CN110515271A - A kind of photosensitive polymer combination and its application - Google Patents
A kind of photosensitive polymer combination and its application Download PDFInfo
- Publication number
- CN110515271A CN110515271A CN201910805266.6A CN201910805266A CN110515271A CN 110515271 A CN110515271 A CN 110515271A CN 201910805266 A CN201910805266 A CN 201910805266A CN 110515271 A CN110515271 A CN 110515271A
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- Prior art keywords
- methyl
- acrylate
- photosensitive polymer
- weight
- polymer combination
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- Granted
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- 229920000642 polymer Polymers 0.000 title claims abstract description 30
- 239000000178 monomer Substances 0.000 claims abstract description 31
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 claims abstract description 20
- 238000006116 polymerization reaction Methods 0.000 claims abstract description 16
- 239000011347 resin Substances 0.000 claims abstract description 16
- 229920005989 resin Polymers 0.000 claims abstract description 16
- 229920002120 photoresistant polymer Polymers 0.000 claims abstract description 12
- 239000003513 alkali Substances 0.000 claims abstract description 11
- 239000000654 additive Substances 0.000 claims abstract description 7
- 230000000996 additive effect Effects 0.000 claims abstract description 7
- -1 (methyl) methyl Chemical group 0.000 claims description 23
- 229910052799 carbon Inorganic materials 0.000 claims description 15
- 150000002148 esters Chemical class 0.000 claims description 14
- 239000004258 Ethoxyquin Substances 0.000 claims description 10
- BAPJBEWLBFYGME-UHFFFAOYSA-N acrylic acid methyl ester Natural products COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 claims description 10
- DECIPOUIJURFOJ-UHFFFAOYSA-N ethoxyquin Chemical compound N1C(C)(C)C=C(C)C2=CC(OCC)=CC=C21 DECIPOUIJURFOJ-UHFFFAOYSA-N 0.000 claims description 10
- 229940093500 ethoxyquin Drugs 0.000 claims description 10
- 235000019285 ethoxyquin Nutrition 0.000 claims description 10
- 239000002253 acid Substances 0.000 claims description 8
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 8
- CERQOIWHTDAKMF-UHFFFAOYSA-N alpha-methacrylic acid Natural products CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 7
- 230000003647 oxidation Effects 0.000 claims description 7
- 238000007254 oxidation reaction Methods 0.000 claims description 7
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 6
- 125000001118 alkylidene group Chemical group 0.000 claims description 6
- 150000001875 compounds Chemical class 0.000 claims description 6
- 125000001140 1,4-phenylene group Chemical group [H]C1=C([H])C([*:2])=C([H])C([H])=C1[*:1] 0.000 claims description 5
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 5
- PJAKWOZHTFWTNF-UHFFFAOYSA-N (2-nonylphenyl) prop-2-enoate Chemical compound CCCCCCCCCC1=CC=CC=C1OC(=O)C=C PJAKWOZHTFWTNF-UHFFFAOYSA-N 0.000 claims description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 4
- 239000002585 base Substances 0.000 claims description 4
- 229940106691 bisphenol a Drugs 0.000 claims description 4
- 229910052739 hydrogen Inorganic materials 0.000 claims description 4
- 239000001257 hydrogen Substances 0.000 claims description 4
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 4
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 claims description 4
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 claims description 3
- 239000007983 Tris buffer Substances 0.000 claims description 3
- GNEPLYVYORHREW-UHFFFAOYSA-N 1,1,3,3,6-pentamethyl-7-nitro-2h-inden-5-amine Chemical compound CC1=C(N)C=C2C(C)(C)CC(C)(C)C2=C1[N+]([O-])=O GNEPLYVYORHREW-UHFFFAOYSA-N 0.000 claims description 2
- DIOZVWSHACHNRT-UHFFFAOYSA-N 2-(2-prop-2-enoxyethoxy)ethanol Chemical compound OCCOCCOCC=C DIOZVWSHACHNRT-UHFFFAOYSA-N 0.000 claims description 2
- FDSUVTROAWLVJA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol;prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OCC(CO)(CO)COCC(CO)(CO)CO FDSUVTROAWLVJA-UHFFFAOYSA-N 0.000 claims description 2
- 239000002202 Polyethylene glycol Substances 0.000 claims description 2
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 claims description 2
- 125000003342 alkenyl group Chemical group 0.000 claims description 2
- 125000000217 alkyl group Chemical group 0.000 claims description 2
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 claims description 2
- 150000004056 anthraquinones Chemical class 0.000 claims description 2
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 claims description 2
- 239000012965 benzophenone Substances 0.000 claims description 2
- 235000019253 formic acid Nutrition 0.000 claims description 2
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Substances C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims description 2
- 239000003112 inhibitor Substances 0.000 claims description 2
- CXHHBNMLPJOKQD-UHFFFAOYSA-N methyl hydrogen carbonate Chemical compound COC(O)=O CXHHBNMLPJOKQD-UHFFFAOYSA-N 0.000 claims description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 2
- 239000004014 plasticizer Substances 0.000 claims description 2
- 229920001223 polyethylene glycol Polymers 0.000 claims description 2
- 150000003440 styrenes Chemical class 0.000 claims description 2
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 claims description 2
- 125000004432 carbon atom Chemical group C* 0.000 claims 7
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims 2
- JGAALXVSFDPKRK-UHFFFAOYSA-N CC(C=C)(C)C.C(O)C(CC)(CO)CO Chemical group CC(C=C)(C)C.C(O)C(CC)(CO)CO JGAALXVSFDPKRK-UHFFFAOYSA-N 0.000 claims 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims 1
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 claims 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims 1
- 150000001336 alkenes Chemical class 0.000 claims 1
- 125000003118 aryl group Chemical group 0.000 claims 1
- 238000001802 infusion Methods 0.000 claims 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 claims 1
- YDKNBNOOCSNPNS-UHFFFAOYSA-N methyl 1,3-benzoxazole-2-carboxylate Chemical compound C1=CC=C2OC(C(=O)OC)=NC2=C1 YDKNBNOOCSNPNS-UHFFFAOYSA-N 0.000 claims 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 claims 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 claims 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 claims 1
- 239000000853 adhesive Substances 0.000 abstract description 13
- 230000001070 adhesive effect Effects 0.000 abstract description 13
- 239000012634 fragment Substances 0.000 abstract description 13
- 238000004519 manufacturing process Methods 0.000 abstract description 10
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 15
- HEMHJVSKTPXQMS-UHFFFAOYSA-M sodium hydroxide Inorganic materials [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 11
- 230000000052 comparative effect Effects 0.000 description 8
- 238000011156 evaluation Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 239000000243 solution Substances 0.000 description 8
- 150000001721 carbon Chemical group 0.000 description 7
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 6
- 238000011161 development Methods 0.000 description 6
- 238000005530 etching Methods 0.000 description 6
- 239000010410 layer Substances 0.000 description 6
- 239000007788 liquid Substances 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 4
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 239000011342 resin composition Substances 0.000 description 3
- 235000012773 waffles Nutrition 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- 239000001569 carbon dioxide Substances 0.000 description 2
- 229910002092 carbon dioxide Inorganic materials 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- YHLVIDQQTOMBGN-UHFFFAOYSA-N methyl prop-2-enyl carbonate Chemical compound COC(=O)OCC=C YHLVIDQQTOMBGN-UHFFFAOYSA-N 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- MYWOJODOMFBVCB-UHFFFAOYSA-N 1,2,6-trimethylphenanthrene Chemical compound CC1=CC=C2C3=CC(C)=CC=C3C=CC2=C1C MYWOJODOMFBVCB-UHFFFAOYSA-N 0.000 description 1
- YIWGJFPJRAEKMK-UHFFFAOYSA-N 1-(2H-benzotriazol-5-yl)-3-methyl-8-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carbonyl]-1,3,8-triazaspiro[4.5]decane-2,4-dione Chemical compound CN1C(=O)N(c2ccc3n[nH]nc3c2)C2(CCN(CC2)C(=O)c2cnc(NCc3cccc(OC(F)(F)F)c3)nc2)C1=O YIWGJFPJRAEKMK-UHFFFAOYSA-N 0.000 description 1
- 125000004343 1-phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])(*)C([H])([H])[H] 0.000 description 1
- NLGDWWCZQDIASO-UHFFFAOYSA-N 2-hydroxy-1-(7-oxabicyclo[4.1.0]hepta-1,3,5-trien-2-yl)-2-phenylethanone Chemical group OC(C(=O)c1cccc2Oc12)c1ccccc1 NLGDWWCZQDIASO-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- 125000003762 3,4-dimethoxyphenyl group Chemical group [H]C1=C([H])C(OC([H])([H])[H])=C(OC([H])([H])[H])C([H])=C1* 0.000 description 1
- YYPNJNDODFVZLE-UHFFFAOYSA-N 3-methylbut-2-enoic acid Chemical compound CC(C)=CC(O)=O YYPNJNDODFVZLE-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- 229920001174 Diethylhydroxylamine Polymers 0.000 description 1
- 229920005682 EO-PO block copolymer Polymers 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- DJOWTWWHMWQATC-KYHIUUMWSA-N Karpoxanthin Natural products CC(=C/C=C/C=C(C)/C=C/C=C(C)/C=C/C1(O)C(C)(C)CC(O)CC1(C)O)C=CC=C(/C)C=CC2=C(C)CC(O)CC2(C)C DJOWTWWHMWQATC-KYHIUUMWSA-N 0.000 description 1
- OAZWDJGLIYNYMU-UHFFFAOYSA-N Leucocrystal Violet Chemical compound C1=CC(N(C)C)=CC=C1C(C=1C=CC(=CC=1)N(C)C)C1=CC=C(N(C)C)C=C1 OAZWDJGLIYNYMU-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- NPKSPKHJBVJUKB-UHFFFAOYSA-N N-phenylglycine Chemical compound OC(=O)CNC1=CC=CC=C1 NPKSPKHJBVJUKB-UHFFFAOYSA-N 0.000 description 1
- 206010034960 Photophobia Diseases 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- OKKRPWIIYQTPQF-UHFFFAOYSA-N Trimethylolpropane trimethacrylate Chemical compound CC(=C)C(=O)OCC(CC)(COC(=O)C(C)=C)COC(=O)C(C)=C OKKRPWIIYQTPQF-UHFFFAOYSA-N 0.000 description 1
- 238000013019 agitation Methods 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000011001 backwashing Methods 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- IAQRGUVFOMOMEM-UHFFFAOYSA-N but-2-ene Chemical group CC=CC IAQRGUVFOMOMEM-UHFFFAOYSA-N 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 1
- FVCOIAYSJZGECG-UHFFFAOYSA-N diethylhydroxylamine Chemical compound CCN(O)CC FVCOIAYSJZGECG-UHFFFAOYSA-N 0.000 description 1
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 1
- KZTYYGOKRVBIMI-UHFFFAOYSA-N diphenyl sulfone Chemical compound C=1C=CC=CC=1S(=O)(=O)C1=CC=CC=C1 KZTYYGOKRVBIMI-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 125000000219 ethylidene group Chemical group [H]C(=[*])C([H])([H])[H] 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000001056 green pigment Substances 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 235000003642 hunger Nutrition 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- PBOSTUDLECTMNL-UHFFFAOYSA-N lauryl acrylate Chemical compound CCCCCCCCCCCCOC(=O)C=C PBOSTUDLECTMNL-UHFFFAOYSA-N 0.000 description 1
- 208000013469 light sensitivity Diseases 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- WRAQQYDMVSCOTE-UHFFFAOYSA-N phenyl prop-2-enoate Chemical compound C=CC(=O)OC1=CC=CC=C1 WRAQQYDMVSCOTE-UHFFFAOYSA-N 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 150000003384 small molecules Chemical class 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Materials For Photolithography (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention discloses a kind of photosensitive polymer combination and its applications.Resin combination of the invention includes the alkali soluble resin of 40-70 parts by weight, the photo polymerization monomer of 20-50 parts by weight, 0.5-10.0 parts by weight photoinitiator and 0.1-10.0 parts by weight additive；The photo polymerization monomer includes the monomer containing structural carbonate of 0.5-15.0 parts by weight.The photosensitive polymer combination is used as dry film photoresist, has and moves back film easy fracture, moves back that film fragment is smaller, characteristics such as fast of moving back film speed, while route resolution ratio, adhesive force is good, to effectively improve production efficiency and product yield.
Description
Technical field
The invention belongs to printed wiring board technical fields, more particularly to a kind of photosensitive polymer combination and its application.
Background technique
In the manufacturing field of printed circuit board, photosensitive polymer combination is widely used as used in etching or plating
Anticorrosive additive material.As electronic equipment is towards light and short development, printed circuit board more High precision, highly dense is required accordingly
Degreeization, this just to the resolution ratio of photosensitive resist layer, adhesive force, developing time and moves back film rate etc. and proposes higher want
It asks.Wherein, moving back film is one of critical process in print circuit plates making, and plate face moves back film clean level and directly affects subsequent handling
Production and product yield, move back film speed influence production efficiency.
During conventional print circuit plates making, for resist pattern obtained implement etching or electroplating processes and
After forming circuit on substrate, resist layer is removed to removing from plate face, this process is to move back membrane process.Move back film overlong time meeting
Productivity is directly affected, causes production efficiency low, life cycle of the product extends cost increase；It is unclean to move back film, moves back after film i.e.
There is part resist layer to remain in plate face, this will have a direct impact on lower step process and such as etches not clean, cause scrappage to increase, yield is low
Under.Moving back the film time faster and moving back film noresidue helps to shorten life cycle of the product, reduces production cost.
In order to improve the film properties that move back of dry film photoresist, research workers have done many researchs.Patent document
Olefinic insatiable hunger in the dosage and photo polymerization monomer that CN108490737A passes through regulation ethylene oxide-propylene oxide block copolymer
It with double bond mole, is made with moving back film easy fracture, move back the dry film photoresist for the characteristics such as film speed is fast, but adhesive force still has promotion
Space.Patent document CN102144189B provides a kind of photosensitive polymer combination, passes through the polyoxy of addition ethylene oxide modification
Ethylidene (three (1- phenylethyl)) phenyl ether, resolution ratio, adhesive force, cap bore are had excellent performance, but stripping performance still has improvement
Leeway.
To sum up, the present invention is directed to the defect and the market demand of above-mentioned existing dry film photoresist, develops a kind of photonasty tree
Oil/fat composition when the resin combination is used as dry film photoresist, has and moves back film easy fracture, moves back that film fragment is smaller, it is fast to move back film speed
The advantages that.
Summary of the invention
In order to solve defect existing in the prior art, the purpose of the present invention is to provide a kind of photosensitive polymer combinations
And its application.
Containing the monomer of structural carbonate in photosensitive polymer combination of the invention, monomer can give birth to after illumination reaction
At the high polymer long chain with structural carbonate, at the time of film withdrawal the structural carbonate in long-chain can rapidly with the hydrogen-oxygen of strong basicity
Change sodium or potassium hydroxide moves back film liquid reaction, to realize that the high polymer long chain fracture of structural carbonate generates carbon dioxide.Therefore,
When photosensitive polymer combination of the invention is used as dry film photoresist, has and move back film easy fracture, move back that film fragment is smaller, moves back film speed
The characteristics such as fast, while route resolution ratio, adhesive force are not influenced.
To achieve the above object, the present invention takes following technical scheme:
A kind of photosensitive polymer combination, the resin combination include the alkali soluble resin of 40-70 parts by weight, 20-50 weight
The photo polymerization monomer, 0.5-10.0 parts by weight photoinitiator and 0.1-10.0 parts by weight additive of part；The photo polymerization monomer packet
Include the monomer containing structural carbonate of 0.5-15.0 parts by weight.
Further, the alkali soluble resin is by methacrylic acid, (methyl) methyl acrylate, (methyl) acrylic acid second
Ester, (methyl) butyl acrylate, (methyl) 2-ethylhexyl acrylate, (methyl) acrylic acid -2- hydroxyl ethyl ester, (methyl) propylene
Acid benzyl ester, styrene, two or more in styrene derivative are copolymerized.
Further, the alkali soluble resin is prepared by polymerisation in solution or suspension polymerisation.
Further, the weight average molecular weight of the alkali soluble resin is 20000-150000, resinous acid value 100-
350mg KOH/g；Preferably, the weight average molecular weight of the alkali soluble resins is 30000- 120000, resinous acid value 120-
250mg KOH/g。
The preferred 40-70 parts by weight of the parts by weight of above-mentioned alkali soluble resin, if parts by weight are lower than 40 parts, photonasty tree
Oil/fat composition is easy excessive glue, not easy to maintain；If parts by weight are higher than 70 parts, it will affect there are sensitivity lowly and resolution ratio be poor
Risk.
Further, the photo polymerization monomer includes ethylenical unsaturated double bonds monomer.Preferably, the photo polymerization monomer packet
Containing (methyl) lauryl acrylate, (methyl) octadecyl acrylate, nonyl phenol acrylate, ethoxyquin (the third oxidation) nonyl
Base phenol acrylate, isobornyl thiocyanoacetate, acrylic acid tetrahydrofuran methyl esters, bisphenol-A two (methyl) acrylate, ethoxyquin (the third oxygen
Change) bisphenol-A two (methyl) acrylate, polyethylene glycol (propylene glycol) two (methyl) acrylate, ethoxyquin (the third oxidation) new penta
Omega-diol diacrylate, trimethylolpropane tris (methyl) acrylate, ethoxyquin (the third oxidation) trimethylolpropane tris (first
Base) acrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, Dipentaerythritol Pentaacrylate, two seasons penta
One of six acrylate of tetrol is a variety of.
The parts by weight of above-mentioned photo polymerization monomer, preferably 20-50 parts by weight, if parts by weight are lower than 20 parts, photonasty tree
Oil/fat composition is easy to produce the problem of low sensitivity and low resolution；If parts by weight are higher than 50 parts, photosensitive layer can be easy excessive glue.
Further, the monomer containing structural carbonate is one of following three kinds of general formula structures or a variety of:
,
,
；
Wherein, in above-mentioned general formula (1), (2) and (3), R1 is hydrogen or phenyl；R2 is hydrogen or methyl；R3 be 1,4- phenylene,
Or the alkylidene of carbon atom number 1 ~ 10；R4 is the linear or branched alkyl group of carbon atom number 1 ~ 10 or the alkenyl of carbon atom number 2 ~ 10；
R5 is the straight of the linear chain or branched chain alkylidene of carbon atom number 1 ~ 10, the arlydene of carbon atom number 6 ~ 10 or carbon atom number 1~10
Chain or branched alkylidene, carbon atom number 6-10 arlydene in acyclic-CH2Optionally by-O- ,-S- or 1,4- phenylene is taken
The group that generation obtains.
Further, the further preferred methyl of general formula (1) R4, ethyl, tert-butyl；The further preferred methyl of R5, second
Base, 1,4- phenylene.
Further, the parts by weight of the monomer containing structural carbonate consider from film time and diaphragm size is moved back, excellent
Select 0.5-15.0 parts by weight, more preferable 1.0-12.0 parts by weight.If parts by weight are lower than 0.5, the time for moving back film can be significantly affected；
If parts by weight are higher than 15.0, diaphragm size is too small, is unfavorable for the collection processing of useless film bits.
Further, the monomer containing structural carbonate is selected from methyl carbonic acid cinnamic ester, formic acid tert-butyl allyl
Ester, tert-butyl 4- ethenylphenyl carbonic ester, Allyl methyl carbonate, bis- (2- methacrylic) carbonic esters, allyl two
One of two carbonic ester of glycol is a variety of.
Further, the Photoepolymerizationinitiater initiater is selected from benzoin ether, benzophenone and its derivative, thioxanthone system class
One of compound, anthraquinone and its derivative, thioxanthones series compound, hexa-aryl bi-imidazole series compound are a variety of.
Further, the additive is selected from one or more of plasticizer, defoaming agent, polymerization inhibitor.
The present invention also provides the purposes that a kind of above-mentioned photosensitive polymer combination is used as dry film photoresist.
The present invention has following technical characterstic:
Photosensitve resin composition of the invention includes the monomer of structural carbonate, and what photopolymerization obtained has structural carbonate
High polymer long chain rapidly can move back film liquid with the sodium hydroxide of strong basicity or potassium hydroxide at the time of film withdrawal and react, to realize carbon
The fracture of the high polymer long chain of acrylate structure.Therefore, when photosensitive polymer combination of the invention is used as dry film photoresist, have
It moves back film easy fracture, move back that film fragment is smaller, characteristics such as fast of moving back film speed, while route resolution ratio, adhesive force is good, thus effectively
Improve production efficiency and product yield.
Specific embodiment
It in order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below will be to the embodiment of the present invention
Technical solution carries out clear, complete description.Obviously, described embodiment is a part of the embodiments of the present invention, rather than
Whole embodiments.Based on described the embodiment of the present invention, those of ordinary skill in the art are without creative work
Under the premise of every other embodiment obtained, belong to protection scope of the present invention.
Unless otherwise defined, technical term or scientific term used in the disclosure are should be in fields of the present invention
The ordinary meaning for thering is the personage of general technical ability to be understood.
One, in embodiment 1-9 and comparative example 1-2 photosensitive polymer combination specific ingredient and its weight proportion (referring to table
1)
(1) alkali soluble resins A: being prepared using polymerisation in solution, and main component is methacrylic acid/methyl methacrylate/methyl
N-butyl acrylate/lauryl acrylate/styrene=22/40/15/5/18(Mw=80,000).
(2) photo polymerization monomer B:
B-1:(8) ethoxylated nonylphenol acrylate, molecular weight 626 (Sartomer)；
B-2:(9) ethoxyquin dimethylacrylate, molecular weight 598 (U.S. source)；
B-3:(3) ethoxyquin trimethylolpropane trimethacrylate, molecular weight 428 (Sartomer)；
B-4: two carbonic ester of allyl diglycol, (Hubei Guang Ao Biotechnology Co., Ltd)；
B-5: Allyl methyl carbonate, (Hubei Guang Ao Biotechnology Co., Ltd)；
B-6: bis- (2- methacrylic) carbonic esters, (Hubei Guang Ao Biotechnology Co., Ltd).
(3) photoinitiator C:
C-1:2,2 ', 4- tri- (2- chlorphenyl) -5- (3,4- Dimethoxyphenyl) -4 ', 5 '-diphenyl -1,1 '-diimidazole is (often
State electronic strong new material)；
C-2:N- phenylglycine (West Asia chemistry).
(4) additive D:
D-1: magnificent green pigment (Shanghai lark waffle Technology Co., Ltd.)；
D-2: leuco crystal violet (Shanghai lark waffle Technology Co., Ltd.)；
D-3: trisbromomethyl phenyl sulfone (the uncommon love chemical industry of Shanghai ladder)；
D-4:N, N- diethyl hydroxylamine (Shanghai lark waffle Technology Co., Ltd.).
The weight proportion of table 1 embodiment 1-9 and comparative example 1-2 each component
Two, the preparation of embodiment and comparative example photosensitive dry film
Specific preparation process is as follows:
(1) according to the proportion of photosensitive polymer combination each component in table 1, each component is mixed, acetone is then added, sufficiently stirs
It mixes and obtains the resin composition solution that solid content is 40% to being completely dissolved；
(2) PET that above-mentioned resin composition solution is uniformly coated on 15 μm of thickness is supported into film surface using coating machine, is placed on 85
10min is dried in DEG C baking oven, forms the dry film photoresist layer with a thickness of 35 μm, blue-green is presented under yellow fluorescent lamp；
It (3) is 20 μm of polyethylene film protective layer to get the sense for having arrived 3-tier architecture in dry film photoresist layer surface coating thickness
Light dry film.
Three, the sample production method (including pad pasting, exposure, development, etch, move back film) of embodiment and comparative example, sample are commented
Valence method and evaluation result.
(1) sample production method
[pad pasting]
Copper-clad plate is processed by shot blasting its copper surface through sander, washes, dries, obtains bright fresh copper surface.If
Setting laminator roller temperature is 110 DEG C, conveying speed 1.5m/min, thermal-adhering under normal pressure.
[exposure]
Sample stands 15min or more after pad pasting, is exposed, is used using the holy science and technology M-552 type parallel exposing machine of will
41 rank exposure guide rule of stouffer carries out light sensitivity test, and exposure lattice number control is in 16-22 lattice, exposure energy 25-60mJ/
cm2。
[development]
Exposed sample stand 15min or more, 30 DEG C of development temperature, pressure 1.2Kg/cm2, developer solution is the sodium carbonate of 1%wt
Aqueous solution, developing time are 1.5-2.0 times of minimum developing time, wash, dry after development.
[etching]
Acid etching, etching solution be copper chloride (CuCl2)/hydrochloric acid (HCL) system, 50 DEG C of etch temperature, pressure 1.2Kg/cm2,
Etching solution specific gravity 1.20-1.30g/mL, concentration of hydrochloric acid 1.5mol/L, copper ion concentration 120-160g/L.
[moving back film]
Moving back film liquid is NaOH, and concentration 3.0wt%, temperature 50 C, pressure 1.2Kg/cm2, moving back the film time is that minimum moves back the film time
1.5-2.0 times, move back washing, drying after film.
(2) evaluation method
[moving back film speed evaluation]
The film time is moved back by test and to evaluate moves back film speed, and it is shorter to move back the film time, and it is faster to move back film speed.
[moving back the evaluation of film fragment size]
1 piece of substrate after taking pad pasting, exposure, development, is cut into the square of 5*5cm, is put into and fills 100mL and move back film liquid (concentration
3wt%, temperature 50 C) beaker in, after magnetic agitation 1min, observation move back film fragment size.
It is good: fragment size 10-20mm；It is general: fragment size 20-30mm；Difference: fragment size 30mm or more or 5mm or less.
[evaluation of resolution ratio]
It is exposed using the mask for the wiring pattern that the width with exposed portion and unexposed portion is 1:1, it is aobvious with minimum
The 1.5 of shadow time show movie queen, will normally form the minimum mask width for solidifying resist line as the value of resolution ratio, have utilized
Magnifying glass is observed.
[evaluation of adhesive force]
Photosensitive dry film resist is laminated on copper sheet by hot pressing pad pasting, utilizes the width with exposed portion and unexposed portion
Mask for the wiring pattern of n:400 is exposed, and shows movie queen with the 1.5 of minimum developing time, will normally form solidification
Value of the minimum mask width of resist line as adhesive force, is observed using magnifying glass.
(3) adhesive force, resolution ratio, the evaluation result moved back film speed, move back film fragment size are shown in Table 2
The parts by weight of structural carbonate monomer are within the scope of 0.1-15.0 in photo polymerization monomer in embodiment 1-9, by implementing in table 2
The comparison of example 1-9 and comparative example 1-2 are can be found that: embodiment 1-7 moves back that film fracture is clean, moves back film speed fastly, moves back film fragment size
It is moderate, and resolution ratio, adhesive force are preferable.The adhesive force of embodiment 8-9, resolution ratio are preferable, but it is general to move back film fragment.Comparative example
In 1, structural carbonate monomer additional amount is 0, and it is unclean to lead to move back film fracture, moves back the decline of film speed, and it is larger to move back film chip size,
Adhesive force decline；In comparative example 2, structural carbonate monomer weight part is more than 15.0, though to resolution ratio, adhesion performance without obvious
It influences, but moves back that film chip size is too small, be unfavorable for moving back the recovery processing of diaphragm, easily blocking pipeline, nozzle.
The evaluation result of table 2 embodiment 1-9 and comparative example 1-2
Containing the monomer of structural carbonate in photosensitive polymer combination of the invention, the structural carbonate in long-chain at the time of film withdrawal
Film liquid rapidly can be moved back with the sodium hydroxide of strong basicity or potassium hydroxide to react, structural carbonate fracture generates carbon dioxide, long
Chain resolves into small molecule, when so that obtained resin combination being used as dry film photoresist, has and moves back film easy fracture, moves back film fragment
It is smaller, move back the characteristics such as film speed is fast, while route resolution ratio, adhesive force are preferable, to effectively improve production efficiency and product
Yield.
The method of the present invention that the above embodiments are only used to help understand and its core concept.It should be pointed out that for
For those skilled in the art, without departing from the principle of the present invention, if can also be carried out to the present invention
Dry improvement and modification, these improvement and modification are also fallen into the claims in the present invention protection scope.
Claims (10)
1. a kind of photosensitive polymer combination, which is characterized in that the resin combination includes the alkali-soluble tree of 40-70 parts by weight
Rouge, the photo polymerization monomer of 20-50 parts by weight, 0.5-10.0 parts by weight photoinitiator and 0.1-10.0 parts by weight additive；It is described
Photo polymerization monomer includes the monomer containing structural carbonate of 0.5-15.0 parts by weight.
2. photosensitive polymer combination according to claim 1, which is characterized in that the alkali soluble resin is by methyl-prop
Olefin(e) acid, (methyl) methyl acrylate, (methyl) ethyl acrylate, (methyl) butyl acrylate, (methyl) acrylic acid-2-ethyl are
Ester, (methyl) acrylic acid -2- hydroxyl ethyl ester, (methyl) benzyl acrylate, styrene, two kinds or two kinds in styrene derivative with
On be copolymerized.
3. photosensitive polymer combination according to claim 1, which is characterized in that the weight of the alkali soluble resin is equal
Molecular weight is 20000-150000, and resinous acid value is 100-350mg KOH/g.
4. photosensitive polymer combination according to claim 3 again, which is characterized in that the alkali soluble resins is divided equally
Son amount is 30000- 120000, and resinous acid value is 120-250mg KOH/g.
5. photosensitive polymer combination according to claim 1, which is characterized in that the photo polymerization monomer includes olefinic
Unsaturated double-bond monomer, it is preferred that the photo polymerization monomer includes (methyl) lauryl acrylate, (methyl) octadecyl
Base ester, nonyl phenol acrylate, ethoxyquin (the third oxidation) nonyl phenol acrylate, isobornyl thiocyanoacetate, acrylic acid tetrahydrofuran
Methyl esters, bisphenol-A two (methyl) acrylate, ethoxyquin (third oxidation) bisphenol-A two (methyl) acrylate, polyethylene glycol (the third two
Alcohol) two (methyl) acrylate, ethoxyquin (the third oxidation) neopentylglycol diacrylate, trimethylolpropane tris (methyl) propylene
Acid esters, ethoxyquin (the third oxidation) trimethylolpropane tris (methyl) acrylate, pentaerythritol triacrylate, pentaerythrite four
One of acrylate, Dipentaerythritol Pentaacrylate, dipentaerythritol hexaacrylate are a variety of.
6. photosensitive polymer combination according to claim 1, which is characterized in that the monomer containing structural carbonate
For one of following three kinds of general formula structures or a variety of:
,
,
；
Wherein, in above-mentioned general formula (1), (2) and (3), R1 is hydrogen or phenyl；R2 is hydrogen or methyl；R3 be 1,4- phenylene,
Or the alkylidene of carbon atom number 1 ~ 10；R4 is the linear or branched alkyl group of carbon atom number 1 ~ 10 or the alkenyl of carbon atom number 2 ~ 10；
R5 is the straight of the linear chain or branched chain alkylidene of carbon atom number 1 ~ 10, the arlydene of carbon atom number 6 ~ 10 or carbon atom number 1~10
Chain or branched alkylidene, carbon atom number 6-10 arlydene in acyclic-CH2Optionally by-O- ,-S- or 1,4- phenylene is taken
The group that generation obtains.
7. photosensitive polymer combination according to claim 1, which is characterized in that the monomer containing structural carbonate
Selected from methyl carbonic acid cinnamic ester, formic acid tert-butyl allyl ester, tert-butyl 4- ethenylphenyl carbonic ester, allyl methyl carbonic acid
Ester, bis- (2- methacrylic) carbonic esters, one of two carbonic ester of allyl diglycol or a variety of.
8. photosensitive polymer combination according to claim 1, which is characterized in that the Photoepolymerizationinitiater initiater, which is selected from, rests in peace
Fragrant ether, benzophenone and its derivative, thioxanthone system class compound, anthraquinone and its derivative, thioxanthones series compound, six
One of aryl bi-imidazole series compound is a variety of.
9. photosensitive polymer combination according to claim 1, which is characterized in that the additive is selected from plasticizer, disappears
One or more of infusion, polymerization inhibitor.
10. the purposes that a kind of photosensitive polymer combination of any of claims 1-9 is used as dry film photoresist.
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| CN201910805266.6A CN110515271B (en) | 2019-08-29 | 2019-08-29 | Photosensitive resin composition and application thereof |
| EP20856265.2A EP4024133A4 (en) | 2019-08-29 | 2020-07-10 | Photosensitive resin composition and application thereof |
| US17/436,628 US11827781B2 (en) | 2019-08-29 | 2020-07-10 | Photosensitive resin composition and use thereof |
| PCT/CN2020/101205 WO2021036538A1 (en) | 2019-08-29 | 2020-07-10 | Photosensitive resin composition and application thereof |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021036538A1 (en) * | 2019-08-29 | 2021-03-04 | 浙江福斯特新材料研究院有限公司 | Photosensitive resin composition and application thereof |
| CN112578633A (en) * | 2020-11-30 | 2021-03-30 | 珠海市能动科技光学产业有限公司 | Photoresist |
| CN113176706A (en) * | 2021-04-27 | 2021-07-27 | 浙江福斯特新材料研究院有限公司 | Dry film resist composition |
| CN113388280A (en) * | 2021-08-03 | 2021-09-14 | 上海电动工具研究所（集团）有限公司 | Ultraviolet light curable mixture |
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| CN1384399A (en) * | 2001-04-19 | 2002-12-11 | 希普雷公司 | Photoresist composition |
| CN101987880A (en) * | 2009-08-04 | 2011-03-23 | 锦湖石油化学株式会社 | Novel copolymer and photoresist composition comprising the same |
| CN106444279A (en) * | 2015-08-13 | 2017-02-22 | 太阳油墨制造株式会社 | Photosensitive resin composition, dry film, and printed circuit board (PCB) |
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| CN1384399A (en) * | 2001-04-19 | 2002-12-11 | 希普雷公司 | Photoresist composition |
| CN101987880A (en) * | 2009-08-04 | 2011-03-23 | 锦湖石油化学株式会社 | Novel copolymer and photoresist composition comprising the same |
| CN106444279A (en) * | 2015-08-13 | 2017-02-22 | 太阳油墨制造株式会社 | Photosensitive resin composition, dry film, and printed circuit board (PCB) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021036538A1 (en) * | 2019-08-29 | 2021-03-04 | 浙江福斯特新材料研究院有限公司 | Photosensitive resin composition and application thereof |
| CN112578633A (en) * | 2020-11-30 | 2021-03-30 | 珠海市能动科技光学产业有限公司 | Photoresist |
| CN112578633B (en) * | 2020-11-30 | 2022-04-29 | 珠海市能动科技光学产业有限公司 | Photoresist |
| CN113176706A (en) * | 2021-04-27 | 2021-07-27 | 浙江福斯特新材料研究院有限公司 | Dry film resist composition |
| CN113176706B (en) * | 2021-04-27 | 2024-05-28 | 杭州福斯特电子材料有限公司 | Dry film resist composition |
| CN113388280A (en) * | 2021-08-03 | 2021-09-14 | 上海电动工具研究所（集团）有限公司 | Ultraviolet light curable mixture |
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