CN116216255A - Chip detection positioning mechanism - Google Patents
Chip detection positioning mechanism Download PDFInfo
- Publication number
- CN116216255A CN116216255A CN202310511080.6A CN202310511080A CN116216255A CN 116216255 A CN116216255 A CN 116216255A CN 202310511080 A CN202310511080 A CN 202310511080A CN 116216255 A CN116216255 A CN 116216255A
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- China
- Prior art keywords
- track
- positioning
- chip
- subassembly
- adsorption
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/22—Devices influencing the relative position or the attitude of articles during transit by conveyors
- B65G47/24—Devices influencing the relative position or the attitude of articles during transit by conveyors orientating the articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
- B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
- B25B11/002—Magnetic work holders
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
- B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
- B25B11/005—Vacuum work holders
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
- B65G47/912—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers provided with drive systems with rectilinear movements only
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/92—Devices for picking-up and depositing articles or materials incorporating electrostatic or magnetic grippers
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Control Of Conveyors (AREA)
- Automatic Assembly (AREA)
Abstract
The invention discloses a chip detection positioning mechanism, which relates to the technical field of chip positioning and comprises a conveying belt, a positioning adsorption component, a movable crawling component and a track component, wherein the conveying belt is used for conveying chips to a detection position at intervals, the track component is arranged above the detection position, the track component jointly constructs a track shape by a first track construction component and a second track construction component, the track shape is similar to the peripheral shape of the chips, at least three movable crawling components are movably connected below the track component, and the movable crawling component is provided with the positioning adsorption component for positioning and adsorbing the chips; the invention has strong adaptability, can position chips with various specifications and is convenient for subsequent detection.
Description
Technical Field
The invention relates to the technical field of chip positioning, in particular to a chip detection positioning mechanism.
Background
At present, a positioning mechanism for a chip often uses a push rod module as a core positioning mechanism, positioning for the chip is realized through telescopic fit of a plurality of push rods, however, the self-adaptive capacity of the structure is general due to the limitation of the number of the push rods and the telescopic length, and the structure cannot be suitable for special-shaped chips.
Therefore, it is necessary to provide a chip detecting and positioning mechanism to solve the above-mentioned problems in the prior art.
Disclosure of Invention
In order to achieve the above purpose, the present invention provides the following technical solutions: the utility model provides a chip detects positioning mechanism, includes conveyer belt, location adsorption component, removes and crawls subassembly and track subassembly, wherein, the conveyer belt is used for the interval conveying chip to detect the position, the top of detecting the position is provided with track subassembly, track subassembly is built the subassembly by first track and second track and is built the subassembly and build the track shape jointly, and make track shape and chip periphery shape close, the mobilizable being connected with of below of track subassembly is at least three removal and crawl the subassembly, remove and be provided with location adsorption component on the subassembly of crawling for the location is adsorbed the chip.
Further, as the preference, location adsorption component includes location telescopic link, location adsorption seat and adsorption block, wherein, the tip of location telescopic link is provided with location adsorption seat, the echelonment location adsorption groove has been seted up to the free end tip of location adsorption seat, the top of location adsorption groove is provided with the adsorption block.
Further, preferably, the adsorption block is an electromagnetic adsorption block or a negative pressure adsorption block.
Further, preferably, the output end of the positioning telescopic rod is connected with the positioning adsorption seat by a connecting piece, and the bottom plane of the positioning adsorption seat can be flush with the bottom plane of the chip.
Further, preferably, the track assembly includes a plurality of track units distributed at intervals, two adjacent track units are connected by a connecting bag, the connecting bag and the track units can form a closed loop together, and the connecting bag is filled with deformable liquid.
Further, preferably, the track assembly is externally sleeved with two adjusting cylinders, one of which is connected with the first track building assembly, and the other of which is connected with the second track building assembly.
Further, as an preference, the adjustment cylinder includes a cylinder body, an electromagnetic heating ring and a cooling spray head, wherein, the cylinder body is sleeved outside the track assembly, the electromagnetic heating ring is arranged in the cylinder body and is used for heating the deformable liquid so as to keep the deformable liquid in a liquid state, so as to adjust the relative position of two adjacent track units, and the cooling spray head is further arranged on one side of the cylinder body and is used for cooling the deformable liquid so as to keep the deformable liquid in a solid state, and then the adjusted track units keep the positions of the deformable liquid.
Further, preferably, a ring body is further embedded in the cylinder body, and a ring bag is arranged on the inner wall of the ring body and controlled by an external hydraulic controller to perform expansion and contraction adjustment.
Further, preferably, the first track building component and the second track building component have the same structure, the first track building component comprises a first screw mechanism, a second screw mechanism is arranged at the moving end of the first screw mechanism, a height adjusting rod is arranged at the moving end of the second screw mechanism, and the first screw mechanism and the second screw mechanism jointly form a two-dimensional adjusting mechanism.
Compared with the prior art, the invention provides a chip detection positioning mechanism, which has the following beneficial effects:
in the embodiment of the invention, the appearance of the track assembly can be adjusted, the track shape is jointly constructed by the first track construction assembly and the second track construction assembly, and the track shape is similar to the peripheral shape of the chip, so that the positioning adsorption assembly on the track assembly can contact and adsorb the chip only by fine adjustment, the adaptability is strong, the chips with various specifications can be positioned, and the subsequent detection is convenient.
Drawings
FIG. 1 is a schematic diagram of a chip detecting and positioning mechanism;
FIG. 2 is a schematic diagram of a positioning and adsorbing assembly in a chip detecting and positioning mechanism;
FIG. 3 is a schematic diagram of a structure of an adjustment cylinder in a chip inspection positioning mechanism;
FIG. 4 is a schematic diagram of a first track building block in a chip inspection positioning mechanism;
in the figure: 1. a conveyor belt; 2. a chip; 3. positioning the adsorption component; 4. moving the crawling assembly; 5. a track assembly; 6. a first track building component; 7. a second track building component; 31. positioning a telescopic rod; 32. a connecting piece; 33. positioning an adsorption seat; 34. positioning an adsorption groove; 35. an adsorption block; 51. a track unit; 52. a connecting bag; 53. a deformable liquid; 8. an adjustment cylinder; 81. a cylinder; 82. an electromagnetic heating ring; 83. cooling the spray head; 84. a ring body; 85. a ring capsule; 61. a first screw mechanism; 62. a second screw mechanism; 63. and a height adjusting rod.
Detailed Description
Referring to fig. 1 to 4, in an embodiment of the present invention, a chip detection positioning mechanism is provided, including a conveyor belt 1, a positioning and adsorbing assembly 3, a moving and crawling assembly 4, and a track assembly 5, where the conveyor belt 1 is used for conveying a chip 2 to a detection position at intervals, the track assembly 5 is disposed above the detection position, the track assembly 5 jointly constructs a track shape by a first track construction assembly 6 and a second track construction assembly 7, and the track shape is similar to the peripheral shape of the chip, at least three moving and crawling assemblies 4 are movably connected to the lower side of the track assembly 5, and the moving and crawling assembly 4 is provided with the positioning and adsorbing assembly 3 for positioning and adsorbing the chip.
That is, the shape of the track assembly 5 can be adjusted, and the track assembly 5 is jointly constructed by the first track construction assembly 6 and the second track construction assembly 7 to have a track shape similar to the peripheral shape of the chip, wherein the "similar" means that the shape and the size of the track assembly 5 are not completely consistent with the peripheral shape and the size of the chip 2, the shape and the size of the track assembly can be equal-scale amplification of the peripheral shape and the size of the chip, or can be partially different on the basis, the track assembly is only required to keep the track shape similar to the peripheral shape of the chip, and by the arrangement, the positioning and adsorbing assembly 3 on the track assembly 5 can contact the chip and adsorb the chip only by fine adjustment, and has strong adaptability, can position chips with various specifications, and is convenient for subsequent detection.
In this embodiment, the positioning and adsorbing assembly 3 includes a positioning telescopic rod 31, a positioning and adsorbing seat 33 and an adsorbing block 35, where the end of the positioning telescopic rod 31 is provided with the positioning and adsorbing seat 33, the free end of the positioning and adsorbing seat 33 is provided with a stepped positioning and adsorbing groove 34, and the top of the positioning and adsorbing groove 34 is provided with the adsorbing block 35. The adsorption groove 34 can be used for realizing the adsorption positioning of the edge of the chip, and specifically, the adsorption block 35 is an electromagnetic adsorption block or a negative pressure adsorption block.
As a preferred embodiment, the output end of the positioning telescopic rod 31 is connected to the positioning adsorption seat 33 by a connecting piece 32, and the bottom plane of the positioning adsorption seat 33 can be flush with the bottom plane of the chip.
In this embodiment, the track assembly 5 includes a plurality of track units 51 that are distributed at intervals, two adjacent track units 51 are connected by a connecting bag 52, the connecting bag 52 and the track units 51 can together form a closed loop, and the connecting bag 52 is filled with a deformable liquid 53.
The deformable liquid 53 is actually a low-melting metal, generally referred to as an alloy or material having a lower melting point, and is heated on the alloy or material having a lower melting point to be brought to a deformation temperature, and then is elastically deformed into a pre-designed shape by external force or itself. When the low-melting point metal is cooled to be solid, the shape of the low-melting point metal is locked and kept unchanged, so that the reconstruction of the shape of the track assembly 5 is realized;
as in fig. 3, there are two track units 51, wherein the left track unit is a first track unit and the right track unit is a second track unit; in addition, the outer part of the track assembly 5 is sleeved with two adjusting cylinders 8, one adjusting cylinder 8 is connected with the first track building assembly 6, and the other adjusting cylinder 8 is connected with the second track building assembly 7.
The adjusting cylinder 8 comprises a cylinder 81, an electromagnetic heating ring 82 and a cooling spray head 83, wherein the cylinder 81 is sleeved outside the track assembly 5, the electromagnetic heating ring 82 is arranged in the cylinder 81 and is used for heating the deformable liquid 53 so as to keep the deformable liquid 53 in a liquid state, so that the relative positions of two adjacent track units 51 can be adjusted, and the cooling spray head 83 is further arranged on one side of the cylinder 81 and is used for cooling the deformable liquid 53 so as to keep the deformable liquid 53 in a solid state and further keep the adjusted track units 51 in the position.
The adjusting cylinder 8 moves from the first track unit to the second track unit, when passing through the connecting bag 52 between the first track unit and the second track unit in the moving process, the deformable part 53 is heated by the electromagnetic heating ring 82 to keep the deformable part in the liquid state, the adjusting cylinder 8 is integrally positioned on the second track unit, the position of the adjusting cylinder 8 is adjusted under the adjustment of the first track building component and the second track building component, and correspondingly, the position of the second track unit relative to the first track unit is adjusted, after adjustment, the cooling spray head is used for carrying out air injection refrigeration towards the connecting bag 52, so that the liquid part in the connecting bag is cooled to form a solid state, and the adjusted track unit 51 keeps the position of the adjusting cylinder.
Since the outer part of the track assembly 5 is sleeved with two adjustment cylinders 8, one of which is connected to the first track building assembly 6 and the other of which is connected to the second track building assembly 7. In fact, when one of the adjustment cylinders adjusts the track unit, the other adjustment cylinder keeps the corresponding track unit still, for this purpose, a ring 84 is further embedded in the cylinder 81, a ring bag 85 is disposed on the inner wall of the ring 84, and the ring bag 85 is controlled by an external hydraulic controller to perform expansion and contraction adjustment, where the adjustment cylinder 8 can lock the corresponding track unit through expansion of the ring bag 85.
In addition, since the adjustment cylinder can lock the rail units, the second rail unit can be locked during adjustment, and thus more effective adjustment can be achieved.
