CN115580801A

CN115580801A - Earphone and earphone box assembly

Info

Publication number: CN115580801A
Application number: CN202110689723.7A
Authority: CN
Inventors: 朱银虎; 许超; 张洵; 鹿麟
Original assignee: Huawei Technologies Co Ltd
Current assignee: Huawei Technologies Co Ltd
Priority date: 2021-06-21
Filing date: 2021-06-21
Publication date: 2023-01-06

Abstract

The application provides an earphone and earphone box subassembly, the earphone includes: an earphone body (10), the earphone body (10) having an opening (10 a); go out sound mouth (20), go out sound mouth (20) connect in on opening (10 a), go out sound mouth (20) including play sound pipe (21), be provided with first speaker (40) in going out sound pipe (21), go out sound mouth (20) be used for with at least one speaker that sets up in earphone main part (10) with the sound conduction of first speaker (40) is to the user's ear canal. This application is through setting up the speaker in the play sound pipe of earphone for the earphone can have more speakers, and then makes the earphone have better noise reduction effect and sound quality effect.

Description

Earphone and earphone box assembly

Technical Field

The application relates to the technical field of electronic equipment, in particular to an earphone and an earphone box assembly.

Background

With the advancement of wireless bluetooth technology, especially the wide application of bluetooth 5.0 technology, true Wireless Stereo (TWS) headset products are increasingly entering people's lives. The TWS earphone is popular with consumers due to the advantages of being wireless, small in size, convenient to carry, good in tone quality effect and the like. With the continuous breakthrough of electronic product technology and the fast-paced change of living environment, the functional requirements of people on the TWS headset are also continuously enhanced, wherein the most prominent requirements are two aspects of noise reduction and sound quality.

The current TWS headset usually has an active noise reduction function, which requires a microphone of the headset to pick up ambient noise, and controls a speaker inside the headset to output a reverse sound wave equal to the ambient noise through an active noise reduction chip, thereby neutralizing the noise and achieving a noise reduction effect. The more the number of the loudspeakers of the earphone is, the easier the more matched reverse sound wave is output, and the noise reduction effect is more obvious. Simultaneously, also can make the tone quality effect of earphone better.

However, for a good experience of wearing, the volume of the TWS headset (e.g. in-ear headset) is constrained by the size of human ear, and is limited by the stacked architecture inside the headset, and the current TWS headset cannot be provided with a larger number of speakers inside, so that the noise reduction effect and the sound quality effect of the headset cannot be further improved.

Disclosure of Invention

The application provides an earphone and earphone box subassembly through setting up the speaker in the play sound pipe of earphone for the earphone can have more speakers, and then makes the earphone have better noise reduction and tone quality effect.

In a first aspect, a headset is provided, comprising: an earphone body having an opening; go out the sound mouth, go out the sound mouth connect in on the opening, go out the sound mouth including a sound pipe, go out the intraductal first speaker that is provided with of sound, go out the sound mouth be used for with at least one speaker that sets up in the earphone main part with the sound conduction of first speaker is to the user's duct.

The earphone body of the earphone provided by the embodiment of the application is internally provided with at least one loudspeaker, and the sound outlet pipe is internally provided with a first loudspeaker, so that the first loudspeaker cannot occupy the inner space of the earphone body, and the earphone provided by the embodiment of the application has more loudspeakers than the earphone in the prior art. The earphone provided by the embodiment of the application realizes the stacking design of a plurality of loudspeakers in a limited space, so that each loudspeaker can exert respective advantages, and better audio effect experience and noise reduction effect experience are realized by combination.

The first speaker in the embodiment of the present application is disposed inside the sound outlet tube, and the sound outlet nozzle is configured to conduct sound of the at least one speaker disposed in the earphone body and the first speaker to the ear canal of the user, and the arrangement of the first speaker does not affect the sound conduction effect and the wearing comfort of the user. And the arrangement of a plurality of loudspeakers makes the earphone that this application embodiment provided have better noise reduction effect and sound quality effect, has improved user's use and has experienced.

In a possible design, the sound outlet nozzle further comprises a sound outlet hole plate fixedly arranged at the front end part of the sound outlet pipe and used for limiting the first loudspeaker.

Go out the sound orifice plate and can fix the closing cap on the front end portion of going out the sound pipe for go out the sound pipe and go out sound orifice plate whole and form "cap form" structure, go out the sound orifice plate and can play limiting displacement to first speaker, prevent that the front end of first speaker from wearing out to the outside of going out the sound pipe, for example the front end of first speaker (the one end that has out the sound hole promptly) can the butt on the internal surface of going out the sound orifice plate, go out and seted up a plurality of through-holes on the sound orifice plate, thereby can not obstruct the propagation of sound.

In a possible design, the sound outlet nozzle further comprises a hollow support which is fixedly arranged at the rear end part of the sound outlet pipe and limits the first loudspeaker. The hollow support can be spacing to first speaker, prevents that it from coming off from the rear end portion of sound pipe, and this hollow support has fretwork portion (for example through-hole or opening), and then makes can not cause too much hindrance to the conduction of sound when playing limiting displacement.

In a possible design, the earphone further includes an earplug sleeved on the periphery of the sound outlet pipe, and a front end of the earplug is provided with a sound outlet.

The earplugs are constructed of an elastomeric material, for example, the earplugs are constructed of a soft gel, such as silicone. The front end of the earplug facing the user is provided with a sound outlet through which sound emitted by the sound outlet tube is transmitted into the ear canal of the user. This application can be with more firm wearing of earphone on user's ear through setting up the earplug to the earplug can seal the duct, reduces the interference of external noise to the sound of play sound pipe output.

In one possible design, the earplug and the sound outlet tube have a sound guiding gap therebetween, and the sound guiding gap communicates the opening and the sound outlet.

This application can increase the speaker quantity of earphone through setting up first speaker in a sound pipe, and the setting of first speaker probably causes certain hindrance to the sound conduction of the second speaker in the earphone main part and third speaker, and this application embodiment can strengthen the sound conduction effect through setting up the leading sound clearance of intercommunication opening and sound outlet.

In a possible design, along the direction from back to front of the sound outlet pipe, the pipe diameter of the sound outlet pipe is gradually reduced, and the hollow support is covered on the inner side of the back end part of the sound outlet pipe.

At the moment, the sound outlet pipe and the sound outlet hole plate are integrally in a frustum shape, the sectional area of the rear end part is larger than the area of the sound outlet hole plate, the first loudspeaker can be conveniently installed and inserted through the arrangement, and the hollow support sealing cover can be fixed to the first loudspeaker after the inner side of the rear end part of the sound outlet pipe. Moreover, the sound outlet pipe adopts a cone-shaped design, the hole is formed in the inclined plane (pipe wall) to meet the requirement of sound outlet area, and the cone-shaped sound outlet pipe is placed in the earplug in the middle without influencing the wearing comfort.

Optionally, the hollow bracket may be mounted on the sound outlet pipe by any means such as welding, bonding, screwing, clamping, riveting, or the like.

For example, the whole sound outlet nozzle is made of metal (that is, the hollow bracket is also made of metal), and the hollow bracket can be mounted by welding or riveting.

In a possible design, the sound outlet pipe is provided with a plurality of through holes, and the through holes are communicated with the sound guide gaps and the openings.

In a possible design, the pipe diameter of the sound outlet pipe is kept unchanged along the direction from back to front of the sound outlet pipe, and the hollow support covers the rear end part of the sound outlet pipe and exceeds the rear end part of the sound outlet pipe.

At the moment, the whole sound outlet pipe is of a columnar structure, the sectional area of the sound outlet pipe is smaller than that of the hollow support, and the rear end part of the sound outlet pipe is installed on the hollow support. The hollow support is covered on the rear end part of the sound outlet pipe and exceeds the rear end part of the sound outlet pipe, so that the sound outlet nozzle can be conveniently and integrally installed on the earphone main body.

In one possible design, the hollow part of the hollow bracket communicates the sound guide gap with the opening.

In one possible design, the mouthpiece is mounted over the opening. Through the arrangement, the first loudspeaker can be installed in the sound outlet nozzle to form an integral structure, and then the first loudspeaker is integrally installed on the opening (namely the earphone main body), so that the installation difficulty of the first loudspeaker can be reduced, and the production efficiency can be improved.

In a possible design, the sound outlet tube, the first speaker and the hollow bracket are assembled into an integral structure and then installed on the opening.

In one possible design, the mouthpiece is a metal piece.

Considering the installation difficulty of the first loudspeaker, the sound outlet pipe can be made of materials with relatively stable performance (high strength) such as metal, and the like, so that the pipe wall of the sound outlet pipe can be arranged as thin as possible, the internal space of the sound outlet pipe is increased, and a sufficient space is provided for the installation of the first loudspeaker.

Alternatively, the metal member may be a stainless steel member, a copper alloy member, an aluminum alloy member, or the like, but is not limited thereto.

In one possible design, the sound outlet pipe and the sound outlet hole plate are made into an integral structure by an integral forming process. Therefore, the obtained sound mouth has higher mechanical strength, the production process can be simplified, and the production cost is saved.

For example, the integral forming process may be metal direct forming, such as may be achieved by forging, stamping, or casting processes.

For another example, the integral structure may be formed by a powder metallurgy process using metal powder.

In one possible design, the first speaker is any one of a moving-iron type speaker, a flat-magnetic type speaker, or a mems type speaker.

In one possible design, a second speaker and a third speaker are provided within the earphone body, the second speaker being adjacent to the opening, the third speaker being located in a middle portion of the earphone body.

The earphone that this application embodiment provided realizes the design of piling up of 3 at least speakers in limited space, with the earphone that has one or two speakers among the prior art, the earphone that this application embodiment provided can carry out the frequency division design to a plurality of speakers for each speaker homoenergetic shows better audio frequency ability, and then makes the earphone have better noise reduction effect and sound quality effect, can promote user's use and experience.

In one possible design, the second speaker is a moving coil speaker.

In one possible design, the third speaker is any one of a moving-iron type speaker, a flat-magnetic type speaker, or a mems type speaker.

In one possible design, the operating frequency bands of the first speaker, the second speaker, and the third speaker are different. Through the arrangement, the three loudspeakers can exert respective audio advantages, and better audio effect experience and noise reduction experience are achieved through combination.

Here, the operating frequency bands of the first speaker, the second speaker and the third speaker may or may not overlap, and the application does not limit this.

Optionally, the three speakers include a woofer, a midrange speaker and a tweeter.

Here, the low frequency speaker gives sound at low frequencies without compromising the sound quality in other frequency bands (e.g., middle and high frequencies). Mid-range speakers produce sound at mid-range frequencies without compromising sound quality in other frequency bands (e.g., low and high frequencies). The tweeters produce sound at high frequencies without compromising the sound quality in other frequency bands (e.g., low and mid-frequencies).

For example, the first speaker may be a mid-range speaker, the sound generation is dominant at mid-range, and the sound generation frequency is between 1000Hz and 4000Hz. The second loudspeaker is a high-frequency loudspeaker, the sounding advantage is high frequency, and the sounding frequency is 4000-20000 Hz. The third loudspeaker is a low-frequency loudspeaker, the generation advantage is low frequency, and the sound production frequency is 200-1000 Hz. The three loudspeakers are combined to respectively exert respective audio advantages, so that the audio effect and the noise reduction effect are better.

In one possible design, a microphone is also provided within the earphone body adjacent to the opening.

The sound pick-up hole of the microphone faces to the opening, the microphone is equivalent to a feedback microphone in an FB microphone noise reduction system, the microphone is used for picking up sound in an ear canal of a user and transmitting a sound signal to a noise reduction chip in the earphone body, and the noise reduction chip controls at least one of the first loudspeaker, the second loudspeaker and the third loudspeaker to output an opposite-phase sound wave equal to ambient noise according to the sound signal, so that the noise is neutralized, and the noise reduction effect is realized.

Optionally, the earphone provided in the embodiment of the present application further includes a feedforward microphone, and the feedforward microphone is configured to pick up external environmental sounds and transmit sound signals to the noise reduction chip inside the earphone main body, so that the earphone provided in the embodiment of the present application has a function of hybrid noise reduction, and the noise reduction effect is better.

In one possible design, the sound outlet nozzle is mounted over the opening by an ultrasonic welding process.

In one possible design, the headset is a true wireless stereo headset.

In a second aspect, an earphone box assembly is provided, which includes an earphone box and the earphone provided in any one of the possible designs of the first aspect, wherein the earphone box is configured to accommodate the earphone and charge the earphone.

Drawings

Fig. 1 is a schematic overall structure diagram of an example of an earphone according to an embodiment of the present application.

Fig. 2 is a schematic view of the whole structure of the earphone provided by the embodiment of the present application after the earplugs are removed.

Fig. 3 is a cross-sectional view from the AA in fig. 1.

Fig. 4 is a cross-sectional view from the view point BB in fig. 2.

Fig. 5 is a schematic structural view showing an example of a structure in which the mouthpiece and the first speaker are integrally formed.

Fig. 6 is a schematic structural view of another example of the structure in which the mouthpiece and the first speaker are integrally formed.

Fig. 7 is a cross-sectional view of another example of the earphone according to the embodiment of the present application.

Fig. 8 is a schematic structural view of another example of a structure in which the mouthpiece and the first speaker are integrally formed.

Fig. 9 is a schematic structural view of another example of a structure in which the mouthpiece and the first speaker are integrally formed.

Reference numerals: 10. an earphone main body; 10a, an opening; 11. ear bags; 12. an ear stem; 13. a second speaker; 14. a third speaker; 15. a microphone; 16. a storage battery; 20. a sound outlet mouth; 21. a sound outlet pipe; 22. hollowing out the bracket; 23. a sound outlet hole plate; 30. an earplug; 30a, a sound outlet; 30b, leading sound clearance; 40. a first speaker.

Detailed Description

Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative and are only for the purpose of explaining the present application and are not to be construed as limiting the present application.

In the description of the present application, it is to be understood that the terms "first", "second" and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or as implying any indication of the number of technical features indicated. Thus, features defined as "first", "second", and "third" may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted" and "connected" are to be interpreted broadly, e.g., as being either fixedly connected, detachably connected, or integrally connected; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In the description of the present application, it is to be understood that the terms "upper", "lower", "side", "front", "back", "inner", "outer", and the like indicate orientations or positional relationships based on installation, and are only for convenience in describing the present application and simplifying the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed in a particular orientation, and operate, and thus should not be construed as limiting the present application.

In the description of the present application, it should be noted that the term "and/or" is only one kind of association relationship describing an associated object, and means that three relationships may exist, for example, a and/or B may mean: a exists alone, A and B exist simultaneously, and B exists alone.

It should be noted that the same reference numerals are used to denote the same components or parts in the embodiments of the present application, and for the same parts in the embodiments of the present application, only one of the parts or parts may be given the reference numeral, and it should be understood that the reference numerals are also applicable to the other same parts or parts.

With the continuous progress of technology, consumer electronics are rapidly developed, and especially TWS earphones are popular with consumers. The TWS headset completely eliminates the wire connection method, including separate left and right headsets (master and slave). The left earphone and the right earphone of the TWS earphone can form a stereo system through wireless connection, and the listening experience of a user is greatly improved. In addition, almost all TWS headphones are equipped with a charging headphone case having both charging and housing functions due to the property that the left and right headphones of the TWS headphones have no physical connection. The charging earphone box can provide power for the wireless earphone and has the storage function, and when the earphone is not used, the charging box charges the earphone as long as the earphone is placed into the charging box.

The TWS earphone is popular with consumers due to the advantages of being wireless, small in size, convenient to carry, good in tone quality effect and the like. With the continuous breakthrough of electronic product technology and the fast-paced change of living environment, the functional requirements of people on the TWS headset are also continuously enhanced, wherein the most prominent requirements are two aspects of noise reduction and sound quality.

The current TWS headset usually has an active noise reduction function, which requires a microphone of the headset to pick up ambient noise, and controls a speaker inside the headset to output a reverse sound wave equal to the ambient noise through an active noise reduction chip, thereby neutralizing the noise and achieving a noise reduction effect.

Active noise reduction is classified into single Feed Forward (FF) microphone noise reduction, single Feedback (FB) microphone noise reduction, and hybrid noise reduction (FF + FB). The noise-reducing microphone of the FF microphone is placed against the ear (i.e., behind the speaker) to pick up ambient sound from the outside. The FB microphone is placed close to the sound outlet (i.e. in front of the loudspeaker) for picking up sound in the ear canal. The FB microphone noise reduction mode has clean noise processing but low processing speed; the FF microphone noise reduction mode is fast in noise processing but difficult to process cleanly, and the hybrid noise reduction mode combines the advantages of the FF microphone noise reduction mode and the hybrid noise reduction mode. Currently, with the advancement of technology, hybrid noise reduction by FF and FB microphones has become a standard for high-end TWS headsets.

The more the number of the loudspeakers of the earphone is, the higher audio frequency dividing capability (each microphone can play different frequency ranges) can be realized, the easier the more matched inverse sound wave can be output, and the more obvious the noise reduction effect is. That is, the noise reduction capability of the earphone is limited by the capability of the speaker, and the noise reduction effect is limited by the capability of the speaker because noise reduction requires the speaker to emit a sound opposite to the external noise to cancel the external noise. The more the number of the speakers of the earphone is, the stronger the capability of emitting sounds of different frequency bands is, and the stronger the noise reduction effect is.

In addition, the pursuit of users for the sound quality of TWS earphones is increasing day by day, and the adoption of a plurality of speakers to improve the sound quality has become one of the most important effective means generally accepted and adopted in the industry. A plurality of loudspeakers are utilized to carry out frequency division design, and each loudspeaker respectively bears a part of frequency bands according to own advantages, so that the advantages of the loudspeakers are exerted to the maximum, and the tone quality effect of the whole product is better.

For the in-ear earphone, for good experience of wearing, the volume of the earphone is constrained by the size of human ears, and more loudspeakers cannot be arranged in the current TWS earphone, so that the noise reduction effect and the sound quality effect of the earphone cannot be further improved.

An in-ear earphone, also known as an ear canal earphone, an in-ear earplug, or an in-ear monitor (IEM), is an earphone used inside the human auditory organs, and generally comprises an earphone body, a sound outlet tube (also known as an in-ear tube), and an earplug (also known as an earmuff). Wherein, earphone body and income ear pipe fixed connection, the earplug cup joints on going out the sound pipe, and the user can be with the inner wall of earplug laminating user's duct when using the pleasant formula earphone. Therefore, a closed cavity can be formed in front of the in-ear earphone, the inner wall of the auditory canal and the eardrum, so that better tightness is obtained, and the interference of external noise on the sound output by the sound outlet pipe is reduced.

In conclusion, the noise reduction effect and the sound quality effect of the TWS earphone can be improved by arranging a plurality of loudspeakers in the TWS earphone. However, the volume of the headset is constrained by the size of human ears, and is limited by the stacking structure inside the headset, so that the current TWS headset cannot be provided with a larger number of speakers, and how to put more speakers into the TWS headset with the limited volume becomes a design difficulty and a bottleneck of a high-end TWS headset, thereby preventing the noise reduction effect and the sound quality effect of the TWS headset from being further improved.

In order to solve the above problem, the embodiment of the application provides an earphone and an earphone box assembly, and a loudspeaker is arranged in a sound outlet pipe of the earphone, so that the earphone can have more loudspeakers, and further the earphone has better noise reduction effect and sound quality effect.

In a first aspect, an embodiment of the present application first provides an earphone 100, and fig. 1 is a schematic overall structural diagram of the earphone 100 provided in the embodiment of the present application. Fig. 2 is a schematic view of the whole structure of the earphone 100 provided by the embodiment of the present application with the earplugs removed. Fig. 3 is a cross-sectional view from the AA in fig. 1. Fig. 4 is a cross-sectional view from the view point BB in fig. 2.

As shown in fig. 1-4, the headset 100 provided in the embodiment of the present application is a wireless headset, which may be, for example, the TWS headset described above. The headset 100 may be stowed in a headset case that may also be used to charge the headset 100. The earphone 100 is an in-ear type earphone and includes an earphone body 10 and a mouthpiece 20 connected to each other.

The earphone body 10 is a main body part of the earphone 100, the earphone body 10 includes an ear bag 11 and an ear rod 12 which are fixedly connected with each other, and the shape of the ear bag 11 is matched with that of a cochlea of a user, so that the earphone 100 can be better worn on the ear of the user. Various functional components are arranged inside the earphone body 10 (for example, inside the shell of the ear bag 11 or the ear rod 12), so that the earphone 100 provided by the embodiment of the present application has rich functions and meets the use requirements of users.

For example, the headset body 10 may be provided with a memory, a processor, a wireless communication module, a speaker, a microphone, a storage battery 16, various sensors, and the like, and the processor may include one or more interfaces for electrically connecting with other components of the headset 100.

The memory may be used to store program code, such as program code for charging the headset 100, wirelessly pairing the headset 100 with another electronic device, or wirelessly communicating the headset 100 with an electronic device (e.g., a cell phone).

The processor may be configured to execute the application codes and call the relevant modules to implement the functions of the headset 100 in the embodiment of the present application. For example, a charging function, a wireless communication function, an audio data playing function, and the like of the headset 100 are realized. The processor may include one or more processing units, and the different processing units may be separate devices or may be integrated in one or more processors. The processor may specifically be an integrated control chip, or may be composed of a circuit including various active and/or passive components, and the circuit is configured to perform the functions attributed to the processor described in the embodiments of the present application.

The wireless communication module is used for supporting data exchange of wireless communication between the headset 100 and other electronic devices or headset boxes, including Bluetooth (BT), global Navigation Satellite System (GNSS), wireless Local Area Network (WLAN), wireless fidelity (Wi-Fi) network, frequency Modulation (FM), near Field Communication (NFC), infrared (IR), and the like. In some embodiments, the wireless communication module may be a bluetooth chip. The headset 100 can be paired with bluetooth chips of other electronic devices through the bluetooth chip and establish a wireless connection, so as to implement wireless communication between the headset 100 and the other electronic devices through the wireless connection.

At least one speaker, such as a second speaker 13 and a third speaker 14, may also be included within the headphone body 10.

A loudspeaker, also known as a horn or an audio unit, is a commonly used electro-acoustic transducer device. The main working principle of the loudspeaker is that an electrified element is utilized to drive a vibrating diaphragm to generate mechanical vibration and push surrounding air, so that an air medium generates fluctuation, and the conversion of electricity, force and sound is realized.

Alternatively, the speaker in the embodiment of the present application may be any one of a moving-coil speaker (or dynamic speaker), a moving-iron speaker, a ring-iron hybrid speaker, an electromagnetic speaker, an inductive speaker, an electrostatic speaker, a planar speaker, a ribbon speaker, a flat-magnetic speaker, and a Micro Electro Mechanical System (MEMS) speaker.

At least one microphone, such as microphone 15, may also be included within the headset body 10.

A microphone, which may also be generally referred to as a sound pickup, a microphone head, a microphone core, etc., is an energy conversion device that converts a sound signal into an electrical signal, and is a device that functions exactly opposite to a speaker.

Depending on the principle of transduction of the microphone, the microphone (e.g., the microphone 15) in the embodiment of the present invention may be an electrodynamic (moving coil type, aluminum ribbon type) microphone, a condenser microphone, a piezoelectric (crystal type, ceramic type) microphone, an electromagnetic type microphone, a semiconductor type microphone, or the like, and may be any type of a cardioid type microphone, an acute heart type microphone, a hyper heart type microphone, a bidirectional (8-shaped) microphone, a non-directional (omnidirectional) type microphone, a MEMS type microphone, or the like.

The storage battery 16 is used to store electric energy charged from the outside (e.g., an earphone box) and supply power to other power consuming modules (e.g., speakers) to drive them to operate. Alternatively, the battery 16 may be any one of a nickel cadmium battery, a lithium battery, and the like.

The earphone 100 provided by the embodiment of the application further comprises various sensors.

For example, the headset 100 further includes a distance sensor or a proximity light sensor for determining whether the headset 100 is worn by a user, a touch sensor for detecting a touch operation of the user, a fingerprint sensor for detecting a fingerprint of the user to identify an identity of the user, a heart rate sensor for detecting a heart rate of the user, a body temperature sensor for detecting a body temperature of the user, an acceleration sensor or a gyroscope for detecting a motion state of the user, and the like, which is not limited in this application.

The earphone 100 provided by the embodiment of the application has better noise reduction effect and sound quality effect, and can improve the use experience of a user. How the earphone 100 provided by the embodiment of the present application achieves the above-mentioned objects will be described in detail with reference to the accompanying drawings.

As shown in fig. 2 to 4, the earphone body 10 includes an ear bag 11 and an ear rod 12, the ear rod 12 is attached to a rear end portion of the ear bag 11, and a front end (an end facing a user when worn) of the ear bag 11 has an opening 10a, and the opening 10a can be used for sound conduction.

The mouthpiece 20 is attached to the opening 10a and covers the opening 10a. The sound outlet nozzle 20 includes a sound outlet tube 21 having a hollow cylindrical structure, the sound outlet tube 21 is protrudingly disposed on the earphone main body 10, a rear end of the sound outlet tube 21 is fixedly connected to the opening 10a, the sound outlet tube 21 is configured to be capable of being abutted against an ear canal of a user, and when worn, a front end of the sound outlet tube 21 extends into the ear canal of the user.

The first speaker 40 is disposed in the sound outlet tube 21, a sound outlet hole of the first speaker 40 faces the front end of the sound outlet tube 21, and the sound outlet nozzle 20 is used for conducting the sound of at least one speaker (e.g., the second speaker 13 and the third speaker 14) disposed in the earphone body 10 and the first speaker 40 into the ear canal of the user.

At least one speaker is arranged in the earphone main body 10 of the earphone 100 provided by the embodiment of the present application, and the first speaker 40 is further arranged in the sound outlet pipe 21, the arrangement of the first speaker 40 in the present application does not occupy the internal space of the earphone main body 10, so that the earphone 100 provided by the embodiment of the present application has a larger number of speakers compared with the earphones in the prior art. The earphone 100 provided by the embodiment of the application realizes the stacking design of a plurality of speakers in a limited space, so that each speaker can exert respective advantages, and better audio effect experience and noise reduction effect experience are realized by combination.

The first speaker 40 in the embodiment of the present application is disposed inside the sound outlet tube 21, and the sound outlet 20 is configured to conduct the sound of the at least one speaker disposed in the earphone body 10 and the first speaker 40 to the ear canal of the user, and the disposition of the first speaker 40 does not affect the sound conduction effect and the wearing comfort of the user. Due to the arrangement of the plurality of speakers, the earphone 100 provided by the embodiment of the application has a better noise reduction effect and a better sound quality effect, and the use experience of a user is improved.

As shown in fig. 3 and 4, in the embodiment of the present application, a second speaker 13 and a third speaker 14 are provided in the earphone body 10, the second speaker 13 is adjacent to the opening 10a, and the third speaker 14 is located in the middle of the earphone body 10. The sound outlet holes of the second speaker 13 and the third speaker 14 are both directed toward the opening 10a to improve the sound guiding effect.

That is to say, the earphone 100 provided by the embodiment of the present application realizes the stacking design of at least 3 speakers in a limited space, and with an earphone having one or two speakers in the prior art, the earphone 100 provided by the embodiment of the present application can perform a frequency division design on a plurality of speakers, so that each speaker can exhibit a better audio capability, and further, the earphone 100 has a better noise reduction effect and a better sound quality effect, and the user experience can be improved.

Further, the operating frequency bands of the first speaker 40, the second speaker 13, and the third speaker 14 are different from each other. Through the arrangement, the three loudspeakers can exert respective audio advantages, and better audio effect experience and noise reduction experience are achieved through combination.

Here, the operating frequency bands of the first speaker 40, the second speaker 13, and the third speaker 14 may or may not overlap, and the present application does not limit this.

Here, the sound production of the woofer is advantageous at low frequencies without compromising the sound quality of other frequency bands (e.g., middle and high frequencies). The mid-range speaker produces sound at mid-range frequencies without compromising sound quality in other frequency bands (e.g., low and high frequencies). The high frequency speaker produces sound at high frequencies without compromising the sound quality in other frequency bands (e.g., low and mid frequencies).

For example, the first speaker 40 may be a mid-range speaker, with sound generation at mid-range frequencies and sound generation frequencies between 1000Hz and 4000Hz. The second loudspeaker 13 is a high-frequency loudspeaker, the sounding advantage is high frequency, and the sounding frequency is 4000-20000 Hz. The third speaker 14 is a low frequency speaker, which has the advantage of low frequency, and the sounding frequency is 200-1000 Hz. The three loudspeakers are combined to respectively exert respective audio advantages, so that the audio effect and the noise reduction effect are better.

The sound outlet tube 21 needs to be inserted into the ear canal of the user, so that the diameter of the sound outlet tube 21 cannot be set to be large, and in order to smoothly mount the first speaker 40 in the sound outlet tube 21, the first speaker 40 should be a speaker with a small volume, for example, the first speaker 40 is any one of a moving-iron speaker, a flat-magnetic speaker, or an MEMS speaker.

The second speaker 13 is adjacent to the opening 10a and located between the third speaker 14 and the opening 10a, and considering that the second speaker 13 should minimize the influence on the sound conduction of the third speaker 14, the second speaker 13 should also be selected to be a speaker with a smaller volume, for example, the second speaker 13 is any one of a moving-iron type speaker, a flat-magnetic type speaker, or a MEMS speaker.

The third speaker 14 is located in the middle of the earphone body 10, and is limited by a small volume, so that the third speaker 14 can be a moving-coil speaker with a large volume but a low cost and a good sound quality.

Further, as shown in fig. 3 and 4, a microphone 15 is also provided in the earphone main body 10 adjacent to the opening 10a. The sound pickup hole of the microphone 15 faces the opening 10a, the microphone 15 is equivalent to a feedback microphone in an FB microphone noise reduction system, the microphone 15 is used for picking up sound in the ear canal of the user and transmitting a sound signal to a noise reduction chip inside the earphone body 10, and the noise reduction chip controls at least one of the first loudspeaker 40, the second loudspeaker 13 and the third loudspeaker 14 to output an opposite-phase sound wave equal to the ambient noise according to the sound signal, so that the noise is neutralized, and the noise reduction effect is realized.

Optionally, the earphone 100 provided by the embodiment of the present application further includes a feedforward microphone (not shown in the drawings) for picking up external environmental sounds and transmitting sound signals to the noise reduction chip inside the earphone body 10, so that the earphone 100 provided by the embodiment of the present application has a function of hybrid noise reduction, and the noise reduction effect is better.

The following description of the sound outlet 20, which is a key component of the earphone 100, will be described in detail with reference to the accompanying drawings.

The sound outlet 20 provided in the embodiment of the present application is used for conducting sound, and the sound outlet 20 at least includes (for example, only includes) a sound outlet tube 21. In consideration of the difficulty in mounting the first speaker 40, the sound outlet tube 21 may be made of a material with relatively stable performance (high strength), so that the wall of the sound outlet tube 21 may be as thin as possible to increase the internal space of the sound outlet tube 21 and provide a sufficient space for mounting the first speaker 40. For example, the sound outlet tube 21 may be a metal member, and the metal member may be a stainless steel member, a copper alloy member, or an aluminum alloy member, but is not limited thereto.

At this time, the sound outlet tube 21 may be fixed to the opening 10a by any means such as clamping, welding, bonding, screwing, riveting, and the like. For example, the sound outlet tube 21 may be attached to the opening 10a by ultrasonic welding.

The sound outlet 20 in the present application may include only one component, namely the sound outlet tube 21, and may further include other components, which are not limited in the present application. Fig. 5 is a schematic structural view of the mouthpiece 20 and the first speaker 40 formed as a single body.

As shown in fig. 3, a part a of fig. 5, and a part c of fig. 5, the sound outlet nozzle 20 according to the embodiment of the present application further includes a sound outlet hole plate 23 fixedly disposed at the front end of the sound outlet tube 21 and limiting the first speaker 40.

Specifically, the sound outlet plate 23 may be fixedly covered on the front end portion of the sound outlet tube 21, so that the sound outlet tube 21 and the sound outlet plate 23 are integrally formed into a "hat-shaped" structure, the sound outlet plate 23 can limit the first speaker 40, and prevent the front end of the first speaker 40 from penetrating out of the sound outlet tube 21, for example, the front end of the first speaker 40 (i.e., the end having the sound outlet hole) may abut against the inner surface of the sound outlet plate 23, and the sound outlet plate 23 is provided with a plurality of through holes, so that the sound transmission is not hindered.

Optionally, the sound outlet pipe 21 and the sound outlet plate 23 are integrally formed by an integral molding process, so that the sound outlet 20 has higher mechanical strength, the production process can be simplified, and the production cost can be saved.

Further, as shown in part b of fig. 5, the sound outlet 20 further includes a hollow bracket 22 fixedly disposed at the rear end of the sound outlet tube 21 and limiting the first speaker 40.

Fretwork support 22 can carry on spacingly to first speaker 40, prevents that it from coming off from the rear end portion of sound pipe 21, and this fretwork support 22 has fretwork portion (for example through-hole or opening), and then makes can not cause too much hindrance to the conduction of sound when playing limiting displacement.

As shown in fig. 5, the first speaker 40 may be adapted to the length of the sound outlet tube 21, so that when the first speaker 40 is installed inside the sound outlet tube 21, the front end and the rear end of the first speaker 40 respectively contact the sound outlet plate 23 and the inner surface of the hollow bracket 22, thereby reliably fixing the first speaker 40 inside the sound outlet tube 21.

Alternatively, the sound outlet nozzle 20 (sound outlet tube 21) may be mounted above the opening 10a. With the above arrangement, the first speaker 40 can be mounted in the mouthpiece 20 to form an integral structure, and then mounted on the opening 10a (i.e., the headphone body 10) as a whole, thereby reducing the difficulty in mounting the first speaker 40 and improving the production efficiency.

For example, the first speaker 40 may be inserted from the rear end of the sound outlet tube 21 so that the front end of the first speaker 40 abuts against the inner surface of the sound outlet plate 23, and then the hollow bracket 22 may be assembled to the sound outlet tube 21, and the first speaker 40 may be reliably fixed to the sound outlet tube 21 under the common limit of the sound outlet tube 21, the sound outlet plate 23, and the hollow bracket 22, and then the above components may be assembled into an integral structure and then installed to the opening 10a, thereby enabling the first speaker 40 to be installed more conveniently and efficiently.

Optionally, a dust-proof mesh may be disposed between the opening 10a and the sound outlet 20 (e.g., the hollow bracket 22), and the dust-proof mesh has good sound transmission performance and can prevent impurities such as moisture and dust from entering the inside of the earphone.

Further, as shown in fig. 2, 3, and 5, the diameter of the sound outlet tube 21 is gradually reduced along the direction from the rear to the front of the sound outlet tube 21, and the hollow bracket 22 is covered on the inner side of the rear end of the sound outlet tube 21. At this time, the sound outlet pipe 21 and the sound outlet hole plate 23 are integrally in a frustum shape, and the sectional area of the rear end portion is larger than the area of the sound outlet hole plate 23, so that the first speaker 40 can be conveniently installed and inserted through the arrangement, and the hollow support 22 covers the inner side of the rear end portion of the sound outlet pipe 21, so that the first speaker 40 can be fixed.

Moreover, the sound outlet tube 21 adopts a cone-shaped design, the hole is formed on the inclined plane (tube wall) to meet the sound outlet area requirement, and the cone-shaped structure is placed in the earplug 30 in the middle, so that the wearing comfort is not influenced.

Alternatively, the hollow bracket 22 may be mounted on the sound outlet tube 21 by any means such as welding, bonding, screwing, clipping, or riveting.

For example, the entire sound outlet 20 is made of a metal material (i.e., the hollow bracket 22 is also made of a metal material), and the hollow bracket 22 may be mounted by welding or riveting.

As shown in fig. 5, the cross-sectional shape of the first speaker 40 is rectangular, and the cross-sectional shape of the sound outlet plate 23 is also rectangular, and in other embodiments, the cross-sectional shape of the first speaker 40 may be any shape such as circular, oval, diamond, or trapezoid, which is not limited in the present application.

Fig. 6 is a schematic structural view of another example of the integrated structure of the sound outlet 20 and the first speaker 40. As a specific example, as shown in a portion a in fig. 6 and a portion b in fig. 6, the cross-sectional shape of the first speaker 40 is a circle, and the cross-sectional shape of the sound outlet plate 23 is also set to be a circle.

Further, as shown in fig. 1 and fig. 3, the earphone 100 further includes an earplug 30 sleeved on the periphery of the sound outlet tube 21, where the earplug 30 is made of an elastic material, for example, the earplug 30 is made of a soft glue (such as a silica gel). The earplug 30 has a sound outlet 30a at a front end portion facing the user, and the sound emitted from the sound outlet tube 21 is transmitted into the ear canal of the user through the sound outlet 30a. This application can be with more firm wearing of earphone 100 on user's ear through setting up earplug 30 to earplug 30 can seal the duct, reduces the interference of external noise to the sound of play sound pipe 21 output.

Further, as shown in fig. 3, a sound leading gap 30b is provided between the earplug 30 and the sound outlet tube 21, and the sound leading gap 30b communicates the opening 10a and the sound outlet 30a. In the present invention, the number of speakers of the earphone 100 can be increased by providing the first speaker 40 in the sound outlet tube 21, the provision of the first speaker 40 may cause a certain hindrance to the sound conduction of the second speaker 13 and the third speaker 14 in the earphone main body 10, and the sound conduction effect can be enhanced by providing the sound guide gap 30b for communicating the opening 10a and the sound outlet 30a in the embodiment of the present invention.

In the embodiment of the present application, how the sound guide gap 30b communicates with the opening 10a and the sound outlet 30a is not particularly limited, and the sound guide gap 30b may directly communicate with the opening 10a and the sound outlet 30a, or may further communicate with the sound outlet through an intermediate medium.

In the embodiment of the present application, the sound outlet tube 21 is provided with a plurality of through holes, and the through holes communicate the sound guide gap 30b and the opening 10a. The sound emitted by the second speaker 13 and the third speaker 14 may sequentially pass through the hollow portion of the hollow bracket 22 and enter the sound outlet tube 21, and then enter the sound guide gap 30b through the through hole formed in the sound outlet tube 21, and finally be transmitted to the ear canal of the user through the opening 10a.

At this time, the integral structure formed by the sound outlet pipe 21 and the sound outlet hole plate 23 has a cap-shaped (frustum-shaped) mesh structure, which has sufficient mechanical strength and is not easily deformed.

Fig. 7 is a cross-sectional view of another example of the earphone 100 according to the embodiment of the present application. Fig. 8 is a schematic structural view of another example in which the mouthpiece 20 and the first speaker 40 are integrally formed.

Compared with the embodiment shown in fig. 1 to 6, as shown in a part a of fig. 7 and 8 and a part b of fig. 8, in the embodiment, the pipe diameter of the sound outlet pipe 21 is kept constant along the direction from the back to the front of the sound outlet pipe 21, and the hollow bracket 22 is covered on the back end part of the sound outlet pipe 21 and exceeds the back end part of the sound outlet pipe 21. At this time, the sound outlet tube 21 is a columnar structure as a whole, the sectional area of the sound outlet tube 21 is smaller than the area of the hollow bracket 22, and the rear end portion of the sound outlet tube 21 is mounted on the hollow bracket 22. The hollow support 22 covers the rear end of the sound outlet tube 21 and extends beyond the rear end of the sound outlet tube 21, so that the sound outlet 20 can be conveniently and integrally mounted on the earphone main body 10.

At this time, the wall of the sound outlet tube 21 may not be provided with a through hole, but the sound guide gap 30b and the opening 10a are communicated through the hollow part (through hole) of the hollow bracket 22, so as to enhance sound conduction.

As shown in fig. 8, the first speaker 40 has a rectangular cross-sectional shape, and the sound outlet plate 23 also has a rectangular cross-sectional shape. Fig. 9 is a schematic configuration diagram of another example in which the mouthpiece 20 and the first speaker 40 are integrally configured. As shown in a portion a of fig. 9 and a portion b of fig. 9, the cross-sectional shape of the first speaker 40 is circular, and the cross-sectional shape of the sound outlet plate 23 is also circular correspondingly.

On the other hand, an embodiment of the present application further provides an earphone box assembly, where the earphone box assembly includes an earphone box and the earphone 100 provided in any of the foregoing embodiments, and the earphone box is configured to accommodate the earphone 100 and charge the earphone 100. When the earphone 100 is stored in the earphone box and the electrical connector on the earphone 100 is in contact with the electrical connector on the earphone box, the earphone 100 can be charged through the current transmission function of the electrical connector.

Optionally, the earphone box assembly comprises two earphones, and at least one earphone is the earphone 100 provided in any of the foregoing embodiments.

The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. An earphone, comprising:

an earphone body (10), the earphone body (10) having an opening (10 a);

go out sound mouth (20), go out sound mouth (20) connect in on opening (10 a), go out sound mouth (20) including play sound pipe (21), be provided with first speaker (40) in going out sound pipe (21), go out sound mouth (20) be used for with at least one speaker that sets up in earphone main part (10) with the sound conduction of first speaker (40) is to the user's ear canal.

2. The earphone of claim 1, wherein the sound outlet nozzle (20) further comprises a sound outlet plate (23) fixedly arranged at the front end of the sound outlet tube (21) and limiting the first speaker (40).

3. The earphone according to claim 1 or 2, wherein the sound outlet nozzle (20) further comprises a hollow support (22) fixedly arranged at the rear end of the sound outlet tube (21) and limiting the first speaker (40).

4. The earphone according to claim 3, further comprising an ear plug (30) fitted around the outer periphery of the sound outlet tube (21), the ear plug (30) having a sound outlet (30 a) at a front end thereof.

5. The ear cup as claimed in claim 4, characterised in that a sound guiding gap (30 b) is provided between the ear plug (30) and the sound outlet tube (21), the sound guiding gap (30 b) communicating the opening (10 a) with the sound outlet (30 a).

6. The earphone according to claim 5, wherein the diameter of the sound outlet tube (21) is gradually reduced along the direction from the back to the front of the sound outlet tube (21), and the hollow support (22) is covered on the inner side of the back end of the sound outlet tube (21).

7. The earphone of claim 6, wherein the sound outlet tube (21) is provided with a plurality of through holes, and the through holes communicate the sound guide gap (30 b) with the opening (10 a).

8. The earphone according to claim 5, wherein the diameter of the sound outlet tube (21) is kept constant along the direction from the back to the front of the sound outlet tube (21), and the hollow bracket (22) covers the back end of the sound outlet tube (21) and exceeds the back end of the sound outlet tube (21).

9. The earphone according to claim 8, wherein the hollowed-out portion of the hollowed-out support (22) communicates the sound guide gap (30 b) with the opening (10 a).

10. The earpiece according to any of claims 1-9, wherein the mouthpiece (20) is mounted over the opening (10 a).

11. The earphone according to any of claims 3-9, wherein the sound outlet tube (21), the first speaker (40) and the hollow bracket (22) are assembled into an integral structure and then mounted on the opening (10 a).

12. The earpiece according to any of the claims 1-11, wherein the mouthpiece (20) is a metallic piece.

13. The earphone according to any of the claims 2-9, wherein the sound outlet tube (21) and the sound outlet plate (23) are made in one piece by an integral molding process.

14. The headset of any of claims 1-13, wherein the first speaker (40) is any of a moving iron type speaker, a flat magnetic type speaker, or a mems type speaker.

15. The headset of any one of claims 1 to 14, wherein a second speaker (13) and a third speaker (14) are provided within the headset body (10), the second speaker (13) being adjacent to the opening (10 a), the third speaker (14) being located in the middle of the headset body (10).

16. The headset of claim 15, wherein the second speaker (13) is a moving coil speaker.

17. The headset of claim 15 or 16, wherein the third speaker (14) is any one of a moving iron type speaker, a flat magnetic type speaker or a mems type speaker.

18. The headset of any of claims 15-17, wherein the first loudspeaker (40), the second loudspeaker (13) and the third loudspeaker (14) are operated in different frequency bands.

19. The headset of any one of claims 1 to 18, wherein a microphone (15) is further provided in the headset body (10) adjacent to the opening (10 a).

20. The ear cup as claimed in claim 10 or 11, characterised in that the sound outlet nozzle (20) is mounted over the opening (10 a) by means of an ultrasonic welding process.

21. The headset of any one of claims 1-20, wherein the headset is a true wireless stereo headset.

22. An earphone box assembly, comprising an earphone box and an earphone according to any one of claims 1-21, the earphone box being adapted to receive the earphone and to charge the earphone.