CN112261538A

CN112261538A - Sound amplifying device applied to earphone

Info

Publication number: CN112261538A
Application number: CN202011209898.5A
Authority: CN
Inventors: 王力维; 廖风云
Original assignee: Shenzhen Voxtech Co Ltd
Current assignee: Shenzhen Voxtech Co Ltd
Priority date: 2020-11-03
Filing date: 2020-11-03
Publication date: 2021-01-22

Abstract

The application mainly relates to a sound reinforcement device applied to an earphone, which comprises a box body, wherein a contact area used for contacting with a loudspeaker of the earphone is arranged on the box body, so that vibration generated by the loudspeaker can be transmitted to the box body through the contact area. This application can increase the area that the speaker of earphone and air contact through the public address device to amplify the mechanical vibration of earphone through the box, make the volume of the sound that the user heard at least can be increased, tone quality can be improved.

Description

Sound amplifying device applied to earphone

Technical Field

The application relates to the technical field of acoustic equipment, in particular to a sound amplifying device applied to an earphone.

Background

Bone conduction is a sound conduction mode, namely, an electric signal is converted into mechanical vibration, and the mechanical vibration is transmitted through the skull, the bone labyrinth, the lymph fluid of the inner ear, the spiral organ, the auditory nerve and the auditory center of the cerebral cortex of a human body to realize the transmission of sound waves. Bone conduction earphone utilizes bone conduction technique to transmit sound signal to the user, and the sound wave can directly pass through human tissue and bone and reach the auditory nerve, and need not to pass through external auditory canal and eardrum, can "liberate" both ears.

Disclosure of Invention

The embodiment of the application provides a sound reinforcement device applied to earphones, wherein the sound reinforcement device comprises a box body, and a contact area used for contacting with a loudspeaker of the earphones is arranged on the box body, so that vibration generated by the loudspeaker can be transmitted to the box body through the contact area.

The beneficial effect of this application is: the utility model provides a public address equipment can be applied to the earphone, can increase the speaker of earphone and the area of air contact through public address equipment to amplify the mechanical vibration of earphone through the box, make the volume of the sound that the user heard can be increased, tone quality can be improved at least.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

FIG. 1 is a schematic diagram of an embodiment of a headset according to the present application;

FIG. 2 is a schematic illustration of the principles of mechanical vibration induced air vibration as described herein;

fig. 3 is a schematic structural diagram of an embodiment of the sound reinforcement device provided in the present application;

fig. 4 is a schematic diagram of the acoustic principle of the sound reinforcement device in fig. 3;

FIG. 5 is a schematic diagram of the structure of one embodiment of the contact region of FIG. 3;

FIG. 6 is a frequency response curve corresponding to the interface formed between the contact zones and the skin contact area of the speaker of FIG. 5;

fig. 7 is a schematic structural diagram of another embodiment of the sound reinforcement device provided in the present application;

fig. 8 is a schematic diagram of the acoustic principle of the sound reinforcement device in fig. 7;

fig. 9 is a schematic structural diagram of a further embodiment of the sound reinforcement device provided in the present application;

fig. 10 is a schematic diagram of the acoustic principle of the sound amplification apparatus in fig. 9;

fig. 11 is a frequency response curve of the sound amplification apparatus provided in the present application;

fig. 12 is a schematic structural diagram of a sound reinforcement device according to still another embodiment of the present application.

Detailed Description

The present application will be described in further detail with reference to the following drawings and examples. It is to be noted that the following examples are only illustrative of the present application, and do not limit the scope of the present application. Likewise, the following examples are only some examples and not all examples of the present application, and all other examples obtained by a person of ordinary skill in the art without any inventive work are within the scope of the present application.

Reference in the specification to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the specification. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.

In the earphone, the mechanical vibration generated by the speaker may be mainly transmitted through a medium such as air or a skull of a user. The former may be generally referred to as an air conduction headset, and the latter may be generally referred to as a bone conduction headset. In addition, since both the air conduction earphone and the bone conduction earphone have mechanical vibration, it is easy for those skilled in the art to think that the technical solution of the present application is applied to the air conduction earphone and the bone conduction earphone respectively, and will not be described herein again. Based on this, the present application mainly uses the earphone as the bone conduction earphone for exemplary explanation.

Referring to fig. 1 and fig. 2 together, fig. 1 is a schematic structural diagram of an embodiment of a headset according to the present application, and fig. 2 is a schematic structural diagram of a circuit of the headset in fig. 1.

As shown in fig. 1, the headset 10 may include two speakers 11, two ear-hook assemblies 12, and a rear-hook assembly 13. Wherein, one end of each ear-hang component 12 is connected with a corresponding loudspeaker 11, and two ends of the rear-hang component 13 are connected with the other ends of the two ear-hang components 12 far away from the loudspeakers 11. In other words, the number of the speakers 11 may be two, and the rear-hanging component 13 may be connected to the two speakers 11 through the ear-hanging components 12, respectively. Further, both ear hook assemblies 12 may be curved to facilitate hanging on both ears of a user; the rear hanging component 13 may also be curved to be conveniently wound around the rear side of the head of the user, so as to meet the use requirement of the user wearing the earphone 10. So arranged that when the headset 10 is in a worn state, the two speakers 11 are located on the left and right sides of the user's head, respectively; and under the cooperation of the two ear hook assemblies 12 and the rear hook assembly 13, the two speakers 11 can clamp the head of the user and contact the skin of the user, so that the earphone 10 can realize sound transmission based on the technology.

It should be noted that: fig. 1 is a schematic diagram of a morphological structure of a common bone conduction earphone, and it is easily known by those skilled in the art that earphones of other forms are closely matched with a sound amplifier by a proper method, and mechanical vibration can be amplified as well, so that an effect of a passive sound box is achieved, and the morphology of the earphones has no limitation.

The inventor of the present application found in a long-term product development process that: the one-sided pressing force applied by the headset 10 (which may specifically be the speaker 11) to the head of the user when the user wears the headset 10 may be in the range of 0.3N to 0.4N. In this case, the user can perform the sound well regardless of the comfort level of wearing the headphone 10 or the acoustic performance (for example, sound quality, volume, and the like) of the headphone 10. Further, referring to fig. 1, the skin contact area of the speaker 11 described herein may specifically refer to an area where the speaker 11 contacts the skin of the head of the user when the user wears the earphone 10.

Further, the headset 10 may also include a main board 14 and a battery 15. With reference to fig. 2, the main board 14 and the battery 15 may be electrically connected to the two speakers 11 through corresponding wiring structures (e.g., wires). At this time, the main board 14 may be used for controlling the sound emission of the speakers 11 (mainly converting the electrical signal into mechanical vibration), and the battery 15 may be used for supplying electric power to the earphone 10 (specifically, two speakers 11). Of course, the earphone 10 described herein may further include microphones such as a microphone and a sound collector, and may further include functional devices such as a USB socket and a control button, which may also be electrically connected to the main board 14 and the battery 15 through corresponding wiring structures to implement corresponding functions. For example: the microphone can realize the functions of the earphone 10 such as conversation, the sound pick-up can realize the functions of the earphone 10 such as noise reduction, the USB socket can realize the functions of the earphone 10 such as wired charging and data transmission, and the control keys can realize the functions of the earphone 10 such as opening and closing and volume adjustment.

It should be noted that: with reference to fig. 1, the main board 14 and the battery 15 may be disposed within the two ear hook assemblies 12, respectively. So configured, not only can the capacity of the battery 15 be increased to improve the cruising ability of the earphone 10; the weight of the headset 10 may also be balanced to improve the wearing comfort of the headset 10.

Referring to fig. 2, fig. 2 is a schematic diagram illustrating the principle of air vibration caused by mechanical vibration according to the present application. Fig. 2 (a) is a schematic diagram of the earphone described in this application directly inducing air vibration, and fig. 2 (b) is a schematic diagram of the earphone described in this application inducing air vibration through the sound amplifying device.

Based on the above-described related description, when the user wears the headset 10, the user can hear sounds of music, voice, and the like through the headset 10. When the user takes off the earphone 10, in conjunction with fig. 2, the present application may also use an acoustic amplifying device 20 in cooperation with the earphone 10, that is, the acoustic amplifying device 20 described in the present application may be applied to the earphone 10 described in the present application, so as to amplify the mechanical vibration of the earphone 10 through the acoustic amplifying device 20, at least, the volume of the sound heard by the user can be increased (that is, the sound is played out), and the sound quality can be improved (for example, the sound range is widened). In other words, when the earphone 10 is used in cooperation with the sound amplifying device 20, the sound amplifying device 20 is driven to vibrate by the mechanical vibration generated by the speaker 11, so that the sound amplifying device 20 drives the air to vibrate. At this time, since the contact area of the sound reinforcement device 20 with the air is large, it is beneficial to drive more air to participate in the vibration, and further beneficial to improve the volume and tone quality of the sound heard by the user.

Referring to fig. 3 and fig. 4 together, fig. 3 is a schematic structural diagram of an embodiment of the sound reinforcement device provided in the present application, and fig. 4 is a schematic acoustic principle diagram of the sound reinforcement device in fig. 3.

In this embodiment, the sound reinforcement device 20 may include a case 21. Based on the above description, the cabinet 21 may have a plate structure, a horn structure, a cavity structure, etc., which can increase the contact area of the speaker 11 with air, thereby improving the volume and quality of sound heard by the user. In the present application, referring to fig. 3, a case 21 is taken as an example of a cavity structure for exemplary description. Further, a contact area 211 for contacting the speaker 11 of the earphone 10 is provided on the case 21, so that vibration generated by the speaker 11 can be transmitted to the case 21 through the contact area 211. At this time, the case 21 further converts the above-described vibration into air conduction vibration. In other words, the earphone 10 can contact the case 21 through the contact region 211 disposed on the case 21, so that the mechanical vibration generated by the speaker 11 can drive the case 21 to vibrate therewith, and the vibration generated by the case 21 is transmitted through the air as a medium, thereby forming sound transmission.

Illustratively, as shown in FIG. 3, the housing 21 may include an outer housing 212. The outer case 212 may be a spherical or cylindrical structure having a hollow space therein. It should be noted that: the inner walls of the outer case 212 are protected as far as possible from sharp projections and/or depressions to optimize the acoustic performance of the case 21. Further, the outer case 212 may enclose to form a first chamber 2121. The volume, shape, and other structural parameters of the first chamber 2121 can adjust the acoustic performance of the box 21. For example: the larger the volume of the first chamber 2121, the better the acoustic performance of the enclosure 21 at low frequencies (e.g., frequencies less than 500 Hz); the more regular and round the shape of the first chamber 2121, the better the acoustic performance of the housing 21. At this time, the contact region 211 may be provided on the outer case 212 so that the outer case 212 vibrates in synchronization with the speaker 11. Referring to fig. 4, the frequency response curve of the tank 21 may form a peak or a trough.

In some embodiments, the first chamber 2121 may be a sealed space, i.e., the medium (e.g., air) in the first chamber 2121 is isolated from the external environment. At this time, in the process that the outer case 212 is vibrated simultaneously with the speaker 11, the medium in the first chamber 2121 is subjected to a large pressure change, thereby reacting to the vibration of the outer case 212. In other embodiments, the first chamber 2121 may be an open space, i.e., the medium (e.g., air) in the first chamber 2121 is in communication with the external environment. At this time, in the process that the outer housing 212 is vibrated simultaneously with the speaker 11, the medium in the first chamber 2121 is subjected to a small pressure change, which has a small influence on the vibration of the outer housing 212. In other words, by providing the first chamber 2121 as a closed space or an open space, the acoustic performance of the case 21 can be adjusted as well.

The inventor of the present application found in a long-term product development process that: in a certain range, the higher the rigidity of the contact region 211 is, the smaller the deformation generated when the structure is stressed is, and the transmission of mechanical vibration is also facilitated. However, if the rigidity of the contact region 211 is too large, the contact region 211 is likely to move relatively to the skin contact region of the speaker 11 during the simultaneous vibration of the outer housing 212 with the speaker 11, thereby reducing the transmission effect of mechanical vibration and even causing abnormal sound when colliding with the speaker 11. In this regard, in the present embodiment, the elastic modulus of the contact region 211 is set to be smaller than the elastic modulus of the other regions of the outer case 212. In other words, the outer case 212 may be softer at the contact region 211 to ensure the efficiency of the speaker 11 in transmitting the mechanical vibration to the outer case 212 and avoid the occurrence of abnormal noise. Illustratively, the elastic modulus of the contact region 211 may be 1-3GPa, and the elastic modulus of the other regions of the outer housing 212 may be 6-8 GPa. Based on this, the outer case 212 may be formed by a two-shot injection molding process, the material of the outer case 212 in the contact region 211 may be polycarbonate, polyamide, abs, etc., and the material of the outer case 212 in other regions may be a mixture of polycarbonate, polyamide, abs, etc., and glass fiber or carbon fiber (for example, 20% to 50% of glass fiber is added to polycarbonate).

Further, referring to fig. 1, the number of the contact regions 211 may be two based on the basic structure of the headset 10, and the two contact regions 211 are symmetrically disposed at opposite sides of the outer housing 212. This is arranged to allow the rear suspension assembly 13 (and the ear suspension assembly 12) of the earphone 10 to straddle the outer case 212 and press and fix the two speakers 11 on the corresponding contact areas 211, respectively. In other words, the outer case 212 corresponds to the head of the user, and the earphone 10 can be simply viewed as the user wearing the earphone 10 with the outer case 212 interposed therebetween. Therefore, based on the above-described related description, the pressing force of the speaker 11 against the corresponding contact region 211 may be 0.3 to 0.4N.

It should be noted that: the contact region 211 may be recessed, that is, the contact region 211 may have a certain depth to accommodate the speaker 11, thereby increasing the accuracy and reliability of the earphone 10 clamping the outer case 212. Based on this, the specific location of the contact region 211 on the outer casing 212 can be reasonably designed according to the acoustic performance of the outer casing 212, and is not limited herein. Further, since the contact region 211 may be recessed, so that the specific position of the contact region 211 on the outer casing 212 is determined after reasonable design according to the acoustic performance of the outer casing 212, the earphone 10 may be clamped at the same position on the outer casing 212 each time, thereby increasing the consistency of the acoustic performance when the outer casing 212 is mated with the earphone 10.

Referring to fig. 5 and 6 together, fig. 5 is a schematic structural diagram of an embodiment of the contact area in fig. 3, and fig. 6 is a frequency response curve corresponding to a contact surface formed between the contact area in fig. 5 and a skin contact area of a speaker.

As shown in fig. 5, the outer case 212 may further have a plurality of protrusions 2122 spaced apart from each other at the contact area 211, and the protrusions 2122 may be mainly used to adjust the size of the contact surface formed by the outer case 212 between the contact area 211 and the skin contact area of the speaker 11 (in short, adjust the size of the contact surface formed by the speaker 11 and the outer case 212), so as to adjust the intensity of the mechanical vibration of the speaker 11 transmitted to the outer case 212 to some extent. Specifically, when two speakers 11 are respectively press-fixed to the corresponding contact regions 211, in conjunction with fig. 5, the skin contact region (which may be defined as a "vibration surface") of the speaker 11 is in contact with the protrusion 2122. Obviously, the larger the number of the protrusions 2122, the larger the area of the surface of each protrusion 2122 in contact with the speaker 11, and the larger the contact surface formed by the speaker 11 and the outer case 212; accordingly, the larger the proportion of the contact surface to the vibration surface.

The inventor of the present application found in a long-term product development process that: as shown in fig. 6, the overall trend of the frequency response curve is generally uniform for different proportions of the contact surface to the vibration surface, which indicates that the size of the contact surface formed by the outer case 212 between the contact region 211 and the skin contact region of the speaker 11 has a small influence on the sound quality. Further, as the proportion of the contact surface to the vibration surface increases, the frequency response curve is biased to a greater vibration intensity, i.e., a corresponding volume of sound is greater. Preferably, the contact surface accounts for not less than 50% of the vibration surface, that is, the contact surface formed between the contact region 211 and the skin contact region of the speaker 11 is not less than 50% of the area of the skin contact region of the speaker 11. It is worth noting that: for the low frequency band below 400Hz, the difference between the sound volume of 25% of the contact surface on the vibration surface and the sound volume of 100% of the contact surface on the vibration surface is about 12dB, which shows that the contact surface is consistent with the vibration surface and is beneficial to the maximization of the sound volume.

It should be noted that: the protrusion 2122 provided on the contact region 211 can adjust the size of the contact surface formed by the speaker 11 and the outer case 212, and the recess (opposite to the protrusion 2122 in structure) provided on the contact region 211 can also adjust the size of the contact surface formed by the speaker 11 and the outer case 212. Further, either the protrusion 2122 or the recess may be formed integrally with the contact region 211.

Referring to fig. 7 to 10 together, fig. 7 is a schematic structural diagram of another embodiment of the sound reinforcement device provided in the present application, fig. 8 is a schematic acoustic principle diagram of the sound reinforcement device in fig. 7, fig. 9 is a schematic structural diagram of another embodiment of the sound reinforcement device provided in the present application, and fig. 10 is a schematic acoustic principle diagram of the sound reinforcement device in fig. 9.

The main differences from the above described embodiment are: in this embodiment, as shown in fig. 7 or 9, the box 21 may further include an inner box 213. The inner housing 213 is disposed in the first chamber 2121 and may enclose the second chamber 2131. So configured, the inner housing 213 may be mainly used to form resonance with the outer housing 212, so as to increase the bandwidth (i.e. frequency band width) of the housing 21 and optimize the sound quality of the housing 21. In other words, the case 21 shown in fig. 3 can be simply regarded as a single-chamber structure, which can achieve an amplification effect of sound in a narrow frequency band; while the case 21 shown in fig. 7 or 9 can be simply regarded as a double chamber structure, the double chamber structure can more easily achieve the amplification effect of sound in a wider frequency band than the single chamber structure. Theoretically, the more the number of the cavities of the box body 21 is, the easier it is to realize the sound amplification effect of a wider frequency band, and the better the tone quality is optimized.

It should be noted that: referring to fig. 7, 9 and 3, since the inner housing 213 may be disposed inside the outer housing 212, the second chamber 2131 may be simply regarded as a part of the first chamber 2121. In other words, referring to fig. 7 and 9, the first chamber 2121 is divided into two relatively independent spaces by the inner box 213, wherein one of the spaces is the second chamber 2131.

Similarly, the inner housing 213 may have a spherical, cylindrical, etc. shape. Further, the inner box 213 avoids sharp projections and/or depressions as much as possible to optimize the acoustic performance of the box 21.

In some embodiments, with reference to fig. 7, the second chamber 2131 may be a closed space, i.e., the medium (e.g., air) in the second chamber 2131 is isolated from the external environment. At this time, in the process that the box body 21 synchronously vibrates with the speaker 11, the medium in the first chamber 2121 and the medium in the second chamber 2131 both have a large pressure change, and further the medium reacts to the vibration of the outer box 212 and the inner box 213, that is, the vibration of the box body 21 is greatly influenced. At this time, referring to fig. 8, the case 21 may be divided into three parts; accordingly, the case 21 may be formed with three peaks or valleys.

In other embodiments, in conjunction with fig. 9, the second chamber 2131 may be an open space, i.e., the medium (e.g., air) in the second chamber 2131 is in communication with the outside environment. At this time, during the synchronous vibration of the cabinet 21 with the speaker 11, the medium in the first chamber 2121 is subjected to a large pressure change, and the medium in the second chamber 2131 is subjected to a small pressure change, which also counteracts the vibration of the outer and

inner cases

212 and 213, i.e., has a large influence on the vibration of the cabinet 21. At this time, referring to fig. 10, the case 21 can be split into two parts; accordingly, the case 21 may be formed with two peaks or valleys.

Referring to fig. 11, fig. 11 is a frequency response curve of the sound reinforcement device provided in the present application. It should be noted that: the sound amplification device illustrated in fig. 11 may correspond to the dual chamber configuration shown in fig. 7 or fig. 9. For the convenience of research, the two cavities corresponding to the dual-cavity structure both use spheres as basic models, that is, the outer box 212 (and the first cavity 2121 formed therein) and the inner box 213 (and the second cavity 2131 formed therein) are spheres. Based on this, the ratio between the volume of the second chamber 2131 and the volume of the first chamber 2121 can be converted to the ratio between the radius of the second chamber 2131 and the radius of the first chamber 2121 (referred to as "ratio of inner and outer chamber radii" for short) according to the formula for calculating the volume of the sphere. Of course, in other embodiments, the cavity may also have a regular structure such as an ellipsoid, a cylinder, a prism, or other irregular structures. Similar test results can be obtained by those skilled in the art.

The inventor of the present application found in a long-term product development process that: as shown in fig. 11, for different ratios between the volume of the second chamber 2131 and the volume of the first chamber 2121, the larger the ratio between the volume of the second chamber 2131 and the volume of the first chamber 2121, the higher the frequency and the lower the intensity of the corresponding formant of the low frequency band (e.g., the frequency less than 500Hz), which indicates that the performance of bass is greatly influenced by the ratio of the radii of the inner and outer chambers. Preferably, the ratio between the volume of the second chamber 2131 and the volume of the first chamber 2121 may be in the range of 1:10 to 1: 3. Further, the frequency response curves almost coincide in the 200-.

Referring to fig. 12, fig. 12 is a schematic structural diagram of another embodiment of the sound reinforcement device provided in the present application.

The main differences from any of the above embodiments are: in this embodiment, as shown in fig. 12, the sound reinforcement device 20 may further include a first wireless charging module 22 disposed on the outer box 212. The first wireless charging module 22 may be based on a wireless charging protocol such as Qi standard, PMA standard, A4WP standard, etc. At this time, the first wireless charging module 22 is configured to be able to wirelessly charge the headset 10 through the second wireless charging module of the headset 10. Accordingly, the second wireless charging module may be based on a Qi standard, a PMA standard, an A4WP standard, etc. wireless charging protocol. Further, the sound reinforcement device 20 may further include a first wireless communication module 23 and a control module 24 disposed on the outer case 212. The first wireless communication module 23 may be based on wireless communication technologies such as bluetooth, ZigBee, and NFC, and the control module 24 may be based on physical keys exposed on the outer case 212. At this time, the control module 24 is configured to be able to send a control signal to the headset 10 through a wireless communication connection between the first wireless communication module 23 and the second wireless communication module of the headset 10. Accordingly, the second wireless communication module may be based on wireless communication technologies such as bluetooth, ZigBee, NFC, etc., and may be integrated on the motherboard 14. In other words, when the sound reinforcement device 20 is used in cooperation with the earphone 10, not only the sound playing function can be realized through the cooperation between the box 21 and the speaker 11, but also the wireless charging function can be realized through the cooperation between the first wireless charging module 22 and the second wireless charging module, and the music playing and voice call control functions can also be realized through the wireless communication connection established through the first wireless communication module 23 and the second wireless communication.

It should be noted that: the first wireless charging module 22 may wirelessly charge the headset 10, and may also wirelessly charge an electronic device such as a mobile phone or a wireless headset. Further, the sound reinforcement device 20 may further be provided with a fast charging module (not shown in fig. 12) to facilitate fast charging for electronic devices such as mobile phones and tablet computers. Wherein a corresponding interface, such as type-C interface, is provided on the sound amplification device 20.

For example, referring to fig. 12, the first wireless charging module 22 may be independent from the outer case 212, for example, a base 25 may be additionally disposed on the sound reinforcement device 20, the base 25 is connected to the outer case 212, and the first wireless charging module 22, the first wireless communication module 23 and the above-mentioned fast charging module may be disposed in the base 25. With this arrangement, it is possible to avoid a large influence on the acoustic performance of the cabinet 21 after the sound reinforcement device 20 integrates too many functional modules.

Illustratively, in conjunction with fig. 12, the outer housing 212 may have a multi-function button, a volume up button, and a volume down button exposed thereon for controlling the earphone 10 to perform operations such as playing, pausing, cutting song, volume up and down, and the like. The multifunctional key can realize the playing and pause functions by pressing once, and can realize the song cutting function by pressing twice in a quick and continuous manner; the volume increasing function can be realized by short pressing of the volume increasing key, and the continuous and rapid volume increasing function can be realized by long pressing of the volume increasing key; the volume reduction key can realize the volume reduction function by short pressing, and can realize the rapid volume reduction function by long pressing.

The above description is only a part of the embodiments of the present application, and not intended to limit the scope of the present application, and all equivalent devices or equivalent processes that can be directly or indirectly applied to other related technologies, which are made by using the contents of the present specification and the accompanying drawings, are also included in the scope of the present application.

Claims

1. The sound reinforcement device applied to the earphone is characterized by comprising a box body, wherein a contact area used for contacting a loudspeaker of the earphone is arranged on the box body, so that vibration generated by the loudspeaker can be transmitted to the box body through the contact area.

2. The sound reinforcement device according to claim 1, wherein the housing includes an outer case enclosing a first chamber, and the contact region is disposed on the outer case so that the outer case vibrates synchronously with the speaker.

3. The sound amplifying device according to claim 2, wherein the housing further comprises an inner housing disposed in the first chamber and enclosing a second chamber, the inner housing configured to resonate with the outer housing.

4. The sound amplification apparatus of claim 3, wherein a ratio between the volume of the second chamber and the volume of the first chamber is in a range of 1:10 to 1: 3.

5. The sound amplification apparatus of claim 2, wherein the contact region is recessed to receive the speaker.

6. The sound amplifying device according to claim 2, wherein the elastic modulus of the contact area is set smaller than the elastic modulus of other areas of the outer case.

7. The sound amplification apparatus of claim 6, wherein the elastic modulus of the contact region is 1-3GPa and the elastic modulus of the other region of the outer case is 6-8 GPa.

8. The sound reinforcement device according to claim 2, wherein the earphone is a bone conduction earphone, the number of the speakers is two, the earphone further comprises a rear hanging component connecting the two speakers, the number of the contact areas is two, and the two contact areas are symmetrically disposed on two opposite sides of the outer case, so as to allow the rear hanging component to straddle over the outer case and press and fix the two speakers on the corresponding contact areas respectively; wherein the pressing force of the loudspeaker on the corresponding contact area is 0.3-0.4N, and the contact surface formed between the contact area and the skin contact area of the loudspeaker is not less than 50% of the area of the skin contact area of the loudspeaker.

9. The sound amplification apparatus as claimed in claim 2, further comprising a first wireless charging module disposed on the outer case.

10. The acoustic horn device of claim 2, further comprising a first wireless communication module and a control module disposed on the outer housing.