CN116162907B

CN116162907B - PLD coating device special for semiconductor device

Info

Publication number: CN116162907B
Application number: CN202310430531.3A
Authority: CN
Inventors: 戴建波; 孙文彬
Original assignee: Advanced Materials Technology and Engineering Inc
Current assignee: Wuxi Yiwen Microelectronics Technology Co ltd
Priority date: 2023-04-21
Filing date: 2023-04-21
Publication date: 2023-08-01
Anticipated expiration: 2043-04-21
Also published as: CN116162907A

Abstract

The invention belongs to the technical field of PLD coating special for semiconductor devices, and in particular relates to a PLD coating device special for semiconductor devices, which comprises a target mounting mechanism, a laser emitting mechanism and a coating substrate mechanism, wherein the target mounting mechanism comprises: a target base with a plurality of openings, a plurality of target mounting seats for mounting targets and a film thickness meter; the target mounting mechanism further includes: the target angle adjusters are in one-to-one correspondence with the target mounting seats, the first ends of the target angle adjusters are rotatably connected to the corresponding target mounting seats, and the second ends of the target angle adjusters are hinged to the target base; and the flexible connectors are in one-to-one correspondence with the target mounting seats, one ends of the flexible connectors are connected to the target mounting seats, and the other ends of the flexible connectors are connected to the second driving mechanism. The invention can realize independent precise adjustment of the sputtering angle of a single target, ensures the consistency of each sputtering, can adjust the sputtering angle of the target according to the detected film thickness in real time, and is beneficial to improving the uniformity of the thickness of the deposited film.

Description

PLD coating device special for semiconductor device

Technical Field

The invention belongs to the technical field of PLD coating special for semiconductor devices, and particularly relates to a PLD coating device special for semiconductor devices.

Background

Pulsed laser deposition (Pulsed laser deposition, PLD for short), which is a way to focus laser light on a small area of a target, and to evaporate or even ionize a portion of the target by using the high energy density of the laser light, so that the target can be separated from the target and moved toward a substrate, and then deposited on the substrate, thereby forming a thin film. Among the numerous thin film fabrication methods, the pulsed laser deposition technique is most widely used for fabricating semiconductor thin films. The existing Physical Vapor Deposition (PVD) coating technology has the defects of limited targets, unsatisfactory film forming quality for compounds such as diamond and nitride or difficult film forming.

The principle and the characteristics of the pulse laser deposition technology can be known, and the pulse laser deposition technology is a film preparation technology with great development potential. With further optimization of auxiliary equipment and process, the method plays an important role in the preparation of the semiconductor thin film; and can accelerate the research of film growth mechanism and the application level of the film, and accelerate the research progress of material science and condensed state physics. Meanwhile, an effective method is provided for preparing the novel film.

CN103996605B discloses a pulsed laser deposition and molecular beam epitaxy combined film plating apparatus and application thereof, by adding a target tray capable of revolution and rotation in the middle region of the MBE evaporation source, placing a target required by PLD film plating; a high-performance solid laser is added, a quartz window is added at the proper position of the MBE growth chamber cavity, and a high-energy laser vapor deposition target with the wavelength of 150-355nm is introduced. The method has the advantages of simple growth process, low preparation cost and wide application range.

However, the PLD coating apparatus dedicated to the semiconductor device in the prior art has a problem that the deposited film thickness is not uniform.

Disclosure of Invention

The PLD coating device special for the semiconductor device can independently adjust the sputtering angle of each target through the target angle regulator, so that the uniformity of the thickness of the film layer is improved.

In order to achieve the above object, the present invention provides a PLD plating apparatus dedicated to a semiconductor device, comprising a target mounting mechanism, a laser emitting mechanism, and a plating base mechanism, the target mounting mechanism comprising: the PLD coating device of the semiconductor device comprises a target base with a plurality of holes, a first driving mechanism for driving the target base to revolve, a plurality of target installation seats for installing targets, a second driving mechanism for driving the target installation seats to rotate, and a plurality of target installation seats respectively and correspondingly installed at the holes, wherein the PLD coating device special for the semiconductor device further comprises: the detection end of the film thickness meter is close to the film coating substrate of the film coating substrate mechanism; and the target mounting mechanism further comprises:

the target angle adjusters are in one-to-one correspondence with the target mounting seats, the first ends of the target angle adjusters are rotatably connected to the corresponding target mounting seats, and the second ends of the target angle adjusters are hinged to the target base;

and the flexible connectors are in one-to-one correspondence with the target mounting seats, one ends of the flexible connectors are connected to the target mounting seats, and the other ends of the flexible connectors are connected to the second driving mechanism.

