CN114839839A - Photosensitive resin composition and dry film anti-corrosion laminated body - Google Patents
Photosensitive resin composition and dry film anti-corrosion laminated body Download PDFInfo
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- CN114839839A CN114839839A CN202210541232.2A CN202210541232A CN114839839A CN 114839839 A CN114839839 A CN 114839839A CN 202210541232 A CN202210541232 A CN 202210541232A CN 114839839 A CN114839839 A CN 114839839A
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- acrylate
- methyl
- resin composition
- photosensitive resin
- vinyl carbamate
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
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- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
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- Structural Engineering (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention relates to a photosensitive resin composition and a dry film resist, belonging to the technical field of printed circuit boards. A photosensitive resin composition comprising the following components: alkali-soluble resin, photopolymerizable monomer, photoinitiator; the photopolymerizable monomer includes vinyl carbamate. The vinyl carbamate monomer is added into the photosensitive resin composition, and the monomer has the structure rigidity and the flexibility of the connecting chain segment, so that the dry film resist layer has better flexibility and adhesiveness, shows better hole masking performance and electroplating resistance, and simultaneously ensures better resolution and adhesion.
Description
Technical Field
The invention relates to a photosensitive resin composition and a dry film corrosion-resistant laminated body, belonging to the technical field of printed circuit boards.
Background
In the manufacture of printed circuit boards, photosensitive resin compositions used as resist materials for pattern transfer in etching or plating and dry film resists containing the photosensitive resin compositions are widely used.
In the manufacture of circuit boards, a dry film resist is generally attached to a copper substrate, and after exposure, the unexposed portions of the dry film resist are dissolved or dispersed and removed by a developer, and then etched or electroplated to form a pattern, and finally the cured resist pattern is removed by stripping the resist film.
During etching, the copper layer is removed by using an acidic etching solution, and if the adhesion between the dry film resist and the copper surface is not enough, the etching solution can penetrate between the dry film resist and the copper surface, so that the resist circuit is raised, the copper required to form a circuit is etched, the circuit with a narrow top and a wide bottom is generated, or even the circuit is broken. Therefore, the dry film resist layer is required to have good hole-masking property, good adhesion to the copper surface, and the like. During electroplating, gantry plating and VCP plating are adopted at present, the VCP plating with more environment-friendly process and better plating uniformity is jet plating, a dry film resist layer needs to resist the pressure of jet, meanwhile, the VCP plating with better plating uniformity needs to resist the penetration of electroplating liquid between the dry film resist layer and a substrate layer, otherwise, the VCP plating can cause diffusion plating short circuit, and therefore the dry film resist layer is required to have better impact resistance and good adhesiveness, namely, the dry film resist layer is required to have better flexibility and plating resistance.
Two of the most important properties in dry film resist are resolution and adhesion, and in general, the prior art mainly improves the resolution and adhesion by reducing the film thickness of the dry film resist, reducing the molecular weight of the alkali-soluble resin, increasing the content of a monomer having a benzene ring in the alkali-soluble resin, selecting a photopolymerizable monomer having multiple functionalities, and the like. However, these methods simultaneously affect the properties of dry film resist such as hole masking, flexibility, plating resistance, etc., and the production of downstream clients, and cause company losses.
CN202110326233 adds a modified polyethyleneimine compound to the photosensitive resin composition to provide flexibility required for a dry film resist, thereby obtaining good hole-masking performance.
Japanese patent laid-open No. 5-271129 teaches that the use of a vinyl urethane compound has an accelerating effect on the masking property of a photosensitive resin composition. Japanese patent laid-open No. 5-232699 discloses that the hole-masking property and flexibility can be effectively improved by adding a single acrylate compound containing a long-chain structure of polyethylene glycol or polypropylene glycol to a photosensitive resin composition.
CN202110422942 introduces a second alkali soluble copolymer resin with polybasic acid anhydride to compound with other components to obtain the dry film resist with better hole masking property and plating resistance.
As a result of the analysis of the above patents, most of the patents have improved the hole masking property and plating resistance of the dry film resist by adding photopolymerizable monomers having specific effects, which mainly serve to improve flexibility and hole masking property, but may affect resolution, adhesion, developability, plating resistance, and the like. In addition, although the patent shows its original effect by adjusting monomers for synthesizing an alkali-soluble resin, it has an adverse effect on adhesion, developability, and the like.
Disclosure of Invention
The present invention is to solve the above problems, and thus provides a photosensitive resin composition. The photosensitive resin composition of the invention is added with vinyl carbamate monomer; the prepared dry film resist layer has the performances of better resolution, adhesive force, developing property, hole masking property, plating resistance and the like.
The technical scheme for solving the problems is as follows:
a photosensitive resin composition includes an alkali-soluble resin, a photopolymerizable monomer including vinyl carbamate, and a photoinitiator.
Preferably, the vinyl carbamate is one or more of the following structures:
in the formula I, R1 and R2 are respectively and independently selected from H, a saturated carbon chain or a carbon ring with 1-12 carbon atoms and a benzene ring, wherein the carbon chain does not contain intervening oxygen, sulfur and phosphorus atoms or contains one or more intervening oxygen, sulfur and phosphorus atoms;
in the formula II, R3 and R4 are respectively and independently selected from H, a saturated carbon chain or a carbon ring with 1-12 carbon atoms and a benzene ring, wherein the carbon chain does not contain intervening oxygen, sulfur and phosphorus atoms or contains one or more intervening oxygen, sulfur and phosphorus atoms;
in the formula III, R5, R6 and R7 are respectively and independently selected from saturated carbon chains or carbon rings and benzene rings, wherein the carbon chains contain no or one or more intervening oxygen, sulfur and phosphorus atoms; r6 and R7 may also be H.
Preferably, the vinyl carbamate is one or more selected from phenyl (vinyl carbamate), octyl methyl carbamate-O-vinyl ester, N-dimethyl ethylenediamine di (vinyl carbamate), ethyl di (vinyl carbamate), butyl di (vinyl carbamate), hexyl di (vinyl carbamate), ethylene glycol di (vinyl carbamate), and triethyl phosphate di (vinyl carbamate).
Preferably, in the above aspect, the photopolymerizable monomer further comprises an acrylate, the acrylate is selected from one or more of pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, ditrimethylolpropane tetraacrylate, trimethylolpropane tri (meth) acrylate, ethoxylated (propoxylated) trimethylolpropane tri (meth) acrylate, dimethylolpropane tetraacrylate, dipropylene glycol diacrylate, tripropylene glycol diacrylate, hexanediol diacrylate, bisphenol A di (meth) acrylate, ethoxylated (propoxylated) bisphenol A di (meth) acrylate, polyethylene glycol (propylene glycol) di (meth) acrylate, ethoxylated (propoxylated) neopentyl glycol diacrylate, benzyl methacrylate and isooctyl acrylate.
Preferably, the components are as follows in parts by mass: 40-70 parts of alkali-soluble resin, 30-60 parts of photopolymerizable monomer and 0.1-10 parts of photoinitiator; wherein the weight part of the vinyl carbamate monomer is 2-16 parts.
In the technical scheme of the invention, the weight part of the alkali soluble resin is controlled to be 40-70 parts in consideration of film forming property, photosensitivity and resolution; when the weight part of the alkali-soluble resin is less than 40 parts, the photosensitive resin composition has poor film forming property and is easy to overflow when being coiled; when the alkali-soluble resin is more than 70 parts by weight, the photosensitive resin composition has poor photosensitivity and low resolution.
In the technical scheme of the invention, the weight parts of the photopolymerizable monomers are controlled to be 30-60 parts in consideration of film forming property, photosensitivity and resolution; when the photopolymerizable monomer is less than 30 parts by weight, the photosensitive resin composition may have poor photosensitivity, low resolution; when the amount is more than 60 parts, the film-forming property is poor, and the problems of glue overflow and short storage period occur.
Preferably, the alkali-soluble resin is composed of (meth) acrylic acid, alkyl (meth) acrylate, and (a-methyl) styrene; the weight average molecular weight is 30000-150000, the polydispersity index (weight average molecular weight/number average molecular weight) is 1-3, and the acid value is 90-300 mgKOH/g.
Preferably, the (meth) acrylate is one or more selected from the group consisting of methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, pentyl (meth) acrylate, t-butyl (meth) acrylate, hexyl (meth) acrylate, octyl (meth) acrylate, isooctyl (meth) acrylate, decyl (meth) acrylate, and dodecyl (meth) acrylate.
Preferably, the alkali-soluble resin has a weight average molecular weight of 40000-120000, a polydispersity index of 1.1-2.5, and an acid value of 140-210 mgKOH/g.
In the above-mentioned embodiment of the present invention, the alkali-soluble resin having a weight average molecular weight of 40000- & ltSUB & gt 120000- & ltSUB & gt and an acid value of 140- & ltSUB & gt 210mgKOH/g is more preferable from the viewpoint of developability and solvent resistance.
In the above aspect of the present invention, the alkali-soluble resin having a polydispersity index of 1.1 to 2.5 is more preferable from the viewpoint of resolution and adhesion.
Preferably, the photoinitiator is selected from one or more of 2- (o-chlorophenyl) -4, 5-diphenyl imidazole dimer, 9-phenylacridine, 2,4, 5-triaryl imidazole dimer or derivatives thereof, N-phenylglycine and coumarin compounds.
Preferably, the photosensitive resin composition further comprises 0.1-5 parts by mass of an addition auxiliary agent; the additive comprises dye, chromophoric agent, color-forming heat stabilizer, plasticizer, defoaming agent, filler, adhesion promoter, leveling agent, stripping promoter, antioxidant and thermal crosslinking agent.
Preferably, in the above technical solution, the dye is malachite green, the color former is leuco crystal violet, and the plasticizer is p-toluenesulfonamide.
Another object of the present invention is to provide a dry film resist laminate comprising a support layer and a photosensitive layer formed of the above photosensitive resin composition.
The support layer comprises PET, PE, or the like.
In conclusion, the invention has the following beneficial effects:
1. according to the invention, the vinyl carbamate monomer is added into the photosensitive resin composition, and the monomer has the structure rigidity and the flexibility of the connecting chain segment, so that the dry film resist layer has better flexibility and adhesiveness, shows better hole masking performance and electroplating resistance, and simultaneously ensures better resolution and adhesion;
2. according to the invention, the vinyl carbamate monomer is adopted, and the anti-corrosion pattern solidified under the action of the film removing strong base is decomposed relatively quickly, so that the film removing speed is high, and the PCB production efficiency is ensured;
3. the vinyl carbamate monomer adopted by the invention has lower biotoxicity compared with a (methyl) acrylate monomer, and the compounding of the vinyl carbamate and the acrylate has no obvious difference with a comparative example without adding the vinyl carbamate in the aspects of resolution, adhesive force after etching, developing speed and the like, has slight advantage in a film stripping speed item, and has obvious advantages in the aspects of special-shaped hole breaking rate, flexibility grade, electroplating resistance and the like; the invention selects the vinyl carbamate monomer as one of the photopolymerization monomers, so that the dry film resist layer prepared from the photosensitive resin composition has better hole masking performance and flexibility, particularly electroplating resistance, and the prepared dry film resist layer has better resolution and adhesion.
Detailed Description
In order to further explain the technical effects of the present invention, the following examples of the present invention are explained in detail.
This detailed description is to be construed as illustrative only and is not limiting, since modifications will occur to those skilled in the art upon reading the preceding specification, and fall within the scope of the appended claims.
1. Alkali soluble resin A
A1: the emulsion is prepared by solution polymerization, the solvent is acetone, the main component is methacrylic acid/methyl methacrylate/butyl methacrylate/styrene-15/45/30/10, the weight-average molecular weight is 40000, the acid value is 97mgKOH/g, and the polydispersity index is 1.32;
a2: the emulsion is prepared by solution polymerization, the solvent is acetone, the main component is methacrylic acid/methyl methacrylate/butyl acrylate/acrylic acid-2-ethylhexyl acrylate which is 23/51/20/6, the weight average molecular weight is 95000, the acid value is 150mgKOH/g, and the polydispersity index is 1.80;
a3: the solution polymerization is adopted for preparation, the solvent is acetone, the main component is acrylic acid/methacrylic acid/methyl methacrylate/ethyl methacrylate/acrylic acid-2-ethylhexyl ester-20/20/40/12/8, the weight average molecular weight is 140000, the acid value is 286mgKOH/g, and the polydispersity index is 2.46;
2. photopolymerizable monomer B (B1-5 is acrylate, B6, B8 &10 are corresponding monomers of formula III, B9 is corresponding monomer of formula II, B7 is corresponding monomer of formula I)
B1: (ii) hexanediol diacrylate;
b2: (10) ethoxylated bisphenol a diacrylate;
b3: (3) ethoxylated trimethylolpropane triacrylate;
b4: dipentaerythritol pentaacrylate;
b5: polypropylene glycol (600) -dimethacrylate;
b6: ethyl bis (vinyl carbamate);
b7: phenyl (vinyl carbamate);
b8: ethylene glycol di (vinyl carbamate);
b9: n, N-dimethylethylenediamine bis (vinyl carbamate);
b10: triethyl phosphate bis (vinyl carbamate);
3. photoinitiator C
C1: 2,2 ', 4-tris (2-chlorophenyl) -5- (3, 4-dimethoxyphenyl) -4', 5 '-diphenyl-1, 1' -diimidazole;
c2: n-phenylglycine;
4. addition of auxiliary D
D1: malachite green;
d2: leuco crystal violet;
d3: p-toluenesulfonamide;
d4: hydroquinone;
the components of the dry film resist according to the following table are mixed according to the weight parts, a certain amount of butanone or acetone is added, and then the mixture is fully stirred until the mixture is completely dissolved to prepare the resist solution with the solid content of 45 percent. Uniformly coating the surface of a PET support film with the thickness of 15um by using a coating machine, and placing the PET support film in a drying oven at 90 ℃ for drying for 8min to form a photosensitive layer with the thickness of 38um, wherein the photosensitive layer presents blue-green under a yellow lamp. Then, a polyethylene film protective layer having a thickness of 18 μm was laminated on the surface thereof, thereby obtaining a 3-layer dry film resist laminate.
5. Parts by weight of photosensitive resin composition
The following describes sample preparation methods (including film attachment, exposure, development, etching, plating, film removal), sample evaluation methods, and evaluation results of examples and comparative examples.
[ FILM-APPLICATION ]
And polishing, washing and wiping the copper surface of the copper-clad plate by a grinder to obtain a bright and fresh copper surface. The press roll temperature of a film sticking machine is set to be 110 ℃, the conveying speed is 1.5m/min, and heat sticking is carried out under standard pressure.
[ Exposure ] to light
Standing the film-pasted sample for more than 15min, exposing by using a M-552 exposure machine of the Saint technology, and performing a photosensitivity test by using a stouffer 41-stage exposure ruler, wherein the number of exposure grids is controlled to be 16-22 grids, and the exposure energy is 25-60mJ/cm 2.
[ DEVELOPING ]
And (3) standing the exposed sample for more than 15min at the development temperature of 30 ℃ and under the pressure of 1.2Kg/cm2, wherein the developing solution is 1% by weight of sodium carbonate aqueous solution, the development time is 1.5-2.0 times of the minimum development time, and washing and drying the developed sample.
[ ETCHING ] of
And (3) carrying out an etching process on the developed copper plate, wherein the etching solution is copper chloride, the etching speed is 1.0m/min, the etching temperature is 48 ℃, the spray pressure is 1.5bar, the specific gravity is 1.3g/mL, the acidity is 2mol/L, the copper ions are 140g/L, and the model of the etching machine is Dongguan universe GL 181946.
[ DEFILLING ] OF FILM
The film stripping liquid is NaOH with the concentration of 3.0 weight percent, the temperature is 50 ℃, and the developing pressure is 1.2Kg/cm 2.
[ evaluation of resolution ]
The resist pattern was exposed to light using a mask having a wiring pattern with a width of n: n (n is 10 to 100 μm) of an exposed portion and an unexposed portion, developed for 1.5 times of the minimum development time, and then observed with a magnifying glass using the minimum mask width at which the cured resist line was normally formed as a value of resolution.
[ evaluation of adhesion ]
A photosensitive dry film resist was laminated on a copper plate by hot-pressing a film, exposed to light using a mask having a wiring pattern with a width of n:400(n is 10 to 100 μm) of an exposed portion and an unexposed portion, developed for 1.5 times of the minimum development time, and then observed with a magnifying glass using the minimum mask width where a cured resist line was normally formed as a value of adhesion.
[ minimum development time ]
And standing for more than 15min after film pasting, wherein the developing temperature is 30 ℃, the pressure is 1.2Kg/cm2, the developing solution is 1 percent by weight of sodium carbonate aqueous solution, and the minimum time required by completely dissolving the resist layer of the unexposed part is taken as the minimum developing time.
[ evaluation of hole-masking ability ]
After the protective film of the obtained dry film resist was peeled off, the resultant was laminated on a shaped orifice plate having a thickness of 1.6mm and having shaped orifices having diameters of 6.0mm, 5.0mm, and 4.0mm, exposed to light with a predetermined exposure energy, developed with a time 4 times the shortest development time, and the hole breakage rate was counted.
[ evaluation of flexibility ]
After film pasting, exposure and development are carried out on the flexible copper clad laminate, after the film pasting, exposure and development, the flexible base material is folded in half for 20 times from different angles, whether the dry film cracks or not is observed, the cracking times are counted, the result is represented by a number, and the smaller the numerical value, the better the flexibility of the dry film is. Well: the dry film is cracked for 0 time after being folded in half; in general: the dry film is cracked for 1-5 times after being folded; difference: the dry film is cracked for more than 5 times after being folded in half.
[ evaluation of plating resistance ]
At the temperature of 40 ℃, placing the developed substrate in 10% acid degreasing liquid for soaking for 10min, washing with water for 5min, after micro-etching by sodium sulfate, soaking for 2min at room temperature by using 10% sulfuric acid aqueous solution; then immersing the substrate into a pre-prepared copper plating solution, and electroplating for 70min at a current density of 2 ASD; soaking in 10% sulfuric acid water solution at room temperature for 2min, soaking the substrate in tin plating solution with current density of 1ASD, and electroplating for 10 min; and removing the solidified resist after washing, and observing by using a 500-time high-resolution scanning electron microscope to see whether the diffusion plating occurs.
[ evaluation of film-Release Rate ]
Taking 1 substrate after film sticking, exposure and development, cutting into squares of 4 x 5cm, putting the squares into a beaker filled with 100mL of stripping liquid (the concentration is 3 wt%, and the temperature is 50 ℃), magnetically stirring for 1min, and recording the time when the dry film completely falls off. The film stripping speed is evaluated by testing the film stripping time, and the shorter the film stripping time is, the faster the film stripping speed is.
By comparing examples 1 to 12 with comparative examples 1 to 4, it can be found that: the photosensitive resin composition has good hole masking performance, flexibility and electroplating resistance, keeps good resolution and adhesion, and has good adhesion performance after etching and film stripping performance. Comparative examples 1 to 4 did not add a vinyl urethane monomer, so that the prepared film had poor adhesion and flexibility after etching, particularly poor plating resistance. The invention selects the vinyl carbamate monomer as the photopolymerization monomer, so that the prepared photosensitive resin composition has better hole masking performance and flexibility, especially electroplating resistance, and the prepared dry film resist laminate has better resolution and adhesion.
Claims (10)
1. A photosensitive resin composition characterized by: comprises alkali soluble resin, photopolymerizable monomer and photoinitiator, wherein the photopolymerizable monomer comprises vinyl carbamate.
2. The photosensitive resin composition according to claim 1, wherein: the vinyl carbamate is one or more of the following structures:
in the formula I, R1 and R2 are respectively and independently selected from H, a saturated carbon chain or a carbon ring with 1-12 carbon atoms and a benzene ring, wherein the carbon chain does not contain intervening oxygen, sulfur and phosphorus atoms or contains one or more intervening oxygen, sulfur and phosphorus atoms;
in the formula II, R3 and R4 are respectively and independently selected from H, a saturated carbon chain or a carbon ring with 1-12 carbon atoms and a benzene ring, wherein the carbon chain does not contain intervening oxygen, sulfur and phosphorus atoms or contains one or more intervening oxygen, sulfur and phosphorus atoms;
in the formula III, R5, R6 and R7 are respectively and independently selected from saturated carbon chains or carbon rings and benzene rings, wherein the carbon chains contain no or one or more intervening oxygen, sulfur and phosphorus atoms; r6 and R7 may be H.
3. The photosensitive resin composition according to claim 2, wherein: the vinyl carbamate is selected from one or more of phenyl (vinyl carbamate), octyl methyl carbamate-O-vinyl ester, N-dimethyl ethylenediamine di (vinyl carbamate), ethyl di (vinyl carbamate), butyl di (vinyl carbamate), hexyl di (vinyl carbamate), ethylene glycol di (vinyl carbamate), triethyl phosphate di (vinyl carbamate).
4. The photosensitive resin composition according to claim 1, wherein: the photopolymerizable monomer also comprises acrylic ester, and the acrylic ester is selected from pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, ditrimethylolpropane tetraacrylate, trimethylolpropane tri (meth) acrylate, ethoxylated trimethylolpropane tri (meth) acrylate, dimethylolpropane tetraacrylate, dipropylene glycol diacrylate, one or more of tripropylene glycol diacrylate, hexanediol diacrylate, bisphenol A di (meth) acrylate, ethoxylated (propoxylated) bisphenol A di (meth) acrylate, polyethylene glycol (propylene glycol) di (meth) acrylate, ethoxylated (propoxylated) neopentyl glycol diacrylate, benzyl methacrylate, and isooctyl acrylate.
5. The photosensitive resin composition according to claim 1, wherein: the weight portions of the components are as follows: 40-70 parts of alkali-soluble resin, 30-60 parts of photopolymerizable monomer and 0.1-10 parts of photoinitiator; wherein the weight part of the vinyl carbamate monomer is 2-16 parts.
6. The photosensitive resin composition according to claim 1, wherein: the alkali soluble resin consists of (methyl) acrylic acid, alkyl (methyl) acrylate and (a-methyl) styrene; the weight average molecular weight is 30000-150000, the polydispersity index is 1-3, and the acid value is 90-300 mgKOH/g.
7. The photosensitive resin composition according to claim 6, wherein: the (methyl) acrylic acid alkyl ester is selected from one or more of methyl (methyl) acrylate, ethyl (methyl) acrylate, propyl (methyl) acrylate, butyl (methyl) acrylate, amyl (methyl) acrylate, tert-butyl (methyl) acrylate, hexyl (methyl) acrylate, octyl (methyl) acrylate, isooctyl (methyl) acrylate, decyl (methyl) acrylate and dodecyl (methyl) acrylate.
8. The photosensitive resin composition according to claim 1, wherein: the photoinitiator is selected from one or more of 2- (o-chlorophenyl) -4, 5-diphenyl imidazole dimer, 9-phenylacridine, 2,4, 5-triaryl imidazole dimer or derivatives thereof, N-phenylglycine and coumarin compounds.
9. The photosensitive resin composition according to claim 1, wherein: the photosensitive resin composition also comprises an addition auxiliary agent with the mass part of 0.1-5; the additive comprises dye, color former, color-forming heat stabilizer, plasticizer, defoaming agent, filler, adhesion promoter, leveling agent, stripping promoter, antioxidant and thermal crosslinking agent.
10. A dry film resist laminate characterized by: comprising a support layer and a photosensitive layer formed of the photosensitive resin composition according to any one of claims 1 to 9; the support layer comprises one or more of a PET layer and a PP layer.
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| CN116144233A (en) * | 2023-01-08 | 2023-05-23 | 珦盛新材料(珠海横琴)股份有限公司 | Photosensitive dry film coating, preparation method thereof and photosensitive dry film |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN116144233A (en) * | 2023-01-08 | 2023-05-23 | 珦盛新材料(珠海横琴)股份有限公司 | Photosensitive dry film coating, preparation method thereof and photosensitive dry film |
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