CN116230584A - Pump source chip mounter and chip mounting control method - Google Patents
Pump source chip mounter and chip mounting control method Download PDFInfo
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- CN116230584A CN116230584A CN202211560367.XA CN202211560367A CN116230584A CN 116230584 A CN116230584 A CN 116230584A CN 202211560367 A CN202211560367 A CN 202211560367A CN 116230584 A CN116230584 A CN 116230584A
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- H—ELECTRICITY
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- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
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- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/09—Processes or apparatus for excitation, e.g. pumping
- H01S3/091—Processes or apparatus for excitation, e.g. pumping using optical pumping
- H01S3/094—Processes or apparatus for excitation, e.g. pumping using optical pumping by coherent light
- H01S3/094003—Processes or apparatus for excitation, e.g. pumping using optical pumping by coherent light the pumped medium being a fibre
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- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
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Abstract
The invention discloses a pump source chip mounter and a chip mounting control method, wherein the pump source chip mounter comprises a workbench, a turntable, a pump source sintering jig, two automatic feeding tools, two automatic mounting mechanisms and driving equipment, a sintering disc mounting and taking station and two mounting stations are circumferentially arranged on the workbench, the turntable is rotatably arranged on the workbench, a vacuum suction seat is arranged on the turntable, the vacuum suction seat can reach the sintering disc mounting and taking station and the two mounting stations, the pump source sintering jig is arranged on the vacuum suction seat, a mounting groove is arranged on the pump source sintering jig, the two automatic feeding tools are respectively arranged on the workbench, and are respectively provided with a material taking station for providing different pieces to be mounted, the two automatic mounting mechanisms are respectively arranged on the workbench and are used for picking up the pieces to be mounted arranged on the corresponding material taking station to the mounting grooves of the corresponding mounting stations, and the driving equipment drives the turntable to rotate, and the two pieces to be mounted comprise welding pieces and chips. The problem of current pump source paster in-process adopt artifical manual paster existence inefficiency is solved.
Description
Technical Field
The invention relates to the technical field of pump source surface mounting, in particular to a pump source surface mounting machine and a surface mounting control method.
Background
The pumping source is a core component of the fiber laser, and in the actual production process, a soldering lug and a chip are required to be connected with a pumping source base according to a certain sequence. In the existing production process, manual operation is mostly adopted. The method comprises the following steps: the soldering lug and the chip are manually clamped by tweezers and then are placed on the appointed position of the pumping source base according to a certain sequence. The manual operation efficiency is low, meanwhile, the proficiency of operators is high, even if the operators are further proficient, the operators can be tired after working for a long time, the processing quality is reduced, and the quality standard is difficult to ensure.
Disclosure of Invention
The invention mainly aims to provide a pump source chip mounter and a chip mounting control method, and aims to solve the problem of low chip mounting efficiency in the existing pump source chip mounting technology by adopting a manual chip mounting feeding mode.
In order to achieve the above object, the pump source chip mounter according to the present invention includes:
the working table is provided with a sintering disc loading and unloading station and two mounting stations along the circumferential direction, wherein the two mounting stations are respectively used for mounting two pieces to be mounted;
the rotary table is rotationally arranged on the workbench along an up-down axial line, a vacuum suction seat is arranged on the rotary table, and the vacuum suction seat can sequentially reach the sintering disc loading and unloading station and the two mounting stations on the rotating stroke of the rotary table;
The pumping source sintering jig is adsorbed and placed on the vacuum suction seat, and a mounting groove is formed in the pumping source sintering jig;
the two automatic feeding tools are arranged on the workbench respectively corresponding to the two mounting stations, each automatic feeding tool is provided with a material taking station, and the two material taking stations are respectively used for providing one to-be-mounted part;
the two automatic mounting mechanisms are respectively arranged on the workbench corresponding to the two automatic feeding tools and used for picking up the to-be-mounted parts arranged on the corresponding material taking stations to the mounting grooves of the pumping source sintering jig at the corresponding mounting stations; the method comprises the steps of,
the driving device is used for driving the turntable to rotate;
the two pieces to be attached comprise soldering lugs and chips.
Optionally, the two get material station includes the chip and gets material station, two paste the dress station including corresponding the chip paste the dress station of chip getting material station, two automatic feeding frock includes chip material loading frock, chip material loading frock includes:
the base is arranged on the workbench, and the chip taking station is formed on the base;
the carrying structure is arranged on the base corresponding to the chip material taking station and comprises a material taking cavity and a blanking cavity which are respectively communicated upwards, wherein the material taking cavity is provided with a material taking space at an opening, and the blanking cavity is provided with a blanking space at the opening;
The material box jigs are stacked up and down and are arranged in the material taking cavity, and the material box jigs are used for placing chips;
the jacking piece is movably arranged on the base along the up-down direction, can extend into the material taking cavity and jack up the plurality of material box jigs upwards so as to jack the material box jigs at the upper end to the material taking space;
the pneumatic paw is used for grabbing the material box jig in the material taking space to the blanking space; the method comprises the steps of,
and the falling piece is movably arranged on the base along the up-down direction, and can extend into the blanking space of the blanking cavity and load the material box jig downwards so as to empty the blanking space.
Optionally, two abdication through holes which are respectively communicated with the material taking cavity and the blanking cavity are formed at the bottom of the carrying structure, and the two abdication through holes are respectively used for the corresponding jacking piece and the falling piece to pass through;
the chip material loading frock includes:
the first longitudinal movement module is arranged corresponding to the blanking cavity, is movably arranged on the base along the up-down direction and is positioned below the corresponding yielding through hole, and the falling piece is arranged on the first longitudinal movement module;
The second longitudinal movement module is arranged corresponding to the material taking cavity, is movably arranged on the base along the up-down direction and is positioned below the corresponding yielding through hole, and the jacking piece is arranged on the second longitudinal movement module; the method comprises the steps of,
the detection assembly comprises a first sensor, a second sensor, a third sensor, a fourth sensor, a fifth sensor and a controller, wherein the first sensor is used for detecting the blanking space, the second sensor is used for detecting the bottom of the blanking cavity, the third sensor is used for detecting the material taking space, the fourth sensor is used for detecting the bottom of the material taking cavity, the fifth sensor is used for detecting the lower side space of the material taking space, and the controller is electrically connected with the first sensor, the second sensor, the third sensor, the fourth sensor, the fifth sensor, the first longitudinal movement module and the second longitudinal movement module.
Optionally, each of the automatic mounting mechanisms includes:
the mounting seat is movably arranged relative to the workbench, so that the mounting seat can reach the corresponding material taking station and the corresponding mounting station on the movable travel;
The driving device is arranged on the workbench and is in driving connection with the mounting seat and used for driving the mounting seat to move;
the picking assembly is arranged on the mounting seat and comprises a picking part which is rotatably arranged on the mounting seat along an up-down axial line, and the picking part is used for picking up the to-be-mounted parts arranged on the corresponding material taking station to the corresponding mounting station;
the first camera device is arranged on the mounting seat and is used for shooting the positions of the to-be-mounted parts of the corresponding material taking station and the mounting groove of the pumping source sintering jig;
and the control device is respectively and electrically connected with the driving device, the pick-up assembly and the image pick-up device.
Optionally, the first camera device is arranged on the upper sides of the material taking station and the mounting station and is used for shooting from top to bottom;
the automatic mounting mechanism further comprises a second camera device, the second camera device is fixedly mounted on the workbench, the mounting seat can move to the upper side of the second camera device on the moving stroke of the mounting seat, and the second camera device is used for shooting from bottom to top.
Optionally, the two automatic feeding tools include a soldering lug feeding tool, and a material taking station of the soldering lug feeding tool is used for providing soldering lugs;
the automatic mounting mechanisms comprise soldering lug mounting mechanisms, the soldering lug mounting mechanisms correspond to the soldering lug feeding tools, the soldering lug mounting mechanisms further comprise waste barrels, and the waste barrels are used for placing dirty soldering lugs.
Optionally, the pump source sintering jig includes:
the vacuum suction seat is arranged on the vacuum suction seat, a mounting groove is formed in the pump source seat, and a plurality of chip bonding positions are formed in the bottom of the mounting groove; the method comprises the steps of,
the positioning jig is arranged in the mounting groove and is arranged at the bottom of the mounting groove in a covering manner, and is provided with a plurality of positioning grooves penetrating in the vertical direction, and the positioning grooves are correspondingly arranged with the chip bonding positions;
wherein, be equipped with at least one reference column on the location tool, the edge of the upper end of reference column is the chamfer setting.
Optionally, the upper surface of the positioning jig is provided with a plurality of coding holes, and the pumping source sintering jig further comprises a plurality of coding pins;
wherein, the coding pins with different numbers can be selected and inserted into the coding holes according to different arrangement combinations so as to form various visual identification coding combinations.
Optionally, the vacuum suction seats are three, and the three vacuum suction seats are arranged at intervals along the circumferential direction of the turntable so as to respectively correspond to the sintering disc loading and unloading station and the two mounting stations.
Optionally, the driving device comprises a DD motor, a motor seat of the DD motor is arranged on the workbench, an output rotating shaft of the DD motor rotates along an up-down axis, and the turntable is connected to the output rotating shaft.
The invention also provides a pump source surface mounting control method for the pump source surface mounting machine, wherein the two automatic feeding tools comprise a chip feeding tool and a soldering lug feeding tool, the two material taking stations comprise a soldering lug material taking station and a chip material taking station, the two automatic surface mounting mechanisms comprise a soldering lug surface mounting mechanism and a chip surface mounting mechanism, and the two surface mounting stations comprise a soldering lug surface mounting station and a chip surface mounting station, and the pump source surface mounting control method is characterized by comprising the following steps:
after the pump source sintering jig is positioned and placed on the vacuum suction seat at the sintering disc loading and unloading station, a target mounting position of the core mounting position in the mounting groove is obtained;
after the pump source sintering jig moves from the sintering disc loading and unloading station to the soldering lug attaching station, controlling the soldering lug feeding tool to act so as to supplement soldering lugs to the soldering lug unloading station;
Controlling the action of the soldering lug mounting mechanism according to the target mounting position so as to pick up the soldering lug on the soldering lug taking station to the chip mounting position of the mounting groove;
after the pumping source sintering jig moves from the soldering lug mounting station to the chip mounting station, controlling the chip feeding tooling to act so as to supplement chips to the chip taking station;
and controlling the chip mounting mechanism to act according to the target mounting position so as to pick up the chip on the chip taking station to the soldering lug positioned at the chip mounting position.
Optionally, the chip feeding fixture comprises a base, a carrying structure, a plurality of material box fixtures, a jacking piece, a falling piece, a first longitudinal movement module and a second longitudinal movement module, wherein the base is arranged on the workbench, the chip feeding station is formed on the base, the carrying structure is arranged on the base corresponding to the chip feeding station, the carrying structure comprises a feeding cavity and a blanking cavity which are respectively penetrated upwards, the feeding cavity is provided with a feeding space at an opening, the blanking cavity is provided with a blanking space at the opening, the plurality of material box fixtures are vertically stacked and arranged in the feeding cavity, the material box fixtures are used for placing chips, the first longitudinal movement module is vertically and movably arranged on the base, the falling piece is arranged on the first longitudinal movement module, the falling piece can extend into the blanking space and downwards load the material box fixtures, the second longitudinal movement module is vertically and movably arranged on the base, the second longitudinal movement module can extend into the jacking piece and vertically arranged in the jacking cavity, and the second longitudinal movement module can vertically move upwards;
The step of controlling the chip feeding tool to act so as to supplement chips to the chip taking station specifically comprises the following steps of:
respectively acquiring a second shielding signal of a second position of the chip taking station and a fifth shielding signal of a fifth position of the chip taking station;
when the second shielding signal is non-shielding and the fifth shielding signal is shielded, respectively acquiring a first shielding signal of the first position of the chip taking station and a third shielding signal of the third position of the chip taking station;
when the first shielding signal is shielded and the third shielding signal is not shielded, the first longitudinal movement module and the second longitudinal movement module are controlled to act so as to drive the falling piece downwards by one unit height, and simultaneously drive the jacking piece upwards by one unit height so as to empty the blanking space and supplement chips to the material taking space at the chip material taking station.
Optionally, the chip mounting mechanism includes a mounting seat and a pickup assembly, the mounting seat is movably disposed relative to the workbench so that the mounting seat can reach the chip taking station and the corresponding chip mounting station on a movable stroke, the pickup assembly is mounted on the mounting seat, the pickup assembly includes a pickup part rotatably mounted on the mounting seat along an up-down axis, and the pickup part is used for picking up a piece to be mounted placed on the chip taking station to the chip mounting station;
The step of controlling the chip mounting mechanism to act according to the target mounting position so as to pick up the chip on the chip taking station to the soldering lug positioned in the mounting groove specifically comprises the following steps:
acquiring a position to be picked up of a chip on the chip taking station;
controlling the pick-up part to move to the position to be picked up so as to pick up the chip;
and controlling the pick-up part to move to the target mounting position so as to mount the chip on the chip mounting position.