In some embodiments, the target angle adjuster controls the target sputter angle to 60-80 °.

In some embodiments, the target angle adjuster comprises:

the middle part of the adjusting plate is provided with a rotating hole, and the target mounting seat is rotationally sleeved in the rotating hole through a bearing;

the hinge shaft is provided with a first end shaft and a second end shaft, the first end shaft and the second end shaft are respectively positioned on two sides of the adjusting plate and are respectively fixedly connected with the adjusting plate, and the first end shaft and the second end shaft are respectively hinged on the target base directly or respectively through the lug plate.

More preferably, the ear plates are distributed uniformly along the circumferential direction of the target base.

More preferably, the hinge axis is perpendicular to the circumferential diameter of the target base.

In some embodiments, when the ear plates are several and are uniformly arranged along the circumferential direction of the target base, the hinge shaft is perpendicular to the circumferential diameter of the target base.

In some embodiments, the flexible connector comprises:

the first connecting plate is provided with an adjusting groove extending along the length direction of the first connecting plate, and a plurality of plunger holes are formed in the side surface of the adjusting groove at intervals along the length direction of the first connecting plate; one end of the first connecting plate is fixedly connected to the second driving mechanism;

one end of the second connecting plate is provided with a threaded hole and a pin hole in sequence from outside to inside along the length direction, the other end of the second connecting plate is provided with a connecting hole, and one end of the connecting hole is fixedly connected to the target mounting seat;

the adjusting screw sequentially passes through the adjusting groove of the first connecting plate and the threaded hole of the second connecting plate to screw and fasten the first connecting plate and the second connecting plate;

the plunger pin sequentially passes through the pin hole of the second connecting plate and one plunger hole of the first connecting plate to be pinned and fixed. When the target angle regulator is required to be matched for flexible linkage, the regulating screw and the plunger pin are opened, the regulating screw slides to a required position in the regulating groove along with the angle regulation of the target angle regulator, and meanwhile, the fixed position of the plunger pin in the plunger hole is correspondingly regulated.

In some embodiments, the target mounting mechanism further comprises:

the mounting substrate is internally provided with a lifting hole, a guide hole and a support hole, and the support hole and the guide hole are symmetrically arranged on the outer side surface of the lifting hole along the center of the support hole;

the lifting guide rod is provided with a first end and a second end, the first end of the lifting guide rod is rotatably sleeved in the guide hole and extends outwards, and a guide groove is formed in the circumferential direction of the extending end;

the top end of the lifting base is connected with the target base and is arranged in parallel, the side surface of the middle part of the lifting base is rotatably sleeved in the lifting hole, the side surface of the top end of the lifting base extends outwards along the top end, and the extending end is clamped in the guide groove;

the support rod is arranged in the support hole in a penetrating way and is supported on one side surface of the target base, and a guide sleeve is sleeved outside the support rod;

and the lifting shaft of the lifting motor is connected with the second end of the lifting guide rod.

Preferably, the second driving mechanism includes:

the satellite gear is connected with the lifting base through a fixed shaft;

the main driving gear is positioned on the side surface of the satellite gear, one end of a driving shaft of the main driving gear is rotatably sleeved on the lifting base and extends outwards, and the other end of the driving shaft of the main driving gear is fixedly connected with the other end of the corresponding flexible connector so as to control the target mounting seat to rotate;

the driven gears are distributed with the main driving gear at intervals along the circumferential direction of the satellite gear and are respectively meshed with the satellite gear, the rotating shafts of the driven gears are fixedly connected with the other ends of the corresponding flexible connectors, and the fixed shafts of the driven gears are connected to the lifting base;

and the driving end of the self-rotating motor is connected with the end part of the main driving gear extending outwards and is used for driving the main driving gear to drive a plurality of driven gears to synchronously rotate through the satellite gears.

In some embodiments, the coating substrate mechanism comprises:

a base plate on which a middle hole is provided;

the base plate frame is provided with a first end and a second end, and the middle part of the base plate frame is rotatably sleeved in the middle hole of the base plate;

the coating substrate is sleeved outside the first end of the base plate frame and is arranged close to the target mounting seats and used for corresponding to the targets to deposit a film layer;

and the rotary driving assembly is connected with the second end of the base plate frame and is used for driving the base plate frame to drive the film coating substrate to rotate so as to deposit film layers with different areas or different thicknesses.

