CN116156370A

CN116156370A - Wireless earphone, shell and electronic equipment

Info

Publication number: CN116156370A
Application number: CN202111376387.7A
Authority: CN
Inventors: 陈家熠; 黎椿键; 秦仁轩; 陶婧雅; 罗育峰; 黄洲泓
Original assignee: Huawei Technologies Co Ltd
Current assignee: Huawei Technologies Co Ltd
Priority date: 2021-11-19
Filing date: 2021-11-19
Publication date: 2023-05-23

Abstract

The embodiment of the application provides a wireless earphone, a shell and electronic equipment, relates to the technical field of electronics, and is used for solving the problem that the wireless earphone is large in size. The wireless earphone includes: a first housing having a recess; a piezoelectric speaker; the piezoelectric loudspeaker comprises a vibrating diaphragm and a plurality of layers of piezoelectric sheets which are arranged in a laminated manner, and the plurality of layers of piezoelectric sheets are connected with the vibrating diaphragm; the multilayer piezoelectric sheet is positioned in the groove; a cavity formed by connecting the vibrating diaphragm and the first shell is used as at least part of a rear cavity of the piezoelectric loudspeaker; the circuit board and the power module are arranged in the groove and are positioned on one side, away from the vibrating diaphragm, of the multilayer piezoelectric sheet. Wherein, the vibrating diaphragm can be directly used as the front shell of the wireless earphone.

Description

Wireless earphone, shell and electronic equipment

Technical Field

The application relates to the technical field of electronics, in particular to a wireless earphone, a shell and electronic equipment.

Background

The wireless earphone can communicate with the electronic device by utilizing a wireless communication technology (such as Bluetooth technology, infrared radio frequency technology, 2.4G wireless technology and the like), compared with a wired earphone, the wireless earphone is more convenient to use because the wireless earphone gets rid of the constraint of a physical wire, and is rapidly developed.

Especially, the real wireless earphone is also called a real wireless stereo (true wireless stereo, TWS) earphone, the mode of wire (wire between two left and right earphones) connection is completely abandoned, and wearing, talking and music experience are improved, so that the earphone is favored by users.

However, the conventional wireless earphone is generally large in size, and is provided with an independent charging box, and the charging box has the functions of storage and charging. When the wireless earphone needs to be charged, the wireless earphone is placed in the charging box, and the contact arranged on the wireless earphone is contacted with the contact in the charging box, so that the wireless earphone can be charged. Such a large-sized wireless earphone equipped with a charging box is inferior in portability, and brings much inconvenience to users.

Disclosure of Invention

The embodiment of the application provides a wireless earphone, a shell and electronic equipment, which are used for solving the problem of large size of the wireless earphone.

In order to achieve the above purpose, the present application adopts the following technical scheme:

in a first aspect of embodiments of the present application, there is provided a wireless earphone, including: a first housing having a recess; a piezoelectric speaker; the piezoelectric loudspeaker comprises a vibrating diaphragm and a plurality of layers of piezoelectric sheets which are arranged in a laminated manner, and the plurality of layers of piezoelectric sheets are connected with the vibrating diaphragm; the multilayer piezoelectric sheet is positioned in the groove; a cavity formed by connecting the vibrating diaphragm and the first shell is used as at least part of a rear cavity of the piezoelectric loudspeaker; the circuit board and the power module are arranged in the groove and are positioned on one side, away from the vibrating diaphragm, of the multilayer piezoelectric sheet.

The wireless earphone that this application embodiment provided includes the speaker be piezoelectric speaker, piezoelectric speaker including multilayer piezoelectric piece and the vibrating diaphragm of range upon range of setting. The total thickness of the laminated multilayer piezoelectric sheet is also thin (for example, 0.1mm to 1 mm), and the total thickness of the coil and the magnet included in the coil speaker needs to be at least about 2mm to 3 mm. Therefore, by selecting the speaker in the wireless earphone as the piezoelectric speaker, the thickness of the wireless earphone can be reduced. On the basis, the cavity formed by connecting the vibrating diaphragm and the first shell is used as at least part of the rear cavity of the piezoelectric loudspeaker, so that the piezoelectric loudspeaker can be free from the rear cavity or the part of the rear cavity. Although a vibration space (4 mm, for example, 0.5mm is required to the maximum) of the piezoelectric sheet needs to be reserved between the piezoelectric sheet and the power module or the circuit board in order to ensure the normal operation of the piezoelectric speaker, the back cavity usually needs to be several to tens of milliliters, and needs to be converted into a thickness of several millimeters, for example, 5-8mm, so that the thickness of the wireless earphone is greatly influenced. Compared with the size of the rear cavity, the thickness required by vibration of the piezoelectric sheet in the embodiment of the application is obviously smaller than that required by the rear cavity. Therefore, the thickness of the wireless earphone can be reduced, and the wireless earphone is further thinned.

In one possible implementation, the diaphragm serves as a second shell of the wireless earphone, and is connected with the first shell in a butt joint manner to form a shell of the wireless earphone. By using the diaphragm of the piezoelectric loudspeaker directly as the second shell of the wireless earphone, the second shell does not need to be arranged separately. The influence of the thickness of the second shell on the thickness of the wireless earphone can be eliminated, and the thickness of the wireless earphone can be further reduced.

In one possible implementation, the wireless earphone further includes a second shell, and the second shell is connected with the first shell in a butt joint manner to form a shell of the wireless earphone; the vibrating diaphragm is connected with the second shell to form a front cavity of the piezoelectric loudspeaker; the diaphragm is connected with the first shell through the second shell. One implementation.

In one possible implementation, the first shell includes a venting hole, and the venting hole communicates with a chamber defined by the diaphragm and the first shell. By providing the vent hole in the first housing, the vent hole opens to allow communication between the interior of the housing and the outside, and the outside environment serves as part of the rear cavity of the piezoelectric speaker. The space in the shell only needs to be satisfied for placing components such as a circuit board, a power module and the like, and the problem of a rear cavity of the piezoelectric loudspeaker is not needed to be considered.

In one possible implementation, a distance between one of the circuit board and the power module proximate to the multilayer piezoelectric sheet and the multilayer piezoelectric sheet is less than or equal to 4mm. On the basis of meeting the vibration space of the piezoelectric sheet, the distance between the piezoelectric sheet and the circuit board or the power module can be reduced as far as possible, so that the thickness of the wireless earphone is reduced.

In one possible implementation, the circuit board has a receiving hole, and at least a portion of the power module is located within the receiving hole. The power module is at least partially positioned in the accommodating hole, so that the influence of the partial power module positioned in the accommodating hole on the thickness of the wireless earphone can be ignored, and the thickness of the wireless earphone is further reduced.

In one possible implementation, the width of the piezoelectric sheet is 5mm to 18mm. The size and shape of the piezoelectric sheet can be reasonably set to push the vibrating diaphragm to vibrate.

In one possible implementation, the width of the housing is 8mm to 20mm. The wireless earphone provided by the embodiment of the application is a mini wireless earphone.

In one possible implementation, the housing is flat. The wireless earphone provided by the embodiment of the application is an ultrathin wireless earphone.

In one possible implementation, the wireless headset further comprises a skin friendly layer; the skin-friendly layer covers at least a portion of a surface of the housing proximate the piezoelectric speaker. Through setting up skin-friendly layer on the shell, when can making the user wear wireless earphone, skin-friendly layer and user's ear contact improve user and wear the comfort level, promote user experience effect.

In one possible implementation, the power module includes a headset charging terminal and a battery, the headset charging terminal being coupled to the battery; the earphone charging terminal is exposed to the first case. Thus, the wireless earphone can be provided with a function of wired charging.

In one possible implementation, the power module includes a wireless charging receive coil and a battery, the wireless charging receive coil being used to charge the battery. Thus, the wireless earphone can have the function of wireless charging.

In one possible implementation, the wireless headset further includes a processor, a memory, and a wireless communication module integrated on the circuit board; the memory is coupled with the processor; the processor is coupled with the power module, the wireless communication module and the piezoelectric loudspeaker; the wireless communication module is coupled with the power module. The processor, the memory and the wireless communication module are integrated on the circuit board, so that the integration level of the wireless earphone can be improved, and the wireless earphone is light and thin.

In one possible implementation, the wireless headset further includes: the microphone is arranged on the circuit board and is coupled with the power supply module. Through setting up the microphone in wireless earphone, can make wireless earphone have the conversation function to improve wireless earphone's application scope.

In a second aspect of embodiments of the present application, a wireless headset is provided, including a housing and a headset assembly, the housing being flat, the headset assembly being located within the housing; the earphone assembly comprises a circuit board, a power module and a loudspeaker; the circuit board is provided with a containing hole, and the power supply module is at least partially positioned in the containing hole; the speaker is disposed between the power module and the housing.

Compared with the conventional wireless earphone with the earplug part and the lug part, the earphone component part is positioned at the earplug part and the lug part, and the wireless earphone provided by the embodiment of the application is flat (similar to a button cell) through arranging the shell, the long lug part is not needed, the size of the wireless earphone can be reduced, the wireless earphone is light and thin, and the portability is high. On the basis, a storage hole is formed in the circuit board in the earphone assembly, and the power module is at least partially located in the storage hole. Under the condition that the power module is completely positioned in the accommodating hole, the thickness of the wireless earphone cannot be increased by the power module. Under the condition that the power module part is positioned in the accommodating hole, the thickness of the wireless earphone cannot be increased by the part of the power module positioned in the accommodating hole, so that the thickness of the wireless earphone can be further reduced, the wireless earphone is light and thin, and the portable wireless earphone is convenient to carry.

In one possible implementation, the receiving hole is a through hole. Through setting up the hole of accomodating into the through-hole, can make more power module and speaker hold in accomodating the downthehole, power module and speaker are located the downthehole part of accomodating and can not increase wireless earphone's thickness, reduce the influence of power module and speaker self thickness to wireless earphone whole thickness as far as, reduce wireless earphone's thickness, make wireless earphone frivolous.

In one possible implementation, the speaker is a piezoelectric speaker. The piezoelectric speaker has ultra-thin characteristic, and wireless earphone uses piezoelectric speaker, can further reduce wireless earphone's thickness, reduces wireless earphone's size. And the piezoelectric laminated stack layers can greatly reduce the voltage requirement during use and improve the displacement amplitude.

In a third aspect of embodiments of the present application, there is provided a housing comprising: a housing body having an outer surface; the outer surface has a receiving slot for receiving either the wireless headset of the first aspect or the second aspect in a detachable connection. The wireless earphone that this application embodiment provided, it is small, can directly attach in the back of casing, need not solitary receiver, convenient to carry.

In one possible implementation, the receiving slot is magnetically connected and/or snap-fit connected with the wireless headset. The storage groove is connected with the wireless earphone magnetically and/or in a buckling manner, and the wireless earphone is connected with the storage groove reliably, so that the wireless earphone is prevented from falling off. In addition, the wireless earphone is easy to put into or take out from the storage groove in the connection mode, and the experience effect is good.

In one possible implementation, the surface of the receiving slot has a housing charging terminal for contact connection with an earphone charging terminal of the wireless earphone. The wireless earphone can be directly charged in a wired manner through the shell, an independent charging box and a charging wire matched with the charging box are not needed, and the wireless earphone is convenient for users to use.

In one possible implementation, the housing is an electronic device back shell or an electronic device protective shell. That is, the wireless earphone can be directly placed in the accessory of the electronic equipment without a separate storage box, and the portable earphone is convenient to carry.

In a fourth aspect of embodiments of the present application, there is provided an electronic device including a display screen and a housing of the third aspect, the housing being located on a backlight side of the display screen, an outer surface of the housing facing away from the display screen.

The electronic equipment that this application embodiment provided can accomodate the wireless earphone of above-mentioned first aspect and second aspect and carry, also can carry out wireless charging through electronic equipment, or carry out wired charging through electronic equipment (or casing), need not the supporting charging wire of solitary charging box and charging box, and it is convenient to charge.

Drawings

Fig. 1A is a schematic structural diagram of a wireless earphone according to an embodiment of the present application;

fig. 1B is a schematic structural diagram of a wireless earphone charging box according to an embodiment of the present application;

fig. 2 is a schematic structural diagram of a housing according to an embodiment of the present disclosure;

fig. 3 is a schematic structural diagram of an ear providing a supporting point for a wireless earphone according to an embodiment of the present application;

fig. 4 is a schematic structural diagram of a wireless earphone according to an embodiment of the present application;

Fig. 5A is a schematic side view of a wireless earphone according to an embodiment of the present disclosure;

fig. 5B is a schematic side view of another wireless headset according to an embodiment of the present disclosure;

fig. 5C is an exploded view of a wireless headset according to an embodiment of the present disclosure;

fig. 6A is an exploded view of another wireless headset according to an embodiment of the present application;

FIG. 6B is a cross-sectional view taken along line A1-A2 in FIG. 6A, according to an embodiment of the present application;

fig. 6C is an exploded view of yet another wireless headset provided in an embodiment of the present application;

FIG. 6D is a cross-sectional view taken along line B1-B2 in FIG. 6C, according to an embodiment of the present application;

FIG. 6E is a cross-sectional view taken along line B1-B2 of FIG. 6C in accordance with an embodiment of the present application;

fig. 6F is a cross-sectional view of a wireless headset according to an embodiment of the present application;

fig. 6G is a cross-sectional view of another wireless headset provided in an embodiment of the present application;

fig. 6H is a cross-sectional view of yet another wireless headset provided in an embodiment of the present application;

fig. 7A is an exploded view of yet another wireless headset provided in an embodiment of the present application;

FIG. 7B is a cross-sectional view taken along the direction C1-C2 in FIG. 7A, according to an embodiment of the present application;

FIG. 7C is a schematic view of another housing according to an embodiment of the present disclosure;

Fig. 7D is an exploded view of yet another wireless headset provided in an embodiment of the present application;

FIG. 7E is a cross-sectional view taken along the direction D1-D2 in FIG. 7D, according to an embodiment of the present application;

fig. 8A is an exploded view of yet another wireless headset provided in an embodiment of the present application;

FIG. 8B is a cross-sectional view taken along the direction E1-E2 in FIG. 8A, according to an embodiment of the present application;

fig. 8C is an exploded view of yet another wireless headset provided in an embodiment of the present application;

FIG. 8D is a cross-sectional view taken along the direction F1-F2 in FIG. 8C, according to an embodiment of the present application;

fig. 9A is a schematic side view of still another wireless headset according to an embodiment of the present application;

fig. 9B is a cross-sectional view of yet another wireless headset provided in an embodiment of the present application;

fig. 9C is a cross-sectional view of yet another wireless headset provided in an embodiment of the present application;

fig. 9D is a cross-sectional view of yet another wireless headset provided in an embodiment of the present application;

fig. 9E is a cross-sectional view of yet another wireless headset provided in an embodiment of the present application;

fig. 9F is a schematic stacking diagram of a piezoelectric sheet according to an embodiment of the present application;

fig. 10A is a schematic structural diagram of a diaphragm of a speaker according to an embodiment of the present disclosure;

fig. 10B is a schematic structural diagram of a diaphragm of another speaker according to an embodiment of the present disclosure;

Fig. 10C is a schematic structural diagram of a diaphragm of another speaker according to an embodiment of the present disclosure;

fig. 11A is a cross-sectional view of yet another wireless headset provided in an embodiment of the present application;

fig. 11B is a cross-sectional view of yet another wireless headset provided in an embodiment of the present application;

fig. 11C is a cross-sectional view of yet another wireless headset provided in an embodiment of the present application;

fig. 11D is a cross-sectional view of yet another wireless headset provided in an embodiment of the present application;

fig. 12A is a schematic diagram of a wireless earphone according to an embodiment of the present disclosure;

fig. 12B is a schematic diagram of another wireless earphone according to an embodiment of the present disclosure;

fig. 13A is a schematic structural view of a housing according to an embodiment of the present disclosure;

fig. 13B is a schematic structural view of another housing according to an embodiment of the present disclosure;

fig. 14 is a schematic structural diagram of a wireless earphone according to an embodiment of the present disclosure after the wireless earphone is placed in a housing;

fig. 15 is a schematic structural diagram of an electronic device according to an embodiment of the present application.

Reference numerals:

100-wireless headphones; 10-a housing; 11-a first shell; 12-a second shell; 13-a sound outlet hole; a 20-earphone assembly; 21-a circuit board; 211-a receiving hole; 22-memory; a 23-processor; a 24-wireless communication module; 25-a power module; 26-a speaker; 26' -piezoelectric speaker; 261-voice coil; 262-a magnetic conduction plate; 263-magnet; 264-vibrating diaphragm; 265-seal; 266-piezoelectric sheet; 267 electrode layer; 27-a microphone; 200-a housing; 210-a housing body; 220-a receiving slot; 300-an electronic device; 310-front shell; 320-a display module; 330-middle frame; 340-backshell.

Detailed Description

The following description of the technical solutions in the embodiments of the present application will be made with reference to the drawings in the embodiments of the present application, and it is apparent that the described embodiments are only some embodiments of the present application, but not all embodiments.

Hereinafter, the terms "second," "first," and the like are used for descriptive convenience only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "second," "first," etc. may explicitly or implicitly include one or more such feature. In the description of the present application, unless otherwise indicated, the meaning of "a plurality" is two or more.

Furthermore, in the embodiments of the present application, the terms "upper," "lower," "left," "right," and the like may be defined by, but are not limited to, orientations that are illustrated with respect to the component in the figures, it being understood that the directional terms may be used for relative description and clarity, and may be modified accordingly in response to changes in the orientation of the component in the figures.

In the embodiments herein, unless explicitly specified and limited otherwise, the term "connected" is to be construed broadly, and for example, "connected" may be either a fixed connection, a removable connection, or an integral body; can be directly connected or indirectly connected through an intermediate medium. Furthermore, the term "coupled" may be a direct electrical connection, or an indirect electrical connection via an intermediary. The term "contact" may be direct contact or indirect contact through an intermediary.

In the embodiment of the present application, "and/or" describes an association relationship of an association object, which indicates that three relationships may exist, for example, a and/or B may indicate: a alone, a and B together, and B alone, wherein a, B may be singular or plural. The character "/" generally indicates that the context-dependent object is an "or" relationship.

The application provides a wireless earphone, which can be matched with electronic equipment such as a mobile phone, a notebook computer, a tablet, a smart watch and the like for processing audio services such as media and communication of the electronic equipment or processing other data services. For example, the audio service may include media services for playing music, recording, sounds in video files, background music in games, incoming call alert tones, etc. for the user; and playing the voice data of the opposite terminal for the user or collecting the voice data of the user and sending the voice data to the opposite terminal and the like under the conversation service scenes such as telephone, weChat voice message, audio conversation, video conversation, game, voice assistant and the like.

Referring to fig. 1A, fig. 1A is a schematic structural diagram of a wireless earphone 100 according to some embodiments of the present application. The wireless headset 100 of the present embodiment is a true wireless stereo (true wireless stereo, TWS) headset. The wireless earphone 100 can be used as a pair, and can be used as a left ear earphone and a right ear earphone, respectively. The left earphone can be matched with the left ear of a user for use, and the right earphone can be matched with the right ear of the user for use. The wireless headset 100 may also be used alone as a left ear headset or a right ear headset.

As shown in fig. 1A, the wireless earphone 100 is an in-ear earphone, and the wireless earphone 100 includes an earplug portion, an ear portion, and an earphone assembly, wherein the earplug portion and the ear portion form a housing of the wireless earphone 100, and the earphone assembly is located in the earplug portion and the ear portion. The earphone assembly is used for realizing a music playing function and a conversation function of the earphone.

TWS earphone has abandoned the mode that the wire rod is connected completely, including between two earphones (left and right sides earphone), does not also have any wire rod, has promoted wearing, conversation, music experience.

Based on the wireless earphone 100 shown in fig. 1A, as shown in fig. 1B, the wireless earphone 100 is usually matched with a charging box having both functions of charging and storing, and the charging box can provide functions of long endurance and storing for the wireless earphone 100. When the wireless earphone 100 needs to be charged, the wireless earphone 100 is put into a charging box, and the wireless earphone 100 is charged through a charging terminal (or called a charging PIN). The wireless earphone 100 has a charger and a charging cord, and when the charging box is exhausted, the charging box needs to be charged by the charger and the charging cord.

However, the wireless earphone 100 including the ear plug portion and the ear stem portion has a large size (the wireless earphone 100 has a length of the order of centimeters), and when the wireless earphone 100 is carried or charged, the wireless earphone 100 needs to be placed in a charging box for use in a mating manner, which is disadvantageous in portability and causes a lot of inconvenience to the user.

Based on this, the embodiment of the present application also provides a flat wireless earphone 100 of a new form, which is similar to a button cell, a coin, a polygonal sheet, etc., in shape, so as to achieve light weight and portability of the wireless earphone 100.

The wireless earphone 100 of the new form provided in the embodiment of the present application is schematically described below.

As shown in fig. 2, the wireless headset 100 includes a housing 10 and a headset assembly (not shown).

The housing 10 is flat and is used for accommodating the earphone assembly to fix and protect the earphone assembly. The housing 10 is sized to be captured within the ear canal of a user.

The wireless headset 100 is secured to the ear canal by the outer diameter of the housing 10, illustratively, as shown in fig. 3, by four points within the ear, the wireless headset 100 being snapped into the ear. The four points in fig. 3 are only one illustration, and are not limited in any way. The point on the tragus (leftmost point) should be located just below the tragus, which is shown above the tragus for clarity in fig. 3.

In some embodiments, the housing 10 has a width of 8mm to 20mm. That is, the maximum size of the housing 10 is in the range of 8mm to 20mm. For example, the housing 10 has a width of 9mm, 10mm, 11mm, 12mm, 13mm, 14mm, 15mm, 16mm, 17mm, 18mm or 19mm, to fit different sized ear canals.

The shape of the housing 10 is not limited, and the top view of the housing 10 may be circular, triangular, quadrilateral, pentagonal, hexagonal or other irregular patterns, which are reasonably arranged after comprehensively considering cost factors and wearing factors.

In some embodiments, the thickness of the housing 10 is 1.4mm to 8mm, i.e., the thickness of the wireless headset 100 is 1.4mm to 8mm. For example, the thickness of the wireless headset 100 is 1.5mm, 2mm, 2.5mm, 3mm, 3.5mm, 3.7mm, 4mm, 4.3mm, 4.5mm, 4.9mm, 5mm, 5.3mm, 5.5mm, 5.7mm, 5.8mm, 5.9mm, 6mm, 6.1mm, 6.3mm, 6.5mm, 6.9mm, 7mm, or 7.5mm.

By reasonably setting the structure of the earphone assembly, the thickness of the wireless earphone 100 can be within the range of 1.4 mm-8 mm, and the width can be within the range of 8 mm-20 mm, thus realizing the light and thin wireless earphone 100.

In some embodiments, as shown in fig. 2, the housing 10 includes a second shell 12 and a first shell 11, the first shell 11 has a groove, and the second shell 12 and the first shell 11 are combined to form a receiving cavity to waterproof and protect the earphone assembly.

The first shell 11 has a groove, and the groove bottom and the groove wall of the first shell 11 may be an integral structure or a discrete structure, which is not limited in the embodiment of the present application. In the case where the groove bottom and the groove wall of the first case 11 are of separate structures, the materials of the groove bottom and the groove wall may be the same or different. In the case where the groove bottom and the groove wall of the first case 11 are separate structures, the groove wall may be formed integrally with the second case 12, and the groove wall and the second case 12 may be formed separately.

In the embodiment of the present application, the second shell 12 and the first shell 11 may be, for example, a front shell and a rear shell, for example, the first shell 11 may be, for example, a rear shell, and the second shell 12 may be, for example, a front shell. As another example, the first case 11 may be a front case, for example, and the second case 12 may be a rear case, for example.

Of course, the housing 10 may also include other structures, and is not limited to include only the second case 12 and the first case 11.

As shown in fig. 2, the folded housing 10 includes a first surface a1, a second surface a2, and a side surface a3. The first surface a1 and the second surface a2 are disposed opposite to each other, and the side surface a3 intersects the first surface a1 and the second surface a 2. The first surface a1 is located on the side of the second housing 12, the first surface a1 being placed towards the ear canal when the wireless headset 100 is worn by a user. The second surface a2 is located on the side of the first case 11, and the second surface a2 is exposed to the outside when the wireless earphone 100 is worn by the user.

In some embodiments, the second housing 12 and the first housing 11 are connected in a detachable connection. The detachable connection mode can be, for example, threaded connection, snap connection, hot melt adhesive connection and the like.

The second housing 12 and the first housing 11 are detachably connected, so that the housing 10 can be easily detached to facilitate maintenance of the earphone assembly located in the housing 10.

Regarding the earphone assembly, in some embodiments, as shown in fig. 4, the earphone assembly 20 is flat and disposed within the housing 10. Or it is understood that the earphone assembly 20 is disposed within the recess of the first housing 11.

The earphone assembly 20 is flat, and each component in the earphone assembly 20 may be flat, or may be flat after the components in the earphone assembly 20 are spliced and distributed.

In some embodiments, the wireless headset 100 is a wireless headset with music capabilities.

As shown in fig. 5A, the earphone assembly 20 includes a circuit board 21, a memory 22, a processor 23, a wireless communication module 24, a power module 25, and a speaker 26.

A circuit board 21 for providing interconnection circuitry for the various components within the earphone assembly 20.

The circuit board 21 may be, for example, a rigid circuit board (printed circuit board, PCB) or may include a part of a flexible circuit board (flexible printed circuit board, FPC).

The memory 22 may be used to store program code, such as program code stored for charging the wireless headset 100, wireless pairing of the wireless headset 100 with other electronic devices, or wireless communication of the wireless headset 100 with an electronic device, etc.

The processor 23 may be configured to execute the above program codes, provide control logic and algorithm driving for the function implementation of the wireless headset 100, and invoke related modules to implement the function of the wireless headset 100 in the embodiment of the present application, which is a control center of the wireless headset 100. For example, the processor 23 is coupled to the memory 22, the wireless communication module 24, the power module 25, and the speaker 26, and implements a wireless communication function, a charging function, an audio data playing function, and the like of the wireless headset 100.

The processor 23 may be a central processing module (central processing unit, CPU), but may also be other general purpose processor, digital signal processor (Digital Signal Processor, DSP), application specific integrated circuit (application specific integrated circuit, ASIC), field programmable gate array (field programmable gate array, FPGA) or other programmable logic device, transistor logic device, hardware components, or any combination thereof. The general purpose processor may be a microprocessor, but in the alternative, it may be any conventional processor.

The wireless communication module 24 provides a communication function for the wireless earphone 100, and can be used for supporting communication between the wireless earphone 100 and other electronic devices (the wireless earphone can be the other earphone of the left earphone and the right earphone or playing devices such as a mobile phone and a computer). Examples include Bluetooth (BT), global navigation satellite system (global navigation satellite system, GNSS), wireless local area network (wireless local area networks, WLAN) (e.g., wireless fidelity (wireless fidelity, wi-Fi) network), frequency modulation (frequency modulation, FM), near field communication technology (near fieldcommunication, NFC), infrared technology (IR), and the like.

In some embodiments, the wireless communication module 24 may be a Bluetooth chip. The wireless earphone 100 may pair with bluetooth chips of other electronic devices through the bluetooth chip and establish a wireless connection, so as to realize wireless communication between the wireless earphone 100 and the other electronic devices through the wireless connection.

The wireless communication module 24 may further include an antenna, and the wireless communication module 24 may receive electromagnetic waves via the antenna, frequency-modulate and filter the electromagnetic wave signals, and transmit the processed signals to the processor 23. The wireless communication module 24 may also receive a signal to be transmitted from the processor 23, frequency modulate and amplify the signal, and convert the signal into electromagnetic waves to radiate the electromagnetic waves through the antenna.

In some embodiments, the memory 22, the processor 23, and the wireless communication module 24 are disposed on the circuit board 21. Thus, the integration level of the wireless earphone 100 can be improved, and the wireless earphone 100 is light and thin.

The memory 22, the processor 23 and the wireless communication module 24 may be provided on the circuit board 21 in the form of individually packaged chips having a single function. The memory 22, the processor 23 and the wireless communication module 24 may also be integrated on one chip, provided on the circuit board 21 in the form of a System On Chip (SOC). The memory 22, the processor 23 and the wireless communication module 24 may also be packaged in the same package structure, provided on the circuit board 21 in the form of a system in package chip (system in a package, SIP).

By integrating the devices with different functions on one chip or packaging the devices in one packaging structure, the space occupied by the devices in the wireless earphone 100 can be reduced, the integration level of the wireless earphone 100 is improved, and the volume of the wireless earphone 100 is reduced.

The power module 25 is configured to provide a system power for the wireless headset 100, power each module of the wireless headset 100, support the wireless headset 100 to receive a charging input, and so on.

The power module 25 is coupled to the circuit board 21, and coupled to the memory 22, the processor 23 and the wireless communication module 24 via the circuit board 21 (or the power module 25 may be directly coupled to the memory 22, the processor 23 and the wireless communication module 24) for supplying power to the memory 22, the processor 23 and the wireless communication module 24.

The power module 25 may include a power management unit (powermanagement unit, PMU) and a battery. The power management unit may include a charging circuit, a voltage drop adjusting circuit, a protection circuit, an electric quantity measuring circuit, and the like. The charging circuit may receive an external charging input. The voltage drop adjusting circuit can transform the electric signal input by the charging circuit and output the electric signal to the battery to charge the battery, and can transform the electric signal input by the battery and output the electric signal to other modules such as the wireless communication module 24. The protection circuit may be used to prevent overcharging, overdischarging, shorting, or overcurrent of the battery, etc. In addition, the power management unit can also be used for monitoring parameters such as battery capacity, battery cycle times, battery health status (leakage, impedance) and the like.

The battery may be, for example, a thin-sheet battery or a chip capacitor. The thin battery and the patch capacitor have smaller thickness, and are applied to the wireless earphone 100 of the present application, which is helpful for further thinning the wireless earphone 100. For example, the thickness of the battery may be 1 to 2mm. For example, the thickness of the battery is 1.5mm.

In some embodiments, the power module 25 further includes an earphone charging terminal coupled to the battery for wired charging of the battery.

The earphone charging terminal is exposed out of the housing 10, and is coupled to the power management unit. The charging structure is in contact with and coupled to the earphone charging terminal, and charges a battery connected with the power management unit through the earphone charging terminal.

The earphone charging terminals may be, for example, two, and the two earphone charging terminals are connected to the positive electrode and the negative electrode of the battery, respectively, so as to charge the battery.

The earphone charging terminal may be exposed to the second case 12 in the housing 10, may be exposed to the first case 11 in the housing 10, or may be exposed to the second case 12 and the first case 11. The embodiment of the application is not limited to this, and can be reasonably arranged according to the needs.

The type of earphone charging terminal can change according to actual demand. For example, the earphone charging terminal may be a spring pin (pogo pin), a spring plate, a conductive block, a conductive patch, a conductive sheet, a pin, a plug, a contact pad, a jack, or a socket, which is not limited in specific types of earphone charging terminals in the embodiments of the present application.

In other embodiments, the power module 25 further includes a wireless charging receiving coil for receiving a signal from the wireless charging transmitting coil to wirelessly charge the battery.

The speaker 26 (or called a vibration unit) is configured to output an audio signal received by the wireless communication module 24 in the wireless headset 100, so as to play a voice signal of the wireless headset 100.

The speaker 26 is directly coupled to the processor 23 (or alternatively, the speaker 26 is coupled to the circuit board 21 and coupled to the processor 23 via the circuit board 21), the audio signal received by the wireless communication module 24 is transmitted to the processor 23, and the processor 23 sends a control signal to control the speaker 26 to vibrate, and the speaker 26 generates vibration through different electric excitation, and the vibration is transmitted to the acoustic nerve through the air and the part contacted with the human ear, so that the human generates hearing.

The speaker 26 may be, for example, at least one of a moving coil speaker, a moving iron speaker, or an electrostatic speaker. It should be noted that, depending on the type of the speaker 26, whether or not the sound hole is formed in the housing 10 is appropriately selected.

In some embodiments, speaker 26 comprises a moving coil speaker.

The principle of the moving coil loudspeaker is as follows: when the current transmitted by the processor 22 passes through, an electromagnetic field which changes with the current law is generated by the coil, and under the combined action of the magnets, the coil and the vibrating diaphragm vibrate together to drive surrounding air to vibrate, and the moving-coil loudspeaker generates sound.

As shown in fig. 5A, the moving coil speaker includes a voice coil 261, a magnetic conductive plate 262, a magnet 263, and a diaphragm 264. The moving coil speaker has a rear chamber, and the diaphragm 264 and the second housing 12 constitute a front chamber.

An electrical signal is applied to the voice coil 261 such that a current is generated in the voice coil 261, and the voice coil 261 is energized to generate a magnetic field, which interacts with the magnetic field of the original magnet 263, so that the voice coil 261 moves up and down. Since the voice coil 261 is connected with the diaphragm 264. Thus, the diaphragm 264 moves up and down, pushing air to sound. The front cavity and the rear cavity are blocked by the vibrating diaphragm 264, so that the front cavity and the rear cavity are prevented from being conducted, and low-frequency signals sent by the vibrating diaphragm 264 are mutually counteracted to influence the low-frequency performance of the loudspeaker 26.

Alternatively, as illustrated in fig. 5B, the moving coil speaker includes a voice coil 261, a magnetic conductive plate 262, a magnet 263, and a diaphragm 264. The moving coil speaker has an open rear cavity, and the void portion in the housing 10 serves as the rear cavity of the moving coil speaker, which is self-contained with a front cavity.

By employing the void portion in the housing 10 as the rear cavity of the speaker 26, the speaker 26 does not need to be self-contained, and the thickness of the speaker 26 can be further reduced, making the wireless headset 100 lightweight and slim.

As can be seen from the above description of the working principle of the moving coil speaker, in the case where the speaker 26 in the wireless earphone 100 is a moving coil speaker, as shown in fig. 5A and 5B, the housing 10 needs to be further provided with a sound outlet 13, so that the sound emitted by the diaphragm 264 needs to be transmitted out of the housing 10 through the sound outlet 13 and enter the ear of the user. Therein, as shown in fig. 5C, the sound outlet hole 13 may be provided, for example, on the second case 12 (the first surface a1 of the outer case 10) to be disposed closer to the user's ear canal, improving the sound outlet effect.

In the case that the wireless earphone 100 further includes the sound outlet holes 13, the number, the setting position and the shape of the sound outlet holes 13 are not limited, and the sound outlet holes can be reasonably set according to needs.

Regarding the structure and arrangement of the circuit board 21, the memory 22, the processor 23, the wireless communication module 24, the power module 25, and the speakers 26 in the earphone assembly 20:

In some embodiments, as shown in fig. 5C, each of the circuit board 21, the power module 25, and the speaker 26 is provided in a flat shape to match the shape of the housing 10.

In some embodiments, speaker 26 is disposed proximate second housing 12.

By way of example, as shown in fig. 5C, the speaker 26 is disposed near the first surface a1 of the housing 10, enabling the user to receive audio signals at a closer distance.

In some embodiments, as shown in fig. 5C, the power module 25 is disposed proximate to the first housing 11 to facilitate receiving wireless or wired charging signals at a closer distance.

In this case, as shown in fig. 5C, the memory 22, the processor 23, and the wireless communication module 24 are provided on the side of the circuit board 21 close to the first housing 11.

That is, the memory 22, the processor 23, and the wireless communication module 24 are disposed between the circuit board 21 and the power module 25 so as to receive power of the power module 25.

In other embodiments, as shown in fig. 6A and 6B (cross-sectional view along A1-A2 in fig. 6A), the circuit board 21 is disposed near the first housing 11, and the power module 25 is disposed on a side of the circuit board 21 away from the first housing 11.

In this case, the memory 22, the processor 23, and the wireless communication module 24 are disposed on the side of the circuit board 21 remote from the first housing 11.

That is, the memory 22, the processor 23, and the wireless communication module 24 are disposed between the circuit board 21 and the power module 25 such that the side of the circuit board 21 near the first housing 11 is in direct contact with the first housing 11, reducing the gap between the circuit board 21 and the first housing 11, thereby reducing the thickness of the wireless earphone 100. Furthermore, it is convenient to receive power from the power module 25.

In other embodiments, as shown in fig. 6C, the circuit board 21 has a receiving hole 211 thereon.

Alternatively, as shown in fig. 6C, the receiving hole 211 is a through hole, and the power module 25 is at least partially located in the receiving hole 211.

As illustrated in fig. 6D (cross-sectional view taken along the direction B1-B2 in fig. 6A), the depth h1 of the receiving hole 211 is greater than the thickness h2 of the power module 25, and the power module 25 is entirely located within the receiving hole 211.

On this basis, as shown in fig. 6D, the speaker 26 is provided between the power supply module 25 and the second case 12, and the speaker 26 is partially located in the receiving hole 211. Of course, depending on the depth of the receiving hole 211 and the thickness of the power module 25, the speaker 26 may be located entirely inside the receiving hole 211, or the speaker 26 may be located outside the receiving hole 211.

Alternatively, as illustrated in fig. 6E (a cross-sectional view taken along the direction C1-C2 in fig. 6A), the depth h1 of the receiving hole 211 is smaller than the thickness h2 of the power module 25, and the power module 25 is partially located within the receiving hole 211.

In either configuration, by providing the receiving hole 211 as a through hole, the circuit board 21 can be disposed close to the first housing 11, for example, the circuit board 21 is directly in contact connection with the first housing 11. The power supply module 25 is also arranged close to the first housing 11, for example the power supply module 25 is directly in contact with the first housing 11.

Through setting the accommodating hole 211 as the through hole, more power supply modules 25 and speakers 26 can be accommodated in the accommodating hole 211, the thickness of the wireless earphone 100 cannot be increased at the positions of the power supply modules 25 and the speakers 26 in the accommodating hole 211, the influence of the thickness of the power supply modules 211 and the speakers 26 on the whole thickness of the wireless earphone 100 is reduced as much as possible, the thickness of the wireless earphone 100 is reduced, and the wireless earphone 100 is made to be light and thin.

Alternatively, the receiving hole 211 is a blind hole, and the power module 25 is at least partially located in the receiving hole 211.

As illustrated in fig. 6F, the receiving hole 211 is a hole facing the first case 11.

The power module 25 is disposed between the circuit board 21 and the first case 11, and the power module 25 is partially or entirely disposed in the receiving hole 211 according to the depth of the receiving hole 211, and the speaker 26 is disposed between the circuit board 21 and the second case 12.

Alternatively, as illustrated in fig. 6G, the receiving hole 211 is a hole facing the second case 12.

The power module 25 is disposed between the circuit board 21 and the second case 12, and the power module 25 is partially or entirely disposed in the receiving hole 211 according to the depth of the receiving hole 211. The speaker 26 is disposed between the power module 25 and the second case 12, and the speaker 26 is located outside the receiving hole 211, or the speaker 26 is partially located in the receiving hole 211, or the speaker 26 is entirely located in the receiving hole 211, depending on the hole depth of the receiving hole 211.

The shape and depth of the receiving hole 211 are not limited in this embodiment, and may be set as needed.

In other embodiments, as shown in fig. 6H, not every component of the earphone assembly 20 is flat, and the earphone assembly 20 formed by splicing multiple components is flat.

Compared with the conventional wireless earphone with an earplug part and an earstem part, the earphone assembly part is positioned at the earplug part and the part is positioned at the earstem part, the wireless earphone 100 provided by the embodiment of the application has the advantages that the shell 10 and the earphone assembly 20 positioned in the shell 10 are both flat (similar to a button battery), the long earstem part is not needed, the size of the wireless earphone 100 can be reduced, the wireless earphone 100 is light and thin, and the portability is high. On the basis, the circuit board 21 in the earphone assembly 20 is provided with a receiving hole 211, and the power module 25 is at least partially positioned in the receiving hole 211. In the case where the power module 21 is completely located in the receiving hole 211, the power module 25 does not increase the thickness of the wireless headset 100. In the case that the power module 25 is partially located in the accommodating hole 211, the thickness of the wireless earphone 100 is not increased by the portion of the power module 25 located in the accommodating hole 211, so that the thickness of the wireless earphone 100 can be further reduced, and the wireless earphone 100 is light and thin and portable.

In other embodiments, the wireless headset 100 is a wireless headset with music and talk functions.

Based on this, in addition to the above-described structure of the wireless earphone 100, as shown in fig. 7A, the wireless earphone 100 further includes a microphone 27 (or referred to as a sound pickup unit), and the microphone 27 is configured to receive sound of a user.

The microphone 27 is coupled to the power module 25 to receive a power signal provided by the power module 25. The microphone 27 is also coupled to the processor 23, and the microphone 27 may be directly coupled to the processor 23, or may be coupled to the circuit board 21, and coupled to the processor 23 via the circuit board 21.

When a person speaks, the human muscle tissue vibrates and the air medium fluctuates. The microphone 27 may pick up human muscle tissue vibrations or air medium fluctuations, convert them into electrical signals for the processor 23, and output to other electronic devices (e.g., cell phones) via the wireless communication module 24.

In some embodiments, the microphone 27 is disposed proximate to the first housing 11.

Illustratively, the microphone 27 is disposed on a surface of the circuit board 21 proximate the first housing 11.

In this way, the microphone 27 is closer to the mouth of the user, and a better sound receiving effect is obtained.

Alternatively, as illustrated in fig. 7A, the microphone 27 is provided on the surface of the circuit board 21 close to the second case 12.

In this way, the side of the circuit board 21 close to the first case 11 can be in direct contact with the first case 11, reducing the gap between the circuit board 21 and the first case 11, thereby reducing the thickness of the wireless earphone 100.

The microphone 27 can be soldered directly to the circuit board 21, thereby realizing a fixed connection and coupling with the circuit board 21.

The microphone 27 may be, for example, a bone conduction microphone, a sound pressure microphone, a particle velocity microphone, or the like. It should be noted that, depending on the principle of the microphone 27, it is reasonable to choose whether or not the sound inlet needs to be provided in the housing 10.

Wherein, the bone conduction microphone uses the slight vibration of the head and neck bone caused by the speaking of the user to collect the sound signal and convert the sound signal into the electric signal.

Based on this, in some embodiments, as shown in FIG. 7A, microphone 27 comprises a bone conduction microphone (also referred to as a vibration sensor, VPU). Then no sound inlet need be provided in the housing 10.

As shown in fig. 7B (a cross-sectional view taken along the direction C1-C2 in fig. 7A), in the case where the bone conduction microphone is provided on the side of the circuit board 21 remote from the first housing 11, the bone conduction microphone should be connected to the housing 10 (for example, connected to the first housing 11 by a connecting member such as an elastic member or directly connected to the first housing 11) to pick up sound by vibration of the housing 10.

Since bone conduction does not require air as a medium, the bone conduction microphone will still have a high definition in a strongly noisy environment. Furthermore, the bone conduction microphone does not need to provide an acoustic hole in the housing 10, and the wireless headset 100 has a good waterproof effect.

The sound pressure microphone collects sound signals and converts them into electric signals by utilizing the sound pressure change caused by the speaking of the user. Particle velocity microphones use changes in airflow caused by a user speaking to collect acoustic signals into electrical signals.

Based on this, in other embodiments, microphone 27 comprises a sound pressure microphone or a particle velocity microphone. Then, as shown in fig. 7C, an acoustic port may be further provided on the housing 10 so that sound may enter the microphone 27 through the acoustic port to check for changes in sound pressure and air flow.

Wherein the sound inlet hole may be provided on the first housing 11, for example, away from the ear canal of the user, so as to facilitate the pickup of the user's sound. The sound inlet may be arranged close to the microphone 27, for example, to improve the pick-up of the microphone 27.

In some embodiments, as shown in fig. 7D and 7E (cross-sectional view along direction D1-D2 in fig. 7D), the microphone 27 is disposed on the surface of the circuit board 21 near the second housing 12, and the sound inlet hole is also disposed on the circuit board 21, and the sound inlet hole on the first housing 11 communicates with the sound inlet hole on the circuit board 21, constituting a sound pickup passage of the microphone 27.

In the case that the wireless earphone 100 further includes sound inlet holes, the number, the setting position and the shape of the sound inlet holes are not limited, and the sound inlet holes can be reasonably set according to needs.

By providing the microphone 27 in the wireless earphone 100, the wireless earphone 100 can have a call function, so as to improve the application range of the wireless earphone 100.

In some embodiments, as shown in fig. 8A, the wireless headset 100 further includes a skin-friendly layer 30 disposed on a surface of the housing 10, the skin-friendly layer 30 covering at least a portion of a surface of the housing proximate to the speaker 26.

As an example, as shown in conjunction with fig. 8A and 8B (cross-sectional view along the direction E1-E2 in fig. 8A), the first surface a1 of the housing 10 has a groove 111, and the skin-friendly layer 30 is disposed in the groove 111.

The contour of the groove 111 may coincide with the contour of the skin-friendly layer 30, for example, and after the skin-friendly layer 30 is disposed in the groove 111, the groove 111 is just filled up to enhance the aesthetic effect of the wireless earphone 100.

Alternatively, as illustrated in connection with fig. 8C and 8D (cross-sectional view along the direction F1-F2 in fig. 8C), the skin-friendly layer 30 covers the first surface a1 of the housing 10 and wraps around the side surface a3 of the housing 10.

The skin-friendly layer 30 may be wrapped around only the side of the second case 12 or may be further wrapped around the side of the first case 11. The skin friendly layer 30 may be detachable, for example. The material of the skin-friendly layer 30 may include, for example, a material such as silica gel, a low-pressure foam mold, high-elasticity polyester, and soft gauze.

It should be appreciated that depending on the material of the skin-friendly layer 30, it may be desirable to choose whether or not holes or other sound-transmitting structures are provided in the skin-friendly layer 30 to avoid that the skin-friendly layer 30 blocks the sound transmitted from the sound outlet 13.

Illustratively, the material of the skin-friendly layer 30 is soft gauze, and the material of the skin-friendly layer 30 itself is acoustically transparent. The holes may not be provided in the skin friendly layer 30.

Alternatively, the material of the skin-friendly layer 30 is exemplified by silica gel, and the material of the skin-friendly layer 30 itself is not permeable to sound or the permeation effect of sound is not good. Holes may be provided in the skin friendly layer 30 to enhance the sound emitting effect of the wireless headset 100.

Through setting up skin layer 30 on shell 10, can make when wireless earphone 100 is worn to the user, skin layer 30 and user's ear contact improve the user and wear the comfort level, promote user experience effect.

In some embodiments, at least one control key (touch key or physical key) is provided on the housing 10 of the wireless earphone 100, and the control key is coupled to the processor 23 and can be used to trigger the pairing reset of the wireless earphone 100 or the charging of the wireless earphone 100.

In the wireless earphone 100 provided in this embodiment, in a music scenario, the power module 25 provides electric energy to enable all units to be in a working state, the wireless communication module 24 receives a signal source (for example, audio played by a mobile phone or other equipment) by adopting a wireless communication technology, and transmits the signal source to the processor 23, and the processor 23 performs algorithm and control signal output to control the speaker 26 to sound so that a user hears the sound.

In a call scenario, the power module 25 provides power to operate all the units, the microphone 27 picks up the sound signal and transmits the signal to the processor 23, the processor 23 transmits the processed signal to the wireless communication module 24, and the wireless communication module 24 transmits the call signal to an external device (e.g., a mobile phone).

In the charging scenario, the wireless earphone 100 is wired or wireless charged by attaching the side of the earphone charging terminal or the wireless charging receiving coil to the power supply device. When in wired charging, the earphone charging terminal is in contact with the charging terminal on the power supply equipment, so that wired power supply can be realized. When the wireless earphone 100 is charged, the power supply device turns on the wireless charging function, and the power supply device automatically identifies the wireless earphone 100 to charge the wireless earphone 100.

In other embodiments, the wireless earphone 100 includes the housing 10, the circuit board 21, the memory 22, the processor 23, the wireless communication module 24, the power module 25, and the microphone 27, and the speaker 26 included in the wireless earphone 100 is a piezoelectric speaker 26'.

The principle of the piezoelectric speaker 26' is: as shown in fig. 9A, the piezoelectric plate 266 is a vibration unit of the piezoelectric speaker 26', and is used to provide the conversion of the electrical energy of the whole system into mechanical energy, so as to drive the vibration film 264 to vibrate, and then to be conducted into the air, so as to form sound waves. When the electrical signal transmitted by the processor 22 passes through, the piezoelectric sheet 266 may be configured with an electrical signal, so that the piezoelectric sheet 266 vibrates under the action of the electrical signal, thereby driving the diaphragm 264 to vibrate. That is, the piezoelectric sheet 266 directly converts the electric energy into mechanical energy to push the diaphragm 264 to vibrate, so that the diaphragm 264 pushes air to sound.

Based on this, as shown in fig. 9B, the wireless earphone 100 includes a housing 10 and an earphone assembly.

The earphone assembly mainly includes the above-described circuit board 21, memory 22, processor 23, wireless communication module 24, power module 25, piezoelectric speaker 26', and microphone 27.

Regarding the structure of the piezoelectric speaker 26 'and the housing 10, in some embodiments, as shown in fig. 9B, the piezoelectric speaker 26' includes a plurality of piezoelectric sheets 266 and a diaphragm 264 that are stacked, and the piezoelectric sheets 266 are connected to the diaphragm 264 for driving the diaphragm 264 to vibrate, thereby making the diaphragm 264 push air to sound. The housing 10 is provided with a sound outlet 13, and sound emitted from the piezoelectric speaker 26' is emitted through the sound outlet 13.

As shown in fig. 9B, the diaphragm 264 of the piezoelectric speaker 26 'is connected to the second case 12, and forms a front chamber of the piezoelectric speaker 26'.

As shown in fig. 9B, the piezoelectric speaker 26' may be self-contained with a rear chamber. In this case, a vent hole may be further provided in the rear chamber of the piezoelectric speaker 26 'so that the rear chamber communicates with the inside of the first housing 11, and a chamber defined by the diaphragm 264 connected to the first housing 11 via the second housing 12 may also serve as a part of the rear chamber of the piezoelectric speaker 26'. So that the volume and thickness of the chamber of the piezoelectric speaker 26' itself can be reduced.

Alternatively, as shown in fig. 9C, the piezoelectric speaker 26 'does not have a rear cavity, and a cavity defined by the diaphragm 264 connected to the first case 11 via the second case 12 serves as the rear cavity of the piezoelectric speaker 26', and the gap between the piezoelectric sheet 266 and the power module 25 or the circuit board 21 may satisfy the vibration of the piezoelectric sheet 266.

Alternatively, as shown in fig. 9D, the piezoelectric speaker 26 'does not have a rear cavity, and a cavity defined by the diaphragm 264 connected to the first case 11 via the second case 12 serves as a part of the rear cavity of the piezoelectric speaker 26'. The first housing 11 is further provided with a vent hole, which communicates with a chamber defined by the diaphragm 264 and the first housing 11, so that the aforementioned chamber communicates with the outside, and the outside environment serves as a part of the rear chamber of the piezoelectric speaker 26'. That is, in some embodiments, the first case 11 is provided with a vent hole. The air leakage hole and the sound inlet hole on the first shell 11 may be the same hole or different holes.

It should be emphasized that, in the embodiment of the present application, the air vent hole on the first shell 11 is communicated with the cavity formed by connecting the diaphragm 264 and the first shell 11, and if the air vent hole is completely blocked or covered by the circuit board 21 or the power module 25 or other components in the wireless earphone 100, the air vent hole does not belong to the embodiment of the present application and is communicated with the cavity.

Alternatively, as shown in fig. 9E, the piezoelectric speaker 26 'does not have a rear cavity, and a cavity defined by the diaphragm 264 directly connected to the first case 11 may be used as the rear cavity of the piezoelectric speaker 26', and the gap between the piezoelectric sheet 266 and the power module 25 or the circuit board 21 may be sufficient to satisfy the vibration of the piezoelectric sheet 266.

Similarly, the first shell 11 may further be provided with a gas vent hole, where the gas vent hole is communicated with a cavity formed by connecting the diaphragm 264 with the first shell 11, and the cavity formed by directly connecting the diaphragm 264 with the first shell 11 is used as a part of rear cavity of the piezoelectric speaker 26 ', the cavity is communicated with the outside, and the external environment is used as a part of rear cavity of the piezoelectric speaker 26'.

The circuit board 21 and the power module 25 are located on a side of the multilayer piezoelectric sheet 266 away from the diaphragm 264, and in the case that the piezoelectric speaker 26' does not have a rear cavity, in some embodiments, a gap between one of the power module 25 and the circuit board 21 adjacent to the piezoelectric sheet 266 and the piezoelectric sheet 266 is within 4mm to ensure a vibration space and an airflow circulation space of the piezoelectric sheet 266.

For example, the power module 25 is adjacent to the piezoelectric sheet 266, and the gap between the piezoelectric sheet 266 closest to the power module 25 and the power module 25 is less than or equal to 4mm. Alternatively, the circuit board 21 is adjacent to the piezoelectric sheet 266, and the gap between the piezoelectric sheet 266 closest to the circuit board 21 and the circuit board 215 is less than or equal to 4mm.

Illustratively, the aforementioned gaps are 4.5mm, 4mm, 3.5mm, 3mm, 2.5mm, 2mm, 1.5mm, 1mm, 0.5mm, 0.4mm, 0.3mm, 0.2mm, 0.1mm.

As for the internal structure of the piezoelectric speaker 26', the piezoelectric plate 266 may be made of a laminated piezoelectric ceramic, for example, a lead zirconate titanate ceramic laminated piezoelectric plate. Alternatively, other piezoelectric ceramics, such as piezoelectric polymers, piezoelectric crystals, etc., may be used as the material of the piezoelectric plate 266. The piezoelectric crystal material may be lead zirconate titanate, polyvinylidene fluoride, lithium niobate, quartz, rochelle salt, etc.

The piezoelectric sheet 266 has a laminated structure, and the number of layers of the piezoelectric sheet 266 is generally several to several tens or several tens. The thickness of each layer of piezoelectric sheet 266 (the dimension in the stacking direction of the piezoelectric sheets 266) may be 5 μm to 50 μm. For example, each layer of piezoelectric sheet 266 has a thickness of 6 μm, 7 μm, 8 μm, 9 μm, 10 μm, 11 μm, 12 μm, 13 μm, 14 μm, 15 μm, 16 μm, 17 μm, 18 μm, 19 μm, 20 μm, 25 μm, 30 μm, 35 μm, 40 μm, or 45 μm. The thickness of each layer of piezoelectric sheet 266 in the multilayer piezoelectric sheet 266 may be the same or different.

Under the condition of meeting the requirements of reliability and tone quality, the overall thickness of the stacked multilayer piezoelectric sheets 266 can be 0.1 mm-1 mm. For example, the thickness of the multilayer piezoelectric sheet 266 is 0.2mm, 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, or 0.9mm.

For example, each piezoelectric sheet 266 has a thickness of 20 μm, the piezoelectric speaker 26' includes ten piezoelectric sheets 266, and the overall thickness of the stacked piezoelectric sheets 266 is 0.3mm (including the thickness of the electrode layers located between the piezoelectric sheets).

As illustrated in fig. 9F, the piezoelectric speaker 26' includes a plurality of piezoelectric sheets 266, each piezoelectric sheet 266 having a positive electrode and a negative electrode, respectively, and an electrode layer 267 is provided between adjacent piezoelectric sheets 266 as the positive electrode or the negative electrode of the piezoelectric sheet 266. In the case where the electrode layer 267 is used as the positive electrode, the electrode layer 267 is used as the positive electrode of the piezoelectric sheet 266 on both sides of the electrode layer 267. Similarly, when the electrode layer 267 is used as a negative electrode, the electrode layer 267 is used as a negative electrode of the piezoelectric sheet 266 on both sides of the electrode layer 267. The material of the electrode layer 267 may be a metal or a metal alloy. For example, the material of the electrode layer 267 is silver palladium alloy. For example, when the piezoelectric speaker 26' is operated, the polarization directions of the multilayer piezoelectric sheets 266 are the same, and the multilayer piezoelectric sheets 266 drive the diaphragm 264 to vibrate by bending deformation of the multilayer piezoelectric sheets 266 themselves.

In addition, the shape and size of the piezoelectric sheet 266 may be matched to the relevant size of the housing 10, i.e., the shape of the piezoelectric sheet 266 may be circular, elliptical, square, irregular, or the like. When the piezoelectric sheet 266 is circular in shape, the piezoelectric sheet 266 may have a diameter of 5 to 60mm. When the shape 266 of the piezoelectric sheet 266 is an irregular pattern, the width of the piezoelectric sheet 266 is 5 to 18mm. The piezoelectric sheet 266 is exemplified by 8mm, 8.5mm, 9mm, 9.5mm, 10mm, 10.5mm, 11mm, 11.5mm, 12mm, 12.5mm, 13mm, 13.5mm, 14mm, 14.5mm, 15mm, 15.5mm, 16mm, 16.5mm, 17mm, 17.5mm in width.

By reasonably sizing the piezoelectric patch 266, it is possible to avoid undersize the piezoelectric patch 266, resulting in less sound for the wireless headset 100, thereby enhancing low frequency performance.

In some embodiments, the shape of the piezoelectric sheet 266 is an asymmetric shape.

When the piezoelectric plate 266 is in a symmetrical pattern, the piezoelectric plate 266 has a highly symmetrical mode when vibrating, and has strong resonance and a significant peak-to-valley difference in frequency response. When the piezoelectric plate 266 is formed in an asymmetric pattern, the resonance of the vibration system can be broken, so that the resonance can be complemented in different directions to balance the peak-to-valley difference of the frequency response.

The piezoelectric plate 266 and the diaphragm 264 may be directly connected or indirectly connected, and can drive the diaphragm 264 to vibrate.

Regarding the diaphragm 264 of the piezoelectric speaker 26', the rigidity of the diaphragm 264 is small so that the resonance frequency f0 of the diaphragm 264 is low, thereby emitting full-band sound under the driving of the piezoelectric sheet 266.

The rigidity of the diaphragm 264 is related to the thickness, size, material and structure of the diaphragm 264, and the above factors are comprehensively considered when determining the specific structure of the diaphragm 264.

Because the thickness of the diaphragm 264 is too thick, on the one hand, the size of the wireless earphone 100 is increased, and on the other hand, the difficulty of the piezoelectric plate 266 driving the diaphragm 264 to vibrate is increased.

Thus, in some embodiments, the thickness of the diaphragm 264 may be, for example, within 15 mm. For example, the diaphragm 264 has a thickness of 14.5mm, 14mm, 13.5mm, 13mm, 12.5mm, 12mm, 11.5mm, 11mm, 10mm, 9mm, 8mm, 7mm, 6mm, 5mm, 4mm, 3mm, 2mm, 1mm, 0.5mm, 0.4mm, 0.3mm, 0.2mm, 0.1mm, 0.07mm, 0.05mm, 0.03mm.

In some embodiments, the edge of the diaphragm 264 may be 0.5mm-5mm beyond the edge of the piezoelectric sheet 266. That is, the length of the overhanging edge of the diaphragm 264 is 0.5mm-5mm.

For example, the overhanging edge length of the diaphragm 264 is 1mm, 1.5mm, 2mm, 2.5mm, 3mm, 3.5mm, 4mm, 4.5mm.

The greater the length of the overhanging edge, the less stiff the diaphragm 264. But the size of the diaphragm 264 is too large and can affect the size of the wireless headset 100. Thus, the length of the overhanging edge is set to 0.5mm-5mm.

In some embodiments, the material of the diaphragm 264 may include less rigid materials such as metals and alloys, polymers, carbon fibers, and the like.

The material of the diaphragm 264 is illustratively an isotropic material.

For example, the material of the diaphragm 264 may be magnesium-aluminum alloy, magnesium-lithium alloy, polyester resin, polyurethane, thermoplastic polyurethane elastomer rubber, carbon fiber, graphene, or the like.

Wherein, the shape of the diaphragm 264 may be a sheet shape, and the thickness of the diaphragm 264 may be less than 0.3mm when the material of the diaphragm 264 is selected to be a light metal alloy film.

Or, for example, the material of the diaphragm 264 is an anisotropic material.

For example, the material of the diaphragm 264 is a carbon fiber woven material.

By selecting the material of the diaphragm 264 as an anisotropic material, the resonance of the diaphragm 264 in different directions is different, and the resonance of the vibration system can be broken, so that the resonance complementation can be performed in different directions to balance the peak-valley difference of the frequency response.

Where the material of the diaphragm 264 is soft, the thickness of the diaphragm 264 may be increased or the length of the overhanging edge may be reduced as appropriate. When the material of the diaphragm 264 is harder, the thickness of the diaphragm 264 can be properly reduced, and the length of the overhanging edge can be increased. Various factors are taken into account in combination to improve the low frequency performance of the piezoelectric speaker 26'.

In some embodiments, the diaphragm 264 may be a single layer structure. In other embodiments, the diaphragm 264 may be a multi-layer structure. Regardless of the structure, the piezoelectric plate 266 needs to drive the diaphragm 264 to vibrate, so that the diaphragm 264 pushes air to sound.

In some embodiments, as shown in fig. 10A, a via is provided on the diaphragm 264.

The via holes can be holes with round or square shapes, or array holes.

Further, as shown in fig. 10A, the via hole on the diaphragm 264 may be a through hole. As shown in fig. 10B, the via holes in the diaphragm 264 may also be blind holes.

Through set up the via hole on vibrating diaphragm 264, can adjust the rigidity of vibrating diaphragm 264, and then be convenient for carry out compliance adjustment to vibrating diaphragm 264 to guarantee that the unit frequency response is good.

The cross-sectional area of the diaphragm 264 may be greater than the cross-sectional area of the piezoelectric plate 266, so as to ensure that the piezoelectric plate 266 can be fixedly attached to the diaphragm 264. In the case where the diaphragm 264 is provided with a through hole, correspondingly, the shape of the piezoelectric sheet 266 may be adjusted to be circular, elliptical, annular, racetrack-shaped, square or square, or the like, and the piezoelectric sheet 266 may cover the through hole in the diaphragm 264.

In other embodiments, as shown in fig. 10C, the diaphragm 264 includes a resilient portion, such as at the periphery of the piezoelectric sheet 266.

The elastic portion may be a spring, a spring sheet, an inner bellows bent toward the piezoelectric sheet 266, an outer bellows bent away from the piezoelectric sheet 266, or other elastic material, among others.

By making the diaphragm 264 include an elastic portion, the rigidity of the diaphragm 264 can be adjusted by the presence of the elastic portion, which vibrates along with the diaphragm 264, thereby adjusting the resonance characteristics of the system.

It should be emphasized that in this embodiment, the diaphragm 264 transmits sound directly into the ear canal of the user by vibration. Therefore, no hole is needed on the skin-friendly layer 30, and the sound output effect of the wireless earphone 100 is still good.

When the piezoelectric sheet 266 is operated, the processor 23 applies voltages to the upper and lower electrodes of the piezoelectric sheet 266, respectively, so that an electric field is generated inside the piezoelectric sheet 266, and the piezoelectric sheet 266 expands and contracts up and down and/or left and right under the action of the electric field. The relationship between the electric field E and the applied voltage V and the thickness d of the piezoelectric sheet 266 is: v/d=e. The larger the electric field, the larger the deformation of the piezoelectric sheet 266, thereby realizing sound emission of various decibels. The conventional piezoelectric sheet 266 has a single-layer structure with a certain thickness, and it is obtained through experiments that the vibration amplitude of the piezoelectric sheet 266 can meet the requirement under the condition that the voltage applied to the conventional piezoelectric sheet 266 is hundreds of volts, so that the sound (for example, 90 dB) emitted by the piezoelectric speaker 26' can be heard by the user. The working voltage of the existing wireless earphone is smaller, and the conventional wireless earphone is usually only a few volts to tens of volts. Therefore, the piezoelectric speaker cannot be applied to a wireless earphone.

Even if the thickness of the piezoelectric sheet 266 is thinned, the piezoelectric sheet 266 is provided in a laminated structure so that the voltage required for each layer of the piezoelectric sheet 266 is reduced to be suitable for a low operating voltage of the wireless headset 100. However, since the rigidity of the piezoelectric sheet 266 is relatively large, the resonance frequency (f ₀ ) Higher guideThe frequency band emitted by the piezoelectric speaker 26' is relatively narrow (low frequency sound is insufficient). The wireless headset 100 requires the piezoelectric speaker 26' to be capable of emitting sound in the full frequency band. Therefore, even if the piezoelectric sheet 266 is thinned, it is provided in a laminated structure and still cannot be applied to the wireless earphone 100.

In this embodiment, by providing the piezoelectric sheets 266 in a thin-layer laminated structure, the voltage required for each layer of piezoelectric sheet 266 is small, and the present embodiment can be applied to the operating voltage of the wireless headset 100. On the basis, the material of the diaphragm 264 is selected from metal, alloy, high polymer, carbon fiber and the like, or a thinning via hole is arranged on the diaphragm 264, or an elastic part is added on the diaphragm 264, so that the rigidity of the diaphragm 264 is smaller. In this way, the piezoelectric sheet 266 drives the vibrating diaphragm 264 to vibrate, and through adjusting the structure and the material of the vibrating diaphragm 264, the low-frequency performance of the piezoelectric speaker can be improved, the effect of emitting full-frequency band sound is achieved, and the audio application requirement of the wireless earphone 100 is met.

In this embodiment, piezoelectric sheets 266 stacked in place of the coils 262 and magnets 263 in the previous embodiment are used in comparison with the moving coil speaker in the previous embodiment. Since the piezoelectric sheet 266 itself is thin, the total thickness of the laminated multilayer piezoelectric sheet 266 is also thin (for example, 0.1mm to 1 mm). The total thickness of the coil 262 and the magnet 263 is at least about 2mm to 3 mm. Accordingly, by selecting the speaker in the wireless headset 100 as the piezoelectric speaker 26', the thickness of the wireless headset 100 can be reduced. Moreover, the piezoelectric speaker 26' need not have a rear cavity on its own, or only a portion of the rear cavity. Although it is necessary to reserve a vibration space (4 mm, for example, 0.5mm is required at maximum) of the piezoelectric sheet 266 between the piezoelectric sheet 266 and the power module 25 or the circuit board 21 in order to ensure the normal operation of the piezoelectric speaker 26'. However, the back volume typically requires several to tens of milliliters, and is converted to a thickness of several millimeters, for example 5-8mm, which has a significant impact on the thickness of the wireless headset 100. Therefore, the thickness required for vibration of the piezoelectric sheet 266 of this embodiment is significantly smaller than that required for the rear cavity, compared to the size of the rear cavity. Therefore, the wireless earphone 100 in the present embodiment can reduce the thickness of the wireless earphone 100.

The foregoing embodiment illustrates a wireless earphone 100 in which the diaphragm 264 in the piezoelectric speaker 26' and the second housing 12 in the housing 10 are distinct components.

In still other embodiments, the diaphragm 264 in the piezoelectric speaker 26' and the second shell 12 in the housing 10 are the same component.

As shown in fig. 11A, the piezoelectric speaker 26' includes a plurality of piezoelectric sheets 266 (which may also be referred to as laminated piezoelectric sheets) disposed in a laminated manner, and the plurality of piezoelectric sheets 266 are connected to the diaphragm 264 (the second case 12) for driving the diaphragm 264 (the second case 12) to vibrate, thereby causing the diaphragm 264 (the second case 12) to push air to sound.

In some embodiments, the material of the diaphragm 264 (second shell 12) may include metals and alloys, polymers, carbon fibers, and the like. Reference may be made, for example, to the description of the materials for the diaphragm 264 above.

However, it should be emphasized that when the diaphragm 264 is used as the second shell 12 of the housing 10, the material of the diaphragm 264 (the second shell 12) should not be too soft, and the structural strength requirement of the housing 10 should be ensured to ensure the reliability of the wireless earphone 100.

In other embodiments, as shown in fig. 11B, a via is provided in the diaphragm 264 (second housing 12).

The structure of the via hole in the diaphragm 264 (the second case 12) may be the same as that of the via hole in the diaphragm 264 described above, and reference is made to the above description.

For example, the vias on the diaphragm 264 (second housing 12) are blind holes. In this way, the rigidity of the diaphragm 264 (the second case 12) can be adjusted by providing the blind hole, and the sealing performance of the wireless earphone 100 can be ensured by not opening the diaphragm 264 (the second case 12).

In still other embodiments, as shown in fig. 11C, the diaphragm 264 (second shell 12) includes an elastic portion.

As an example, as shown in fig. 11C, the elastic portion is a part of the first surface a1 of the housing 10. The elastic portion may be, for example, located at the periphery of the piezoelectric sheet 266, and the elastic portion may be a spring, a spring sheet, a folded ring, or other elastic structure.

Alternatively, as illustrated in fig. 11D, the elastic portion is exemplified as a part of the side surface a3 of the housing 10. The elastic portion may be, for example, a soft gel, a spring, or other elastic structure.

By providing an elastic portion on the diaphragm 264 (the second case 12), the presence of the elastic portion can adjust the rigidity of the second case 12, and the elastic portion vibrates along with the diaphragm 264 (the second case 12), thereby adjusting the resonance characteristics of the system.

As shown in fig. 12A and 12B, with the wireless earphone 100 provided in this embodiment, after the wireless earphone 100 is placed in the ear canal, the housing 10 can be coupled with the ear canal of the user to form a sealed front cavity, and the sound can be directly sent to the external auditory canal. In this case, as is known from the above description of the operation principle of the piezoelectric speaker, the sound outlet hole 13 may not be provided on the diaphragm 264 (the second case 12).

In addition, since the front cavity of the piezoelectric speaker 26' is located outside the wireless headset 100. Thus, the interior of the housing 10 may act directly as a rear cavity for the piezoelectric speaker 26'. If necessary (for example, when the rear cavity is not sufficiently sized), the first case 11 may be provided with a vent hole so that the inside of the case 10 communicates with the side of the wireless earphone 100 away from the ear canal, and the side of the wireless earphone 100 away from the ear canal (the external space of the ear canal) may be a part of the case 10. In this way, the interior of the housing 10 only needs to satisfy the placement space of the earphone assembly 20, and the space required by the rear cavity is not required to be considered. Alternatively, it is understood that the piezoelectric speaker 26' in this embodiment does not require front and rear chambers.

The wireless earphone 100 of the present embodiment includes a piezoelectric speaker 26 'as the speaker 26, and the second shell 12 in the housing 10 directly serves as a diaphragm of the piezoelectric speaker 26'. In this way, after the wireless earphone 100 provided in the embodiment of the present application is placed in the ear canal of the user, the ear canal of the user is directly used as the front cavity of the piezoelectric speaker 26 ', and the piezoelectric speaker 26' does not need to have a front cavity, and also does not need to use the internal space of the housing 10 as the front cavity. Moreover, the piezoelectric speaker 26' need not have a rear cavity on its own, or only a portion of the rear cavity. Although it is necessary to reserve a vibration space (4 mm, for example, 0.5mm is required at maximum) of the piezoelectric sheet 266 between the piezoelectric sheet 266 and the power module 25 or the circuit board 21 in order to ensure the normal operation of the piezoelectric speaker 26'. However, the back volume typically requires several to tens of milliliters, and is converted to a thickness of several millimeters, for example 5-8mm, which has a significant impact on the thickness of the wireless headset 100. Therefore, the thickness required for vibration of the piezoelectric sheet 266 of this embodiment is significantly smaller than that required for the rear cavity, compared to the size of the rear cavity. Therefore, the wireless earphone 100 in the present embodiment can reduce the thickness of the wireless earphone 100. Therefore, the thickness of the wireless earphone 100 can be reduced, and the wireless earphone 100 can be further thinned.

Furthermore, in the present embodiment, by using the diaphragm 264 of the piezoelectric speaker 26' directly as the second casing 12 of the wireless headset 100, it is not necessary to separately provide the second casing 12. The influence of the thickness of the second housing 12 itself on the thickness of the wireless earphone 100 can be eliminated, and the thickness of the wireless earphone 100 can be further reduced.

In this case, the skin-friendly layer 30 directly covers at least a portion of the diaphragm 264. And no holes may be provided in the skin-friendly layer 30.

To facilitate the portability and the charging of the wireless headset 100 described above. The embodiment of the application also provides a shell, which is matched with the wireless earphone 100 for use, and has the functions of storage and charging of the wireless earphone 100. In addition, the case is also used as a protective case or a rear case of the electronic device.

With respect to the structure of the case, as shown in fig. 13A and 13B, the case 200 includes a case body 210, and the case body 210 has an outer surface B, which is a surface facing away from the display screen of the electronic device when the electronic device is used in cooperation.

The outer surface b has a receiving groove 220, and the receiving groove 220 is configured to detachably receive the wireless earphone 100.

The wireless earphone 100 provided in the embodiment of the present application may be used in pairs, and may be used as a left ear earphone and a right ear earphone, respectively. The left ear earphone can be matched with the left ear of a user for use, and the right ear earphone can be matched with the right ear of the user for use. The wireless headset 100 may also be used as a left ear headset and a right ear headset separately.

In this case, the number of the housing grooves 220 provided in the housing body 210 is determined according to the number of the wireless headphones 100, and in the case where the wireless headphones 100 are single-ear headphones, as shown in fig. 13B, only one housing groove 220 may be provided in the housing body 210. When the wireless earphone 100 is an earphone used with left and right ears, as shown in fig. 13A, the housing body 210 may include two receiving grooves 220.

The setting position of the storage slot 220 on the housing body 210 is not limited, and the storage slot can be reasonably set according to needs.

As shown in fig. 14, after the wireless earphone 100 is placed in the receiving slot 220, the wireless earphone may be fixedly connected to the receiving slot 220.

Regarding the manner in which the receiving slot 220 is fixedly coupled to the wireless headset 100, in some embodiments, the receiving slot 220 is magnetically coupled to the wireless headset 100.

For example, a magnet is provided on the outer surface or the inner surface of the housing 10 of the wireless earphone 100, a magnet is also provided on the surface of the receiving groove 220, and the wireless earphone 100 is magnetically attracted in the receiving groove 220.

In other embodiments, the receiving slot 220 is snap-fit with the wireless headset 100.

For example, a first connection portion (e.g., a protrusion) is provided on the housing 10 of the wireless earphone 100, and a second connection portion (e.g., a clamping slot) is provided on the receiving slot 220, so that the wireless earphone 100 is clamped in the receiving slot 220.

Of course, the receiving slot 220 and the wireless earphone 100 may be fixedly connected in other manners, which is not limited in the embodiment of the present application.

The depth of the receiving slot 220 may be greater than, less than, or equal to the thickness of the wireless earphone 100, which is not limited in the embodiment of the present application.

In some embodiments, the surface of the receiving slot 220 has a housing charging terminal for contact connection with the earphone charging terminal of the wireless earphone 100.

That is, the housing 200 has a housing charging terminal and an ability to transmit power, and has an ability to transfer power to the earphone charging terminal to perform wired charging for the wireless earphone 100. The wireless earphone 100 does not need a separate charging box and a charging wire matched with the charging box, and is convenient for users to use.

The type of the shell charging terminal can be changed according to actual requirements. For example, the housing charging terminal may be a spring pin (pogo pin), a spring plate, a conductive block, a conductive patch, a conductive sheet, a pin, a plug, a contact pad, a jack, or a socket, and the specific type of the housing charging terminal is not limited in the embodiments of the present application. The position of the case charging terminal in the storage groove 220 is not limited, and the case charging terminal may be located at the bottom of the storage groove 220, or may be located at the wall of the storage groove 220, and may be matched with the position of the earphone charging terminal in the wireless earphone 100.

The earphone charging terminal and the shell charging terminal can be electrically connected in a plurality of modes such as surface contact, direct insertion connection, threaded connection, bayonet connection and the like.

In addition, the earphone charging terminal and the casing charging terminal are used for electrical connection, and may be made of various conductive materials, for example, metals such as copper, and the specific materials are not limited in the embodiment of the present application.

In some embodiments, the earphone charging terminal and the housing charging terminal may be made of an alloy to improve oxidation resistance. For example, in some versions, it may be made of copper, nickel, and silver alloys. In other embodiments, the alloy may be made of phosphor and bronze alloys. In other versions, different alloys may be used.

In other embodiments, the outer surfaces of the earphone charging terminal and the housing charging terminal may be plated with an anti-corrosion metal (e.g., gold, silver, etc.) to increase the anti-corrosion strength.

The above-mentioned housing 200 may be used in combination with an electronic device, and based on this, the embodiment of the present application provides an electronic device, which may be a mobile phone, a screen computer, a phone watch, or the like.

Taking an electronic device as a mobile phone, as shown in fig. 15, the electronic device 300 mainly includes: a front case 310, a display module 320, a middle frame 330, and a rear case (which may also be referred to as a battery cover) 340.

The display module 320 has a light-emitting side from which a display screen can be seen and a back surface disposed opposite to the light-emitting side.

The front case 310 is located on the light emitting side of the display module 320, and is used for protecting the display module 320. The front case 310 may be, for example, front Case Glass (CG), which may have a certain toughness.

The display module 320 includes a Display (DP).

In some embodiments of the present application, the display screen may be a Liquid Crystal Display (LCD) screen. In this case, the display module 320 further includes a backlight module (BLU) for providing a light source to the lcd.

In other embodiments of the present application, the display screen is an organic light emitting diode (organic light emitting diode, OLED) display screen, in which case a backlight module is not required.

The middle frame 330 is located between the display module 320 and the rear case 340. The surface of the middle frame 330 far from the display module 320 is used for installing internal components such as a battery, a motherboard, a camera, an antenna, and the like.

The rear case 340 is mounted on the middle frame 330, and the rear case 340 can protect the internal components of the electronic device 300. The rear case 340 has opposite inner and outer surfaces c1 and c2. The inner surface c1 of the rear case 340 faces the display module 320, and the outer surface c2 of the rear case 340 faces away from the display module 320.

In some embodiments, the housing 200 is used as the rear case 340 of the electronic device 300, and the outer surface b of the housing 200 is the outer surface c2 of the rear case 340.

In other embodiments, the housing 200 is used as a protective shell of the electronic device 300 and is sleeved on the rear shell 340.

The electronic device 300 may include a wireless charging transmitting coil, for example, for cooperating with a wireless charging receiving coil in the wireless earphone 100 to wirelessly charge the wireless earphone 100.

It is understood that the installation position of the receiving slot 220 should not affect the installation of the rear camera of the electronic device 300.

The wireless earphone 100 provided by the embodiment of the application is small in size, can be directly attached to the back of the shell 200, does not need a separate storage box, and is convenient to carry. In addition, the wireless earphone 100 may perform wireless charging through the electronic device 300, or perform wired charging through the electronic device 300 (or the housing 200), without a separate charging box and a charging wire matched with the charging box, so that charging is convenient.

The foregoing is merely a specific embodiment of the present application, but the protection scope of the present application is not limited thereto, and any changes or substitutions within the technical scope of the present disclosure should be covered in the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A wireless headset, comprising:

a first housing having a recess;

a piezoelectric speaker; the piezoelectric loudspeaker comprises a vibrating diaphragm and a plurality of layers of piezoelectric sheets which are arranged in a stacked manner, and the plurality of layers of piezoelectric sheets are connected with the vibrating diaphragm; the multilayer piezoelectric sheet is positioned in the groove; a cavity formed by connecting the vibrating diaphragm and the first shell is used as at least part of a rear cavity of the piezoelectric loudspeaker;

the circuit board and the power module are arranged in the groove and are positioned on one side, away from the vibrating diaphragm, of the multilayer piezoelectric sheet.

2. The wireless headset of claim 1, wherein the diaphragm acts as a second shell of the wireless headset, and is coupled to the first shell in apposition to form a housing of the wireless headset.

3. The wireless headset of claim 1, further comprising a second shell, the second shell being joined to the first shell to form a housing for the wireless headset;

the vibrating diaphragm is connected with the second shell to form a front cavity of the piezoelectric loudspeaker; the diaphragm is connected with the first shell through the second shell.

4. The wireless headset of claim 1, wherein the first housing includes a vent hole in communication with the chamber.

5. The wireless headset of claim 1, wherein a distance between one of the circuit board and the power module proximate the multilayer piezoelectric sheet and the multilayer piezoelectric sheet is less than or equal to 4mm.

6. The wireless headset of any one of claims 1-5, wherein the circuit board has a receiving hole, at least a portion of the power module being located within the receiving hole.

7. The wireless headset of any one of claims 1-5, wherein the piezoelectric patch has a width of 5mm to 18mm.

8. A wireless headset according to claim 2 or 3, wherein the housing has a width of 8mm to 20mm.

9. A wireless headset as claimed in claim 2 or 3, wherein the housing is flat.

10. A wireless headset according to claim 2 or 3, wherein the wireless headset further comprises a skin friendly layer;

the skin-friendly layer covers at least a portion of a surface of the housing proximate the piezoelectric speaker.

11. The wireless headset of any one of claims 1-5, wherein,

the power module comprises an earphone charging terminal and a battery, wherein the earphone charging terminal is coupled with the battery; the earphone charging terminal is exposed out of the first shell;

And/or the number of the groups of groups,

the power module comprises a wireless charging receiving coil and a battery, wherein the wireless charging receiving coil is used for charging the battery.

12. The wireless headset of any one of claims 1-5, further comprising a processor, a memory, and a wireless communication module integrated on the circuit board;

the memory is coupled with the processor; the processor is coupled with the power module, the wireless communication module and the piezoelectric speaker; the wireless communication module is coupled with the power module.

13. The wireless headset of any one of claims 1-5, further comprising: and the microphone is arranged on the circuit board and is coupled with the power supply module.

14. A housing, comprising: a housing body having an outer surface;

the outer surface has a receiving slot for receiving the wireless headset of any of claims 1-13 in a detachable connection.

15. The housing of claim 14, wherein the receiving slot is magnetically connected and/or snap-fit with the wireless headset.

16. The housing of claim 14, wherein a surface of the receiving slot has a housing charging terminal for contact connection with a headset charging terminal of the wireless headset.

17. The housing according to any one of claims 14-16, wherein the housing is an electronic device back shell or an electronic device protective shell.

18. An electronic device comprising a display screen and the housing of any one of claims 14-16, the housing being positioned on a backlight side of the display screen, an outer surface of the housing facing away from the display screen.