CN116156778A - Method and device for repairing short circuit of printed circuit board - Google Patents
Method and device for repairing short circuit of printed circuit board Download PDFInfo
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- CN116156778A CN116156778A CN202310198073.5A CN202310198073A CN116156778A CN 116156778 A CN116156778 A CN 116156778A CN 202310198073 A CN202310198073 A CN 202310198073A CN 116156778 A CN116156778 A CN 116156778A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
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Abstract
The invention relates to the technical field of printed circuit board repair, in particular to a method and a device for repairing short circuit of a printed circuit board. The short circuit repairing method of the printed circuit board comprises the following steps: s1: acquiring an image of a region to be repaired of the circuit board to be repaired so as to determine the size, shape and position of the region to be repaired; s2: adjusting the size of a rectangular laser spot according to the acquired image information of the area to be repaired, and focusing the focus of the rectangular laser spot on the surface of the area to be repaired so as to remove the copper layer of the area to be repaired; s3: reducing the irradiation power of the rectangular laser spot, and focusing the focus of the rectangular laser spot on the surface of the area to be repaired so as to clean the residual product of the area to be repaired. The short circuit repairing device for the printed circuit board realizes the short circuit repairing of the printed circuit board by adopting the short circuit repairing method for the printed circuit board, can avoid the damage of the repaired residual product to the normal copper layer and the base material, improves the repairing efficiency and also improves the repairing effect.
Description
Technical Field
The invention relates to the technical field of printed circuit board repair, in particular to a method and a device for repairing short circuit of a printed circuit board.
Background
A Printed Circuit Board (PCB) is an important electronic component among electronic components, and it can be said to be a support for the electronic components, and also a carrier for the electronic components to be electrically connected to each other. The manufacturing process of the printed circuit board comprises main processes of exposure, development, electroplating, etching and the like, and as the process problems of different degrees occur in each manufacturing process, a certain area of the circuit may be short-circuited, and the printed circuit board is scrapped as a whole. As the density of conductive traces in a printed wiring board increases, the line width decreases and the shorting problem is more frequent, resulting in a significant amount of economic loss.
At present, in order to repair local short circuits in a printed circuit board, a laser beam is mostly adopted to carry out filling scanning on an area to be repaired, and as a light spot generated by the laser beam is a circular light spot, redundant energy exists in the outline of the circular light spot, so that excessive burn can be caused on a substrate in the cleaning process of the laser beam, the adopted laser energy is weaker, the area to be repaired needs to be filled and scanned for multiple times, the repairing time is greatly increased, and the repairing efficiency is reduced for the area to be repaired with a large area. In addition, the region to be repaired is subjected to filling scanning for many times, so that a large amount of black copper oxide is easy to remain on the periphery of the region to be repaired, the image information of the residual product is required to be acquired again, and then the residual product is subjected to filling scanning, so that the repair efficiency is further reduced, and the repair effect is also reduced.
Therefore, there is a need to provide a method and a device for repairing short circuit of a printed circuit board to solve the above problems.
Disclosure of Invention
The invention aims to provide a method and a device for repairing short circuit of a printed circuit board, which are used for repairing the short circuit of the printed circuit board, avoiding damage to a normal copper layer and a base material caused by residual products after repair and improving repair efficiency and repair effect.
To achieve the purpose, the invention adopts the following technical scheme:
a short circuit repairing method of a printed circuit board comprises the following steps:
s1: acquiring an image of a region to be repaired of a circuit board to be repaired so as to determine the size, shape and position of the region to be repaired;
s2: adjusting the size of a rectangular laser spot according to the acquired image information of the area to be repaired, and focusing the focus of the rectangular laser spot on the surface of the area to be repaired so as to remove the copper layer of the area to be repaired;
s3: and reducing the irradiation power of the rectangular laser spot, and focusing the focus of the rectangular laser spot on the surface of the area to be repaired so as to clean the residual product of the area to be repaired.
Preferably, the method further comprises the following steps after the step S3:
s4: acquiring an image of the area to be repaired, and judging whether the area to be repaired meets the repair requirement or not;
if yes, executing the operations from the step S1 to the step S3 on the next area to be repaired of the circuit board to be repaired;
if not, continuing to execute the operations from the step S1 to the step S3 on the area to be repaired.
