CN116207022A - Vibration reduction die bonding structure and die bonding equipment - Google Patents

Vibration reduction die bonding structure and die bonding equipment Download PDF

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Publication number
CN116207022A
CN116207022A CN202310136469.7A CN202310136469A CN116207022A CN 116207022 A CN116207022 A CN 116207022A CN 202310136469 A CN202310136469 A CN 202310136469A CN 116207022 A CN116207022 A CN 116207022A
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CN
China
Prior art keywords
die bonding
assembly
driving
driving end
wire
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Pending
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CN202310136469.7A
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Chinese (zh)
Inventor
陈树斌
张勇
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Dongguan Attach Point Intelligent Equipment Co ltd
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Dongguan Attach Point Intelligent Equipment Co ltd
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Priority to CN202310136469.7A priority Critical patent/CN116207022A/en
Publication of CN116207022A publication Critical patent/CN116207022A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Abstract

The invention provides a vibration reduction die bonding structure and die bonding equipment, which particularly comprise a frame and a first cross beam arranged on the frame; the first beam is provided with a first driving assembly, and a first driving end and a second driving end of the first driving assembly can move along a first direction; the first driving end is provided with a die bonding assembly, and the second driving end is provided with a balance block; the moving direction of the balance weight is opposite to the moving direction of the die bonding assembly. When the die bonding is carried out, the first driving component can be utilized to drive the die bonding component to move, and the die bonding component is utilized to absorb the chip, so that the movement of the chip is realized, and the action of placing the chip at a specified position is completed; in the process of die bonding, the stage of acceleration and deceleration of the die bonding assembly is involved, and in the stage, the counter motion of the balance weight relative to the die bonding assembly generates a motion trend opposite to that of the die bonding assembly, so that vibration generated in the process of acceleration and deceleration of the die bonding assembly is counteracted, and the overall accuracy is improved.

Description

Vibration reduction die bonding structure and die bonding equipment
Technical Field
The invention relates to the technical field of die bonding equipment structures, in particular to a vibration reduction die bonding structure and die bonding equipment.
Background
The die bonding refers to a process of bonding a wafer to a designated area of a bracket through colloid to form a thermal path or an electrical path, and providing conditions for subsequent wire bonding connection; the die bonding equipment refers to automatic equipment capable of completing the die bonding process.
The current die bonding equipment is described in patent document CN113921434a, and generally comprises a first beam and a die bonding machine head mounted on the first beam, wherein a motor and a driving screw are mounted on the first beam, and the motor works to drive the screw to rotate so that the die bonding machine head moves horizontally along the first beam; the die bonder head comprises a glue dropping head and an adsorption rod, wherein the glue dropping head is used for dropping glue, and the adsorption rod is used for adsorbing wafers; through the arrangement, the die bonder head can adsorb the wafer and is adhered to the bracket through the spot adhesive.
However, the current die bonding apparatus is mainly applied to the assembly of the LED chip and the bracket, wherein the thickness of the LED chip is thicker, usually more than 100 micrometers, and the die bonding apparatus can meet the precision requirement. For various chips such as a memory chip, the thickness of the memory chip is thinner and can reach 20 micrometers, and for the chip with the thinner size, the requirement on precision is high. However, for the above-mentioned die bonder, frequent acceleration and deceleration movements are involved in the movement process of the die bonder, and when the acceleration is large, the die bonder will vibrate, so that the overall accuracy of the die bonder is reduced.
Disclosure of Invention
The invention aims to provide a vibration reduction die bonding structure and die bonding equipment, which are used for solving the problem of insufficient precision of the current die bonding equipment.
To achieve the purpose, the invention adopts the following technical scheme:
a vibration reduction die bonding structure comprises a frame and a first cross beam arranged on the frame; the first beam is provided with a first driving assembly, and a first driving end and a second driving end of the first driving assembly can move along a first direction;
the first driving end is provided with a die bonding assembly, the second driving end is provided with a balance weight, and the die bonding assembly is used for sucking a chip; the moving direction of the balance weight is opposite to the moving direction of the die bonding assembly.
Optionally, the die bonding assembly includes a die bonding base mounted on the first driving end; the die bonding base is provided with a second driving assembly, and a third driving end of the second driving assembly can move along a second direction; the second direction is perpendicular to the first direction;
and the third driving end is provided with a suction component which is used for generating negative pressure.
Optionally, the third driving end comprises a mounting bottom plate, and the mounting bottom plate is slidably connected with the die bonding base; the suction component is arranged on the mounting bottom plate;
the die bonding base is connected with a first positioning column, the mounting bottom plate is connected with a second positioning column, and a tension spring is connected between the first positioning column and the second positioning column; one end of the tension spring is sleeved on the first positioning column, and the other end of the tension spring is sleeved on the second positioning column.
Optionally, a wire guide plate is further installed on the installation bottom plate, a plurality of wire guide blocks are installed on the wire guide plate, and gaps are reserved between the wire guide blocks and the wire guide plate.
Optionally, the wire guide plate includes a first extension portion extending along the second direction and a second extension portion extending along the first direction; the first extension part is arranged on one side of the second driving assembly, and the second extension part is arranged between the mounting bottom plate and the second driving assembly;
the wire block comprises a first wire block and a second wire block, the first wire block is installed on the first extension part, and the second wire block is installed on the second extension part;
two first ends of the first wire block along the first direction are respectively connected with the first extension part through fasteners;
two second end parts of the second wire block are respectively connected with the second extension part through fasteners; the second wire block is obliquely arranged and is arranged between the suction assembly and the first wire block.
Optionally, the first driving end includes a first driving sliding seat, and the first driving sliding seat is slidably connected with the first beam along the first direction;
the first driving sliding seat is convexly provided with a positioning boss along the direction facing the die bonding assembly, and the positioning boss is abutted with the die bonding base; the positioning boss and the wire guide plate are respectively positioned at two ends of the first driving sliding seat.
Optionally, a third driving assembly is arranged between the frame and the first beam; the third driving assembly is arranged on the frame, the first cross beam is arranged on a fourth driving end of the third driving assembly, and the fourth driving end can move along a third direction;
the third direction is perpendicular to the first direction and the second direction, respectively.
Optionally, the third driving assembly comprises a second beam, and a beam connecting part is convexly arranged on one side of the first beam, which faces the second beam; the beam connecting portion is slidably connected with the second beam along the third direction.
Optionally, a positioning groove is formed in one side, facing the first beam, of the second beam;
a first connecting plate part and a second connecting plate part are arranged between the first cross beam and the cross beam connecting part, and the first connecting plate part and the second connecting plate part are arranged in the positioning groove;
the first connecting plate portion is in contact with the groove wall on one side of the positioning groove, and the second connecting plate portion is in contact with the groove wall on the other side of the positioning groove.
A die bonding device comprises a bracket feeding structure, a wafer feeding structure and a vibration reduction die bonding structure.
Compared with the prior art, the invention has the following beneficial effects:
according to the vibration reduction die bonding structure and die bonding equipment, when die bonding is carried out, the first driving component can be utilized to drive the die bonding component to move, and the die bonding component is utilized to absorb the die, so that the movement of the die is realized, and the action of placing the die at the designated position is completed; in the process of die bonding, the stage of acceleration and deceleration of the die bonding assembly is involved, and in the stage, the counter motion of the balance weight relative to the die bonding assembly generates a motion trend opposite to that of the die bonding assembly, so that vibration generated in the process of acceleration and deceleration of the die bonding assembly is counteracted, and the overall accuracy is improved.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions of the prior art, the drawings which are used in the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the description below are only some embodiments of the invention, and that other drawings can be obtained from these drawings without inventive faculty for a person skilled in the art.
The structures, proportions, sizes, etc. shown in the drawings are shown only in connection with the present disclosure, and are not intended to limit the scope of the invention, since any modification, variation in proportions, or adjustment of the size, etc. of the structures, proportions, etc. should be considered as falling within the spirit and scope of the invention, without affecting the effect or achievement of the objective.
FIG. 1 is a schematic diagram of the overall structure of a vibration reduction die bonding structure according to an embodiment of the present invention;
fig. 2 is a schematic diagram of an overall structure of a die bonding assembly according to an embodiment of the present invention;
fig. 3 is a schematic front view of a die bonding assembly according to an embodiment of the present invention;
fig. 4 is an exploded view of a die attach assembly according to an embodiment of the present invention;
FIG. 5 is a schematic diagram of a first partial structure of a vibration reduction die bonding structure according to an embodiment of the present invention;
FIG. 6 is a schematic diagram of a second partial structure of a vibration reduction die bonding structure according to an embodiment of the present invention;
fig. 7 is a schematic diagram of a third partial structure of a vibration reduction die bonding structure according to an embodiment of the present invention.
Illustration of: 10. a frame; 20. a first cross beam; 21. a beam connection portion; 22. a first connection plate portion; 23. a second connection plate portion; 30. a first drive assembly; 31. a first drive carriage; 32. positioning the boss;
40. a die bonding assembly; 41. a die bonding base; 42. a second drive assembly; 43. a suction assembly; 44. a mounting base plate; 451. a first positioning column; 452. a second positioning column; 453. a tension spring; 46. a wire guide plate; 461. a first extension; 462. a second extension; 47. a wire block; 471. a first wire block; 472. a second wire block;
50. a balance weight; 60. a third drive assembly; 61. a second cross beam; 611. and a positioning groove.
Detailed Description
In order to make the objects, features and advantages of the present invention more comprehensible, the technical solutions in the embodiments of the present invention are described in detail below with reference to the accompanying drawings, and it is apparent that the embodiments described below are only some embodiments of the present invention, but not all embodiments of the present invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the description of the present invention, it should be understood that the directions or positional relationships indicated by the terms "upper", "lower", "top", "bottom", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention. It is noted that when one component is referred to as being "connected" to another component, it can be directly connected to the other component or intervening components may also be present.
The technical scheme of the invention is further described below by the specific embodiments with reference to the accompanying drawings.
Referring to fig. 1 to 7, fig. 1 is a schematic overall structure of a vibration reduction die bonding structure provided by an embodiment of the present invention, fig. 2 is a schematic overall structure of a die bonding assembly provided by an embodiment of the present invention, fig. 3 is a schematic front view of a die bonding assembly provided by an embodiment of the present invention, fig. 4 is a schematic explosion structure of a die bonding assembly provided by an embodiment of the present invention, fig. 5 is a schematic first partial structure of a vibration reduction die bonding structure provided by an embodiment of the present invention, fig. 6 is a schematic second partial structure of a vibration reduction die bonding structure provided by an embodiment of the present invention, and fig. 7 is a schematic third partial structure of a vibration reduction die bonding structure provided by an embodiment of the present invention.
Example 1
The damping die bonding structure provided by the embodiment is applied to die bonding equipment, and is particularly suitable for die bonding scenes of chips with thinner sizes, wherein vibration of the die bonding structure is reduced by optimizing the structure, so that accuracy is improved.
As shown in fig. 1, the vibration reduction die bonding structure in this embodiment includes a frame 10 and a first beam 20 mounted on the frame 10; the first beam 20 is provided with a first driving assembly 30, and a first driving end and a second driving end of the first driving assembly 30 can move along a first direction; the first driving assembly 30 may include two groups of linear motors arranged along a first direction, a first driving end is mounted on a moving end of one of the linear motors, a second driving end is mounted on a moving end of the other linear motor, and the two linear motors are independently controlled, so that the first driving end and the second driving end can respectively and independently move; a die bonding assembly 40 is arranged on the first driving end, a balance block 50 is arranged on the second driving end, wherein the weight of the balance block 50 is matched with that of the die bonding assembly 40, and the die bonding assembly 40 is used for sucking a chip; it can be understood that by controlling the two linear motors and making the movement directions of the two linear motors opposite, the first driving end and the second driving end can be made to move in opposite directions, or move in opposite directions, that is, the movement direction of the balance weight 50 is always opposite to the movement direction of the die bonding assembly 40. The linear motor may be replaced with a ball screw module provided with a motor, or may be replaced with a rack and pinion structure provided with a motor, so that the die bonding assembly 40 or the balance weight 50 may be driven correspondingly.
Specifically, when die bonding is performed, the first driving component 30 may be utilized to drive the die bonding component 40 to move, and the die is sucked by the die bonding component 40 to realize movement of the die, so as to complete the action of placing the die at the specified position, more specifically, the process of obtaining the die from the base film and placing the die on the die support can be completed; in the process of die bonding, the stage of acceleration and deceleration of the die bonding assembly 40 is involved, in this stage, since the movement directions of the first driving end and the second driving end are opposite, the movement trend of the balance block 50 opposite to the die bonding assembly 40 is generated, and therefore, the movement trend opposite to the die bonding assembly 40 can be generated through the reverse movement of the balance block 50 relative to the die bonding assembly 40, so as to offset the vibration generated by the die bonding assembly 40 in the acceleration and deceleration processes, and the overall precision is improved.
As shown in fig. 1 to 4, the die bonding assembly 40 includes a die bonding base 41 mounted on the first driving end; the die bonding base 41 is provided with a second driving component 42, and the second driving component 42 is a linear motor, a ball screw module provided with the motor, a gear rack structure provided with the motor and the like and has a linear movement function; the third drive end of the second drive assembly 42 is movable in a second direction; the second direction is perpendicular to the first direction; the third driving end is provided with a suction component 43, the suction component 43 is used for generating negative pressure, the suction component 43 can be a vacuum chuck, and the vacuum chuck is communicated with a negative pressure generating device through an air pipe so as to generate negative pressure to suck the chip; more specifically, the second direction is a direction perpendicular to the chip, and the second driving component 42 can drive the suction component 43 to move along a direction approaching or separating from the chip. For example, when the chip needs to be sucked, the second driving component 42 may drive the sucking component 43 to move downward, so that the sucking component 43 is convenient to suck the chip; then, the second driving component 42 drives the chip to rise, the first driving component 30 drives the chip to move along the first direction, and after the chip moves to the upper part of the chip bracket, the second driving component 42 drives the sucking component 43 to move downwards, so that the sucking component 43 is convenient for placing the chip on the chip bracket.
Further, as shown in fig. 2 to 4, the third driving end includes a mounting base plate 44, and the mounting base plate 44 is slidably connected with the die bonding base 41; and the suction assembly 43 is mounted on the mounting base plate 44; the die-bonding base 41 is connected with a first positioning column 451, the mounting bottom plate 44 is connected with a second positioning column 452, and a tension spring 453 is connected between the first positioning column 451 and the second positioning column 452; one end of the tension spring 453 is sleeved on the first positioning column 451, and the other end of the tension spring 453 is sleeved on the second positioning column 452. By the arrangement of the tension spring 453, a reverse stretching force can be provided for the mounting bottom plate 44 in the process of downward movement of the third driving end and the mounting bottom plate 44, so that the suction assembly 43 is more stable in the process of downward movement; in addition, during the upward movement of the suction assembly 43, its elastic potential energy is released, which can help the mounting base plate 44 reset more quickly.
Further, as shown in fig. 3 and 4, a wire guide plate 46 is further mounted on the mounting base plate 44, and a plurality of wire guide blocks 47 are mounted on the wire guide plate 46, and gaps are left between the wire guide blocks 47 and the wire guide plate 46; the wire and the air pipe can pass through the gap and be connected with the suction component 43 through the arrangement of the wire guide plate 46 and the wire guide block 47, and the wire guide plate 46 and the wire guide block 47 can play a role in positioning and limiting the wires.
In the present embodiment, the wire guide plate 46 includes a first extension portion 461 extending in the second direction and a second extension portion 462 extending in the first direction; the first extension 461 is disposed at one side of the second driving assembly 42, and the second extension 462 is disposed between the mounting base 44 and the second driving assembly 42; i.e. the wire guide plate 46 is arranged in an overall "L" shape. The wire block 47 includes a first wire block 471 and a second wire block 472, the first wire block 471 being mounted on the first extension 461, the second wire block 472 being mounted on the second extension 462.
Wherein, two first ends of the first wire block 471 along the first direction are respectively connected with the first extension parts 461 by fasteners; the two second ends of the second wire block 472 are respectively connected with the second extension 462 through fasteners; the second wire block 472 is disposed obliquely and between the suction assembly 43 and the first wire block 471. It can be appreciated that the electric wire and the air pipe first pass through the gap between the first wire block 471 and the first extension 461, and move along the second direction in a direction approaching the suction component 43; then, through the second wire block 472 that inclines to set up for electric wire and trachea are by the clearance guide suction component 43 between second wire block 472 and the second extension 462, promptly the pipeline structure that links to each other with suction component 43 can be followed first along the second direction and passed through the clearance between first wire block 471 and the first extension 461, then along the incline direction that forms an contained angle with the second direction, pass through the clearance between second wire block 472 and the second extension 462, make pipeline structure smoothly, not having the abrupt ground insert suction component 43, and pipeline structure is difficult for the deviation or swings, make above-mentioned pipeline structure more stable in the in-process of first drive assembly 30 motion, further reduce the influence of vibration.
Further, as shown in fig. 4, the first driving end includes a first driving slider 31, and the first driving slider 31 is slidably connected to the first beam 20 along the first direction; the first driving sliding seat 31 is convexly provided with a positioning boss 32 along the direction facing the die bonding assembly 40, and the positioning boss 32 is abutted with the die bonding base 41; the positioning boss 32 and the wire guide plate 46 are respectively located at two ends of the first driving sliding seat 31. It can be appreciated that the positioning boss 32 can assist the die bonding assembly 40 to quickly position and mount on the first driving slide 31, meanwhile, the main weights of the wire guide plate 46, the wire guide block 47 and the pipeline structure are distributed at one end (left side) of the first driving end, while the positioning boss 32 arranged at the right side is distributed at the other end (right side) of the first driving end, so that the overall weight on the first driving end can be balanced, the center of gravity is located at the center line of the die bonding assembly 40, and inclination or swing is not easy to occur, so that the overall is more stable.
Further, as shown in fig. 5 to 7, a third driving assembly 60 is provided between the frame 10 and the first beam 20; the third driving assembly 60 is mounted on the frame 10, the first cross beam 20 is mounted on a fourth driving end of the third driving assembly 60, and the fourth driving end can move along a third direction; the third direction is perpendicular to the first direction and the second direction, respectively. The third driving assembly 60 is a linear motor, a ball screw module configured with a motor, a rack and pinion structure configured with a motor, and the like, and has a linear movement function, and the third direction and the first direction are both located on a horizontal plane, and the third driving assembly 60 is matched with the first driving assembly 30, so that the movement of the die bonding assembly 40 on the horizontal plane can be realized.
Further, the third driving assembly 60 includes a second beam 61, and a beam connecting portion 21 is protruded from a side of the first beam 20 facing the second beam 61; the beam connecting portion 21 is slidably connected to the second beam 61 in the third direction. Wherein, be formed with the mounting groove on the crossbeam connecting portion 21, be provided with the slide rail along the third direction on the second crossbeam 61, the slide rail passes through the slider and installs in this mounting groove to realize the slip of first crossbeam 20 for second crossbeam 61.
Further, as shown in fig. 6 and 7, a positioning groove 611 is formed on a side of the second beam 61 facing the first beam 20; a first connecting plate portion 22 and a second connecting plate portion 23 are arranged between the first beam 20 and the beam connecting portion 21, and the first connecting plate portion 22 and the second connecting plate portion 23 are arranged in the positioning groove 611; the first connecting plate 22 is in contact with one side groove wall of the positioning groove 611, and the second connecting plate 23 is in contact with the other side groove wall of the positioning groove 611. It can be appreciated that the first connecting plate portion 22 and the second connecting plate portion 23 are equivalent to reinforcing ribs, and play a role of reinforcing the first beam 20, and meanwhile, through cooperation between the remaining positioning grooves 611 of the connecting plate portions, positioning accuracy between the first beam 20 and the second beam 61 can be improved, so that overall accuracy is further improved.
In summary, the vibration reduction die bonding structure provided by the invention has the advantages of less vibration, high precision, compact structure, high stability, stable structure and the like.
Example two
The die bonding equipment of the embodiment comprises a bracket feeding structure and a wafer feeding structure, wherein the vibration reduction die bonding structure is as in the first embodiment. In the first embodiment, a specific structure and a technical effect about the vibration reduction die bonding structure are described, and the die bonding apparatus of the present embodiment refers to the structure and has the technical effect as well. The support feeding structure can be a conveying structure, and the conveying structure can input the chip support to the vibration reduction die bonding structure through structures such as a conveying belt; the wafer feeding structure can be a conveying structure, and the conveying structure can input chips into the vibration reduction die bonding structure through structures such as a conveying belt; the vibration reduction die bonding structure can fix the chip on the chip bracket; additionally, the die bonding apparatus may further include a dispensing structure that may dispense glue on the chip carrier to bond the chip.
In summary, the die bonding equipment provided by the invention has the advantages of less vibration, high precision, compact structure, high stability, stable structure and the like.
The above embodiments are only for illustrating the technical solution of the present invention, and not for limiting the same; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims (10)

1. The vibration reduction die bonding structure is characterized by comprising a frame (10) and a first cross beam (20) arranged on the frame (10); a first driving assembly (30) is arranged on the first cross beam (20), and a first driving end and a second driving end of the first driving assembly (30) can move along a first direction;
a die bonding assembly (40) is arranged on the first driving end, a balance block (50) is arranged on the second driving end, and the die bonding assembly (40) is used for sucking a chip; wherein, the moving direction of the balance block (50) is opposite to the moving direction of the die bonding assembly (40).
2. A vibration damping die attach structure according to claim 1, wherein said die attach assembly (40) comprises a die attach base (41) mounted on said first drive end; a second driving assembly (42) is arranged on the die bonding base (41), and a third driving end of the second driving assembly (42) can move along a second direction; the second direction is perpendicular to the first direction;
the third driving end is provided with a suction component (43), and the suction component (43) is used for generating negative pressure.
3. A vibration damping die bonding structure according to claim 2, wherein the third driving end comprises a mounting base plate (44), the mounting base plate (44) being slidably connected to the die bonding base (41); and the suction assembly (43) is mounted on the mounting base plate (44);
the die bonding base (41) is connected with a first positioning column (451), the mounting bottom plate (44) is connected with a second positioning column (452), and a tension spring (453) is connected between the first positioning column (451) and the second positioning column (452); one end of the tension spring (453) is sleeved on the first positioning column (451), and the other end of the tension spring (453) is sleeved on the second positioning column (452).
4. A vibration-damping die bonding structure according to claim 3, wherein the mounting base plate (44) is further provided with a wire guide plate (46), the wire guide plate (46) is provided with a plurality of wire guide blocks (47), and gaps are reserved between the wire guide blocks (47) and the wire guide plate (46).
5. The vibration-damping die attach structure according to claim 4, wherein the wire guide plate (46) includes a first extension portion (461) extending in the second direction and a second extension portion (462) extending in the first direction; the first extension part (461) is arranged on one side of the second driving assembly (42), and the second extension part (462) is arranged between the mounting base plate (44) and the second driving assembly (42);
the wire block (47) comprises a first wire block (471) and a second wire block (472), the first wire block (471) is mounted on the first extension (461), and the second wire block (472) is mounted on the second extension (462);
two first ends of the first wire block (471) along the first direction are respectively connected with the first extension part (461) through fasteners;
two second ends of the second wire block (472) are respectively connected with the second extension part (462) through fasteners; the second wire block (472) is obliquely arranged and is arranged between the suction component (43) and the first wire block (471).
6. The vibration reduction die bonding structure according to claim 5, wherein the first driving end comprises a first driving slide (31), and the first driving slide (31) is slidably connected with the first beam (20) along the first direction;
the first driving sliding seat (31) is convexly provided with a positioning boss (32) along the direction facing the die bonding assembly (40), and the positioning boss (32) is abutted with the die bonding base (41); wherein the positioning boss (32) and the wire guide plate (46) are respectively positioned at two ends of the first driving sliding seat (31).
7. The vibration reduction die bonding structure according to claim 2, wherein a third driving assembly (60) is arranged between the frame (10) and the first cross beam (20); the third driving assembly (60) is mounted on the frame (10), the first cross beam (20) is mounted on a fourth driving end of the third driving assembly (60), and the fourth driving end can move along a third direction;
the third direction is perpendicular to the first direction and the second direction, respectively.
8. The vibration reduction die bonding structure according to claim 7, wherein the third driving assembly (60) comprises a second beam (61), and a beam connecting part (21) is convexly arranged on one side of the first beam (20) facing the second beam (61); the beam connecting portion (21) is slidably connected to the second beam (61) in the third direction.
9. The vibration reduction die bonding structure according to claim 8, wherein a positioning groove (611) is formed on one side of the second beam (61) facing the first beam (20);
a first connecting plate part (22) and a second connecting plate part (23) are arranged between the first cross beam (20) and the cross beam connecting part (21), and the first connecting plate part (22) and the second connecting plate part (23) are arranged in the positioning groove (611);
wherein the first connecting plate part (22) is abutted with one side groove wall of the positioning groove (611), and the second connecting plate part (23) is abutted with the other side groove wall of the positioning groove (611).
10. A die bonding apparatus comprising a carrier loading structure, a wafer loading structure, and a vibration damping die bonding structure according to any one of claims 1-9.
CN202310136469.7A 2023-02-17 2023-02-17 Vibration reduction die bonding structure and die bonding equipment Pending CN116207022A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202310136469.7A CN116207022A (en) 2023-02-17 2023-02-17 Vibration reduction die bonding structure and die bonding equipment

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