CN116153718A - High-efficient radiating solid-state relay module - Google Patents

High-efficient radiating solid-state relay module Download PDF

Info

Publication number
CN116153718A
CN116153718A CN202310031226.7A CN202310031226A CN116153718A CN 116153718 A CN116153718 A CN 116153718A CN 202310031226 A CN202310031226 A CN 202310031226A CN 116153718 A CN116153718 A CN 116153718A
Authority
CN
China
Prior art keywords
heat
positioning
fixedly connected
guide post
radiator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202310031226.7A
Other languages
Chinese (zh)
Inventor
龙文强
查泉意
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Sanming Electric Co ltd
Original Assignee
Shenzhen Sanming Electric Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Sanming Electric Co ltd filed Critical Shenzhen Sanming Electric Co ltd
Priority to CN202310031226.7A priority Critical patent/CN116153718A/en
Publication of CN116153718A publication Critical patent/CN116153718A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H50/00Details of electromagnetic relays
    • H01H50/12Ventilating; Cooling; Heating
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H50/00Details of electromagnetic relays
    • H01H50/02Bases; Casings; Covers
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02DCLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00Energy efficient computing, e.g. low power processors, power management or thermal management

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention relates to the technical field of relay modules, in particular to a high-efficiency heat-dissipation solid-state relay module which comprises a first heat dissipation component, wherein the first heat dissipation component comprises a radiator, one side of the radiator is connected with a fan, the other side of the fan is connected with a dust screen, and a heat conduction column penetrates through the inside of the radiator; a relay body; the relay main body is arranged in the positioning shell; the second cooling assembly comprises a water storage tank, the water storage tank is fixedly connected to the upper surface of the positioning shell, a micro circulating pump is arranged on one side of the water storage tank, and a water outlet end of the micro circulating pump is connected with a guide pipe. The invention can realize the omnibearing heat dissipation treatment of the relay main body, thereby greatly improving the heat dissipation efficiency of the relay main body, avoiding the occurrence of the condition of uneven heat dissipation of a single side of the traditional radiator structure, and realizing the efficient heat dissipation of the relay main body.