Optionally, the step of obtaining the target mounting position of the chip mounting position in the mounting groove specifically includes the following steps;
obtaining coding information of the pumping source sintering jig to determine the model of the pumping source sintering jig;
acquiring position information of a coordinate reference arranged on the pumping source sintering jig, and establishing a current rectangular coordinate system according to the position information of the coordinate reference;
and inquiring a preset mapping relation according to the current rectangular coordinate system to obtain the position information of each chip attaching position on the pump source sintering jig, wherein the preset mapping relation is the corresponding relation between the model of the pump source sintering jig and the position information of each chip attaching position on the pump source sintering jig.
Optionally, a plurality of coding holes are formed in the pump source sintering jig, the pump source sintering jig further comprises a plurality of coding pins, and different numbers of the coding pins are selected to be inserted into the plurality of coding holes at different positions so as to form a plurality of visual identification codes;
the step of obtaining the coding information to determine the model of the pump source sintering jig comprises the following steps:
acquiring the number of the coding pins and the position information of each coding pin in a plurality of coding holes;
acquiring the visual identification codes according to the position information of each coding pin in a plurality of coding holes;
inquiring a preset coding relation according to the visual identification code to determine the model of the pumping source sintering jig, wherein the preset coding relation is the corresponding relation between the visual identification code and the model of the pumping source sintering jig.
According to the technical scheme provided by the invention, the pumping source sintering jig is manually placed on the vacuum suction seat at the sintering disc loading station, the driving device drives the turntable to rotate so as to drive the vacuum suction seat to rotate to the corresponding mounting station, at the moment, the corresponding automatic mounting mechanism automatically picks up the soldering lug at the corresponding chip loading station to the mounting groove firstly, then the driving device drives the turntable to rotate so as to drive the vacuum suction seat to rotate to the other mounting station, at the moment, the other automatic mounting mechanism automatically picks up the chip at the other chip loading station to the mounting groove, so that the alignment mounting of the soldering lug and the chip is completed, and finally, the driving device drives the turntable to rotate so as to drive the vacuum suction seat to rotate to the sintering disc loading station again.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of an embodiment of a pump source chip mounter according to the present invention;
FIG. 2 is a schematic structural diagram of the chip loading tool in FIG. 1 in one direction;
fig. 3 is a schematic structural diagram of the chip feeding tooling (excluding the lateral movement module and the mounting structure) in fig. 2;
fig. 4 is a schematic structural diagram of the chip feeding tooling (excluding the slide) in fig. 3;
fig. 5 is a schematic structural diagram of the mounting structure (including the cartridge jig) in fig. 2;
FIG. 6 is a schematic diagram of the chip cartridge and the cover of the chip cartridge in FIG. 5;
fig. 7 is a schematic structural diagram of the chip feeding tooling in fig. 1 in another direction;
FIG. 8 is a schematic view of an embodiment of the automatic mounting mechanism (soldering-tab mounting mechanism) in FIG. 1;
Fig. 9 is a schematic structural view of another embodiment (chip mounter) of the automatic mounting mechanism in fig. 1;
FIG. 10 is a schematic view of a partial mounting structure of the mount, pickup device and first camera device of FIG. 8;
FIG. 11 is a schematic view of a partial mounting structure of the mount, pickup device and first camera device of FIG. 10 from another perspective;
FIG. 12 is a schematic diagram of the pump source sintering fixture of FIG. 8;
FIG. 13 is a schematic perspective view of the pump source sintering fixture of FIG. 12 from another perspective;
fig. 14 is a schematic structural view of the positioning post in fig. 12 and a schematic view of a photographing direction;
FIG. 15 is a schematic view of the positioning post of FIG. 14;
FIG. 16 is a schematic view of FIG. 12 with two positioning columns to establish a rectangular coordinate system;
FIG. 17 is a schematic diagram illustrating the positions of a plurality of identification points on the boundary of the contour of the positioning slot in FIG. 12;
FIG. 18 is a schematic illustration of a polygonal profile fitted with a plurality of identified points of FIG. 17;
fig. 19 is a flowchart illustrating an embodiment of a pump source patch mounting control method according to the present invention.
Reference numerals illustrate:
the achievement of the objects, functional features and advantages of the present invention will be further described with reference to the accompanying drawings, in conjunction with the embodiments.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the case where a directional instruction is involved in the embodiment of the present invention, the directional instruction is merely used to explain the relative positional relationship, movement condition, etc. between the components in a specific posture, and if the specific posture is changed, the directional instruction is changed accordingly.
In addition, if there is a description of "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present invention.
The pumping source is a core component of the fiber laser, and in the actual production process, a soldering lug and a chip are required to be connected with a pumping source base according to a certain sequence. In the existing production process, manual operation is mostly adopted. The method comprises the following steps: the soldering lug and the chip are manually clamped by tweezers and then are placed on the appointed position of the pumping source base according to a certain sequence. The manual operation efficiency is low, meanwhile, the proficiency of operators is high, even if the operators are further proficient, the operators can be tired after working for a long time, the processing quality is reduced, and the quality standard is difficult to ensure.
In view of the above, the invention provides a pump source chip mounter and a chip mounting control method, which aim to solve the problem of low chip mounting efficiency in the existing pump source chip mounting process by adopting a manual chip mounting feeding mode. Fig. 1 to fig. 18 are schematic structural diagrams of an embodiment of a pump source chip mounter provided by the present invention, and fig. 19 is a flow chart of a pump source chip mounter control method provided by the present invention.
Referring to fig. 1, the pump source chip mounter 1000 provided by the present invention includes a workbench 500, a turntable 400, a pump source sintering fixture 200, two automatic feeding tools 100, two automatic mounting mechanisms 300, and a driving device, wherein a sintering tray mounting station and two mounting stations are circumferentially arranged on the workbench 500, and the two mounting stations are respectively used for mounting two pieces to be mounted; the rotary table 400 is rotatably arranged on the workbench 500 along an up-down axis, the rotary table 400 is provided with a vacuum suction seat 41, and the vacuum suction seat 41 can sequentially reach the sintering disc loading and unloading station and the two mounting stations on the rotation stroke of the rotary table 400; the pump source sintering jig 200 is adsorbed and placed on the vacuum suction seat 41, and a mounting groove is formed in the pump source sintering jig 200; the two automatic feeding tools 100 are respectively arranged on the workbench 500 corresponding to the two mounting stations, each automatic feeding tool 100 is provided with a material taking station, and the two chip material taking stations are respectively used for providing one of the to-be-mounted parts; the two automatic mounting mechanisms 300 are respectively arranged on the workbench 500 corresponding to the two automatic feeding tools 100, and are used for picking up the to-be-mounted parts arranged at the corresponding chip taking stations to the mounting grooves of the pumping source sintering jig 200 at the corresponding mounting stations; the driving device is used for driving the turntable 400 to rotate; the two pieces to be attached comprise soldering lugs and chips.
According to the technical scheme provided by the invention, the pump source sintering jig 200 is manually placed on the vacuum suction seat 41 at the sintering disc loading station, the driving device drives the rotary disc 400 to rotate so as to drive the vacuum suction seat 41 to rotate to the corresponding mounting station, at the moment, the corresponding automatic mounting mechanism 300 automatically picks up the soldering lug at the corresponding chip loading station to the mounting groove firstly, then the driving device drives the rotary disc 400 to rotate so as to drive the vacuum suction seat 41 to rotate to the other mounting station, at the moment, the other automatic mounting mechanism 300 automatically picks up the chip at the other chip loading station to the mounting groove after the chip is automatically positioned at the other chip loading station, so that the alignment mounting of the soldering lug and the chip is finished, and finally, the driving device drives the rotary disc 400 to rotate so as to drive the vacuum suction seat 41 to rotate to the chip loading station again.
It should be noted that, the pump source sintering jig 200 to which the soldering lug and the chip are attached needs to be manually placed in a sintering furnace to perform final sintering welding; the chip and the soldering lug also need to be manually supplemented to the two automatic feeding tools 100; meanwhile, the driving control of the driving device can be automatic control or manual control.
The two automatic feeding tools 100 are respectively used for providing soldering lugs and chips, and have various specific structural forms, specifically referring to fig. 1 to 7, in this embodiment, 2, the pump source chip mounter 1000 according to claim 1 is characterized in that two chip taking stations include a chip taking station, two mounting stations include a chip mounting station corresponding to the chip taking station, two automatic feeding tools 100 include a chip feeding tool 100a, the chip feeding tool 100a includes a base 11, a carrying structure 12, a plurality of magazine tools 13, a lifting member 14, a pneumatic gripper 16 and a falling member 15, the base 11 is disposed on the workbench 500, and the chip taking station is formed on the base 11; the carrying structure 12 is arranged on the base 11 corresponding to the chip taking station, the carrying structure 12 comprises a taking cavity 121a and a blanking cavity 121b which are respectively communicated upwards, the taking cavity 121a is provided with a taking space at an opening, and the blanking cavity 121b is provided with a blanking space at the opening; the plurality of material box jigs 13 are stacked up and down in the material taking cavity 121a, and the material box jigs 13 are used for placing chips; the jacking piece 14 is movably arranged on the base 11 along the up-down direction, and the jacking piece 14 can extend into the material taking cavity 121a and jack up the plurality of material box jigs 13 so as to jack up the material box jigs 13 at the upper end to the material taking space; the pneumatic gripper 16 is used for grabbing the material box jig 13 in the material taking space to the blanking space; the falling piece 15 is movably arranged on the base 11 along the up-down direction, and the falling piece 15 can extend into the blanking space of the blanking cavity 121b and load the magazine jig 13 downwards so as to empty the blanking space. In the technical solution provided in this embodiment, after the chips in the magazine tools 13 in the material taking space are picked up, the pneumatic gripper 16 is capable of gripping the magazine tools 13 onto the falling piece 15 in the material falling space, after that, the remaining plurality of stacked magazine tools 13 are lifted up by the lifting piece 14, so as to timely supplement the uppermost magazine tool 13 to the material taking space, ensure that the pickup part 331 of the corresponding automatic mounting mechanism 300 can pick up chips at a uniform height each time, so that the movement path of the pickup part 331 is shortest, that is, the pickup efficiency of the chips is ensured, and simultaneously, the downward falling of the falling piece 15 drives the magazine tools 13 in the material falling space to move downward, thereby emptying the material falling space, and further, the operation flow of reciprocating circulation ensures that the movement path of the pneumatic gripper 16 is shortest, and the pneumatic gripper 16 always has the highest gripping efficiency, that is ensured that the gripper 16 is in a fast state, that is, and the gripper 100a is further ensured; furthermore, by stacking a plurality of the magazine jigs 13, the space occupation requirement is reduced.
It should be noted that, the manner in which the pneumatic gripper 16 grips the magazine jig 13 may be various, and may be implemented by a slide rail 113 and a cylinder, or may be implemented by a mechanical arm, which is not limited in this embodiment; meanwhile, the lifting member 14 and the falling member 15 may be driven in various manners, which may be realized by a screw slider or a cylinder, and this embodiment is not limited thereto.
The mode that magazine tool 13 held the chip has multiple, can directly place the chip on magazine tool 13, also can put the chip magazine 131 that is equipped with the chip in the magazine tool 13, specifically in this embodiment, place chip magazine 131 on the magazine tool 13, chip magazine 131 is used for placing a plurality of chips, the upper cover of chip magazine 131 is equipped with chip lid 132, chip feeding frock 100a includes transverse movement module 17, transverse movement module 17 along fore-and-aft direction activity set up in base 11, wherein, pneumatic gripper 16 can along the activity set up in transverse movement module 17, blanking chamber 121a with blanking chamber 121b is along the below of transverse movement module 17, be provided with on the transverse movement module 17 and sweep a yard rifle 171, sweep yard rifle 171 and be used for reading and locate two-dimensional code on the chip lid, through will transverse movement module 17's activity direction set up with blanking chamber 121a and the realization of taking advantage of the realization of the fact that the realization is followed in order of taking advantage of the two-dimensional code of the realization of the chip and is traced back to the realization of carrying out the industrial code of the setting up and tracing the blanking chamber 121a with the recognition of the module 121b and the direction of the chip lid is guaranteed to take the data of the realization of the two-dimensional code of the inspection module 17.
In another embodiment, the chip magazine 131 is placed on the magazine jig 13, the chip magazine 131 is used for placing a plurality of chips, the chip magazine 131 upper cover is provided with a chip box cover 132, the chip feeding fixture 100a comprises a temporary storage seat 111, the temporary storage seat 111 is arranged on the base 11 and is movably arranged on one side of the front and rear directions of the carrying structure 12, wherein the pneumatic gripper 16 can be movably arranged on the transverse movement module 17 up and down, the material taking cavity 121a and the material taking cavity 121b are arranged below the transverse movement module 17 in the front and rear directions, the vacuum chuck 172 is arranged on the transverse movement module 17, the vacuum chuck 172 can move up and down, the vacuum chuck 172 is used for sucking the chip box cover 132, the chip feeding fixture 100a further comprises a temporary storage seat 111, the temporary storage seat 111 is arranged on the base 11, the movable direction of the transverse movement module 17 is arranged on one side of the front and rear directions of the carrying structure 12, the vacuum chuck 172 is driven to move in the same direction as the material taking cavity 121a and the blanking cavity 121b in the front and back direction of the die cover 17, and the vacuum chuck 172 is driven to move in the same direction as the front and back direction of the die cover 132, and the vacuum chuck 172 is driven to move in the vacuum chuck 132.
