CN116252198A - Grinding device for diamond monocrystal piece processing - Google Patents
Grinding device for diamond monocrystal piece processing Download PDFInfo
- Publication number
- CN116252198A CN116252198A CN202310008663.7A CN202310008663A CN116252198A CN 116252198 A CN116252198 A CN 116252198A CN 202310008663 A CN202310008663 A CN 202310008663A CN 116252198 A CN116252198 A CN 116252198A
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- China
- Prior art keywords
- polishing
- clamping
- shaft
- power
- diamond single
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
- B24B41/067—Work supports, e.g. adjustable steadies radially supporting workpieces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
- B24B47/12—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces by mechanical gearing or electric power
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/10—Single-purpose machines or devices
- B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Abstract
The invention relates to the technical field of artificial diamond processing, and discloses a polishing device for diamond single crystal wafer processing, which comprises a polishing seat, wherein a plurality of rotary drums are rotatably arranged at the edge of the upper end of the polishing seat, lifting shafts are arranged on the rotary drums through threaded structures, polishing mechanisms for polishing the end faces of diamond single crystal wafers are arranged at the tops of the lifting shafts through fixing plates, adjusting mechanisms for adjusting the height of the polishing mechanisms up and down are further arranged on the outer sides of the upper ends of the polishing seat, a plurality of limit grooves are symmetrically arranged on the polishing seat, limiting blocks are slidably arranged in the limit grooves, and clamping mechanisms for adjusting the distance between the limiting blocks are arranged at the bottoms of the polishing seat. The diamond single-crystal wafer polishing machine can polish the diamond single-crystal wafer back and forth along the end face of the diamond single-crystal wafer, so that polishing quality is greatly improved, polishing requirements of different thicknesses are met under the cooperation of the adjusting mechanism, and the diamond single-crystal wafer polishing machine is mutually matched with the clamping mechanism, so that the clamping and positioning stability of the diamond single-crystal wafer during polishing is ensured.
Description
Technical Field
The invention relates to the technical field of artificial diamond processing, in particular to a polishing device for diamond monocrystal wafer processing.
Background
Diamond is a mineral composed of carbon elements and is an allotrope of graphite, wherein single crystal diamond chips are characterized by hardness and wear resistance, and diamond is a crystal bonded by covalent bonds having saturation and directionality, so that it has extremely high hardness and wear resistance, and is the hardest substance known in nature.
Synthetic diamond is the process of artificially converting non-diamond structured carbon into diamond structured carbon and forming single crystal and polycrystalline diamond by nucleation and growth, or sintering fine-grained diamond into polycrystalline diamond at high pressure and high temperature.
At present, after the conventional diamond single crystal wafer is cultured, manufactured and finalized, the conventional diamond single crystal wafer polishing device needs to polish the diamond single crystal wafer, the polishing effect on the diamond single crystal wafer is poor, and meanwhile, the positioning stability is not high, and the polishing thickness cannot be quickly adjusted at any time according to the use requirement, so that further improvement is needed.
Disclosure of Invention
The invention aims to provide a polishing device for processing a diamond single crystal wafer, which aims to solve the problems in the background technology.
In order to achieve the above purpose, the present invention provides the following technical solutions:
the utility model provides a grinding device is used in diamond monocrystalline wafer processing, includes the seat of polishing, the rotation of seat upper end edge is installed a plurality of revolving drums, installs the lift axle through the helicitic texture on the revolving drum, and the lift axle top is installed through the fixed plate and is used for carrying out the grinding machanism of polishing to diamond monocrystalline wafer terminal surface, the seat of polishing upper end outside still is provided with the adjustment mechanism who is used for the height-adjusting about the grinding machanism, the symmetry is provided with a plurality of spacing grooves on the seat of polishing, and spacing inslot slidable mounting has the stopper, the seat bottom of polishing is provided with the fixture that is used for adjusting the distance between the stopper.
As an improvement scheme of the invention: and a plurality of supporting legs are arranged at the edge position of the bottom of the polishing seat.