Preferably, in step S2, when the acquired size of the area to be repaired is greater than the maximum size of the rectangular laser spot, the rectangular laser spot is adjusted to the maximum size, and the rectangular laser spot and the area to be repaired relatively move, so that the rectangular laser spot fills and scans the surface of the area to be repaired;
and when the acquired size of the area to be repaired is not larger than the maximum size of the rectangular laser spot, adjusting to enable the size of the rectangular laser spot to be matched with the size of the area to be repaired, so that the rectangular laser spot covers and irradiates the surface of the area to be repaired.
Preferably, in step S2, the irradiation power of the rectangular laser spot is 100uj to 1000uj.
Preferably, the length dimension of the rectangular laser spot is in the range of 1 μm to 250 μm, and the width dimension of the rectangular laser spot is in the range of 1 μm to 250 μm.
As a preferable scheme, in the step S1 and the step S4, the image of the area to be repaired is acquired under a 10-time observation lens; in step S2, the size of the rectangular laser spot is adjusted under a 50-fold observation lens.
A short circuit repairing device for a printed circuit board, which repairs the circuit board to be repaired by adopting the short circuit repairing method for the printed circuit board, comprises the following steps:
the laser optical system comprises a laser, a spot adjuster and a laser focusing device, wherein the laser, the spot adjuster and the laser focusing device are sequentially arranged along a laser beam irradiation path, the laser is configured to emit a laser beam, the spot adjuster is configured to adjust the received laser beam into a rectangular laser spot with a required size, and the laser focusing device is configured to focus the received rectangular laser spot on the surface of an area to be repaired;
a visual imaging system configured to acquire an image of the area to be repaired of the circuit board to be repaired, and the spot adjuster adjusts the size of the rectangular laser spot according to image information acquired by the visual imaging system; and
the translation motion system comprises a Y-axis transplanting platform and an X-axis transplanting module, the Y-axis transplanting platform is positioned below the laser focusing device and is configured to drive the circuit board to be repaired to move along the Y-axis direction; the X-axis transplanting module is configured to synchronously drive the laser optical system and the visual imaging system to move along the X-axis direction.
Preferably, the flare adjuster includes:
the X-axis transplanting module comprises a first driving piece, a first baffle and a second baffle, wherein the first driving piece is arranged on the X-axis transplanting module, the first baffle and the second baffle are arranged at intervals along a first direction, and the first driving piece can synchronously drive the first baffle and the second baffle to be close to or far away from each other;
the second driving piece, the third baffle and the fourth baffle are arranged on the X-axis transplanting module, the third baffle and the fourth baffle are arranged at intervals along a second direction, the second driving piece can synchronously drive the third baffle and the fourth baffle to be close to or far away from each other, and the second direction and the first direction are mutually perpendicular;
the first baffle plate, the second baffle plate, the third baffle plate and the fourth baffle plate are distributed in a 'well' -shaped mode, a rectangular slit is formed in the middle of the first baffle plate, the second baffle plate, the third baffle plate and the fourth baffle plate, the laser beam is emitted through the rectangular slit, and the size of the rectangular laser spot emitted out of the rectangular slit is adjusted by adjusting the size of the rectangular slit.
As a preferable scheme, the laser focusing device comprises a laser focusing lens group and a third driving piece, wherein the third driving piece is arranged on the X-axis transplanting module, the laser focusing lens group and the light spot adjuster are arranged opposite to each other, and the third driving piece is configured to drive the laser focusing lens group to move towards a direction close to or far away from the light spot adjuster.
Preferably, the laser focusing lens group is made of a plurality of optical lenses.
As a preferred solution, the Y-axis transplanting platform includes:
a Y-axis transplanting module; and
the bearing platform is arranged below the laser focus device and used for bearing the circuit board to be repaired, and the Y-axis transplanting module is configured to drive the bearing platform to move along the Y-axis direction.