Because the chips in the magazine jig 13 need to be timely and manually replenished after the chips are completely taken, and the replenishing and the reloading are directly carried out at the working positions corresponding to the pneumatic paw 16, the jacking piece 14 and the falling piece 15, in the embodiment, a chip replenishing station is further formed on the base 11, the chip taking station is arranged corresponding to the jacking piece 14 and the falling piece 15, a rodless cylinder 112 and a sliding rail 113 are arranged on the base 11, the sliding rail 113 passes through the chip taking station and the chip replenishing station, a sliding seat 114 is arranged on the sliding rail 113, and the rodless cylinder 112 is used for driving the sliding seat 114 to switch between the chip taking station and the chip replenishing station; the carrying structure 12 comprises two carrying bins 121, the two carrying bins 121 are detachably arranged on the sliding seat 114 and are arranged along the front-back direction, and the material taking cavity 121aa and the blanking cavity 121bb are respectively formed on the two carrying bins 121. The rodless cylinder 112 drives the sliding seat 114 to switch between the chip material taking station and the chip material supplementing station, namely, the carrying structure 12 is switched between the chip material taking station and the chip material supplementing station, when all chips in the material box jig 13 are taken, the rodless cylinder 112 can be controlled to drive the carrying structure 12 to the chip material supplementing station, so that an operator can detach the two material carrying bins 121 to replace the new material carrying bins 121, and the efficient and safe carrying of the material supplementing process is ensured.
It should be noted that, the carrying bin 121 may be detachably disposed on the sliding base 114 in various forms, and may be connected by a buckle connection or a limiting structure, which is not limited in the embodiment of the present invention.
Referring to fig. 2 and 5, in the present embodiment, the carrying structure 12 includes two carrying bins 121 disposed along a front-rear direction, each carrying bin 121 includes a plurality of upwardly extending limiting posts 1211, and the plurality of limiting posts 1211 are disposed at intervals along a horizontal circumferential direction so as to form the material taking cavity 121a or the blanking cavity 121b. By arranging two identical material box jigs 13 with fully loaded chips and material box jigs 13 with fully consumed chips on the material carrying bins 121, the universality of the material carrying bins 121 is improved; meanwhile, since the material box jig 13 needs to move upwards or downwards in the material carrying bin 121, friction loss is inevitably generated between the material carrying bin 121 and the material carrying bin 121, and the friction loss between the material carrying bin 121 and the material box jig 13 can be reduced by arranging the material carrying bin 121 to be composed of a plurality of limiting columns 1211, the service lives of the material box jig 13 and the material carrying bin 121 are ensured, and the maintenance and replacement cost is reduced; furthermore, the magazine jig 13 is required to have a space for letting out when being grasped by the pneumatic gripper 16 from the side end surface, and a space for letting out is formed between the two adjacent limiting posts 1211, which is convenient for grasping operation of the pneumatic gripper 16.
In the embodiment, as shown in fig. 2 to fig. 4, two abdication through holes 121c respectively communicating the material taking cavity 121a and the material blanking cavity 121b are formed at the bottom of the carrying structure 12, and the two abdication through holes 121c are respectively used for allowing the corresponding lifting member 14 and the corresponding material blanking cavity 15 to pass through; the chip feeding tool 100a includes two longitudinal movement modules 18, the two longitudinal movement modules 18 are movably disposed on the base 11 along an up-down direction, and are respectively disposed below the two abdicating through holes 121c, and the lifting member 14 and the falling member 15 are respectively disposed on the two longitudinal movement modules 18. Through the giving way of the giving way through hole 121c, the two longitudinal movement modules 18 can drive the corresponding jacking piece 14 and the falling piece 15 to extend upwards into the material taking cavity 121a and the blanking cavity 121b, and the driving mode is direct, so that the jacking and falling driving of the material box jig 13 are accurate, the material taking space can be accurately filled by the single material box jig 13, and the blanking space can be accurately emptied.
It should be noted that the longitudinal movement module 18 may be connected to the base 11 through a screw slider mechanism, or may be connected to the base 11 through other various forms, which is not limited in the embodiment of the present invention.
The lifting member 14 and the falling member 15 may have various forms, and in this embodiment, a plurality of penetrating holes are formed in the base 11 corresponding to the two yielding holes 121c, respectively; the jacking piece 14 and the falling piece 15 each comprise a plurality of ejector rods, the lower ends of the ejector rods are connected to the longitudinal movement module 18, the upper ends of the ejector rods are correspondingly and adaptively penetrated through corresponding penetrating through holes, the penetrating through holes can effectively position the ejector rods, and the vertical movement direction of the ejector rods is accurate.
Referring to fig. 7, in the present embodiment, two abdication through holes 121c respectively communicating the material taking cavity 121a and the blanking cavity 121b are formed at the bottom of the carrying structure 12, and the two abdication through holes 121c are respectively used for the corresponding lifting member 14 and the corresponding falling member 15 to pass through; the chip feeding tool 100a comprises a first longitudinal movement module, a second longitudinal movement module and a detection assembly 19, wherein the first longitudinal movement module is arranged corresponding to the blanking cavity 121b, and is movably arranged on the base 11 along the up-down direction and below the corresponding yielding through hole 121c, and the falling piece 15 is arranged on the first longitudinal movement module; the second longitudinal movement module is arranged corresponding to the material taking cavity 121a, and is movably arranged on the base 11 along the up-down direction and below the corresponding yielding through hole 121c, and the jacking piece 14 is arranged on the second longitudinal movement module; the detecting assembly 19 includes a first sensor 191, a second sensor 192, a third sensor 193, a fourth sensor 194, a fifth sensor 195, and a controller disposed on the base 11, where the first sensor 191 is configured to detect the blanking space, the second sensor 192 is configured to detect the bottom of the blanking cavity 121b, the third sensor 193 is configured to detect the material taking space, the fourth sensor 194 is configured to detect the bottom of the material taking cavity 121a, the fifth sensor 195 is configured to detect the space below the material taking space, and the controller is electrically connected to the first sensor 191, the second sensor 192, the third sensor 193, the fourth sensor 194, the fifth sensor 195, the first longitudinal movement module, and the second longitudinal movement module. In this embodiment, whether the first sensor 191 detects that the first longitudinal movement module is in the blanking space or not, whether the second sensor 192 detects that the first longitudinal movement module is in the bottom of the blanking cavity 121b or not, and the first sensor 191 and the second sensor 192 are electrically connected to the controller to comprehensively reflect the current position condition of the first longitudinal movement module 13 in the blanking cavity 121b, so as to determine whether the first longitudinal movement module should be driven to act in a feedback manner, the whole process is accurate in regulation and control, the reaction is timely, and the emptying efficiency of the blanking space is greatly improved; meanwhile, whether the material box jig 13 exists in the material taking space can be detected by the third sensor 193, whether the material box jig 13 exists at the bottom of the material taking cavity 121a can be detected by the fourth sensor 194, whether the material box jig 13 exists in the lower side space of the material taking space can be detected by the fifth sensor 195, and then the third sensor 193, the fourth sensor 194 and the fifth sensor 195 are electrically connected to the controller so as to comprehensively reflect the current position condition of the material box jig 13 in the material taking cavity 121a, thereby judging whether the second longitudinal movement module is driven to act by feedback, the whole process is accurately adjusted, the reaction is timely, and the supplementing efficiency of the material taking space is greatly improved; through the real-time detection of each sensor, realize synchronous control first longitudinal movement module with the action of second longitudinal movement module, in order to control simultaneously jacking piece 14 with fall back piece 15 action, and then empty when in time replenishing magazine tool 13 to the material taking space the blanking space can accomplish the preparation work of picking up the chip next time in shorter time, has improved the material loading efficiency of chip.
Referring to fig. 1, in another embodiment, the two material taking stations further include a soldering lug material taking station, the two mounting stations include soldering lug mounting stations corresponding to the soldering lug material taking station, the automatic feeding tool 100 further includes a soldering lug feeding tool 100b, the soldering lug feeding tool 100b includes a feeding flyer, the soldering lug material taking station is formed at one end of a feeding adhesive tape of the feeding flyer, and a plurality of bonding pads are adhered on the feeding adhesive tape, and are simultaneously wound and arranged on a driving roller shaft and a driven roller shaft of the feeding flyer.
The automatic mounting mechanism 300 is mainly configured to pick up the part to be mounted at the corresponding material taking station to the mounting groove of the pump source sintering jig 200 at the corresponding material taking station, and has various structural forms, specifically, please refer to fig. 1 and 8 to 11, in this embodiment, each automatic mounting mechanism 300 includes a mounting seat 31, a driving device 32, a pick-up assembly 33, a first camera device 34 and a control device, the mounting seat 31 is movably disposed relative to the workbench 500, so that the part to be mounted can reach the corresponding material taking station and the corresponding mounting station on the movable stroke, the driving device 32 is installed on the workbench 500, the driving device 32 is in driving connection with the mounting seat 31, so as to drive the mounting seat 31 to move, the pick-up assembly 33 is installed on the mounting seat 31, and the pick-up assembly 33 includes a pick-up portion 331 mounted on the mounting seat 31 along an up axis, the pick-up portion 331 is used for electrically connecting the part to be mounted at the corresponding material taking station to the corresponding material taking station and the corresponding pick-up assembly 34 to the pick-up assembly 32, and the pick-up assembly 32 are electrically connected to the pick-up device 34 at the corresponding material taking station and the pick-up station to the pick-up station. In the technical solution of this embodiment, the driving device 32 drives the mounting base 31 to move between the corresponding material taking station and the corresponding mounting station of the workbench 500, the pick-up portion 331 picks up the to-be-mounted part placed at the material taking station to the corresponding mounting station, and when the pick-up portion 331 picks up and places the to-be-mounted part, the first image pickup device 34 performs visual identification to determine the accurate positions of the mounting grooves on the pump source sintering jig 200 of the corresponding material taking station and the corresponding mounting station, and then controls the mounting base 31 and the pick-up portion 331 to perform the pick-up and place actions according to the identification result. Compared with the manual placement mode, the automatic picking mode of the picking part 331 is controlled, the picking efficiency is high, the picking and placing accuracy is high and errors are not prone to being caused by the fact that the first photographing device 34 photographs and positions.
Further, in this embodiment, the first camera 34 is disposed above the chip taking station and the mounting station, so as to take a photograph from top to bottom; the automatic mounting mechanism 300 further includes a second image pickup device 35, the second image pickup device 35 is fixedly mounted on the workbench 500, the mounting seat 31 can move to the upper side of the second image pickup device 35 on the moving stroke, and the second image pickup device 35 is used for photographing from bottom to top. In this embodiment, the first camera device 34 includes a first camera and a first illumination lamp, where the first camera extends along an up-down direction and is disposed on one side of the pickup assembly 33, the first illumination lamp is disposed on a lower side of the first camera for downward illumination, and a camera bracket is disposed on the mounting base 31 for fixing the first camera and the first illumination lamp. When picking up a part to be mounted, the first camera device 34 is controlled to move to a position right above the material taking station, photographing is performed by the first camera, the accurate position of the part to be mounted on the material taking station and whether dirt exists on the upper surface of the part to be mounted are determined by illumination of the first illumination lamp, then the mounting seat 31 is controlled to move so that the pick-up part 331 moves to the position of the part to be mounted for picking up, and if no dirt exists, the subsequent mounting action is continued; the first camera device 34 is further configured to capture the pump source sintering jig 200, an identification code is provided on the upper surface of the pump source sintering jig 200, and the identification code is identified by the first camera device 34 to determine the model of the pump source sintering jig 200, thereby determining the specific positions of a plurality of mounting slots of the pump source sintering jig 200; the second camera device 35 includes a second camera and a second illumination lamp, the second camera extends along the up-down direction and is fixedly mounted on one side of the workbench 500, and the second illumination lamp is disposed on the upper side of the second camera to illuminate upwards. After the pick-up portion 331 picks up the part to be mounted, it is controlled to move to the position right above the second camera to take a picture, so as to determine the geometric center deviation between the part to be mounted and the pick-up portion 331 and whether the lower surface of the part to be mounted is dirty, if not, the displacement of the pick-up portion 331 moving to the mounting station is calculated according to the geometric deviation, and the part to be mounted is mounted in the mounting groove corresponding to the pump source sintering jig 200.
In another embodiment, the two automatic feeding tools 100 include a soldering lug feeding tool 100b, and a material taking station of the soldering lug feeding tool 100b is used for providing soldering lugs; the two automatic mounting mechanisms 300 include a soldering lug mounting mechanism, which is disposed corresponding to the soldering lug feeding tool 100b, and further includes a waste bucket 38, where the waste bucket 38 is used for placing a dirty soldering lug. Because the soldering lug is a consumable part, the use cost is low, and when dirt is found on the soldering lug, the pick-up part 331 is directly controlled to discard the soldering lug into the waste barrel 38, so that the mounting efficiency of the soldering lug is guaranteed.
The pick-up portion 331 may have various structural forms for picking up the parts to be mounted, and may be a gripping form or a grabbing form, and specifically, in this embodiment, a suction nozzle 3311 is disposed at a lower end of the pick-up portion 331, and the suction nozzle 3311 is used for picking up the parts to be mounted. The suction nozzle 3311 is connected to a vacuum apparatus, vacuum is generated by the vacuum apparatus, the pick-up portion 331 is abutted against the upper surface of the component to be mounted when picking up the component to be mounted, and suction is performed by the suction nozzle 3311 to generate negative pressure to pick up the component to be mounted. The mounting seat 31 is further provided with a third image pickup device 36, the third image pickup device 36 is used for photographing the suction nozzle 3311, the third image pickup device 36 is fixedly installed at one side of the pickup portion 331 and is in a normally open state, and is used for photographing the suction nozzle 3311 to pick up a part to be mounted and a process of mounting the part to be mounted, and if an abnormality occurs, recording and analyzing reasons of the abnormality are facilitated. The device can be subsequently improved according to the analysis result to improve accuracy and efficiency.
In this embodiment, the pickup assembly 33 includes a driving motor 332, and the driving motor 332 is fixedly mounted on the mounting base 31 and is drivingly connected to the pickup 331 so as to rotate the pickup 331 about an axis extending in the up-down direction. Specifically, the driving motor 332 is disposed on the upper side of the pick-up portion 331, and the driving motor 332 is connected to the pick-up portion 331 through a coupling, so as to drive the pick-up portion 331 to rotate around an R axis extending in the vertical direction, so as to adjust the position angle of the component to be mounted.
Specifically, the driving motor 332 may be a servo motor.
The driving device 32 is configured to drive the mounting base 31 to move between the material taking station and the mounting station, and has various structural forms, in this embodiment, the driving device 32 is specifically a three-axis platform, and includes an X-axis linear motion module 321, a Y-axis linear motion module 322, and a Z-axis linear motion module 323, where the Y-axis linear motion module 322 is in driving connection with the X-axis linear motion module 321, so as to drive the X-axis linear motion module 321 to perform linear motion along the Y-axis; the X-axis linear motion module 321 is in driving connection with the Z-axis linear motion module 323 to drive the Z-axis linear motion module 323 to do linear motion along the X axis; the Z-axis linear motion module 323 is in driving connection with the mounting seat 31, so as to drive the mounting seat 31 to perform linear motion along the Z-axis; so as to realize the movement of the mounting seat 31 along the X axis, the Y axis and the Z axis according to the photographing and calculating results of the first photographing device 34 and the second photographing device 35. It is understood that the X-axis, Y-axis and Z-axis are perpendicular to each other.
In other embodiments, the triaxial platform may also be a triaxial linear motion mechanism driven by a screw rod sliding rail 113, and the structure is a technical means commonly used in the prior art, which will not be described herein.
Referring to fig. 12 to 18, in the present embodiment, the pump source sintering fixture 200 includes a pump source base 21 and a positioning fixture 22, the pump source base is disposed on the vacuum suction base 41, the mounting groove is formed in the pump source base 21, a plurality of chip bonding sites are disposed at the bottom of the mounting groove, the positioning fixture 22 is disposed in the mounting groove and covers the bottom of the mounting groove, the positioning fixture 22 is provided with a plurality of positioning grooves 221 penetrating along the vertical direction, and a plurality of positioning grooves 221 are disposed corresponding to a plurality of chip bonding sites, wherein at least one positioning post 23 is disposed on the positioning fixture 22, and edges of the upper ends of the positioning posts 23 are in chamfer arrangement. By arranging the positioning jig 22 and arranging a plurality of positioning grooves 221 corresponding to a plurality of chip attaching positions on the positioning jig 22, soldering lugs and chips are sequentially and correspondingly attached in the positioning grooves 221 during attaching, so that positioning effect on the soldering lugs and the chips is realized, and therefore, the boundary of the positioning grooves 221 is required to be identified during attaching. In the present invention, by arranging two positioning columns 23 on the positioning jig 22, the upper end edges of the two positioning columns 23 are arranged in a chamfer manner, so that the visual recognition device can recognize the outlines of the two positioning columns 23, by recognizing the positions of the two positioning columns 23, and by establishing a rectangular coordinate system with the two positioning columns 23 as a reference, the positions of the preset plurality of positioning grooves 221 can be obtained with the obtained rectangular coordinate system as a reference. Compared with the traditional method for directly photographing and identifying the outline of the positioning groove 221, the positioning groove 221 is easy to cause blurring of edges and can not be identified because of long-term use, and the visual identification device only identifies the positioning post 23 by inputting the position of the corresponding positioning groove 221 into the system in advance, so that the identification speed is high, clear and accurate.
Referring to fig. 14 to 15, when photographing by the visual recognition device, the light is generally emitted by a flash lamp, and the light is reflected back to the visual recognition device to be recognized by contacting the surface of the object. The upper end face of the positioning column 23 is smooth, the upper end edge of the positioning column 23 is chamfered, the upper end face of the positioning column 23 reflects light when photographing, and the upper end edge of the positioning column 23 reflects light to the periphery and is not received by the visual recognition equipment, so that a dark ring-shaped outline is formed, and the visual recognition equipment can receive and recognize the light conveniently.
It should be noted that, the bottom of the mounting groove is generally in an inclined step-like arrangement, and a plurality of chip attaching positions are correspondingly arranged on each step protrusion, so that when the visual identification device identifies the positioning jig 22, in order to ensure the visual accuracy and the mounting convenience, the upper surface of the positioning jig 22 is required to be ensured to be perpendicular to the shooting angle of the visual identification device, and therefore, the lower surface of the positioning jig 22 is in a step-like arrangement corresponding to the bottom of the mounting groove.
It should be further noted that, the outline of the positioning groove 221 is set according to the chip shape, and the specific shape is not limited herein, and in this embodiment, the positioning groove 221 is set in a rectangular shape.
In a specific embodiment of the present invention, two positioning columns 23 are provided, two positioning holes are provided on the upper surface of the positioning jig 22, and pins are provided at the lower ends of the two positioning columns 23, so that the two positioning columns 23 are respectively inserted into the two positioning holes correspondingly. Each of the pins is in interference fit with the corresponding positioning hole, so that the two positioning posts 23 are fixedly installed in the two positioning holes. Wherein, each reference column 23 can be dismantled and assembled and set up to prevent for a long time use reference column 23 wearing and tearing warp, influence the discernment of shooing, change only need with corresponding reference column 23 pull out, change new reference column 23 can, change simple with low costs, the durability is strong.
The shape of the two positioning posts 23 is not limited in the technical scheme of the present invention, and may be a square post, a diamond post or a circular post, and in this embodiment, the two positioning posts 23 are both circular posts, which is convenient for production and simple for identification. The visual recognition device shoots two movable circular patterns, realizes positioning by recognizing circle centers of the two circular patterns, takes the connecting line direction of the two circle centers as an X axis, takes one of the two circle centers as an origin, establishes a Y axis which passes through the origin and is perpendicular to the X axis, and forms a rectangular coordinate system by fitting.
It can be understood that the selection of the origin, the positive direction of the X axis and the positive direction of the Y axis are selectable, and the rectangular coordinate system established after each photographing identification is ensured to be the same by presetting in advance.
In the technical solution of the present invention, the pump source is generally provided with multiple types, the corresponding pump source sintering jig 200 has multiple types, the positioning jig 22 is provided with multiple types, and the positions of the positioning grooves 221 and the positions of the positioning posts 23 of the positioning jigs 22 with different types are different, so that the type of the pump source sintering jig 200 needs to be identified before the positioning posts 23 are identified and chip mounting is performed. However, when the pump source sintering jig 200 is sintered in a vacuum sintering furnace, the positioning groove 221 may not only be blurred in edge due to long-term use, but also be deformed or melted due to high temperature in the conventional code recognition or two-dimensional code recognition, which results in no recognition after several uses, high cost and influence on production efficiency.
Referring to fig. 12 and 13, in the present embodiment, a plurality of encoding holes 222 are formed on the upper surface of the positioning jig 22, and the pump source sintering jig 200 further includes a plurality of encoding pins 24; wherein a different number of the code pins 24 may be selected for insertion into a plurality of the code holes 222 in a different arrangement to form a plurality of visually identifiable code combinations. The plurality of coding holes 222 are arranged in an array on the upper surface of the positioning jig 22, the upper end edges of the plurality of coding pins 24 are arranged in a beveling way, when the model of the positioning jig 22 is identified, the array areas of the plurality of coding holes 222 are photographed, and whether the coding pins 24 are inserted into the coding holes 222 is determined by identifying the coding pins 24 so as to obtain different graphic coding information; or the output signal of the code pin 24 is identified in the corresponding code hole 222 by a preset visual identification device, and the output model of the code pin 24 is not identified in the corresponding code hole 222, so as to obtain the code information of different binary number sequences.
It will be appreciated that each of the coding pins 24 is an interference fit with each of the corresponding coding holes 222 such that each of the coding pins 24 is fixedly mounted in the corresponding coding hole 222. The number of the code holes 222 is not limited herein, and the maximum number of the code pins 24 corresponds to the number of the code holes 222, and various combinations of visual identification codes can be formed by selecting different numbers of the code pins 24 to be arranged and combined in a plurality of the code holes 222. In the technical solution of the present invention, the number of the encoding holes 222 is at least two, in order to satisfy the positioning jigs 22 with more types, in this embodiment, the number of the encoding holes 222 is a number, and the encoding holes 222 are arranged in a nine-grid shape, if the positioning jigs 22 with more types need to be satisfied, more encoding holes 222 may be arranged, which should be all within the protection scope of the technical solution of the present invention.
Wherein, each coding pin 24 is detachably arranged to prevent the long-time use of the coding pin 24 from wearing and deforming, influencing the photographing identification, and the replacement only needs to pull out the corresponding coding pin 24 and replace the new coding pin 24, thus the replacement is simple, the cost is low, and the durability is strong.
In the embodiment of the present invention, the upper surface of the pump source base 21 is provided with a plurality of first mounting holes, and the positioning jig 22 is provided with a plurality of second mounting holes corresponding to the plurality of first mounting holes; the pump source sintering jig 200 further includes a plurality of mounting pins 25, and the plurality of mounting pins 25 correspondingly penetrate through the plurality of second mounting holes to be inserted into the plurality of first mounting holes. Each positioning jig 22 is fixedly mounted on the pump source base 21 through the mounting pin 25, and in order to ensure the mounting stability, each mounting pin 25 is in interference fit with the corresponding first mounting hole and the corresponding second mounting hole.
Because the pump source sintering jig 200 rotates to another mounting station after the mounting at the mounting station is completed, the corresponding automatic mounting mechanism 300 for mounting soldering lugs first may be in an idle state, resulting in waste of mechanism productivity resources, and in this embodiment, three vacuum suction seats 41 are provided, and three vacuum suction seats 41 are arranged at intervals along the circumferential direction of the turntable 400, so as to respectively correspond to the sintering tray mounting station and two mounting stations. By arranging the three vacuum suction seats 41, three pump source sintering jigs 200 can be simultaneously carried, so that two automatic mounting mechanisms 300 in each mounting time period are ensured to be in a working state, and the mounting efficiency of the pump source sintering jigs 200 is greatly improved.
The driving device has various structural forms, specifically, in this embodiment, the driving device includes a DD motor, the motor of the DD motor is seated on the workbench 500, an output shaft of the DD motor rotates along an up-down axis, and the turntable 400 is connected to the output shaft. Because the DD motor has better driving stability, the DD motor is adopted for driving, the turntable 400 can be stably driven to rotate, so that the pumping source sintering jig 200 can accurately reach the corresponding mounting station, namely the quality of the mounting is ensured.
The pump source surface mounting control method provided by the invention is used for the pump source surface mounting machine 1000, wherein two automatic feeding tools 100 comprise a chip feeding tool 100a and a soldering lug feeding tool 100b, two chip taking stations comprise a soldering lug taking station and a chip taking station, two automatic mounting mechanisms 300 comprise a soldering lug mounting mechanism and a chip mounting mechanism, and two mounting stations comprise a soldering lug mounting station and a chip mounting station;
referring to fig. 19, the pump source patch control method includes the following steps:
s10, after the pump source sintering jig 200 is positioned and placed on the vacuum suction seat 41 at the sintering disc loading and unloading station, a target mounting position of a chip bonding position in the mounting groove is obtained;
S20, after the pump source sintering jig 200 moves from the sintering disc loading station to the soldering lug attaching station, controlling the soldering lug feeding tool 100b to act so as to supplement soldering lugs to the soldering lug taking station;
s30, controlling the action of the soldering lug attaching mechanism according to the target attaching position so as to pick up soldering lugs on the soldering lug taking station to the chip attaching position of the attaching groove;
s40, after the pump source sintering jig 200 moves from the soldering lug mounting station to the chip mounting station, controlling the chip feeding tool 100a to act so as to supplement chips to the chip taking station;
s50, controlling the chip mounting mechanism to act according to the target mounting position so as to pick up the chips on the chip taking station to the soldering lug positioned at the chip mounting position.
In the technical scheme provided by this embodiment, firstly, the pump source sintering jig 200 is positioned and placed in the vacuum suction seat 41 at the sintering tray mounting and taking station by manpower, then the driving device is controlled to act so as to rotate the pump source sintering jig 200 to the soldering lug mounting station, meanwhile, the soldering lug taking station is already supplemented with a soldering lug, then the soldering lug mounting mechanism is controlled to act so as to pick up the soldering lug to the chip mounting position in the mounting groove corresponding to the pump source sintering jig 200 at the soldering lug mounting station, thereby completing the mounting of the soldering lug, then the driving device is controlled to act so as to rotate the pump source sintering jig 200 to the chip mounting station, meanwhile, the chip mounting mechanism is controlled to act so as to pick up the chip to the chip mounting position in the mounting groove corresponding to the pump source sintering jig 200 at the chip mounting station, so as to stack the soldering lug to the chip mounting position at the chip mounting station, and finally, the pump source sintering jig 200 is controlled to rotate again, thereby completing the chip mounting and the chip mounting process is completed, and the manual mounting is completed, and the quality is reduced. It should be noted that, each mounting groove is provided with a die attaching position for attaching a die, the target attaching position is fixed relative to the coordinate position of the pump source sintering jig 200, the target attaching position is obtained by shooting the pump source sintering jig 200 through the fourth camera device 37 arranged at the sintering disc mounting and taking station, and meanwhile, the pump source sintering jig 200 rotates to the soldering lug mounting station or the coordinate position of the die mounting station is fixed, so when the pump source sintering jig 200 is located at the soldering lug mounting station or the die mounting station, the soldering lug mounting mechanism and the die attaching structure can act according to the target attaching position, so that the soldering lug and the die can be picked up to the die attaching position successively.
Specifically, in this embodiment, the chip feeding tool 100a includes a base 11, a carrying structure 12, a plurality of material box tools 13, a lifting member 14, a dropping member 15, a first longitudinal movement module and a second longitudinal movement module, where the base 11 is disposed on the workbench 500, the chip feeding station is formed on the base 11, the carrying structure 12 is disposed on the base 11 corresponding to the chip feeding station, the carrying structure 12 includes a feeding cavity 121a and a blanking cavity 121b that respectively penetrate upwards, the feeding cavity 121a has a feeding space at an opening, the blanking cavity 121b has a blanking space at an opening, the plurality of material box tools 13 are stacked up and down in the feeding cavity 121a, the material box tools 13 are used for placing chips, the first longitudinal movement module is movably disposed on the base 11 in an up-down direction, the dropping member 15 is disposed on the first longitudinal movement module, the blanking member 15 can extend into the feeding cavity 121a and can extend down to the second longitudinal movement module 14 in the lifting member 13 in an up-down direction, and the second longitudinal movement module is capable of moving up-down in the lifting member 121a lifting member 14;
The step S20 of controlling the chip feeding fixture 100a to act so as to supplement chips to the chip taking station specifically includes the following steps:
s24, respectively acquiring a second shielding signal of a second position of the chip taking station and a fifth shielding signal of a fifth position of the chip taking station;
s25, when the second shielding signal is non-shielding and the fifth shielding signal is shielding, respectively acquiring a first shielding signal of the first position of the chip taking station and a third shielding signal of the third position of the chip taking station;
s26, when the first shielding signal is shielded and the third shielding signal is not shielded, controlling the first longitudinal movement module and the second longitudinal movement module to act so as to drive the falling piece 15 downwards by one unit height and drive the jacking piece 14 upwards by one unit height at the same time, so as to empty the blanking space and supplement chips to the taking space at the chip taking station.
It should be noted that the first position corresponds to a position where the blanking space is located; the second position corresponds to the position where the bottom of the blanking cavity 121bb is located; the third position corresponds to the position of the material taking space; the fifth position corresponds to the position of the lower side space of the material taking space;
When the first shielding signal is shielded and the third shielding signal is not shielded, it means that the cartridge jig 13 after coring is picked up to the blanking space, and at this time, the first longitudinal movement module and the second longitudinal movement module are controlled to act so as to drive the lifting member 14 upwards by one unit height, and simultaneously drive the falling member 15 downwards by one unit height, so as to supplement the non-cored cartridge jig 13 in the material taking space, and simultaneously vacate the blanking space to prepare for coring and transferring the cartridge jig 13 by the chip mounting mechanism next time. It should be understood that the unit height is the thickness of the cartridge jig 13.
When the second shielding signal is not shielded and the fifth shielding signal is shielded, it means that the falling back member 15 does not completely fall back to the lowest end position of the blanking cavity 121b, the empty magazine jig 13 can still be stacked and loaded in the blanking cavity 121bb, at least one magazine jig 13 corresponding to the fifth position is still present in the material taking cavity 121aa, and the full magazine jig 13 can still be provided in the material taking cavity 121 aa.
It should be noted that, in order to reduce the number of times of manually supplementing chips to the feeding cavity, each time of supplementing the feeding cavity is needed to supplement the chips, so that the second shielding signal is shielded, and the two conditions that the fifth shielding signal is not shielded can be satisfied simultaneously.
More specifically, in this embodiment, the chip feeding tool 100a further includes a lateral movement module 17, where the lateral movement module 17 is movably disposed on the base 11 along a front-back direction so as to reach above the material taking space and the material blanking space, and a pneumatic gripper 16 capable of moving up and down is disposed on the lateral movement module 17, and the pneumatic gripper 16 is used to grasp the material taking box tool 13;
the two automatic mounting mechanisms 300 include a chip mounting mechanism including a pick-up portion 331 for sucking a transfer chip;
after the step S26 of controlling the first longitudinal movement module and the second longitudinal movement module to move so as to drive the falling member 15 downward by one unit height and simultaneously drive the lifting member 14 upward by one unit height, so as to empty the blanking space and supplement chips to the material taking space at the chip material taking station, the method further includes:
S27, after the pick-up part 331 absorbs all chips in the material box jig 13 at the top end, controlling the transverse movement module 17 and the pneumatic gripper 16 to act so as to grasp the material box jig 13 in the material taking space to the blanking space;
s28, respectively acquiring a second shielding signal of a second position of the chip taking station and a fifth shielding signal of a fifth position of the chip taking station;
s29a, when the second shielding signal is not shielded and the fifth shielding signal is shielded, repeating the steps S25-S28;
and S29b, when the second shielding signal is shielded and the fifth shielding signal is not shielded, controlling the first longitudinal movement module and the second longitudinal movement module to act so as to drive the jacking piece 14 to an initial jacking position and drive the falling piece 15 to an initial falling position.
In the technical scheme provided by the embodiment, the empty magazine jig 13 is transferred from the material taking space to the blanking space by adopting the transverse movement module 17 and the pneumatic gripper 16; when the second shielding signal is not shielded and the fifth shielding signal is shielded, it means that the chip feeding tool 100a can still provide the fully loaded magazine tool 13; after the pick-up 331 has completely sucked chips in the material box jig 13 at the top end, the lateral movement module 17 and the pneumatic gripper 16 are controlled to act, so that after the material box jig 13 at the material taking space is grabbed to the material falling space, when the second shielding signal is shielded, the fifth shielding signal is not shielded, which means that the falling piece 15 completely falls back to the lowest end position of the material falling cavity 121b, the material falling cavity 121b fully loads the material box jig 13, the material taking cavity 121a is emptied, at this time, the first longitudinal movement module and the second longitudinal movement module are controlled to act, so that the jacking piece 14 is driven to an initial jacking position, the falling piece 15 is driven to an initial falling position, and as a result, the initial jacking position is a position lower than the material taking cavity 121a, and the initial falling position is a position lower than the material falling cavity 121b, so that the material taking cavity 121a can be conveniently refilled manually.
After the refilling of the material taking cavity 121a, the lifting member 14 and the falling member 15 need to be driven to move to the standby working position again, specifically, in this embodiment, before the step S24 of acquiring the second shielding signal of the second position of the chip material taking station and the fifth shielding signal of the fifth position of the chip material taking station, the method further includes:
s22, respectively acquiring a second shielding signal of the second position and a fourth shielding signal of the fourth position of the material taking station;
s23, when the fourth shielding signal is shielded and the second shielding signal is not shielded, controlling the first longitudinal movement module and the second longitudinal movement module to act so as to drive the jacking piece 14 from the initial jacking position to the fourth position and drive the falling piece 15 from the initial falling position to the first position.
It should be noted that, the chip taking station further includes a fourth position, where the fourth position corresponds to a position where the bottom of the taking cavity 121a is located, when the fourth shielding signal is shielded, and the second shielding signal is not shielded, which means that the blanking cavity 121b is empty, the taking cavity 121a is fully loaded with the magazine jig 13, at this time, the lifting member 14 should be driven from the initial lifting position to the fourth position so as to be in abutment with the magazine jig 13, and the falling member 15 is driven from the initial falling position to the first position so as to prepare for receiving the magazine jig 13 after coring, so that it is ensured that after the pneumatic gripper 16 grabs the magazine jig 13 located in the taking cavity 121a to the blanking cavity 121b, the lifting member 14 and the falling member 15 can be lifted and lowered at the fastest speed respectively so as to supplement the taking cavity 121a and the blanking cavity 121b; in order to reduce the feeding frequency as much as possible, the feeding chamber 121a is filled up each time the feeding chamber 121a is fed manually.
Further, in this embodiment, a rodless cylinder 112 is disposed on the base 11 of the chip feeding tool 100a, a chip feeding station is further formed on the base 11, and the rodless cylinder 112 is used to drive the carrying structure 12 to switch between the chip feeding station and the chip taking station;
before the step S22 of obtaining the second shielding signal at the second position and the fourth shielding signal at the fourth position of the chip taking station, the method further includes the following steps:
s21, acquiring a feeding instruction, and controlling the action of the rodless cylinder 112 to drive the carrying structure 12 from the chip feeding station to the chip taking station;
after the step S29b of controlling the first longitudinal movement module and the second longitudinal movement module to act so as to drive the lifting member 14 to the initial lifting position and drive the falling member 15 to the initial falling position, the method further includes the following steps:
and acquiring a feeding instruction, and controlling the action of the rodless cylinder 112 to drive the carrying structure 12 from the chip material taking station to the chip feeding station.
In the technical solution provided in this embodiment, when the carrying structure 12 is located at the chip feeding station, an operator can conveniently feed the carrying structure 12, and after the feeding is completed, the carrying structure 12 is driven by the rodless cylinder 112 to the chip material taking station to perform subsequent material taking; when the chips in the feeding box jig 13 of the carrying structure 12 are completely taken out, the rodless cylinder 112 drives the carrying structure 12 to reset to the chip feeding station, the feeding process is convenient and efficient, meanwhile, the carrying structure 12 can be accurately driven to be switched between the chip taking station and the chip feeding station through the rodless cylinder 112, and the position positioning is accurate.
The shielding signals can be acquired in various modes, namely contact type or non-contact type, specifically, the first shielding signal is acquired through a first sensor 191, the second shielding signal is acquired through a second sensor 192, the third shielding signal is acquired through a third sensor 193, the fourth shielding signal is acquired through a fourth sensor 194, and the fifth shielding signal is acquired through a fifth sensor 195.
In another embodiment, the lateral movement module 17 is further provided with a vacuum chuck 172 capable of moving up and down, the cartridge jig 13 is provided with a chip cartridge 131, the chip cartridge 131 is covered with a chip cartridge cover 132, and the base 11 is provided with a temporary storage seat 111;
after the chip suction nozzle 3311 sucks all the chips in the material box jig 13 at the top end, the step of controlling the lateral movement module 17 and the pneumatic gripper 16 to grasp the material box jig 13 in the material taking space to the material blanking space further comprises the following steps:
acquiring a shielding signal of the third position;
when the shielding signal at the third position is shielded, the lateral movement module 17 and the vacuum chuck 172 are controlled to act so as to suck the die set cover 132 in the material taking space onto the temporary storage seat 111;
After the chip suction nozzle 3311 sucks all the chips in the material box jig 13 at the top end, the step of controlling the lateral movement module 17 and the pneumatic gripper 16 to grasp the material box jig 13 in the material taking space to the material blanking space further includes the following steps:
after the chip suction nozzles 3311 suck all chips in the material box jig 13 at the top end, the lateral movement module 17 and the vacuum chuck 172 are controlled to act so as to suck the chip box cover 132 from the temporary storage seat 111 to the chip material box 131 in the material taking space;
the lateral movement module 17 and the pneumatic gripper 16 are controlled to move so as to grasp the magazine jig 13 in the material taking space to the material blanking space.
In the technical solution provided in this embodiment, for the chip material box 131 with the chip box cover 132, the chip box cover 132 is firstly taken onto the temporary storage seat 111 through the actions of the lateral movement module 17 and the vacuum chuck 172, so as to facilitate the subsequent external coring operation of the chip suction nozzle 3311; after coring, the chip box cover 132 is retrieved and covered onto the chip box 131 by the temporary storage seat 111 through the actions of the transverse movement module 17 and the vacuum chuck 172, and then the chip box 131 is grabbed by the pneumatic gripper 16, so that the whole process is accurate in action, clear in logic and effective in coping with the uncapping and coring operation of the chip box 131.
Further, in this embodiment, the code scanning gun 171 is disposed on the lateral movement module 17, and when the shielding signal at the third position is shielded;
before the step of controlling the lateral movement module 17 and the vacuum chuck 172 to suck the die set cover 132 in the material taking space onto the temporary storage base 111, the method further comprises the following steps:
the transverse movement module 17 is controlled to act so as to acquire the two-dimensional code information parameters on the chip box cover 132 through the code scanning gun 171.
In the technical solution provided in this embodiment, the two-dimensional code information parameters of the chip box cover 132 are obtained before the cover is taken, so that each box chip can be ensured to be detected, and the data management of industrial production is realized, so that the product can be traced.
In this embodiment, the chip mounter includes a mounting base 31 and a pick-up assembly 33, the mounting base 31 is movably disposed relative to the workbench 500 so that the chip mounter can reach the chip picking station and the corresponding chip mounter station on a moving stroke, the pick-up assembly 33 is mounted on the mounting base 31, and the pick-up assembly 33 includes a pick-up portion 331 rotatably mounted on the mounting base 31 along an up-down axis, the pick-up portion 331 is configured to pick up a chip placed on the chip picking station to the chip mounter station;
The step S50 of controlling the chip mounting mechanism to act according to the target mounting position to pick up the chip on the chip taking station to the soldering lug in the mounting groove specifically includes the following steps:
s51, acquiring a position to be picked up of the chip on the chip taking station;
s52, controlling the pick-up part 331 to move to the position to be picked up so as to pick up the chip;
and S54, controlling the pick-up part 331 to move to the target mounting position so as to mount the chip on the chip mounting position.
In the technical solution provided in this embodiment, the first image pickup device 34 is controlled to capture the chip taking station to determine a position to be picked up of the chip, the driving device 32 is controlled to drive the pick-up portion 331 to move to the position to be picked up according to the position information of the position to be picked up, and the suction nozzle 3311 of the pick-up portion 331 is controlled to be communicated with vacuum so as to absorb and pick up the chip; and then controlling the pick-up part 331 to move to the target mounting position, mounting the chip on the chip mounting position, controlling the suction nozzle 3311 to be disconnected from vacuum, completing one mounting, returning to the chip taking station, repeating the steps, and continuing the next mounting.
In this embodiment, the chip has opposite front and back sides;
the step S51 of obtaining the position to be picked up of the chip on the chip taking station specifically includes:
s511, acquiring first image information parameters of the front surface of the chip, wherein the first image information parameters comprise first position parameters;
s512, the step of controlling the pick-up 331 to move to the position to be picked up to pick up the chip includes:
s513, acquiring a second position parameter of the pick-up part 331;
s514, calculating a first position deviation parameter according to the first position parameter and the second position parameter;
and S515, controlling the pick-up part 331 to move according to the first position deviation parameter so that the position parameter after the pick-up part 331 moves coincides with the first position parameter.
In the technical solution provided in this embodiment, the first position parameter is specifically a coordinate position of a geometric center of the chip, the second position parameter is specifically a coordinate position of a geometric center of the suction nozzle 3311, and the first position deviation parameter of the first position parameter and the second position parameter is calculated by the control device, so as to instruct the driving device 32 to drive the X-axis linear motion module 321, the Y-axis linear motion module 322, the Z-axis linear motion module 323, and the driving motor 332 according to the first deviation parameter, so as to drive the suction nozzle 3311 of the pickup portion 331 to move to the geometric center of the upper surface of the chip to coincide, and control the driving motor 332 to drive the suction nozzle 3311 to rotate along the R-axis to adjust the pickup angle.
In the technical solution of the present invention, an XYZ three-axis coordinate system is established based on the X-axis linear motion module 321, the Y-axis linear motion module 322, and the Z-axis linear motion module 323, and in the embodiment of the present invention, an X-axis, a Y-axis, or a Z-axis may be used as an up-down direction, which is not limited herein; in this embodiment, the Z axis is taken as the up-down direction, and the subsequent embodiments take the Z axis as the up-down direction as the reference.
In this embodiment, the first image information parameter further includes a chip ID information parameter, and the step S513 of obtaining the second position parameter of the pick-up 331 specifically includes:
s513a, when the chip ID information parameter is correctly matched with the chip and an MES system, acquiring a second position parameter of the pick-up part 331;
after the step S511 of acquiring the first image information parameter of the front surface of the chip, the method further includes:
and S513b, when the chip ID information parameter is incorrectly matched with the MES system, controlling the automatic mounting mechanism 300 to stop and controlling an alarm device to send an alarm prompt.
Since the chip ID information parameters and the performances of the chips are different from one chip to another, the chips must be mounted in the order set when the chips are mounted in the mounting grooves of the pump source sintering jig 200. When the chips are mounted in sequence, the first camera 34 is required to identify the chip ID information parameters corresponding to the chips, and compare the chip ID information parameters with an MES system, and if the matching is correct, the second position parameters of the pick-up 331 are acquired for picking up; if the chip DI information parameter corresponding to the chip is incorrectly matched with the MES system, the automatic mounting mechanism 300 is controlled to stop, and an alarm prompt is sent out to wait for manual intervention, so that the influence on the quality of the finished product of the pump source caused by the chip mismounting is avoided.
In this embodiment, the step S54 of controlling the pick-up portion 331 to move to the target mounting position to mount the chip on the chip mounting position further includes:
s531, acquiring second image information parameters of the back surface of the chip, wherein the second image information parameters comprise third position parameters;
s532, acquiring a fourth position parameter of the pick-up part 331;
s533, calculating a second position deviation parameter according to the third position parameter and the fourth position parameter;
the step S54 of controlling the pick-up 331 to move to the target mounting position to mount the chip on the chip mounting position includes:
s541, calculating a third position deviation parameter according to the fourth position parameter and the parameter of the target mounting position;
s542, determining a final position deviation parameter according to the second position deviation parameter and the third position deviation parameter;
s543, controlling the pick-up part 331 to move to the target mounting position according to the final position deviation parameter.
In the technical solution provided in this embodiment, in order to improve the accuracy of chip mounting, after the pick-up 331 picks up the chip, before the chip mounting position is mounted, the chip is driven to move to a position right above the second image capturing device 35, and a third position parameter of a back surface of the chip is obtained by the second image capturing device 35, specifically, the third position parameter is a position coordinate of a geometric center of the chip at the moment, and then the fourth position parameter information of the pick-up 331 is obtained, specifically, the fourth position parameter information is a position coordinate of the geometric center of the suction nozzle 3311 at the moment; the control device calculates the second position deviation parameter according to the third parameter position information and the fourth position parameter information so as to guide the pick-up part 331 to calibrate the accurate position of the chip.
Meanwhile, the third position deviation parameter is calculated according to the fourth position parameter of the pick-up 331 and the parameter of the target mounting position, the final position deviation parameter is determined according to the second position deviation parameter and the third position deviation parameter, then the pick-up 331 is known to move to the target mounting position according to the final position deviation parameter, and the chip is accurately mounted in the corresponding mounting groove of the pump source sintering jig 200.
It should be noted that, to reduce the calculation amount, the fourth position parameter is generally a fixed value, and specific coordinate parameters of the pickup portion 331 moving to the position above the second image capturing device 35 are set in advance to ensure that the pickup portion 331 moves to the same position each time, where the specific coordinate parameters include information of the X axis, the Y axis, the Z axis, and the R axis of the suction nozzle 3311. In addition, the chip is generally rectangular in shape, the cross-section of the mounting groove of the pump source sintering jig 200 is also rectangular, and the third position parameter of the chip further includes position coordinates of four vertices of the chip to determine R-axis information of the chip. It will be appreciated that the chip may also be circular or other polygonal in shape, and the specific shape is not limited herein, by entering its shape information into the system in advance to facilitate identifying the location information.
In this embodiment, the second image information parameter further includes a second dirt information parameter, and the step S532 of obtaining the fourth position parameter of the pick-up 331 specifically includes:
s532a, when the back surface of the chip is free from dirt, acquiring a fourth position parameter of the pick-up part 331;
after the step S531 of acquiring the second image information parameter of the opposite side of the chip, the method further includes:
and S532b, when dirt is on the back surface of the chip, controlling the pick-up part 331 to put the chip back to the position to be picked up.
In this embodiment, whether the back surface of the chip is dirty or not is determined by the second dirty information parameter, if not, the fourth position parameter of the pick-up 331 is obtained, and the chip is mounted to the target mounting position; if the back surface of the chip has dirt, in order to avoid influencing the sintering and welding effect during sintering and avoiding the chip displacement caused by the dirt, the pick-up 331 is controlled to put the chip back to the position to be picked up, specifically, to put the chip back to the first position parameter.
It should be noted that, the chips are generally placed in the chip magazine 131, a plurality of accommodating grooves are provided on the chip magazine 131 to accommodate a plurality of chips correspondingly, if the back surface of the chip is dirty, the chips are put back into the corresponding accommodating grooves to wait for manual processing, meanwhile, the corresponding mounting grooves on the pump source sintering jig 200 are empty, the pick-up part 331 is controlled to pick up the next chip in the next accommodating groove, and the next chip is correspondingly mounted in the next mounting groove on the pump source sintering jig 200; if the back surface of the next chip still has dirt, and so on. After the mounting of the plurality of mounting grooves of the pump source sintering jig 200 is completed, the mounting grooves without mounting are manually processed, and the system can record and identify the positions of the mounting grooves without mounting chips and the positions of the corresponding chips on the chip magazine 131, so as to facilitate the manual processing.
In this embodiment, the soldering-tab attaching mechanism includes a mounting base 31 and a pickup assembly 33, the mounting base 31 is movably disposed relative to the workbench 500 so as to reach the soldering-tab taking station and the corresponding soldering-tab attaching station on a moving stroke, the pickup assembly 33 is mounted on the mounting base 31, and the pickup assembly 33 includes a pickup portion 331 rotatably mounted on the mounting base 31 along an up-down axis, and the pickup portion 331 is configured to pick up a soldering tab placed on the soldering-tab taking station to the soldering-tab attaching station;
the step S30 of controlling the action of the soldering-lug attaching mechanism according to the target attaching position to pick up the soldering lug on the soldering-lug taking station to the chip attaching position of the attaching slot specifically includes the following steps:
s31, acquiring a position to be picked up of the soldering lug on the soldering lug taking station;
s32, controlling the pick-up part 331 to move to the position to be picked up so as to pick up the soldering lug;
and S34, controlling the pick-up part 331 to move to the target mounting position so as to mount the soldering lug on the chip mounting position.
In the technical solution provided in this embodiment, the first camera 34 is controlled to capture the solder tab pick-up station to determine a position to be picked up of the solder tab, the driving device 32 is controlled to drive the pick-up portion 331 to move to the position to be picked up according to the position information of the position to be picked up, and the suction nozzle 3311 of the pick-up portion 331 is controlled to be communicated with vacuum to absorb and pick up the solder tab; and then controlling the pick-up part 331 to move to the target mounting position, mounting the soldering lug on the soldering lug mounting position, controlling the suction nozzle 3311 to be disconnected from vacuum, completing one mounting, returning to the soldering lug taking station, repeating the steps, and continuing the next mounting.
In this embodiment, the soldering lug has opposite front and back surfaces;
the step S31 of obtaining the position to be picked up of the soldering lug on the soldering lug material taking station specifically includes:
s311, acquiring first image information parameters of the front surface of the soldering lug, wherein the first image information parameters comprise first position parameters;
s312, the step of controlling the picking portion 331 to move to the position to be picked up to pick up the soldering lug includes:
s313, acquiring a second position parameter of the pick-up part 331;
s314, calculating a first position deviation parameter according to the first position parameter and the second position parameter;
s315, controlling the pick-up part 331 to move according to the first position deviation parameter, so that the position parameter after the pick-up part 331 moves coincides with the first position parameter.
In the technical solution provided in this embodiment, the first position parameter is specifically a coordinate position of a geometric center of the soldering lug, the second position parameter is specifically a coordinate position of a geometric center of the suction nozzle 3311, and the first position deviation parameter of the first position parameter and the second position parameter is calculated by the control device, so as to instruct the driving device 32 to drive the X-axis linear motion module 321, the Y-axis linear motion module 322, the Z-axis linear motion module 323 and the driving motor 332 according to the first deviation parameter, so as to drive the suction nozzle 3311 of the pickup portion 331 to move to the geometric center of the upper surface of the soldering lug to coincide, and control the driving motor 332 to drive the suction nozzle 3311 to rotate along the R-axis to adjust the pickup angle.
Further, in this embodiment, the first image information parameter further includes a first dirt information parameter, and the step S313 of obtaining the second position parameter of the pick-up 331 specifically includes:
s313a, when the front surface of the soldering lug is free from dirt, acquiring a second position parameter of the pick-up part 331;
after the step S311 of acquiring the first image information parameter of the front surface of the soldering lug, the method further includes:
s313b, when the front surface of the soldering lug is dirty, controlling the pick-up 331 to put the soldering lug into the waste bin 38.
It should be noted that, the chip mounting of the pump source requires high precision, so that the surface of the soldering lug cannot be stained, and if the surface of the soldering lug is stained, the chip is displaced during sintering, and the laser output of the pump source is affected. Therefore, the first image information parameters further comprise the first dirty information parameters of the front surface of the soldering lug, whether the front surface of the soldering lug is dirty or not is judged through the first dirty information parameters, and if the front surface of the soldering lug is not dirty, the subsequent steps are normally carried out; and if the front surface of the soldering lug is judged to be dirty, after the picking-up part 331 picks up the soldering lug, controlling the picking-up part 331 to put the soldering lug into the waste bucket 38 for recycling, and then picking up a new soldering lug of the material taking station again.
In this embodiment, the step S34 of controlling the pick-up portion 331 to move to the target mounting position to mount the soldering tab on the soldering tab attaching position further includes:
s331, acquiring second image information parameters of the reverse side of the soldering lug, wherein the second image information parameters comprise third position parameters;
s332, acquiring a fourth position parameter of the pick-up 331;
s333, calculating a second position deviation parameter according to the third position parameter and the fourth position parameter;
the step S34 of controlling the pick-up 331 to move to the target mounting position to mount the soldering lug on the chip mounting position includes:
s341, calculating a third position deviation parameter according to the fourth position parameter and the parameter of the target mounting position;
s342, determining a final position deviation parameter according to the second position deviation parameter and the third position deviation parameter;
s343, controlling the pick-up part 331 to move to the target mounting position according to the final position deviation parameter.
In the technical solution provided in this embodiment, in order to improve the accuracy of bonding the soldering lug, after the pick-up portion 331 picks up the soldering lug, before the bonding position of the soldering lug is bonded, the soldering lug is driven to move to a position right above the second image pickup device 35, and a third position parameter of the back surface of the soldering lug is obtained by the second image pickup device 35, specifically, the third position parameter is a position coordinate of a geometric center of the soldering lug at the moment, and then the fourth position parameter information of the pick-up portion 331 is obtained, specifically, the fourth position parameter information is a position coordinate of the geometric center of the suction nozzle 3311 at the moment; the control device calculates the second position deviation parameter according to the third parameter position information and the fourth parameter position information so as to guide the pick-up part 331 to calibrate the accurate position of the soldering lug.
Meanwhile, the third position deviation parameter is calculated according to the fourth position parameter of the pick-up part 331 and the parameter of the target mounting position, the final position value deviation parameter is determined according to the second position deviation parameter and the third position deviation parameter, then the pick-up part 331 is known to move to the target mounting position according to the final position deviation parameter, and the soldering lug is accurately mounted in the corresponding mounting groove of the pumping source sintering jig 200.
It should be noted that, to reduce the calculation amount, the fourth position parameter is generally a fixed value, and specific coordinate parameters of the pickup portion 331 moving to the position above the second image capturing device 35 are set in advance to ensure that the pickup portion 331 moves to the same position each time, where the specific coordinate parameters include information of the X axis, the Y axis, the Z axis, and the R axis of the suction nozzle 3311. In addition, the shape of the soldering lug is generally rectangular, the cross section of the mounting groove of the pump source sintering jig 200 is also rectangular, and the third position parameter of the soldering lug further includes position coordinates of four vertexes of the soldering lug so as to judge the R-axis information of the soldering lug. It will be appreciated that the shape of the lug may also be circular or other polygonal, and the specific shape is not limited herein, by entering its shape information into the system in advance to facilitate identification of the location information.
In this embodiment, the second image information parameter further includes a second dirt information parameter, and the step S332 of obtaining the fourth position parameter of the pick-up 331 specifically includes:
s332a, acquiring a fourth position parameter of the pick-up part 331 when the back surface of the soldering lug is free of dirt;
after the step S331 of acquiring the second image information parameter of the opposite side of the soldering lug, the method further includes:
and S332b, when the reverse surface of the soldering lug is dirty, controlling the pick-up part 331 to put the soldering lug into the waste bucket 38.
In this embodiment, whether the back surface of the soldering lug is dirty or not is judged according to the second dirty information parameter, if not, the fourth position parameter of the pick-up 331 is obtained, and the soldering lug is attached to the target attaching position; if the reverse surface of the tab is stained, the pick-up 331 is controlled to put the tab into the waste bin 38 to recover the tab, and then return to the position to be picked up to pick up the next tab in order to avoid affecting the sintering welding effect during sintering and to avoid chip displacement caused by the stain.
In this embodiment, the step S10 of obtaining the target mounting position of the chip bonding position in the mounting groove specifically includes the following steps;
S11, obtaining coding information of the pump source sintering jig 200 to determine the model of the pump source sintering jig 200;
s12, acquiring position information of a coordinate reference arranged on the pump source sintering jig 200, and establishing a current rectangular coordinate system according to the position information of the coordinate reference;
s14, inquiring a preset mapping relation according to a current rectangular coordinate system to obtain the position information of each chip bonding position on the pump source sintering jig 200, wherein the preset mapping relation is a corresponding relation between the model of the pump source sintering jig 200 and the position information of each chip bonding position on the pump source sintering jig 200.
In the technical solution provided in this embodiment, the pump source sintering jig 200 is provided with multiple types, the positioning slots 221 of the pump source sintering jig 200 of different types are different in position, and the positions of the coordinate references are also different, and the coding information on the pump source sintering jig 200 is obtained by photographing through the visual identification device, so as to determine the type of the pump source sintering jig 200. And then photographing to obtain the position information of the coordinate reference on the pump source sintering jig 200 which is required to be mounted currently, and establishing a current rectangular coordinate system according to the position information of the coordinate reference currently. And inquiring the preset mapping relation according to the current rectangular coordinate system, wherein the preset mapping relation is specifically a corresponding relation between the model of the pump source sintering jig 200 and the position information of each chip mounting position on the pump source sintering jig 200, so as to obtain the position information of each chip mounting position on the pump source sintering jig 200. By setting the coordinate references and the preset mapping relation, each attaching position is not required to be identified one by one when each chip attaching position is identified, the identification efficiency is low, the position information of each chip attaching position can be obtained only by identifying the model and the corresponding coordinate references, and the problem that each chip attaching position is fuzzy and possibly cannot be identified due to long-term use of the pumping source sintering jig 200 is avoided.
In this embodiment, the pump source sintering jig 200 is provided with a plurality of code holes 222, and the pump source sintering jig 200 further includes a plurality of code pins 24, and different numbers of the code pins 24 are selected to be inserted into the plurality of code holes 222 at different positions to form a plurality of visual identification codes;
the step S11 of obtaining the coding information of the pump source sintering jig 200 to determine the model of the pump source sintering jig 200 includes:
s111, acquiring the number of the coding pins 24 and the position information of each coding pin 24 in a plurality of coding holes 222;
s112, acquiring the visual identification codes according to the position information of each coding pin 24 in a plurality of coding holes 222;
s113, inquiring a preset coding relation according to the visual identification code to determine the model of the pump source sintering jig 200, wherein the preset coding relation is a corresponding relation between the visual identification code and the model of the pump source sintering jig 200.
In the technical scheme provided in this embodiment, when the pump source sintering fixture 200 is sintered in the vacuum sintering furnace, not only the positioning groove 221 may have blurred edges due to long-term use, but also the conventional code recognition or two-dimensional code recognition may deform or melt due to high temperature, which results in failure to recognize after several times of use, high cost and influence on production efficiency.
In this embodiment, the upper surface of the positioning jig 22 is provided with a plurality of coding holes 222, and the pump source sintering jig 200 further includes a plurality of coding pins 24; wherein a different number of the code pins 24 may be selected for insertion into a plurality of the code holes 222 in a different arrangement to form a plurality of visually identifiable code combinations. The plurality of coding holes 222 are arranged in an array on the upper surface of the positioning jig 22, the upper end edges of the plurality of coding pins 24 are arranged in a beveling manner, when the model of the positioning jig 22 is identified, the array areas of the plurality of coding holes 222 are photographed, and whether the coding pins 24 are inserted into the coding holes 222 is determined by identifying the coding pins 24, so that different graphic coding information is obtained.
Further, in this embodiment, a plurality of the code holes 222 are arranged in an array, and the visual identification code includes a binary number array;
the step S112 of obtaining the visual identification code according to the position information of each code pin 24 in the plurality of code holes 222 includes:
s1121, acquiring image information of a plurality of the encoding holes 222;
s1122, determining the numerical value on each digit of the binary number sequence according to the image information of the plurality of encoding holes 222, so as to form the visual identification code.
The plurality of coding holes 222 are arranged in an array on the upper surface of the positioning jig 22, the upper end edges of the plurality of coding pins 24 are arranged in a beveling manner, when the model of the positioning jig 22 is identified, the array areas of the plurality of coding holes 222 are photographed, and whether the coding pins 24 are inserted into the coding holes 222 is judged by sequentially identifying the plurality of coding holes 222 according to a fixed sequence so as to obtain different binary coding sequences.
Further, the step S1122 of determining the numerical value of each digit of the binary number sequence according to the image information of the plurality of encoding holes 222 includes:
s11221, when the coding pin 24 does not exist in the corresponding coding hole 222, determining that the value on the binary number array number corresponding to the coding hole 222 is 0;
s11222, when the coding pin 24 is provided corresponding to the coding hole 222, determining that the value of the binary number array number corresponding to the coding hole 222 is 1.
In this embodiment, the visual recognition device may preset that the output signal of the code pin 24 is recognized as 1 in the corresponding code hole 222, that the output model of the code pin 24 is not recognized as 0 in the corresponding code hole 222, and the recognition results of the plurality of code holes 222 are sequentially combined to obtain the code information of different binary number sequences.
In this embodiment, two positioning columns 23 are disposed on the pump source sintering fixture 200;
the step S12 of obtaining the position information of the coordinate reference on the pump source sintering fixture 200 and establishing the current rectangular coordinate system according to the position information of the coordinate reference includes:
s121, acquiring first contour image information of the two positioning columns 23 to acquire two first circular patterns;
s122, establishing an abscissa in the direction of connecting the circle centers of the two first circular patterns, and establishing an ordinate in the direction perpendicular to the abscissa through one of the two circle centers to form a current rectangular coordinate system.
In this embodiment, by disposing two positioning columns 23 on the pump source sintering fixture 200, the upper end edges of the two positioning columns 23 are disposed in a chamfer manner, so that the visual recognition device recognizes the outlines of the two positioning columns 23, and by recognizing the positions of the two positioning columns 23, a current rectangular coordinate system is established with the two positioning columns 23 as references.
Referring to fig. 14 and 15, when photographing by the visual recognition device, the light is generally emitted by a flash lamp, and the light is reflected back to the visual recognition device to be recognized by contacting the surface of the object. The upper end face of the positioning column 23 is smooth, the upper end edge of the positioning column 23 is chamfered, the upper end face of the positioning column 23 reflects light when photographing, and the upper end edge of the positioning column 23 reflects light to the periphery and is not received by the visual recognition equipment, so that a dark ring-shaped outline is formed, and the visual recognition equipment can receive and recognize the light conveniently.
Specifically, in this embodiment, two positioning holes are provided on the upper surface of the pump source sintering fixture 200, and pins are provided at the lower ends of the two positioning columns 23, so that the two positioning columns 23 are respectively installed in the two positioning holes in a corresponding manner. Each of the pins is in interference fit with the corresponding positioning hole, so that the two positioning posts 23 are fixedly installed in the two positioning holes. Wherein, each reference column 23 can be dismantled and assembled and set up to prevent for a long time use reference column 23 wearing and tearing warp, influence the discernment of shooing, change only need with corresponding reference column 23 pull out, change new reference column 23 can, change simple with low costs, the durability is strong.
The shape of the two positioning posts 23 is not limited in the technical scheme of the present invention, and may be a square post, a diamond post or a circular post, and in this embodiment, the two positioning posts 23 are both circular posts, which is convenient for production and simple for identification. The visual recognition device shoots two movable circular patterns, realizes positioning by recognizing circle centers of the two circular patterns, takes the connecting line direction of the two circle centers as an X axis, takes one of the two circle centers as an origin, establishes a Y axis which passes through the origin and is perpendicular to the X axis, and forms a rectangular coordinate system by fitting.
It can be understood that the selection of the origin, the positive direction of the X axis and the positive direction of the Y axis are selectable, and the rectangular coordinate system established after each photographing identification is ensured to be the same by presetting in advance.
In this embodiment, each chip mounting position on the pump source sintering jig 200 is provided with a positioning slot 221, and the pump source sintering jig 200 is provided with two positioning posts 23;
the step S14 of querying the preset mapping relationship according to the current rectangular coordinate system to obtain the position information of each chip mounting position on the pump source sintering fixture 200 further includes:
s121, acquiring second contour image information of the two positioning columns 23 to acquire two second circular patterns;
s122, establishing an abscissa in the direction of connecting the circle centers of the two second circular patterns, and establishing an ordinate in the direction perpendicular to the abscissa by passing through one of the two circle centers to form an associated rectangular coordinate system;
s123, after a plurality of identification points 2211 are arranged on the outline boundary of the positioning groove 221, obtaining image information of each identification point 2211;
s124, fitting each identification point 2211 according to a preset rule to form a polygonal outline;
s125, corresponding the coordinate position information of each polygonal contour in the associated rectangular coordinate system to the model of the pump source sintering jig 200 to establish a preset mapping relation.
Referring to fig. 12 and 13, in the solution provided in this embodiment, the pump source sintering fixture 200 is provided with a plurality of positioning slots 221 corresponding to each die attach position for positioning the die, so as to avoid the die shifting during the handling process. Before the pump source sintering jig 200 is put into use, the positions of the positioning grooves 221 of the pump sources of various types need to be input into the system, so that data can be conveniently called in later use. When the system is input, the two positioning columns 23 are photographed and identified to establish the associated rectangular coordinate system of the pump source sintering jig 200, then a plurality of identification points 2211 are arranged on the outline boundary of the positioning groove 221 through visual identification equipment to obtain outline boundary information of the positioning groove 221 at the position of each identification point 2211, the visual identification equipment can fit the outline boundary information of the positioning groove 221 at the position of each identification point 2211 through a preset rule, the outline boundary information is formed by connecting the outline boundary information to form a polygonal outline, and coordinate position information of each polygonal outline in the associated rectangular coordinate system corresponds to the model of the pump source sintering jig 200, so that a preset mapping relation is established. When the positioning device is put into production, the coordinates of the polygonal outline of each positioning groove 221 of the corresponding model in the rectangular coordinate system can be called according to the preset mapping relation, so that the accuracy is high, and the recognition efficiency is high.
Note that, the outline of the positioning groove 221 is set according to the chip shape, and the specific shape is not limited herein, and in this embodiment, the positioning groove 221 is set in a rectangular shape.
The foregoing description is only of the preferred embodiments of the present invention and is not intended to limit the scope of the invention, and all equivalent structural changes made by the specification and drawings of the present invention or direct/indirect application in other related technical fields are included in the scope of the present invention.
Claims (15)
1. The utility model provides a pumping source chip mounter which characterized in that includes:
the working table is provided with a sintering disc loading and unloading station and two mounting stations along the circumferential direction, wherein the two mounting stations are respectively used for mounting two pieces to be mounted;
the rotary table is rotationally arranged on the workbench along an up-down axial line, a vacuum suction seat is arranged on the rotary table, and the vacuum suction seat can sequentially reach the sintering disc loading and unloading station and the two mounting stations on the rotating stroke of the rotary table;
the pumping source sintering jig is adsorbed and placed on the vacuum suction seat, and a mounting groove is formed in the pumping source sintering jig;
the two automatic feeding tools are arranged on the workbench respectively corresponding to the two mounting stations, each automatic feeding tool is provided with a material taking station, and the two material taking stations are respectively used for providing one to-be-mounted part;
The two automatic mounting mechanisms are respectively arranged on the workbench corresponding to the two automatic feeding tools and used for picking up the to-be-mounted parts arranged on the corresponding material taking stations to the mounting grooves of the pumping source sintering jig at the corresponding mounting stations; the method comprises the steps of,
the driving device is used for driving the turntable to rotate;
the two pieces to be attached comprise soldering lugs and chips.
2. The pump source placement machine of claim 1, wherein two of the pick-up stations comprise a chip pick-up station, two of the placement stations comprise a chip placement station corresponding to the chip pick-up station, two of the automatic loading tools comprise a chip loading tool, the chip loading tool comprising:
the base is arranged on the workbench, and the chip taking station is formed on the base;
the carrying structure is arranged on the base corresponding to the chip material taking station and comprises a material taking cavity and a blanking cavity which are respectively communicated upwards, wherein the material taking cavity is provided with a material taking space at an opening, and the blanking cavity is provided with a blanking space at the opening;
the material box jigs are stacked up and down and are arranged in the material taking cavity, and the material box jigs are used for placing chips;
The jacking piece is movably arranged on the base along the up-down direction, can extend into the material taking cavity and jack up the plurality of material box jigs upwards so as to jack the material box jigs at the upper end to the material taking space;
the pneumatic paw is used for grabbing the material box jig in the material taking space to the blanking space; the method comprises the steps of,
and the falling piece is movably arranged on the base along the up-down direction, and can extend into the blanking space of the blanking cavity and load the material box jig downwards so as to empty the blanking space.
3. The pump source chip mounter according to claim 2, wherein two abdication through holes respectively communicating said material taking cavity and said blanking cavity are formed at the bottom of said carrying structure, and said two abdication through holes are respectively used for the corresponding lifting member and said falling member to pass through;
the chip material loading frock includes:
the first longitudinal movement module is arranged corresponding to the blanking cavity, is movably arranged on the base along the up-down direction and is positioned below the corresponding yielding through hole, and the falling piece is arranged on the first longitudinal movement module;
the second longitudinal movement module is arranged corresponding to the material taking cavity, is movably arranged on the base along the up-down direction and is positioned below the corresponding yielding through hole, and the jacking piece is arranged on the second longitudinal movement module; the method comprises the steps of,
The detection assembly comprises a first sensor, a second sensor, a third sensor, a fourth sensor, a fifth sensor and a controller, wherein the first sensor is used for detecting the blanking space, the second sensor is used for detecting the bottom of the blanking cavity, the third sensor is used for detecting the material taking space, the fourth sensor is used for detecting the bottom of the material taking cavity, the fifth sensor is used for detecting the lower side space of the material taking space, and the controller is electrically connected with the first sensor, the second sensor, the third sensor, the fourth sensor, the fifth sensor, the first longitudinal movement module and the second longitudinal movement module.
4. The pump source placement machine of claim 1, wherein each of the automated placement mechanisms comprises:
the mounting seat is movably arranged relative to the workbench, so that the mounting seat can reach the corresponding material taking station and the corresponding mounting station on the movable travel;
the driving device is arranged on the workbench and is in driving connection with the mounting seat and used for driving the mounting seat to move;
The picking assembly is arranged on the mounting seat and comprises a picking part which is rotatably arranged on the mounting seat along an up-down axial line, and the picking part is used for picking up the to-be-mounted parts arranged on the corresponding material taking station to the corresponding mounting station;
the first camera device is arranged on the mounting seat and is used for shooting the positions of the to-be-mounted parts of the corresponding material taking station and the mounting groove of the pumping source sintering jig;
and the control device is respectively and electrically connected with the driving device, the pick-up assembly and the image pick-up device.
5. The pump source chip mounter according to claim 4, wherein said first camera device is provided on upper sides of said pick-up station and said mounting station for photographing from top to bottom;
the automatic mounting mechanism further comprises a second camera device, the second camera device is fixedly mounted on the workbench, the mounting seat can move to the upper side of the second camera device on the moving stroke of the mounting seat, and the second camera device is used for shooting from bottom to top.
6. The pump source die bonder of claim 5, wherein two of said automated feed tools include a lug feed tool, a pick-up station of said lug feed tool being configured to provide a lug;
The automatic mounting mechanisms comprise soldering lug mounting mechanisms, the soldering lug mounting mechanisms correspond to the soldering lug feeding tools, the soldering lug mounting mechanisms further comprise waste barrels, and the waste barrels are used for placing dirty soldering lugs.
7. The pump source pick-up machine of claim 1, wherein the pump source sintering fixture comprises:
the vacuum suction seat is arranged on the vacuum suction seat, a mounting groove is formed in the pump source seat, and a plurality of chip bonding positions are formed in the bottom of the mounting groove; the method comprises the steps of,
the positioning jig is arranged in the mounting groove and is arranged at the bottom of the mounting groove in a covering manner, and is provided with a plurality of positioning grooves penetrating in the vertical direction, and the positioning grooves are correspondingly arranged with the chip bonding positions;
wherein, be equipped with at least one reference column on the location tool, the edge of the upper end of reference column is the chamfer setting.
8. The pump source chip mounter according to claim 7, wherein a plurality of coding holes are formed in an upper surface of said positioning jig, and said pump source sintering jig further comprises a plurality of coding pins;
wherein, the coding pins with different numbers can be selected and inserted into the coding holes according to different arrangement combinations so as to form various visual identification coding combinations.
9. The pump source chip mounter according to claim 1, wherein three vacuum suction seats are provided, and the three vacuum suction seats are arranged at intervals along the circumferential direction of the turntable so as to correspond to the sinter tray loading and unloading station and the two mounting stations respectively.
10. The pump source mounter according to claim 1, wherein said driving device includes a DD motor, a motor seat of said DD motor is provided to said table, an output shaft of said DD motor rotates along an up-down axis, and said turntable is connected to said output shaft.
11. A pump source chip mounter according to any one of claims 1 to 10, wherein two said automatic feeding tools include a chip feeding tool and a chip feeding tool, two said material taking stations include a chip taking station and a chip taking station, two said automatic mounting mechanisms include a chip mounting mechanism and a chip mounting mechanism, and two said mounting stations include a chip mounting station and a chip mounting station, characterized in that said pump source chip mounter comprises the steps of:
after the pump source sintering jig is positioned and placed on the vacuum suction seat at the sintering disc loading and unloading station, a target mounting position of the core mounting position in the mounting groove is obtained;
After the pump source sintering jig moves from the sintering disc loading and unloading station to the soldering lug attaching station, controlling the soldering lug feeding tool to act so as to supplement soldering lugs to the soldering lug unloading station;
controlling the action of the soldering lug mounting mechanism according to the target mounting position so as to pick up the soldering lug on the soldering lug taking station to the chip mounting position of the mounting groove;
after the pumping source sintering jig moves from the soldering lug mounting station to the chip mounting station, controlling the chip feeding tooling to act so as to supplement chips to the chip taking station;
and controlling the chip mounting mechanism to act according to the target mounting position so as to pick up the chip on the chip taking station to the soldering lug positioned at the chip mounting position.
12. The pump source patch control method according to claim 11, wherein the chip feeding fixture comprises a base, a carrying structure, a plurality of material box jigs, a jacking piece, a falling piece, a first longitudinal movement module and a second longitudinal movement module, wherein the base is arranged on the workbench, the chip feeding station is formed on the base, the carrying structure is arranged on the base corresponding to the chip feeding station, the carrying structure comprises a feeding cavity and a discharging cavity which are respectively penetrated upwards, the feeding cavity is provided with a feeding space at an opening, the discharging cavity is provided with a discharging space at the opening, the plurality of material box jigs are vertically stacked and arranged in the feeding cavity, the material box jigs are used for placing chips, the first longitudinal movement module is movably arranged on the base along the up-down direction, the falling piece is arranged on the first longitudinal movement module, the falling piece can extend into the feeding space and downwards load the material box jigs, the second longitudinal movement module is arranged on the base along the up-down direction, and the second longitudinal movement module is arranged on the jacking piece and can extend upwards;
The step of controlling the chip feeding tool to act so as to supplement chips to the chip taking station specifically comprises the following steps of:
respectively acquiring a second shielding signal of a second position of the chip taking station and a fifth shielding signal of a fifth position of the chip taking station;
when the second shielding signal is non-shielding and the fifth shielding signal is shielded, respectively acquiring a first shielding signal of the first position of the chip taking station and a third shielding signal of the third position of the chip taking station;
when the first shielding signal is shielded and the third shielding signal is not shielded, the first longitudinal movement module and the second longitudinal movement module are controlled to act so as to drive the falling piece downwards by one unit height, and simultaneously drive the jacking piece upwards by one unit height so as to empty the blanking space and supplement chips to the material taking space at the chip material taking station.
13. The pump source patch control method of claim 11, wherein the die attach mechanism comprises a mounting base and a pick-up assembly, the mounting base is movably arranged relative to the workbench so as to reach the die pick-up station and the corresponding die attach station on a movable stroke, the pick-up assembly is mounted on the mounting base, and the pick-up assembly comprises a pick-up part rotatably mounted on the mounting base along an up-down axis, and the pick-up part is used for picking up a to-be-attached part placed on the die pick-up station to the die attach station;
The step of controlling the chip mounting mechanism to act according to the target mounting position so as to pick up the chip on the chip taking station to the soldering lug positioned in the mounting groove specifically comprises the following steps:
acquiring a position to be picked up of a chip on the chip taking station;
controlling the pick-up part to move to the position to be picked up so as to pick up the chip;
and controlling the pick-up part to move to the target mounting position so as to mount the chip on the chip mounting position.
14. The method of claim 11, wherein the step of obtaining the target mounting position of the chip bonding position in the mounting groove comprises the steps of;
obtaining coding information of the pumping source sintering jig to determine the model of the pumping source sintering jig;
acquiring position information of a coordinate reference arranged on the pumping source sintering jig, and establishing a current rectangular coordinate system according to the position information of the coordinate reference;
and inquiring a preset mapping relation according to the current rectangular coordinate system to obtain the position information of each chip attaching position on the pump source sintering jig, wherein the preset mapping relation is the corresponding relation between the model of the pump source sintering jig and the position information of each chip attaching position on the pump source sintering jig.
15. The method of claim 14, wherein the pump source sintering jig is provided with a plurality of coding holes, the pump source sintering jig further comprises a plurality of coding pins, and different numbers of the coding pins are selected to be inserted into the plurality of coding holes at different positions so as to form a plurality of visual identification codes;
the step of obtaining the coding information to determine the model of the pump source sintering jig comprises the following steps:
acquiring the number of the coding pins and the position information of each coding pin in a plurality of coding holes;
acquiring the visual identification codes according to the position information of each coding pin in a plurality of coding holes;
inquiring a preset coding relation according to the visual identification code to determine the model of the pumping source sintering jig, wherein the preset coding relation is the corresponding relation between the visual identification code and the model of the pumping source sintering jig.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211560367.XA CN116230584A (en) | 2022-12-07 | 2022-12-07 | Pump source chip mounter and chip mounting control method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211560367.XA CN116230584A (en) | 2022-12-07 | 2022-12-07 | Pump source chip mounter and chip mounting control method |
Publications (1)
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116573397A (en) * | 2023-07-12 | 2023-08-11 | 前海晶方云(深圳)测试设备有限公司 | Changing equipment |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116573397A (en) * | 2023-07-12 | 2023-08-11 | 前海晶方云(深圳)测试设备有限公司 | Changing equipment |
| CN116573397B (en) * | 2023-07-12 | 2023-12-08 | 前海晶方云(深圳)测试设备有限公司 | Changing equipment |
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