CN116213996A - Gold-based alloy soldering paste with good dispensing performance and preparation method thereof - Google Patents
Gold-based alloy soldering paste with good dispensing performance and preparation method thereof Download PDFInfo
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- CN116213996A CN116213996A CN202310005261.1A CN202310005261A CN116213996A CN 116213996 A CN116213996 A CN 116213996A CN 202310005261 A CN202310005261 A CN 202310005261A CN 116213996 A CN116213996 A CN 116213996A
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- gold
- based alloy
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3013—Au as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
A gold-based alloy soldering paste with good dispensing performance comprises the following components in percentage by mass: 87-93% of gold-based alloy powder, wherein the gold content in the gold-based alloy powder is 75-90%; 7-13% of soldering flux, wherein the main components of the soldering flux comprise: modified rosin, an organic solvent, an active agent and a thixotropic agent; the modified rosin adopts hydrogenated rosin and polymerized rosin, and the organic solvent is more than two of ethylene glycol, glycerol, isopropanol, diethylene glycol diethyl ether, propylene glycol methyl ether or dipropylene glycol butyl ether; the active agent is one or more of acetic acid, glutaric acid, o-hydroxybenzoic acid, sebacic acid and pimelic acid; the thixotropic agent is ethylene bisstearamide and modified fatty acid amide resin; the gold-based alloy soldering paste prepared by the invention has the advantages of no halogen, easy cleaning, low oxygen content, bright soldering spots and high expansion rate, can realize continuous dispensing, and is applied to the field of high-reliability electronic packaging.
Description
Technical Field
The invention belongs to the field of electronic packaging, and particularly relates to gold-based alloy soldering paste with good dispensing performance and a preparation method thereof.
Background
The gold-based alloy soldering paste has excellent electric conduction, heat conduction and corrosion resistance and excellent mechanical property, and is widely applied to the fields with high reliability requirements such as JG, aerospace and the like. As a high-reliability high-temperature soldering paste, the solder paste can be used in occasions with higher service temperature range (more than 150 ℃), and has the characteristics of good thermal fatigue performance, high strength at high temperature, and excellent corrosion resistance and oxidation resistance.
The gold-based alloy soldering paste has two modes of dispensing and screen printing in the use process, namely the soldering paste is encapsulated in an injection type dispenser in the dispensing process, the soldering paste with specific quality is pressed out of a needle nozzle by controlling the pressure of compressed air, a precise place is positioned at a specific position on the surface of a matrix, the soldering paste is leveled into a film layer with specific shape under the action of gravity, the initial connection of components and the matrix is realized, then the organic carrier is decomposed and volatilized at the soldering temperature, the soldering flux flows out from the film layer after playing the cleaning and wetting roles, and the soldering flux is melted and spread, so that the good electric connection of the electronic components and the matrix is realized. The main factor affecting the paste dispensing performance is the thixotropic properties of the paste, i.e., the characteristic of the paste that reduces in viscosity under the action of shear forces. Whether the solder paste can keep high viscosity under static state or not and whether the solder paste can be thinned instantaneously after stress is an important basis for evaluating the quality of the solder paste. The problem that the adhesive dispensing performance is unstable and soldering flux and powder are layered in an injection type distributor is common in domestic gold-based alloy soldering paste on the market.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention aims to provide gold-based alloy soldering paste with good dispensing performance and a preparation method thereof, and the specific technical scheme is as follows:
the first aspect of the invention provides a gold-based alloy soldering paste, which comprises 87-93% of gold-based alloy powder and 7-13% of soldering flux in percentage by mass; wherein the main components of the soldering flux comprise modified rosin, an organic solvent, an active agent, a thixotropic agent and the like.
Preferably, the gold and the alloy powder have a gold content of 75-90%.
In the invention, the modified rosin is hydrogenated rosin and polymerized rosin, the proportion of the hydrogenated rosin to the polymerized rosin is 2-4:1-2, and the content of the hydrogenated rosin to the polymerized rosin accounts for 25-35% of the total amount of the soldering flux. The solubility and crystallization trend of different kinds of rosin in alcohol ether solvents are different, and the invention selects two kinds of modified rosin resins, and then selects proper proportion to achieve better soldering effect, and the polymerized rosin has relatively low acid value and high viscosity, and the hydrogenated rosin has good antioxidant property, small brittleness and high thermal stability.
In the invention, the organic solvent is more than two of ethylene glycol, glycerol, isopropanol, diethylene glycol diethyl ether, propylene glycol methyl ether or dipropylene glycol butyl ether, the ratio of alcohols to ethers is 2-4:1-2, and the content of the alcohols to ethers accounts for 50-70% of the total amount of the soldering flux; each organic solvent has different viscosity and boiling point, and different alcohols and ethers are selected to adjust the viscosity solvent of the soldering flux, and the soldering flux is completely volatilized when the temperature is close to the temperature for forming a soldering point, so that the soldering flux has the effect of reducing postweld residues.
In the invention, the active agent is one or more of acetic acid, glutaric acid, o-hydroxybenzoic acid, sebacic acid and pimelic acid, and the content of the active agent accounts for 2-10% of the total amount of the soldering flux;
in the invention, the thixotropic agent is ethylene bis-stearic acid amide and modified fatty acid amide, the proportion of which is 1-2:2-4, and the content of which accounts for 2-10% of the total amount of the soldering flux. Thixotropic agents have a significant effect on the final viscosity of gold-based alloy solder pastes.
In the invention, the gold-based alloy powder is gold-based alloy powder with liquidus at 250-400 ℃ and oxygen content less than or equal to 50 ppm; the solder paste prepared from the gold-based alloy powder has good fluidity, the solder powder is easy to be fully combined with the soldering flux, and the welding performance is good.
In a second aspect of the present invention, there is provided a method for preparing the gold-based alloy solder paste according to the first aspect of the present invention, the method comprising:
(1) Weighing the following components in percentage by weight: rosin, an organic solvent and an active agent are placed in a water bath heating reactor at 80-100 ℃ and stirred for 20-40 minutes under the condition of 800-1200 rpm until a uniformly dispersed mixture is formed, and the mixture is cooled to room temperature;
(2) Adding a thixotropic agent into the mixture obtained in the step (1), and stirring at a rotating speed of 1000 revolutions per minute for more than 5 minutes to uniformly mix the thixotropic agent into the mixture;
(3) Weighing soldering flux and Jin Jige gold powder according to the weight ratio, uniformly stirring by using a stirrer, rolling soldering paste by using a rolling mill, wherein the fineness of the gold-based alloy soldering paste after 3-5 times of rolling is smaller than the maximum gold and alloy powder particle diameter.
The beneficial effects of the invention are as follows:
(1) The gold-based alloy soldering paste prepared by the method does not contain halogen, and is friendly to electronic components and environment;
(2) The gold-based alloy soldering paste prepared by the invention is easy to clean, good in dispensing performance and good in spreadability;
(3) The organic solvent of the gold-base alloy soldering paste prepared by the invention has low boiling point, is completely removed during soldering, and the antioxidant can effectively inhibit or reduce oxidation of metal particles, so that the thermal shock resistance and mechanical property of a soldering layer are improved.
Drawings
Fig. 1 is a spreading experiment performed on a gold-plated board of the gold-based solder paste prepared in examples 1 to 3, wherein fig. 1a is an effect diagram of example 1, fig. 1b is an effect diagram of example 2, and fig. 1c is an effect diagram of example 3.
Detailed Description
The invention provides a preparation method of gold-based alloy soldering paste with good dispensing performance, and the invention is further described below by referring to examples.
In the following examples, the gold-based alloy powder was a metallurgical gold having a gold content of 75 to 90% and was obtained by atomization, and the other materials were industrial products.
Example 1
Weighing 87% of gold-based alloy powder and 13% of soldering flux in percentage by mass; wherein the main component of the soldering flux is 35% hydrogenated rosin and polymerized rosin, and the mass ratio of the hydrogenated rosin to the polymerized rosin is 2:1;60% of an organic solvent, wherein the mass ratio of glycerol to diethylene glycol diethyl ether is 2:1;2% acetic acid; 3% of thixotropic agent, wherein the mass ratio of ethylene bisstearamide to modified fatty acid amide resin is 1:2; the liquidus of the gold-based alloy powder is 280 ℃, the gold-based alloy powder contains 80% of gold and the oxygen content is 46ppm; high sphericity, no satellite ball, no hollow ball and particle size of 25-45 microns. The preparation method comprises the following steps of:
(1) Weighing rosin, an organic solvent and an active agent according to weight, placing the rosin, the organic solvent and the active agent in a water bath heating reactor at 80 ℃, stirring for 30 minutes at the speed of 800 revolutions per minute until a uniformly dispersed mixture is formed, and cooling to room temperature;
(2) Adding a thixotropic agent into the mixture obtained in the step (1), placing the mixture into a stirrer, stirring the mixture for 5 minutes at a rotating speed of 1000 revolutions per minute, and uniformly mixing the mixture into the mixture to obtain the soldering flux;
(3) 26 g of soldering flux and 174 g of Jin Jige gold powder are weighed, uniformly stirred by a stirrer, then a three-roller mill is used for rolling soldering paste, and the gold-based alloy soldering paste is subjected to three-roller rolling for 3 times. The obtained gold-base alloy soldering paste has the viscosity of 80 Pa.s, bright soldering spots, easy cleaning and continuous dispensing.
Example 2
Weighing 90% of Jin Jige gold powder and 10% of soldering flux by mass percent; wherein the main component of the soldering flux is 30% of hydrogenated rosin and polymerized rosin, and the mass ratio of the hydrogenated rosin to the polymerized rosin is 3:1;65% of an organic solvent, wherein the mass ratio of glycerol, isopropanol, diethylene glycol diethyl ether and dipropylene glycol butyl ether is 1:2:2:1;2.5% glutaric acid; 2.5% of thixotropic agent, wherein the mass ratio of ethylene bisstearamide to modified fatty acid amide resin is 2:3; the liquidus 356 ℃ of the gold-based alloy powder contains 88% of gold and 39ppm of oxygen; high sphericity, no satellite ball, no hollow ball and particle size of 25-45 microns. The preparation method comprises the following steps of:
(1) Weighing rosin, an organic solvent and an active agent according to weight, placing the rosin, the organic solvent and the active agent in a water bath heating reactor at 90 ℃, stirring for 32 minutes at 900 rpm until a uniformly dispersed mixture is formed, and cooling to room temperature;
(2) Adding a thixotropic agent into the mixture obtained in the step (1), placing the mixture into a stirrer, stirring the mixture for 5 minutes at a rotating speed of 1000 revolutions per minute, and uniformly mixing the mixture into the mixture to obtain the soldering flux;
(3) 20 g of soldering flux and 180 g of Jin Jige gold powder are weighed, uniformly stirred by a stirrer, then a three-roller mill is used for rolling soldering paste, and the gold-based alloy soldering paste is subjected to three-roller rolling for 3 times. The obtained gold-base alloy soldering paste has the viscosity of 75 Pa.s, bright soldering spots, easy cleaning and continuous dispensing.
Example 3
Weighing 85% of Jin Jige gold powder and 15% of soldering flux in percentage by mass; wherein the main component of the soldering flux is 32% of hydrogenated rosin and polymerized rosin, and the mass ratio of the hydrogenated rosin to the polymerized rosin is 2:1;62% of an organic solvent, wherein the mass ratio of ethylene glycol, isopropanol, diethylene glycol diethyl ether and propylene glycol methyl ether is 2:1:1:1;3% of sebacic acid; 4% of thixotropic agent, wherein the mass ratio of ethylene bisstearamide to modified fatty acid amide resin is 1:2; gold-based alloy powder with liquidus 290 ℃ and gold 88% and oxygen content of 36 ppm; high sphericity, no satellite ball, no hollow ball and particle size of 25-45 microns. The preparation method comprises the following steps of:
(1) The rosin, the organic solvent and the active agent which are weighed according to the weight are placed in a water bath heating reactor at 95 ℃ and stirred for 38 minutes at the rotating speed of 1000 revolutions per minute until a mixture which is uniformly dispersed is formed, and the mixture is cooled to the room temperature;
(2) Adding a thixotropic agent into the mixture obtained in the step (1), placing the mixture into a stirrer, stirring the mixture for 5 minutes at a rotating speed of 1000 revolutions per minute, and uniformly mixing the mixture into the mixture to obtain the soldering flux;
(3) 30 g of soldering flux and 170 g of Jin Jige gold powder are weighed, uniformly stirred by a stirrer, then a three-roller mill is used for rolling soldering paste, and the gold-based alloy soldering paste is subjected to three-roller rolling for 3 times. The obtained gold-base alloy soldering paste has the viscosity of 90 Pa.s, bright soldering spots, easy cleaning and continuous dispensing.
The soldering flux prepared by the embodiment of the invention is halogen-free, has good physical stability on electronic components and environment, is easy to clean, has good dispensing performance and good spreadability, has low boiling point, is completely removed during welding, effectively inhibits oxidation of gold-based powder, improves the thermal shock resistance and mechanical property of a welding layer, has good wettability, bright welding spot appearance and excellent welding performance, and can ensure the reliability of high-end electronic packaging.
Claims (7)
1. The gold-based alloy soldering paste with good dispensing performance is characterized by comprising the following components in percentage by mass: 87-93% of gold-based alloy powder, wherein the gold content in the gold-based alloy powder is 75-90%; 7-13% of soldering flux, wherein the main components of the soldering flux comprise: modified rosin, an organic solvent, an active agent and a thixotropic agent.
2. The gold-based alloy soldering paste according to claim 1, wherein the modified rosin is hydrogenated rosin and polymerized rosin, the ratio is 2-4:1-2, and the content of the modified rosin is 15-25% of the soldering flux.
3. The gold-based alloy soldering paste of claim 1, wherein the organic solvent is more than two of ethylene glycol, glycerol, isopropanol, diethylene glycol diethyl ether, propylene glycol methyl ether or dipropylene glycol butyl ether, the ratio of alcohols to ethers is 2-4:1-2, and the content of the alcohols to ethers is 50-70% of the soldering flux.
4. The gold-base alloy soldering paste of claim 1, wherein the active agent is one or more of acetic acid, glutaric acid, o-hydroxybenzoic acid, sebacic acid and pimelic acid, and the content of the active agent is 2-10% of the soldering flux.
5. The gold-based alloy soldering paste according to claim 1, wherein the thixotropic agent is ethylene bis-stearamide and modified fatty acid amide, the ratio of which is 1-2:2-4, and the content of the thixotropic agent is 2-10% of the soldering flux.
6. The gold-based alloy solder paste according to claim 1, wherein the gold-based alloy powder is a gold-based alloy powder having a liquidus line of 270 to 360 ℃ and an oxygen content of 50ppm or less and a particle size distribution of 25 to 45 μm.
7. A method of preparing the gold-based alloy solder paste of claim 1, comprising:
(1) Weighing rosin, an organic solvent and an active agent according to the weight ratio, placing the rosin, the organic solvent and the active agent in a water bath heating reactor at 80-100 ℃, stirring for 20-40 minutes at the rotating speed of 800-1200 rpm until a uniformly dispersed mixture is formed, and cooling to room temperature;
(2) Adding a thixotropic agent into the mixture obtained in the step (1), and stirring at a rotating speed of 1000 revolutions per minute for more than 5 minutes to uniformly mix the thixotropic agent into the mixture;
(3) Weighing soldering flux and Jin Jige gold powder according to the weight ratio, uniformly stirring by using a stirrer, rolling soldering paste by using a rolling mill, wherein the fineness of the gold-based alloy soldering paste after 3-5 times of rolling is smaller than the maximum gold and alloy powder particle diameter.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310005261.1A CN116213996A (en) | 2023-01-04 | 2023-01-04 | Gold-based alloy soldering paste with good dispensing performance and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202310005261.1A CN116213996A (en) | 2023-01-04 | 2023-01-04 | Gold-based alloy soldering paste with good dispensing performance and preparation method thereof |
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| CN202310005261.1A Pending CN116213996A (en) | 2023-01-04 | 2023-01-04 | Gold-based alloy soldering paste with good dispensing performance and preparation method thereof |
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- 2023-01-04 CN CN202310005261.1A patent/CN116213996A/en active Pending
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