The invention has the beneficial effects that:
the invention provides a printed circuit board short circuit repairing method, which is characterized in that a rectangular laser spot after shaping is focused on the surface of an area to be repaired to remove a copper layer of the area to be repaired, and the rectangular laser spot after shaping has uniform energy, so that the area to be repaired is subjected to one-time removal operation by using high-peak energy laser, and the repairing efficiency and the repairing effect are greatly improved. In addition, the rectangular laser light spots with uniform energy are adopted for removing operation, the area to be repaired does not need to be scanned for multiple times, only a small amount of residual products exist in the area to be repaired, therefore, only the irradiation power of the rectangular laser light spots is reduced, the area to be repaired is cleaned, the image of the residual products does not need to be acquired again, the size of the rectangular laser light spots does not need to be readjusted, the repair efficiency is further improved, and damage to the peripheral normal copper layer and the base material caused by the repaired residual products is avoided.
The invention also provides a device for repairing the short circuit of the printed circuit board, which is used for repairing the to-be-repaired area of the circuit board to be repaired by adopting the method for repairing the short circuit of the printed circuit board, so that the damage of the repaired residual product to the peripheral normal copper layer and the base material is avoided, and the repair efficiency and the repair effect are greatly improved.
Drawings
Fig. 1 is a flowchart of a method for repairing a short circuit of a printed wiring board according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a device for repairing a short circuit of a printed circuit board according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a spot adjuster according to an embodiment of the present invention;
fig. 4 is a schematic diagram of the position arrangement of each baffle of the spot adjuster according to the embodiment of the present invention.
In the figure:
1. a laser optical system; 11. a laser; 12. a spot adjuster; 121. a first driving member; 122. a first baffle; 123. a second baffle; 124. a second driving member; 125. a third baffle; 126. a fourth baffle; 127. rectangular slits; 13. a laser focus;
2. a visual imaging system; 21. an observation lens; 22. a lens group; 23. a visual imaging module; 24. a CCD camera; 25. a light source member;
3. a translational motion system; 31. a Y-axis transplanting platform; 311. a Y-axis transplanting module; 312. a load-bearing platform; 32. and the X-axis transplanting module.
Detailed Description
In order to make the technical problems solved, the technical scheme adopted and the technical effects achieved by the invention more clear, the technical scheme of the invention is further described below by a specific embodiment in combination with the attached drawings.
In the description of the present invention, unless explicitly stated and limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
In the present invention, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.
In the description of the present embodiment, the terms "upper", "lower", "left", "right", and the like are orientation or positional relationships based on those shown in the drawings, merely for convenience of description and simplicity of operation, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the invention. Furthermore, the terms "first," "second," and the like, are used merely for distinguishing between descriptions and not for distinguishing between them.
At present, in order to repair local short circuits in a printed circuit board, a laser beam is mostly adopted to carry out filling scanning on an area to be repaired, and as a light spot generated by the laser beam is a circular light spot, redundant energy exists in the outline of the circular light spot, so that excessive burn can be caused on a substrate in the cleaning process of the laser beam, the adopted laser energy is weaker, the area to be repaired needs to be filled and scanned for multiple times, the repairing time is greatly increased, and the repairing efficiency is reduced for the area to be repaired with a large area. In addition, the region to be repaired is subjected to filling scanning for many times, so that a large amount of black copper oxide is easy to remain on the periphery of the region to be repaired, the image information of the residual product is required to be acquired again, and then the residual product is subjected to filling scanning, so that the repair efficiency is further reduced, and the repair effect is also reduced.
In order to solve the above problems, as shown in fig. 1, the present embodiment provides a method for repairing a short circuit of a printed circuit board, including the steps of:
s1: acquiring an image of a region to be repaired of the circuit board to be repaired so as to determine the size, shape and position of the region to be repaired;
s2: adjusting the size of a rectangular laser spot according to the acquired image information of the area to be repaired, and focusing the focus of the rectangular laser spot on the surface of the area to be repaired so as to remove the copper layer of the area to be repaired;
s3: reducing the irradiation power of the rectangular laser spot, and focusing the focus of the rectangular laser spot on the surface of the area to be repaired so as to clean the residual product of the area to be repaired.
According to the printed circuit board short circuit repairing method, the rectangular laser light spots after shaping are focused on the surface of the area to be repaired, so that the copper layer of the area to be repaired is removed, the rectangular laser light spots after shaping are uniform in energy, and therefore the area to be repaired is removed by adopting high-peak energy laser at one time, and the repairing efficiency and the repairing effect are greatly improved. In addition, the rectangular laser light spots with uniform energy are adopted for removing operation, the area to be repaired does not need to be scanned for multiple times, so that a small amount of residual products only exist in the area to be repaired, the irradiation power of the rectangular laser light spots is reduced, the area to be repaired is cleaned, the image of the residual products does not need to be acquired again, the size of the rectangular laser light spots does not need to be readjusted, the repair efficiency is further improved, and damage to the peripheral normal copper layers and the base materials caused by the repaired residual products is avoided.
In this embodiment, since the laser beam is shaped and the shaped rectangular laser spot is used to perform the removal operation, the laser energy can be selected from the narrow pulse high peak energy laser, so that the copper layer can be instantaneously vaporized, and the area to be repaired does not need to be scanned for multiple times. In addition, the laser beam is shaped, so that the tail end of the laser beam is a rectangular laser spot with uniform energy, the copper layer can be heated uniformly when the area to be repaired is focused and irradiated, the substrate is not burnt by redundant energy, and the substrate is not damaged. There is no excess energy in the profile of the rectangular laser spot, but a steeper edge transition, and therefore a higher energy transfer efficiency and a smaller heat affected zone than a conventional round spot at the end of the unshaped laser beam.
In the step S2, the irradiation power of the rectangular laser spot is 100uj to 1000uj, so that the rectangular laser spot is ensured to enable the copper layer to be instantaneously vaporized, and the irradiation power of the rectangular laser spot in the step S3 is smaller than that of the rectangular laser spot in the step S2, so that the decomposition and damage of the substrate caused by the laser spot with too high power can be prevented when the residual product is cleaned.
Specifically, in step S2, when the acquired size of the area to be repaired is greater than the maximum size of the rectangular laser spot, the rectangular laser spot is adjusted to the maximum size, and the rectangular laser spot and the area to be repaired are relatively moved, so that the rectangular laser spot fills and scans the surface of the area to be repaired; and when the acquired size of the area to be repaired is not larger than the maximum size of the rectangular laser spot, adjusting to enable the size of the rectangular laser spot to be matched with the size of the area to be repaired so as to enable the rectangular laser spot to cover and irradiate the surface of the area to be repaired. The setting mode aims at the size of the area to be repaired, so that the size of the rectangular laser light spot is adjusted, filling scanning is not needed for the small-size area to be repaired, the area to be repaired is directly covered and irradiated, and the repair efficiency is further improved. In the present embodiment, the rectangular laser spot has a length in the range of 1 μm to 250 μm and a width in the range of 1 μm to 250 μm. For example, when the size of the area to be repaired is 50×100 μm, the size of the rectangular laser spot may be set directly to 50×100 μm so as to cover the irradiation of the surface of the area to be repaired. When the size of the area to be repaired is 300x300 μm, the size of the rectangular laser spot can be directly set to 250x250 μm, and then the area to be repaired is subjected to filling scanning. When filling and scanning is performed on the area to be repaired, the scanning speed ranges from 10mm/s to 300mm/s, and the irradiation of the rectangular laser spots can be interrupted along with the displacement or can be uninterrupted.
Further, as shown in fig. 1, the following steps are further included after step S3:
s4: acquiring an image of an area to be repaired, and judging whether the area to be repaired meets the repair requirement;
if yes, executing the operations from the step S1 to the step S3 in the next area to be repaired of the circuit board to be repaired;
if not, continuing to execute the operations from the step S1 to the step S3 on the area to be repaired.
According to the short circuit repairing method for the printed circuit board, after the repairing operation of the area to be repaired is completed, the area to be repaired is detected, so that the repairing of the area to be repaired is ensured to meet the repairing requirement.
Preferably, in step S1 and step S4, the image of the area to be repaired is acquired under a 10-time observation lens, so as to ensure that the image information of the size, shape and position of the area to be repaired is accurately acquired, and in step S2, the size of the rectangular laser spot is adjusted under a 50-time observation lens, so as to ensure that the size of the rectangular laser spot is accurately adjusted.
As shown in fig. 2, this embodiment also provides a device for repairing a short circuit of a printed circuit board, which is used for repairing a circuit board to be repaired by adopting the method for repairing a short circuit of a printed circuit board. In this embodiment, the short-circuit repairing device for a printed circuit board includes a laser optical system 1, a vision imaging system 2 and a translational motion system 3, where the laser optical system 1 includes a laser 11, a spot adjuster 12 and a laser focusing device 13 sequentially disposed along a laser beam irradiation path, the laser 11 is used for emitting a laser beam, the spot adjuster 12 is used for adjusting the received laser beam into a rectangular laser spot with a required size, the laser focusing device 13 is used for focusing the received rectangular laser spot on a surface of an area to be repaired, the vision imaging system 2 is used for acquiring an image of the area to be repaired of the circuit board, the spot adjuster 12 adjusts the size of the rectangular laser spot according to image information acquired by the vision imaging system 2, the translational motion system 3 includes a Y-axis transplanting platform 31 and an X-axis transplanting module 32, the Y-axis transplanting platform 31 is located below the laser focusing device 13 (in a negative direction of a Z-axis in fig. 2), and the Y-axis transplanting platform 31 is used for driving the circuit board to be repaired to move along the Y-axis direction, and the X-axis module 32 is used for synchronously driving the laser optical system 1 and the vision imaging system 2 to move along the X-axis direction, so as to ensure that the accurate image information of the area to be repaired by the vision imaging system 1 is accurately irradiated by the vision imaging system 2. It should be noted that, the Y-axis transplanting platform 31 and the X-axis transplanting module 32 also perform corresponding movements according to the image information acquired by the visual imaging system 2.
According to the printed circuit board short circuit repairing device, the region to be repaired of the circuit board to be repaired is repaired by adopting the printed circuit board short circuit repairing method, damage to the peripheral normal copper layer and the base material caused by the repaired residual product is avoided, and the repairing efficiency and the repairing effect are also greatly improved.
It should be noted that, the laser focusing device 13 includes a laser focusing lens set and a third driving member, the third driving member is disposed on the X-axis transplanting module 32, the laser focusing lens set is disposed opposite to the spot adjuster 12, and the third driving member is configured to drive the laser focusing lens set to move in a direction approaching or departing from the spot adjuster 12, so that the focal point of the rectangular laser spot is located on the surface of the area to be repaired. The third driving piece can be driven and adjusted by adopting a screw-nut, and as the specific structure and the focusing principle of the laser focusing lens group belong to the prior art, the detailed description is omitted.
It should be noted that, the X-axis transplanting module 32 is a conventional servo motor screw module, and will not be described herein. In addition, the Y-axis transplanting platform 31 includes a Y-axis transplanting module 311 and a carrying platform 312, wherein the carrying platform 312 is disposed below the laser focusing device 13, the carrying platform 312 is used for carrying a circuit board to be repaired, and the Y-axis transplanting module 311 is used for driving the carrying platform 312 to move along the Y-axis direction. The Y-axis transplanting module 311 is also a conventional servo motor screw module, and will not be described here again. It should be noted that, the Y-axis transplanting module 311 and the X-axis transplanting module 32 each perform corresponding movement according to the image information acquired by the visual imaging system 2, and the positioning accuracy of the Y-axis transplanting module 311 and the X-axis transplanting module 32 is ±0.1 μm.
In this embodiment, as shown in fig. 1, the visual imaging system 2 includes an observation lens 21, a lens group 22, a visual imaging module 23, a CCD camera 24 and a light source member 25, where the observation lens 21 is disposed above the carrying platform 312 (in the positive direction of the Z axis in the drawing), the lens group 22, the visual imaging module 23 and the CCD camera 24 are sequentially disposed above the observation lens 21 along the light path direction, and the light source member 25 is used for providing a light source for the observation lens 21, so as to ensure that the observation lens 21 observes the image information of the area to be repaired on the carrying platform 312 more clearly. Since the functions and specific working principles of the components in the visual imaging system 2 belong to the prior art, the details are not repeated here. It should be noted that, the observation lens 21 has 10 times of observation lenses and 50 times of observation lenses, and the observation lens 21 with a proper multiple can be selected according to the requirement.
Referring now to fig. 3 and 4, the specific structure of the spot adjuster 12 will be described, as shown in fig. 3 and 4, the spot adjuster 12 includes a first driving member 121, a first blocking piece 122, a second blocking piece 123, a second driving member 124, a third blocking piece 125, and a fourth blocking piece 126, where the first driving member 121 and the second driving member 124 are disposed on the X-axis transplanting module 32, the first blocking piece 122 and the second blocking piece 123 are arranged at intervals along a first direction, the first driving member 121 can synchronously drive the first blocking piece 122 and the second blocking piece 123 to approach or depart from each other, the third blocking piece 125 and the fourth blocking piece 126 are arranged at intervals along a second direction, the second driving member 124 can synchronously drive the third blocking piece 125 and the fourth blocking piece 126 to approach or depart from each other, the second direction and the first direction are perpendicular to each other, the first blocking piece 122, the second blocking piece 123, the third blocking piece 125, and the fourth blocking piece 126 are in a "well" shape "and form a rectangular slit 127 in the middle, the first driving member 11 emits a rectangular slit 127, and the second driving member 127 emits a rectangular slit 127 through the first driving member 121 and the rectangular slit 127, and the second driving member 121 moves the laser beam to move correspondingly, and the size of the rectangular slit 127 is adjusted. It should be noted that, in this embodiment, the first baffle 122 and the second baffle 123 are arranged at intervals along the X-axis direction, the third baffle 125 and the fourth baffle 126 are arranged at intervals along the Y-axis direction, and the first driving member 121 and the second driving member 124 are all motor screw modules, so as to ensure the adjustment accuracy of each baffle.
It is to be understood that the above examples of the present invention are provided for clarity of illustration only and are not limiting of the embodiments of the present invention. Other variations or modifications of the above teachings will be apparent to those of ordinary skill in the art. It is not necessary here nor is it exhaustive of all embodiments. Any modification, equivalent replacement, improvement, etc. which come within the spirit and principles of the invention are desired to be protected by the following claims.
Claims (10)
1. A method for repairing short circuit of a printed circuit board is characterized by comprising the following steps:
s1: acquiring an image of a region to be repaired of a circuit board to be repaired so as to determine the size, shape and position of the region to be repaired;
s2: adjusting the size of a rectangular laser spot according to the acquired image information of the area to be repaired, and focusing the focus of the rectangular laser spot on the surface of the area to be repaired so as to remove the copper layer of the area to be repaired;
s3: and reducing the irradiation power of the rectangular laser spot, and focusing the focus of the rectangular laser spot on the surface of the area to be repaired so as to clean the residual product of the area to be repaired.
2. The method for repairing a short circuit of a printed wiring board according to claim 1, further comprising the step of, after step S3:
s4: acquiring an image of the area to be repaired, and judging whether the area to be repaired meets the repair requirement or not;
if yes, executing the operations from the step S1 to the step S3 on the next area to be repaired of the circuit board to be repaired;
if not, continuing to execute the operations from the step S1 to the step S3 on the area to be repaired.
3. The method according to claim 1, wherein in step S2, when the acquired size of the area to be repaired is larger than the largest size of the rectangular laser spot, the rectangular laser spot is adjusted to the largest size, and the rectangular laser spot and the area to be repaired are relatively moved so that the rectangular laser spot fills and scans the surface of the area to be repaired;
and when the acquired size of the area to be repaired is not larger than the maximum size of the rectangular laser spot, adjusting to enable the size of the rectangular laser spot to be matched with the size of the area to be repaired, so that the rectangular laser spot covers and irradiates the surface of the area to be repaired.
4. A method of repairing a short circuit of a printed wiring board according to any one of claims 1 to 3, wherein in step S2, the irradiation power of the rectangular laser spot is 100uj to 1000uj.
5. A method of repairing a short circuit of a printed wiring board according to any one of claims 1 to 3, wherein the rectangular laser spot has a length dimension in the range of 1 μm to 250 μm and a width dimension in the range of 1 μm to 250 μm.
6. A method of repairing a short circuit of a printed wiring board according to claim 2 or 3, wherein in step S1 and step S4, the image of the area to be repaired is acquired under a 10-fold observation lens; in step S2, the size of the rectangular laser spot is adjusted under a 50-fold observation lens.
7. A printed wiring board short-circuit repairing apparatus, characterized in that the printed wiring board to be repaired is repaired by adopting the printed wiring board short-circuit repairing method according to any one of claims 1 to 6, the printed wiring board short-circuit repairing apparatus comprising:
a laser optical system (1), the laser optical system (1) comprising a laser (11), a spot adjuster (12) and a laser focusing device (13) which are sequentially arranged along a laser beam irradiation path, the laser (11) being configured to emit a laser beam, the spot adjuster (12) being configured to adjust the received laser beam to a rectangular laser spot of a desired size, the laser focusing device (13) being configured to focus the received rectangular laser spot on a surface of an area to be repaired;
a vision imaging system (2), the vision imaging system (2) being configured to acquire an image of the area to be repaired of the circuit board to be repaired, and the spot adjuster (12) adjusting a size of the rectangular laser spot according to image information acquired by the vision imaging system (2); and
the translation motion system (3), the translation motion system (3) comprises a Y-axis transplanting platform (31) and an X-axis transplanting module (32), the Y-axis transplanting platform (31) is positioned below the laser focusing device (13), and the Y-axis transplanting platform (31) is configured to drive the circuit board to be repaired to move along the Y-axis direction; the X-axis transplanting module (32) is configured to synchronously drive the laser optical system (1) and the visual imaging system (2) to move along the X-axis direction.
8. The printed wiring board short circuit repairing device according to claim 7, wherein the flare adjuster (12) comprises:
the X-axis transplanting module comprises a first driving piece (121), a first baffle (122) and a second baffle (123), wherein the first driving piece (121) is arranged on an X-axis transplanting module (32), the first baffle (122) and the second baffle (123) are arranged at intervals along a first direction, and the first driving piece (121) can synchronously drive the first baffle (122) and the second baffle (123) to be close to or far away from each other;
the X-axis transplanting module (32) comprises a second driving piece (124), a third baffle (125) and a fourth baffle (126), wherein the second driving piece (124) is arranged on the X-axis transplanting module (32), the third baffle (125) and the fourth baffle (126) are arranged at intervals along a second direction, the second driving piece (124) can synchronously drive the third baffle (125) and the fourth baffle (126) to be close to or far away from each other, and the second direction and the first direction are mutually perpendicular;
the first baffle (122), the second baffle (123), the third baffle (125) and the fourth baffle (126) are arranged in a 'well' -shaped manner and form a rectangular slit (127) in the middle, the laser beam is emitted through the rectangular slit (127), and the size of the rectangular laser spot emitted through the rectangular slit (127) is adjusted by adjusting the size of the rectangular slit (127).
9. The printed wiring board short-circuit repairing device according to claim 7, wherein the laser focusing device (13) comprises a laser focusing lens group and a third driving piece, the third driving piece is arranged on the X-axis transplanting module (32), the laser focusing lens group is opposite to the light spot adjuster (12), and the third driving piece is configured to drive the laser focusing lens group to move towards a direction approaching or away from the light spot adjuster (12).
10. The printed wiring board short circuit repair device according to claim 7, wherein the Y-axis transplanting stage (31) comprises:
a Y-axis transplanting module (311); and
the bearing platform (312) is arranged below the laser focusing device (13), the bearing platform (312) is used for bearing the circuit board to be repaired, and the Y-axis transplanting module (311) is configured to drive the bearing platform (312) to move along the Y-axis direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310198073.5A CN116156778A (en) | 2023-03-03 | 2023-03-03 | Method and device for repairing short circuit of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310198073.5A CN116156778A (en) | 2023-03-03 | 2023-03-03 | Method and device for repairing short circuit of printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116156778A true CN116156778A (en) | 2023-05-23 |
Family
ID=86358146
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310198073.5A Pending CN116156778A (en) | 2023-03-03 | 2023-03-03 | Method and device for repairing short circuit of printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116156778A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117031873A (en) * | 2023-09-28 | 2023-11-10 | 上海传芯半导体有限公司 | Repairing method and repairing device |
| CN118334418A (en) * | 2024-04-09 | 2024-07-12 | 上海频准激光科技有限公司 | Target laser information acquisition method, electronic equipment and storage medium |
-
2023
- 2023-03-03 CN CN202310198073.5A patent/CN116156778A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117031873A (en) * | 2023-09-28 | 2023-11-10 | 上海传芯半导体有限公司 | Repairing method and repairing device |
| CN117031873B (en) * | 2023-09-28 | 2024-01-05 | 上海传芯半导体有限公司 | Repairing method and repairing device |
| CN118334418A (en) * | 2024-04-09 | 2024-07-12 | 上海频准激光科技有限公司 | Target laser information acquisition method, electronic equipment and storage medium |
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