In some embodiments, the PLD plating device dedicated to semiconductor devices further comprises: and the optical observer is arranged close to the film coating substrate of the film coating substrate mechanism and is used for observing the film forming condition of a film layer on the film coating substrate.

In some embodiments, the laser emitting mechanism comprises:

a laser;

a reflective assembly having a reflective exit aligned with the target;

the reflection cavity is provided with a light inlet end and a light outlet end, the light inlet end is connected with the laser, and the light outlet end is connected with the reflection assembly, so that laser emitted by the laser is focused on a target through reflection of the reflection assembly.

Wherein preferably the reflective assembly comprises:

a light-emitting glass window;

one end of the flexible connecting piece is connected to the light-emitting end of the reflecting cavity, and the other end of the flexible connecting piece is connected with the light-emitting glass window;

the reflecting mirror is arranged on the flexible connecting piece and is used for reflecting laser from the light emitting end into the light emitting glass window so as to focus on a target;

the locking piece is provided with a first rod and a second rod which are mutually hinged, the outer end of the first rod is rotationally connected to the light emitting end of the reflecting cavity, the outer end of the second rod is rotationally connected to the light emitting glass window, and the hinged ends of the first rod and the second rod are locked through elastic plunger pins.

In some embodiments, the PLD plating device dedicated to semiconductor devices further comprises:

the target mounting mechanism is positioned at one end of the mounting frame, and the laser emission mechanism and the coating substrate mechanism are positioned at the other end of the mounting frame;

the shielding cover is integrally arranged in a sealing way and is arranged on the mounting frame, a deposition area is arranged in the shielding cover, and a target arranging part of the target mounting mechanism, a light emitting part of the laser emitting mechanism and a coating substrate part of the coating substrate mechanism are all arranged in the deposition area;

and the cooling chamber is positioned in the shielding cover and is close to the deposition area and used for cooling the deposition area.

The beneficial effects are that:

according to the technical scheme, the film thickness gauge, the target angle regulator and the flexible connector are particularly arranged, so that the single target sputtering angle can be independently and precisely regulated while the target base revolves and the single target rotates, the consistency of each sputtering is ensured, the sputtering angle of the target can be regulated in real time according to the detected film thickness, and the uniformity of the thickness of a deposited film layer is improved.

In the preferred scheme of the invention, the integral structure of the target base, the target mounting seat and the target can realize synchronous lifting, can meet the requirements of different target base distances, can adjust the rotating speed of the coating substrate in the coating substrate mechanism through the cooperation of different target base distances, and is more beneficial to cooperatively improving the uniformity of the film thickness.

In the preferred driving scheme of the invention, star-shaped transmission structures such as a satellite gear, a main driving gear, a driven gear and the like are arranged, and the single target loading rate and the uniformity and density of the film thickness are improved by combining the lifting structure; and the layout is reasonable, the structure is compact, the occupied space is small, and the industrialization applicability is strong. The device of the invention does not need frequent loading, which is unfavorable for maintaining a stable vacuum environment, and the film forming environment change caused by the frequent loading has adverse effects on the density and uniformity of the film layer.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic diagram showing the general assembly structure of a PLD plating device dedicated to a semiconductor device according to the invention.

Fig. 2 is a schematic view of the structure of fig. 1 with the shield and film thickness gauge removed.

Fig. 3 is a schematic view of the structure of the head of the target mounting mechanism where the target is located.

Fig. 4 is a schematic structural view of the target, the target mounting seat, the target angle adjuster, the flexible connector and the driven gear in fig. 3, which are sequentially connected in a matched manner.

Fig. 5 is a schematic structural view of a driving portion of the target mounting mechanism.

FIG. 6 is a schematic diagram showing the overall structure of the laser emitting mechanism and the coating substrate mechanism, the film thickness meter and the optical observer.

Fig. 7 is a schematic view of the head structure of the laser emitting mechanism.

Fig. 8 is a schematic structural view of an embodiment of a flexible connector.