As an improvement scheme of the invention: the adjusting mechanism comprises a rotating ring which is rotatably arranged on the polishing seat through a fixed ring, a plurality of rotating ring teeth are arranged on the inner side of the rotating ring, the rotating ring teeth are meshed with a rotating gear fixed on the rotating cylinder, and the adjusting mechanism further comprises a driving assembly for driving the rotating ring to rotate.
As an improvement scheme of the invention: the driving assembly comprises driving frames symmetrically arranged on the polishing seat, worm shafts are rotatably arranged between the driving frames, a plurality of worm gear teeth arranged on the outer ring of the rotating ring are meshed with the outer side of each worm shaft, and one end of each worm shaft penetrates through the driving frames and is further provided with a driving handle.
As an improvement scheme of the invention: the clamping mechanism comprises a synchronous disc rotatably arranged at the bottom of the polishing seat, a synchronous frame which is in the same quantity with the limiting block is hinged to the synchronous disc, one end, away from the synchronous disc, of the synchronous frame is hinged to the bottom of the limiting block, a limiting ring is arranged at the upper end of the limiting block, and the clamping mechanism further comprises a clamping assembly for driving the synchronous disc to rotate.
As an improvement scheme of the invention: the clamping assembly comprises clamping frames symmetrically arranged at the bottoms of the polishing seats, clamping shafts are rotatably arranged between the clamping frames, the clamping shafts are connected with moving plates fixed at the bottoms of two symmetrical limiting blocks through threaded portions, and one ends of the clamping shafts penetrate through the clamping frames and are connected with clamping handles.
As an improvement scheme of the invention: the thread part comprises a thread sleeve a arranged at one end of the clamping shaft and a thread sleeve b arranged at the other end of the clamping shaft, and the thread directions of the thread sleeve a and the thread sleeve b are opposite.
As an improvement scheme of the invention: the polishing mechanism comprises fixed ring teeth fixed on a fixed plate, a power shaft is rotatably arranged at the upper end of the fixed ring teeth through a plurality of connecting frames, a power frame is fixedly arranged on the power shaft, a transmission gear meshed with the fixed ring teeth is rotatably arranged at the end part of the power frame, which is far away from the power shaft, through a transmission shaft, a power plate is fixedly arranged at the bottom of the power shaft, a power groove is formed in the power plate, a polishing shaft is slidably arranged in the power groove, a polishing disc is fixedly connected at the bottom of the polishing shaft, and the polishing mechanism further comprises a rotating assembly for driving the polishing disc to move.
As an improvement scheme of the invention: the rotary assembly comprises a transmission disc fixed at the bottom of the transmission shaft, a crankshaft is fixedly arranged at the non-center position of the bottom of the transmission disc, a crank rod is hinged to the crankshaft, one end, away from the crankshaft, of the crank rod is hinged to the top of a polishing shaft, a power rack is further arranged at the bottom of the power plate, and a polishing gear meshed with the power rack is further fixed on the polishing shaft.
As an improvement scheme of the invention: and a polishing motor is fixedly installed on the connecting frame, and the output end of the polishing motor is connected with a power shaft.
Compared with the prior art, the invention has the beneficial effects that:
the polishing device for diamond monocrystal wafer processing is reasonable in structure and novel in design, the polishing disc can be used for polishing back and forth along the end face of the diamond monocrystal wafer through the polishing mechanism, polishing quality is greatly improved, polishing requirements of different thicknesses are met under the cooperation of the adjusting mechanism, and the polishing device is mutually matched with the clamping mechanism, so that the clamping positioning stability of the diamond monocrystal wafer during polishing is ensured, and polishing precision is further improved.
Drawings
FIG. 1 is a schematic overall elevational view of the present invention;
FIG. 2 is a schematic diagram of the overall bottom view structure of the present invention;
FIG. 3 is a schematic top view of the overall structure of the present invention;
FIG. 4 is a schematic view of the polishing mechanism of the present invention in a bottom view;
FIG. 5 is a schematic elevational view of the polishing mechanism of the present invention;
fig. 6 is a schematic view of a partial enlarged structure of a in fig. 1.
In the figure: 1. polishing a base; 2. support legs; 3. a rotating ring; 4. rotating the ring teeth; 5. a rotary drum; 6. a rotary gear; 7. a lifting shaft; 8. a fixing plate; 9. fixing ring teeth; 10. a connecting frame; 11. polishing a motor; 12. a limit groove; 13. a limiting block; 14. a clamping frame; 15. a clamping shaft; 16. a threaded sleeve a; 17. a thread bush b; 18. a moving plate; 19. a synchronization disk; 20. a synchronous frame; 21. a clamping handle; 22. a limiting ring; 23. a power shaft; 24. a power plate; 25. a power rack; 26. a transmission gear; 27. a transmission shaft; 28. a drive plate; 29. polishing the grinding disc; 30. polishing a gear; 31. a power rack; 32. a curved bar; 33. polishing the shaft; 34. a crankshaft; 35. a drive rack; 36. a worm shaft; 37. worm gear teeth; 38. a drive handle; 39. a fixing ring; 40. a power groove.
Detailed Description
It should be noted that, without conflict, the embodiments of the present invention and features of the embodiments may be combined with each other.
In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the drawings, are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the apparatus or element in question must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention, and furthermore, the terms "first", "second", etc. are used for descriptive purposes only and should not be construed to indicate or imply relative importance or implying a number of the indicated technical features, whereby the features defining "first", "second", etc. may explicitly or implicitly include one or more of such features.
In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; either directly or indirectly through intermediaries, or by communication between two elements, the specific meaning of the terms in the present disclosure will be understood by those skilled in the art in view of the specific circumstances.
The invention will be described in detail below with reference to the drawings in connection with embodiments.
Example 1
Referring to fig. 1 to 6, in the embodiment of the invention, a polishing device for processing diamond single crystal wafers comprises a polishing seat 1, a plurality of rotary drums 5 are rotatably installed at the edge of the upper end of the polishing seat 1, lifting shafts 7 are installed on the rotary drums 5 through threaded structures, polishing mechanisms for polishing the end faces of the diamond single crystal wafers are installed at the tops of the lifting shafts 7 through fixing plates 8, the upper ends of the lifting shafts 7 and the fixing plates 8 are rotatably arranged, adjusting mechanisms for adjusting the upper and lower heights of the polishing mechanisms are further arranged on the outer sides of the upper ends of the polishing seat 1, so that the polishing mechanisms can meet polishing requirements of diamond single crystal wafers with different thicknesses, a plurality of limiting grooves 12 are symmetrically formed in the polishing seat 1, each limiting groove 12 is of a rectangular groove structure, limiting blocks 13 are slidably installed in each limiting groove 12, and clamping mechanisms for adjusting the distances between the limiting blocks 13 are arranged at the bottoms of the polishing seat 1, and finally, so that the requirements of clamping diamond single crystal wafers with different diameters are finally realized.
Through install a plurality of supporting legs 2 in the base 1 bottom edge position of polishing to carry out effectual support spacing to whole grinding device, further improved the reliability of device.
In a preferred case of this embodiment, the adjusting mechanism includes a rotating ring 3 rotatably mounted on the polishing base 1 through a fixed ring 39, a plurality of rotating ring teeth 4 are provided on the inner side of the rotating ring 3, the rotating ring teeth 4 are meshed with a rotating gear 6 fixed on the rotating cylinder 5, and the adjusting mechanism further includes a driving component for driving the rotating ring 3 to rotate. During operation, the rotating ring 3 is rotated through the driving assembly, then the rotating cylinder 5 synchronously rotates under the meshing of the rotating ring teeth 4 and the rotating gear 6, and then the rotating cylinder is converted into the vertical linear motion of the fixed plate 8.
The driving assembly comprises driving frames 35 symmetrically arranged on the polishing seat 1, worm shafts 36 are rotatably arranged between the driving frames 35, a plurality of worm gear teeth 37 arranged on the outer ring of the rotating ring 3 are meshed with the outer side of the worm shafts 36, and one end of each worm shaft 36 penetrates through the driving frame 35 and is further provided with a driving handle 38. By utilizing the meshing self-locking property between the worm shaft 36 and the worm gear teeth 37, the rotation angle of the rotating ring 3 can be adjusted and maintained after the driving handle 38 is driven to rotate, and finally the adjusting requirement of the adjusting mechanism is met.
In one case of this embodiment, the clamping mechanism includes a synchronization disk 19 rotatably mounted at the bottom of the polishing seat 1, a synchronization frame 20 with the same number as the limiting block 13 is hinged on the synchronization disk 19, one end, away from the synchronization disk 19, of the synchronization frame 20 is hinged at the bottom of the limiting block 13, a limiting ring 22 is mounted at the upper end of the limiting block 13, and the clamping mechanism further includes a clamping component for driving the synchronization disk 19 to rotate. During operation, the synchronous disc 19 is enabled to rotate through the clamping assembly, then the four limiting blocks 13 are enabled to synchronously move under the action of the synchronous frame 20, and finally the limiting rings 22 are enabled to clamp the outer wall of the diamond monocrystal wafer.
In addition, in this embodiment, the clamping assembly includes clamping frames 14 symmetrically installed at the bottom of the polishing seat 1, a clamping shaft 15 is rotatably installed between the clamping frames 14, the clamping shaft 15 is connected with a moving plate 18 fixed at the bottoms of two symmetrical limiting blocks 13 through a threaded portion, and one end of the clamping shaft 15 passes through the clamping frames 14 and is connected with a clamping handle 21. In operation, the clamping handle 21 is rotated to rotate the clamping shaft 15, then the clamping shaft is converted into linear motion between the two limiting blocks 13 under the cooperation of the threaded parts, and then the synchronous disc 19 is rotated under the cooperation of the synchronous frame 20 connected with the clamping handle.
Wherein the screw part comprises a screw sleeve a16 arranged at one end of the clamping shaft 15 and a screw sleeve b17 arranged at the other end of the clamping shaft 15, and the screw directions of the screw sleeve a16 and the screw sleeve b17 are opposite. By the arrangement of the above structure, the relativity of the movement between the stoppers 13 is further ensured.
Example 2
In another embodiment of the present invention, the difference between the embodiment and the above embodiment is that the polishing mechanism includes a fixed ring gear 9 fixed on a fixed plate 8, a power shaft 23 is rotatably installed at the upper end of the fixed ring gear 9 through a plurality of connecting frames 10, a power frame 25 is fixedly installed on the power shaft 23, a transmission gear 26 meshed with the fixed ring gear 9 is rotatably installed at the end of the power frame 25 far away from the power shaft 23 through a transmission shaft 27, a power plate 24 is fixedly installed at the bottom of the power shaft 23, a power groove 40 is provided on the power plate 24, a polishing shaft 33 is slidably installed inside the power groove 40, a polishing disc 29 is fixedly connected at the bottom of the polishing shaft 33, and the polishing mechanism further includes a rotating assembly for driving the polishing disc 29 to move. Specifically, during operation, the power shaft 23 drives the power frame 25 and the power plate 24 to rotate synchronously, and then under the engagement between the fixed ring teeth 9 and the transmission gear 26, the transmission shaft 27 not only rotates, but also revolves along the inner side of the fixed ring teeth 9, and finally the polishing range of the polishing mechanism is increased.
In order to further improve the polishing range of the polishing disc 29, so that the polishing disc 29 can fully cover the end face of the diamond monocrystal wafer, in this embodiment, the rotating assembly comprises a transmission disc 28 fixed at the bottom of the transmission shaft 27, a crankshaft 34 is fixedly arranged at the non-center position of the bottom of the transmission disc 28, a crank rod 32 is hinged on the crankshaft 34, one end, far away from the crankshaft 34, of the crank rod 32 is hinged at the top of a polishing shaft 33, a power rack 31 is further arranged at the bottom of the power plate 24, and a polishing gear 30 meshed with the power rack 31 is further fixed on the polishing shaft 33. When the transmission shaft 27 rotates, the transmission disc 28 synchronously rotates, then the polishing shaft 33 moves back and forth along the inside of the power groove 40 under the cooperation of the crankshaft 34 and the crank 32, and meanwhile, the polishing shaft 33 also rotates in a reciprocating manner under the meshing between the power rack 31 and the polishing gear 30, so that the polishing range is finally ensured.
