CN116168954A - Electrolytic capacitor - Google Patents
Electrolytic capacitor Download PDFInfo
- Publication number
- CN116168954A CN116168954A CN202111411832.9A CN202111411832A CN116168954A CN 116168954 A CN116168954 A CN 116168954A CN 202111411832 A CN202111411832 A CN 202111411832A CN 116168954 A CN116168954 A CN 116168954A
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- China
- Prior art keywords
- capacitor
- base
- electrolytic capacitor
- pins
- metal layers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000003990 capacitor Substances 0.000 title claims abstract description 123
- 239000002184 metal Substances 0.000 claims abstract description 53
- 229910052751 metal Inorganic materials 0.000 claims abstract description 53
- 238000004806 packaging method and process Methods 0.000 claims abstract description 10
- 229910000679 solder Inorganic materials 0.000 claims description 9
- 239000003989 dielectric material Substances 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 238000002955 isolation Methods 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 3
- 238000004804 winding Methods 0.000 claims description 3
- 238000007789 sealing Methods 0.000 abstract description 14
- 238000005516 engineering process Methods 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 239000007788 liquid Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 229920001940 conductive polymer Polymers 0.000 description 2
- 239000003792 electrolyte Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/08—Housing; Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/008—Terminals
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The electrolytic capacitor comprises a capacitor body and a base body, wherein the capacitor body comprises a packaging body, a capacitor and at least two pins, the capacitor is arranged in the packaging body and is covered and sealed by the packaging body, the at least two pins are respectively provided with an inner end and an outer end, the inner ends are electrically connected with the capacitor, and the outer ends penetrate out of the capacitor; the base body is arranged at the position where the pins penetrate out of the capacitor and comprises a base and at least two metal layers, the base is provided with at least two setting openings, and each pin penetrates into each setting opening and is electrically connected with each metal layer; the package body directly covers the capacitor to replace the conventional shell and the elastic sealing body, so that the sealing degree of the electrolytic capacitor can be improved, and the metal layer replaces the bent part of the pin in the conventional technology to serve as a medium for electrically connecting the pin with the outside, so that the simplification of the manufacturing process is facilitated.
Description
Technical Field
An electrolytic capacitor, in particular to an electrolytic capacitor capable of improving the tightness between a shell and an elastic sealing body.
Background
Electrolytic capacitors are common electronic components in electronic circuit devices that have a wide range of applications, such as storing electrical energy, improving power factor, filtering, and resonating. The general electrolytic capacitor is manufactured by forming, polymerizing and aging the capacitor element with the forming liquid, the oxidant, the monomer material and the like to form a capacitor, then placing the capacitor in a shell, and sealing the opening end of the shell by an elastic sealing body to form a closed space inside the shell, wherein the capacitor is positioned in the closed space, thereby being isolated from external moisture and air.
However, in the conventional electrolytic capacitor, the connection between the elastic sealing body and the inner wall of the housing is poor, so that the elastic sealing body and the housing are not easily sealed and have a gap, and the poor sealing between the elastic sealing body and the housing can cause external moisture to enter the electrolytic capacitor from the gap, thereby affecting the performance and the service life of the electrolytic capacitor.
On the other hand, as electronic goods gradually trend toward miniaturization, surface mount technology (Surface Mount Technology, SMT) is becoming the mainstream of electronic component mounting nowadays, and electrolytic capacitors are also one of them. In order to apply the surface-mount technology to the electrolytic capacitor, two pins of the electrolytic capacitor must be combined with a base, the two pins are connected with the base by penetrating the two pins into two connecting holes of the base, and then the two pins penetrating the two connecting holes are further bent towards the base, so that the two pins are attached to the bottom surface of the base, and the two pins are attached to the electronic device, so that the electrolytic capacitor can be welded on the bottom surface of the base.
Therefore, it is necessary to improve the conventional electrolytic capacitor, simplify the process of connecting the capacitor body and the base, and improve the problem of poor tightness between the housing and the elastic sealing body.