Description of the reference numerals

1. The device comprises a target mounting mechanism 2, a laser emitting mechanism 3, a film coating substrate mechanism 4, a film thickness meter 5, an optical observer 6, a mounting rack 7 and a shielding cover;

101. a target base 102 and a first driving mechanism; 103. target 104, target mounting seat 105, second driving mechanism 1051, satellite gear 1052, main driving gear 1053, driven gear 1054 and self-rotation motor; 106. target angle regulator, 1061, regulating plate, 1062, hinge shaft, 1063 and ear plate; 107. the flexible connector 1071, the first connecting plate, 1072, the second connecting plate, 1073, the adjusting groove, 1074, the plunger hole, 1075, the plunger pin, 1076 and the adjusting screw; 108. a mounting substrate 109, a lifting guide rod 1091 and a guide groove; 110. lifting base, 111, supporting rod, 112 and lifting motor;

201. the laser comprises a laser, 202, a reflecting component, 2021, a light emergent glass window, 2022, a flexible connecting piece, 2023, a reflecting mirror, 2024 and a locking piece; 203. a reflective chamber;

301. base plate, 302, base plate frame, 303, coating substrate, 304, rotation driving assembly.

Detailed Description

In the present invention, unless otherwise indicated, terms of orientation such as "upper, lower, left, right" and the like are used generally to refer to the orientation understanding shown in the drawings and in practice, and "inner, outer" refer to the inner, outer of the outline of the components.

Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the invention.

In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present invention.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present invention, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

In the present invention, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through an intermediate medium (e.g., gear meshing), or through communication between two elements or through interaction of the two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.

In the present invention, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.

The endpoints and any values of the ranges disclosed herein are not limited to the precise range or value, and are understood to encompass values approaching those ranges or values. For numerical ranges, one or more new numerical ranges may be found between the endpoints of each range, between the endpoint of each range and the individual point value, and between the individual point value, in combination with each other, and are to be considered as specifically disclosed herein. Wherein the terms "optional" and "optionally" mean either comprising or not comprising (or may not be present).

The invention provides a PLD coating device special for a semiconductor device, which is shown in fig. 1, 2, 3, 4 and 5, and comprises a target mounting mechanism 1, a laser emitting mechanism 2 and a coating substrate mechanism 3, wherein the target mounting mechanism 1 comprises: the PLD coating device special for the semiconductor device comprises a target base 101 with a plurality of holes, a first driving mechanism 102 for driving the target base 101 to revolve, a plurality of target mounting seats 104 for mounting the target 103, a second driving mechanism 105 for driving the target mounting seats 104 to rotate, and a plurality of target mounting seats 104 respectively and correspondingly mounted at the holes, wherein the PLD coating device special for the semiconductor device further comprises: a film thickness gauge 4, the detection end of which is arranged close to the film plating substrate 303 of the film plating substrate mechanism 3, for detecting the thickness of the film layer deposited on the film plating substrate 303; and the target mounting mechanism 1 further includes:

a plurality of target angle adjusters 106, which are in one-to-one correspondence with the plurality of target mounting seats 104, and have first ends rotatably connected to the corresponding target mounting seats 104, and second ends hinged to the target base 101, for adjusting the angle of the target mounting seats 104 and ensuring the rotation of the target mounting seats 104;

the plurality of flexible connectors 107 are in one-to-one correspondence with the plurality of target mounting seats 104, one end of each flexible connector is connected to the target mounting seat 104, and the other end of each flexible connector is connected to the second driving mechanism 105 and is used for flexibly connecting the target mounting seat 104 to the second driving mechanism 105, so that the target mounting seat 104 can be driven to rotate through the second driving mechanism 105, and the movement allowance of the target mounting seat 104 when the angle is adjusted can be met.

In some particularly preferred embodiments, as shown in fig. 3 and 4, the target angle adjuster 106 comprises:

the middle part of the adjusting plate 1061 is provided with a rotating hole, and the target mounting seat 104 is rotatably sleeved (for example, the rotating sleeve can be realized through a bearing) in the rotating hole;

the hinge shaft 1062 has a first end shaft and a second end shaft, where the first end shaft and the second end shaft are respectively located at two sides of the adjusting plate 1061 and are respectively fixedly connected with the adjusting plate 1061, and the first end shaft and the second end shaft are respectively hinged to the target base 101 directly or respectively through the ear plate 1063.

More preferably, the first and second end shafts are hinged to the target base 101 via an ear plate 1063, respectively. The ear plate 1063 is fixed to a side of the target base 101 near the target 103.

More preferably, the ear plates 1063 are several and are uniformly arranged along the circumferential direction of the target base 101.

