CN218299756U - Silicon chip degumming frame and silicon chip degumming machine - Google Patents

Abstract

The application discloses a silicon wafer degumming rack and a silicon wafer degumming machine, which relate to the technical field of silicon wafer processing. In the embodiment of the present application, the silicon wafer degumming frame includes: a frame body, and at least one blocking rod assembly; A side bar, the end plate, the bottom bar and the side bar enclose an accommodating space for accommodating silicon wafers; wherein, two side bars are arranged oppositely on both sides of the end plate; the blocking bar assembly is arranged in the accommodating space and along the The length direction of the side bar extends, and the blocking bar assembly is detachably connected to the two end plates, and divides the accommodating space into at least two accommodating slots. In the embodiment of the present application, the silicon wafer degumming rack can carry silicon wafers of different sizes for degumming as required, and has a simple structure, good compatibility, and high reuse rate.

Description

A silicon wafer degumming rack and a silicon wafer degumming machine

technical field

The application belongs to the field of solar photovoltaic technology, and in particular relates to a silicon wafer degumming frame and a silicon wafer degumming machine.

Background technique

With the development of photovoltaic technology, solar energy has been widely promoted as a green, environmentally friendly and renewable energy. Solar photovoltaic half-chip technology has been widely promoted due to its advantages of high photoelectric conversion efficiency and low cost.

In the prior art, usually, the silicon wafer after slicing the silicon rod is directly prepared into a whole piece of photovoltaic cell, and then the whole piece of photovoltaic cell is cut with a laser, so as to obtain a half piece of photovoltaic cell. However, the way of directly cutting the whole cell to prepare small-sized cells is easy to form thermal and mechanical damage at the section, and these damages will introduce defect states at the cut section of the battery, and these defect states will cause minority carrier recombination, resulting in The conversion efficiency of small-sized cells is reduced, and cutting and splitting at the cell end may cause problems such as fragments and cracks. In order to avoid the above problems, at present, after cutting half or 1/N small-sized silicon wafers, the half or 1/N small-sized silicon wafers are prepared into corresponding half-cut batteries or 1/N small-sized batteries. It has gradually become the direction of preparing half-sheet or 1/N-sheet small-sized batteries.

However, most of the existing silicon wafer degumming racks are designed according to the shape and size of the entire silicon wafer, which leads to the fact that the existing silicon wafer degumming racks cannot carry half or 1/N small-sized silicon wafers at the same time. Wafer size processing silicon wafer degumming frame will cause waste of production cost.

Utility model content

The purpose of the embodiments of the present application is to provide a silicon wafer degumming machine and a silicon wafer degumming machine, which can solve the problem that the traditional silicon wafer degumming rack cannot carry half or 1/N small-sized silicon wafers.

In the first aspect, the embodiment of the present application provides a silicon wafer degumming rack, the silicon wafer degumming rack includes: a rack body, and at least one blocking rod assembly;

The frame body includes: a pair of opposite end plates, and at least one bottom bar and two side bars connected between the two end plates, the end plates, the bottom bar and the side bars Enclosing an accommodating space; wherein, the two side bars are relatively arranged on both sides of the end plate;

The blocking rod assembly is arranged in the accommodation space and extends along the length direction of the side bar, the blocking rod assembly is detachably connected to the two end plates, and divides the accommodation space into at least Two storage slots.

Optionally, the blocking rod assembly includes: a parallel bottom plate and a separation rod, the bottom plate and the separation rod are respectively detachably connected to the two end plates;

Wherein, the bottom plate is arranged close to the bottom bar;

The separating rod is arranged on the side of the bottom plate away from the bottom rod.

Optionally, the number of the separating rod is one;

Along the direction perpendicular to the bottom plate, the projection of the partition bar on the bottom plate is located on the center line of the bottom plate.

Optionally, there are multiple partition bars, and the plurality of partition bars are distributed along a direction parallel to the bottom plate.

Optionally, the blocking rod assembly further includes: a buffer sleeve, and the buffer sleeve is covered on the partition rod.

Optionally, the barrier bar assembly further includes: a buffer film, the buffer film covers the side of the bottom plate close to the partition bar.

Optionally, the bottom plate includes: a bottom plate body, and two connecting plates connected to two ends of the bottom plate body;

The connecting plates correspond to the end plates one by one, and the connecting plates are detachably connected to the end plates;

Two ends of the separating rod are respectively fixedly connected to the connecting plate opposite to it.

Optionally, the bottom plate body and the connecting plate are integrally formed.

Optionally, when the number of the blocking rod assembly is one, one of the blocking rod assemblies is arranged in the center of the accommodating space;

When the number of the stop rod assemblies is multiple, a plurality of the stop rod assemblies are distributed at intervals in the accommodating space, and one of the stop rod assemblies is formed between two adjacent stop rod assemblies. holding tank.

In the second aspect, the embodiment of the present application further provides a silicon wafer degumming machine, including the above-mentioned silicon wafer degumming rack.

In the embodiment of the present application, since the stop bar assembly is arranged in the accommodation space and extends along the length of the side bar, the stop bar assembly is detachably connected to the two end plates, and divides the accommodation space into at least two accommodation slots , therefore, in practical applications, two or more accommodating slots can be separated by setting one or more blocking rod assemblies in the frame, and each accommodating slot can carry half a silicon wafer or 1/N slice Small-sized silicon wafers, or, after all the blocking rod components are removed, the entire silicon wafer can be carried in the accommodation space. In the embodiment of this application, the silicon wafer degumming rack can carry silicon wafers of different sizes for degumming as required, and has a simple structure, good compatibility, and high reuse rate, which can effectively avoid the waste of production costs caused by the production of silicon wafer degumming racks of various specifications question.

Description of drawings

Fig. 1 is one of the structural representations of the silicon wafer degumming frame described in the embodiment of the present application;

Fig. 2 is the second structural diagram of the silicon wafer degumming rack described in the embodiment of the present application;

Fig. 3 is the second structural schematic diagram of the silicon wafer degumming rack described in the embodiment of the present application;

Fig. 4 is one of the structural schematic diagrams of the bar assembly described in the embodiment of the present application;

Fig. 5 is the second structural schematic diagram of the bar assembly described in the embodiment of the present application;

Fig. 6 is the third structural schematic diagram of the bar assembly described in the embodiment of the present application;

Fig. 7 is the fourth schematic structural view of the stop rod assembly according to the embodiment of the present application.

Explanation of reference signs:

10: Frame body; 20: Bar assembly; 30: Accommodating slot; 11: End plate; 12: Bottom bar; 13: Side bar; 21: Bottom plate; 22: Divider bar; 211: Bottom plate body; .

detailed description

The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of this application.

The terms "first", "second" and the like in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific sequence or sequence. It is to be understood that the data so used are interchangeable under appropriate circumstances such that the embodiments of the application can be practiced in sequences other than those illustrated or described herein. In addition, "and/or" in the specification and claims means at least one of the connected objects, and the character "/" generally means that the related objects are an "or" relationship.

The silicon wafer degumming rack and the silicon wafer degumming machine provided in the embodiments of the present application will be described in detail below through specific embodiments and application scenarios with reference to the accompanying drawings.

Referring to FIG. 1 to FIG. 3 , there are shown schematic structural views of the silicon wafer degumming rack described in the embodiment of the present application.

In the embodiment of the present application, the silicon wafer degumming frame may specifically include: a frame body 10, and at least one blocking rod assembly 20; the frame body 10 includes: a pair of end plates 11 arranged oppositely, and a At least one bottom rod 12 and two side rods 13, the end plate 11, the bottom rod 12 and the side rods 13 are enclosed into an accommodating space for accommodating silicon wafers; On both sides: the blocking rod assembly 20 is arranged in the accommodation space and extends along the length direction of the side rod 13, the blocking rod assembly 20 is detachably connected to the two end plates 11, and divides the accommodation space into at least two accommodation slots 30.

In the embodiment of the present application, since the blocking bar assembly 20 is arranged in the accommodation space and extends along the length of the side bar 13, the blocking bar assembly 20 is detachably connected to the two end plates 11, and divides the accommodation space into at least two parts. Therefore, in practical applications, one or more blocking rod assemblies 20 can be arranged in the frame body 10, thereby separating two or more accommodating grooves 30, each accommodating groove 30 It can carry half a silicon wafer or 1/N small-sized silicon wafers, or, after removing the bar assembly 20 completely, it can carry a whole silicon wafer in the accommodating space. In the embodiment of this application, the silicon wafer degumming rack can carry silicon wafers of different sizes for degumming as required, and has a simple structure, good compatibility, and high reuse rate, which can effectively avoid the waste of production costs caused by the production of silicon wafer degumming racks of various specifications question.

It should be noted that when a plurality of silicon wafers are arranged in the accommodating tank 30 , they are stacked sideways from one end plate 11 to the other end plate 11 . The stacking direction of the silicon wafers is consistent with the length direction of the side bars 13 .

The silicon wafer degumming rack in the embodiment of the present application can be used for degumming the cut whole piece or 1/N silicon wafer; wherein, by setting one or more blocking rod assemblies 20, the accommodating space can be divided into at least Two accommodating tanks 30, so that a group of small silicon wafers (1/2 silicon wafer, 1/3 silicon wafer, 1/4 silicon wafer, etc.) can be placed in each housing tank 30 for degumming. In the case where the number of accommodating tanks 30 is greater than or equal to 2, the silicon wafer degumming rack in the embodiment of the present application can be used for degumming a group of silicon wafers at the same time Two or more groups of small silicon wafers (1/2 silicon wafer, 1/3 silicon wafer, 1/4 silicon wafer, etc.) are degummed, so that the degumming efficiency of small silicon wafers can be effectively improved.

Referring to FIG. 4 to FIG. 7 , there are shown schematic structural diagrams of the stop rod assembly according to the embodiment of the present application.

In the embodiment of the present application, there may be one or more blocking rod assemblies 20 . In the embodiment of the present application, the number of the bar assembly 20 is three as an example for illustration. In the embodiment of the present application, when the number of the stop bar assembly 20 is one, one stop bar assembly 20 can be arranged in the center of the accommodation space, and the stop bar assembly 20 divides the accommodation space into two accommodation spaces of the same size. Groove 30; Wherein, each accommodating groove 30 can be used for the degumming of a group of half silicon wafers; The silicon wafer degumming rack can simultaneously degumming two groups of half silicon wafers, thereby effectively improving the degumming efficiency of the half silicon wafers. It should be noted that one bar assembly 20 can also divide the accommodating space into two accommodating grooves 30 of different sizes, so that the two accommodating grooves 30 carry 1/N small silicon wafers of different sizes.

In the embodiment of the present application, when the number of stop rod assemblies 20 is multiple (greater than or equal to two), a plurality of stop rod assemblies 20 are distributed at intervals in the accommodating space, and two adjacent stop rod assemblies An accommodating groove 30 is formed between the components 20, so that the number of accommodating grooves 30 separated by a plurality of bar assemblies 20 is greater than or equal to three. In this way, the silicon wafer degumming rack can degumming multiple groups of small-sized silicon wafers at the same time, thereby effectively improving the degumming efficiency of small-sized silicon wafers. It should be noted that, in the case of multiple blocking rod assemblies 20, the multiple blocking rod assemblies 20 can divide the accommodating space into a plurality of accommodating grooves 30 of the same size or a plurality of accommodating grooves of different sizes. 30, so that the silicon wafers whose dimensions and specifications are compatible with the holding tank 30 can be selected for degumming. In the embodiment of the present application, the silicon wafer degumming rack can be adapted to various sizes of small-sized silicon wafers, and has a wider application range and stronger compatibility.

In the embodiment of the present application, the number of partition components+1=the number of accommodating slots 30 .

In the embodiment of the present application, the blocking rod assembly 20 can be detachably connected to the end plate 11 in various ways such as clamping, screw and other fastener connections, which is not limited in this embodiment of the present application.

In the embodiment of the present application, the bar assembly 20 may specifically include: a bottom plate 21 and a partition bar 22, the bottom plate 21 and the spacer bar 22 are detachably connected to the two end plates 11 respectively; wherein, the bottom plate 21 is arranged close to the bottom bar 12; the spacer bar 22 is disposed on the side of the bottom plate 21 away from the bottom bar 12 . In the embodiment of the present application, the bottom plate 21 is used to carry silicon wafers, and the partition rod 22 is used to divide the storage space into at least two storage tanks 30 , and the adjacent storage tanks 30 are separated by the partition rod 22 . In practical applications, the bottom plate 21 and the separating rod 22 can be connected to the end plate 11 respectively, or the separating rod 22 and the bottom plate 21 are connected to form an assembly, and then connected to the end plate 11 .

It can be understood that, along the direction from one side bar 13 to the other side bar 13 , the size of the bottom plate 21 is larger than the size of the partition bar 22 . Specifically, the separating rod 22 may be a round rod, a square rod or the like.

In the embodiment of the present application, the number of the separating rods 22 may be one or more (greater than or equal to two). When the quantity of dividing bar 22 is one, along the direction perpendicular to base plate 21, the projection of dividing bar 22 on base plate 21 is positioned at the center line of base plate 21; When the quantity of dividing bar 22 is multiple, a plurality of dividing bars 22 can be distributed along a direction parallel to the bottom plate 21, wherein the gaps between two adjacent spacer bars 22 can be the same to form a plurality of accommodating grooves 30 of the same size, or two adjacent spacer bars 22 The gaps therebetween can be different, so as to form multiple accommodating grooves 30 with different sizes.

Optionally, the blocking rod assembly 20 may further include: a buffer sleeve covering the partition rod 22 .

In practical application, the buffer sleeve sleeved on the separation rod 22 can play a role of flexible buffering, and then can protect the silicon wafer from collision with the separation rod 22 during degumming, causing the silicon wafer to be damaged.

Optionally, the blocking bar assembly 20 may further include: a buffer film covering the side of the bottom plate 21 close to the partition bar 22 .

In the embodiment of the present application, the buffer film can be made of soft materials such as silica gel and rubber. In this way, when the silicon wafer falls on the bottom plate 21 during the degumming process, it can first drop on the buffer film, and the buffer film acts as a flexible buffer. The role of silicon wafers to avoid bump damage, effectively reduce the damage rate of silicon wafers in the process of degumming.

In the embodiment of the present application, the bottom plate 21 may specifically include: the body of the bottom plate 21, and two connecting plates 212 connected to both ends of the body of the bottom plate 21; the connecting plates 212 correspond to the end plates 11 one by one, and the connecting plates 212 are detachably connected to the Both ends of the plate 11 and the separating rod 22 are respectively fixedly connected to the connecting plate 212 opposite to it. In the embodiment of the present application, the bottom plate 21 is connected with the partition bar 22 to form an integral assembly, so that the blocking bar assembly 20 can be connected to the end plate 11 more conveniently and quickly. Specifically, the connection plates 212 may be detachably connected to the end plates 11 in various manners, such as clip connection, screw connection, and the like.

In the embodiment of the present application, the main body of the bottom plate 21 and the connecting plate 212 are integrally formed. Specifically, in the embodiment of the present application, the main body of the bottom plate 21 and the connecting plate 212 can be bent to form a U-shaped structure by sheet metal, which has a simple structure and low processing cost.

To sum up, the silicon wafer degumming rack described in the embodiment of the present application at least includes the following advantages:

In the embodiment of the present application, since the stop bar assembly is arranged in the accommodation space and extends along the length of the side bar, the stop bar assembly is detachably connected to the two end plates, and divides the accommodation space into at least two accommodation slots , therefore, in practical applications, two or more accommodating slots can be separated by setting one or more blocking rod assemblies in the frame, and each accommodating slot can carry half a silicon wafer or 1/N slice Small-sized silicon wafers, or, after all the blocking rod components are removed, the entire silicon wafer can be carried in the accommodation space. In the embodiment of this application, the silicon wafer degumming rack can carry silicon wafers of different sizes for degumming as required, and has a simple structure, good compatibility, and high reuse rate, which can effectively avoid the waste of production costs caused by the production of silicon wafer degumming racks of various specifications question.

The embodiment of the present application also provides a silicon wafer degumming machine, including the above-mentioned silicon wafer degumming rack.

It should be noted that the structure and working principle of the silicon wafer degumming rack described in the embodiment of the present application are the same as those of the silicon wafer degumming rack in the foregoing embodiments, and will not be repeated here.

In the embodiment of the present application, since the stop bar assembly is arranged in the accommodation space and extends along the length of the side bar, the stop bar assembly is detachably connected to the two end plates, and divides the accommodation space into at least two accommodation slots , therefore, in practical applications, two or more accommodating slots can be separated by setting one or more blocking rod assemblies in the frame, and each accommodating slot can carry half a silicon wafer or 1/N slice Small-sized silicon wafers, or, after all the blocking rod components are removed, the entire silicon wafer can be carried in the accommodation space. In the embodiment of this application, the silicon wafer degumming rack can carry silicon wafers of different sizes for degumming as required, and has a simple structure, good compatibility, and high reuse rate, which can effectively avoid the waste of production costs caused by the production of silicon wafer degumming racks of various specifications question.

The embodiments of the present application have been described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementations. The above-mentioned specific implementations are only illustrative and not restrictive. Those of ordinary skill in the art will Under the inspiration of this application, without departing from the purpose of this application and the scope of protection of the claims, many forms can also be made, all of which belong to the protection of this application.

Claims (10)

1. The silicon wafer degumming frame is characterized by comprising: the device comprises a frame body and at least one stop lever component;

the support body includes: the pair of end plates are oppositely arranged, and at least one bottom rod and two side rods are connected between the two end plates, and the end plates, the bottom rods and the side rods enclose an accommodating space; the two side rods are oppositely arranged on two sides of the end plate;

the stop lever assembly is arranged in the accommodating space and extends along the length direction of the side rods, and the stop lever assembly is detachably connected to the two end plates and divides the accommodating space into at least two accommodating grooves.

2. The silicon wafer debonding frame of claim 1, wherein the stop lever assembly comprises: the bottom plate and the separation rod are respectively detachably connected with the two end plates;

wherein the bottom plate is arranged close to the bottom rod;

the separating rod is arranged on one side of the bottom plate, which is far away from the bottom rod.

3. The silicon wafer debonding frame of claim 2, wherein the number of the separation bars is one;

along the direction perpendicular to the bottom plate, the projection of the separating rod on the bottom plate is positioned on the central line of the bottom plate.

4. The silicon wafer debonding frame of claim 2, wherein the number of the separation rods is multiple, and the multiple separation rods are distributed along a direction parallel to the bottom plate.

5. The silicon wafer debonding frame of claim 2, wherein the stop lever assembly further comprises: the buffer sleeve covers the separating rod.

6. The silicon wafer debonding frame of claim 2, wherein the stop lever assembly further comprises: the buffer film covers the side face, close to the separation rod, of the bottom plate.

7. The silicon wafer debonding frame of claim 2, wherein the base plate comprises: the bottom plate comprises a bottom plate body and two connecting plates connected to two ends of the bottom plate body;

the connecting plates correspond to the end plates one to one, and the connecting plates are detachably connected to the end plates;

two ends of the separating rod are respectively and fixedly connected with the connecting plate opposite to the separating rod.

8. The silicon wafer degumming frame according to claim 7, wherein said bottom plate body and said connecting plate are of an integrally formed structure.

9. The silicon wafer degumming frame according to claim 1, wherein one stop lever assembly is arranged in the center of the accommodating space in case that the number of the stop lever assemblies is one;

under the condition that the number of the stop lever assemblies is multiple, the stop lever assemblies are distributed in the accommodating space at intervals, and one accommodating groove is formed between every two adjacent stop lever assemblies.

10. The silicon wafer degumming machine is characterized by comprising the following components: the silicon wafer debonding frame of any one of claims 1 to 9.

Images