CN113510406A - Microelectronic assembly solder paste and preparation method thereof - Google Patents
Microelectronic assembly solder paste and preparation method thereof Download PDFInfo
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- CN113510406A CN113510406A CN202110925232.8A CN202110925232A CN113510406A CN 113510406 A CN113510406 A CN 113510406A CN 202110925232 A CN202110925232 A CN 202110925232A CN 113510406 A CN113510406 A CN 113510406A
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 49
- 238000004377 microelectronic Methods 0.000 title claims abstract description 19
- 238000002360 preparation method Methods 0.000 title abstract description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 49
- 229910021389 graphene Inorganic materials 0.000 claims abstract description 49
- 238000005476 soldering Methods 0.000 claims abstract description 43
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 34
- 230000004907 flux Effects 0.000 claims abstract description 34
- 239000002270 dispersing agent Substances 0.000 claims abstract description 33
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims abstract description 22
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims abstract description 22
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims abstract description 22
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 13
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000002245 particle Substances 0.000 claims abstract description 9
- 239000002904 solvent Substances 0.000 claims abstract description 9
- 239000010936 titanium Substances 0.000 claims abstract description 9
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 9
- 239000003963 antioxidant agent Substances 0.000 claims abstract description 7
- 230000003078 antioxidant effect Effects 0.000 claims abstract description 7
- 229910052802 copper Inorganic materials 0.000 claims abstract description 7
- 239000010949 copper Substances 0.000 claims abstract description 7
- 229910052709 silver Inorganic materials 0.000 claims abstract description 7
- 239000004332 silver Substances 0.000 claims abstract description 7
- 239000013008 thixotropic agent Substances 0.000 claims abstract description 7
- 230000003213 activating effect Effects 0.000 claims abstract description 4
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 4
- 239000000843 powder Substances 0.000 claims description 22
- 238000003756 stirring Methods 0.000 claims description 18
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 17
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 12
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 12
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 claims description 12
- 238000000498 ball milling Methods 0.000 claims description 12
- 238000001816 cooling Methods 0.000 claims description 12
- 239000007788 liquid Substances 0.000 claims description 7
- 238000002156 mixing Methods 0.000 claims description 7
- 239000004952 Polyamide Substances 0.000 claims description 6
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 claims description 6
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 claims description 6
- 239000001361 adipic acid Substances 0.000 claims description 6
- 235000011037 adipic acid Nutrition 0.000 claims description 6
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 claims description 6
- 238000006243 chemical reaction Methods 0.000 claims description 6
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 claims description 6
- 238000007599 discharging Methods 0.000 claims description 6
- 238000011049 filling Methods 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 6
- 229910052757 nitrogen Inorganic materials 0.000 claims description 6
- 229920002647 polyamide Polymers 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 239000004359 castor oil Substances 0.000 claims description 4
- 235000019438 castor oil Nutrition 0.000 claims description 4
- 150000002148 esters Chemical class 0.000 claims description 4
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 4
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 claims description 4
- LYRFLYHAGKPMFH-UHFFFAOYSA-N octadecanamide Chemical compound CCCCCCCCCCCCCCCCCC(N)=O LYRFLYHAGKPMFH-UHFFFAOYSA-N 0.000 claims description 4
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 claims description 4
- TYFQFVWCELRYAO-UHFFFAOYSA-N suberic acid Chemical compound OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 claims description 4
- 239000013543 active substance Substances 0.000 claims description 2
- 239000012190 activator Substances 0.000 claims 1
- 238000003466 welding Methods 0.000 description 8
- 238000005457 optimization Methods 0.000 description 5
- 239000006185 dispersion Substances 0.000 description 3
- FSWDLYNGJBGFJH-UHFFFAOYSA-N n,n'-di-2-butyl-1,4-phenylenediamine Chemical compound CCC(C)NC1=CC=C(NC(C)CC)C=C1 FSWDLYNGJBGFJH-UHFFFAOYSA-N 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 239000000654 additive Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007792 addition Methods 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- BTVWZWFKMIUSGS-UHFFFAOYSA-N dimethylethyleneglycol Natural products CC(C)(O)CO BTVWZWFKMIUSGS-UHFFFAOYSA-N 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Emulsifying, Dispersing, Foam-Producing Or Wetting Agents (AREA)
Abstract
The invention discloses a microelectronic assembly solder paste and a preparation method thereof, wherein the solder paste comprises tin powder and soldering flux, the weight ratio of the tin powder to the soldering flux is (82-95) to (8-15), and the tin powder comprises the following components in parts by weight: 80-90 parts of tin, 1-2 parts of silver, 1.5-2 parts of copper, 0-1.5 parts of nano titanium particles, 0.5-1.5 parts of graphene and 0.5-1 part of graphene dispersant; the soldering flux comprises the following components in parts by weight: 4-6 parts of rosin, 3-5 parts of solvent, 0.8-2 parts of activating agent, 0.2-0.5 part of thixotropic agent, 0.1-0.5 part of antioxidant and 0.5-1 part of tin paste dispersing agent.
Description
Technical Field
The invention relates to the technical field of solder paste processing, in particular to microelectronic assembly solder paste and a preparation method thereof.
Background
Solder paste is a new type of soldering material that comes with SMT. The solder paste is a complex system and is a paste formed by mixing solder powder, soldering flux and other additives. The soldering paste has certain viscosity at normal temperature, can initially adhere electronic components to a set position, and welds the welded components and the printed circuit bonding pad together to form permanent connection along with volatilization of the solvent and part of the additives at the welding temperature.
The existing soldering paste can play a certain role in soldering, but in order to improve the thermal conductivity and prevent the temperature from being too high, graphene is added into raw materials to improve the corresponding performance of the existing soldering paste, but the graphene is easy to agglomerate, and if the graphene is not uniformly distributed in the whole system, the soldering effect and the electric and thermal conductivity are influenced; meanwhile, if the whole solder paste cannot be uniformly coated, the soldering quality is also affected.
Disclosure of Invention
The present invention is directed to a microelectronic assembly solder paste and a method for preparing the same, which solve the above-mentioned problems of the prior art.
In order to achieve the purpose, the invention adopts the technical scheme that: the microelectronic assembly solder paste comprises 82-95 wt% to 8-15 wt% of tin powder and soldering flux, wherein the tin powder comprises the following components in parts by weight: 80-90 parts of tin, 1-2 parts of silver, 1.5-2 parts of copper, 0-1.5 parts of nano titanium particles, 0.5-1.5 parts of graphene and 0.5-1 part of graphene dispersing agent, wherein the graphene dispersing agent is PVP, and the dispersion and compatibility of the graphene in the solder paste are improved by adding the graphene dispersing agent, so that the agglomeration phenomenon is avoided, and the storage stability of the solder paste is enhanced; the soldering flux comprises the following components in parts by weight: 4-6 parts of rosin, 3-5 parts of solvent, 0.8-2 parts of activating agent, 0.2-0.5 part of thixotropic agent, 0.1-0.5 part of antioxidant and 0.5-1 part of tin paste dispersing agent.
As further optimization, the rosin is one or more of hydrogenated rosin resin, polymerized rosin and pentaerythritol rosin ester, and a protective film can be formed at a welding temperature to cover a welding point in the welding process of the rosin, so that the corrosion resistance is improved; and simultaneously, the overall storage stability of the soldering paste is improved.
As further optimization, the solvent is one or more of diethylene glycol dimethyl ether, ethylene glycol and propylene glycol, and the environment-friendly solvent is selected as a carrier, so that the overall environment-friendly performance of the solder paste can be improved.
As a further optimization, the activating agent is one or more of succinic acid, adipic acid, azelaic acid and suberic acid.
As a further optimization, the thixotropic agent is one or more of polyamide wax, hydrogenated castor oil and stearic acid amide.
Preferably, the antioxidant is one or two of 4-dimethyl-6-tert-butylphenol and N, N' -di-sec-butyl-p-phenylenediamine.
As a further optimization, the solder paste dispersing agent is EB-7, so that the storage stability of the solder paste can be improved, the uniform dispersion of all components of the solder paste is facilitated, and the uniform welding state of all welding positions is ensured.
The invention also provides a method for preparing solder paste assembled according to microelectronics, which comprises the following steps,
s1) putting rosin and a solvent into a reaction kettle, heating to 150 ℃ and stirring for 30-40min, cooling to 80-90 ℃, adding an active agent, a thixotropic agent, an antioxidant and a tin paste dispersing agent, stirring for 40-50min, and cooling to room temperature to obtain a soldering flux;
s2) putting graphene into a ball mill, filling liquid nitrogen into the ball mill until the graphene is completely immersed, carrying out ball milling, uniformly mixing graphene powder obtained after ball milling, tin powder, silver powder, copper powder and a graphene dispersing agent, adding soldering flux, stirring for 10-20min under the vacuum condition of 0.5-1Mpa, and discharging to obtain a finished product.