More preferably, the hinge axis 1062 is perpendicular to the circumferential diameter of the target base 101.

In some embodiments, the target angle adjuster 106 controls the sputtering angle of the target 103 to be 60-80 °. Under the preferred scheme, the maximum sputtering rate can be realized, and the uniformity of the deposited film thickness is facilitated. If the sputtering angle is smaller than 60 °, the sputtering rate increases relatively slowly with an increase in the sputtering angle, and if it is larger than 80 °, the sputtering rate decreases sharply with an increase in the sputtering angle.

The flexible connector 107 of the invention not only can drive the target mounting base 104 to rotate, but also can meet the movement allowance when the target mounting base 104 is adjusted in angle, wherein the flexible connector 107 can flexibly stretch in linkage with the angle adjustment of the target mounting base 104. In some particularly preferred embodiments, as shown in fig. 8, the structure of the flexible connector 107 includes:

the first connecting plate 1071 is provided with an adjusting groove 1073 extending along the length direction thereof, and a plurality of plunger holes 1074 arranged at intervals along the length direction thereof are arranged on the side surface of the adjusting groove 1073; and one end of the first connecting plate 1071 is fixedly connected to the second driving mechanism 105;

a second connecting plate 1072, one end of which is provided with a threaded hole and a pin hole in sequence from outside to inside along the length direction thereof, and the other end of which is provided with a connecting hole, one end of which is fixedly connected to the target mounting seat 104;

the adjusting screw 1076 sequentially passes through the adjusting groove 1073 of the first connecting plate 1071 and the threaded hole of the second connecting plate 1072 to screw-fasten the first connecting plate 1071 and the second connecting plate 1072;

the plunger pin 1075 is sequentially inserted through the pin hole of the second connecting plate 1072 and one plunger hole 1074 of the first connecting plate 1071 to be pinned. The structure realizes flexible/rigid connection, is used for opening the adjusting screw 1076 and the plunger pin 1075 when the target angle regulator 106 needs to be matched for flexible linkage, the adjusting screw 1076 slides to a required position in the adjusting groove 1073 along with the angle regulation of the target angle regulator 106, and simultaneously correspondingly adjusts the fixed position of the plunger pin 1075 in the plunger hole 1074.

In the present invention, the sputtering angle can be adjusted by the flexible connector 107 to adjust the angle of the target mounting base 104 and the adjusting plate 1061 connected thereto, for example, by rotating the second connecting plate 1072 about the adjusting screw 1076 as the central axis until the pin hole thereof is aligned with a certain plunger hole 1074, and inserting the plunger pin 1075 into the pin hole and the plunger hole 1074 to fix the same, thereby adjusting the sputtering angle. The pin holes of the second web 1072 are aligned with different plunger holes 1074 and the sputtering angle is different.

The first connecting plate 1071, the second connecting plate 1072, the adjusting screw 1076 and the plunger pin 1075 form a flexible unit, and the flexible connector 107 may include a plurality of flexible units according to the present invention, and a person skilled in the art may select the flexible units according to the needs, so long as the flexible connection between the flexible units can be achieved.

It will be appreciated that fig. 4 of the present invention shows only the overall profile of the assembled flexible units of the flexible connector 107, and does not show the internal detail of the construction; which is not conflicting or contradictory with the structure of fig. 8, can be considered as one structure or two structures.

In some embodiments, as shown in fig. 3, the target mounting mechanism 1 further includes:

the mounting substrate 108 is internally provided with a lifting hole, a guide hole and a support hole, and the support hole and the guide hole are symmetrically arranged on the outer side surface of the lifting hole along the center of the support hole;

a lifting guide rod 109 having a first end and a second end, the first end thereof being rotatably fitted in the guide hole and extending outwardly, the extending end being provided with a guide groove 1091 in a circumferential direction thereof;

the top end of the lifting base 110 is connected with the target base 101 and is arranged in parallel, the side surface of the middle part of the lifting base is rotatably sleeved in the lifting hole, the side surface of the top end of the lifting base extends outwards along the top end, and the extending end is clamped in the guide groove 1091;

a support rod 111 penetrating through the support hole and supported on one side surface of the target base 101, and having a guide sleeve sleeved thereon;

and a lifting motor 112, the lifting shaft of which is connected with the second end of the lifting guide rod 109. Under the preferred scheme, the target base 101, the target mounting seat 104 and the target 103 on the target base are driven by controlling the lifting base 110 to synchronously lift, so that the requirements of different target base distances can be met, and film layers with different sizes can be deposited.

