CN110515271B - Photosensitive resin composition and application thereof - Google Patents
Photosensitive resin composition and application thereof Download PDFInfo
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- CN110515271B CN110515271B CN201910805266.6A CN201910805266A CN110515271B CN 110515271 B CN110515271 B CN 110515271B CN 201910805266 A CN201910805266 A CN 201910805266A CN 110515271 B CN110515271 B CN 110515271B
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- acrylate
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- photosensitive resin
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- 239000011342 resin composition Substances 0.000 title claims abstract description 36
- 239000000178 monomer Substances 0.000 claims abstract description 31
- 125000005587 carbonate group Chemical group 0.000 claims abstract description 18
- 239000011347 resin Substances 0.000 claims abstract description 13
- 229920005989 resin Polymers 0.000 claims abstract description 13
- 239000000654 additive Substances 0.000 claims abstract description 6
- 230000000996 additive effect Effects 0.000 claims abstract description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 26
- -1 2-ethylhexyl Chemical group 0.000 claims description 10
- 125000004432 carbon atom Chemical group C* 0.000 claims description 7
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 claims description 6
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 claims description 6
- 125000002947 alkylene group Chemical group 0.000 claims description 6
- 150000001875 compounds Chemical class 0.000 claims description 6
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 6
- PJAKWOZHTFWTNF-UHFFFAOYSA-N (2-nonylphenyl) prop-2-enoate Chemical compound CCCCCCCCCC1=CC=CC=C1OC(=O)C=C PJAKWOZHTFWTNF-UHFFFAOYSA-N 0.000 claims description 5
- 125000001140 1,4-phenylene group Chemical group [H]C1=C([H])C([*:2])=C([H])C([H])=C1[*:1] 0.000 claims description 5
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 4
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 claims description 4
- 125000000732 arylene group Chemical group 0.000 claims description 4
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 4
- 229910052739 hydrogen Inorganic materials 0.000 claims description 4
- 239000001257 hydrogen Substances 0.000 claims description 4
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 4
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 claims description 4
- RSWGJHLUYNHPMX-UHFFFAOYSA-N 1,4a-dimethyl-7-propan-2-yl-2,3,4,4b,5,6,10,10a-octahydrophenanthrene-1-carboxylic acid Chemical compound C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 3
- DIOZVWSHACHNRT-UHFFFAOYSA-N 2-(2-prop-2-enoxyethoxy)ethanol Chemical compound OCCOCCOCC=C DIOZVWSHACHNRT-UHFFFAOYSA-N 0.000 claims description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 229910052799 carbon Inorganic materials 0.000 claims description 3
- ZFTFAPZRGNKQPU-UHFFFAOYSA-N dicarbonic acid Chemical compound OC(=O)OC(O)=O ZFTFAPZRGNKQPU-UHFFFAOYSA-N 0.000 claims description 3
- YHLVIDQQTOMBGN-UHFFFAOYSA-N methyl prop-2-enyl carbonate Chemical compound COC(=O)OCC=C YHLVIDQQTOMBGN-UHFFFAOYSA-N 0.000 claims description 3
- MYWOJODOMFBVCB-UHFFFAOYSA-N 1,2,6-trimethylphenanthrene Chemical compound CC1=CC=C2C3=CC(C)=CC=C3C=CC2=C1C MYWOJODOMFBVCB-UHFFFAOYSA-N 0.000 claims description 2
- FDSUVTROAWLVJA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol;prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OCC(CO)(CO)COCC(CO)(CO)CO FDSUVTROAWLVJA-UHFFFAOYSA-N 0.000 claims description 2
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 claims description 2
- 125000006374 C2-C10 alkenyl group Chemical group 0.000 claims description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 2
- 239000002202 Polyethylene glycol Substances 0.000 claims description 2
- 244000028419 Styrax benzoin Species 0.000 claims description 2
- 235000000126 Styrax benzoin Nutrition 0.000 claims description 2
- 235000008411 Sumatra benzointree Nutrition 0.000 claims description 2
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 claims description 2
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 claims description 2
- 125000000217 alkyl group Chemical group 0.000 claims description 2
- 150000004056 anthraquinones Chemical class 0.000 claims description 2
- 239000002518 antifoaming agent Substances 0.000 claims description 2
- 229960002130 benzoin Drugs 0.000 claims description 2
- 239000012965 benzophenone Substances 0.000 claims description 2
- 150000008366 benzophenones Chemical class 0.000 claims description 2
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 claims description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 2
- ISAOCJYIOMOJEB-UHFFFAOYSA-N desyl alcohol Natural products C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 claims description 2
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 claims description 2
- 235000019382 gum benzoic Nutrition 0.000 claims description 2
- 239000003112 inhibitor Substances 0.000 claims description 2
- YDKNBNOOCSNPNS-UHFFFAOYSA-N methyl 1,3-benzoxazole-2-carboxylate Chemical compound C1=CC=C2OC(C(=O)OC)=NC2=C1 YDKNBNOOCSNPNS-UHFFFAOYSA-N 0.000 claims description 2
- NXPVXGMVVNYCGZ-VMPITWQZSA-N methyl [(e)-3-phenylprop-2-enyl] carbonate Chemical compound COC(=O)OC\C=C\C1=CC=CC=C1 NXPVXGMVVNYCGZ-VMPITWQZSA-N 0.000 claims description 2
- FEUIEHHLVZUGPB-UHFFFAOYSA-N oxolan-2-yl prop-2-enoate Chemical compound C=CC(=O)OC1CCCO1 FEUIEHHLVZUGPB-UHFFFAOYSA-N 0.000 claims description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 2
- 239000004014 plasticizer Substances 0.000 claims description 2
- 229920001223 polyethylene glycol Polymers 0.000 claims description 2
- 238000006116 polymerization reaction Methods 0.000 claims description 2
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 2
- 150000003440 styrenes Chemical class 0.000 claims description 2
- GJWMYLFHBXEWNZ-UHFFFAOYSA-N tert-butyl (4-ethenylphenyl) carbonate Chemical compound CC(C)(C)OC(=O)OC1=CC=C(C=C)C=C1 GJWMYLFHBXEWNZ-UHFFFAOYSA-N 0.000 claims description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-M Formate Chemical compound [O-]C=O BDAGIHXWWSANSR-UHFFFAOYSA-M 0.000 claims 1
- 239000012634 fragment Substances 0.000 abstract description 13
- 238000004519 manufacturing process Methods 0.000 abstract description 12
- 239000000853 adhesive Substances 0.000 abstract description 5
- 230000001070 adhesive effect Effects 0.000 abstract description 5
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 15
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 12
- 239000000243 solution Substances 0.000 description 10
- 238000011156 evaluation Methods 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 8
- 238000011161 development Methods 0.000 description 7
- 238000005530 etching Methods 0.000 description 7
- 239000010410 layer Substances 0.000 description 7
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 239000000126 substance Substances 0.000 description 5
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 4
- 230000003578 releasing effect Effects 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000002349 favourable effect Effects 0.000 description 3
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000001569 carbon dioxide Substances 0.000 description 2
- 229910002092 carbon dioxide Inorganic materials 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000005464 sample preparation method Methods 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 description 1
- 125000004182 2-chlorophenyl group Chemical group [H]C1=C([H])C(Cl)=C(*)C([H])=C1[H] 0.000 description 1
- GTELLNMUWNJXMQ-UHFFFAOYSA-N 2-ethyl-2-(hydroxymethyl)propane-1,3-diol;prop-2-enoic acid Chemical class OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.CCC(CO)(CO)CO GTELLNMUWNJXMQ-UHFFFAOYSA-N 0.000 description 1
- 125000003762 3,4-dimethoxyphenyl group Chemical group [H]C1=C([H])C(OC([H])([H])[H])=C(OC([H])([H])[H])C([H])=C1* 0.000 description 1
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- 229920001174 Diethylhydroxylamine Polymers 0.000 description 1
- 229920005682 EO-PO block copolymer Polymers 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- OAZWDJGLIYNYMU-UHFFFAOYSA-N Leucocrystal Violet Chemical compound C1=CC(N(C)C)=CC=C1C(C=1C=CC(=CC=1)N(C)C)C1=CC=C(N(C)C)C=C1 OAZWDJGLIYNYMU-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- NPKSPKHJBVJUKB-UHFFFAOYSA-N N-phenylglycine Chemical compound OC(=O)CNC1=CC=CC=C1 NPKSPKHJBVJUKB-UHFFFAOYSA-N 0.000 description 1
- 206010034972 Photosensitivity reaction Diseases 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 229960001506 brilliant green Drugs 0.000 description 1
- HXCILVUBKWANLN-UHFFFAOYSA-N brilliant green cation Chemical compound C1=CC(N(CC)CC)=CC=C1C(C=1C=CC=CC=1)=C1C=CC(=[N+](CC)CC)C=C1 HXCILVUBKWANLN-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- FVCOIAYSJZGECG-UHFFFAOYSA-N diethylhydroxylamine Chemical compound CCN(O)CC FVCOIAYSJZGECG-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000001056 green pigment Substances 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- PBOSTUDLECTMNL-UHFFFAOYSA-N lauryl acrylate Chemical compound CCCCCCCCCCCCOC(=O)C=C PBOSTUDLECTMNL-UHFFFAOYSA-N 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000036211 photosensitivity Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 150000003384 small molecules Chemical class 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000010557 suspension polymerization reaction Methods 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- DWWMSEANWMWMCB-UHFFFAOYSA-N tribromomethylsulfonylbenzene Chemical compound BrC(Br)(Br)S(=O)(=O)C1=CC=CC=C1 DWWMSEANWMWMCB-UHFFFAOYSA-N 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Materials For Photolithography (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention discloses a photosensitive resin composition and application thereof. The resin composition of the present invention comprises 40 to 70 parts by weight of an alkali-soluble resin, 20 to 50 parts by weight of a photopolymerizable monomer, 0.5 to 10.0 parts by weight of a photoinitiator, and 0.1 to 10.0 parts by weight of an additive; the photopolymerizable monomer comprises 0.5 to 15.0 parts by weight of a monomer containing a carbonate structure. The photosensitive resin composition is used as a dry film resist, has the characteristics of easy film stripping fracture, small film stripping fragments, high film stripping speed and the like, and has good line resolution and adhesive force, thereby effectively improving the production efficiency and the product yield.
Description
Technical Field
The invention belongs to the technical field of printed circuit boards, and particularly relates to a photosensitive resin composition and application thereof.
Background
In the field of printed wiring board production, photosensitive resin compositions are widely used as resist materials for etching or plating. With the development of light, thin, short and small electronic devices, the printed circuit board is required to be more highly refined and densified, which puts higher demands on the aspects of resolution, adhesion, development time, film stripping rate and the like of the photosensitive resist layer. The film removing is a key process in the manufacturing of the printed circuit board, the clean degree of the film removing of the board surface directly influences the production and the product yield of the subsequent process, and the film removing speed influences the production efficiency.
In a conventional process for manufacturing a printed wiring board, a resist pattern obtained is subjected to etching or plating to form a circuit on a substrate, and then the resist is peeled off from the board surface and removed, which is a film removal process. The film removing time is too long, so that the productivity is directly influenced, the production efficiency is low, the production period of the product is prolonged, and the cost is increased; the film is not completely removed, and partial anti-corrosion layer is remained on the board surface after the film is removed, which directly affects the next process such as incomplete etching, thereby increasing the rejection rate and lowering the yield. The fast film removing time and no residue after film removing are favorable for shortening the production period of products and reducing the production cost.
In order to improve the film-releasing property of the dry film resist, researchers have made many studies. Patent document CN108490737A discloses that by controlling the amount of ethylene oxide-propylene oxide block copolymer and the molar amount of ethylenically unsaturated double bonds in the photopolymerizable monomers, a dry film resist with characteristics of easy film breaking and fast film stripping speed is obtained, but the adhesion still has room for improvement. Patent document CN102144189B provides a photosensitive resin composition which is excellent in resolution, adhesion, and capping performance, but still has room for improvement in peeling performance, by adding ethylene oxide-modified polyoxyethylene (tris (1-phenylethyl)) phenyl ether.
In view of the above-mentioned drawbacks of the conventional dry film resists and the market demand, the present invention has developed a photosensitive resin composition which, when used as a dry film resist, has advantages of easy film removal, small film removal fragments, and high film removal speed.
Disclosure of Invention
In order to solve the defects in the prior art, the invention aims to provide a photosensitive resin composition and application thereof.
The photosensitive resin composition contains a monomer with a carbonate structure, the monomer can generate a high-molecular long chain with the carbonate structure after illumination reaction, and the carbonate structure in the long chain can quickly react with a strong-alkaline sodium hydroxide or potassium hydroxide stripping solution during stripping, so that the high-molecular long chain with the carbonate structure is broken to generate carbon dioxide. Therefore, when the photosensitive resin composition is used as a dry film resist, the photosensitive resin composition has the characteristics of easy film stripping fracture, small film stripping fragments, high film stripping speed and the like, and does not influence the resolution and the adhesive force of a circuit.
In order to achieve the purpose, the invention adopts the following technical scheme:
a photosensitive resin composition comprises 40-70 parts by weight of alkali-soluble resin, 20-50 parts by weight of photopolymerizable monomer, 0.5-10.0 parts by weight of photoinitiator and 0.1-10.0 parts by weight of additive; the photopolymerizable monomer comprises 0.5 to 15.0 parts by weight of a monomer containing a carbonate structure.
The alkali-soluble resin is obtained by copolymerizing two or more of methacrylic acid, methyl (meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, benzyl (meth) acrylate, styrene, and a styrene derivative.
Further, the alkali-soluble resin is prepared by solution polymerization or suspension polymerization.
Further, the weight average molecular weight of the alkali-soluble resin is 20000-150000, and the acid value of the resin is 100-350mg KOH/g; preferably, the weight average molecular weight of the alkali-soluble resin is 30000-120000, and the resin acid value is 120-250mg KOH/g.
The alkali soluble resin is preferably 40-70 parts by weight, if the weight is less than 40 parts, the photosensitive resin composition is easy to overflow glue and is not easy to store; if the weight part is more than 70 parts, there is an effect that there is a risk of low sensitivity and poor resolution.
Further, the photopolymerizable monomer contains an ethylenically unsaturated double bond monomer. Preferably, the photopolymerizable monomer comprises one or more of lauryl (meth) acrylate, stearyl (meth) acrylate, nonylphenol acrylate, ethoxylated (propoxylated) nonylphenol acrylate, isobornyl acrylate, tetrahydrofuryl acrylate, bisphenol a di (meth) acrylate, ethoxylated (propoxylated) bisphenol a di (meth) acrylate, polyethylene glycol (propylene glycol) di (meth) acrylate, ethoxylated (propoxylated) neopentyl glycol diacrylate, trimethylolpropane tri (meth) acrylate, ethoxylated (propoxylated) trimethylolpropane tri (meth) acrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate.
The above-mentioned photopolymerizable monomer is preferably 20 to 50 parts by weight, and if the amount is less than 20 parts by weight, the photosensitive resin composition tends to have problems of low sensitivity and low resolution; if the amount is more than 50 parts by weight, the photosensitive layer tends to bleed.
Further, the monomer containing a carbonate structure is one or more of the following three general structures:
wherein, in the above general formulae (1), (2) and (3), R1 is hydrogen or phenyl; r2 is hydrogen or methyl; r3 is a 1, 4-phenylene group or an alkylene group having 1 to 10 carbon atoms; r4 is a C1-10 straight chain or branched alkyl group or a C2-10 alkenyl group; r5 is acyclic-CH in a linear or branched alkylene group having 1 to 10 carbon atoms, an arylene group having 6 to 10 carbon atoms, or a linear or branched alkylene group having 1 to 10 carbon atoms or an arylene group having 6 to 10 carbon atoms2-optionally substituted by-O-, -S-or 1, 4-phenylene.
Further, said general formula (1) R4 is further preferably methyl, ethyl, tert-butyl; r5 is further preferably methyl, ethyl, 1, 4-phenylene.
Further, the weight part of the monomer having a carbonate structure is preferably 0.5 to 15.0 parts by weight, more preferably 1.0 to 12.0 parts by weight, from the viewpoint of film removal time and film size. If the weight part is less than 0.5, the film stripping time is obviously affected; if the weight part is more than 15.0, the size of the membrane is too small, which is not favorable for the collection and treatment of the waste membrane scraps.
Further, the monomer containing a carbonate structure is selected from one or more of cinnamyl methyl carbonate, tert-butyl allyl formate, tert-butyl 4-vinylphenyl carbonate, allyl methyl carbonate, bis (2-methallyl) carbonate and allyl diglycol dicarbonate.
Further, the photopolymerization initiator is one or more selected from the group consisting of benzoin ethers, benzophenones and derivatives thereof, thioxanthone-based compounds, anthraquinones and derivatives thereof, thioxanthone-based compounds, and hexaarylbisimidazole-based compounds.
Further, the additive is selected from one or more of a plasticizer, a defoaming agent and a polymerization inhibitor.
The invention also provides an application of the photosensitive resin composition as a dry film resist.
The invention has the following technical characteristics:
the photosensitive resin composition comprises a monomer with a carbonate structure, and a high-molecular long chain with the carbonate structure obtained by photopolymerization can quickly react with a strong-alkaline sodium hydroxide or potassium hydroxide stripping solution during stripping so as to realize the breaking of the high-molecular long chain with the carbonate structure. Therefore, when the photosensitive resin composition is used as a dry film resist, the photosensitive resin composition has the characteristics of easy film stripping fracture, small film stripping fragments, high film stripping speed and the like, and simultaneously has good line resolution and adhesive force, thereby effectively improving the production efficiency and the product yield.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the described embodiments of the invention without any inventive step, are within the scope of protection of the invention.
Unless defined otherwise, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this invention belongs.
First, examples 1-9 and comparative examples 1-2 specific components and weight ratios thereof (see Table 1)
(1) Alkali-soluble resin a: prepared by solution polymerization, the main component is methacrylic acid/methyl methacrylate/n-butyl methacrylate/lauryl acrylate/styrene-22/40/15/5/18 (Mw-80,000).
(2) Photopolymerizable monomer B:
b-1: (8) ethoxylated nonylphenol acrylate, molecular weight 626 (sartomer);
b-2: (9) ethoxylated dimethacrylate, molecular weight 598 (meiyuan);
b-3: (3) ethoxylated trimethylolpropane triacrylate, molecular weight 428 (sartomer);
b-4: allyl diglycol dicarbonate, (guanao biotechnology limited, Hubei);
b-5: allyl methyl carbonate, (guanao biotechnology limited, Hubei);
b-6: bis (2-methallyl) carbonate, (Guanao Biotech, Inc., Hubei).
(3) A photoinitiator C:
c-1: 2,2 ', 4-tris (2-chlorophenyl) -5- (3, 4-dimethoxyphenyl) -4', 5 '-diphenyl-1, 1' -diimidazole (a new powerful electron material in Changzhou);
c-2: n-phenylglycine (Western Asia chemical).
(4) And (3) an additive D:
d-1: brilliant green pigment (Shanghai Bailingwei chemical technology Co., Ltd.);
d-2: leuco crystal violet (Shanghai Bailingwei chemical technologies, Inc.);
d-3: tribromomethyl phenyl sulfone (Shanghai ladder love chemical industry);
d-4: n, N-diethylhydroxylamine (Shanghai Bailingwei chemical technology Co., Ltd.).
TABLE 1 weight ratios of the components of examples 1-9 and comparative examples 1-2
Second, preparation of photosensitive Dry films of examples and comparative examples
The preparation method comprises the following specific steps:
(1) mixing the components according to the proportion of the photosensitive resin composition in the table 1, adding acetone, and fully stirring until the acetone is completely dissolved to obtain a resin composition solution with the solid content of 40%;
(2) uniformly coating the resin composition solution on the surface of a PET (polyethylene terephthalate) support film with the thickness of 15 mu m by using a coating machine, and drying in an oven at 85 ℃ for 10min to form a dry film resist layer with the thickness of 35 mu m, wherein the dry film resist layer presents blue-green under a yellow light;
(3) and (3) attaching a polyethylene film protective layer with the thickness of 20 mu m to the surface of the dry film resist layer to obtain the photosensitive dry film with the 3-layer structure.
Third, sample preparation methods (including film pasting, exposure, development, etching, film removal), sample evaluation methods, and evaluation results of examples and comparative examples.
(1) Sample preparation method
[ FILM-APPLICATION ]
And polishing the copper surface of the copper-clad plate by a grinder, washing with water, and wiping to obtain a bright and fresh copper surface. The press roll temperature of the laminator is set to be 110 ℃, the conveying speed is 1.5m/min, and the hot lamination is carried out under the standard pressure.
[ Exposure ] to light
Standing the filmed sample for more than 15min, exposing with M-552 type parallel light exposure machine, testing photosensitivity with 41-stage exposure ruler, controlling exposure lattice number at 16-22 lattice, and exposing energy at 25-60mJ/cm2。
[ DEVELOPING ]
The exposed sample is kept stand for more than 15min at the developing temperature of 30 ℃ and the pressure of 1.2Kg/cm2The developing solution is 1 wt% sodium carbonate aqueous solution, the developing time is 1.5-2.0 times of the minimum developing time, and the developing solution is washed and dried.
[ ETCHING ] of
Acid etching with copper chloride (CuCl 2)/hydrochloric acid (HCL) system at 50 deg.C and 1.2Kg/cm2The specific weight of the etching solution is 1.20-1.30g/mL, the concentration of hydrochloric acid is 1.5mol/L, and the concentration of copper ions is 120-160 g/L.
[ DEFILLING ] OF FILM
The film stripping liquid is NaOH with the concentration of 3.0 wt%, the temperature is 50 ℃, the pressure is 1.2Kg/cm2, the film stripping time is 1.5-2.0 times of the minimum film stripping time, and the film is washed and dried after being stripped.
(2) Evaluation method
[ evaluation of film-Release Rate ]
The film stripping speed is evaluated by testing the film stripping time, and the shorter the film stripping time is, the faster the film stripping speed is.
[ evaluation of size of film-releasing fragment ]
Taking 1 substrate after film sticking, exposure and development, cutting into 5 x 5cm squares, placing the squares into a beaker filled with 100mL of stripping liquid (the concentration is 3 wt%, and the temperature is 50 ℃), magnetically stirring for 1min, and observing the size of stripping fragments.
Well: the size of the fragments is 10-20 mm; in general: the size of the fragments is 20-30 mm; difference: the size of the fragments is more than 30mm or less than 5 mm.
[ evaluation of resolution ]
After exposure using a mask having a wiring pattern with a width of 1:1 of the exposed portion and the unexposed portion and development with 1.5 times of the minimum development time, the minimum mask width where the cured resist line was normally formed was observed with a magnifying glass as a value of resolution.
[ evaluation of adhesion ]
A photosensitive dry film resist was laminated on a copper plate by hot-pressing a film, exposed to light using a mask having a wiring pattern with a width of n:400 of an exposed portion and an unexposed portion, developed for 1.5 times of the minimum development time, and then observed with a magnifying glass using the minimum mask width where a cured resist line was normally formed as a value of adhesion.
(3) The evaluation results of adhesion, resolution, film removal rate, and film removal debris size are shown in Table 2
The parts by weight of the carbonate structural monomers in the photopolymerizable monomers in examples 1-9 are in the range of 0.1 to 15.0, as can be seen from the comparison of examples 1-9 with comparative examples 1-2 in Table 2: examples 1-7 film removal fracture clean, film removal speed is fast, film removal fragment size is moderate, and resolution ratio, adhesion are better. The adhesion and resolution of examples 8-9 were good, but the film release debris was general. In comparative example 1, the addition of the carbonate structural monomer is 0, which causes incomplete film stripping and breakage, reduced film stripping speed, larger film stripping fragment size and reduced adhesive force; in comparative example 2, the carbonate structural monomer in an amount exceeding 15.0 parts by weight does not significantly affect the resolution and the adhesion properties, but the film-releasing fragments are too small in size, which is not favorable for the recovery of the film-releasing sheet and tends to block the pipes and nozzles.
TABLE 2 evaluation results of examples 1 to 9 and comparative examples 1 to 2
The photosensitive resin composition contains the monomer with the carbonate structure, the carbonate structure in the long chain can quickly react with a strong-alkaline sodium hydroxide or potassium hydroxide stripping solution during stripping, the carbonate structure is broken to generate carbon dioxide, and the long chain is decomposed into small molecules, so that the prepared resin composition has the characteristics of easy film stripping breakage, small film stripping fragments, high film stripping speed and the like when being used as a dry film resist, and meanwhile, the circuit resolution and the adhesive force are good, so that the production efficiency and the product yield are effectively improved.
The above description of the embodiments is only intended to facilitate the understanding of the method of the invention and its core ideas. It should be noted that, for those skilled in the art, it is possible to make various improvements and modifications to the present invention without departing from the principle of the present invention, and those improvements and modifications also fall within the scope of the claims of the present invention.
Claims (10)
1. A photosensitive resin composition is characterized in that the resin composition comprises 40-70 parts by weight of alkali-soluble resin, 20-50 parts by weight of photopolymerization monomer, 0.5-10.0 parts by weight of photoinitiator and 0.1-10.0 parts by weight of additive; the photopolymerization monomer comprises 0.5-15.0 parts by weight of a monomer containing a carbonate structure; wherein the monomer containing a carbonate structure is one or more of the following three general structures:
wherein, in the above general formulae (1), (2) and (3), R1 is hydrogen or phenyl; r2 is hydrogen or methyl; r3 represents a 1, 4-phenylene group or a group having a carbon atom1 to 10 alkylene groups; r4 is a C1-10 straight chain or branched alkyl group or a C2-10 alkenyl group; r5 is acyclic-CH in a linear or branched alkylene group having 1 to 10 carbon atoms, an arylene group having 6 to 10 carbon atoms, or a linear or branched alkylene group having 1 to 10 carbon atoms or an arylene group having 6 to 10 carbon atoms2-optionally substituted by-O-, -S-or 1, 4-phenylene.
2. The photosensitive resin composition according to claim 1, wherein the alkali-soluble resin is obtained by copolymerizing two or more selected from the group consisting of methacrylic acid, methyl (meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, benzyl (meth) acrylate, styrene and styrene derivatives.
3. The photosensitive resin composition according to claim 1, wherein the weight average molecular weight of the alkali-soluble resin is 20000-150000, and the resin acid value is 100-350mg KOH/g.
4. The photosensitive resin composition according to claim 3, wherein the weight average molecular weight of the alkali-soluble resin is 30000-120000, and the resin acid value is 120-250mg KOH/g.
5. The photosensitive resin composition according to claim 1, wherein the photopolymerizable monomer comprises an ethylenically unsaturated double bond monomer.
6. The photosensitive resin composition according to claim 5, wherein the photopolymerizable monomer comprises lauryl (meth) acrylate, stearyl (meth) acrylate, nonylphenol acrylate, ethoxylated (propoxylated) nonylphenol acrylate, isobornyl ester, tetrahydrofuryl acrylate, bisphenol a di (meth) acrylate, ethoxylated (propoxylated) bisphenol a di (meth) acrylate, polyethylene glycol (propylene glycol) di (meth) acrylate, ethoxylated (propoxylated) neopentyl glycol diacrylate, trimethylolpropane tri (meth) acrylate, ethoxylated (propoxylated) trimethylolpropane tri (meth) acrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate.
7. The photosensitive resin composition according to claim 1, wherein the carbonate structure-containing monomer is one or more selected from the group consisting of cinnamyl methylcarbonate, t-butylallyl formate, t-butyl 4-vinylphenyl carbonate, allyl methylcarbonate, bis (2-methallyl) carbonate, and allyl diglycol dicarbonate.
8. The photosensitive resin composition according to claim 1, wherein the photoinitiator is one or more selected from the group consisting of benzoin ethers, benzophenones and derivatives thereof, thioxanthone-based compounds, anthraquinones and derivatives thereof, thioxanthone-based compounds, and hexaarylbisimidazoles-based compounds.
9. The photosensitive resin composition according to claim 1, wherein the additive is one or more selected from the group consisting of a plasticizer, a defoaming agent, and a polymerization inhibitor.
10. Use of the photosensitive resin composition according to any one of claims 1 to 9 as a dry film resist.
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| PCT/CN2020/101205 WO2021036538A1 (en) | 2019-08-29 | 2020-07-10 | Photosensitive resin composition and application thereof |
| EP20856265.2A EP4024133A4 (en) | 2019-08-29 | 2020-07-10 | Photosensitive resin composition and application thereof |
| US17/436,628 US11827781B2 (en) | 2019-08-29 | 2020-07-10 | Photosensitive resin composition and use thereof |
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