CN116169121A - Solar cell capable of reducing cutting loss - Google Patents

Solar cell capable of reducing cutting loss Download PDF

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Publication number
CN116169121A
CN116169121A CN202211695250.2A CN202211695250A CN116169121A CN 116169121 A CN116169121 A CN 116169121A CN 202211695250 A CN202211695250 A CN 202211695250A CN 116169121 A CN116169121 A CN 116169121A
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CN
China
Prior art keywords
solar cell
cell silicon
silicon wafers
cut
cuts
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Pending
Application number
CN202211695250.2A
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Chinese (zh)
Inventor
丰平
贾琛
周朋
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Zhongrun New Energy Xuzhou Co ltd
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Zhongrun New Energy Xuzhou Co ltd
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Priority to CN202211695250.2A priority Critical patent/CN116169121A/en
Publication of CN116169121A publication Critical patent/CN116169121A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/782—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, each consisting of a single circuit element
    • H01L21/784—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, each consisting of a single circuit element the substrate being a semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Electromagnetism (AREA)
  • Photovoltaic Devices (AREA)

Abstract

The invention discloses a solar cell capable of reducing cutting loss, which relates to the field of solar cells and comprises a plurality of solar cell silicon wafers, wherein a plurality of groups of pre-cuts are formed on the upper side and the lower side of each solar cell silicon wafer, two pre-cuts of each group are distributed in an up-down alignment manner, pre-cuts are formed on the front side and the rear side of each solar cell silicon wafer, the upper end and the lower end of each pre-cut are respectively aligned with and connected with the two pre-cuts of the same group, and each solar cell silicon wafer is divided into a plurality of battery units which are equally divided into a plurality of parts through the plurality of groups of pre-cuts and the plurality of pre-cuts; the solar cell silicon wafers are transversely arranged and sequentially arranged from front to back, and a gap is formed between every two adjacent solar cell silicon wafers. According to the invention, the plurality of solar cell silicon wafers are conveniently cut into the plurality of battery units through the plurality of groups of pre-cuts and the plurality of pre-cuts on the plurality of solar cell silicon wafers, so that the solar cell silicon wafers are prevented from being damaged during cutting, and the solar cell silicon wafers are convenient for people to use.