Disclosure of Invention
Accordingly, the present invention is directed to an electrolytic capacitor for improving the adhesion of the electrolytic capacitor and simplifying the process of connecting the electrolytic capacitor to a base.
To achieve the above object, the electrolytic capacitor of the present invention comprises:
a capacitor body, comprising:
a package;
the capacitor is arranged in the packaging body and is covered and sealed by the packaging body;
at least two pins, each having an inner end and an outer end, wherein each inner end of the at least two pins is electrically connected with the capacitor, and each outer end of the at least two pins passes through the capacitor; and
the base body is arranged at the position where the at least two pins penetrate out of the capacitor and comprises a base and at least two metal layers, the base comprises at least two arrangement ports corresponding to the at least two metal layers respectively, the at least two metal layers respectively comprise a first connection part and a second connection part, each first connection part is arranged at each arrangement port, and each second connection part is respectively attached to a bottom surface of the base;
wherein, the at least two pins are respectively electrically connected with the at least two metal layers.
In the electrolytic capacitor, the capacitor is covered and sealed by the integrally formed packaging body, and the packaging body is used for replacing the traditional shell and the elastic sealing body, so that the capacitor is prevented from being deteriorated due to contact with air. On the other hand, the first connecting parts of the at least two metal layers are respectively and electrically connected with the pins, and the second connecting parts extend to a bottom surface of the base.
Drawings
Fig. 1: the electrolytic capacitor of the present invention is a schematic bottom perspective view of the first embodiment.
Fig. 2: the electrolytic capacitor of the present invention is a schematic top perspective view of a first embodiment thereof.
Fig. 3: the electrolytic capacitor of the present invention is a schematic bottom plan view of the first embodiment.
Fig. 4: the electrolytic capacitor of the present invention is a schematic sectional side view of the first embodiment thereof.
Fig. 5: the electrolytic capacitor of the present invention is a schematic bottom perspective view of a second embodiment thereof.
Fig. 6: the electrolytic capacitor of the present invention is a schematic top perspective view of a second embodiment thereof.
Fig. 7: the electrolytic capacitor of the present invention is a schematic bottom plan view of the second embodiment thereof.
Detailed Description
The technical means adopted by the invention to achieve the preset aim are further described below by matching with the drawings and the preferred embodiments of the invention.
Referring to fig. 1 to 4, in a first embodiment, the electrolytic capacitor of the present invention includes a capacitor body 10 and a base body 20, wherein the capacitor body 10 includes a package 11, a capacitor 13, a protection layer 14 and at least two leads 15, and the capacitor body 10 is disposed on the base body 20.
As shown in fig. 4, the package 11 encapsulates the capacitor 13 and seals the capacitor 13 on the base body 20, so as to provide a protection function for the capacitor 13, to prevent the capacitor 13 from contacting with external moisture and air, and to avoid oxidation, current leakage or dielectric material overflow of the capacitor 13, wherein the package 11 may be formed by curing a gel, and in this embodiment, the package 11 is a square package.
The capacitor 13 is disposed in the package 11, and the capacitor 13 comprises a capacitor element and a dielectric material combined with the capacitor element, wherein the capacitor element is formed by alternately winding an anode film, a cathode film and a plurality of isolation layers, each isolation layer is disposed between the anode film and the cathode film and is used for preventing the anode film and the cathode film from being short-circuited due to contact during winding, the capacitor element can be combined with different dielectric materials to form a liquid, solid or solid-liquid capacitor, the dielectric material used in the liquid capacitor is electrolyte, the dielectric material used in the solid-liquid capacitor is conductive polymer, and the dielectric material used in the solid-liquid capacitor is both electrolyte and conductive polymer.
The protection layer 14 is disposed between the capacitor 13 and the package 11, and is used for preventing molding material from flowing into a gap between an anode film and a cathode film of the capacitor 13 to affect the operation of the capacitor 13 when the package 11 is formed by injecting glue.
In this embodiment, the at least two pins 15 are taken as two pins 15, each pin 15 has an inner end 151 and an outer end 152, the inner end 151 of each pin 15 extends into the capacitor 13 to be electrically connected with the capacitor 13, the outer end 152 extends out of the capacitor 13, the inner end 151 of one pin 15 is connected with the anode film of the capacitor 13 to be regarded as an anode pin, and the inner end 151 of the other pin 15 is connected with the cathode film of the capacitor 13 to be regarded as a cathode pin.
The base body 20 is disposed at a position where the at least two pins 15 pass through the capacitor 13, and the base body 20 includes a base 21 and at least two metal layers 22, in this embodiment, taking the at least two metal layers 22 as an example, the base 21 may be an insulating base, the base 21 includes a first side 211, a second side 212, a third side 213, a fourth side 214, a top 215, a bottom 216 and at least two openings 218, the number of the at least two openings 218 is the same as the number of the at least two pins 15, in this embodiment, the at least two openings 218 are two openings 218, for example, the first side 211 is opposite to the third side 213, the second side 212 is opposite to the fourth side 214, the at least two pins 15 pass through the bottom 216 of the base 21, and each of the openings 218 may pass through the top 215 and the bottom 216 of the base 21. The two metal layers 22 may be two copper plating layers formed on the base 21 through electroplating, wherein, as shown in fig. 4, each metal layer 22 includes a first connecting portion 221 and a second connecting portion 222, the first connecting portion 221 is formed on a wall surface of each of the setting openings 218 of the base 21 and extends to the top surface 215, and has a through hole 223, the through hole 223 penetrates through the top surface 215 and the bottom surface 216 of the base 21, wherein one metal layer 22 is attached to the bottom surface 216 and the first side surface 211, and the end of the second connecting portion 222 extends to the edge of the top surface 215, such that the second connecting portion 222 forms a hook-shaped first fixing structure at the edges of the first side surface 211 and the top surface 215 to prevent the metal layer 22 from falling off from the base 21, and the end of the second connecting portion 222 of the metal layer 22 is not protruded out of the first side surface 211 and is flush with the first side surface 211, and the other metal layer 22 is attached to the bottom surface 216 and the first side surface 211, and the end of the second connecting portion 222 is not protruded out of the second side surface 213 is flush with the third side surface 213, and the end of the second connecting portion 213 is not protruded from the third side surface 213.
In this embodiment, the base body 20 further includes an insulating layer 24, and the insulating layer 24 is disposed between the base 21 and the capacitor body 10 and covers the top surface 215 and the second connection portions 222 disposed on the top surface 215, so as to prevent the housing 11 of the capacitor body 10 from being electrically connected to the metal layers 22 extending to the top surface 215.
In this embodiment, the base body 20 is further provided with two grooves 25, the two grooves 25 penetrate through the top surface 215 and the bottom surface 216 of the base body 20, one groove 25 is disposed on the first side surface 211 of the base body 20, the second connecting portion 222 of the metal layer 22 on the first side surface 211 is disposed at the groove 25 and along the wall surface of the groove 25, wherein the second connecting portion 222 does not protrude the edges of the groove 25 on the first side surface 211 and the top surface 215, the other groove 25 is disposed on the third side surface 216 of the base body 20, and the second connecting portion 222 of the metal layer 22 on the third side surface 213 is disposed at the groove 25 and along the wall surface of the groove 25, wherein the second connecting portion 222 does not protrude the edges of the groove 25 on the third side surface 213 and the top surface 215. When different electrolytic capacitors are required to be connected due to packaging or configuration problems, the positions of the grooves 25 can be aligned with each other, in this embodiment, each groove 25 is a square groove, the grooves 25 of different electrolytic capacitors can form square holes by contacting with each other, and external electronic devices can be electrically connected with different electrolytic capacitors through wires in the square holes formed by each groove 25.
In addition, the package 11 is connected to one side of the first side 211 of the base 21, and may have a channel 111 in communication with the groove 25 on the first side 211, and similarly, the package 11 is connected to one side of the third side 213 of the base 21, and may have another channel 111 in communication with the groove 25 on the third side 213.
The capacitor body 10 is electrically connected to the two metal layers 22 of the base body 20 through the two pins 15, wherein the two outer ends 152 of the two pins 15 respectively penetrate through the through holes 223 of the first connecting portions 221 of the two metal layers 22, a solder layer 23 is disposed between the outer peripheral surface of the outer end 152 of each pin 15 and the two metal layers 22, each solder layer 23 covers the two outer ends 152 of each pin 15, each solder layer 23 is made of conductive metal materials such as tin, copper, silver, gold, etc., the outer peripheral surface of each pin 15 is connected to each first connecting portion 221 through each solder layer 23, so that the two pins 15 are respectively and fixedly electrically connected to the two metal layers 22, wherein the two pins 15 do not protrude out of the bottom surface 26 of the base 21, the two outer ends 152 of the two pins 15 can be electrically connected and fixed to the first connecting portions 221 of the two metal layers 22 through welding by the two solder layers 23, and the two pins 15 are firmly electrically connected to the two metal layers 22. When the electrolytic capacitor is connected to the circuit board, the two metal layers 22 (i.e., the second connection portions 222) on the bottom surface 26 of the base 21 can be electrically connected to corresponding pins on the circuit board via a surface mount technology.
Referring to fig. 5 to 7, the difference between the second embodiment and the first embodiment is that, in one metal layer 22 attached to the bottom surface 216 and the first side surface 211, a portion of the second connecting portion 222 attached to the bottom surface 216 extends toward the junction between the bottom surface 216 and the second side surface 212, but does not extend to the boundary between the bottom surface 216 and the second side surface 212, and the other side extends toward the junction between the bottom surface 216 and the fourth side surface 214, but does not extend to the boundary between the bottom surface 216 and the fourth side surface 214, so that the metal layer 22 presents a T-shaped structure on the bottom surface, and the arrangement area of the metal layer 22 on the bottom surface 216 is increased.
Similarly, in the other metal layer 22 attached to the bottom surface 216 and the third side surface 213, a portion of the second connecting portion 222 attached to the bottom surface 216 extends toward the junction between the bottom surface 216 and the second side surface 212, but does not extend to the boundary between the bottom surface 216 and the second side surface 212, and the other side extends toward the junction between the bottom surface 216 and the fourth side surface 214, but does not extend to the boundary between the bottom surface 216 and the fourth side surface 214, so that the metal layer 22 presents a T-shaped structure on the bottom surface, and the arrangement area of the metal layer 22 on the bottom surface 216 is increased.
In a preferred embodiment, the capacitor body 10 may further comprise a printed layer, which may be a plating layer, disposed on the outer surface of the package 11 for attaching ink, so as to print the information of the element number, capacitance, etc. of the electrolytic capacitor on the outer surface of the capacitor body 10, so as to facilitate the user to identify the quality and specification of the electrolytic capacitor.
In a preferred embodiment, two oblique angles may be formed on one side of the base 21, on which one metal layer 22 is disposed, of the two metal layers 22, for example, two oblique angles are formed on the first side 211, and two oblique angles are also formed on a side of the first side 211 connected to the package 11, so that the positive and negative electrodes of the electrolytic capacitor can be distinguished by the oblique angle.
In summary, the electrolytic capacitor of the present invention directly covers the capacitor 13 by the integrally formed package 11, and replaces the conventional case and elastic sealing body with the package 11, so that the situation that the sealing performance of the electrolytic capacitor is affected due to the separation of the case and elastic sealing body in the prior art can be avoided, on the other hand, when the capacitor body 10 is connected with the base 21, only the two pins 15 need to be inserted into the corresponding arrangement openings 218, and the two pins 15 and the two metal layers 22 located in the two arrangement openings 218 are welded by the two solder layers 23, so that the two pins 15 are electrically connected with the two metal layers 22 respectively, and compared with the conventional electrolytic capacitor, the steps of further bending the pins after the connection of the capacitor body and the base are reduced, the process required for connecting the capacitor body and the base is simplified, and the manufacturing and time cost of the electrolytic capacitor are further reduced.
The present invention is not limited to the above-mentioned embodiments, but is capable of modification and variation in all embodiments without departing from the spirit and scope of the present invention.
Claims (15)
1. An electrolytic capacitor, comprising:
a capacitor body, comprising:
a package;
the capacitor is arranged in the packaging body and is covered and sealed by the packaging body;
at least two pins, each having an inner end and an outer end, wherein each inner end of the at least two pins is electrically connected with the capacitor, and each outer end of the at least two pins passes through the capacitor; and
the base body is arranged at the position where the at least two pins penetrate out of the capacitor and comprises a base and at least two metal layers, the base comprises at least two arrangement ports corresponding to the at least two metal layers respectively, the at least two metal layers respectively comprise a first connection part and a second connection part, each first connection part is arranged at each arrangement port, and each second connection part is respectively attached to a bottom surface of the base;
wherein, the at least two pins are respectively electrically connected with the at least two metal layers.
2. The electrolytic capacitor of claim 1 wherein the capacitor comprises a capacitor element and dielectric material bonded to the capacitor element, the capacitor element being formed by alternately winding an anode film, a cathode film and a plurality of isolation layers; the at least two pins are two pins, wherein the inner end of one pin is electrically connected with the anode film, and the inner end of the other pin is electrically connected with the cathode film.
3. The electrolytic capacitor of claim 1 wherein the base comprises a first side, a second side, a third side, a fourth side, a top, the bottom and the at least two openings, the first side being opposite to the third side, the second side being opposite to the fourth side, the at least two pins extending out of the capacitor and being disposed on the bottom of the base.
4. The electrolytic capacitor as recited in claim 3, wherein each of the plurality of placement openings extends through the top surface and the bottom surface of the base, and the number of the at least two placement openings is equal to the number of the at least two pins.
5. The electrolytic capacitor as recited in claim 4, wherein each of the first connecting portions of each of the metal layers is formed on a wall surface of each of the mounting openings of the base and has a through hole, each of the through holes penetrating through the top surface and the bottom surface of the base.
6. The electrolytic capacitor as recited in claim 5, wherein each outer end of each pin penetrates into the through hole of the first connecting portion of each metal layer, respectively, to be electrically connected with each metal layer.
7. The electrolytic capacitor of claim 6 wherein a solder layer is disposed between the outer end of each of the leads and each of the metal layers, each of the solder layers covering each of the outer ends of each of the leads, each of the outer ends of each of the leads being electrically connected to each of the metal layers by each of the solder layers.
8. The electrolytic capacitor as recited in claim 6, wherein each of the outer ends of the at least two pins penetrates into each of the through holes without protruding from the bottom surface of the base.
9. The electrolytic capacitor of claim 1 wherein the at least two metal layers are each a copper plating.
10. The electrolytic capacitor of claim 1 wherein the capacitor body comprises a printed layer, the printed layer being a plated layer and disposed on the outer surface of the package.
11. The electrolytic capacitor as recited in claim 3 wherein the at least two metal layers are two metal layers, wherein one metal layer is attached to the bottom surface and the first side surface, and the end of the second connecting portion extends to the edge of the top surface, and the other metal layer is attached to the bottom surface and the third side surface, and the end of the second connecting portion extends to the edge of the top surface.
12. The electrolytic capacitor as recited in claim 11 wherein, in one of the metal layers attached to the bottom surface and the first side surface, a portion of the second connecting portion attached to the bottom surface has one side extending toward a junction between the bottom surface and the second side surface and the other side extending toward a junction between the bottom surface and the fourth side surface.
13. The electrolytic capacitor as recited in claim 11 wherein, in the other metal layer attached to the bottom surface and the third side surface, a portion of the second connecting portion attached to the bottom surface has a side extending toward a junction between the bottom surface and the second side surface and another side extending toward the bottom surface and the fourth side surface.
14. The electrolytic capacitor of claim 1 wherein the base body further comprises two grooves extending through the top and bottom surfaces of the base body, one groove being formed in the first side surface of the base body and the other groove being formed in the third side surface of the base body.
15. The electrolytic capacitor of claim 14 wherein each of the second connection portions of the two metal layers is disposed in each of the recesses.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111411832.9A CN116168954A (en) | 2021-11-25 | 2021-11-25 | Electrolytic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111411832.9A CN116168954A (en) | 2021-11-25 | 2021-11-25 | Electrolytic capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116168954A true CN116168954A (en) | 2023-05-26 |
Family
ID=86418731
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111411832.9A Pending CN116168954A (en) | 2021-11-25 | 2021-11-25 | Electrolytic capacitor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116168954A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020001169A1 (en) * | 2000-05-26 | 2002-01-03 | Matsushita Electric Industrial Co., Ltd. | Solid electrolytic capacitor |
| JP2005109096A (en) * | 2003-09-30 | 2005-04-21 | Tdk Corp | Electrolytic capacitor |
| CN101271764A (en) * | 2007-03-19 | 2008-09-24 | 至美电器股份有限公司 | Electrolytic capacitor |
| CN101329945A (en) * | 2007-06-22 | 2008-12-24 | 至美电器股份有限公司 | Electrolytic capacitor with circumscribe type pins |
| CN101640130A (en) * | 2008-07-29 | 2010-02-03 | 至美电器股份有限公司 | Electrolytic capacitor with external connected pin |
| JP2016207822A (en) * | 2015-04-22 | 2016-12-08 | エヌイーシー ショット コンポーネンツ株式会社 | Airtight terminal and aluminum electrolytic capacitor employing the airtight terminal |
| CN212411845U (en) * | 2020-06-23 | 2021-01-26 | 至美电器股份有限公司 | Electrolytic capacitor packaging structure |
| CN213366408U (en) * | 2020-08-07 | 2021-06-04 | 东莞市爱伦电子科技有限公司 | Aluminum electrolytic capacitor based on low impedance |
-
2021
- 2021-11-25 CN CN202111411832.9A patent/CN116168954A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020001169A1 (en) * | 2000-05-26 | 2002-01-03 | Matsushita Electric Industrial Co., Ltd. | Solid electrolytic capacitor |
| JP2005109096A (en) * | 2003-09-30 | 2005-04-21 | Tdk Corp | Electrolytic capacitor |
| CN101271764A (en) * | 2007-03-19 | 2008-09-24 | 至美电器股份有限公司 | Electrolytic capacitor |
| CN101329945A (en) * | 2007-06-22 | 2008-12-24 | 至美电器股份有限公司 | Electrolytic capacitor with circumscribe type pins |
| CN101640130A (en) * | 2008-07-29 | 2010-02-03 | 至美电器股份有限公司 | Electrolytic capacitor with external connected pin |
| JP2016207822A (en) * | 2015-04-22 | 2016-12-08 | エヌイーシー ショット コンポーネンツ株式会社 | Airtight terminal and aluminum electrolytic capacitor employing the airtight terminal |
| CN212411845U (en) * | 2020-06-23 | 2021-01-26 | 至美电器股份有限公司 | Electrolytic capacitor packaging structure |
| CN213366408U (en) * | 2020-08-07 | 2021-06-04 | 东莞市爱伦电子科技有限公司 | Aluminum electrolytic capacitor based on low impedance |
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