The lifting base 110 of the present invention may have a shape that satisfies the above conditions and functions, and may be, for example, a T-shape including a disk at the top and a lifting column at the middle, the lifting column and the disk forming a T-shape. The top end of the lifting base 110 is connected to the target base 101, for example, the top end of the lifting base 110 is connected to the target base 101 through a plurality of struts.

In the present invention, it is understood that the guide sleeve is made of wear-resistant material.

The specific structure of the rotation sleeving of the lifting guide rod 109 and the guide hole in the invention can only realize the lifting function of the lifting guide rod 109; for example, a threaded connection. The specific structure of the rotation sleeving connection of the lifting base 110 and the lifting hole can only realize the lifting function of the lifting base 110; for example, a threaded connection.

In the present invention, when the lifting operation is performed, the lifting motor 112 drives the lifting guide rod 109 to lift rotationally in the guide hole, the lifting guide rod 109 drives the lifting base 110 to lift by the clamping groove, the lifting base 110 lifts rotationally along the central axis of the mounting substrate 108 in the lifting hole, and the whole structure of the target base 101, the target mounting base 104 and the target 103 thereon lifts synchronously with the lifting base 110.

The lifting guide rod 109 and the support rod 111 can provide guide support when the target base 101 is lifted, so as to realize stable lifting.

Further preferably, an L-shaped groove is further provided on the extending end of the lifting guide rod 109, the opening of the L-shaped groove faces the direction approaching the target 103, and the side surface of the target base 101 is supported on the L-shaped groove. Under the preferred scheme, the target base 101 is more stably supported.

In the lifting preferred scheme, a person skilled in the art can seal a proper position according to actual requirements such as vacuum environment required by deposition, for example, a welded bellows can be used for a lifting dynamic seal position, and a biaxial magnetic fluid can be used for a rotating connection position seal.

The lift motor 112 may be, for example, a stepper motor.

Further preferably, as shown in fig. 3, the second driving mechanism 105 includes:

a satellite gear 1051 having a fixed shaft connected to the elevation base 110;

a main driving gear 1052, which is located at the side of the satellite gear 1051, and has one end of a driving shaft rotatably sleeved on the lifting base 110 and extending outwards, and the other end of the driving shaft fixedly connected with the other end of the corresponding flexible connector 107, so as to control the rotation of the target mounting base 104;

a plurality of driven gears 1053 which are spaced apart from the main driving gear 1052 along the circumferential direction of the satellite gears 1051 and are respectively engaged with the satellite gears 1051, and the rotating shafts of which are fixedly connected with the other ends of the corresponding flexible connectors 107, and the fixed shafts of which are connected to the lifting base 110;

and the driving end of the rotation motor 1054 is connected with the end part of the main driving gear 1052 extending outwards, and is used for driving the main driving gear 1052 to drive a plurality of driven gears 1053 to synchronously rotate through the satellite gears 1051. Under this preferred scheme, the quantity of driven gear 1053 can correspond the setting according to the quantity of target 103, and this kind of star transmission structure combines above-mentioned elevation structure, compact structure, occupation space are little, can realize the synchronous rotation of a plurality of targets 103, can also realize overall structure's lift simultaneously to more do benefit to and promote target 103 loading rate and rete homogeneity.

When the second driving mechanism 105 works, the main driving gear 1052 is driven by the rotation motor 1054 to drive the satellite gear 1051 to drive the driven gears 1053 to rotate, and each corresponding gear drives the target mounting base 104 and the target 103 connected with the corresponding gear to synchronously rotate. It should be appreciated that the rotation motor 1054 simultaneously drives several target mounts 104 to rotate synchronously, each time a single target 103 is sputtered, different revolution and rotation speeds can be adjusted as a single target 103 is sputtered.

It will be appreciated that satellite gear 1051 includes a gear and a stationary shaft upon which the gear is rotatably journaled. The main drive gear 1052 includes a main gear fixedly coupled to a main drive shaft extending outwardly along both ends of the main gear, and a main drive shaft. The driven gear 1053 comprises a driven wheel, a rotating shaft and a fixed shaft, one end of the driven wheel is fixed on the rotating shaft, and the other end of the driven wheel is rotatably sleeved on the outer surface of the fixed shaft.

More preferably, as shown in fig. 2 and 5, the first driving mechanism 102 includes:

a revolution shaft having a first end and a second end, the first end of which is fixedly connected to the elevation base 110;

and a revolution motor, the driving shaft of which is connected with the second end of the revolution shaft (such as gear meshing connection), and is used for driving the lifting base 110 to drive the target base 101 and the target mounting base 104 to perform integral revolution. In this preferred embodiment, the elevating base 110 and the target base 101, the target mount 104, the target 103, and other integral structures fixed thereon are driven by the revolution motor to revolve.

In some more preferred embodiments, the target mounting mechanism 1 has the above-described elevating structure, and the first driving mechanism 102 and the second driving mechanism 105 each have the above-described preferred structure. According to the more preferable scheme, revolution of the target base 101 can be realized in a smaller space, synchronous rotation of the single target 103 is realized, and meanwhile, the angle of the target 103 can be adjusted to improve the uniformity of the deposited film thickness of the target 103, and the loading rate of the target 103 can be adjusted according to the film thickness requirement.

In some embodiments, the plating base mechanism 3 includes:

a base 301 on which a middle hole is provided;

a base plate rack 302 having a first end and a second end, wherein the middle part of the base plate rack is rotatably sleeved in the middle hole of the base plate 301;

a film plating substrate 303, which is sleeved outside the first end of the base plate frame 302 and is arranged close to the target mounting seats 104, and is used for corresponding to the targets 103 to deposit a film layer;

and the rotary driving assembly 304 is connected to the second end of the base plate frame 302, and is used for driving the base plate frame 302 to drive the film plating substrate 303 to rotate so as to deposit film layers with different areas or different thicknesses.

In some embodiments, the PLD plating device dedicated to semiconductor devices further comprises: an optical viewer 5 disposed near the film-plating substrate 303 of the film-plating substrate mechanism 3 for viewing the film formation of the film layer on the film-plating substrate 303. In this preferred embodiment, dynamic observation of the film formation can also be achieved by the optical observer 5, thereby controlling the deposition process. It will be appreciated that the optical viewer 5 has an optical lens.

In the present invention, it should be understood that the laser sputtering target 103 is emitted by the laser emitting mechanism 2, and the targets 103 are sputtered one at a time.

In some embodiments, as shown in fig. 6 and 7, the laser emitting mechanism 2 includes:

a laser 201;

a reflective assembly 202 having a reflective exit aligned with the target 103;

the reflecting chamber 203 is provided with a light inlet end and a light outlet end, the light inlet end is connected with the laser 201, and the light outlet end is connected with the reflecting component 202, so that laser light emitted by the laser 201 is reflected and focused on the target 103 through the reflecting component 202.

Wherein preferably, as shown in fig. 7, the reflecting assembly 202 comprises:

a light-exiting glass window 2021;

a flexible connection member 2022 having one end connected to the light-emitting end of the reflection chamber 203 and the other end connected to the light-emitting glass window 2021;

a reflecting mirror 2023, mounted on the flexible connection element 2022, for reflecting the laser light from the light emitting end into the light emitting glass window 2021, so as to focus on the target 103;

the locking member 2024 has a first rod and a second rod hinged to each other, the outer end of the first rod is rotatably connected to the light emitting end of the reflecting chamber 203, the outer end of the second rod is rotatably connected to the light emitting glass window 2021, and the hinged ends of the first rod and the second rod are locked by an elastic plunger pin. Under the preferred scheme, the sputtering angle can be precisely adjusted by arranging the reflecting component 202 with the precise adjusting structure, so that the consistency of each sputtering is more favorable to be ensured; and the reflection angle is adjustable, so that the laser beam reflection loss can be reduced, the cost is saved, and the space of a vacuum cavity is saved due to locking by the elastic plunger pin, and the device is convenient to adjust, stable and reliable.

When the reflection angle is adjusted, the locking piece 2024 can be loosened first, the flexible connecting piece 2022 moves along with the angle and the position of the light emergent glass window 2021 are adjusted, the angle and the position of the reflecting mirror 2023 are adjusted, and the locking piece 2024 can be fastened after the required angle and the required position are met.

The specific configuration of the flexible connection 2022 can be selected by those skilled in the art as desired, so long as it is achieved that both supports the mirror 2023 to maintain angle and position and facilitates as much of the laser light entering the light exit glass window 2021 as possible. The flexible connection 2022 may be, for example, a flexible bellows, which is a conventional structure or material in the art.

In the present invention, the PLD coating apparatus dedicated to semiconductor devices may further include other conventional structures required for deposition and/or conventional components required for device mounting. In some embodiments, as shown in fig. 1, the PLD plating device dedicated to the semiconductor device further includes:

the mounting frame 6 is used for fixing the target mounting mechanism 1, the laser emission mechanism 2 and the coating substrate mechanism 3, the target mounting mechanism 1 is positioned at one end of the mounting frame 6, and the laser emission mechanism 2 and the coating substrate mechanism 3 are positioned at the other end of the mounting frame 6;

a shielding cover 7, which is integrally and hermetically arranged and mounted on the mounting frame 6, and in which a deposition area is arranged, wherein the target 103 arrangement part of the target mounting mechanism 1, the light emergent part of the laser emitting mechanism 2 and the film coating substrate 303 part of the film coating substrate mechanism 3 are all arranged in the deposition area;

a cooling chamber located within the shield 7 and located adjacent to the deposition zone for cooling the deposition zone. Under the preferred scheme, each part is combined compactly, occupies small space and is reasonable in layout.

It should be understood that the shielding case 7 is further provided with a component capable of exhausting air to provide vacuum environment required for deposition, which is a conventional structure in the art, and will not be described herein.

The cooling chamber of the invention preferably adopts a double-layer structure, thereby ensuring the low-temperature environment required by the deposition process. The material of the cooling chamber and the sealing flange can be selected by a person skilled in the art according to requirements, so long as the high vacuum environment can be ensured; for example, SUS304 material may be used, and the end portion may be a CF series knife edge flange.

The PLD film plating device can greatly improve the film thickness uniformity and the loading rate of the target material 103.

The preferred embodiments of the present invention have been described in detail above, but the present invention is not limited thereto. Within the scope of the technical idea of the invention, a number of simple variants of the technical solution of the invention are possible, including combinations of the individual technical features in any other suitable way, which simple variants and combinations should likewise be regarded as being disclosed by the invention, all falling within the scope of protection of the invention.

Claims

1. The PLD coating device special for the semiconductor device comprises a target mounting mechanism, a laser emitting mechanism and a coating substrate mechanism, wherein the target mounting mechanism comprises: the PLD coating device is characterized in that the PLD coating device special for the semiconductor device further comprises: the detection end of the film thickness meter is close to the film coating substrate of the film coating substrate mechanism; and the target mounting mechanism further comprises:

the flexible connectors are in one-to-one correspondence with the target mounting seats, one ends of the flexible connectors are connected to the target mounting seats, and the other ends of the flexible connectors are connected to the second driving mechanism;

the target angle adjuster includes:

2. The PLD plating apparatus as set forth in claim 1, wherein said target angle adjuster controls a target sputtering angle to be 60-80 °.

3. The PLD plating apparatus as in claim 1, wherein said hinge axis is perpendicular to a circumferential diameter of said target base when said ear plates are uniformly arranged in a circumferential direction of said target base.

4. The PLD plating apparatus as defined in claim 1, wherein said flexible connector comprises:

the plunger pin sequentially passes through the pin hole of the second connecting plate and one plunger hole of the first connecting plate to be pinned and fixed.

5. The PLD plating apparatus as defined in claim 1, wherein said target mounting mechanism further comprises:

6. The PLD plating apparatus as defined in claim 5, wherein said second driving mechanism comprises:

the satellite gear is connected with the lifting base through a fixed shaft;

7. The PLD plating apparatus as set forth in claim 1, wherein said plating base mechanism comprises:

a base plate on which a middle hole is provided;

8. The PLD plating apparatus as defined in claim 1, wherein said PLD plating apparatus for semiconductor devices further comprises: and the optical observer is arranged close to the film coating substrate of the film coating substrate mechanism and is used for observing the film forming condition of a film layer on the film coating substrate.

9. The PLD plating apparatus as set forth in claim 1, wherein said laser light emitting mechanism comprises:

a laser;

a reflective assembly having a reflective exit aligned with the target;

the reflection cavity is provided with a light inlet end and a light outlet end, the light inlet end is connected with the laser, and the light outlet end is connected with the reflection assembly, so that laser emitted by the laser is reflected and focused on a target through the reflection assembly;

wherein the reflection assembly comprises:

a light-emitting glass window;

10. The PLD plating apparatus as defined in claim 1, wherein said PLD plating apparatus for semiconductor devices further comprises: