TW510009B - Machine monitoring method and system for manufacturing of integrated circuit - Google Patents

Machine monitoring method and system for manufacturing of integrated circuit Download PDF

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Publication number
TW510009B
TW510009B TW90126658A TW90126658A TW510009B TW 510009 B TW510009 B TW 510009B TW 90126658 A TW90126658 A TW 90126658A TW 90126658 A TW90126658 A TW 90126658A TW 510009 B TW510009 B TW 510009B
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Taiwan
Prior art keywords
machine
integrated circuit
scope
event
patent application
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TW90126658A
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Chinese (zh)
Inventor
Jung-Shin Chen
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Winbond Electronics Corp
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Priority to TW90126658A priority Critical patent/TW510009B/en
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Publication of TW510009B publication Critical patent/TW510009B/en

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  • Management, Administration, Business Operations System, And Electronic Commerce (AREA)

Abstract

A machine monitoring method and its system for manufacturing of integrated circuit are provided, which employs the replay for the machine event to obtain the problems occurred in the wafer manufacturing process. By downloading the machine event data from the database, the credit indices are determined and the control chart is established, so as to define the limited conditions, and execute the machine replay system with the graphic computer interface, thereby finding the abnormal problems for correction. This machine monitoring method for manufacturing of integrated circuit uses the establishment of the replay mode and credit indices for the machine history event to review the past credits, and uses the establishment of control charts and rule knowledge database for the credit indices of the machines to estimate the possible future problems.

Description

510009 A7 __B7_ 五、發明說明() 發明領域: 本發明係有關於一種積體電路製造廠中的監控方法與 系統,特別是有關於積體電路製造廠中機台事件的監控方 法,並可提供達到機台重演及問題反應之系統。 發明背景: 在積體電路製程中,為了提高晶圓的製造品質、降低 製造成本、縮短生產週期等目的,資訊管理系統整合自動 化的製造是現今積體電路廠所要研究的重要課題。一個完 整的電腦整合自動化系統大致包含了例如生產排程系統、 品質管理系統、監控系統、和自動化介面系統等等。由於 積體電路產品的不斷推陳出新,各個製造流程和細節也更 趨複雜,因此自動化系統中就必需有一個良好的生產排程 系統和管理系統;而為了元件的製造品質,更必需有一套 品質管理系統和監控系統加以控管。 請參照第1圖,第1圖所繪示係為一般積體電路部分 生產系統的連接示意圖。其中,在單一區域内的生產系統 之中,通常會有控制主機10,以控制與其相連的生產機台 12及生產機台14等之動作。控制主機10可與其他多個資 料主機1 6等利用網路相連結,以使控制主機1 〇可讀取資 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) (請先閲讀背面之注意事項再填寫本頁) 裝 經濟部智慧財產局員工消費合作社印製 510009 A: B7_ 五、發明說明() (請先閱讀背面之注意事項再填冩本頁) 料主機1 6之資料庫。資料庫中並内含有有關各個處理機台 的各項參數與操作資訊等,並藉由利用資料庫之資訊以轉 換由生產機台12及生產機台14送出至控制主機10之資 訊、或是由控制主機10傳送至生產機台12及生產機台14 之資訊及指令等。 一般積體電路廠的監控系統多係用來監控晶圓,以得 知晶圓經過製程製造後的結構與狀態,當這些偵測工作站 發現晶圓製造有問題時,操作人員才至資料主機1 6處調出 資料庫中的的報表資料,逐筆查詢對照後,才能找出問題 所在。這種監控方法不僅費時費力,而且由於人工搜尋難 免判斷有誤,無法完全確認問題所在。 經濟部智慧財產局員工消費合作社印製 另外,習知對於監控生產過程,多是經由讀取資料主 機1 6之資料庫中生產機台之事件比例、與產出量等結果, 以這些指標來做為生產機台的控管。但是,從上述之指標, 並無法瞭解生產機台12及生產機台14的實際製造晶圓的 過程。如果在實際製造晶圓的過程中有任何問題,這些問 題往往被隱藏起來,直到問題發生了,也已造成或大或小 的損失。 發明目的及概述: 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) 510009 經濟部智慧財產局員工消費合作社印製 A7 -—----- 五、發明說明() 鑒於上述之習知系統中,旅無適當的機台之監控方法 與系統,因此本發明係提供一禮積體電路製造之機台監控 方法,並可提供達到機台重演及問題反應之系統。 當機台進行晶圓批次之製造,本發明積體電路製造之 機台監控方法係用以監控機台事件之過程變化,本發明積 體電路製造之機台監控方法包栝··提供一資料庫;從資料 庫下載數個機台事件資料;利用上述之機台事件資料計算 機台之績效指標;利用上述之績效指標建立一管制圖;利 用機台事件資料、績效指標與管制圖建立一規則知識庫, 並定義數個限制,藉以發現一異常問題點;將上述之機台 事件資料依時間排序形成一事件曰曆檔;執行機台重演步 驟,以進行一矯正措施。 本發明積體電路製造之機台監控方法可僅利用來重演 機台之事件過程變化,或者利用自行定義的限制來發現異 常問題點’以進行矯正措施。本發明積體電路製造之機台 監控方法,其中上述之機台事件資料可包括:機台機況事 件、機台轉帳產出資料以及機台線上在製晶圓(Wafer in Process ; WIP)資料;而上述之績效指標可包括··機台產出 量(Move)、機台生產時間(Productive Time ; PT)、機台每 小時產出量(ΡΟΗ)、機台待料時間(Loss Time ; LT)、機台 製造的晶圓批次數(Batch)、線上在製晶圓的平均等候時間 4 本紙張尺度適用中國13冢標準(CNS)A4規格(21G χ 297公爱)510009 A7 __B7_ V. Description of the invention () Field of the invention: The present invention relates to a monitoring method and system in an integrated circuit manufacturing plant, in particular to a method for monitoring machine events in an integrated circuit manufacturing plant, and can provide Reach the system of machine replay and problem response. Background of the Invention: In the integrated circuit manufacturing process, in order to improve the manufacturing quality of wafers, reduce manufacturing costs, shorten production cycles, and other purposes, integrated and automated manufacturing of information management systems is an important subject to be studied by integrated circuit factories today. A complete computer integrated automation system roughly includes, for example, a production scheduling system, a quality management system, a monitoring system, and an automated interface system. Due to the continuous innovation of integrated circuit products, and the various manufacturing processes and details are becoming more complicated, a good production scheduling system and management system must be included in the automation system; and for the manufacturing quality of components, a set of quality management is more necessary. Systems and monitoring systems. Please refer to Figure 1, which shows the connection diagram of the general integrated circuit production system. Among them, in the production system in a single area, there is usually a control host 10 to control the operations of the production machine 12 and the production machine 14 connected thereto. The control host 10 can be connected to other data hosts 16 and other utilization networks, so that the control host 10 can read the capital paper. The size of the paper applies to the Chinese National Standard (CNS) A4 (210 X 297 mm) (please first Read the notes on the back and fill in this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs, printed 510009 A: B7_ V. Description of the invention () (Please read the notes on the back before filling this page) Material host 1 of 6 database. The database contains various parameters and operation information about each processing machine, and uses the information in the database to convert the information sent from the production machine 12 and the production machine 14 to the control host 10, or Information and instructions transmitted from the control host 10 to the production machine 12 and the production machine 14. The monitoring system of the general integrated circuit factory is mostly used to monitor the wafer to know the structure and status of the wafer after the manufacturing process. When these inspection stations find that there is a problem in the wafer manufacturing, the operator only goes to the data host 1 The report data in the database was retrieved at 6 locations, and the problem could be found only after querying and comparing one by one. This monitoring method is not only time-consuming and labor-intensive, but because of manual search it is inevitable that the judgment is erroneous and the problem cannot be fully identified. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. In addition, it is known that for monitoring the production process, most of the results are obtained by reading the results of the production machine in the database of the data host 16 and the output, etc. As the control of the production machine. However, from the above-mentioned indicators, it is impossible to understand the process of actually manufacturing wafers on the production machine 12 and the production machine 14. If there are any problems during the actual manufacturing of the wafers, these problems are often hidden until the problem occurs and has caused large or small losses. Purpose and summary of the invention: This paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 510009 Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 ------------- 5. Description of the invention () In the above-mentioned conventional system, there is no proper monitoring method and system for the machine. Therefore, the present invention provides a machine monitoring method for the manufacture of integrated circuit, and can provide a system to achieve machine replay and problem response. When the machine is used for wafer batch manufacturing, the machine monitoring method of integrated circuit manufacturing of the present invention is used to monitor the process change of machine events. The machine monitoring method of integrated circuit manufacturing of the present invention includes: Database; download several machine event data from the database; use the above machine event data computer performance indicators; use the above performance indicators to establish a control chart; use machine event data, performance indicators and control charts to establish a Rule knowledge base and define several restrictions to discover an abnormal problem point; sort the above machine event data in time to form an event calendar file; execute machine replay steps to perform a corrective action. The machine monitoring method for integrated circuit manufacturing of the present invention can only use the process change of the machine to replay the event, or use the self-defined limits to find abnormal problem points' for corrective measures. The machine monitoring method for integrated circuit manufacturing according to the present invention, wherein the machine event data mentioned above may include: machine machine condition events, machine transfer output data, and wafer online process (Wafer in Process; WIP) data ; And the above performance indicators may include: · machine output (Move), machine production time (PT), machine hourly output (P0Η), machine waiting time (Loss Time; LT), the number of wafers manufactured by the machine (Batch), and the average waiting time of wafers in process on the line 4 This paper size is applicable to China's 13-tsuka standard (CNS) A4 specification (21G x 297 public love)

510009 A7 B7 五、發明說明() (W)以及線上在製晶圓的等候線長度(L);另外,事件曰曆 檔可包括該些機台之機況變化、轉帳產出變化以及線上在 製晶圓變化。本發明積體電路製造之機台監控方法的較佳 實施例中,上述之管制圖係利用取2個月約6 〇筆資料,並 取3個標準差以做為管制界線。 另外’本發明積體電路製造之機台監控系統,係用以 監控生產機台之事件,其中生產機台係用以執行生產動作 以製造晶圓批次,本發明該積體電路製造之機台監控系統 包括:一控制主機,係用以控制生產機台;一資料主機, 係具有生產機台之數個操作參數,並紀錄生產設備之事件 與數個製程資料;-監控主機,可執行一機台監控流程, 以重演生產機台製造晶圓批次之事件。上述之機台監控流 程係為上述之本發明積體電路製造之機台監控方法。 本發月積體電路製造之機台監控方法與系統係針對檢 討過去績效與預測未來可能問題兩個方向來構建。其中, 係利用建立機台歷史之翁:當描# & + 丈之重肩模式與績效指標,來檢討過去 績效’·並利用建立機台的績效於 旧、頁双払標的管制圖與規則知識 經濟部智慧財產局員工消費合作社印製 庫’以預測未來可能問題。 圖式簡單說明: 5 510009 A7 __B7_ 五、發明說明() 本發明的較佳實施例將於往後之說明文字中辅以下列 圖形做更詳細的闡述,其中: 第1 意圖; 第2 不意圖, 第3 與系統之 第4 與系統之 第5 法,執行 第6 介面系統 第7 介面系統 (請先閱讀背面之注意事項再填寫本頁) 圖所繪示為一般積體電路部分生產系統的連接示 圖所繪示為本發明積體電路部分生產系統的連接 圖所繪示為本發明積體電路製造之機台監控方法 架構圖; 圖所繪示為本發明積體電路製造之機台監控方法 管制圖之電腦圖形介面系統; 圖所繪示為本發明積體電路製造之機台監控方 機台重演系統的電腦圖形介面系統之示意圖; 圖所繪示為本發明執行機台重演系統的電腦圖形 ,出現異常問題點之訊息視窗示意圖;以及 圖所繪示為本發明執行機台重演系統的電腦圖形 ,出現異常問題點之訊息視窗示意圖。 圖號對照說明 經濟部智慧財產局員工消費合作社印製 10 控制主機 12 生產機台 14 生產機台 16 資料主機 20 控制主機 22 生產機台 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公f ) 510009 __B7 五、發明說明() 經濟部智慧財產局員工消費合作社印製 24 生產機台 26 資料主機 28 監控主機 50 資料庫 52 下載機台事件資料 54 計算機台績效指標 56 建立管制圖 58 建立規則知識庫 60 建立事件曰曆檔 62 發現異常問題點 64 執行機台重演 66 執行矯正措施 70 實際趨勢線 72 上管制界線 74 下管制界線 76 中間線 78 平均值 80 標準差 82 當曰值 90 事件時間點 92 晶圓暫停狀態 94 機台事件 96 機台事件說明 98 晶圓批數 100 晶圓片數 102 機台產出量 104 晶圓等候線長度 106 機台製造之批次數 108 機台每小時產出量 110 機台生產時間 112 晶圓平均等候時間 114 速度調整 116 進入管制圖模式 118 跳至上一事件 120 跳至下一事件 122 連續播放事件 124 暫停/繼續之切換鍵 126 重複執行 128 結束程式 130 跳至上一問題點 132 跳至下一問題點 發明詳細說明: (請先閱讀背面之注意事項再填寫本頁) 裝 本紙張尺度適用中國國家標準(CNS)A4規格(210 x 297公釐) 510009 Λ7 B7 五、發明說明( 省知監控晶圓生產的方法與系統,不僅費時費力且容 易出錯,又無一種較良好的機台監控方法與系統,因此, 本發明的目的係提供一種積體電路製造之機台監控方法與 系統’利用機台事件之重演,以得知晶圓製造過程所發生 的問題’如第2圖所示。第2圖所繪示係為本發明積體電 路斗刀生產;r、統的連接示意圖。其中,在積體電路之生產 系統中,具有控制主機2〇,以控制與其相連的生產機台Η 及生產機台24等之動作,由於積體電路元件的不同,生產 機σ 22及生產機台24即可為各種不同的半導體製程處理 機台。控制主機20並與其他多個資料主機26等利用網路 相連釔,以使控制主機2 〇可讀取資料主機2 6之資料庫, 其内3有有關各個處理機台的各項參數與操作資訊等,並 错由利用資料庫之資訊以轉換由生產機台22及生產機台 -4送出至控制主機2〇之資訊、或是由控制主機2〇傳送至 生產機台22及生產機台24之資訊及指令等。本發明積體 電路製造之機台監控方法與系統係提供一監控主機28,使 監控主機28與資料主機26利用網路相連結,以使監控主 機28可下載資料主機26之資料庫中的機台資料,例如機 台處理晶圓的各種參數與數據,#進行各種統計運算,以 建立另一資料庫,做為機台製造晶圓的績效指標。 本發明積體電路製造之機台監控方法與系統之架構如 --------Γ ιιί---Μ--- (請先閱讀背面之注意事項再填寫本頁) · 經濟部智慧財產局員工消費合作社印製 Μ氏張尺度適用中國國家標各 X 297公釐) 510009 B7 五、發明說明( 第J圖所T μ參照第3圖,本發明積體電路製造之△ 監控方法與系統係由資料庫5〇中下載機台事件資料MY 接著將所獲得的基本資料,透過數學運 效指標一接著,再將上述之績效指標建立管:圖异= 者,進行建立規則知識冑58的步冑,係利用事先在電腦資 料庫内建立各種判斷規則,利用管制圖檢查以 = 轉 未來可能的問題。其中定義的違反規則狀況舉例如= 狀況1 :機台事件與實際線上在製晶圓的狀況不同,例如 機台事件顯示為待料,實際上卻有線上在製晶圓的存在; (2)狀況2:績效指標超出管制圖的管制界線;(3)狀況 連續數點績效指標在管制圖平均線的同一側;狀況4 : 績效指標有趨勢的傾向;(5)狀況5 ··各操作員的班別間, 存在績效指標之差異性;狀況6 :操作員未依規定 帳。 經 濟 部 智 慧 財 產 局 員 工 消 費 合 作 社 印 製 以上述違反規則的狀況,來發現異常問題點62。接著, 將機台的事件按時間軸排序,建立事件日曆檔60 ^再利用 執行機台重演64之步驟,以監控上述圖形介面化之事件日 曆檔。隨後,執行矯正措施66,對異常問題點進行再確認 步驟。 以下係利用一較佳實施例來對本發明積體電路製造之 機台監控方法與系統加以說明。請再參照第3圖,其中, 本紙張尺度適用中國國家標準(CNS)A4規格(21〇χ 297公t ) 510009 Α7 Β7 五、發明說明() 資料庫50係按時間順序,儲存積體電路廠中所有生產機台 的事件、轉帳產出量、以及例如在製品存貨等與線上在製 晶圓有關的資料。因此,本發明積體電路製造之機台監控 方法係由資料庫50來下載機台事件資料52,先輸入欲查 詢的時間區間’便可由資料庫5〇中下載機台事件資料52, 其中下载的事件資料可包括··機台狀況、機台轉帳產出資 料以及線上在製晶圓資料。 經濟部智慧財產局員工消費合作社印製 -----— — ΙΓΙ1.ΓΙ — --- (請先閱讀背面之注意事項再填寫本頁) 接著,進行計算機台績效指標54。利用上述從資料庫 5〇所下載的機台事件資料透過數學運算,計算各生產機台 的績效指標,其中可引用的績效指標有:機台產出量、機 台生產時間、機台每小時產出量、機台待料時間、機台製 造的晶圓批次數、線上在製晶圓的平均等候時間、以及線 上在製晶圓的等候線長度等。然後,建立管制圖56。係利 用上述β十异仔到的結果建立各績效指標之管制圖,並構建 一電腦圖形介面系統,如第4圖所示。其中,績效指標之 實際趨勢線70係應位於上管制界線72與下管制界線74之 間,且其平均值應不偏離於中間線76太多。另外在電腦圖 形介面上方係可顯示績效指標的平均值78、標準差8〇與 當日值82。本發明的管制圖定義參數係為取2個月約6〇 筆資料的資料長度,並取3個的標準差做為上管制界線72 與下管制界線7 4的定義。上述建立管制圖之步驟係為熟悉 此技藝者所知之管制圖建立方法,此步驟並非本發明之重 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公爱) 510009 經濟部智慧財產局員工消費合作社印製 Λ7 五、發明說明() 點所在,故不在此贅述。 接著’建立規則知識庫58。當資料庫5〇、下載機台事 件資料5 2與计算機台績效指標5 4的資料彙整後,在電腦 資料庫内建立各種判斷規則,以電腦輔助判斷晶圓製造 時,是否發現異常問題點62。其中,本發明積體電路製造 之機台監控方法所定義的違反規則的狀況如下: (1) 狀況1 · A.線上在製晶圓大於4批,並且線上在製 晶圓大於96片;b.機台事件為待料,但待料時間超過1〇 分鐘以上。 (2) 狀況2 :績效指標超過第* _ ^ 〜、弟4圖之官制圖中上管制界 線72與下管制界線74,亦即韶讲λ ^ j卩超過J個標準差之管制界限。 (3) 狀況3:在第4圖之營舍 固制圖中,連續5點及5點以 上的績效指標位於中間線76的同一側。 (4 )狀況4 · A ·以統計回歸計篡鱼 ? t异連續5點績效指標之表 之相關係數R,若R大於或等於Λ 寸% υ·85,或R小於_〇·85,即 視為有趨勢性。Β.連續5點的績效指標上升、或連續5點 的績效指標下降。 ” (5)狀況5:本發明積體電路製造之機台監控方法中, 現有4個操作之班別,分別為a、b、c、d班。其中a、c 為日班,B、D為仗班,A、B班為同一510009 A7 B7 V. Description of the invention () (W) and the length of the waiting line (L) for wafers on the line; In addition, the event calendar can include changes in the conditions of these machines, changes in transfer output, and online availability Manufacturing wafer changes. In a preferred embodiment of the machine monitoring method for integrated circuit manufacturing according to the present invention, the above-mentioned control chart is obtained by taking about 60 data of 2 months, and taking 3 standard deviations as the control boundary. In addition, the machine monitoring system of the integrated circuit manufacturing of the present invention is used to monitor the events of the production machine, wherein the production machine is used to perform production actions to manufacture wafer batches. The machine of the integrated circuit manufacturing of the present invention The monitoring system includes: a control host, which is used to control the production machine; a data host, which has several operating parameters of the production machine, and records the events of the production equipment and several process data;-the monitoring host, which can be executed A machine monitoring process to repeat the events of wafer batches produced by the production machine. The above-mentioned machine monitoring process is the above-mentioned machine monitoring method for manufacturing integrated circuits of the present invention. The machine monitoring method and system of this month's integrated circuit manufacturing are built for reviewing past performance and predicting possible future problems. Among them, it is the use of the history of the establishment of the machine: Dangshou # & + heavy duty model and performance indicators to review the past performance 'and the use of the performance of the machine to the old and the double-targeted control charts and rules The Intellectual Property Bureau of the Intellectual Property Bureau of the Ministry of Knowledge Economy printed a library of