Description

Solar cell capable of reducing cutting loss
Technical Field
The invention belongs to the technical field of solar cells, and particularly relates to a solar cell capable of reducing cutting loss.
Background
The solar cell is a device for directly converting light energy into electric energy through a photoelectric effect or a photochemical effect, and can output voltage and current instantly as long as the device is illuminated, and is physically called solar photovoltaic, for short, photovoltaic, and a thin film solar cell working through the photoelectric effect is the main stream, while a wet solar cell working through the photochemical effect is still in a sprouting stage.
At present, along with the continuous development of the photovoltaic industry, the reduction of the power generation cost becomes the consistent pursuit of the photovoltaic industry, the high-efficiency component can improve the conversion efficiency, thereby reducing the occupied area of a system and the BOS cost of the system, and being pursued by the market, the half-sheet or small-sheet photovoltaic component technology and the tile-overlapping component technology are two important directions of the current high-efficiency solar component technology, wherein the half-sheet or small-sheet photovoltaic component technology adopts laser scribing equipment to divide a finished battery piece into two or more fragments, so that the internal resistance loss of the component is reduced, the power of the component is improved, but the last procedure of the finished battery piece is in the laser scribing and splitting process, the edge of the small-sheet battery after the splitting generates a damaged layer, the defect state density of the damaged layer is high, the compound current in the edge area is increased, the opening voltage drop is low, and the efficiency loss of the small-sheet battery is further caused.
Disclosure of Invention
Aiming at the situation, in order to overcome the defects of the prior art, the invention provides the solar cell capable of reducing the cutting loss, and the problems that the edge area compound current is increased, the opening voltage drop is low and the efficiency loss of the small cell is further caused because the edge of the small cell after the splitting generates a damaged layer in the laser scribing and splitting process of the last procedure of the existing finished cell are effectively solved.
In order to achieve the above purpose, the present invention provides the following technical solutions: the solar cell capable of reducing cutting loss comprises a plurality of solar cell silicon wafers, wherein a plurality of groups of pre-cuts are formed in the upper side and the lower side of each solar cell silicon wafer, two pre-cuts in each group are distributed in an up-down aligned mode, pre-cuts are formed in the front side and the rear side of each solar cell silicon wafer, the upper end and the lower end of each pre-cut are respectively aligned with and connected with the two pre-cuts in the same group, and each solar cell silicon wafer is divided into a plurality of battery units which are equally divided into a plurality of parts through the plurality of groups of pre-cuts and the plurality of pre-cuts;
the solar cell silicon wafers are transversely arranged and sequentially arranged from front to back, a gap is formed between every two adjacent solar cell silicon wafers, and retainers are arranged at the left end and the right end of each solar cell silicon wafer.
Preferably, each retainer comprises a first rectangular frame and a U-shaped plate, the first rectangular frame is slidably sleeved outside the solar cell silicon wafers, the U-shaped plate is sleeved at the end parts of the solar cell silicon wafers, two opening ends of the U-shaped plate are fixedly connected with the side walls of the first rectangular frame, a plurality of evenly distributed inserted bars are fixedly connected to the bottom plate of the U-shaped plate, each end part of each inserted bar is square, and each inserted bar corresponds to a position gap and abuts against the surfaces of two adjacent solar cell silicon wafers.
Preferably, one end of each inserted link, which is far away from the U-shaped plate, is arranged in a trapezoid shape.
Preferably, the first protection pads are fixedly arranged on the inner side walls around the first rectangular frame, and the inner side walls around the first protection pads are tightly attached to the surfaces of the solar cell silicon wafers.
Preferably, the inner side wall of the bottom plate of the U-shaped plate is fixedly provided with a second protection pad, and the second protection pad is tightly abutted against the end parts of the solar cell silicon wafers at the same time.
Preferably, the middle parts of the solar cell silicon wafers are sleeved with two second rectangular frames together, a plurality of vertical partition plates are fixedly arranged in each second rectangular frame, and the partition plates respectively penetrate through the plurality of gaps and tightly abut against the two adjacent solar cell silicon wafers.
Preferably, each pre-cut is V-shaped, and the depth of each pre-cut is 3um, and the end face of each pre-cut groove is V-shaped, and the depth of each pre-cut groove is 2um.
The invention has the technical effects and advantages that:
1. when cutting into a plurality of battery units, the solar battery silicon wafers can be fixed and supported simultaneously through the two retainers, and gaps are kept between the two adjacent solar battery silicon wafers, so that the two adjacent solar battery silicon wafers can be prevented from affecting each other during cutting, and the plurality of groups of pre-cuts and the plurality of pre-cuts on the plurality of solar battery silicon wafers are convenient for cutting the plurality of solar battery silicon wafers into a plurality of battery units, so that the solar battery silicon wafers are prevented from being damaged during cutting, and the solar battery silicon wafer cutting machine is convenient for people to use.
Drawings
The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate the invention and together with the embodiments of the invention, serve to explain the invention. In the drawings:
FIG. 1 is a schematic diagram of the front structure of the present invention;
FIG. 2 is a schematic side view of the present invention;
FIG. 3 is a schematic top view of the U-shaped plate of the present invention;
FIG. 4 is a schematic side view of a second rectangular frame according to the present invention;
FIG. 5 is a schematic diagram of a three-dimensional structure of a solar cell silicon wafer according to the present invention;
fig. 6 is a schematic top view of a solar cell silicon wafer according to the present invention.
In the figure: 1. a solar cell silicon wafer; 2. pre-cutting; 3. precutting the groove; 4. a first rectangular frame; 5. a U-shaped plate; 6. a rod; 7. a first protective pad; 8. a second protective pad; 9. a second rectangular frame; 10. a partition board.
Detailed Description
The invention provides a solar cell capable of reducing cutting loss as shown in figures 1-6, which comprises a plurality of solar cell silicon wafers 1, wherein a plurality of groups of pre-cut grooves 2 are formed in the upper side and the lower side of each solar cell silicon wafer 1, each group of two pre-cut grooves 2 are distributed in an up-down alignment manner, pre-cut grooves 3 are formed in the front side and the rear side of each solar cell silicon wafer 1, the upper end and the lower end of each pre-cut groove 3 are respectively aligned with and connected with the two pre-cut grooves 2 in the same group, and each solar cell silicon wafer 1 is divided into a plurality of equally-divided cell units through the plurality of groups of pre-cut grooves 2 and the plurality of pre-cut grooves 3;
the solar cell silicon wafers 1 are transversely arranged and sequentially arranged from front to back, gaps are formed between two adjacent solar cell silicon wafers 1, and retainers are arranged at the left end and the right end of each solar cell silicon wafer 1.
As shown in fig. 1, fig. 2 and fig. 3, each retainer comprises a first rectangular frame 4 and a U-shaped plate 5, the first rectangular frame 4 is slidably sleeved outside the solar cell silicon wafers 1, the U-shaped plate 5 is sleeved at the ends of the solar cell silicon wafers 1, two open ends of the U-shaped plate 5 are fixedly connected with the side walls of the first rectangular frame 4, a plurality of evenly distributed inserting rods 6 are fixedly connected to the bottom plate of the U-shaped plate 5, the ends of each inserting rod 6 are square, each inserting rod 6 corresponds to a position gap and abuts against the surfaces of two adjacent solar cell silicon wafers 1, the bottom plate of the U-shaped plate 5 is simultaneously abutted against the ends of the solar cell silicon wafers 1, so that the solar cell silicon wafers 1 can be aligned in sequence, the plurality of groups of pre-cut 2 on the solar cell silicon wafers 1 can be separated, gaps between the solar cell silicon wafers 1 can be kept, and when the solar cell silicon wafers 1 are cut, the adjacent two silicon wafers 1 are prevented from affecting each other.
As shown in fig. 3, an end of each of the inserting rods 6, which is far away from the U-shaped plate 5, is arranged in a trapezoid shape, so that the inserting rods 6 are conveniently inserted into the gaps respectively.
As shown in fig. 2, the inner side walls around the first rectangular frame 4 are fixedly provided with first protection pads 7, the inner side walls around the first protection pads 7 are tightly attached to the surfaces of the solar cell silicon wafers 1, so that the first rectangular frame 4 and the solar cell silicon wafers 1 can be protected, and damage to the solar cell silicon wafers 1 is avoided.
As shown in fig. 3, the second protection pad 8 is fixedly arranged on the inner side wall of the bottom plate of the U-shaped plate 5, and the second protection pad 8 is tightly propped against the end parts of the solar cell silicon wafers 1, so that the U-shaped plate 5 and the solar cell silicon wafers 1 can be protected, and damage to the end parts of the solar cell silicon wafers 1 is avoided.
As shown in fig. 1 and fig. 4, two second rectangular frames 9 are sleeved together in the middle of the solar cell silicon wafers 1, a plurality of vertical separators 10 are fixedly arranged in each second rectangular frame 9, the plurality of separators 10 respectively penetrate through the plurality of gaps and tightly abut against the two adjacent solar cell silicon wafers 1, and the plurality of solar cell silicon wafers 1 can be kept and supported.
Simultaneously, every is the setting of V-arrangement all to cut 2 in advance, and the degree of depth of every 2um in advance, and the terminal surface of every 3 in advance cutting groove also is the setting of V-arrangement, and the degree of depth of every 3 in advance cutting groove is 2um.
The working principle of the invention is as follows: when the solar cell silicon wafer 1 is cut into a plurality of battery units, the plurality of solar cell silicon wafers 1 can be fixed and supported simultaneously through the two retainers, and gaps are kept between the two adjacent solar cell silicon wafers 1, so that the mutual influence of the two adjacent solar cell silicon wafers 1 can be avoided when the solar cell silicon wafers 1 are cut, the solar cell silicon wafers 1 are conveniently cut into a plurality of battery units through a plurality of groups of precuts 2 and a plurality of precuts 3 on the solar cell silicon wafers 1, the solar cell silicon wafers 1 are prevented from being damaged when being cut, and the solar cell silicon wafer is convenient for people to use.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (7)

1. A solar cell capable of reducing cutting loss, characterized in that: the solar cell silicon wafer manufacturing device comprises a plurality of solar cell silicon wafers (1), wherein a plurality of groups of pre-cut openings (2) are formed in the upper side and the lower side of each solar cell silicon wafer (1), each group of two pre-cut openings (2) are distributed in an up-down alignment mode, pre-cut grooves (3) are formed in the front side and the rear side of each solar cell silicon wafer (1), the upper end and the lower end of each pre-cut groove (3) are respectively aligned with and connected with the two pre-cut openings (2) in the same group, and each solar cell silicon wafer (1) is divided into a plurality of equal cell units through the plurality of groups of pre-cut openings (2) and the plurality of pre-cut grooves (3);
the solar cell silicon wafers (1) are transversely arranged and sequentially arranged from front to back, gaps are formed between every two adjacent solar cell silicon wafers (1), and retainers are arranged at the left end and the right end of each solar cell silicon wafer (1).
2. A solar cell capable of reducing cutting loss according to claim 1, wherein: every the holder all includes first rectangle frame (4) and U-shaped board (5), the outside at a plurality of solar cell silicon chip (1) is established to first rectangle frame (4) slip cap, the tip at a plurality of solar cell silicon chip (1) is established to U-shaped board (5) cover, and two open ends of U-shaped board (5) all with the lateral wall fixed connection of first rectangle frame (4), fixedly connected with a plurality of evenly distributed inserted bars (6) on the bottom plate of U-shaped board (5), every the tip of inserted bar (6) all is square setting, and in every inserted bar (6) all correspond the position space and with its adjacent two solar cell silicon chip (1) surface offsets.
3. A solar cell capable of reducing cutting loss according to claim 2, wherein: one end of each inserted link (6) far away from the U-shaped plate (5) is arranged in a trapezoid shape.
4. A solar cell capable of reducing cutting loss according to claim 3, wherein: the solar cell is characterized in that first protection pads (7) are fixedly arranged on the inner side walls around the first rectangular frame (4), and the inner side walls around the first protection pads (7) are tightly attached to the surfaces of the solar cell silicon wafers (1).
5. A solar cell capable of reducing cut loss according to claim 4, wherein: the bottom plate inside wall of U-shaped board (5) is fixed to be provided with second protection pad (8), second protection pad (8) are closely supported with the tip of a plurality of solar cell silicon chip (1) simultaneously.
6. A solar cell capable of reducing cut loss according to claim 5, wherein: two second rectangular frames (9) are sleeved on the middle parts of the solar cell silicon wafers (1) together, a plurality of vertical baffles (10) are fixedly arranged in each second rectangular frame (9), and the baffles (10) respectively penetrate through a plurality of gaps and tightly abut against the two adjacent solar cell silicon wafers (1).
7. A solar cell capable of reducing cutting loss according to claim 6, wherein: every all be V-arrangement setting in advance incision (2), and the degree of depth of every incision (2) in advance is 3um, every the terminal surface of grooving (3) in advance is V-arrangement setting too, and the degree of depth of grooving (3) in advance is 2um in every.
CN202211695250.2A 2022-12-28 2022-12-28 Solar cell capable of reducing cutting loss Pending CN116169121A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202211695250.2A CN116169121A (en) 2022-12-28 2022-12-28 Solar cell capable of reducing cutting loss

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202211695250.2A CN116169121A (en) 2022-12-28 2022-12-28 Solar cell capable of reducing cutting loss

Publications (1)

Publication Number Publication Date
CN116169121A true CN116169121A (en) 2023-05-26

Family

ID=86410535

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202211695250.2A Pending CN116169121A (en) 2022-12-28 2022-12-28 Solar cell capable of reducing cutting loss

Country Status (1)

Country Link
CN (1) CN116169121A (en)

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