CN116153201A - Display module, manufacturing method thereof and display device - Google Patents
Display module, manufacturing method thereof and display device Download PDFInfo
- Publication number
- CN116153201A CN116153201A CN202310196505.9A CN202310196505A CN116153201A CN 116153201 A CN116153201 A CN 116153201A CN 202310196505 A CN202310196505 A CN 202310196505A CN 116153201 A CN116153201 A CN 116153201A
- Authority
- CN
- China
- Prior art keywords
- adhesive layer
- heat dissipation
- layer
- opening pattern
- area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 31
- 230000017525 heat dissipation Effects 0.000 claims abstract description 85
- 238000005452 bending Methods 0.000 claims abstract description 70
- 239000000463 material Substances 0.000 claims abstract description 70
- 238000000034 method Methods 0.000 claims abstract description 23
- 230000002093 peripheral effect Effects 0.000 claims abstract description 8
- 239000010410 layer Substances 0.000 claims description 94
- 239000012790 adhesive layer Substances 0.000 claims description 92
- 230000001070 adhesive effect Effects 0.000 claims description 14
- 239000000853 adhesive Substances 0.000 claims description 13
- 239000003292 glue Substances 0.000 claims description 13
- 239000006260 foam Substances 0.000 claims description 8
- 229920001296 polysiloxane Polymers 0.000 claims description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 7
- 239000000741 silica gel Substances 0.000 claims description 7
- 229910002027 silica gel Inorganic materials 0.000 claims description 7
- 239000002390 adhesive tape Substances 0.000 claims description 5
- 230000014759 maintenance of location Effects 0.000 claims description 4
- 238000010030 laminating Methods 0.000 claims description 2
- 230000001681 protective effect Effects 0.000 description 8
- 239000000499 gel Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000013464 silicone adhesive Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 101000801619 Homo sapiens Long-chain-fatty-acid-CoA ligase ACSBG1 Proteins 0.000 description 1
- 102100033564 Long-chain-fatty-acid-CoA ligase ACSBG1 Human genes 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 235000010634 bubble gum Nutrition 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The disclosure provides a display module, a manufacturing method thereof and a display device, wherein the display module comprises: the display panel comprises a display area and a peripheral area positioned at the periphery of the display area, wherein the peripheral area comprises a bending area; and a back film assembly attached to a backlight side of the display panel; the back film assembly includes: a back film body including a first region attached to at least the display region and a second region attached to at least the inflection region; and the heat dissipation film body is attached to one side, away from the display panel, of the back film body, the heat dissipation film body comprises a plurality of stacked film layers, at least part of the film layers comprise an opening pattern, and orthographic projection of the opening pattern on the back film body is at least partially overlapped with the second area. The display module, the manufacturing method thereof and the display device can reduce material cost, reduce production procedures and improve production efficiency.
Description
Technical Field
The present invention relates to the field of display technologies, and in particular, to a display module, a manufacturing method thereof, and a display device.
Background
In the related art, with the development of display technology, the display module product needs to continuously reduce the cost while improving the quality, and the cost relates to production operation, materials and the like. Therefore, how to reduce the number of materials used, reduce the production process, and improve the production efficiency is important.
Disclosure of Invention
The embodiment of the disclosure provides a display module, a manufacturing method thereof and a display device, which can reduce material cost, reduce production procedures and improve production efficiency.
The technical scheme provided by the embodiment of the disclosure is as follows:
a display module, comprising:
the display panel comprises a display area and a peripheral area positioned at the periphery of the display area, wherein the peripheral area comprises a bending area; and
A back film assembly attached to a backlight side of the display panel;
wherein, the backing film assembly includes:
a back film body including a first region attached to at least the display region and a second region attached to at least the inflection region; and
Laminating to the notacoria body deviate from the heat dissipation film body of one side of display panel, the heat dissipation film body is including stacking a plurality of retes that set up, just at least part rete in a plurality of retes includes the opening pattern, the opening pattern orthographic projection on the notacoria body with the second district at least partially coincides.