employees' cooperatives to predict possible future problems. Brief description of the drawings: 5 510009 A7 __B7_ V. Description of the invention () The preferred embodiment of the present invention will be described in more detail in the following explanatory text with the following figures, where: 1st intention; 2nd intention 3rd, 4th and 5th method of the system, implement the 6th interface system, 7th interface system (please read the precautions on the back before filling this page) The picture shows the general production system of the integrated circuit part The connection diagram shows the connection diagram of the integrated circuit part production system of the present invention. The diagram shows the structure monitoring method of the integrated circuit manufacturing machine of the present invention. The figure shows the integrated circuit manufacturing machine of the present invention. Computer graphics interface system for monitoring method control diagram; The figure shows a schematic diagram of the computer graphics interface system of the machine monitoring side machine replay system of the integrated circuit manufacturing of the present invention; the picture shows the machine replay system of the execution machine of the present invention Computer graphics, a schematic diagram of a message window showing an abnormal problem; and the figure shows a computer graphics of the execution system of the machine replay system of the present invention, a message showing an abnormal problem Schematic window. Drawing number comparison description Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 10 Control host 12 Production machine 14 Production machine 16 Data host 20 Control host 22 Production machine This paper size applies Chinese National Standard (CNS) A4 specifications (210 X 297 Public f) 510009 __B7 V. Description of the invention () Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs, printed by the Consumer Cooperatives 24 Production machines 26 Data hosts 28 Monitoring hosts 50 Databases 52 Download machine event data 54 Computer performance indicators 56 Establish control charts 58 Establish rule knowledge base 60 Establish event calendar 62 Find abnormal problems 64 Perform machine replay 66 Implement corrective measures 70 Actual trend line 72 Upper regulatory boundary 74 Lower regulatory boundary 76 Middle line 78 Mean 80 Standard deviation 82 Current value 90 Event time point 92 Wafer pause state 94 Machine event 96 Machine event description 98 wafer batches 100 wafers 102 machine output 104 wafer waiting line length 106 machine batches 108 machine each Hourly output 110 Machine production time 112 Average wafer waiting time 114 Speed adjustment 116 Enter the control chart mode 118 Skip to the previous event 120 Skip to the next event 122 Continuously play the event 124 Pause / Resume key 126 Repeat the execution 128 End the program 130 Skip to the previous problem point 132 Skip to the next problem point Detailed description of the invention: ( Please read the notes on the back before filling this page) The paper size of this paper is applicable to the Chinese National Standard (CNS) A4 (210 x 297 mm) 510009 Λ7 B7 V. Description of the invention (Provincial methods and systems for monitoring wafer production Not only is time-consuming, labor-intensive and error-prone, but there is no better method and system for machine monitoring. Therefore, the object of the present invention is to provide a machine monitoring method and system for integrated circuit manufacturing. It is learned that the problems occurring in the wafer manufacturing process are shown in FIG. 2. The drawing shown in FIG. 2 is the production of the integrated circuit bucket knife of the present invention; the schematic diagram of the connection of r and system. Among them, the production of integrated circuit In the system, there is a control host 20 to control the operations of the production machine Η and production machine 24 connected to it. Due to the difference of integrated circuit components, production The machine σ 22 and the production machine 24 can be various semiconductor process processing machines. The control host 20 is connected to other data hosts 26 and other networks using yttrium so that the control host 2 can read the data host 2 The database of 6 includes various parameters and operation information about each processing machine, and the information in the database is used to convert the data from the production machine 22 and the production machine-4 to the control host 2. Information, or information and instructions transmitted from the control host 20 to the production machine 22 and the production machine 24. The machine monitoring method and system for integrated circuit manufacturing of the present invention provide a monitoring host 28, so that the monitoring host 28 and the data host 26 are connected using a network, so that the monitoring host 28 can download the machines in the database of the data host 26 Data, such as various parameters and data of the wafer processed by the machine, # various statistical operations are performed to establish another database as a performance indicator of the wafer manufactured by the machine. The machine monitoring method and system structure of the integrated circuit manufacturing of the present invention is as follows: ---- Γ ιιί --- M --- (Please read the precautions on the back before filling this page) The M-sheet scale printed by the employee's consumer cooperative of the Property Bureau is applicable to the Chinese national standard X 297 mm) 510009 B7 V. Description of the invention (Figure J, T μ Refer to Figure 3, the △ monitoring method and method for manufacturing integrated circuits of the present invention and The system downloads the machine event data MY from the database 50. Then the basic data obtained is followed by mathematical operation performance indicators, and then the above performance indicators are established and managed: if the figure is different, the rule knowledge is established. 58 The steps are based on the establishment of various judgment rules in the computer database in advance, and the use of control charts to check for possible future problems. The defined rule violations include, for example, Condition 1: Machine incidents and actual online production of crystals The status of the circle is different, for example, the machine event is displayed as waiting, but the existence of the wafer in process is actually on the line; (2) Condition 2: The performance index exceeds the control boundary of the control chart; (3) The status continuous number of performance indicators In tube The same side of the average line of the graph; Condition 4: The trend of performance indicators has a tendency; (5) Condition 5 · There are differences in performance indicators between the classes of each operator; Condition 6: The operator does not account according to the regulations. Economy The Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Justice printed the above-mentioned violation of the rules to find the abnormal problem points 62. Then, the events of the machine are sorted according to the time axis, and an event calendar file 60 is created. In order to monitor the event calendar file with the above graphical interface. Subsequently, corrective action 66 is performed to re-confirm the abnormal problem points. The following is a preferred embodiment of the method and system for monitoring the integrated circuit manufacturing machine of the present invention Please refer to Figure 3 again, in which the paper size applies the Chinese National Standard (CNS) A4 specification (21〇χ297297t) 510009 Α7 Β7 5. Description of the invention () The database 50 is stored in chronological order. Incidents of all production machines in the integrated circuit factory, transfer output volume, and data related to wafers in process, such as work in process inventory. The machine monitoring method for integrated circuit manufacturing of the present invention is to download machine event data 52 from the database 50. Enter the time interval to be inquired first, and then the machine event data 52 can be downloaded from the database 50. The event data can include: · machine status, machine transfer output data, and online wafer data. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs -------ΙΓΙ1.ΓΙ — --- (Please First read the notes on the back and then fill out this page) Then, perform the computer performance indicator 54. Use the machine event data downloaded from the database 50 above to calculate the performance indicators of each production machine through mathematical operations, which can be cited The performance indicators are: machine output, machine production time, machine hourly output, machine waiting time, wafer batches manufactured by the machine, average waiting time for wafers in process online, and The waiting line length of the wafer on the line and so on. Then, the control map 56 is established. It is to use the results of the above-mentioned β ten strangers to establish a control chart of each performance index, and build a computer graphics interface system, as shown in Figure 4. Among them, the actual trend line 70 of the performance index should be located between the upper control line 72 and the lower control line 74, and the average value should not deviate too much from the middle line 76. In addition, the average value of the performance index 78, the standard deviation 80 and the current day value 82 can be displayed above the computer graphics interface. The definition parameter of the control chart of the present invention is to take the data length of about 60 pieces of data in 2 months, and take 3 standard deviations as the definition of the upper control boundary 72 and the lower control boundary 74. The above steps for establishing a control chart are the methods for establishing a control chart that are familiar to those skilled in the art. This step is not the heavyweight of the present invention. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 public love). Printed by the Consumer Cooperative of the Property Bureau Λ7 5. The description of the invention () is located here, so it will not be repeated here. Then, 'the rule knowledge base 58 is established. After the data of the database 50, the downloaded machine event data 52, and the computer performance indicator 54 are integrated, various judgment rules are established in the computer database to determine whether abnormal points are found during wafer manufacturing with computer assistance 62. Among them, the status of violations of rules as defined by the method for monitoring a machine for manufacturing integrated circuits of the present invention is as follows: (1) Condition 1 · A. More than 4 batches of wafers being produced online, and more than 96 wafers being produced online; b The machine event is waiting, but the waiting time is more than 10 minutes. (2) Condition 2: The performance index exceeds the upper control boundary 72 and lower control boundary 74 in the official chart of the fourth chart, that is, Shao said that λ ^ j 卩 exceeds the control limit of J standard deviations. (3) Condition 3: In the solid diagram of the camp in Figure 4, the performance indicators of 5 consecutive points or more are located on the same side of the middle line 76. (4) Condition 4 · A · Using statistical regression to calculate fish? T The correlation coefficient R of the table of 5 consecutive continuous performance indicators, if R is greater than or equal to Λ inch% υ · 85, or R is less than _〇 · 85, that is, Considered trendy. Β. The performance index for 5 consecutive points increased, or the performance index for 5 consecutive points decreased. "(5) Condition 5: In the method for monitoring integrated circuit manufacturing of the present invention, there are currently four operation classes, namely classes a, b, c, and d. Among them, a, c are daily shifts, and B, D For battle class, class A and B are the same