Description

High-efficient radiating solid-state relay module
Technical Field
The invention relates to the technical field of relay modules, in particular to a solid-state relay module capable of efficiently radiating heat.
Background
The solid-state relay is a contactless switch composed of a microelectronic circuit, a discrete electronic device and a power electronic power device, the isolation between a control end and a load end is realized by using an isolation device, the input end of the solid-state relay is directly driven by using a tiny control signal to achieve the purpose of directly driving a heavy current load, and the solid-state relay is mostly realized by adopting a mounting mode of a heat dissipation base to realize the heat dissipation treatment in the use process.
However, the heat dissipation base of the existing solid-state relay module is simple in structure and mainly comprises a radiator and a fan, so that heat dissipation treatment of the relay module is realized, but the relay main body is only in contact with the upper surface of the radiator through the bottom of the relay main body, so that heat dissipation treatment of the relay main body cannot be realized efficiently and rapidly, the heat dissipation effect of the relay main body is seriously reduced, the heat dissipation capacity of the relay main body is limited in time, and the best use effect of the relay main body cannot be realized, and therefore, a need exists for designing a solid-state relay module with high-efficiency heat dissipation to solve the problems.
Disclosure of Invention
The invention aims to provide a solid-state relay module capable of efficiently radiating, which solves the problems that in the background technology, the relay main body is only contacted with the upper surface of a radiator through the bottom of the relay main body, so that the whole body of the relay main body is not uniformly radiated, the heat radiation treatment of the relay main body cannot be efficiently and rapidly realized, and the heat radiation effect of the relay main body is seriously reduced.
In order to achieve the above purpose, the present invention provides the following technical solutions: a high efficiency heat dissipating solid state relay module comprising:
the first heat dissipation assembly comprises a radiator, one side of the radiator is connected with a fan, the other side of the fan is connected with a dust screen, a heat conduction column penetrates through the radiator, the top of the heat conduction column is connected with a first heat conduction plate, a positioning shell is arranged outside the first heat conduction plate, and the inner wall of the positioning shell is connected with a baffle plate;
a relay body; the relay main body is arranged in the positioning shell;
the second cooling assembly comprises a water storage tank, the water storage tank is fixedly connected to the upper surface of the positioning shell, a micro circulating pump is arranged on one side of the water storage tank, a guide pipe is connected to the water outlet end of the micro circulating pump, a second heat conducting plate is arranged outside the guide pipe, and the second heat conducting plate is located between the relay main body and the positioning shell.
Preferably, the center department of radiator is provided with the rectangular channel, and the both sides of rectangular channel all are connected with radiating fin, the screw hole has been seted up to one side that the radiator is close to the fan, the locating hole has been seted up at four corners of fan, and the inside in locating hole runs through there is the inside of bolt to radiator screw hole.
Preferably, the first heat conducting plate wraps the outer wall of the relay main body, three groups of heat conducting columns are fixedly connected to the lower surface of the first heat conducting plate, a baffle and a second heat conducting plate are fixedly connected to the inner wall of the positioning shell, through grooves are formed in two ends of the positioning shell, a circuit connecting point of the relay main body is located at the through grooves, and the first heat conducting plate is located inside the second heat conducting plate and the baffle.
Preferably, the inner wall of the positioning shell is provided with a heat-insulating coating, when the first heat-conducting plate is inserted into the positioning shell, the upper surface of the first heat-conducting plate is abutted against the lower surface of the baffle, the top of the water storage tank is provided with a water filling port, one end of the conduit, which is far away from the micro circulating pump, penetrates into the water storage tank, and the second heat dissipation assembly is a closed loop circulating system.
Preferably, the outside parcel of positioning shell has locating component, locating component includes the locating rack, locating rack fixedly connected with is at the upper surface of radiator, the outer wall fixedly connected with protecting crust of locating rack, the center of protecting crust runs through there is the button, the outside of button has cup jointed the guide ring, the one end of button is connected with first spring, the outside parcel of first spring has first uide bushing, the outer wall fixedly connected with articulated seat of button, articulated outside of articulated seat has articulated pole, articulated pole's the other end articulates there is first guide post, the outside of first guide post has cup jointed the second spring, the one end fixedly connected with third uide bushing of second spring, the other end fixedly connected with second guide post of first guide post, the outside of second guide post has cup jointed the second uide bushing, the other end fixedly connected with location plug pin axle of second guide post, and the inside of locating plug pin axle through locating rack to positioning shell.
Preferably, the locating component is provided with two sets of altogether, and two sets of locating components are in the both sides of locating shell respectively, the locating rack is U style of calligraphy structure, the through-hole has all been seted up at the both ends of locating rack, and the inside of through-hole runs through has the location to insert the round pin axle, the location inserts the round pin axle and is U style of calligraphy structure, the through-hole has been seted up at the center of protecting shell, and the inside of through-hole runs through there is the button, the outside of button is provided with the soft rubber pad.
Preferably, the first uide bushing is provided with two altogether, and two equal fixed connection of first uide bushing are at the outer wall of locating rack, two it has the articulated lever to slip between the first uide bushing, guide ring fixed connection keeps away from the one end of locating rack at first uide bushing, and the center slip of guide ring runs through there is the button, first spring is in between locating rack and the button, the both ends of articulated seat all articulate there is the articulated lever, and the one end structure of keeping away from the articulated seat of two articulated levers is symmetrical structure about the articulated seat.
Preferably, the third uide bushing and the second uide bushing are all fixed connection at the outer wall of locating rack, the inside slip of third uide bushing runs through there is first guide post, the cross section of second guide post is the hexagon structure, the cross section of location plug pin axle is the same with the cross section of first guide post, the third uide bushing is provided with three altogether, two the third uide bushing is in the outside of first guide post, another the third uide bushing is in the outside of location plug pin axle, the one end fixed connection of second spring is at the outer wall of third uide bushing, the other end fixedly connected with holding ring of second spring, and holding ring fixed connection is at the outer wall of first guide post.
Compared with the prior art, the invention has the beneficial effects that:
1. this high-efficient radiating solid-state relay module is through the mutually supporting of first radiating component and second radiating component, can realize carrying out all-round heat dissipation to the relay main part and handle to improve the radiating efficiency of relay main part greatly, avoided traditional radiator structure unilateral heat dissipation inhomogeneous condition to appear, thereby realize the high-efficient heat dissipation of relay main part.
2. This high-efficient radiating solid-state relay module is through setting up of locating component, can realize relay main part's quick assembly disassembly handles, through pressing to the button, can drive articulated seat and remove, thereby it rotates to drive articulated pole through articulated seat's removal, further realize the removal of first guide post and second guide post, further through the removal of location pin axle, make the inside at the locating rack can be placed to the locating shell, place stably the back with the locating shell, remove the pressing to the button, elastic control through first spring, drive location pin axle runs through grafting to locating rack and locating shell, thereby realize the assistance-localization real-time to the locating shell, further improve relay main part convenience of using, make things convenient for it to carry out dismouting maintenance or change.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present invention;
FIG. 2 is a schematic view of a distribution structure of a relay body according to the present invention;
FIG. 3 is a schematic diagram of an explosion structure of a heat sink according to the present invention;
FIG. 4 is a schematic overall cross-sectional view of the present invention;
FIG. 5 is a schematic diagram of a distribution structure of positioning components according to the present invention;
FIG. 6 is an enlarged schematic view of the structure of FIG. 5A according to the present invention;
FIG. 7 is a schematic view of a distribution structure of a positioning shell according to the present invention;
FIG. 8 is an enlarged schematic view of the structure of FIG. 7B according to the present invention;
fig. 9 is an exploded view of a second heat dissipating assembly according to the present invention.
In the figure: 1. a first heat dissipation assembly; 11. a heat sink; 12. a fan; 13. a dust screen; 14. a heat conducting column; 15. a first heat-conducting plate; 16. positioning a shell; 17. a baffle; 2. a relay body; 3. a second heat dissipation assembly; 31. a water storage tank; 32. a micro circulation pump; 33. a conduit; 34. a second heat-conducting plate; 4. a positioning assembly; 41. a positioning frame; 42. a protective shell; 43. a button; 44. a guide ring; 45. a first guide sleeve; 46. a first spring; 47. a hinge base; 48. a hinge rod; 49. a first guide post; 50. a second spring; 51. a second guide post; 52. a second guide sleeve; 53. a third guide sleeve; 54. and positioning the pin shaft.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1-9, an embodiment of the present invention is provided:
a high efficiency heat dissipating solid state relay module comprising: the radiator 11, the fan 12, the relay body 2 and the micro circulation pump 32 used in the present application are all commercially available products, and the principle and the connection manner thereof are all well known to those skilled in the art, so that they are not described in detail herein,
the first heat dissipation assembly 1, the first heat dissipation assembly 1 includes the radiator 11, one side of the radiator 11 is connected with the fan 12, the other side of the fan 12 is connected with the dust screen 13, there is a heat conduction column 14 in the radiator 11, the top of the heat conduction column 14 is connected with the first heat conduction plate 15, the outside of the first heat conduction plate 15 is provided with the locating shell 16, the inner wall of the locating shell 16 is connected with the baffle 17, through the setting of this structure, can realize the joint installation to the relay main body 2 through the mutual cooperation of the first heat conduction plate 15 and the locating shell 16, realize the heat absorption and heat conduction to the relay main body 2 through the contact of the first heat conduction plate 15 and the relay main body 2, further carry on the abundant derivation of heat through the heat conduction column 14 penetrating to the inside of the radiator 11, realize the blast heat dissipation to the radiator 11 through the circular telegram start of the fan 12 at the same time, install the switch between the fan 12 and the relay main body 2, the temperature control point is below 60 ℃;
a relay main body 2; the relay body 2 is provided inside the positioning case 16;
the second cooling assembly 3, the second cooling assembly 3 includes the water storage box 31, water storage box 31 fixed connection is at the upper surface of locating shell 16, one side of water storage box 31 is provided with micro circulating pump 32, the play water end of micro circulating pump 32 is connected with pipe 33, the outside of pipe 33 is provided with second heat-conducting plate 34, second heat-conducting plate 34 is in between relay main part 2 and the locating shell 16, the setting of this structure can further cooperate the installation of first cooling assembly 1, realize the omnidirectional heat dissipation to relay main part 2, thereby improve the radiating efficiency of relay main part 2 greatly, through water storage box 31, micro circulating pump 32 and the circulation system setting of pipe 33, the heat conduction of cooperation second heat-conducting plate 34, realize carrying out the water-cooling circulation heat dissipation to second heat-conducting plate 34.
Further, the center department of radiator 11 is provided with the rectangular channel, and the both sides of rectangular channel all are connected with radiating fin, through the setting of this structure, can increase its air contact, improves the radiating effect, cooperates the wind of fan 12 simultaneously, further improves radiating efficiency, and the screw hole has been seted up to one side that radiator 11 is close to fan 12, and the locating hole has been seted up at four corners of fan 12, and the inside in locating hole has run through the inside of bolt to radiator 11 screw hole.
Further, the first heat-conducting plate 15 is wrapped on the outer wall of the relay main body 2, the lower surface of the first heat-conducting plate 15 is fixedly connected with three groups of heat-conducting columns 14, the inner wall of the positioning shell 16 is fixedly connected with a baffle 17 and a second heat-conducting plate 34, through grooves are formed at two ends of the positioning shell 16, the circuit connection point of the relay main body 2 is positioned at the through grooves, the first heat-conducting plate 15 is positioned inside the second heat-conducting plate 34 and the baffle 17, the heat-conducting columns 14 and the first heat-conducting plate 15 are also called heat-conducting gap-filling materials, heat-conducting silica gel mats and the like, and the heat-conducting material is formed by adding heat-conducting fillers, auxiliary agents and the like and curing through addition reaction based on addition type silicon rubber; the gap can be filled, heat transfer between a heating part and a radiating part can be completed, and the functions of insulation, vibration reduction, sealing and the like are simultaneously realized, the relay main body 2 is a four-terminal active device, wherein two terminals are input control ends, the other two ends are output controlled ends, the relay main body has amplification driving function and isolation function, and is very suitable for driving a high-power switch type actuating mechanism, so that high-heat radiation is required, and the relay main body is used for guaranteeing high-efficiency normal work.
Further, the inner wall of the positioning shell 16 is provided with a heat-insulating coating layer, the heat-insulating coating layer material contains an oxide represented by a composition formula A2B2O7 (wherein a is an element selected from La, nd and Sr, and B is an element selected from Ti, si, nb, ta) as a main body, the novel heat-insulating coating layer material has a melting point higher than a working temperature range, a thermal conductivity lower than zirconia and a thermal expansion rate higher than zirconia, has a good heat-insulating effect, ensures that heat of the novel heat-insulating coating layer material can be accurately conducted, thereby ensuring a heat-radiating effect, further avoiding temperature rise at the installation space of the relay body 2, the upper surface of the first heat-conducting plate 15 is abutted against the lower surface of the baffle 17 when the first heat-conducting plate 15 is inserted into the positioning shell 16, the top of the water storage tank 31 is provided with a water filling port, one end of the conduit 33, which is far from the micro circulation pump 32, penetrates into the water storage tank 31, and the second heat-radiating component 3 is in a closed loop circulation system.
Further, the positioning assembly 4 is wrapped outside the positioning shell 16, the positioning assembly 4 comprises a positioning frame 41, the positioning frame 41 is fixedly connected to the upper surface of the radiator 11, the outer wall of the positioning frame 41 is fixedly connected with a protecting shell 42, the center of the protecting shell 42 is penetrated with a button 43, the outside of the button 43 is sleeved with a guide ring 44, one end of the button 43 is connected with a first spring 46, the outside of the first spring 46 is wrapped with a first guide sleeve 45, the outer wall of the button 43 is fixedly connected with a hinge seat 47, the outside of the hinge seat 47 is hinged with a hinge rod 48, the other end of the hinge rod 48 is hinged with a first guide post 49, the outside of the first guide post 49 is sleeved with a second spring 50, one end of the second spring 50 is fixedly connected with a third guide sleeve 53, the other end of the first guide post 49 is fixedly connected with a second guide post 51, the outside of the second guide post 51 is sleeved with a second guide sleeve 52, the other end of the second guide post 51 is fixedly connected with a positioning pin 54, the positioning pin 54 penetrates through the positioning frame 41 to the inside of the positioning shell 16, through the arrangement of the structure, the installation and positioning of the positioning shell 16 are realized, thereby the auxiliary positioning of the relay main body 2 is realized, through the pressing of the button 43, the hinge seat 47 can be driven to move, the hinge rod 48 is driven to rotate through the movement of the hinge seat 47, the movement of the first guide post 49 and the second guide post 51 is further realized, the movement of the positioning pin 54 is further realized, the positioning shell 16 can be placed in the positioning frame 41, after the positioning shell 16 is placed stably, the pressing of the button 43 is released, through the elastic control of the first spring 46, the positioning pin 54 is driven to perform the penetrating and inserting on the positioning frame 41 and the positioning shell 16, thereby achieving the auxiliary positioning of the positioning shell 16.
Further, the positioning components 4 are provided with two groups, the two groups of positioning components 4 are respectively positioned on two sides of the positioning shell 16, the positioning frame 41 is of a U-shaped structure, through holes are formed in two ends of the positioning frame 41, positioning pin shafts 54 penetrate through the through holes, the positioning pin shafts 54 are of a U-shaped structure, the positioning frame 41 and the positioning shell 16 penetrate through the positioning pin shafts 54, positioning of the positioning shell 16 is achieved, and therefore the relay main body 2 is clamped and installed, meanwhile, the positioning structure is convenient for dismounting and maintenance of the relay main body 2, through holes are formed in the center of the protective shell 42, buttons 43 penetrate through the inside of the through holes, soft rubber mats are arranged outside the buttons 43, and comfort of hand pressing is improved.
Further, two first guide sleeves 45 are provided together, two first guide sleeves 45 are fixedly connected to the outer wall of the positioning frame 41, a hinge rod 48 is fixedly connected between the two first guide sleeves 45 in a sliding manner, one end of the first guide sleeve 45, which is far away from the positioning frame 41, is fixedly connected to the guide ring 44, a button 43 is arranged in a sliding manner in the center of the guide ring 44, the first spring 46 is located between the positioning frame 41 and the button 43, the two ends of the hinge seat 47 are hinged with the hinge rod 48, one end structure of the two hinge rods 48, which is far away from the hinge seat 47, is in a symmetrical structure with respect to the hinge seat 47, and the hinge seat 47 is driven to displace through the pressing of the button 43, so that the hinge rod 48 is driven to perform hinge rotation displacement through the hinge seat 47 and the hinge rod 48, and further position control of the first guide post 49 is achieved, and the positioning plug pin 54 is located in a state penetrating through the positioning frame 41 and the positioning shell 16 through elastic control of the first spring 46.
Further, the third guide sleeve 53 and the second guide sleeve 52 are fixedly connected to the outer wall of the positioning frame 41, the first guide post 49 is penetrated through the inner sliding of the third guide sleeve 53, the cross section of the second guide post 51 is of a hexagonal structure, the second guide post 51 and the second guide sleeve 52 slide in a guiding manner, good guiding and limiting effects are achieved, the moving stability of the positioning pin shaft 54 is guaranteed, the cross section of the positioning pin shaft 54 is identical to that of the first guide post 49, the three third guide sleeves 53 are arranged, two third guide sleeves 53 are positioned outside the first guide post 49, the other third guide sleeve 53 is positioned outside the positioning pin shaft 54, one end of the second spring 50 is fixedly connected to the outer wall of the third guide sleeve 53, the other end of the second spring 50 is fixedly connected with a supporting ring, the supporting ring is fixedly connected to the outer wall of the first guide post 49, the positions of the second guide post 51 and the first guide post 49 are further controlled through the arrangement of the second spring 50, and the use of the positioning pin shaft 54 is further improved.
Working principle: when the heat-conducting device is used, firstly, the relay main body 2 is clamped in the first heat-conducting plate 15, the first heat-conducting plate 15 is further inserted in the positioning shell 16, then the hinge seat 47 is driven to displace through pressing the button 43, so that the hinge seat 47 and the hinge rod 48 are hinged, the hinge rod 48 is driven to rotate and displace, further, the position control of the first guide post 49 is realized, further, the position movement of the positioning pin shaft 54 is realized, the penetrating of the positioning frame 41 is contacted, at the moment, the positioning shell 16 can be placed in the positioning frame 41, further, after the positioning frame 41 is placed stably, the positioning frame 41 and the positioning shell 16 are driven to penetrate and insert through elastic control of the first spring 46, the positioning pin shaft 54 and the positioning shell 16 are driven to realize auxiliary positioning of the positioning shell 16, and finally, the installation and positioning of the relay main body 2 are realized through the radiator 11, the use of the relay main body 2 can be realized, and when the temperature of the relay main body 2 rises to a certain value, the fan 12 and the micro-circulating pump 32 can be controlled to conduct heat through the fan 12, the heat-conducting plate is conducted out of the heat-conducting plate 14 and the heat-conducting tube 33 through the heat-conducting plate 12, the heat-conducting device is cooled, and the heat-conducting tube is cooled down heat-conducting tube is conducted to the heat-conducting device is cooled by the heat-conducting device, and the heat-conducting device is cooled by the heat-conducting device.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims (8)

1. The utility model provides a solid state relay module of high-efficient heat dissipation which characterized in that includes:
the heat radiation device comprises a first heat radiation assembly (1), wherein the first heat radiation assembly (1) comprises a radiator (11), one side of the radiator (11) is connected with a fan (12), the other side of the fan (12) is connected with a dustproof net (13), a heat conduction column (14) penetrates through the radiator (11), the top of the heat conduction column (14) is connected with a first heat conduction plate (15), a positioning shell (16) is arranged outside the first heat conduction plate (15), and the inner wall of the positioning shell (16) is connected with a baffle plate (17);
a relay body (2); the relay main body (2) is arranged inside the positioning shell (16);
the second cooling assembly (3), second cooling assembly (3) include water storage box (31), water storage box (31) fixed connection is at the upper surface of positioning shell (16), one side of water storage box (31) is provided with miniature circulating pump (32), the play water end of miniature circulating pump (32) is connected with pipe (33), the outside of pipe (33) is provided with second heat-conducting plate (34), second heat-conducting plate (34) are in between relay main part (2) and positioning shell (16).
2. The high-efficiency heat-dissipating solid state relay module of claim 1, wherein: rectangular grooves are formed in the centers of the radiators (11), radiating fins are connected to two sides of each rectangular groove, threaded holes are formed in one side, close to the fans (12), of each radiator (11), positioning holes are formed in four corners of each fan (12), and bolts penetrate through the inside of the corresponding positioning holes to the threaded holes of the radiators (11).
3. The high-efficiency heat-dissipating solid state relay module of claim 1, wherein: the relay is characterized in that the first heat conducting plate (15) is wrapped on the outer wall of the relay main body (2), three groups of heat conducting columns (14) are fixedly connected to the lower surface of the first heat conducting plate (15), a baffle plate (17) and a second heat conducting plate (34) are fixedly connected to the inner wall of the positioning shell (16), through grooves are formed in the two ends of the positioning shell (16), a circuit connecting point of the relay main body (2) is located at the through grooves, and the first heat conducting plate (15) is located inside the second heat conducting plate (34) and the baffle plate (17).
4. The high-efficiency heat-dissipating solid state relay module of claim 1, wherein: the inner wall of positioning shell (16) is provided with thermal-insulated coating, when first heat-conducting plate (15) are pegged graft in positioning shell (16) inside, the upper surface butt of first heat-conducting plate (15) is at the lower surface of baffle (17), the top of water storage tank (31) is provided with the water filling port, the one end that micro circulating pump (32) was kept away from to pipe (33) runs through to the inside of water storage tank (31), second radiating component (3) are closed loop circulation system.
5. The high-efficiency heat-dissipating solid state relay module of claim 1, wherein: the outside parcel of positioning shell (16) has locating component (4), locating component (4) include locating rack (41), locating rack (41) fixed connection is at the upper surface of radiator (11), the outer wall fixedly connected with protecting crust (42) of locating rack (41), the center of protecting crust (42) runs through there is button (43), guiding ring (44) have been cup jointed in the outside of button (43), the one end of button (43) is connected with first spring (46), the outside parcel of first spring (46) has first uide bushing (45), the outer wall fixedly connected with articulated seat (47) of button (43), the outside articulated joint of articulated joint (48) of articulated joint (47), the other end articulated joint of articulated joint (48) has first guide post (49), the outside of first guide post (49) has cup jointed second spring (50), the one end fixedly connected with third uide bushing (53), the one end of first guide post (43) is connected with first spring (46), the outside parcel has first guide post (51), the other end fixedly connected with second guide post (51) has the fixed pin roll (51), and the positioning pin shaft (54) penetrates through the positioning frame (41) to the inside of the positioning shell (16).
6. The high-efficiency heat dissipation solid state relay module of claim 5, wherein: the positioning assembly (4) is provided with two groups, the two groups of positioning assemblies (4) are respectively positioned on two sides of the positioning shell (16), the positioning frame (41) is of a U-shaped structure, through holes are formed in two ends of the positioning frame (41), positioning pin shafts (54) penetrate through the through holes, the positioning pin shafts (54) are of a U-shaped structure, through holes are formed in the centers of the protecting shells (42), buttons (43) penetrate through the interiors of the through holes, and soft rubber mats are arranged outside the buttons (43).
7. The high-efficiency heat-dissipating solid state relay module of claim 6, wherein: the utility model discloses a hinge seat, including locating rack (41), first uide bushing (45), articulated seat (47) are located in the center of articulated seat (47), first uide bushing (45) are provided with two altogether, and two first uide bushing (45) are all fixed connection at the outer wall of locating rack (41), two articulated rod (48) have been run through between first uide bushing (45) slip, one end that locating rack (41) was kept away from to uide ring (44), and the center slip of uide ring (44) has run through button (43), first spring (46) are located between locating rack (41) and button (43), articulated rod (48) are all articulated at the both ends of articulated seat (47), and the one end structure that articulated seat (47) were kept away from to two articulated rod (48) is symmetrical structure about articulated seat (47).
8. The high-efficiency heat-dissipating solid state relay module of claim 7, wherein: the novel positioning device is characterized in that the third guide sleeve (53) and the second guide sleeve (52) are fixedly connected to the outer wall of the positioning frame (41), a first guide post (49) is penetrated through the third guide sleeve (53) in a sliding mode, the cross section of the second guide post (51) is of a hexagonal structure, the cross section of the positioning pin shaft (54) is identical to that of the first guide post (49), three third guide sleeves (53) are arranged, two third guide sleeves (53) are arranged outside the first guide post (49), the other third guide sleeve (53) is arranged outside the positioning pin shaft (54), one end of the second spring (50) is fixedly connected to the outer wall of the third guide sleeve (53), the other end of the second spring (50) is fixedly connected with a supporting ring, and the supporting ring is fixedly connected to the outer wall of the first guide post (49).
CN202310031226.7A 2023-01-10 2023-01-10 High-efficient radiating solid-state relay module Pending CN116153718A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202310031226.7A CN116153718A (en) 2023-01-10 2023-01-10 High-efficient radiating solid-state relay module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202310031226.7A CN116153718A (en) 2023-01-10 2023-01-10 High-efficient radiating solid-state relay module

Publications (1)

Publication Number Publication Date
CN116153718A true CN116153718A (en) 2023-05-23

Family

ID=86353755

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202310031226.7A Pending CN116153718A (en) 2023-01-10 2023-01-10 High-efficient radiating solid-state relay module

Country Status (1)

Country Link
CN (1) CN116153718A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116344267A (en) * 2023-05-29 2023-06-27 深圳三铭电气有限公司 Relay module with heat dissipation mechanism is favorable to operation

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116344267A (en) * 2023-05-29 2023-06-27 深圳三铭电气有限公司 Relay module with heat dissipation mechanism is favorable to operation
CN116344267B (en) * 2023-05-29 2023-07-21 深圳三铭电气有限公司 Relay module with heat dissipation mechanism is favorable to operation

Similar Documents

Publication Publication Date Title
CN202127079U (en) Water-cooling system of power battery pack of electric automobile based on thermoelectric cooling
CN108390123A (en) A kind of power battery pack heat management system and automobile
CN116153718A (en) High-efficient radiating solid-state relay module
CN101500398A (en) Heat radiation structure for motor driver
CN110062565B (en) Soaking plate reinforcing server heat dissipation device and method based on thermoelectric refrigeration technology
CN203523173U (en) Communication module supporting OpenVPX standard and electronic device using communication module
CN219834732U (en) Heat dissipation type microwave power amplifier
CN209964458U (en) Heat preservation and dissipation device of sealed cabin
CN114496476A (en) High-efficient radiator for transformer
CN103138183A (en) Semiconductor refrigeration radiator for sealed power distribution cabinet
CN209994241U (en) Automatic heat dissipation device of generator
CN213214144U (en) Refrigerating device and server that integration set up
CN108183094A (en) A kind of combined heat radiating system
CN211376741U (en) Power lithium battery thermal management box
CN207800596U (en) A kind of combined heat radiating system
CN207408845U (en) Temperature control module, temperature conditioning unit and incubator
CN215337179U (en) Energy-saving heat dissipation structure of semiconductor refrigerating device
CN213024276U (en) Water-cooled computer server heat dissipation equipment
CN112768828B (en) Temperature self-adjusting type electric power supply equipment
CN215008371U (en) Shell structure for liquid cooling plate
CN220383453U (en) Servo driver heat abstractor
CN218770826U (en) Cooling system for internal ring temperature of power supply equipment
CN215453776U (en) Integrated heat dissipation power module
CN213959022U (en) Lithium battery module temperature processing device based on semiconductor refrigeration heats
CN117355111B (en) Vehicle-mounted super-calculation shelter heat dissipation system

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination