CN116218336A - Preparation and application of water-soluble protective adhesive - Google Patents
Preparation and application of water-soluble protective adhesive Download PDFInfo
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- CN116218336A CN116218336A CN202310338321.1A CN202310338321A CN116218336A CN 116218336 A CN116218336 A CN 116218336A CN 202310338321 A CN202310338321 A CN 202310338321A CN 116218336 A CN116218336 A CN 116218336A
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- water
- parts
- polyethylene glycol
- preparation
- polyvinylpyrrolidone
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- 230000001681 protective effect Effects 0.000 title claims abstract description 35
- 238000002360 preparation method Methods 0.000 title claims abstract description 16
- 239000000853 adhesive Substances 0.000 title claims description 31
- 230000001070 adhesive effect Effects 0.000 title claims description 28
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 30
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims abstract description 30
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 27
- 239000002202 Polyethylene glycol Substances 0.000 claims abstract description 22
- 229920001223 polyethylene glycol Polymers 0.000 claims abstract description 22
- 229920000036 polyvinylpyrrolidone Polymers 0.000 claims abstract description 22
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 claims abstract description 22
- 239000001267 polyvinylpyrrolidone Substances 0.000 claims abstract description 16
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 15
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims abstract description 14
- 239000004408 titanium dioxide Substances 0.000 claims abstract description 14
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims abstract description 13
- 235000012239 silicon dioxide Nutrition 0.000 claims abstract description 12
- 239000002245 particle Substances 0.000 claims abstract description 8
- 239000012535 impurity Substances 0.000 claims abstract description 7
- 239000000314 lubricant Substances 0.000 claims abstract description 3
- 239000002994 raw material Substances 0.000 claims abstract description 3
- 239000011521 glass Substances 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 10
- 230000008569 process Effects 0.000 claims description 7
- 238000007747 plating Methods 0.000 claims description 4
- 239000000945 filler Substances 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 239000003292 glue Substances 0.000 abstract description 8
- 238000001914 filtration Methods 0.000 abstract description 7
- 230000007613 environmental effect Effects 0.000 abstract description 3
- 238000001556 precipitation Methods 0.000 abstract description 3
- 239000002351 wastewater Substances 0.000 abstract description 3
- 238000009835 boiling Methods 0.000 abstract description 2
- 239000012046 mixed solvent Substances 0.000 abstract description 2
- 238000013035 low temperature curing Methods 0.000 abstract 1
- 238000003756 stirring Methods 0.000 description 8
- 238000007650 screen-printing Methods 0.000 description 6
- 229910021502 aluminium hydroxide Inorganic materials 0.000 description 4
- 238000004090 dissolution Methods 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- -1 alkali metal salt Chemical class 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 239000012752 auxiliary agent Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- RWNUSVWFHDHRCJ-UHFFFAOYSA-N 1-butoxypropan-2-ol Chemical compound CCCCOCC(C)O RWNUSVWFHDHRCJ-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- FKNQFGJONOIPTF-UHFFFAOYSA-N Sodium cation Chemical compound [Na+] FKNQFGJONOIPTF-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000002318 adhesion promoter Substances 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000013530 defoamer Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910002011 hydrophilic fumed silica Inorganic materials 0.000 description 1
- 239000002480 mineral oil Substances 0.000 description 1
- 235000010446 mineral oil Nutrition 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000011527 polyurethane coating Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 229910001415 sodium ion Inorganic materials 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
- 238000004383 yellowing Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D171/00—Coating compositions based on polyethers obtained by reactions forming an ether link in the main chain; Coating compositions based on derivatives of such polymers
- C09D171/02—Polyalkylene oxides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/20—Diluents or solvents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2237—Oxides; Hydroxides of metals of titanium
- C08K2003/2241—Titanium dioxide
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Lubricants (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses preparation and application of water-soluble protective glue, which comprises the following raw materials in percentage by mass: polyethylene glycol: 100 parts; polyvinylpyrrolidone: 20-66.7 parts; aluminum hydroxide: 54-75 parts; silica: 9.6-13.3 parts; titanium dioxide: 9.6-13.3 parts; water: 200-280 parts of a lubricant; alcohol: 200-280 parts of: the preparation method comprises the following steps: firstly adding polyethylene glycol and polyvinylpyrrolidone into water, adding alcohol after dissolving completely, sequentially adding aluminum hydroxide, silicon dioxide and titanium dioxide, dispersing for 30-40 min at 1500-2000 rpm by using a dispersing machine, and removing large-particle impurities by using a 200-mesh filter bag to obtain a finished product; the invention uses water and low boiling point alcohol as mixed solvent, can prepare low temperature temporary protective water-soluble protective glue with high low temperature curing and glue removing speed; under the normal temperature condition, the dry film is put into water, after 4-6 minutes, all the water of the film is dissolved for degumming, and the wastewater after degumming can be directly discharged after precipitation and filtration, so that the invention has the advantages of high efficiency, energy saving, environmental protection and no pollution.
Description
Technical Field
The invention belongs to the technical field of additive manufacturing, and particularly relates to preparation and application of water-soluble protective glue.
Background
The water-soluble protective adhesive is applied to the glass cover plate industry more, and is easy to scrape, collide and splash ink to cause bad due to the fact that the glass is a material in a complex production process, and bad occurrence can be avoided by carrying out processing after silk-screen printing a protective film on the surface of the glass.
Patent CN201510736820 discloses a temperature-resistant water-soluble glass protective adhesive and a preparation method thereof: the adhesive is prepared by compounding acrylic resin and propylene glycol butyl ether in a weak alkaline environment, using pure water as a solvent, adding alkali metal salt, mineral oil defoamer and surfactant, and has good redissolution effect and 100% adhesive stripping rate, and can resist high Wen Jushui at 250 ℃.
Patent CN201810794685 discloses a low-energy curing temperature-resistant water-soluble glass protective adhesive for an LED and a preparation method thereof: the polyurethane coating is prepared from organosilicon modified polyurethane acrylic ester, sodium ion chelating polyurethane acrylic ester, a photoinitiator, a film forming auxiliary agent, pigment, ceramic powder filler, a defoaming agent, a wetting agent, a thickening rheological auxiliary agent, an adhesion promoter and water, has the advantages of high temperature resistance, easy stripping and no yellowing, and can be directly subjected to film stripping by hot water at 80 ℃.
The existing protective adhesive comprising the patent has complex production formula and process, uses water as solvent, has high curing temperature and slow curing, and aims at the problem that the low-temperature temporary protection field is not applicable, so that the water-soluble protective adhesive needs to be designed to solve the problem.
Disclosure of Invention
The invention aims to provide a preparation and application of water-soluble protective glue so as to solve the problems in the background technology.
In order to achieve the above purpose, the present invention provides the following technical solutions: the water-soluble protective adhesive is prepared from the following raw materials in percentage by mass: polyethylene glycol: 100 parts; polyvinylpyrrolidone: 20-66.7 parts; aluminum hydroxide: 54-75 parts; silica: 9.6-13.3 parts; titanium dioxide: 9.6-13.3 parts; water: 200-280 parts of a lubricant; alcohol: 200-280 parts of:
the preparation method comprises the following steps: firstly, adding polyethylene glycol and polyvinylpyrrolidone into water, adding alcohol after dissolving completely, sequentially adding aluminum hydroxide, silicon dioxide and titanium dioxide, dispersing for 30-40 min at 1500-2000 rpm by using a dispersing machine, and removing large-particle impurities by using a 200-mesh filter bag to obtain a finished product.
Preferably, the molecular weight of the polyethylene glycol is 2000-8000, the molecular weight of the polyvinylpyrrolidone is 30000, the mass ratio of the polyvinylpyrrolidone to the polyethylene glycol is 1:1.5-5, the addition amount of the aluminum hydroxide, the silicon dioxide and the titanium dioxide filler is 61% of the mass of the polyvinylpyrrolidone and the polyethylene glycol, and the temperature resistant range is 100-120 ℃.
Preferably, the particle size of the aluminum hydroxide is 50nm, and the addition proportion is 45% of the total mass of the polyethylene glycol and PVP.
Preferably, the silicon dioxide is hydrophilic fumed silica with the particle size of 12nm, and the addition amount is 8% of the total mass of polyethylene glycol and PVP.
Preferably, the titanium dioxide is rutile titanium dioxide with the particle size of 250nm and the addition amount is 8% of the total mass of polyethylene glycol and PVP.
Preferably, the protective adhesive is suitable for temporary processing, vacuum plating and film plating temporary fixing in the process of lower than 120 ℃ and temporary protection in the processing of circuit boards and glass cover plates.
Compared with the prior art, the invention has the beneficial effects that:
1. the invention uses water and low boiling point alcohol as mixed solvent, can prepare low temperature temporary protective water-soluble protective glue with quick low temperature solidification and glue removal.
2. Under the normal temperature condition, the dry film is put into water, after 4-6 minutes, all the water of the film is dissolved for degumming, and the wastewater after degumming can be directly discharged after precipitation and filtration, so that the invention has the advantages of high efficiency, energy saving, environmental protection and no pollution.
Drawings
FIG. 1 is a schematic diagram of the preparation steps of the present invention.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Embodiment one:
referring to fig. 1, the present invention provides a technical solution: a water-soluble protective adhesive is prepared through adding polyethylene glycol (molecular weight 2000) 100 portions and polyvinylpyrrolidone (molecular weight 30000) 20 portions into pot, adding 200 portions of water, stirring at normal temperature for 20 min at 1000 rpm until it is completely dissolved, sequentially adding 200 portions of alcohol, 54 portions of aluminium hydroxide, 9.6 portions of silicon dioxide and 9.6 portions of titanium dioxide, stirring at 1500-2000 rpm for 30-40 min, and filtering with 200 mesh filter screen to remove excessive impurities.
The protective adhesive is printed on the surface of glass by using a 100-mesh screen printing screen, and is put into an oven to be dried at 100 ℃ for 30 min, and then the dry film thickness is 40 and umn, and the test results of the temperature resistance and the normal-temperature water dissolution adhesive removal speed are shown in Table 1.
Embodiment two:
referring to fig. 1, the present invention provides a technical solution: a water-soluble protecting adhesive is prepared through adding polyethylene glycol (molecular weight 4000) 100 portions and polyvinylpyrrolidone (molecular weight 30000) 25 portions into pot, adding 206 portions of water, stirring at ordinary temp. for 20 min at 1000 rpm until it is completely dissolved, sequentially adding 206 portions of alcohol, 56 portions of aluminium hydroxide, 10 portions of silicon dioxide and 10 portions of titanium dioxide, stirring at 1500-2000 rpm for 30-40 min, and filtering with 200 meshes to remove excessive impurities.
The protective adhesive was printed on the surface of glass using a 100-mesh screen printing plate, and dried in an oven at 100℃for 30 min to give a dry film thickness of 44/umn, and the test results of the temperature resistance and the normal-temperature water dissolution and de-adhesive speed were shown in Table 1.
Embodiment III:
referring to fig. 1, the present invention provides a technical solution: a water-soluble protecting adhesive is prepared through adding polyethylene glycol (molecular weight 6000) 100 portions and polyvinylpyrrolidone (molecular weight 30000) 50 portions into pot, adding 250 portions of water, stirring at normal temp. for 20 min at 1000 rpm until it is completely dissolved, sequentially adding 250 portions of alcohol, 67.3 portions of aluminium hydroxide, 12 portions of silicon dioxide and 12 portions of titanium dioxide, stirring at 1500-2000 rpm for 30-40 min, and filtering with 200 meshes to remove excessive impurities.
The protective adhesive was printed on the surface of glass using a 100-mesh screen printing plate, and dried in an oven at 100℃for 30 min to give a dry film thickness of 46. 46umn, and the test results of the temperature resistance and the normal-temperature water dissolution and de-adhesive speed were shown in Table 1.
Embodiment four:
referring to fig. 1, the present invention provides a technical solution: a water-soluble protective adhesive is prepared through adding polyethylene glycol (molecular weight 8000) 100 portions and polyvinylpyrrolidone (molecular weight 30000) 66.7 portions into a pot, adding 280 portions of water, stirring at normal temperature for 20 min at 1000 rpm until it is completely dissolved, sequentially adding 280 portions of alcohol, 75 portions of aluminium hydroxide, 13.3 portions of silicon dioxide and 13.3 portions of titanium dioxide, stirring at 1500-2000 rpm for 30-40 min, and filtering with 200 mesh filter screen to remove excessive impurities.
The protective adhesive was printed on the surface of glass using a 100-mesh screen printing plate, and dried in an oven at 100℃for 30 min to give a dry film thickness of 50. 50umn, and the test results of the temperature resistance and the normal-temperature water dissolution and de-adhesive speed were shown in Table 1.
TABLE 1
The viscosity of the protective adhesive is 4000-5000cps, 100 mesh screen printing can be used, the protective adhesive is put into an oven to be dried at 100 ℃ for 30 min, the dry film thickness is 40-50umn, the dry film is put into water at normal temperature, the adhesive is removed after the film is completely dissolved in water for 4-6 minutes, and the waste water after the adhesive removal can be directly discharged after precipitation and filtration, so that the protective adhesive has the advantages of high efficiency, energy conservation, environmental protection and no pollution; the protective glue uses water and alcohol as solvents, has low curing temperature and high curing speed, does not cause corrosion damage to protective materials, and is suitable for temporary processing, vacuum plating, temporary fixation of coating films, temporary protection of circuit board and glass cover plate processing and the like in the process of lower than 120 ℃.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
The foregoing is merely illustrative of the present invention and not restrictive, and other modifications and equivalents thereof may occur to those skilled in the art without departing from the spirit and scope of the present invention.
Claims (6)
1. The preparation of the water-soluble protective adhesive is characterized in that: the raw material formula comprises the following components in percentage by mass: polyethylene glycol: 100 parts; polyvinylpyrrolidone: 20-66.7 parts; aluminum hydroxide: 54-75 parts; silica: 9.6-13.3 parts; titanium dioxide: 9.6-13.3 parts; water: 200-280 parts of a lubricant; alcohol: 200-280 parts of:
the preparation method comprises the following steps: firstly adding polyethylene glycol and polyvinylpyrrolidone into water, adding alcohol after dissolving completely, sequentially adding aluminum hydroxide, silicon dioxide and titanium dioxide, dispersing for 30-40 min at 1500-2000 rpm by using a dispersing machine, and removing large-particle impurities by using a 200-mesh filter bag to obtain a finished product.
2. The preparation of a water-soluble protective gum according to claim 1, wherein: the molecular weight of the polyethylene glycol is 2000-8000, the molecular weight of the polyvinylpyrrolidone is 30000, the mass ratio of the polyvinylpyrrolidone to the polyethylene glycol is 1:1.5-5, the addition amount of the aluminum hydroxide, the silicon dioxide and the titanium dioxide filler is 61% of the mass of the polyvinylpyrrolidone and the polyethylene glycol, and the temperature resistant range is 100-120 ℃.
3. The preparation of a water-soluble protective gum according to claim 1, wherein: the particle size of the aluminum hydroxide is 50nm, and the addition proportion is 45% of the total mass of polyethylene glycol and PVP.
4. The preparation of a water-soluble protective gum according to claim 1, wherein: the silicon dioxide is hydrophilic gas phase silicon dioxide, the grain diameter is 12nm, and the addition amount is 8% of the total mass of polyethylene glycol and PVP.
5. The preparation of a water-soluble protective gum according to claim 1, wherein: the titanium dioxide is rutile titanium dioxide with the particle size of 250nm, and the addition amount is 8% of the total mass of polyethylene glycol and PVP.
6. The application of the water-soluble protective adhesive is characterized in that: the protective adhesive is suitable for temporary protection in the processing of circuit boards and glass cover plates in the process of lower than 120 ℃, vacuum plating and temporary fixation of coating films.
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CN202310338321.1A CN116218336A (en) | 2023-03-31 | 2023-03-31 | Preparation and application of water-soluble protective adhesive |
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CN202310338321.1A CN116218336A (en) | 2023-03-31 | 2023-03-31 | Preparation and application of water-soluble protective adhesive |
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Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005146046A (en) * | 2003-11-12 | 2005-06-09 | Denki Kagaku Kogyo Kk | Masking film |
CN101519556A (en) * | 2009-03-24 | 2009-09-02 | 汕头市龙湖昌丰化工有限公司 | Water-washable ink used in a packaging film local aluminum plating process and preparation method thereof |
CN101788765A (en) * | 2009-01-23 | 2010-07-28 | 潘治平 | Anti-corrosion water-based laser glue capable of being removed easily and ablated by laser |
KR20110038339A (en) * | 2009-10-08 | 2011-04-14 | 동우 화인켐 주식회사 | Protective film composition for laser dicing |
CN104231503A (en) * | 2014-08-15 | 2014-12-24 | 深圳市容大感光科技股份有限公司 | Water-soluble resin composition |
CN115216195A (en) * | 2022-08-31 | 2022-10-21 | 广东光华科技股份有限公司 | Application of resin composition in vehicle protection and vehicle |
-
2023
- 2023-03-31 CN CN202310338321.1A patent/CN116218336A/en active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005146046A (en) * | 2003-11-12 | 2005-06-09 | Denki Kagaku Kogyo Kk | Masking film |
CN101788765A (en) * | 2009-01-23 | 2010-07-28 | 潘治平 | Anti-corrosion water-based laser glue capable of being removed easily and ablated by laser |
CN101519556A (en) * | 2009-03-24 | 2009-09-02 | 汕头市龙湖昌丰化工有限公司 | Water-washable ink used in a packaging film local aluminum plating process and preparation method thereof |
KR20110038339A (en) * | 2009-10-08 | 2011-04-14 | 동우 화인켐 주식회사 | Protective film composition for laser dicing |
CN104231503A (en) * | 2014-08-15 | 2014-12-24 | 深圳市容大感光科技股份有限公司 | Water-soluble resin composition |
CN115216195A (en) * | 2022-08-31 | 2022-10-21 | 广东光华科技股份有限公司 | Application of resin composition in vehicle protection and vehicle |
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