J 天的日仗班,C、D 班為同一天的日夜班。(a)若a、b排哲 β班第一天上班與第二天 私纸張尺度適用中國國家標準(CNS)A4規格(210 X 2^7^" I — — · I I (請先閱讀背面之注意事項再填寫本頁)Day-to-day shifts on day J, and day-to-night shifts on days C and D. (A) If a, b and philosophical β classes go to work on the first day and on the second day, the private paper size applies the Chinese National Standard (CNS) A4 specification (210 X 2 ^ 7 ^ " I — — · II (please read first (Notes on the back then fill out this page)

Ί^τI ¼. 510009 A7 B7 五、發明說明() 上班的績效指標有顯著差異,則視為違反規則的狀況;(b) 若C、D班第一天上班與第二天上班的績效指標有顯著差 異’亦視為違反規則的狀況;(c)A、B班與c、D班的績致 指標有顯著差異,也視為違反規則的狀況。在上述(a)(b)(e) 中’所檢測的資料長度為30筆,以統計檢定其差異性。 (6)狀況6·右操作貝未依規疋轉帳、或在機台裡晶圓 製造的時間超過原本預定的時間,都視為違反規則的狀 況。 經濟部智慧財產局員工消費合作社印製 接著,將生產機台所發生的事件按時間軸排序,建立 事件日曆檔60。所記錄的生產機台事件包括:生產機台各 種機況變化、生產機台轉帳產出變化、生產機台線上在製 晶圓之變化、停留的線上在製晶圓之變化、生產機台所製 造的晶圓批次量變化、績效指標變化、以及異常問題點。 隨後,利用圖形化的介面執行機台重演64,以從電腦營幕 上讀取上述的事件日曆檔。本發明積體電路製造之機台監 控方法,執行機台重演的電腦圖形介面系統係如第5圖所 示,其可將上述事件日曆檔的排序結果逐筆顯示於視窗 中,可調整、暫停、恢復、中斷或重複電腦播放,可跳至 任一異常問題點’並以訊息由通知’更可依事件性質以不 同顏色區別。 請參照第5圖,其中係顯示此時播放的事件時間點9〇 12 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) 510009 Λ7 五、發明說明( 為2〇〇1年4月26曰上午7點整,並在事件時間點%的 方顯不機台狀態92,而在事件時間點9〇與晶圓 扯 均庁狀態 92的下方更顯示有機台事件94,與機台事件說明96。 外’視窗内更顯示了晶圓批數98、晶圓片數1〇〇、機台另 出量102、晶圓等候線長度1〇4、機台製造之批次數ι〇6產 機台每小時產出量108、機台生產時間11〇 '晶圓平均等候 時間112等晶圓製造與機台的基本資料。當出現違反定義 狀況而產生第3圖之異常問題點62時,電腦螢幕會自動出 現如第6圖與第7圖的異常問題點之訊息視窗。其中,第6 圖的訊息視窗係說明係有6筆資料低於中間線,因此產生 上述之狀況3 ,而第7圖係說明機台狀態為待料時間,確 有晶圓的存在’因此產生上述之狀況!。如需更詳細的資 料’可利用進入管制圖模式11 6,以查取更多了事件資料。 本發明機台重演系統所使用的電腦介面系統可依各人 喜好或需要’利用速度調整114的選擇,來調整第3圖之 事件日曆檔60的播放速度。並可利用跳至上一事件118、 跳至下一事件120、跳至上一問題點13〇、跳至下一問題點 132、連續播放事件122、暫停/繼續之切換鍵124、重複執 行126或結束程式128來讀取想要的資料。 值得注意的是’上述本發明較佳實施例參照第3圖中 所舉例的下載機台事件資料52、計算機台績效指標54、事 13 木纸張尺度適用中國國家標準(CNS)A4規格(21〇 X 297公f ) flIllrllhl — · 1 I f請先閱tt背面之注意事項再填寫本頁) 訂: %· 經濟部智慧財產局員工消費合作社印製 510009 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明() 件日曆檔所讀g、計算、顯示與利用的生產機台與晶圓製 造之資料僅為舉例,可視實際需要增加或減少所讀取計算 的參數資料,本發明不限於此。另外,建立管制圖5 6與建 立規則知識庫58所定義的參數與狀況亦僅為舉例,可視實 際生產需要而加以限制,本發明不限於此。 本發明機〇重/貝系統所使用的電腦介面系統係可利用 Visual Basic或Foxpro等程式語言所撰寫,本發明不限於 此。另外,電腦介面系統中,視窗顯示參數與資料並不僅 限於上述說明’可視實際需要而改變,更可將事件日曆檔 或管制圖的數字資料’搭配以長條圖或者更為擬真的動畫 顯示來展示’本發明並不限於此。更若透過規則知識庫的 擴充或引進FUZZY、類神經網路等人工智慧原理,形成工 廠問題診斷之專家系統。 本發明積體電路製造之機台監控方法與系統係針對檢 討過去績效與預測未來可能問題兩個方向來構建。其中, 係利用建立機台歷史之重演模式與績效指標,來檢討過去 績效;並利用建立機台的績效指標的管制圖與規則知識 庫,以預測未來可能問題。 如熟悉此技術之人員所瞭解的,以上所述僅為本發明 之較佳實施例而已,並非用以限定本發明之申請專利範 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) -------.---rI* Μ,—— (請先閲讀背面之注意事項再填寫本頁) · 線! 510009 Λ7 __B7_ 五、發明說明() 圍;凡其它未脫離本發明所揭示之精神下所完成之等效改 變或修飾,均應包含在下述之申請專利範圍内。 (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製Ί ^ τI ¼. 510009 A7 B7 V. Description of the invention () If there is a significant difference in the performance indicators of work, it is deemed to be a violation of the rules; (b) If the performance indicators of class C and D on the first day and the next day 'Significant difference' is also considered to be a violation of the rules; (c) Significant differences in performance indicators of Classes A and B and Classes C and D are also considered to be a violation of the rules. In the above (a) (b) (e), the length of the detected data is 30, in order to statistically test the difference. (6) Scenario 6. The right-hand operation failed to transfer funds in accordance with the regulations, or the wafer manufacturing time in the machine exceeded the originally scheduled time, which is considered a violation of the rules. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. Then, the events on the production machine are sorted by time axis, and an event calendar file 60 is created. The recorded production machine events include: changes in various machine conditions of the production machine, changes in the production machine transfer output, changes in the wafer production line on the production machine line, changes in the wafer production line on the stop line, and manufacturing in the production machine. Changes in wafer batches, changes in performance indicators, and abnormal issues. Subsequently, a graphical interface is used to perform a machine replay 64 to read the above-mentioned event calendar file from the computer screen. According to the method for monitoring a machine for manufacturing integrated circuits in the present invention, a computer graphics interface system for performing machine replay is shown in FIG. 5, which can display the sorting result of the event calendar file in a window one by one, and can be adjusted and paused , Resume, interrupt or repeat the computer playback, you can skip to any abnormal problem point and notify by message. It can also be distinguished in different colors according to the nature of the event. Please refer to Figure 5, which shows the time point of the event being played at this moment. 9 The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 510009 Λ7. 5. Description of the invention (for 2001) On April 26, 2010, at 7 am, the machine status 92 was displayed at the time of the event %%, and at the time of the event 90 and the wafer state 92 was displayed below the machine event 94, and Machine event description 96. The number of wafer batches 98, wafers 100, machine output 102, wafer waiting line length 104, and machine manufacturing batch numbers are displayed in the window. 〇 The basic data of wafer manufacturing and equipment, such as 108 hourly output of the production equipment, 110 'of wafer production time, 112 wafer average waiting time, etc. When there is a violation of the definition, the abnormal problem of Figure 3 will occur. At 6:00, the computer screen will automatically display the message window of the abnormal problem points as shown in Figure 6 and Figure 7. Among them, the message window in Figure 6 indicates that there are 6 pieces of data below the middle line, so the above situation 3 occurs. And Figure 7 shows that the state of the machine is waiting time, and there is indeed a wafer. 'As a result of the above situation! ... If more detailed information is needed', you can use the control chart mode 116 to retrieve more event data. The computer interface system used in the machine replay system of the present invention can be based on everyone's preference Or you need to 'use the selection of speed adjustment 114 to adjust the playback speed of the event calendar file 60 in Figure 3. You can also use skip to the previous event 118, skip to the next event 120, skip to the previous problem point 13, skip to Next problem point 132, continuous playback event 122, pause / resume switch key 124, repeat execution 126 or end program 128 to read the desired data. It is worth noting that 'the preferred embodiment of the present invention mentioned above refers to FIG. Download the machine event data 52, computer performance index 54 and event 13 in the example. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (21〇X 297 male f) flIllrllhl — · 1 I f Please read tt first Note on the back, please fill out this page again) Order:% · Printed by the Employees 'Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 510009 Printed by the Employees' Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 The data read from the file g, calculation, display and utilization of the production machine and wafer manufacturing are just examples, and the parameter data of the read calculation can be increased or decreased according to actual needs, and the present invention is not limited to this. In addition, the parameters and conditions defined in the establishment of the control map 56 and the establishment of the rule knowledge base 58 are only examples, and may be limited according to actual production needs, and the present invention is not limited thereto. The computer interface system used in the machine weight / shell system of the present invention can be written using a programming language such as Visual Basic or Foxpro, and the present invention is not limited thereto. In addition, in the computer interface system, the window display parameters and data are not limited to the above descriptions 'can be changed according to actual needs, and the event calendar file or digital data of the control chart' can be combined with bar graphs or more realistic animation display To show that the present invention is not limited to this. Furthermore, through the expansion of the rule knowledge base or the introduction of artificial intelligence principles such as FUZZY and neural network, an expert system for the diagnosis of factory problems is formed. The machine monitoring method and system for integrated circuit manufacturing of the present invention are constructed for two directions: reviewing past performance and predicting possible future problems. Among them, it is to review the past performance by establishing a repeat model and performance indicators of the history of the machine; and to use the control chart and rule knowledge base of the machine's performance indicators to predict possible future problems. As understood by those familiar with this technology, the above description is only a preferred embodiment of the present invention, and is not intended to limit the patent application template of the present invention. The paper size applies to the Chinese National Standard (CNS) A4 specification (210 X 297 public). Li) -------.--- rI * Μ, —— (Please read the notes on the back before filling this page) · Online! 510009 Λ7 __B7_ V. Description of the invention (); All other equivalent changes or modifications made without departing from the spirit disclosed by the present invention shall be included in the scope of patent application described below. (Please read the notes on the back before filling out this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs

本紙張瓦度適用中國國家標準(CNS)A4規格(210 X 297公釐)The paper wattage is in accordance with China National Standard (CNS) A4 (210 X 297 mm)

Claims (1)

申請專利範圍 經濟部智慧財產局員工消費合作社印製 L 一種積體電路製造之機台監〜 進行福餐a m U k 皿 <工方法,^複數個機台 仃後數個晶0批次之製造時, 數個事件,4 f β 係用以監控該些機台之複 , 機口 i控方法至少包括: 資料; 4庫係具有複數個機台事件 從該資料庫下載該些機台事件資料; 利用該些機台事件資料补筲 標; °十'^該些機台之複數個績效指, 利用該些機台之該也績效 一、貧欢#曰軚建立一管制圖; 利用該些機台事件資料、 貝4 該二、凌效指標與該管制圖建 立一規則知識庫,並定Α Φ & t Μ β 疋義出複數個限制,藉以發現一異常 問題點; 將該些機:台事件資料依時間排序形《一事件日層檔; 以及 執仃一機台重演步驟,以進行一矯正措施。 2·如申請專利範圍第丨項所述之積體電路製造之機台 監控方法,其中上述之機台事件資料至少包括:機台機況 事件、機台轉帳產出資料以及機台線上在製晶圓資料。 J•如申請專利範圍第1項所述之積體電路製造之機台 監控方法,其中上述之績效指標至少包括:機台產出量 16 本紙張尺度適用中國國家標準(CNS)A4規格(210 x 297公釐) ,,—,¾ 裝-------—tr-------- (請先閱讀背面之注意事項再填窵本頁) 510009 A8 B8 C8 D8 、申請專利範圍 (Move)、機台生產時間(pr〇ductive Time)、機台每小時產出 量(ΡΟΗ)、機台待料時間(L〇ss Time)、機台製造的晶圓批次 數(Batch)、線上在製晶圓的平均等候時間以及線上在製 晶圓的等候線長度(L)。 々·如申請專利範u μ所述之積體電路製造之機台 監控方法’其中上述之管制圖係利用取2個月約6〇筆之該 些機台事件資料,並取3個標準差以做发 Χ马一管制界線。 5.如申請專利範圍第1項所述之 體電路製造之播a 監控方法,其_上述之事件日盾檔係至 表&之機口 夕包括該此德二夕 機況變化、轉帳產出變化、線上在製晶圓變化。二機口之 6·如申請專利範圍第1項所述之積體 #製造之機台 血控方法,其中上述之進行該機台重演步騍, 事件日曆檔與該規則知識庫圖形介面化〃更包括將該 系統。 建立—機台重演 如申請專利範圍第6項所述之積趙電 (請先閱讀背面之注意事項再填寫本頁) 裝 訂-丨 I-------h- 經濟部智慧財產局員工消費合作社印製 路製造之機台 監控方法,其中上述之機台重演系统係利 k之 Visual Basic與Foxpr〇等程式語言所έ L自於由 寫。 族群所撰 17 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公餐) :)1關9 韻 C8 D8 、申請專利範圍 8· 一種積體電路製造之機台 ^ . 准并说虹加《 η ^万法,當複數個機台 進仃禝數個晶圓批次製 數個事件之過程變化用以監控該些機台之複 少包括: 變化,該積體電路製造之機台監控方法至 提供一資料康,甘+ 資料; 八I貝^係具有複數個機台事件 從該 >料庫下載該些機台事件資料; 利用該些機台事件眘斜+笪 標; 爭件貝科片异該些機台之複數個績效指 利用該些機台之該些績效指標建立一管制圖; 利用該些機台事件資料、該些績效指標與該管制圖建 立一規則知識庫; 思 將該些機台事件資料依時間排序形成一事件日層栌· 以一機台重演系統執行一機台重演步驟, 續取該些 機台之該些事件。 9·如申請專利範圍第8項所述之積體電路製 <•機;台 監控方法,其中上述之機台事件資料至少包括: π σ機況 事件、機台轉帳產出資料、機台線上在製晶圓資料。 經濟部智慧財產局員工消費合作社印製 (請先閱讀背面之注意事項再填寫本頁) 10.如申請專利範圍第8項所述之積體電路製造之 台監控方法,其中上述之績效指標至少包括:機台產出量 機台生產時間、機台每小時產出量、機台待料時間、 、機台 18 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) 510009 09800 00 ABCD 經濟部智慧財產局員工消費合作社印製 f、申請專利範圍 製造的晶圓批次數、線上在製晶圓的平均等候時間、線上 在製晶圓的等候線長度。 η.如申請專利範圍第8項所述之積體電路製造之機 台監控方法,其中上述之管制圖係利用取2個月約6〇筆之 機台事件資料,並取3個標準差以做為—管制界線。 /2·如申請專利範圍第8項所述之積體電路製造之機 台監控方法,其中上述之事件日曆檔係至少包括該些機台 之機況變化、轉帳產出變化、線上在製晶圓變化。 13. 如申請專利範圍第8項所述之積體電路製造之機 台監控方法,其中上述之建立該規則知識庫之步驟更包括 定義複數個限制,藉以發現一異常問題點。 14. 如申請專利範圍第8項所述之積體電路製造之機 台監控方法,其中上述之以該機台重演系統執行該機台重 演步驟更包括將該事件日曆樓與該規則知識庠圖形介面 化。 15·如申請專利範圍第8項所述之積體電路製造之機 台監控方法,其中上述之機台重演系統係利用選自於由 Visual Basic與Foxpro等程式語言所組成之一族群所撰 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐)Patent application scope: Intellectual Property Bureau, Ministry of Economic Affairs, Employees' Cooperatives, Printing Co., Ltd., a type of integrated circuit manufacturing machine supervisor, performing blessing am Uk dishes, and working methods, ^ multiple machines, several crystals, and 0 batches At the time of manufacture, several events, 4 f β is used to monitor the complex of these machines, the machine port i control method at least includes: data; 4 library has a plurality of machine events Download the machine events from the database Information; use the event data of these machines to supplement the target; ° ten '^ multiple performance indicators of these machines, the use of these machines should also perform a performance, poor Huan # Yue 軚 establish a control chart; use the Some machine incident data, the second, the performance index and the control chart to establish a rule knowledge base, and set Α Φ & t Μ β to define a number of restrictions, in order to find an abnormal problem point; Machine: The event data is sorted according to time, "one event day level; and one machine replay step is performed to perform a corrective action. 2. The machine monitoring method for integrated circuit manufacturing as described in item 丨 of the scope of patent application, wherein the above machine event data includes at least: machine machine condition events, machine transfer output data, and machine online in-process Wafer information. J • The machine monitoring method for integrated circuit manufacturing as described in item 1 of the scope of patent application, wherein the above performance indicators include at least: machine output 16 This paper size is applicable to China National Standard (CNS) A4 specification (210 x 297 mm) ,,-, ¾ --------- tr -------- (Please read the precautions on the back before filling out this page) 510009 A8 B8 C8 D8, apply for a patent Range (Move), machine production time (pr〇ductive Time), machine hour output (P0Η), machine waiting time (L〇ss Time), the number of wafers manufactured by the machine (Batch) , The average waiting time for wafers on the line, and the length of the waiting line for wafers on the line (L). 々 · A machine monitoring method for integrated circuit manufacturing as described in the patent application u μ 'wherein the above-mentioned control chart is to use about 60 machine event data for 2 months and take 3 standard deviations In order to make a horse, a control line. 5. According to the monitoring method of the body circuit manufacturing as described in item 1 of the scope of the patent application, the above-mentioned event date shield file is to the table & Change, wafer in-line change. 6. Second machine mouth 6. The blood control method for the machine manufactured by the product # 1 described in item 1 of the scope of the patent application, in which the machine replays the steps described above, the event calendar file and the rule knowledge base graphical interface are converted. It also includes the system. Build—The machine repeats the product as described in item 6 of the scope of patent application (please read the precautions on the back before filling this page) Binding-丨 I ------- h- Staff of Intellectual Property Bureau, Ministry of Economic Affairs The method for monitoring the machine manufacturing of printed cooperatives produced by consumer cooperatives. The above machine replay system is written by programming languages such as Visual Basic and Foxpr0. The 17 paper standards written by the ethnic group are applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 meals): 1 level, 9 rhymes, C8 D8, and scope of patent application8. A type of integrated circuit manufacturing machine ^. Hongjia "η ^ 10,000 method, when multiple machines enter several wafer batches to make several events process changes to monitor the number of these machines include: changes, the integrated circuit manufacturing machine The monitoring method of the station is to provide a data source, data, and data. The system has multiple machine events to download the machine event data from the >magazine; use the machine events to be careful to tilt + target; The multiple performances of the beacons that differ from the machines refer to the establishment of a control chart using the performance indicators of the machines; the use of the machine event data, the performance indicators and the control chart to establish a rule of knowledge Think of this machine event data in order of time to form an event layer. 栌 Use a machine replay system to perform a machine replay step and continue to retrieve the events of the machines. 9. The integrated circuit system as described in item 8 of the scope of patent application < • machine; machine monitoring method, wherein the above machine event data includes at least: π σ machine condition event, machine transfer output data, machine Online wafer information. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs (please read the precautions on the back before filling this page) 10. The monitoring method for integrated circuit manufacturing as described in item 8 of the scope of patent application, where the above performance indicators are at least Including: machine output, machine production time, machine hourly output, machine waiting time, machine 18 This paper size applies to China National Standard (CNS) A4 specification (210 X 297 mm) 510009 09800 00 ABCD Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs, Consumer Cooperatives, the number of wafers manufactured in the scope of patent applications, the average waiting time of wafers on the line, and the length of waiting lines of wafers on the line. η. The machine monitoring method for integrated circuit manufacturing as described in item 8 of the scope of the patent application, wherein the above-mentioned control chart is to use about 60 machine event data for 2 months, and take 3 standard deviations to As—the regulatory boundary. / 2 · The machine monitoring method for integrated circuit manufacturing as described in item 8 of the scope of the patent application, wherein the above event calendar file includes at least the machine condition changes of these machines, the transfer output change, and the online production of crystals Circle changes. 13. The method for monitoring integrated circuit manufacturing as described in item 8 of the scope of patent application, wherein the step of establishing the rule knowledge base further includes defining a plurality of restrictions to discover an abnormal problem point. 14. The machine monitoring method for integrated circuit manufacturing as described in item 8 of the scope of the patent application, wherein the machine replay steps performed by the machine replay system described above further include the event calendar building and the rule knowledge graphic Interface. 15. The machine monitoring method for integrated circuit manufacturing as described in item 8 of the scope of the patent application, wherein the machine replay system described above is written by a group selected from a group consisting of programming languages such as Visual Basic and Foxpro Paper size applies to China National Standard (CNS) A4 (210 X 297 mm) I I J ^ ---I----^ --- (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 510009 A8 B8 C8 D8 六、申請專利範圍 寫。 16· —種積體電路製造之機台監控系統,係用以監控 複數個生產機台之複數個事件,其中該些生產機台係用以 執行複數個生產動作以製造複數個晶圓批次,該積體電路 製造之機台監控系統至少包括: 一控制主機,係用以控制該些生產機台; 一資料主機,係具有該些生產機台之複數個操作參 數,並紀錄該些生產機台之複數個事件資料與複數個製程 資料; 一監控主機,可執行一機台監控流程,以重演該些生 產機台製造該些晶圓批次之該些事件,該機台監控流程至 少包括: 由該資料主機下載該些事件資料; 利用該些事件資料計算該些生產機台之複數個績 效指標; 利用該些生產機台之該些績效指標建立一管制 1$| · 圍, 利用該些事件資料、該些績效指標與該管制圖建 立一規則知識庫,並定義複數個限制藉以發現一異常 問題點; 將該些事件資料依時間排序形成一事件日曆檔; 以及 20 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公t ) I丨丨丨丨丨丨彳丨•丨I (請先閱讀背面之注意事項再填寫本頁) · 510009 A8 B8 C8 D8 t、申請專利範圍 執行一機台重演步驟以進行一矯正措施。 1 7.如申請專利範圍第1 6項所述之積體電路製造之機 台監控系統,其中上述之管制圖係利用取2個月約60筆之 該些事件資料,並取3個標準差以做為一管制界線。 1 8 ·如申請專利範圍第1 6項所述之積體電路製造之機 台監控系統,其中上述之事件曰曆槽係包括該些生產機台 之機況變化、轉帳產出變化、以及線上在製晶圓變化。 19. 如申請專利範圍第16項所述之積體電路製造之機 台監控系統,其中上述之執行該機台重演步驟,更包括將 該事件日曆檔與該規則知識庫圖形介面化以建立一機台重 演系統。 20. 如申請專利範圍第19項所述之積體電路製造之機 台監控系統,其中上述之機台重演系統係利用選自於由 Visual Basic與Foxpro等程式語言所組成之一族群所撰 寫0 (請先閱讀背面之注意事項再填寫本頁) 裝 經濟部智慧財產局員工消費合作社印製 21 本紙張尺度適用中國國家標準(CNS)A4規格(2.10 X 297公t )I I J ^ --- I ---- ^ --- (Please read the notes on the back before filling out this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 510009 A8 B8 C8 D8 VI. Scope of Patent Application Write. 16 · —A machine monitoring system for integrated circuit manufacturing is used to monitor multiple events of multiple production machines, where the production machines are used to perform multiple production actions to manufacture multiple wafer batches The machine monitoring system manufactured by the integrated circuit at least includes: a control host to control the production machines; a data host to have a plurality of operating parameters of the production machines and record the production A plurality of event data and a plurality of process data of the machine; a monitoring host can execute a machine monitoring process to repeat the events of the wafer batches produced by the production machines, and the machine monitoring process is at least Including: downloading the event data by the data host; using the event data to calculate a plurality of performance indicators of the production machines; using the performance indicators of the production machines to establish a control 1 $ | The event data, the performance indicators and the control chart establish a rule knowledge base, and define a plurality of restrictions to discover an abnormal problem point; The materials are sorted by time to form an event calendar file; and 20 paper sizes are applicable to the Chinese National Standard (CNS) A4 specification (210 X 297g t) I 丨 丨 丨 丨 丨 彳 丨 • 丨 I (Please read the note on the back first Please fill in this page again for the matters) · 510009 A8 B8 C8 D8 t. Apply for a patent scope to perform a machine replay step to perform a corrective action. 1 7. The machine monitoring system for integrated circuit manufacturing as described in item 16 of the scope of the patent application, wherein the above-mentioned control chart uses the data of about 60 events in 2 months and takes 3 standard deviations Think of it as a regulatory boundary. 18 · The machine monitoring system for integrated circuit manufacturing as described in item 16 of the scope of patent application, wherein the above-mentioned event calendar system includes changes in the machine conditions of these production machines, changes in transfer output, and online Wafer change in progress. 19. The machine monitoring system for integrated circuit manufacturing as described in item 16 of the scope of the patent application, wherein performing the machine replay steps described above further includes graphically interfacing the event calendar file with the rules knowledge base to create a Machine replay system. 20. The machine monitoring system for integrated circuit manufacturing as described in item 19 of the scope of patent application, wherein the above-mentioned machine replay system is written using a group selected from a group consisting of programming languages such as Visual Basic and Foxpro. (Please read the precautions on the back before filling out this page.) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. 21 This paper size is applicable to China National Standard (CNS) A4 (2.10 X 297mm)
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI679508B (en) * 2017-01-26 2019-12-11 台灣積體電路製造股份有限公司 Systems and methods for dynamically displaying process sequences of equipment in semiconductor manufacturing

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI679508B (en) * 2017-01-26 2019-12-11 台灣積體電路製造股份有限公司 Systems and methods for dynamically displaying process sequences of equipment in semiconductor manufacturing

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