Compared with the prior art, the invention has the beneficial effects that:
1. graphene can be uniformly dispersed in tin powder through the graphene dispersing agent, the phenomenon that graphene is agglomerated when the tin powder and soldering flux are mixed is prevented, the dispersion uniformity of the graphene in the whole soldering paste system is improved, the uniform and same heat dissipation performance is kept after welding, meanwhile, a thin and compact oxidation film is formed on the nano titanium particles instantly on the liquid surface of molten solder, and the oxidation film can effectively isolate external oxygen from entering the film, so that the oxidation resistance of the solder alloy is remarkably improved;
2. the tin paste dispersing agent is added into the system, so that the components can be distributed relatively uniformly, and a relatively consistent welding effect can be formed after coating;
3. the system does not contain restricted substances and has good environmental protection property.
Detailed Description
The following are specific examples of the present invention and further describe the technical solutions of the present invention, but the present invention is not limited to these examples.
Example 1
The microelectronic assembly solder paste comprises solder powder and soldering flux, wherein the weight ratio of the solder powder to the soldering flux is 87.7:10.8, and the solder powder comprises the following components in parts by weight: 83 parts of tin, 1.5 parts of silver, 1.5 parts of copper, 1 part of nano titanium particles, 1.2 parts of graphene and 0.5 part of graphene dispersant PVP; the soldering flux comprises the following components in parts by weight: 5 parts of hydrogenated rosin resin, 3.5 parts of ethylene glycol, 1 part of succinic acid, 0.2 part of polyamide wax, 0.4 part of 4-dimethyl-6-tert-butylphenol and 70.7 parts of tin paste dispersing agent EB-7.
The preparation method comprises the following steps: putting hydrogenated rosin resin and ethylene glycol into a reaction kettle, heating to 150 ℃, stirring for 30min, cooling to 85 ℃, adding succinic acid, polyamide wax, 4-dimethyl-6-tert-butylphenol and a tin paste dispersing agent EB, stirring for 40min, and cooling to room temperature to obtain a soldering flux; putting graphene in a ball mill, filling liquid nitrogen into the ball mill until the graphene is completely immersed, then carrying out ball milling, uniformly mixing graphene powder obtained after ball milling, tin powder, silver powder, copper powder, graphene dispersant PVP and nano titanium particles, adding soldering flux, stirring for 10min under the vacuum condition of 1Mpa, and discharging to obtain a finished product.
Example 2
The microelectronic assembly solder paste comprises solder powder and soldering flux, wherein the weight ratio of the solder powder to the soldering flux is 90.3:12.2, and the solder powder comprises the following components in parts by weight: 85 parts of tin, 1.2 parts of silver, 1.8 parts of copper, 1.5 parts of nano titanium particles, 1.5 parts of graphene and 0.8 part of graphene dispersant PVP; the soldering flux comprises the following components in parts by weight: 4 parts of pentaerythritol rosin ester, 5 parts of ethylene glycol, 1.6 parts of adipic acid, 0.3 part of polyamide wax, 0.5 part of N, N' -di-sec-butyl-p-phenylenediamine and 70.8 parts of a tin paste dispersing agent EB (EB-B).
The preparation method comprises the following steps: putting pentaerythritol rosin ester and ethylene glycol into a reaction kettle, heating to 130 ℃, stirring for 35min, cooling to 90 ℃, adding adipic acid, polyamide wax, N' -di-sec-butyl-p-phenylenediamine and a tin paste dispersing agent EB-7, stirring for 40min, and cooling to room temperature to obtain a soldering flux; putting graphene in a ball mill, filling liquid nitrogen into the ball mill until the graphene is completely immersed, then carrying out ball milling, uniformly mixing graphene powder obtained after ball milling, tin powder, silver powder, copper powder, graphene dispersant PVP and nano titanium particles, adding soldering flux, stirring for 15min under the vacuum condition of 0.8Mpa, and discharging to obtain a finished product.
Example 3
The microelectronic assembly solder paste comprises solder powder and soldering flux, wherein the weight ratio of the solder powder to the soldering flux is 93.8:11.9, and the solder powder comprises the following components in parts by weight: 88 parts of tin, 1.8 parts of silver, 2 parts of copper, 1.3 parts of graphene and 0.7 part of graphene dispersant PVP; the soldering flux comprises the following components in parts by weight: 4.5 parts of hydrogenated rosin resin, 4.5 parts of diethylene glycol dimethyl ether, 1.2 parts of adipic acid, 0.5 part of stearic acid amide, 0.2 part of N, N' -di-sec-butyl p-phenylenediamine and 71 parts of a tin paste dispersing agent EB-71.
The preparation method comprises the following steps: putting hydrogenated rosin resin and diethylene glycol dimethyl ether into a reaction kettle, heating to 120 ℃, stirring for 40min, cooling to 80 ℃, adding adipic acid, stearic acid amide, N' -di-sec-butyl-p-phenylenediamine and a tin paste dispersing agent EB-7, stirring for 40min, and cooling to room temperature to obtain a soldering flux; putting graphene in a ball mill, filling liquid nitrogen into the ball mill until the graphene is completely immersed, then carrying out ball milling, uniformly mixing graphene powder obtained after ball milling, tin powder, silver powder, copper powder and graphene dispersing agent PVP, adding soldering flux, stirring for 15min under the vacuum condition of 1Mpa, and discharging to obtain a finished product.
Example 4
The microelectronic assembly solder paste comprises solder powder and soldering flux, wherein the weight ratio of the solder powder to the soldering flux is 90.4:12.4, and the solder powder comprises the following components in parts by weight: 86 parts of tin, 1.5 parts of silver, 1.6 parts of copper, 0.8 part of graphene and 0.5 part of graphene dispersant PVP; the soldering flux comprises the following components in parts by weight: 6 parts of polymerized rosin, 3.5 parts of diethylene glycol dimethyl ether, 1.7 parts of succinic acid, 0.3 part of hydrogenated castor oil, 0.3 part of 4-dimethyl-6-tert-butylphenol and 70.6 parts of tin paste dispersant EB (Epstein-Barr).
The preparation method comprises the following steps: putting polymerized rosin and diethylene glycol dimethyl ether into a reaction kettle, heating to 130 ℃, stirring for 35min, cooling to 85 ℃, adding succinic acid, hydrogenated castor oil, 4-dimethyl-6-tert-butylphenol and a tin paste dispersing agent EB-7, stirring for 50min, and cooling to room temperature to obtain a soldering flux; putting graphene in a ball mill, filling liquid nitrogen into the ball mill until the graphene is completely immersed, then carrying out ball milling, uniformly mixing graphene powder obtained after ball milling, tin powder, silver powder, copper powder and graphene dispersing agent PVP, adding soldering flux, stirring for 15min under the vacuum condition of 1Mpa, and discharging to obtain a finished product.
The specific embodiments described herein are merely illustrative of the spirit of the invention. Various modifications or additions may be made to the described embodiments or alternatives may be employed by those skilled in the art without departing from the spirit or ambit of the invention as defined in the appended claims.
Claims (8)
1. The microelectronic assembly solder paste comprises solder powder and soldering flux, and is characterized in that the weight ratio of the solder powder to the soldering flux is (82-95) to (8-15), and the solder powder comprises the following components in parts by weight: 80-90 parts of tin, 1-2 parts of silver, 1.5-2 parts of copper, 0-1.5 parts of nano titanium particles, 0.5-1.5 parts of graphene and 0.5-1 part of graphene dispersant, wherein the graphene dispersant is PVP; the soldering flux comprises the following components in parts by weight: 4-6 parts of rosin, 3-5 parts of solvent, 0.8-2 parts of activating agent, 0.2-0.5 part of thixotropic agent, 0.1-0.5 part of antioxidant and 0.5-1 part of tin paste dispersing agent.
2. The microelectronic assembly solder paste of claim 1, wherein the rosin is one or more of a hydrogenated rosin resin, a polymerized rosin, a pentaerythritol rosin ester.
3. The microelectronic assembly solder paste of claim 1, wherein the solvent is one or more of diglyme, ethylene glycol, propylene glycol.
4. The microelectronic assembly solder paste of claim 1, wherein the activator is one or more of succinic acid, adipic acid, azelaic acid, suberic acid.
5. The microelectronic assembly solder paste of claim 1, wherein the thixotropic agent is one or more of a polyamide wax, hydrogenated castor oil, stearic acid amide.
6. The microelectronic assembly solder paste of claim 1, wherein the antioxidant is one or both of 4-dimethyl-6-tert-butylphenol, N' -di-sec-butyl-p-phenylenediamine.
7. The microelectronic assembly solder paste of claim 1, wherein the solder paste dispersant is EB-7.
8. A method of preparing a microelectronic assembly solder paste according to any of claims 1 to 7, characterized in that it comprises the steps of,
s1) putting rosin and a solvent into a reaction kettle, heating to 150 ℃ and stirring for 30-40min, cooling to 80-90 ℃, adding an active agent, a thixotropic agent, an antioxidant and a tin paste dispersing agent, stirring for 40-50min, and cooling to room temperature to obtain a soldering flux;
s2) putting graphene into a ball mill, filling liquid nitrogen into the ball mill until the graphene is completely immersed, then carrying out ball milling, uniformly mixing graphene powder obtained after ball milling, tin powder, silver powder, copper powder, a graphene dispersing agent and nano titanium particles, adding soldering flux, stirring for 10-20min under the vacuum condition of 0.5-1Mpa, and discharging to obtain a finished product.
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| CN202010804077X | 2020-08-12 | ||
| CN202010804077.XA CN111958143A (en) | 2020-08-12 | 2020-08-12 | Microelectronic assembly solder paste and preparation method thereof |
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| CN113510406A true CN113510406A (en) | 2021-10-19 |
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| CN111958143A (en) * | 2020-08-12 | 2020-11-20 | 江苏三沃电子科技有限公司 | Microelectronic assembly solder paste and preparation method thereof |
| CN117773407B (en) * | 2024-02-27 | 2024-05-07 | 江苏银和金属材料有限公司 | High-ductility tin-silver-copper-nickel solder and preparation method thereof |
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|---|---|---|---|---|
| CN107552996A (en) * | 2017-09-08 | 2018-01-09 | 如皋市下原科技创业服务有限公司 | A kind of stamp-mounting-paper diode welds special solder(ing) paste |
| CN109262162A (en) * | 2018-11-23 | 2019-01-25 | 深圳市唯特偶新材料股份有限公司 | A kind of high-performance solder(ing) paste |
| KR20190050585A (en) * | 2017-11-03 | 2019-05-13 | 서울시립대학교 산학협력단 | Lead-free solder composition and manufacturing method of the same, bonding method using lead-free solder composition |
| CN110091094A (en) * | 2019-05-17 | 2019-08-06 | 江苏三沃电子科技有限公司 | A kind of halogen-free environmental solder(ing) paste and preparation method thereof |
| CN111958143A (en) * | 2020-08-12 | 2020-11-20 | 江苏三沃电子科技有限公司 | Microelectronic assembly solder paste and preparation method thereof |
| CN113199171A (en) * | 2021-04-19 | 2021-08-03 | 江苏博蓝锡威金属科技有限公司 | Preparation method of solder paste for automobile control panel and homogenizing equipment thereof |
| CN113210929A (en) * | 2021-04-15 | 2021-08-06 | 江苏博蓝锡威金属科技有限公司 | Preparation method of solder paste for welding stainless steel and brass and temperature return treatment equipment |
-
2020
- 2020-08-12 CN CN202010804077.XA patent/CN111958143A/en not_active Withdrawn
-
2021
- 2021-08-12 CN CN202110925232.8A patent/CN113510406A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107552996A (en) * | 2017-09-08 | 2018-01-09 | 如皋市下原科技创业服务有限公司 | A kind of stamp-mounting-paper diode welds special solder(ing) paste |
| KR20190050585A (en) * | 2017-11-03 | 2019-05-13 | 서울시립대학교 산학협력단 | Lead-free solder composition and manufacturing method of the same, bonding method using lead-free solder composition |
| CN109262162A (en) * | 2018-11-23 | 2019-01-25 | 深圳市唯特偶新材料股份有限公司 | A kind of high-performance solder(ing) paste |
| CN110091094A (en) * | 2019-05-17 | 2019-08-06 | 江苏三沃电子科技有限公司 | A kind of halogen-free environmental solder(ing) paste and preparation method thereof |
| CN111958143A (en) * | 2020-08-12 | 2020-11-20 | 江苏三沃电子科技有限公司 | Microelectronic assembly solder paste and preparation method thereof |
| CN113210929A (en) * | 2021-04-15 | 2021-08-06 | 江苏博蓝锡威金属科技有限公司 | Preparation method of solder paste for welding stainless steel and brass and temperature return treatment equipment |
| CN113199171A (en) * | 2021-04-19 | 2021-08-03 | 江苏博蓝锡威金属科技有限公司 | Preparation method of solder paste for automobile control panel and homogenizing equipment thereof |
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| Publication number | Publication date |
|---|---|
| CN111958143A (en) | 2020-11-20 |
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Application publication date: 20211019 |