CN116230620B - Horizontal adjusting device of thimble mechanism - Google Patents
Horizontal adjusting device of thimble mechanism Download PDFInfo
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- CN116230620B CN116230620B CN202310511272.7A CN202310511272A CN116230620B CN 116230620 B CN116230620 B CN 116230620B CN 202310511272 A CN202310511272 A CN 202310511272A CN 116230620 B CN116230620 B CN 116230620B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E30/00—Energy generation of nuclear origin
- Y02E30/30—Nuclear fission reactors
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Abstract
The invention provides a horizontal adjusting device of a thimble mechanism. The device comprises a plurality of ejector pins, an ejection mechanism, a driving assembly and an angle adjusting mechanism; the plurality of ejector pins are all positioned in the cavity; the jacking mechanism is arranged below the plurality of ejector pins and is used for jacking the plurality of ejector pins; the top of the jacking mechanism penetrates through the bottom of the cavity and is connected with the bottom of the cavity; the jacking mechanism comprises a movable seat positioned at the bottom of the jacking mechanism; the drive assembly links to each other and is used for driving climbing mechanism jack-up thimble with movable seat bottom, and drive assembly includes: the connecting piece is arranged below the movable seat of the jacking mechanism; the angle adjusting mechanism is respectively connected with the movable seat and the connecting piece and is used for adjusting and keeping the angle of the movable seat relative to the connecting piece within a preset angle range. According to the embodiment of the invention, the movable seat is connected with the connecting piece of the driving assembly through the angle adjusting mechanism, so that the levelness of the plane where the top point of the thimble is positioned is adjustable, and the process stability can be ensured without the need of disassembling and assembling equipment again.
Description
Technical Field
The invention relates to the technical field of semiconductor equipment, in particular to a horizontal adjusting device of a thimble mechanism.
Background
The conventional semiconductor manufacturing system comprises one or more process chambers, such as a thimble lifting mechanism in the prior art shown in fig. 1 and 2, which comprises a plurality of thimbles 101 positioned in a cavity (not shown), a spraying device (not shown) is arranged at the top of the cavity (not shown), a heating disc 102 is arranged in the cavity, lifting holes are formed in the heating disc 102, the thimbles 101 penetrate through the lifting holes, lifting rings 103 are arranged below the thimbles 101, the lifting rings 103 are positioned in the cavity, the bottoms of the lifting rings 103 are fixedly connected with movable columns 105 penetrating through the bottoms of the cavities at the tops through connecting parts and bolts, the movable columns 105 are integrally structured with movable seats 107, bellows 106 is sleeved on the movable columns 105, the tops of the bellows 106 are fixedly arranged at the bottoms of the cavities through cavity connecting plates 104, and the bottoms of the bellows 106 are fixedly connected with the movable seats 107. The bottom of the movable seat 107 is fixedly connected with a connecting piece 108 of the driving assembly through a bolt 1081. The connecting piece 108 is connected with the driving piece 109, and the driving piece 109 can drive the connecting piece 108 to drive the movable seat 107, the movable column 105 and the lifting ring 103 to move along the positioning rod 110, so as to drive the thimble 101 to jack up along the vertical direction.
The whole thimble lifting mechanism is provided with a movable part except the thimble 101 with a balancing weight, the heating disc 102 and the spraying device are other mechanism components, and the rest components are connected into a whole and cannot be adjusted. The levelness of the spray device is affected by the machining precision of the hinge at the top of the cavity, assembly errors and other factors, the absolute level cannot be guaranteed, and small deviation exists, and the heating disc 102 can be adjusted to keep the required levelness with the spray device. However, the levelness deviation between the lifting mechanism of the thimble 101 and the heating disc can not be adjusted by adopting fixed connection, and the levelness of relevant mechanisms such as a spraying device or the heating disc 102 can be influenced by equipment abrasion or aging after long-term use. When the levelness deviation exists between the thimble 101 and the heating plate 102, the ascending and descending sequence appears when the thimble 101 is lifted, the stability of the wafer drop point and the wafer transferred by the manipulator in the cavity is affected, and glow may be caused to cause the process failure.
Disclosure of Invention
The embodiment of the invention aims to provide a thimble mechanism horizontal adjusting device, so that the levelness of a thimble can be adjusted according to the levelness of a correlation mechanism, and the process stability is ensured.
In order to solve the above technical problems, an embodiment of the present invention provides a horizontal adjustment device for a thimble mechanism, including:
the plurality of ejector pins are positioned in the cavity;
the jacking mechanism is arranged below the plurality of ejector pins and is used for jacking the plurality of ejector pins; the top of the jacking mechanism penetrates through the bottom of the cavity and is connected with the bottom of the cavity; the jacking mechanism comprises a movable seat positioned at the bottom of the jacking mechanism;
the driving assembly is connected with the bottom of the movable seat and used for driving the jacking mechanism to jack the thimble, and the driving assembly comprises: the connecting piece is arranged below the movable seat of the jacking mechanism; and
and the angle adjusting mechanism is respectively connected with the movable seat and the connecting piece and is used for adjusting and maintaining the angle of the movable seat relative to the connecting piece within a preset angle range.
In some examples, the angle adjustment mechanism includes: three adjusting members;
any one of the adjusting pieces and the movable seat form a rotating part, and the other two adjusting pieces can drive the movable seat to rotate relative to the connecting piece based on the rotating part; or alternatively
Any two adjusting parts can form a rotating shaft with the movable seat, and the rest adjusting parts can drive the movable seat to rotate relative to the connecting part by taking the rotating shaft as a rotating shaft.
In some examples, the adjustment member is a ball screw;
the movable seat is provided with a ball head rotating cavity matched with the ball head of each ball head screw, the ball head is positioned in the ball head rotating cavity, and the movable seat can rotate relative to the ball head;
the connecting piece is provided with a through hole corresponding to the threaded rod of the ball screw, and the threaded rod is arranged in the through hole in a penetrating way;
and an adjusting nut matched with the threaded rod is further arranged in the connecting piece.
In some examples, the movable mount includes a top substrate and a bottom substrate; the top substrate and the bottom substrate are fixedly connected through a movable seat locking bolt;
the top base plate and the bottom base plate are formed with the ball head rotating cavity, the ball head is matched with the ball head rotating cavity, and the movable seat can rotate relative to the ball head.
In some examples, the plurality of ball screws are uniformly distributed on the movable seat and positioned at the edge of the movable seat;
the peripheral wall of the movable seat is provided with a chamfer enabling the movable seat to rotate within the preset angle range relative to the connecting piece;
when any two adjusting parts and the movable seat form a rotating shaft, the base substrate is in an equilateral triangle shape, and the ball screws are respectively positioned at the top points of the base substrate.
In some examples, the chamfer angle is a 45 ° angle and the chamfer angle is immediately adjacent the ball pivot cavity.
In some examples, the connector includes a top connector plate and a bottom connector plate fixedly connected by a connector locking bolt;
the top connecting plate and/or the bottom connecting plate are/is internally provided with the adjusting nut.
In some examples, the threaded rod has an ultra-fine thread.
In some examples, a damping nut is further provided on the threaded rod at the bottom of the connection plate.
In some examples, the jacking mechanism includes: lifting ring, movable column and corrugated pipe;
the lifting ring is positioned in the cavity, and the top of the movable column is fixedly connected with the bottom of the lifting ring;
the movable column penetrates through the corrugated tube, the top of the corrugated tube is fixedly connected with the bottom of the cavity, the bottom of the corrugated tube is fixedly connected with the top of the movable seat, an annular adjusting gap is reserved between the corrugated tube and the movable column, and the annular adjusting gap is used for providing a fit gap when the movable seat rotates relative to the connecting piece within a preset angle range.
According to the technical scheme, the invention has at least the following advantages and positive effects:
in the thimble mechanism horizontal adjusting device provided by the embodiment of the invention, the movable seat of the thimble lifting mechanism is connected with the connecting piece of the driving assembly through the angle adjusting mechanism, so that the angle between the lifting mechanism and the driving assembly can be adjusted within a preset angle range, the angle between the thimble and the heating disc can be adjusted within a certain angle range, the adjustment control of the levelness of the thimble can be realized without re-dismounting related equipment, and the process stability is ensured.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described below, it being understood that the drawings in the following description are only embodiments of the present invention and that other drawings may be obtained according to the drawings provided without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural view of a conventional thimble lifting mechanism.
Fig. 2 is a schematic diagram of a connection structure between a lifting mechanism and a driving assembly in the thimble lifting mechanism shown in fig. 1.
Fig. 3 is a schematic structural diagram of a horizontal adjustment device for a thimble mechanism according to an embodiment of the present invention.
Fig. 4 is an exploded view of the horizontal adjustment device of the ejector mechanism shown in fig. 3.
FIG. 5 is a cross-sectional view showing the connection structure of the movable seat and the connecting piece in the horizontal adjusting device of the thimble mechanism shown in FIG. 3.
Fig. 6 is a schematic diagram of a connection structure between a movable seat and a connecting piece of the horizontal adjusting device of the thimble mechanism shown in fig. 3.
In the figure: 101. a thimble; 102. a heating plate; 103. a lifting ring; 104. a cavity connecting plate, 105 and a movable column; 106. a bellows; 107. a movable seat; 108. a connecting piece; 1081. a bolt; 109. a driving member; 110. a positioning rod; 201. a thimble; 202. a heating plate; 203. a lifting ring; 204. a cavity connecting plate; 2041. a seal ring; 205. a movable column; 206. a bellows; 2061. annular adjusting gap; 207. a movable seat; 2071 top substrate; 2072 base substrate; 2073. a ball head rotating cavity; 2074. a movable seat locking bolt; 2075. cutting the corners; 208. a connecting piece; 2081. a top connection plate; 2082. A bottom connecting plate; 2083. A connector locking bolt; 2084. a through hole; 209. a driving member; 210. a positioning rod; 211. ball screw, 212, adjusting nut; 213 damping nut.
Description of the embodiments
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the following detailed description of the embodiments of the present invention will be given with reference to the accompanying drawings. However, those of ordinary skill in the art will understand that in various embodiments of the present invention, numerous technical details have been set forth in order to provide a better understanding of the present invention. However, the claimed invention may be practiced without these specific details and with various changes and modifications based on the following embodiments.
In the description of the present invention, it should be noted that the directions or positional relationships indicated by the terms "upper", "lower", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the apparatus or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
It should be noted that, unless explicitly stated otherwise, the terms "connected," "connected," and the like should be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements.
Referring to fig. 3 to 6, an embodiment of the present invention provides a horizontal adjustment device for a thimble mechanism, which can be used for adjusting the levelness of a plane where the vertex of a thimble is located according to the levelness of a heating plate after the cavity is installed. The thimble mechanism horizontal adjusting device of the embodiment of the invention comprises a plurality of thimbles 201, a jacking mechanism, a driving assembly and an angle adjusting mechanism.
The plurality of ejector pins 201 are all located in the cavity. The number of the ejector pins 201 is three, and the planes of the vertexes of the three ejector pins 201 are used for providing a supporting surface of a substrate, such as a wafer, manufactured by the semiconductor device. A heating plate 202 positioned above the jacking mechanism is also arranged in the cavity, and thimble through holes corresponding to the plurality of thimbles 201 are uniformly formed in the heating plate 202. The plurality of ejector pins 201 are vertically arranged at the top of the jacking mechanism, and the top ends of the ejector pins 201 penetrate through the ejector pin through holes. The bottoms of the ejector pins 201 can be provided with balancing weights, so that the ejector pins 201 can automatically drop after the jacking mechanism descends.
The jacking mechanism is arranged below the plurality of ejector pins 201 and is used for simultaneously jacking the plurality of ejector pins 201. The top of the jacking mechanism penetrates through the bottom of the cavity and is connected with the bottom of the cavity. The climbing mechanism comprises: lifting ring 203, cavity link plate 204, movable column 205, bellows 206, and movable base 207. Wherein, the lifting ring 203 is located in the cavity, and the top of the movable column 205 is fixedly connected with the bottom of the lifting ring 203. The movable column 205 is arranged in the corrugated pipe 206 in a penetrating way, and the bottom end of the movable column 205 is fixedly connected with the movable seat 207 positioned at the bottom of the jacking mechanism. The top of the corrugated pipe 206 is fixedly connected with the bottom of the cavity, and the bottom end of the corrugated pipe 206 is fixedly connected with the top of the movable seat 207. Specifically, the top of the bellows 206 is fixedly connected to the cavity connecting plate 204, and the cavity connecting plate 204 is fixedly connected to the bottom of the cavity. A sealing ring 2041 is provided in the cavity web 204. The cavity connecting plate 204, the movable column 205, the corrugated pipe 206 and the movable seat 207 are all fixedly connected. Therefore, air seal is formed between the jacking mechanism and the cavity, so that a certain vacuum degree can be kept in the cavity.
The driving assembly is connected with the bottom of the movable seat 207 and is used for driving the jacking mechanism to jack the ejector pin 201. The drive assembly includes: a driving element 209, a positioning rod 210 and a connecting element 208 arranged below the movable seat 207 of the lifting mechanism.
The angle adjusting mechanism is connected to the movable base 207 and the connecting member 208, respectively, and is used to adjust and maintain the angle of the movable base 207 with respect to the connecting member 208 within a predetermined angle range.
When in use, the driving piece 209 drives the movable seat 207 connected with the connecting piece 208 to move up and down along the positioning rod 210, so that the lifting ring 203 jacks up the ejector pins, the ejector pins with the balancing weights move up and down to pass through the lifting holes of the heating plate 202, when the ejector pins 201 pass through the lifting holes to reach a certain height, the wafer falls onto the top points of the ejector pins 201 with the balancing weights, and then the ejector pins slowly fall down, so that the wafer is placed on the heating plate.
When the installation of the equipment is completed, if the levelness of the spraying device at the top of the cavity deviates due to factors such as the processing precision and the assembly precision of the hinge, the heating plate 202 can be adjusted to keep the required levelness with the spraying device. The angle between the movable base 207 and the connecting member 208 can then be adjusted by an angle adjustment mechanism, so that the plane of the apex of the ejector pin and the heating plate 202 etc. maintain a desired levelness.
The angle adjustment mechanism includes: three adjusting members. Illustratively, any one of the adjustment members may form a rotational portion with the movable mount 207 and the remaining two adjustment members may be capable of driving the movable mount 207 to rotate relative to the connection member 208 based on the rotational portion. Therefore, the adjustment of the thimble angle can be realized by simultaneously adjusting the height or the height of the adjusting piece; and the rotation part is formed by one of the adjusting parts, which is easy to realize.
As an alternative, any two adjusting members can form a rotation axis with the movable base 207 and the remaining one adjusting member can drive the movable base 207 to rotate about the rotation axis with respect to the connecting member 208. However, the present invention is not limited thereto, and the angle of the ejector pin may be adjusted by the rotation fit of the adjusting member and the movable base 207.
Specifically, the adjusting member may be ball screws 211, the movable seat 207 has a ball rotating cavity 2073 engaged with a ball of each ball screw 211, the ball is located in the ball rotating cavity 2073 and the movable seat 207 can rotate relative to the ball. The movable seat 207 being rotatable relative to the ball head means that the movable seat can be rotatable relative to the ball head of any one ball head screw 211, so that the ball head of the ball head screw 211 and the movable seat 207 form a rotation shaft. The connecting piece 208 is provided with a through hole 2084 corresponding to the threaded rod of the ball screw 211, and the threaded rod is arranged in the through hole 2084 in a penetrating way. Also provided within the connector 208 is an adjustment nut 212 that mates with the threaded rod. The adjusting nut 212 has a thread groove adapted to the thread on the threaded rod of the ball screw 211, and the movable base 207 can be driven to rotate relative to the connecting piece 208 by screwing the bottom end of the threaded rod of the ball screw 211, and simultaneously the adjusting nut 212 is matched with the threaded rod so that the movable base 207 and the connecting piece 208 are locked at a required angle. It should be noted that the threaded rod of the ball screw 211 may have a threaded section corresponding to the adjusting nut 212, and the height of the threaded section is the range of up-down movement of the ball screw 211, and the portion of the threaded rod not matching with the nut may be smooth and cylindrical. The through hole 2084 is slightly larger than the threaded rod of the ball screw 211, so as to prevent the ball screw 211 from being blocked when the height is adjusted.
Wherein, the number of the ball head rotating cavities 2073 is three, and the three ball head rotating cavities 2073 are uniformly distributed on the movable seat 207 and are positioned at the edge of the movable seat 207. The outer peripheral wall of the movable base 207 has a chamfer 2075 enabling the movable base 207 to rotate within a predetermined angular range with respect to the connecting member 208. It is understood that, for any two adjusting members and the movable base 207 may form a rotation shaft, the bottom of the movable base 207 may be in an equilateral triangle, and the three ball rotating cavities 2073 are respectively located at the vertices of the triangle. Illustratively, the chamfer 2075 may be sized at a 45 angle with the chamfer 2075 immediately adjacent the ball pivot cavity 2073 so that the movable mount 207 can be rotated at an angle relative to the connection 208. For example, the predetermined angle range may be 0-4 °, that is, the movable base 207 may achieve fine adjustment of the angle within 4 ° with respect to the connecting piece 208, so that the plane of the vertex of the ejector pin 201 may maintain a desired levelness with the heating plate 202. Small amplitude adjustment within 4 degrees can be fully compatible with the design size of the existing corrugated pipe. However, without being limited thereto, a larger angular range of adjustment can be achieved by adjusting the bellows design as long as frictional interference does not occur between the bellows 206 and the movable post 205.
The bottom of the bellows 206 is fixedly connected with the top of the movable seat 207, and an annular adjusting gap 2061 is left between the bellows 206 and the movable post 205, and the annular adjusting gap 2061 is used for providing a fit gap when the movable seat 207 rotates relative to the connecting piece 208 within a preset angle range, so that interference between the bellows 206 and the movable post 205 can be avoided, and the movable post 205 can still freely move in the bellows 206 when the angle between the movable seat 207 and the connecting piece 208 is adjusted to a larger angle. Specifically, compared with the prior art, the inner diameter of the bellows 206 can be increased from 1CM to 2CM, so that the movable column 205 can have enough movement space in the bellows 206 within a certain angle range, but the inner diameter of the bellows 206 is not particularly limited, so long as the air tightness and smoothness of the movable column during movement can be considered.
As an example, the movable base 207 may include a top substrate 2071 and a bottom substrate 2072. The top substrate 2071 and the bottom substrate 2072 are fixedly connected by a movable seat lock bolt 2074. The top substrate 2071 and the bottom substrate 2072 are formed with a ball rotating cavity 2073, the ball of the ball screw 211 is matched with the ball rotating cavity 2073 and the movable seat 207 can rotate relative to the ball. In the mounting process, the threaded rod of the ball screw 211 penetrates from the top of the bottom base plate 2072, and the bottom base plate 2072 and the top base plate 2071 are aligned and then locked and fixed through the movable base locking bolt 2074. The number of the movable seat locking bolts 2074 may be three, but is not limited thereto, as long as the top substrate 2071 and the bottom substrate 2072 can be firmly locked. In this embodiment, the top substrate 2071 may be a movable base of an existing thimble lifting mechanism, and the top substrate 2071 and the bottom substrate 2072 may respectively form a partial ball rotating cavity 2073.
Correspondingly, for the scheme that any two adjusting members and the movable seat 207 can form a rotating shaft, the base substrate 2072 can be made to be in an equilateral triangle, and the movable seat 207 can be ensured to rotate for a certain angle relative to the connecting member 208.
The connection 208 may include a top connection plate 2081 and a bottom connection plate 2082, with the top connection plate 2081 and the bottom connection plate 2082 being fixedly connected by a connection locking bolt 2083. The number of the connector locking bolts 2083 may be 4, and is not particularly limited herein, as long as the top connector plate 2081 and the bottom connector plate 2082 can be firmly locked. Wherein, an adjusting nut 212 can be arranged in the top connecting plate 2081. Or the adjusting nut 212 can be arranged in the bottom connecting plate 2082, correspondingly, the top connecting plate 2081 can be connected with a connecting piece in the prior art, at the moment, when abrasion occurs, only the bottom connecting plate 2082, the adjusting nut 212 and the like can be replaced, the top connecting plate 2081 connected with the driving piece 209 does not need to be replaced, and the maintenance cost is saved. And adjusting nuts 212 are arranged in the top connecting plate 2081 and the bottom connecting plate 2082, namely, part of the adjusting nuts 212 is positioned at the bottom of the top connecting plate 2081, and the other part is positioned at the top of the bottom connecting plate 2082.
In one example, a shock nut 213 is further provided on the threaded rod of the ball screw 211 at the bottom of the connecting member 208, so that the position of the ball screw 211 can be locked more reliably for a longer time.
The threaded shaft of the ball screw 211 may have ultra-fine threads, thereby making the angle adjustment accuracy finer. The bottom end of the threaded rod of the ball screw 211 is provided with an adjusting groove, which can be matched with a screwdriver and the like to realize the height adjustment of the ball screw 211.
The relationship between the height of the ball screw 211 and the adjustment angle (lift ring tilt angle) is illustrated below:
wherein the diameter of the movable seat 207 is 5cm, and the distance between the corresponding openings at the lower ends of the bulbs of each two bulb screws 211 is 4.3cm; the diameter of the slide area of the heating plate 202 is 30.2cm, and the distance between every two lifting holes is 23.38cm;
the ball screw height and corresponding angular offset are shown in the following table (unit: CM):
| angle adjustment | Ball screw moving height | Height of lifting ring | Width of movement of movable column |
| 1° | 0.075 | 0.408 | 0.122 |
| 2° | 0.15 | 0.816 | 0.244 |
| 3° | 0.225 | 1.224 | 0.366 |
| 4° | 0.299 | 1.63 | 0.488 |
| 5° | 0.375 | 2.038 | 0.61 |
As can be seen from the data in the table, a greater height adjustment of the lift ring 203 can be achieved by slightly adjusting the height of the ball screw 211.
According to the embodiment of the invention, the levelness of the thimble mechanism is kept consistent with the levelness of the related mechanisms such as the heating disc by slightly changing the existing thimble lifting mechanism. The cavity is adjusted to be relatively horizontal, and then the height of the ball screw is adjusted, so that the tiny errors of the thimble point on the horizontal caused by assembly errors or low equipment machining precision can be compensated, the stability of the wafer transferred by the manipulator is improved, the process stability is improved, and the high-precision requirement of machining can be properly reduced.
The using method of the thimble mechanism horizontal adjusting device of the embodiment in combination with fig. 3 and 5 is as follows:
after the heating plate 202 and the spraying device (also called as a gas plate) in the cavity are adjusted relatively horizontally, the inclination angle of the inclined heating plate 202 is measured and recorded by using an inclinometer; the driving motor is controlled to drive the connecting piece 208 and the device above the connecting piece to move up and down along the positioning rod 210, the lifting ring 203 is driven to jack up the thimble 201 with the balancing weight, the thimble 201 is upwards moved to pass through a lifting hole in the heating disc 202 by a certain height, a disc with the same size as a wafer is placed, an inclinometer is used for measuring and recording the angle of the disc, and when the angle of the disc deviates from the angle of the heating disc, a screwdriver is used for adjusting the height of the ball head screw 211 until the inclination angle of the disc is consistent with the inclination angle of the heating disc. Therefore, the levelness of the thimble and the levelness of the heating plate can meet the required requirements.
Based on the technical scheme, the invention has at least the following advantages and positive effects:
in the thimble mechanism horizontal adjusting device provided by the embodiment of the invention, the movable seat of the thimble lifting mechanism is connected with the connecting piece of the driving assembly through the angle adjusting mechanism, so that the angle between the lifting mechanism and the driving assembly can be adjusted within a preset angle range, the angle between the thimble and the heating disc can be adjusted within a certain angle range, the adjustment control of the levelness of the thimble can be realized without re-dismounting related equipment, and the process stability is ensured.
It will be understood by those of ordinary skill in the art that the foregoing embodiments are specific examples of carrying out the invention and that various changes in form and details may be made therein without departing from the spirit and scope of the invention.
Claims (6)
1. The utility model provides a thimble mechanism level adjustment device which characterized in that includes:
the plurality of ejector pins are positioned in the cavity;
the jacking mechanism is arranged below the plurality of ejector pins and is used for jacking the plurality of ejector pins; the top of the jacking mechanism penetrates through the bottom of the cavity and is connected with the bottom of the cavity; the jacking mechanism comprises a movable seat positioned at the bottom of the jacking mechanism;
the driving assembly is connected with the bottom of the movable seat and used for driving the jacking mechanism to jack the thimble, and the driving assembly comprises: the connecting piece is arranged below the movable seat of the jacking mechanism; and
the angle adjusting mechanism is respectively connected with the movable seat and the connecting piece and is used for adjusting and maintaining the angle of the movable seat relative to the connecting piece within a preset angle range;
the angle adjusting mechanism includes: three adjusting members;
any one of the adjusting pieces and the movable seat form a rotating part, and the other two adjusting pieces can drive the movable seat to rotate relative to the connecting piece based on the rotating part; or alternatively
Any two adjusting parts can form a rotating shaft with the movable seat, and the other adjusting parts can drive the movable seat to rotate relative to the connecting part by taking the rotating shaft as a rotating shaft;
the adjusting piece is a ball screw;
the movable seat is provided with a ball head rotating cavity matched with the ball head of each ball head screw, the ball head is positioned in the ball head rotating cavity, and the movable seat can rotate relative to the ball head;
the connecting piece is provided with a through hole corresponding to the threaded rod of the ball screw, and the threaded rod is arranged in the through hole in a penetrating way;
an adjusting nut matched with the threaded rod is further arranged in the connecting piece;
the movable seat comprises a top substrate and a bottom substrate; the top substrate and the bottom substrate are fixedly connected through a movable seat locking bolt; the top substrate and the bottom substrate form the ball head rotating cavity, the ball head is matched with the ball head rotating cavity, and the movable seat can rotate relative to the ball head;
the ball screws are uniformly distributed on the movable seat and positioned at the edge of the movable seat;
the peripheral wall of the movable seat is provided with a chamfer enabling the movable seat to rotate within the preset angle range relative to the connecting piece;
when any two adjusting parts and the movable seat form a rotating shaft, the base substrate is in an equilateral triangle shape, and the ball screws are respectively positioned at the top points of the base substrate.
2. The ejector pin mechanism horizontal adjustment device of claim 1, wherein the chamfer angle is 45 ° and the chamfer angle is immediately adjacent the ball head rotation cavity.
3. The thimble mechanism horizontal adjustment device according to claim 1, wherein said connector comprises a top connector plate and a bottom connector plate, said top connector plate and said bottom connector plate being fixedly connected by a connector locking bolt;
the top connecting plate and/or the bottom connecting plate are/is internally provided with the adjusting nut.
4. The ejector mechanism horizontal adjustment device of claim 1, wherein the threaded rod has ultra-fine threads.
5. The thimble mechanism horizontal adjustment device according to claim 1, wherein said threaded rod further comprises a shock nut disposed on said threaded rod at said bottom of said connector.
6. The thimble mechanism level adjustment device according to claim 1, wherein said climbing mechanism comprises: lifting ring, movable column and corrugated pipe;
the lifting ring is positioned in the cavity, and the top of the movable column is fixedly connected with the bottom of the lifting ring;
the movable column penetrates through the corrugated tube, the top of the corrugated tube is fixedly connected with the bottom of the cavity, the bottom of the corrugated tube is fixedly connected with the top of the movable seat, an annular adjusting gap is reserved between the corrugated tube and the movable column, and the annular adjusting gap is used for providing a fit gap when the movable seat rotates relative to the connecting piece within a preset angle range.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310511272.7A CN116230620B (en) | 2023-05-09 | 2023-05-09 | Horizontal adjusting device of thimble mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310511272.7A CN116230620B (en) | 2023-05-09 | 2023-05-09 | Horizontal adjusting device of thimble mechanism |
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| Publication Number | Publication Date |
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| CN116230620A CN116230620A (en) | 2023-06-06 |
| CN116230620B true CN116230620B (en) | 2023-07-21 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202310511272.7A Active CN116230620B (en) | 2023-05-09 | 2023-05-09 | Horizontal adjusting device of thimble mechanism |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN117476539B (en) * | 2023-10-07 | 2024-05-03 | 昆山日月同芯半导体有限公司 | Adjustment mechanism convenient to adjust thimble seat height |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5504980B2 (en) * | 2010-03-04 | 2014-05-28 | 日新イオン機器株式会社 | Wafer lift rotation mechanism, stage apparatus, and ion implantation apparatus |
| KR102430473B1 (en) * | 2016-03-03 | 2022-08-09 | 세메스 주식회사 | Ejector pin and die ejecting apparatus having the same |
| CN107195576B (en) * | 2017-05-24 | 2020-05-05 | 广东瑞谷光网通信股份有限公司 | XY movement, angle correction and ejection mechanism for chip |
| CN112447579B (en) * | 2019-09-04 | 2023-10-31 | 中微半导体设备(上海)股份有限公司 | Plasma processor, wafer jacking device and method thereof |
| CN114121771B (en) * | 2021-11-18 | 2023-07-14 | 深圳新益昌科技股份有限公司 | Ejector pin mechanism and crystal ejection equipment |
| CN113903703B (en) * | 2021-12-10 | 2022-04-12 | 上海陛通半导体能源科技股份有限公司 | Horizontal adjusting device of thimble mechanism |
| CN114927461B (en) * | 2022-07-01 | 2023-08-18 | 北京北方华创微电子装备有限公司 | Wafer carrying device and semiconductor process equipment |
| CN115274540A (en) * | 2022-07-26 | 2022-11-01 | 长园半导体设备(珠海)有限公司 | Thimble mechanism |
| CN218585944U (en) * | 2022-09-20 | 2023-03-07 | 深圳市联赢激光股份有限公司 | Chip feeding mechanism and ejector pin module |
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