In order to ensure the polishing power source of the polishing mechanism, in this embodiment, a polishing motor 11 is fixedly installed on the connecting frame 10, and a power shaft 23 is connected to an output end of the polishing motor 11. In operation, the polishing plate 29 can be effectively operated by only starting the polishing motor 11.
The working principle of the invention is as follows: during the use, the diamond single-crystal piece that will polish is carried out the centre gripping through fixture, later under adjustment mechanism's cooperation, adjusts the distance between polishing dish 29 and the diamond single-crystal piece, later starts polishing motor 11 and can ensured that polishing mechanism is to the effective polishing of diamond single-crystal piece, and whole operation process is swift convenient, is worth using widely.
The foregoing description of the preferred embodiments of the invention is not intended to be limiting, but rather is intended to cover all modifications, equivalents, alternatives, and improvements that fall within the spirit and scope of the invention.
Claims (10)
1. The utility model provides a diamond monocrystal piece processings uses grinding device, includes grinding seat (1), its characterized in that: the polishing device is characterized in that a plurality of rotary drums (5) are rotatably mounted on the edge of the upper end of the polishing seat (1), lifting shafts (7) are mounted on the rotary drums (5) through threaded structures, polishing mechanisms for polishing the end faces of diamond single crystal wafers are mounted on the tops of the lifting shafts (7) through fixing plates (8), adjusting mechanisms for adjusting the height of the polishing mechanisms up and down are further arranged on the outer sides of the upper end of the polishing seat (1), a plurality of limiting grooves (12) are symmetrically arranged on the polishing seat (1), limiting blocks (13) are mounted in the limiting grooves (12) in a sliding mode, and clamping mechanisms for adjusting the distance between the limiting blocks (13) are arranged at the bottoms of the polishing seat (1).
2. The polishing device for diamond single-crystal wafer processing according to claim 1, wherein a plurality of supporting legs (2) are arranged at the bottom edge position of the polishing seat (1).
3. A polishing device for diamond single-wafer processing according to claim 1, characterized in that the adjusting mechanism comprises a rotating ring (3) rotatably mounted on the polishing seat (1) through a fixed ring (39), a plurality of rotating ring teeth (4) are arranged on the inner side of the rotating ring (3), the rotating ring teeth (4) are meshed with a rotating gear (6) fixed on the rotating cylinder (5), and the adjusting mechanism further comprises a driving component for driving the rotating ring (3) to rotate.
4. A polishing device for diamond single-wafer processing according to claim 3, characterized in that the driving assembly comprises driving frames (35) symmetrically arranged on the polishing seat (1), worm shafts (36) are rotatably arranged between the driving frames (35), a plurality of worm gear teeth (37) arranged on the outer ring of the rotating ring (3) are meshed on the outer side of the worm shafts (36), and one end of each worm shaft (36) penetrates through each driving frame (35) and is further provided with a driving handle (38).
5. The polishing device for diamond single-wafer processing according to claim 4, wherein the clamping mechanism comprises a synchronous disc (19) rotatably mounted at the bottom of the polishing seat (1), a synchronous frame (20) with the same number as the limiting block (13) is hinged on the synchronous disc (19), one end, far away from the synchronous disc (19), of the synchronous frame (20) is hinged at the bottom of the limiting block (13), a limiting ring (22) is mounted at the upper end of the limiting block (13), and the clamping mechanism further comprises a clamping assembly for driving the synchronous disc (19) to rotate.
6. The polishing device for diamond single-wafer processing according to claim 5, wherein the clamping assembly comprises clamping frames (14) symmetrically arranged at the bottoms of the polishing seats (1), clamping shafts (15) are rotatably arranged between the clamping frames (14), the clamping shafts (15) are connected with moving plates (18) fixed at the bottoms of two symmetrical limiting blocks (13) through threaded portions, and one ends of the clamping shafts (15) penetrate through the clamping frames (14) and are connected with clamping handles (21).
7. The polishing apparatus for diamond single wafer processing according to claim 1, wherein the screw portion includes a screw bush a (16) provided at one end of the holding shaft (15) and a screw bush b (17) provided at the other end of the holding shaft (15), the screw directions of the screw bush a (16) and the screw bush b (17) being opposite.
8. The polishing device for diamond monocrystal wafer processing according to claim 7, wherein the polishing mechanism comprises a fixed ring tooth (9) fixed on a fixed plate (8), a power shaft (23) is rotatably mounted at the upper end of the fixed ring tooth (9) through a plurality of connecting frames (10), a power frame (25) is fixedly mounted on the power shaft (23), a transmission gear (26) meshed with the fixed ring tooth (9) is rotatably mounted at the end part of the power frame (25) far away from the power shaft (23) through a transmission shaft (27), a power plate (24) is fixedly mounted at the bottom of the power shaft (23), a power groove (40) is formed in the power plate (24), a polishing shaft (33) is slidably mounted in the power groove (40), a polishing disc (29) is fixedly connected at the bottom of the polishing shaft (33), and the polishing mechanism further comprises a rotating assembly for driving the polishing disc (29) to move.
9. The polishing device for diamond monocrystal wafer processing according to claim 8, wherein the rotating assembly comprises a transmission disc (28) fixed at the bottom of the transmission shaft (27), a crankshaft (34) is fixedly arranged at the non-center position of the bottom of the transmission disc (28), a bent rod (32) is hinged on the crankshaft (34), one end, far away from the crankshaft (34), of the bent rod (32) is hinged at the top of a polishing shaft (33), a power rack (31) is further arranged at the bottom of the power plate (24), and a polishing gear (30) meshed with the power rack (31) is further fixed on the polishing shaft (33).
10. The polishing device for diamond single-wafer processing according to claim 8, wherein a polishing motor (11) is fixedly installed on the connecting frame (10), and the output end of the polishing motor (11) is connected with a power shaft (23).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310008663.7A CN116252198A (en) | 2023-01-04 | 2023-01-04 | Grinding device for diamond monocrystal piece processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310008663.7A CN116252198A (en) | 2023-01-04 | 2023-01-04 | Grinding device for diamond monocrystal piece processing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116252198A true CN116252198A (en) | 2023-06-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310008663.7A Pending CN116252198A (en) | 2023-01-04 | 2023-01-04 | Grinding device for diamond monocrystal piece processing |
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| Country | Link |
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| CN (1) | CN116252198A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116551484A (en) * | 2023-07-11 | 2023-08-08 | 诸城市惠林精密机械有限公司 | Rotatory grinding device of cam divider shell |
| CN116748782A (en) * | 2023-08-17 | 2023-09-15 | 山东齐盛达铁塔股份有限公司 | Automatic welding fixture capable of clamping various iron tower weldments |
| CN117020840A (en) * | 2023-08-30 | 2023-11-10 | 宁波杰铖机械有限公司 | Finishing device for inner wall of spiral case of worm machine |
-
2023
- 2023-01-04 CN CN202310008663.7A patent/CN116252198A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116551484A (en) * | 2023-07-11 | 2023-08-08 | 诸城市惠林精密机械有限公司 | Rotatory grinding device of cam divider shell |
| CN116748782A (en) * | 2023-08-17 | 2023-09-15 | 山东齐盛达铁塔股份有限公司 | Automatic welding fixture capable of clamping various iron tower weldments |
| CN117020840A (en) * | 2023-08-30 | 2023-11-10 | 宁波杰铖机械有限公司 | Finishing device for inner wall of spiral case of worm machine |
| CN117020840B (en) * | 2023-08-30 | 2024-02-02 | 宁波杰铖机械有限公司 | Finishing device for inner wall of spiral case of worm machine |
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