In addition, the track unit may be i-shaped, and the movable crawling assembly 4 includes a wheel body capable of being carried on the track unit, so as to move along the track unit, which will not be described herein again, and it should be noted that the number of wheel bodies should be plural, so as to span the connecting bags 52.
In this embodiment, the first track building component 6 and the second track building component 7 have the same structure, the first track building component 6 includes a first screw mechanism 61, a second screw mechanism 62 is disposed at a moving end of the first screw mechanism 61, a height adjusting rod 63 is disposed at a moving end of the second screw mechanism 62, and the first screw mechanism 61 and the second screw mechanism 62 together form a two-dimensional adjusting mechanism.
The foregoing description is only a preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art, who is within the scope of the present invention, should make equivalent substitutions or modifications according to the technical solution of the present invention and the inventive concept thereof, and should be covered by the scope of the present invention.
Claims (9)
1. The utility model provides a chip detects positioning mechanism which characterized in that: including conveyer belt (1), location absorption subassembly (3), removal subassembly (4) and track subassembly (5) crawl, wherein, conveyer belt (1) are used for the interval conveying chip (2) to detect the position, the top of detecting the position is provided with track subassembly (5), track subassembly (5) are constructed the track shape by first track and are constructed subassembly (6) and second track and construct subassembly (7) jointly, and make track shape and chip (2) periphery shape close, the mobilizable below of track subassembly (5) is connected with at least three removal subassembly (4) crawl, be provided with location absorption subassembly (3) on the removal subassembly (4) for location absorption chip (2).
2. The chip scale positioning mechanism of claim 1, wherein: the positioning adsorption assembly (3) comprises a positioning telescopic rod (31), a positioning adsorption seat (33) and an adsorption block (35), wherein the end part of the positioning telescopic rod (31) is provided with the positioning adsorption seat (33), the free end part of the positioning adsorption seat (33) is provided with a stepped positioning adsorption groove (34), and the top of the positioning adsorption groove (34) is provided with the adsorption block (35).
3. The chip scale positioning mechanism of claim 2, wherein: the adsorption block (35) is an electromagnetic adsorption block or a negative pressure adsorption block.
4. The chip scale positioning mechanism of claim 2, wherein: the output end of the positioning telescopic rod (31) is connected with the positioning adsorption seat (33) by adopting a connecting piece (32), and the bottom plane of the positioning adsorption seat (33) can be flush with the bottom plane of the chip (2).
5. The chip scale positioning mechanism of claim 1, wherein: the track assembly (5) comprises a plurality of track units (51) which are distributed at intervals, two adjacent track units (51) are connected through a connecting bag (52), the connecting bag (52) and the track units (51) can jointly form a closed loop, and deformable liquid (53) is filled in the connecting bag (52).
6. The chip scale positioning mechanism of claim 5, wherein: two adjusting cylinders (8) are sleeved outside the track assembly (5), one adjusting cylinder (8) is connected with the first track construction assembly (6), and the other adjusting cylinder (8) is connected with the second track construction assembly (7).
7. The chip scale positioning mechanism of claim 6, wherein: the adjusting cylinder (8) comprises a cylinder body (81), an electromagnetic heating ring (82) and a cooling spray head (83), wherein the cylinder body (81) is sleeved outside the track assembly (5), the electromagnetic heating ring (82) is arranged in the cylinder body (81) and used for heating the deformable liquid (53) so as to enable the deformable liquid to be kept in a liquid state, the relative positions of two adjacent track units (51) are adjusted, and the cooling spray head (83) is further arranged on one side of the cylinder body (81) and used for cooling the deformable liquid (53) so as to enable the deformable liquid (53) to be kept in a solid state, and then the adjusted track units (51) keep the positions of the deformable liquid.
8. The chip scale positioning mechanism of claim 7, wherein: the inside of barrel (81) still imbeds ring body (84), the inner wall of ring body (84) is provided with ring bag (85), ring bag (85) are controlled by outside hydraulic controller and are carried out the expansion and contraction regulation.
9. The chip scale positioning mechanism of claim 1, wherein: the first track construction assembly (6) and the second track construction assembly (7) are identical in structure, the first track construction assembly (6) comprises a first screw mechanism (61), a second screw mechanism (62) is arranged at the moving end of the first screw mechanism (61), a height adjusting rod (63) is arranged at the moving end of the second screw mechanism (62), and the first screw mechanism (61) and the second screw mechanism (62) jointly form a two-dimensional adjusting mechanism.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202310511080.6A CN116216255B (en) | 2023-05-09 | 2023-05-09 | Chip detection positioning mechanism |
Applications Claiming Priority (1)
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CN202310511080.6A CN116216255B (en) | 2023-05-09 | 2023-05-09 | Chip detection positioning mechanism |
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CN116216255A true CN116216255A (en) | 2023-06-06 |
CN116216255B CN116216255B (en) | 2023-07-18 |
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CN202310511080.6A Active CN116216255B (en) | 2023-05-09 | 2023-05-09 | Chip detection positioning mechanism |
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Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19920365A1 (en) * | 1999-05-04 | 2000-11-30 | Emil Stark | Fastening and detachment of workpiece and carrier for precision processing, e.g. machining, employs intervening adhesive layer, forming attachment in accurate registration |
JP2001156115A (en) * | 1999-11-29 | 2001-06-08 | Seiko Epson Corp | Chip bonder, chip-bonding method, bond-inspecting apparatus and bond inspection method |
CN106112342A (en) * | 2016-07-22 | 2016-11-16 | 广州益川机械有限公司 | A kind of positioning and clamping mechanism of stamping parts of automobile soldering cramping apparatus |
CN109292451A (en) * | 2018-11-19 | 2019-02-01 | 慈溪市日兴电子有限公司 | The conveying device of solar battery board chip |
CN110550431A (en) * | 2019-08-08 | 2019-12-10 | 广州明森合兴科技有限公司 | chip position adjusting mechanism of chip feeding device |
CN212371996U (en) * | 2020-03-27 | 2021-01-19 | 昆山市世达精密机械有限公司 | Clamp for detecting air tightness of aluminum casting cylinder |
CN216582929U (en) * | 2021-09-28 | 2022-05-24 | 苏州品利得自动化科技有限公司 | Vacuum material suction device for IC recorder |
CN115744277A (en) * | 2022-11-23 | 2023-03-07 | 苏州艾方芯动自动化设备有限公司 | Chip detection and collection equipment |
-
2023
- 2023-05-09 CN CN202310511080.6A patent/CN116216255B/en active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19920365A1 (en) * | 1999-05-04 | 2000-11-30 | Emil Stark | Fastening and detachment of workpiece and carrier for precision processing, e.g. machining, employs intervening adhesive layer, forming attachment in accurate registration |
JP2001156115A (en) * | 1999-11-29 | 2001-06-08 | Seiko Epson Corp | Chip bonder, chip-bonding method, bond-inspecting apparatus and bond inspection method |
CN106112342A (en) * | 2016-07-22 | 2016-11-16 | 广州益川机械有限公司 | A kind of positioning and clamping mechanism of stamping parts of automobile soldering cramping apparatus |
CN109292451A (en) * | 2018-11-19 | 2019-02-01 | 慈溪市日兴电子有限公司 | The conveying device of solar battery board chip |
CN110550431A (en) * | 2019-08-08 | 2019-12-10 | 广州明森合兴科技有限公司 | chip position adjusting mechanism of chip feeding device |
CN212371996U (en) * | 2020-03-27 | 2021-01-19 | 昆山市世达精密机械有限公司 | Clamp for detecting air tightness of aluminum casting cylinder |
CN216582929U (en) * | 2021-09-28 | 2022-05-24 | 苏州品利得自动化科技有限公司 | Vacuum material suction device for IC recorder |
CN115744277A (en) * | 2022-11-23 | 2023-03-07 | 苏州艾方芯动自动化设备有限公司 | Chip detection and collection equipment |
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