Illustratively, the plurality of film layers includes: a heat dissipation material layer and an adhesive layer attached between the back film body and the heat dissipation material layer, wherein
And removing the materials of the heat dissipation material layer and the adhesive layer at the position corresponding to the second area to form the opening pattern.
Illustratively, the plurality of film layers includes: a heat dissipation material layer and an adhesive layer attached between the back film body and the heat dissipation material layer, wherein
Orthographic projection of the adhesive layer on the back film body is at least partially overlapped with the first area and the second area; the heat dissipation material layer comprises a retention pattern for retaining the heat dissipation material and the opening pattern for removing the heat dissipation material, and the opening pattern exposes at least part of the adhesive layer in the second area.
Illustratively, the gel layer includes a mesh gel layer and a foam gel layer, the mesh gel layer being located between the foam gel layer and the backing film body.
The heat dissipation material layer is attached to the first adhesive layer on the side facing the adhesive layer, and the first adhesive layer is removed from the opening pattern and is only attached between the reserved pattern and the adhesive layer so as to connect the heat dissipation material layer and the adhesive layer.
Illustratively, a double-sided tape is attached to a surface of a portion of the adhesive layer exposed by the opening pattern.
In an exemplary embodiment, when the opening pattern exposes at least a portion of the adhesive layer in the second area, the adhesive layer is attached to a second adhesive layer on a side facing the heat dissipation material layer, and at least a portion of the second adhesive layer is located in the remaining pattern to adhere and connect the heat dissipation material layer and the adhesive layer, and at least another portion of the second adhesive layer is located on a surface of a portion of the adhesive layer exposed by the opening pattern.
Illustratively, the adhesive layer includes a tacky silicone adhesive layer, and at least one portion of the silicone adhesive layer is located on the retention pattern to adhesively connect the heat dissipating material layer, and at least another portion is exposed by the opening pattern.
A method of manufacturing a display module, for manufacturing a display module as described above, the method comprising the steps of:
attaching the back film assembly to a backlight side of the display panel;
bending the bending region, wherein the second region of the back film body and/or a part of the film layer of the heat dissipation film body, which is reserved without the opening pattern in the second region, is used as a protection structure of the bending region;
and adhering and fixing the bent area after bending on the backlight side of the display panel.
Exemplary, the attaching and fixing the bent area after bending to the backlight side of the display panel specifically includes:
when double-sided adhesive tape is attached to the surface of the part of the adhesive layer exposed by the opening pattern, the bending area is fixed through the double-sided adhesive tape;
when a second adhesive layer is attached to one side of the adhesive layer facing the heat dissipation material layer and at least part of the second adhesive layer is positioned on the surface of the adhesive layer exposed by the opening pattern, the bending area is fixed through the second adhesive layer in a sticking mode;
when the adhesive layer comprises a sticky silica gel layer and the silica gel layer is at least partially exposed by the opening pattern, the bending area is stuck and fixed through the silica gel layer.
A display device comprises the display module.
The embodiment of the disclosure also provides a display device, which comprises the display module.
The beneficial effects brought by the embodiment of the disclosure are as follows:
in the above scheme, the back film body and the heat dissipation film body of the display module extend to the bending area of the display panel, and the heat dissipation film body is subjected to patterning design, and at least part of the film layer of the heat dissipation material layer is removed at the position of the bending area to form the opening pattern, so that the back film body and/or part of the adhesive layer reserved in the heat dissipation film body can be directly used as a protection structure of the bending area, namely, the bending area is protected by replacing protection adhesive in the related art, and the protection adhesive coating procedure in the related art is reduced.
Therefore, the display module, the manufacturing method thereof and the display device provided by the embodiment of the disclosure can effectively reduce the total cost of materials, reduce the working procedures, reduce the production loss and shorten the production time.
Drawings
FIG. 1 is a schematic diagram of a display module according to the related art;
fig. 2 is a schematic structural diagram of a display module according to some exemplary embodiments of the present disclosure;
fig. 3 is a front view illustrating a structure of a display module according to other exemplary embodiments of the present disclosure;
fig. 4 is a front view illustrating a structure of a display module provided in other embodiments of the present disclosure;
FIG. 5 is a cross-sectional view of the back film assembly of the display module of some embodiments of the present disclosure taken in the X-X' direction of FIG. 4 before the bending region is unbent;
FIG. 6 is a cross-sectional view of the back film assembly of the display module of the embodiment of FIG. 5 after bending in the bending region;
FIG. 7 is a cross-sectional view taken along line X-X' in FIG. 3 of a back film assembly of a display module according to some embodiments of the present disclosure before bending of the bending region;
FIG. 8 is a cross-sectional view of the back film assembly of the display module of the embodiment of FIG. 7 after bending in the bending region;
FIG. 9 is a cross-sectional view taken along line X-X' in FIG. 3 of a back film assembly of a display module according to other embodiments of the present disclosure before bending of the bending region;
fig. 10 is a cross-sectional view of the back film assembly of the display module of the embodiment of fig. 9 after bending in the bending region.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present disclosure more apparent, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present disclosure. It will be apparent that the described embodiments are some, but not all, of the embodiments of the present disclosure. All other embodiments, which can be made by one of ordinary skill in the art without the need for inventive faculty, are within the scope of the present disclosure, based on the described embodiments of the present disclosure.
Unless defined otherwise, technical or scientific terms used in this disclosure should be given the ordinary meaning as understood by one of ordinary skill in the art to which this disclosure belongs. The terms "first," "second," and the like, as used in this disclosure, do not denote any order, quantity, or importance, but rather are used to distinguish one element from another. Likewise, the terms "a," "an," or "the" and similar terms do not denote a limitation of quantity, but rather denote the presence of at least one. The word "comprising" or "comprises", and the like, means that elements or items preceding the word are included in the element or item listed after the word and equivalents thereof, but does not exclude other elements or items. The terms "connected" or "connected," and the like, are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", etc. are used merely to indicate relative positional relationships, which may also be changed when the absolute position of the object to be described is changed.
Before describing in detail the back film, the display module, the manufacturing method thereof, and the display device provided in the embodiments of the present disclosure, the following description is necessary for the related art:
in the related art, in the manufacturing process of the display module, the backing film and the heat dissipation film in the materials are separately supplied and separately attached, and as shown in fig. 1, the backing film 1 and the heat dissipation film 2 only cover the display area, and the backing film 1 and the heat dissipation film 2 have a grooved area at the corresponding position of the bending area 3 of the display panel 5, so before the bending process, the protective adhesive 4 needs to be separately coated to protect the bending area, and the flexible circuit board for fixing the bending area 3 is adhered by setting the double sided adhesive 6 on the bending area 3.
In order to reduce cost and production procedures, the embodiment of the disclosure provides a display module, a manufacturing method thereof and a display device.
As shown in fig. 2 to 10, a display module provided in an embodiment of the disclosure includes:
the display panel 10 and the back film assembly 20 attached to the backlight side of the display panel 10, wherein the display panel 10 comprises a display area A and a peripheral area positioned at the periphery of the display area A, and the peripheral area comprises a bending area B positioned at one side of the binding flexible circuit board. It should be noted that the Bending region B is bent (Bending) during the display module manufacturing process and is adhered and fixed to the backlight side of the display panel 10.
The back film assembly 20 includes:
a back film body 21, wherein the back film body 21 includes a first area a 'attached to at least the display area a and a second area B' attached to at least the bending area B, that is, the back film body 21 may cover the display area a and extend to cover the bending area B; and
The heat dissipation film body 22 attached to one side of the back film body 21 facing away from the display panel 10, the heat dissipation film body 22 includes a plurality of stacked film layers, and at least a part of the film layers include an opening pattern, and an orthographic projection of the opening pattern on the back film body 21 is at least partially overlapped with the second area B'.
In the above-mentioned scheme, the back film body 21 and the heat dissipation film body 22 are extended to the bending region B of the display panel 10, and the heat dissipation film body 22 is patterned and contoured, and at least a portion of the film layer in the heat dissipation material layer 221 is removed at the position of the bending region B to form the opening pattern 221B.
In some embodiments, the back film body 21 and the heat dissipation film body 22 are integrally designed, so that the heat dissipation film body 22 can be attached to the back film assembly 20 at the same time, and compared with the manufacturing process of the display module in the related art, the process of attaching the module can be reduced, and meanwhile, the collision damage to the display panel 10 in the manufacturing process can be reduced.
In some embodiments, as shown in fig. 2, the heat dissipation film body 22 includes: the heat dissipation material layer 221 and the adhesive layer 222 attached between the back film body 21 and the heat dissipation material layer 221, wherein the materials of the heat dissipation material layer 221 and the adhesive layer 222 are removed at the position corresponding to the second region B', so as to form the opening pattern 221B. That is, the material of the heat dissipation film body 22 is removed entirely at the position corresponding to the second region B'. Therefore, the back film body can replace the protective adhesive in the related technology to protect the bending area, so that the coating procedure of the protective adhesive is reduced, and the process is simplified.
In other embodiments, as shown in fig. 3 to 10, the heat dissipation film body 22 includes: a heat dissipation material layer 221, and a glue layer 222 attached between the back film body 21 and the heat dissipation material layer 221, wherein the orthographic projection of the glue layer 222 on the back film body 21 is at least partially overlapped with the first area a 'and the second area B';
the heat dissipation material layer 221 includes a retention pattern 221a for retaining heat dissipation material and an opening pattern 221B for removing heat dissipation material, where an orthographic projection of the opening pattern 221B on the back film body 21 is at least partially overlapped with the bending region B, so as to expose at least a portion of the adhesive layer 222 located in the bending region B. That is, the heat dissipation film body 22 is thinned at the bending region B, the heat dissipation material layer 221 is removed at the opening pattern 221B, and the adhesive layer 222 is remained at the opening pattern 221B.
In the above-mentioned scheme, the heat dissipation film body 22 is patterned and contoured, the heat dissipation material layer 221 is removed at the position of the bending region B to form the opening pattern 221B, and the glue layer 222 on the heat dissipation film body 22 is remained, so that the glue layer 222 of the heat dissipation film body 22 is exposed, and the part of the glue layer 222 exposed by the opening pattern 221B can be directly used as the protective glue of the bending region B, i.e. replace the protective glue in the related art to protect the bending region, so as to reduce the protective glue coating procedure in the related art.
Therefore, the back film assembly 20 provided by the embodiment of the disclosure can effectively reduce the total cost of materials by integrating the back film assembly 20 and the heat dissipation film materials, and simultaneously can reduce a plurality of working procedures, reduce the loss of production and shorten the production time; meanwhile, as the heat dissipation film is attached at the same time in the attaching process of the back film assembly 20, the heat dissipation film can be used in advance in the process to protect the display panel 10, so that the collision of the panel in the process is reduced, and the production yield is improved.
In some embodiments, the material of the heat dissipation material layer 221 may be any suitable heat dissipation material, such as copper foil.
In some exemplary embodiments, as shown in fig. 4 and 5, the adhesive layer 222 may include a mesh adhesive layer 2221 and a foam adhesive layer 2222, the mesh adhesive layer 2221 being located between the foam adhesive layer 2222 and the back film body 21. In the above-mentioned scheme, the foam adhesive layer 2222 may replace the protective adhesive in the related art to protect the bending region of the bending region B, so as to reduce the protective adhesive coating process.
The foam adhesive layer 2222 is adhered to and fixed with the heat dissipation material layer 221. Specifically, as shown in fig. 5 and 6, in some exemplary embodiments, the heat dissipation material layer 221 is attached with a first adhesive layer 23 at a side facing the adhesive layer 222, and when only the heat dissipation material layer 221 is removed at the bending region B, the first adhesive layer 23 is removed along with the heat dissipation material layer 221 at the opening pattern 221B, and is attached only between the remaining pattern 221a and the adhesive layer 222 to connect the heat dissipation material layer 221 and the adhesive layer 222. That is, the heat dissipation material layer 221 itself adheres to the first adhesive layer 23, and when the heat dissipation material layer 221 of the opening pattern 221b is removed, the first adhesive layer 23 of the opening pattern 221b is simultaneously removed, so that the bubble gum layer 2222 is exposed at the opening pattern 221b portion. At this time, as shown in fig. 3, a double-sided tape 26 may be attached to a surface of the portion of the adhesive layer 222 exposed by the opening pattern 221B, and the bending region B may be adhered and fixed on the backlight side of the display panel 10 through the double-sided tape 26.
In other exemplary embodiments, as shown in fig. 7 and 8, when the opening pattern exposes at least a portion of the adhesive layer located in the second region B', the adhesive layer 222 is attached with a second adhesive layer 24 on a side facing the heat dissipation material layer 221, and at least a portion of the second adhesive layer 24 is located in the remaining pattern 221a to attach the heat dissipation material layer 221 to the adhesive layer 222, and at least another portion is located on a surface of the portion of the adhesive layer 222 exposed by the opening pattern 221B. That is, the second adhesive layer 24 is attached to the adhesive layer 222 itself, and when the heat dissipation material layer 221 of the opening pattern 221b is removed, the second adhesive layer 24 of the opening pattern 221b is not removed, so that the second adhesive layer 24 is remained and exposed at the opening pattern 221b. At this time, as shown in fig. 4, the portion of the second adhesive layer 24 exposed by the opening pattern 221B may not be adhered with a double-sided adhesive, and the bending region B may be directly adhered and fixed on the backlight side of the display panel 10 by using the portion of the second adhesive layer 24 exposed by the opening pattern 221B, so that, compared with the process of adhering and fixing using an adhesive pad or the like when bending the bending region B in the related art, the process of adhering and fixing directly without adhering an adhesive pad or the like separately is not required, thereby reducing the process and saving materials.
In addition, in other exemplary embodiments, as shown in fig. 9 and 10, the adhesive layer 222 may include a silicone layer 25 having an adhesive property, and when only the heat dissipation material layer 221 is removed at the bending region B, at least a portion of the silicone layer 25 is positioned on the remaining pattern 221a to be adhered to the heat dissipation material layer 221, at least another portion is exposed by the opening pattern 221B. Therefore, the silica gel layer 25 can be directly used for adhering and fixing the bending region B instead of double-sided adhesive tape and the like in the related technology in the process of bending the bending region B, so that the working procedures are reduced, and the materials are saved.
In addition, the embodiment of the disclosure further provides a manufacturing method of the display module, which is used for manufacturing the display module provided by the embodiment of the disclosure, and the method comprises the following steps:
step S01, attaching the back film assembly 20 to the backlight side of the display panel 10;
step S02, bending the bending region B, wherein the second region B 'of the back film body 21 and/or a portion of the film layer of the heat dissipation film body 22 that is not provided with the opening pattern 221B but remains in the second region B' is used as a protection structure of the bending region B;
step S03, adhering and fixing the folded area B on the backlight side of the display panel 10.
Illustratively, step S03 specifically includes:
when a double-sided tape is attached to the surface of the portion of the adhesive layer 222 exposed by the opening pattern 221B (i.e., the back film assembly 20 as shown in fig. 5 and 6), the bending region B is fixed by the double-sided tape;
when the second adhesive layer 24 is attached to the adhesive layer 222 at a side facing the heat dissipation material layer 221 and the second adhesive layer 24 is at least partially located on a surface of a portion of the adhesive layer 222 exposed by the opening pattern 221B (i.e., the back film assembly 20 as shown in fig. 7 and 8), the bending region B is attached and fixed by the second adhesive layer 24;
when the adhesive layer 222 includes the adhesive silicone layer 25 and the silicone layer 25 is at least partially exposed by the opening pattern 221B (i.e., the back film assembly 20 as shown in fig. 9 and 10), the bending region B is adhered and fixed by the silicone layer 25.
The embodiment of the disclosure also provides a display device, which comprises the display module provided by the embodiment of the disclosure.
The following points need to be described:
(1) The drawings of the embodiments of the present disclosure relate only to the structures related to the embodiments of the present disclosure, and other structures may refer to the general design.
(2) In the drawings for describing embodiments of the present disclosure, the thickness of layers or regions is exaggerated or reduced for clarity, i.e., the drawings are not drawn to actual scale. It will be understood that when an element such as a layer, film, region or substrate is referred to as being "on" or "under" another element, it can be "directly on" or "under" the other element or intervening elements may be present.
(3) The embodiments of the present disclosure and features in the embodiments may be combined with each other to arrive at a new embodiment without conflict.
The above is merely a specific embodiment of the disclosure, but the protection scope of the disclosure should not be limited thereto, and the protection scope of the disclosure should be subject to the claims.
Claims (11)
1. A display module, comprising:
the display panel comprises a display area and a peripheral area positioned at the periphery of the display area, wherein the peripheral area comprises a bending area; and
A back film assembly attached to a backlight side of the display panel;
the back film assembly is characterized by comprising:
a back film body including a first region attached to at least the display region and a second region attached to at least the inflection region; and
Laminating to the notacoria body deviate from the heat dissipation film body of one side of display panel, the heat dissipation film body is including stacking a plurality of retes that set up, just at least part rete in a plurality of retes includes the opening pattern, the opening pattern orthographic projection on the notacoria body with the second district at least partially coincides.
2. The display module assembly of claim 1, wherein the display module assembly comprises,
the plurality of film layers includes: a heat dissipation material layer and an adhesive layer attached between the back film body and the heat dissipation material layer, wherein
And removing the materials of the heat dissipation material layer and the adhesive layer at the position corresponding to the second area to form the opening pattern.
3. The display module assembly of claim 1, wherein the display module assembly comprises,
the plurality of film layers includes: a heat dissipation material layer and an adhesive layer attached between the back film body and the heat dissipation material layer, wherein
Orthographic projection of the adhesive layer on the back film body is at least partially overlapped with the first area and the second area; the heat dissipation material layer comprises a retention pattern for retaining the heat dissipation material and the opening pattern for removing the heat dissipation material, and the opening pattern exposes at least part of the adhesive layer in the second area.
4. A display module according to claim 3, wherein the glue layer comprises a mesh glue layer and a foam glue layer, the mesh glue layer being located between the foam glue layer and the back film body.
5. The display module of claim 4, wherein the heat dissipation material layer is attached to a first adhesive layer on a side facing the adhesive layer, the first adhesive layer is removed at the opening pattern and is only attached between the remaining pattern and the adhesive layer to connect the heat dissipation material layer and the adhesive layer.
6. The display module assembly of claim 5, wherein a portion of the adhesive layer exposed by the opening pattern has a double sided tape attached thereto.
7. The display module of claim 4, wherein when the opening pattern exposes at least a portion of the adhesive layer located in the second area, a second adhesive layer is attached to a side of the adhesive layer facing the heat dissipation material layer, and at least a portion of the second adhesive layer is located in the remaining pattern to attach the heat dissipation material layer to the adhesive layer, and at least another portion of the second adhesive layer is located on a surface of a portion of the adhesive layer exposed by the opening pattern.
8. A display module according to claim 3, wherein the adhesive layer comprises an adhesive silicone layer, and at least one part of the silicone layer is located on the reserved pattern to be adhered to the heat dissipation material layer, and at least another part of the silicone layer is exposed by the opening pattern.
9. A method of manufacturing a display module according to any one of claims 1 to 8, the method comprising the steps of:
attaching the back film assembly to a backlight side of the display panel;
bending the bending region, wherein the second region of the back film body and/or a part of the film layer of the heat dissipation film body, which is reserved without the opening pattern in the second region, is used as a protection structure of the bending region;
and adhering and fixing the bent area after bending on the backlight side of the display panel.
10. The method of claim 9, wherein when the backsheet assembly is a backsheet assembly as recited in claim 3,
the step of adhering and fixing the bent bending area on the backlight side of the display panel specifically includes:
when double-sided adhesive tape is attached to the surface of the part of the adhesive layer exposed by the opening pattern, the bending area is fixed through the double-sided adhesive tape;
when a second adhesive layer is attached to one side of the adhesive layer facing the heat dissipation material layer and at least part of the second adhesive layer is positioned on the surface of the adhesive layer exposed by the opening pattern, the bending area is fixed through the second adhesive layer in a sticking mode;
when the adhesive layer comprises a sticky silica gel layer and the silica gel layer is at least partially exposed by the opening pattern, the bending area is stuck and fixed through the silica gel layer.
11. A display device comprising a display module according to any one of claims 1 to 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310196505.9A CN116153201A (en) | 2023-03-02 | 2023-03-02 | Display module, manufacturing method thereof and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310196505.9A CN116153201A (en) | 2023-03-02 | 2023-03-02 | Display module, manufacturing method thereof and display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116153201A true CN116153201A (en) | 2023-05-23 |
Family
ID=86354354
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310196505.9A Pending CN116153201A (en) | 2023-03-02 | 2023-03-02 | Display module, manufacturing method thereof and display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116153201A (en) |
-
2023
- 2023-03-02 CN CN202310196505.9A patent/CN116153201A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110491883B (en) | Display panel, manufacturing method thereof and display device | |
| JP3909485B2 (en) | Optical fiber interconnection device and manufacturing method thereof | |
| CN109873020B (en) | Laminated film material, display panel, display device and preparation method of display panel | |
| CN113241341A (en) | Display module, preparation method thereof and display device | |
| CN106853704A (en) | Interior rupture pressure disc for many curved surface touch-control display modules and preparation method thereof | |
| CN113436530A (en) | Display module, manufacturing method thereof and display device | |
| CN112863371B (en) | Manufacturing method of spliced display screen and spliced display screen | |
| CN103649971A (en) | RFID inlet antenna and RFID employing same | |
| CN104916550A (en) | Method for manufacturing flexible substrate and substrate structure | |
| CN113112917B (en) | Display device and method for manufacturing the same | |
| CN116153201A (en) | Display module, manufacturing method thereof and display device | |
| CN215578551U (en) | Display module and display device | |
| CN114267254A (en) | Display module, manufacturing method thereof and display device | |
| JP4552503B2 (en) | Method for manufacturing flexible wiring board with reinforcing plate | |
| CN116056350A (en) | Preparation method of substrate-free curved glass transparent antenna | |
| CN104501038A (en) | Backlight moduleassembly | |
| CN110791220A (en) | Transparent polyimide composite film for flexible display and method for manufacturing the same | |
| JP5137723B2 (en) | RFID label sheet and RFID label | |
| TW201518467A (en) | Dicing/die-bonding tape and method for manufacturing semiconductor chip provided with adhesive layer | |
| JP2000268153A (en) | Manufacture of non-contact data carrier | |
| JPH027491A (en) | Manufacture of solid forming printed circuit board and plating formation film of forming die | |
| CN213924599U (en) | Support membrane and flexible display panel | |
| CN113809445B (en) | Battery cover back adhesive structure, battery cover back adhesive assembly method and mobile terminal | |
| CN114615804B (en) | Manufacturing method of flexible circuit board with 180-degree bending single-sided golden finger and two-sided plugging function | |
| CN113050214B (en) | Display panel and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |