CN116240541A - Anti-sticking plate surface treatment method, anti-sticking plate and vapor deposition system - Google Patents
Anti-sticking plate surface treatment method, anti-sticking plate and vapor deposition system Download PDFInfo
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- CN116240541A CN116240541A CN202310170262.1A CN202310170262A CN116240541A CN 116240541 A CN116240541 A CN 116240541A CN 202310170262 A CN202310170262 A CN 202310170262A CN 116240541 A CN116240541 A CN 116240541A
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- 238000007740 vapor deposition Methods 0.000 title claims abstract description 28
- 238000004381 surface treatment Methods 0.000 title abstract description 17
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- 238000002844 melting Methods 0.000 claims abstract description 28
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C24/00—Coating starting from inorganic powder
- C23C24/08—Coating starting from inorganic powder by application of heat or pressure and heat
- C23C24/10—Coating starting from inorganic powder by application of heat or pressure and heat with intermediate formation of a liquid phase in the layer
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F3/00—Changing the physical structure of non-ferrous metals or alloys by special physical methods, e.g. treatment with neutrons
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Crystallography & Structural Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The present disclosure discloses a surface treatment method for an anti-sticking plate, an anti-sticking plate and a vapor deposition system for improving the service life of the anti-sticking plate and the film forming effect. The embodiment of the disclosure provides a surface treatment method for an anti-sticking board, which comprises the following steps: carrying out a meltallizing process on the surface to be treated of the protection plate to form a meltallizing layer; and (3) melting the surface of the meltallizing layer to enable the surface of the meltallizing layer to be melted and then recrystallized to form a recrystallized layer.
Description
Technical Field
The disclosure relates to the technical field of display, in particular to a surface treatment method for an anti-sticking plate, the anti-sticking plate and a vapor deposition system.
Background
The principle of the vacuum sputtering process is as follows: and bombarding the target material with charged particles, wherein when the accelerated ions bombard the solid surface, surface atoms collide and transfer energy and momentum, so that the target material atoms escape from the surface and are deposited on the substrate material. However, the target atoms or large-size particles sputtered in the process can finally fly to the inner wall surface of the cavity of the sputtering device, so that the cleaning of the sputtering device is affected. Therefore, it is necessary to incorporate a shield plate in the structure of the sputtering apparatus to protect the surface of the chamber. However, as the number of sputtering processes performed in the sputtering chamber increases, sputtered particles accumulate on the surface of the protection plate, and the sputtered particles accumulate to a certain thickness, and the adhesion ability of the protection plate to particles is deteriorated, so that the protection plate needs to be removed from the surface of the chamber for cleaning and treatment according to the service life and then used. The specific method for treating the surface of the anti-sticking plate comprises the following steps: removing the surface sediment, and carrying out surface roughness treatment by means of meltallizing and the like. However, according to the cleaning method, particles of the meltallizing material are clearly visible on the surface of the meltallizing layer formed by the meltallizing process, the particles of the meltallizing material are not firmly adhered, and the situation that the particles of the meltallizing material fall off easily occurs. The anti-sticking plate treated by the method is arranged on the inner wall of the cavity of the equipment, and particles of the meltallizing material possibly fall into the cavity to influence the film forming effect.
In summary, the surface treatment method of the anti-sticking plate in the prior art has low adhesion among particles of the meltallizing material, influences the service life of the anti-sticking plate, and influences the sputtering film forming effect.
Disclosure of Invention
The embodiment of the disclosure provides a surface treatment method of an anti-sticking plate, the anti-sticking plate and a vapor deposition system, which are used for prolonging the service life of the anti-sticking plate and improving the film forming effect.
The embodiment of the disclosure provides a surface treatment method for an anti-sticking board, which comprises the following steps:
carrying out a meltallizing process on the surface to be treated of the protection plate to form a meltallizing layer;
and (3) melting the surface of the meltallizing layer to enable the surface of the meltallizing layer to be recrystallized after melting.
In some embodiments, the surface of the melt-shot layer is subjected to a melting process, specifically including:
the surface of the fuse layer is baked using a flame.
In some embodiments, the outer flame temperature of the flame is greater than the melting point of the material of the melt layer.
In some embodiments, the difference between the outer flame temperature of the flame and the melting point of the material of the melt layer is greater than 10 ℃.
In some embodiments, the flame is an oxyhydrogen flame.
In some embodiments, the surface of the melt-blown layer is subjected to a melting treatment such that after the melt-blown layer surface is recrystallized, the method further comprises:
and (5) carrying out a purging process on the surface of the recrystallization layer.
In some embodiments, the thickness of the melt-blown layer is greater than or equal to 200 microns and less than or equal to 300 microns.
In some embodiments, before the performing the meltblowing process on the surface to be treated of the protection plate, the method further comprises:
performing a film removing process on the surface to be treated;
carrying out a sand blasting process on the surface to be treated after the film removing process;
after the surface to be treated of the shielding plate is subjected to the meltblowing process, the method further comprises the following steps:
the anti-sticking board is subjected to a baking process.
An anti-sticking board provided by an embodiment of the present disclosure includes: the plate comprises a plate body and a recrystallization layer formed on the surface of the plate body by adopting the method provided by the embodiment of the disclosure.
The embodiment of the disclosure provides a vapor deposition system, which comprises: a vacuum chamber and a chucking plate provided by embodiments of the present disclosure positioned within the vacuum chamber.
According to the surface treatment method for the anti-sticking board, the anti-sticking board and the vapor deposition system, after the formation of the meltallizing layer, the surface of the meltallizing layer is subjected to melting treatment, so that materials on the surface of the meltallizing layer are melted and recrystallized to form a recrystallized layer, the adhesive force between the meltallizing materials can be improved, the falling of particles caused by poor adhesive force between particles of the meltallizing materials is avoided, and the service life of the anti-sticking board can be prolonged. The surface cleanliness of the anti-landing plate can also be improved. When the anti-sticking board adopting the anti-sticking board surface treatment method provided by the embodiment of the disclosure is applied to the inside of the vapor deposition vacuum chamber, vapor deposition film forming particle can be avoided, and vapor deposition film forming effect is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings that are needed in the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present disclosure, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic flow chart of a method for treating a surface of an anti-adhesion plate according to an embodiment of the disclosure;
fig. 2 is a schematic structural diagram of a penetration layer formed in a method for treating a surface of an anti-adhesion plate according to an embodiment of the present disclosure;
FIG. 3 is a schematic view of a structure of a recrystallized layer formed in a surface treatment method of a plate according to an embodiment of the present disclosure;
FIG. 4 is a schematic diagram of baking the surface of the meltallizing layer with flame in an embodiment of the present disclosure;
FIG. 5 is a schematic view of a construction of a landing plate according to an embodiment of the present disclosure;
fig. 6 is a schematic structural view of another anti-landing plate according to an embodiment of the present disclosure.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present disclosure more apparent, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present disclosure. It will be apparent that the described embodiments are some, but not all, of the embodiments of the present disclosure. And embodiments of the disclosure and features of embodiments may be combined with each other without conflict. All other embodiments, which can be made by one of ordinary skill in the art without the need for inventive faculty, are within the scope of the present disclosure, based on the described embodiments of the present disclosure.
Unless defined otherwise, technical or scientific terms used in this disclosure should be given the ordinary meaning as understood by one of ordinary skill in the art to which this disclosure belongs. The terms "first," "second," and the like, as used in this disclosure, do not denote any order, quantity, or importance, but rather are used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that elements or items preceding the word are included in the element or item listed after the word and equivalents thereof, but does not exclude other elements or items. The terms "connected" or "connected," and the like, are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect.
It should be noted that the dimensions and shapes of the various figures in the drawings do not reflect true proportions, and are intended to illustrate the present disclosure only. And the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout.
In the related art, a vapor deposition technique is a common film forming technique, and the principle thereof is a technique of gasifying a material source into gaseous atoms or molecules by a physical method under vacuum conditions, or partially ionizing the material source into ions, and depositing a thin film on a substrate surface by a low-pressure gas or plasma process. In the technology, besides the material deposited on the substrate, the material particles of the material fly to the surface of the inner wall of the vacuum chamber, so that the cleaning of the chamber is affected, and if the particles attached to the inner wall of the chamber fall to the corresponding area of the substrate, the film forming quality is also affected. Therefore, a shielding plate is required to be arranged in the vacuum chamber to prevent materials used in the deposition process such as sputtering from adhering to the inner wall of the chamber to pollute the chamber. However, in the process of continuously performing vapor deposition film formation, more and more particles are accumulated on the anti-plate, even the film is formed, when the film layer formed by accumulating the particles reaches a certain thickness, the adhesion force of the particles to the particles is poor, and the particles fall on the surface of the substrate, and still the film forming quality of the film layer deposited on the substrate is affected, so that after the anti-plate is used for a period of time, the surface of the anti-plate needs to be cleaned to remove the accumulated particles, and then the surface roughness treatment is performed by a meltallizing process, and then the anti-plate is continuously used for protecting the inner wall of the chamber. However, in the fused layer formed after the surface roughness treatment of the anti-sticking plate by the fusion process, adhesion force between fused particles is poor, and if the anti-sticking plate is put back into the chamber again, there is a risk that particles fall off and pollute the chamber. Moreover, because of the rough surface of the melt-blown layer, this surface also risks containing other particles (particles), which affect the cleanliness of the surface of the protection plate. Whether the adhesion force between the meltallizing particles is poor or other particles are contained on the surface of the meltallizing layer, the particles fall off the surface of the substrate in the vapor deposition process to cause vapor deposition film forming particle, and the vapor deposition film forming effect is affected.
Based on the above-described problems of the related art, an embodiment of the present disclosure provides a method for treating a surface of a touch-proof sheet, as shown in fig. 1, including:
s101, forming a meltallizing layer by meltallizing the surface to be treated of the anti-sticking plate;
s102, melting the surface of the meltallizing layer to enable the surface of the meltallizing layer to be melted and then recrystallized, so that a recrystallized layer is formed.
In the implementation, after the meltallizing process, the structure of the anti-sticking board is shown in fig. 2, and the anti-sticking board comprises an anti-sticking board body 1 and a meltallizing layer 2 positioned on one side of the anti-sticking board body; the fuse layer 2 includes a plurality of particles of the fuse material, and the adhesion between the particles is weak. The structure of the surface of the meltallizing layer 2 after the melting treatment is shown in fig. 3, the particles of the meltallizing material are melted and recrystallized to form a recrystallized layer 3, and the melting and recrystallization process can reduce the gaps among the particles of the meltallizing material, improve the adhesion force among the meltallizing materials, prevent other particles from remaining on the surface of the plate, and improve the cleanliness of the surface of the plate.
According to the surface treatment method for the anti-sticking board, after the meltallizing layer is formed, the surface of the meltallizing layer is subjected to melting treatment, so that materials on the surface of the meltallizing layer are melted and recrystallized to form a recrystallization layer, the adhesive force between the meltallizing materials can be improved, particles falling due to the fact that the adhesive force difference between particles of the meltallizing materials is avoided, and the service life of the anti-sticking board can be prolonged. The surface cleanliness of the anti-landing plate can also be improved. When the anti-sticking board adopting the anti-sticking board surface treatment method provided by the embodiment of the disclosure is applied to the inside of the vapor deposition vacuum chamber, vapor deposition film forming particle can be avoided, and vapor deposition film forming effect is improved.
In fig. 3, the example of the total recrystallization of the melt-blown layer is illustrated, and in the specific implementation, the melt-blown layer may be completely recrystallized due to the thickness of the melt-blown layer, the melting treatment temperature, and the duration of the melting treatment, or only the melt-blown material on the surface of the melt-blown layer facing away from the side of the plate body may be melted and recrystallized. As long as the recrystallization layer is formed on the surface of the meltallizing layer, the particles are prevented from falling off due to the poor adhesive force between the particles of the meltallizing material, and other particles are prevented from remaining on the surface of the protection plate.
In practice, the formation of the fused layer on the surface of the protective sheet to be treated is to protect the protective sheet itself.
In some embodiments, the surface of the melt-shot layer is subjected to a melting process, specifically including:
as shown in fig. 4, the surface of the fuse layer 2 is baked using a flame 4.
In the surface treatment method for the anti-sticking board provided by the embodiment of the disclosure, the surface of the meltallizing layer is baked by flame, so that the material of the meltallizing layer is melted and recrystallized in the baking process to form a recrystallization layer.
In practice, as shown in fig. 4, the protective plate may be placed on the table 5, with the layer 2 being located on the side of the protective plate body 1 facing away from the table 5, and the means for providing the flame 4 being located above the layer 2. The flame 4 moves on a plane parallel to the plane of the table to bake the surface of the layer 2 at different positions.
In some embodiments, the outer flame temperature of the flame is greater than the melting point of the material of the melt layer.
So that the melt-shot layer can be melted and recrystallized to form a recrystallized layer.
In some embodiments, the difference between the outer flame temperature of the flame and the melting point of the material of the melt layer is greater than 10 ℃.
In some embodiments, the distance between the flame and the melt-blown layer is greater than 0. I.e. the flame is not in contact with the melt-blown layer. It should be noted that, because the thickness of the meltallizing layer is thinner, the distance between the flame and the meltallizing layer is greater than 0, so that the flame only heats the meltallizing layer, and other parts of the protection plate are not affected.
In a specific implementation, the distance between the flame and the layer may be set according to the difference between the outer flame temperature of the flame and the melting point of the layer material, the greater the distance between the flame and the layer.
In some embodiments, the flame is a clean energy flame.
In practice, the clean energy flame is, for example, an oxyhydrogen flame.
In some embodiments, the thickness of the melt-blown layer is greater than or equal to 200 microns and less than or equal to 300 microns.
In practice, the duration of the melting treatment of the surface of the layer may be determined according to the thickness of the layer.
In some embodiments, the surface of the melt-blown layer is subjected to a melting treatment such that after the melt-blown layer surface is recrystallized, the method further comprises:
and (5) carrying out a purging process on the surface of the recrystallization layer.
If the surface of the melt-shot layer is rough and particles remain, the particles can be carbonized under the action of high temperature in the melting process, and the carbonized particles can be taken out by blowing the surface of the recrystallization layer, so that the surface cleanliness of the plate is improved, and the pollution to the vacuum chamber is avoided.
In some embodiments, the material used in the meltallizing process is aluminum (Al). And melting the surface of the Al melt-shot layer to enable the Al on the surface of the melt-shot layer to be melted and then recrystallized, so as to form an Al recrystallization layer. The adhesion between the Al particles in the Al recrystallized layer may be improved by about 40% over the adhesion between the Al particles in the Al-melt layer. The use of the Al recrystallized layer protected shield plate in a vapor deposition chamber can reduce the probability of vapor deposition process film formation by about 50% compared to the Al melt layer protected shield plate. Compared with the protection plate protected by the Al-melting layer, the service life of the protection plate protected by the Al-recrystallization layer is improved by 30-50%.
In some embodiments, before the performing the meltblowing process on the surface to be treated of the protection plate, the method further comprises:
performing a film removing process on the surface to be treated;
and carrying out a sand blasting process on the surface to be treated after the film removing process.
In practice, the removal of the film from the surface to be treated may remove material, such as sputtered particles, that is resistant to deposition on the surface of the plate. The surface to be treated may be subjected to a stripping process using chemical or physical means.
In specific implementation, the film removing can be sequentially carried out on the surface to be treated by adopting a chemical method or a physical method; chemical methods include, for example: washing the surface to be treated by nitric acid, sulfuric acid, hydrogen peroxide and other liquids; physical methods include, for example: and (5) washing the surface to be treated by high-pressure water.
It should be noted that the corresponding stripping method may be selected according to the specific material to be deposited on the surface of the plate.
In specific implementation, the surface to be treated after the film removing process is subjected to a sand blasting process, for example, steel grit, alumina, quartz sand, silicon carbide and the like can be used. The corresponding sand blasting material can be selected according to the hardness requirement after the sand blasting process. The surface roughness of the anti-sticking board after the sand blasting process is more than or equal to 5 micrometers and less than or equal to 10 micrometers.
In some embodiments, after the subjecting the surface to be treated of the shielding plate to the meltblowing process, the method further comprises:
the anti-sticking board is subjected to a baking process.
The baking process performed after the formation of the fuse layer by the fuse process is only for removing the moisture of the shielding plate, and does not recrystallize the fuse layer.
An anti-sticking board provided by an embodiment of the present disclosure includes: the plate comprises a plate body and a recrystallization layer formed on the surface of the plate body by adopting the method provided by the embodiment of the disclosure.
According to the anti-sticking board provided by the embodiment of the disclosure, as the surface of the anti-sticking board body adopts the anti-sticking board surface treatment method provided by the embodiment of the disclosure, after the formation of the meltallizing layer, the surface of the meltallizing layer is subjected to melting treatment, so that the material on the surface of the meltallizing layer is melted and recrystallized to form a recrystallized layer, the adhesive force between the meltallizing materials can be improved, the drop of particles caused by poor adhesive force between particles of the meltallizing material is avoided, and the service life of the anti-sticking board can be prolonged. The surface cleanliness of the anti-landing plate can also be improved. When the anti-sticking plate provided by the embodiment of the disclosure is applied to the vapor deposition vacuum chamber, vapor deposition film forming particle can be avoided, and vapor deposition film forming effect is improved.
In a specific implementation, when the shielding plate is applied to a vapor deposition process, a surface of the shielding plate, which is close to one side of the target, is treated to form a recrystallized layer by the method provided by the embodiment of the disclosure. The face adjacent to the target once comprises, for example, a surface parallel to the plane in which the shield plate is placed and a side face connected to the surface.
In some embodiments, the material of the shielding plate body comprises, for example, one or a combination of the following: titanium, titanium alloy, aluminum alloy.
In some embodiments, a sand blast layer formed by a sand blast process is also included between the guard plate body and the recrystallized layer.
The embodiment of the disclosure provides a vapor deposition system, which comprises: a vacuum chamber and a chucking plate provided by embodiments of the present disclosure positioned within the vacuum chamber.
In some embodiments, the vapor deposition system is a sputtering system; the vacuum chamber is internally provided with a target and a substrate, and the areas which are easy to sputter in the vacuum chamber are the areas around the target and the areas around the substrate. In practice, the shield plate is positioned between the target and the substrate and is in contact with the vacuum chamber surface.
In practice, the shield plate has openings so that the target can be sputtered onto the substrate to form a film through the open areas. If the target is a planar target, as shown in fig. 5, the shielding plate 6 includes only one first opening 7, and in a direction perpendicular to the plane in which the shielding plate is placed, the orthographic projection of the target 9 falls into the first opening 7, and the first opening 7 exposes a region of the substrate (not shown) where sputter coating is required. If the target is a cylindrical target, as shown in fig. 6, the sputtering system includes a plurality of cylindrical targets, the shielding plate 6 includes a frame 601 and a plurality of strip-shaped portions 602, the frame 601 includes a first opening 7, the plurality of strip-shaped portions 602 extend along a first direction Y and are arranged along a second direction X, the plurality of strip-shaped portions 602 divide the first opening 7 into a plurality of second openings 10, the orthographic projection of the target 9 falls into the second openings 10, and the first openings 7 expose a region of the substrate (not shown) where the sputter coating is required. As shown in fig. 5 and 6, the shielding plate 6 is further provided with a plurality of fixing members 8.
In summary, according to the surface treatment method for the anti-adhesion plate, the anti-adhesion plate and the vapor deposition system provided by the embodiments of the present disclosure, after the formation of the melt-injection layer, the surface of the melt-injection layer is subjected to melting treatment, so that the material on the surface of the melt-injection layer is melted and recrystallized to form a recrystallized layer, thereby improving the adhesion between the melt-injection materials, avoiding the drop of particles due to the poor adhesion between the particles of the melt-injection material, and improving the service life of the anti-adhesion plate. The surface cleanliness of the anti-landing plate can also be improved. When the anti-sticking board adopting the anti-sticking board surface treatment method provided by the embodiment of the disclosure is applied to the inside of the vapor deposition vacuum chamber, vapor deposition film forming particle can be avoided, and vapor deposition film forming effect is improved.
While preferred embodiments of the present invention have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. It is therefore intended that the following claims be interpreted as including the preferred embodiments and all such alterations and modifications as fall within the scope of the invention.
It will be apparent to those skilled in the art that various modifications and variations can be made to the present disclosure without departing from the spirit or scope of the disclosure. Thus, the present disclosure is intended to include such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.
Claims (10)
1. A method of treating a surface of a touch-resistant panel, the method comprising:
carrying out a meltallizing process on the surface to be treated of the anti-sticking plate to form a meltallizing layer;
and melting the surface of the meltallizing layer to make the surface of the meltallizing layer melt and then recrystallize to form a recrystallized layer.
2. The method according to claim 1, characterized in that the surface of the layer is subjected to a melting treatment, comprising in particular:
and baking the surface of the meltallizing layer by using flame.
3. The method of claim 2, wherein an outer flame temperature of the flame is greater than a melting point of the melt layer material.
4. A method according to claim 3, wherein the difference between the outer flame temperature of the flame and the melting point of the material of the layer of meltallizing material is greater than 10 ℃.
5. The method of claim 2, wherein the flame is an oxyhydrogen flame.
6. The method according to any one of claims 1 to 5, wherein the surface of the melt-blown layer is subjected to a melting treatment so that the melt-blown layer surface is recrystallized after melting, further comprising:
and (5) carrying out a purging process on the surface of the recrystallization layer.
7. The method of any one of claims 1-5, wherein the thickness of the melt-blown layer is greater than or equal to 200 microns and less than or equal to 300 microns.
8. The method according to any one of claims 1 to 5, further comprising, prior to said subjecting the surface to be treated of the protective sheet to a meltblowing process:
performing a film removing process on the surface to be treated;
carrying out a sand blasting process on the surface to be treated after the film removing process;
after the surface to be treated of the anti-sticking board is subjected to the meltblowing process, the method further comprises the following steps:
and baking the anti-sticking plate.
9. A landing plate, the landing plate comprising: a protective sheet body, and a recrystallized layer formed on the surface of the protective sheet body by treating the protective sheet body according to the method of any one of claims 1 to 8.
10. A vapor deposition system, comprising: a vacuum chamber, and a landing plate according to claim 9 located within the vacuum chamber.
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| CN202310170262.1A CN116240541A (en) | 2023-02-17 | 2023-02-17 | Anti-sticking plate surface treatment method, anti-sticking plate and vapor deposition system |
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| CN202310170262.1A CN116240541A (en) | 2023-02-17 | 2023-02-17 | Anti-sticking plate surface treatment method, anti-sticking plate and vapor deposition system |
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