CN116153831A - Fake sheet replacing method and device, electronic equipment and storage medium - Google Patents
Fake sheet replacing method and device, electronic equipment and storage medium Download PDFInfo
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
Abstract
The application provides a false sheet replacing method, a false sheet replacing device, electronic equipment and a storage medium, which relate to the technical field of chip manufacturing and are applied to a Manufacturing Execution System (MES), wherein a target machine station reported by a machine station automation program (EAP) needs to replace an old false sheet based on a set false sheet replacing notification interface; responding to the received notification that the target machine station reported by the machine station automation program EAP needs to replace the old fake piece, and establishing fake piece replacement information; based on the established false sheet replacement information, issuing a matched conveying task for replacing the false sheet to the target machine; therefore, full automation of replacement of Dummy Wafer of the furnace tube machine and the etching machine in the chip manufacturing process is realized, and the chip manufacturing efficiency and quality are improved.
Description
Technical Field
The present invention relates to the field of chip manufacturing technologies, and in particular, to a method and an apparatus for replacing a dummy chip, an electronic device, and a storage medium.
Background
Furnace tools and etchers are the main equipment for chip fabrication, and Dummy wafers (Dummy wafers) are often used during use. For example, before actual production, the furnace tube machine can perform one hundred products at a time, and only tens of products or products which are not fully loaded are actually produced, so that the empty positions are filled and occupied by Dummy Wafer, and the empty positions cannot be left, otherwise, the chemical and physical conditions such as the concentration of reaction gas, the temperature and the like are influenced, so that the same environmental conditions of the product wafers are ensured. Or, equipment and other production conditions in the whole production line need to be evaluated and tested to improve stability, a Dummy Wafer is used in advance for testing, and whether a machine is normal or not is checked according to test data of the Dummy Wafer.
Since Dummy Wafer is not as high in purity as the product and the film thickness increases during continuous use, which affects the test result or quality of the product Wafer, replacement of Dummy Wafer is required after repeated use thereof a plurality of times. In the current chip manufacturing process, though the automation technology is mature gradually, the procedure of replacing Dummy Wafer used in the furnace tube machine and the etching machine still adopts a manual mode, and the efficiency and quality of chip manufacturing are affected.
Disclosure of Invention
In view of the foregoing, an object of the present application is to provide a Dummy Wafer replacement method, apparatus, electronic device, and storage medium, which can realize full automation of replacement of Dummy wafers of a furnace tube machine and an etching machine in a chip manufacturing process.
In a first aspect, an embodiment of the present application provides a method for replacing a dummy wafer, applied to manufacturing execution system MES, the method including the steps of:
based on the set false sheet replacement notification interface, the target machine station reported by the machine station automation program EAP needs to replace the old false sheet;
responding to the received notification that the target machine station reported by the machine station automation program EAP needs to replace the old fake piece, and establishing fake piece replacement information;
and issuing a conveying task for replacing the fake sheet to the target machine based on the established fake sheet replacement information.
In some embodiments, the establishing the dummy replacement information in response to the received notification that the target machine needs to replace the old dummy, which is reported by the machine automation program EAP, includes the following steps:
based on the received notification that the target machine station needs to replace the old fake sheet, which is reported by the machine station automation program EAP, acquiring the unique identification information of the old fake sheet which needs to be replaced and the unique identification information of the target machine station;
determining the production type of the target machine according to the obtained unique identification information of the target machine; the production type of the target machine comprises a furnace tube machine and an etching machine;
based on the obtained unique identification information of the old fake sheet and the determined production type of the target machine, setting up fake sheet replacement information; if the production type of the target machine is a furnace tube machine, establishing first fake sheet replacement information; and if the production type of the target machine is the etching machine, establishing second dummy replacement information.
In some embodiments, the second dummy replacement information established further includes automation type information of the etching tool; wherein, the automation type of the etching machine comprises semi-automation and full automation.
In some embodiments, the delivering the task of replacing the dummy wafer to the target platform based on the created dummy wafer replacement information includes the following steps:
issuing a first conveying task for replacing the false sheet to a furnace tube machine based on the established first false sheet replacement information;
or issuing a second conveying task for replacing the dummy wafer to the etching machine based on the established second dummy wafer replacement information.
In some embodiments, the issuing the first conveying task of replacing the dummy wafer to the furnace tube machine based on the established first dummy wafer replacement information includes the following steps:
determining the number of old dummy pieces to be replaced based on the established first dummy piece replacement information, and setting the replacement sequence of the old dummy pieces;
and generating a first conveying task of conveying the front-opening wafer conveying boxes filled with new dummy wafers into the furnace tube machine one by one according to the set replacement sequence of the old dummy wafers, and sending the first conveying task to the furnace tube machine so as to drive the furnace tube machine to replace the corresponding old dummy wafers.
In some embodiments, the issuing the second conveying task of replacing the dummy wafer to the etching machine based on the established second dummy wafer replacement information includes the following steps:
determining the automation type of the etching machine based on the established second dummy wafer replacement information;
if the etching machine is full-automatic, generating a second conveying task of conveying the front-opening wafer conveying box with the new dummy wafers into the etching machine and sending the second conveying task to the etching machine so as to drive the furnace tube machine to replace the corresponding old dummy wafers;
if the etching machine is semi-automatic, an empty front opening wafer transfer box is sent into the etching machine, then the front opening wafer transfer box with the new dummy wafer is sent into a second conveying task of the etching machine and sent down to the etching machine, so that the furnace tube machine is driven to send out the old dummy wafer through the empty front opening wafer transfer box, and then the new dummy wafer is filled.
In some embodiments, the second transport task further includes instructions to lock the empty front opening unified pods.
In a second aspect, an embodiment of the present application provides a dummy wafer replacement apparatus applied to a manufacturing execution system MES, the apparatus including:
the receiving module is used for receiving a notification that the target machine station reported by the machine station automation program EAP needs to replace the old fake piece based on the set fake piece replacement notification interface;
the establishing module is used for responding to the received notification that the target machine station reported by the machine station automation program EAP needs to replace the old fake piece and establishing fake piece replacement information;
and the issuing module is used for issuing a conveying task for replacing the fake sheet to the target machine station based on the established fake sheet replacement information.
In a third aspect, an embodiment of the present application provides an electronic device, including a processor, a memory, and a bus, where the memory stores machine-readable instructions executable by the processor, where the processor and the memory communicate through the bus when the electronic device is running, and where the machine-readable instructions, when executed by the processor, perform the steps of the method for replacing a dummy slice as described in any one of the above.
In a fourth aspect, embodiments of the present application provide a computer readable storage medium having a computer program stored thereon, where the computer program when executed by a processor performs the steps of any of the above-described method for changing a dummy slice.
The false sheet replacing method, the device, the electronic equipment and the storage medium are applied to a Manufacturing Execution System (MES), wherein based on a set false sheet replacing notification interface, a target machine station reported by a machine station automation program (EAP) needs to replace old false sheets; responding to the received notification that the target machine station reported by the machine station automation program EAP needs to replace the old fake piece, and establishing fake piece replacement information; based on the established false sheet replacement information, issuing a matched conveying task for replacing the false sheet to the target machine; therefore, full automation of replacement of Dummy Wafer of the furnace tube machine and the etching machine in the chip manufacturing process is realized, and the chip manufacturing efficiency and quality are improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered limiting the scope, and that other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 shows a flow chart of a method for changing a dummy wafer according to an embodiment of the present application;
FIG. 2 is a schematic diagram of a manufacturing execution system MES according to embodiments of the present application;
FIG. 3 illustrates a flow chart for establishing dummy replacement information according to an embodiment of the present application;
FIG. 4 is a block diagram showing a structure of a dummy wafer replacement device according to an embodiment of the present application;
fig. 5 shows a block diagram of an electronic device according to an embodiment of the present application.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present application more clear, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application, and it should be understood that the accompanying drawings in the present application are only for the purpose of illustration and description, and are not intended to limit the protection scope of the present application. In addition, it should be understood that the schematic drawings are not drawn to scale. A flowchart, as used in this application, illustrates operations implemented according to some embodiments of the present application. It should be understood that the operations of the flow diagrams may be implemented out of order and that steps without logical context may be performed in reverse order or concurrently. Moreover, one or more other operations may be added to the flow diagrams and one or more operations may be removed from the flow diagrams as directed by those skilled in the art.
In addition, the described embodiments are only some, but not all, of the embodiments of the present application. The components of the embodiments of the present application, which are generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present application, as provided in the accompanying drawings, is not intended to limit the scope of the application, as claimed, but is merely representative of selected embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present application without making any inventive effort, are intended to be within the scope of the present application.
It should be noted that the term "comprising" will be used in the embodiments of the present application to indicate the presence of the features stated hereinafter, but not to exclude the addition of other features.
In view of the technical problems set forth in the background art, the application provides a Dummy Wafer replacement method, a device, electronic equipment and a storage medium, which can realize full automation of replacement of Dummy wafers of a furnace tube machine and an etching machine in the chip manufacturing process so as to improve the efficiency and quality of chip manufacturing.
Referring to fig. 1 of the specification, the method for replacing a dummy wafer provided in the present application is applied to manufacturing execution system MES, and includes the following steps:
s1, based on a set false sheet replacement notification interface, a target machine station reported by a machine station automation program EAP needs to replace a false sheet;
in this embodiment of the present application, the architecture schematic diagram of the manufacturing execution system (Manufacturing execution system, abbreviated as MES) may refer to fig. 2 of the specification, where the MES can help an enterprise to implement production plan management, production process control, product quality management, shop inventory management, project bulletin board management, etc., so as to improve the manufacturing execution capability of the enterprise. The system is mainly oriented to an enterprise production and manufacturing layer, can rapidly realize the issuing of a production plan and the execution of a monitoring production plan, and is defined as an inter-vehicle layer oriented management information system between an upper-layer plan management system and an underlying industrial control. The method provides planned execution, tracking and current states of all resources (people, equipment, materials, customer demands and the like) for operators/managers, and aims to solve the black box problem of the factory production process and realize visualization and controllability of the production process. The MES can monitor the running state of the bottom equipment in real time, collect the state data of the equipment and the instrument, and trigger a new event through analysis, calculation and processing, so that a control system and an information system are conveniently and reliably connected together, and the production condition is timely fed back to a planning layer.
In step S1, in order to realize full automation of Dummy Wafer replacement of the furnace platen and the etching platen during the chip manufacturing process, a Dummy Wafer replacement notification interface (Dummy Exchange Notice interface) is added to the MES to receive notification that the target platen reported by the platen automation program EAP needs to replace the old Dummy Wafer. The machine automation program (Equipment Automation Program, EAP for short) is interposed between the MES and the devices, and is used for several aspects such as device information transmission, data collection and uploading, flow control, exception capturing, interaction with the MES, etc. Specifically, in this application, the EAP is configured to receive information of the old dummy wafer to be replaced, which is reported by the target machine, and then invoke the dummy wafer replacement notification interface, and further report the received information of the old dummy wafer to the MES, so that the MES issues and monitors execution of the production plan (replacement of the old dummy wafer).
S2, responding to a received notification that the target machine station reported by the machine station automation program EAP needs to replace an old fake piece, and establishing fake piece replacement information;
in the present application, the target machine refers to a furnace tube machine and an etching machine for chip manufacturing, and specifically refers to a furnace tube machine and an etching machine with old chip replacement requirements. In an embodiment, referring to fig. 3 of the specification, the establishing the dummy replacement information in response to the received notification that the target machine needs to replace the old dummy, which is reported by the machine automation program EAP, includes the following steps:
s201, acquiring unique identification information of an old fake sheet required to be replaced and unique identification information of the target machine based on a received notification that the old fake sheet is required to be replaced of the target machine reported by the machine automation program EAP;
s202, determining the production type of the target machine according to the acquired unique identification information of the target machine; the production type of the target machine comprises a furnace tube machine and an etching machine;
s203, establishing false sheet replacement information based on the acquired unique identification information of the old false sheet and the determined production type of the target machine; if the production type of the target machine is a furnace tube machine, establishing first fake sheet replacement information; and if the production type of the target machine is the etching machine, establishing second dummy replacement information.
In steps S201 to S203, through the notification that the target machine station reported by the EAP needs to replace the old dummy wafer, it can immediately determine which old dummy wafer of which machine station needs to be replaced, and determine the machine station type that needs to replace the old dummy wafer. The type of the machine to be replaced with the old dummy wafer is determined because the dummy wafer replacing modes of the furnace machine and the etching machine are different, wherein the furnace machine is exemplified by Furance, the number of the old dummy wafers to be replaced each time can be multiple, the old dummy wafers can be divided into SideDummy (edge filled) and FillDummy (middle filled), and the Furance of an old dummy wafer can be dispatched into Furance through a front-opening wafer conveying box with a new dummy wafer, so that the replacement is completed in one step;
the etching machine only has one replaced old dummy wafer (no edge filling and middle filling) each time, and the etching machine has two modes according to the degree of automation (semi-automation and full automation) when the old dummy wafer is replaced, wherein the full-automatic etching machine is used for replacing the old dummy wafer, as in Furance, the etching machine can be completely replaced in one step by dispatching the front opening wafer conveying box with the new dummy wafer into the etching machine; for the semi-automatic etching machine, when the old dummy wafer is replaced, two steps are needed, the dummy wafer in the etching machine is firstly connected through the empty front opening wafer conveying box, and then the front opening wafer conveying box with the new dummy wafer is used for dispatching and filling the etching machine.
Thus, after determining which old dummy wafer of which machine station needs to be replaced, a piece of detailed information that the old dummy wafer corresponding to one machine station needs to be replaced is recorded, so that the MES is responsible for preparing the new dummy wafer, generating a conveying task for replacing the old dummy wafer, and then completing the record.
S3, issuing a conveying task for replacing the fake sheet to the target machine station based on the established fake sheet replacement information.
In step S3, according to the description of step S2, since the types of the target machines are different, the task of conveying the replacement dummy wafer generated and issued to the target machines is also different. In the embodiment, a first conveying task for replacing the dummy wafer is issued to the furnace tube machine based on the established first dummy wafer replacement information; or, for the etching machine, issuing a second conveying task for replacing the dummy wafer to the etching machine based on the established second dummy wafer replacement information.
When the first conveying task is generated, firstly, the number of old dummy wafers needing to be replaced of the furnace tube machine is determined according to first dummy wafer replacement information, and if a plurality of old dummy wafers needing to be replaced exist, the sequence of the old dummy wafers needing to be replaced is set, because the MES utilizes a full-automatic production flow queue structure, only one front-opening wafer conveying box with new dummy wafers can be controlled to be conveyed into the furnace tube machine at one time. The setting of the replacement sequence of the old dummy strip can be set according to the default sequence of side-middle-side, or can be set manually by an engineer, and the setting mode of the replacement sequence of the old dummy strip is not limited and fixed. After a first conveying task is generated, the first conveying task is issued to a corresponding furnace tube machine according to the unique identifier of the equipment, and meanwhile, the furnace tube machine is controlled to start a replacement function after a front open wafer conveying box with a new dummy wafer is fed in, so that the corresponding old dummy wafer is replaced;
when a second conveying task is generated, firstly determining the automatic type information of the etching machine according to the second dummy wafer replacement information, if the etching machine is full-automatic, generating a second conveying task of conveying a front opening wafer conveying box with a new dummy wafer into the etching machine, issuing a corresponding etching machine, and simultaneously controlling the etching machine to start a replacement function after the front opening wafer conveying box with the new dummy wafer is conveyed into the etching machine, and replacing the corresponding old dummy wafer; if the etching machine is semi-automatic, the empty front opening wafer transfer box is firstly sent to the etching machine, then the front opening wafer transfer box with the new dummy wafer is sent to the second conveying task of the etching machine, the corresponding etching machine is issued, the etching machine is controlled to send the old dummy wafer out after the empty front opening wafer transfer box is sent to the etching machine, and after the front opening wafer transfer box with the new dummy wafer is sent to the etching machine, the new dummy wafer is filled to the position of the sent old dummy wafer.
In addition, when the second conveying task is issued, a certain empty front opening wafer transfer box needs to be reserved and locked, and the front opening wafer transfer box is not released until the old dummy wafer is converted, so that the reliability of replacing the dummy wafer by the machine is ensured.
According to the fake sheet replacement method, the fake sheet replacement notification interface is additionally arranged on the MES, and according to the production type and the automatic type information of the target machine, corresponding conveying tasks for replacing the fake sheet are generated for the furnace tube machine or the etching machine, so that full automation of replacement of the Dummy sheet of the furnace tube machine and the etching machine is realized in the chip manufacturing process, and the chip manufacturing efficiency is improved.
Based on the same inventive concept, the embodiment of the present application further provides a device for replacing a dummy sheet, and since the principle of solving the problem of the device in the embodiment of the present application is similar to that of the method for replacing a dummy sheet in the embodiment of the present application, the implementation of the device can refer to the implementation of the method for replacing a dummy sheet, and the repetition is not repeated.
Referring to fig. 4 of the drawings, in some embodiments, a dummy wafer replacement apparatus for use in manufacturing a manufacturing execution system MES, the apparatus comprising:
the receiving module 401 is configured to receive, based on the set false piece replacement notification interface, a notification that the target machine station reported by the machine station automation program EAP needs to replace an old false piece;
the establishing module 402 is configured to respond to a received notification that the target machine station reported by the machine automation program EAP needs to replace an old fake piece, and establish fake piece replacement information;
and the issuing module 403 is configured to issue a task of replacing the dummy to the target machine based on the created dummy replacement information.
In one embodiment, the establishing module 402 establishes the dummy replacement information in response to the received notification that the target machine needs to replace the old dummy, which is reported by the machine automation program EAP, and includes:
based on the received notification that the target machine station needs to replace the old fake sheet, which is reported by the machine station automation program EAP, acquiring the unique identification information of the old fake sheet which needs to be replaced and the unique identification information of the target machine station;
determining the production type of the target machine according to the obtained unique identification information of the target machine; the production type of the target machine comprises a furnace tube machine and an etching machine;
based on the obtained unique identification information of the old fake sheet and the determined production type of the target machine, setting up fake sheet replacement information; if the production type of the target machine is a furnace tube machine, establishing first fake sheet replacement information; and if the production type of the target machine is the etching machine, establishing second dummy replacement information.
In an embodiment, the established second dummy replacement information further includes automation type information of the etching machine; wherein, the automation type of the etching machine comprises semi-automation and full automation.
In an embodiment, the issuing module 403 issues a task of replacing the dummy wafer to the target platform based on the created dummy wafer replacement information, including:
issuing a first conveying task for replacing the false sheet to a furnace tube machine based on the established first false sheet replacement information; determining the number of old dummy pieces to be replaced based on the established first dummy piece replacement information, and setting the replacement sequence of the old dummy pieces; generating a first conveying task of conveying front-opening wafer conveying boxes filled with new dummy wafers into a furnace tube machine table one by one according to a set replacement sequence of the old dummy wafers, and sending the first conveying task to the furnace tube machine table so as to drive the furnace tube machine table to replace the corresponding old dummy wafers;
or issuing a second conveying task for replacing the dummy wafer to the etching machine based on the established second dummy wafer replacement information; determining the automation type of the etching machine based on the established second dummy wafer replacement information; if the etching machine is full-automatic, generating a second conveying task of conveying the front-opening wafer conveying box with the new dummy wafers into the etching machine and sending the second conveying task to the etching machine so as to drive the furnace tube machine to replace the corresponding old dummy wafers; if the etching machine is semi-automatic, an empty front opening wafer transfer box is sent into the etching machine, then the front opening wafer transfer box with the new dummy wafer is sent into a second conveying task of the etching machine and sent down to the etching machine, so that the furnace tube machine is driven to send out the old dummy wafer through the empty front opening wafer transfer box, and then the new dummy wafer is filled.
In one embodiment, the second transport task further includes instructions to lock the empty front opening unified pods.
The false sheet replacing device is applied to a manufacturing execution system MES, and a receiving module is used for receiving a notification that a target machine station reported by a machine station automation program EAP needs to replace an old false sheet based on a set false sheet replacing notification interface; the establishing module responds to the received notification that the target machine station reported by the machine station automation program EAP needs to replace the old fake piece, and the fake piece replacement information is established; issuing a matched dummy replacement conveying task to the target machine station based on the created dummy replacement information through an issuing module; therefore, the full automation of the replacement of Dummy Wafer of the furnace tube machine and the etching machine in the chip manufacturing process is realized, and the labor of engineers is reduced.
Based on the same concept of the present invention, as shown in fig. 5 of the present application, an electronic device 500 according to an embodiment of the present application is provided, where the electronic device 500 includes: at least one processor 501, at least one network interface 504 or other user interface 503, memory 505, at least one communication bus 502. The communication bus 502 is used to enable connected communications between these components. The electronic device 500 optionally includes a user interface 503 including a display (e.g., a touch screen, LCD, CRT, holographic imaging (Holographic) or projection (Projector), etc.), a keyboard or pointing device (e.g., a mouse, trackball, touch pad or touch screen, etc.).
In some implementations, the memory 505 stores elements that may protect modules or data structures, or a subset thereof, or an extended set thereof:
an operating system 5051 containing various system programs for implementing various basic services and handling hardware-based tasks;
the application module 5052 includes various application programs such as a desktop (desktop), a Media Player (Media Player), a Browser (Browser), etc., for implementing various application services.
In the embodiment of the present application, the processor 501 is configured to execute steps in a Dummy Wafer replacement method, for example, by calling a program or instructions stored in the memory 505, so as to implement full automation of replacement of Dummy wafers of the furnace tube machine and the etching machine in the chip manufacturing process.
The present application also provides a computer readable storage medium having stored thereon a computer program which, when executed by a processor, performs steps as in a method of changing a dummy slice.
Specifically, the storage medium can be a general-purpose storage medium, such as a removable disk, a hard disk, or the like, on which a computer program can be executed to perform the above-described dummy replacement method.
In the embodiments provided in the present application, it should be understood that the disclosed apparatus and method may be implemented in other manners. The above-described apparatus embodiments are merely illustrative, for example, the division of units is merely a logical function division, and there may be other manners of division in actual implementation, and for example, multiple units or components may be combined or integrated into another system, or some features may be omitted, or not performed. Alternatively, the coupling or direct coupling or communication connection shown or discussed with each other may be through some communication interface, device or unit indirect coupling or communication connection, which may be in electrical, mechanical or other form.
The units described as separate units may or may not be physically separate, and units shown as units may or may not be physical units, may be located in one place, or may be distributed over a plurality of network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.
In addition, each functional unit in the embodiments provided in the present application may be integrated in one processing unit, or each unit may exist alone physically, or two or more units may be integrated in one unit.
The functions, if implemented in the form of software functional units and sold or used as a stand-alone product, may be stored in a computer-readable storage medium. Based on such understanding, the technical solution of the present application may be embodied essentially or in a part contributing to the prior art or in a part of the technical solution, in the form of a software product stored in a storage medium, including several instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the methods of the embodiments of the present application. And the aforementioned storage medium includes: a U-disk, a removable hard disk, a Read-Only Memory (ROM), a random access Memory (RAM, random Access Memory), a magnetic disk, or an optical disk, or other various media capable of storing program codes.
Finally, it should be noted that: the foregoing examples are merely illustrative of specific embodiments of the present application, and are not intended to limit the scope of the present application, although the present application is described in detail with reference to the foregoing examples, it will be understood by those skilled in the art that: any person skilled in the art may modify or easily conceive of the technical solution described in the foregoing embodiments, or make equivalent substitutions for some of the technical features within the technical scope of the disclosure of the present application; such modifications, changes or substitutions do not depart from the spirit and scope of the corresponding technical solutions. Are intended to be encompassed within the scope of this application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (10)
1. A method for replacing a dummy wafer, for use in manufacturing a manufacturing execution system MES, the method comprising the steps of:
based on the set false sheet replacement notification interface, the target machine station reported by the machine station automation program EAP needs to replace the old false sheet;
responding to the received notification that the target machine station reported by the machine station automation program EAP needs to replace the old fake piece, and establishing fake piece replacement information;
and issuing a conveying task for replacing the fake sheet to the target machine based on the established fake sheet replacement information.
2. The method for replacing a dummy strip according to claim 1, wherein the step of establishing dummy strip replacement information in response to the received notification that the target machine station reported by the machine automation program EAP needs to replace the old dummy strip comprises the steps of:
based on the received notification that the target machine station needs to replace the old fake sheet, which is reported by the machine station automation program EAP, acquiring the unique identification information of the old fake sheet which needs to be replaced and the unique identification information of the target machine station;
determining the production type of the target machine according to the obtained unique identification information of the target machine; the production type of the target machine comprises a furnace tube machine and an etching machine;
based on the obtained unique identification information of the old fake sheet and the determined production type of the target machine, setting up fake sheet replacement information; if the production type of the target machine is a furnace tube machine, establishing first fake sheet replacement information; and if the production type of the target machine is the etching machine, establishing second dummy replacement information.
3. The method according to claim 2, wherein the second dummy replacement information is further established to include automation type information of the etching machine; wherein, the automation type of the etching machine comprises semi-automation and full automation.
4. A method for replacing a dummy strip according to claim 3, wherein the delivering a dummy strip replacement delivery task to the target machine based on the created dummy strip replacement information comprises the steps of:
issuing a first conveying task for replacing the false sheet to a furnace tube machine based on the established first false sheet replacement information;
or issuing a second conveying task for replacing the dummy wafer to the etching machine based on the established second dummy wafer replacement information.
5. The method for replacing a dummy strip according to claim 4, wherein the step of issuing a first transport task for replacing a dummy strip to the furnace tube machine based on the established first dummy strip replacement information comprises the steps of:
determining the number of old dummy pieces to be replaced based on the established first dummy piece replacement information, and setting the replacement sequence of the old dummy pieces;
and generating a first conveying task of conveying the front-opening wafer conveying boxes filled with new dummy wafers into the furnace tube machine one by one according to the set replacement sequence of the old dummy wafers, and sending the first conveying task to the furnace tube machine so as to drive the furnace tube machine to replace the corresponding old dummy wafers.
6. The method for replacing a dummy wafer according to claim 5, wherein the step of issuing a second conveyance task for replacing a dummy wafer to the etching machine based on the established second dummy wafer replacement information comprises the steps of:
determining the automation type of the etching machine based on the established second dummy wafer replacement information;
if the etching machine is full-automatic, generating a second conveying task of conveying the front-opening wafer conveying box with the new dummy wafers into the etching machine and sending the second conveying task to the etching machine so as to drive the furnace tube machine to replace the corresponding old dummy wafers;
if the etching machine is semi-automatic, an empty front opening wafer transfer box is sent into the etching machine, then the front opening wafer transfer box with the new dummy wafer is sent into a second conveying task of the etching machine and sent down to the etching machine, so that the furnace tube machine is driven to send out the old dummy wafer through the empty front opening wafer transfer box, and then the new dummy wafer is filled.
7. The method of claim 6, wherein the second transport task further comprises an instruction to lock an empty front opening unified pod.
8. A dummy wafer replacement apparatus for use in a manufacturing execution system MES, the apparatus comprising:
the receiving module is used for receiving a notification that the target machine station reported by the machine station automation program EAP needs to replace the old fake piece based on the set fake piece replacement notification interface;
the establishing module is used for responding to the received notification that the target machine station reported by the machine station automation program EAP needs to replace the old fake piece and establishing fake piece replacement information;
and the issuing module is used for issuing a conveying task for replacing the fake sheet to the target machine station based on the established fake sheet replacement information.
9. An electronic device comprising a processor, a memory and a bus, the memory storing machine-readable instructions executable by the processor, the processor and the memory in communication over the bus when the electronic device is in operation, the machine-readable instructions when executed by the processor performing the steps of the method for changing a dummy slice of any one of claims 1 to 7.
10. A computer-readable storage medium, characterized by: the computer readable storage medium has stored thereon a computer program which, when executed by a processor, performs the steps of the method for changing a dummy wafer according to any one of claims 1 to 7.
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| CN202310166796.7A CN116153831B (en) | 2023-02-24 | 2023-02-24 | Fake sheet replacing method and device, electronic equipment and storage medium |
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| CN202310166796.7A CN116153831B (en) | 2023-02-24 | 2023-02-24 | Fake sheet replacing method and device, electronic equipment and storage medium |
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| JPH04206714A (en) * | 1990-11-30 | 1992-07-28 | Shinko Electric Co Ltd | Surface treatment apparatus |
| KR20010039342A (en) * | 1999-10-30 | 2001-05-15 | 박종섭 | Method for preventing error of auto guide vehicle when exchanging side dummy wafer in high temperature process |
| CN111933541A (en) * | 2020-08-10 | 2020-11-13 | 北京北方华创微电子装备有限公司 | Method and system for processing wafer in semiconductor equipment |
| CN112349616A (en) * | 2019-08-09 | 2021-02-09 | 长鑫存储技术有限公司 | Automatic control wafer replacing system and automatic control wafer replacing method |
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2023
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04206714A (en) * | 1990-11-30 | 1992-07-28 | Shinko Electric Co Ltd | Surface treatment apparatus |
| KR20010039342A (en) * | 1999-10-30 | 2001-05-15 | 박종섭 | Method for preventing error of auto guide vehicle when exchanging side dummy wafer in high temperature process |
| CN112349616A (en) * | 2019-08-09 | 2021-02-09 | 长鑫存储技术有限公司 | Automatic control wafer replacing system and automatic control wafer replacing method |
| CN111933541A (en) * | 2020-08-10 | 2020-11-13 | 北京北方华创微电子装备有限公司 | Method and system for processing wafer in semiconductor equipment |
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