CN116133492A - Display module and display device - Google Patents
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- CN116133492A CN116133492A CN202211517658.0A CN202211517658A CN116133492A CN 116133492 A CN116133492 A CN 116133492A CN 202211517658 A CN202211517658 A CN 202211517658A CN 116133492 A CN116133492 A CN 116133492A
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Abstract
The utility model discloses a display module assembly and display device, the display module assembly includes display panel, be equipped with the binding structure on the display panel, bind flexible circuit board on the binding pin, set up the adhesive layer and bond flexible circuit board and binding structure together, the edge of adhesive layer is closer to the display area than the edge of flexible circuit board in first direction, the edge of flexible circuit board and the edge of adhesive layer are the distance of first direction, be flexible circuit board in the ascending size of second direction 0.05-0.125 times, can increase the area that the adhesive layer covers flexible circuit board and binding structure, thereby strengthen the electric connection reliability and the mechanical connection intensity between flexible circuit board and the binding structure, improve display module assembly's reliability. The disclosure also provides a display device including the display module.
Description
Technical Field
The disclosure relates to the technical field of display, in particular to a display module and a display device.
Background
In the manufacturing process of the display module, the reliability of the electrical connection and the reliability of the mechanical connection of the bonding structure (bonding pad) of the display panel and the flexible circuit board (Flexible Printed Circuit, FPC) have a decisive influence on the display effect.
After the flexible circuit board is connected with the binding structure, an adhesive layer is arranged between the binding structure and the flexible circuit board for adhesion and protection, however, the adhesive layer is not reasonable enough, and the reliability of the display module is poor.
It should be noted that the information disclosed in the above background section is only for enhancing understanding of the background of the present disclosure and thus may include information that does not constitute prior art known to those of ordinary skill in the art.
Disclosure of Invention
The purpose of the present disclosure is to provide a display module and a display device, which solve the problem of poor reliability and stability of the display module due to unreasonable setting of an adhesive layer.
According to one aspect of the disclosure, a display module is provided, including a display panel, a flexible circuit board, and an adhesive layer, the display panel has a display area and a non-display area located outside the display area, the non-display area includes a binding area, and the binding area is provided with a binding structure; the flexible circuit board is bound on the binding structure; the bonding layer is connected between the flexible circuit board and the binding structure, the edge of the bonding layer is closer to the display area than the edge of the flexible circuit board in the first direction, the distance between the edge of the flexible circuit board and the edge of the bonding layer in the first direction is 0.05-0.125 times of the dimension of the flexible circuit board in the second direction, and the second direction is perpendicular to the first direction.
In one embodiment of the present disclosure, the edge of the flexible circuit board in the second direction is located between the edges of the adhesive layer in the second direction, and the distance between the edge of the flexible circuit board and the edge of the adhesive layer in the second direction is 0.02-0.0625 times the size of the flexible circuit board in the second direction.
In one embodiment of the present disclosure, an edge of the binding structure is closer to the display area than an edge of the flexible circuit board in the first direction, and an edge of the adhesive layer is closer to the display area than an edge of the binding structure in the first direction; the edge of the binding structure in the second direction is positioned outside the edge of the flexible circuit board in the second direction and between the edges of the adhesive layer in the second direction.
In one embodiment of the present disclosure, the distance between the edge of the binding structure and the edge of the adhesive layer in the first direction is 0.025-0.04375 times the size of the flexible circuit board in the second direction.
In one embodiment of the present disclosure, the distance between the edge of the binding structure and the edge of the adhesive layer in the second direction is 0.01-0.0375 times the size of the flexible circuit board in the second direction.
In an embodiment of the disclosure, the display module further includes a cover plate, the cover plate is disposed on a display side of the display panel, an orthographic projection of the cover plate on the display panel covers the display area and a part of the non-display area, and exposes the binding area, and the adhesive layer extends to an edge of the cover plate along the first direction and is connected with the edge of the cover plate.
In one embodiment of the present disclosure, a side of the adhesive layer close to the cover plate is flush with a side of the cover plate away from the display panel, and the adhesive layer is made of an opaque adhesive material.
In one embodiment of the disclosure, the non-display area includes an alignment area, and the alignment area is close to one side of the non-display area away from the display area along the first direction, and the orthographic projection of the adhesive layer on the display panel and the alignment area do not overlap each other.
In one embodiment of the disclosure, a display panel includes a driving back plate, a pixel layer, a driving back plate, a first packaging layer, a color film layer and a second packaging layer, wherein the pixel layer is arranged on a driving side of the driving back plate; the first packaging layer is arranged on one side of the pixel layer, which is far away from the driving backboard; the color film layer is arranged on one side of the first packaging layer, which is far away from the driving backboard; the second packaging layer is arranged on one side of the color film layer away from the driving backboard.
According to another aspect of the present disclosure, there is provided a display device including the display module set according to one aspect of the present disclosure.
The display module of this disclosure includes display panel, be equipped with the binding structure on the display panel, bind flexible circuit board on binding the pin, set up the adhesive linkage and bond flexible circuit board and bind the structure together, the edge of adhesive linkage is closer to the display area than the edge of flexible circuit board in first direction, the edge of flexible circuit board and the edge of adhesive linkage are at first direction's distance, be flexible circuit board 0.05-0.125 in the ascending size of second direction, can increase the area that the adhesive linkage covered flexible circuit board and binding the structure, thereby strengthen the flexible circuit board and bind the electric connection reliability and the mechanical connection intensity between the structure, improve display module assembly's reliability.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the disclosure and together with the description, serve to explain the principles of the disclosure. It will be apparent to those of ordinary skill in the art that the drawings in the following description are merely examples of the disclosure and that other drawings may be derived from them without undue effort.
Fig. 1 is a schematic plan view of a display module according to an embodiment of the disclosure.
Fig. 2 is a perspective view of another display module according to an embodiment of the present disclosure.
Fig. 3 is a schematic plan view of another display module according to an embodiment of the disclosure.
Fig. 4 is a schematic plan view of another display module according to an embodiment of the disclosure.
Fig. 5 is a schematic cross-sectional view of another display module according to an embodiment of the disclosure.
Fig. 6 is a schematic cross-sectional view of a display panel of another display surface module according to an embodiment of the disclosure.
In the figure: 100-display panel, 101-display area, 102-non-display area, 1021-first sub-area, 1022-second sub-area, 1023-third sub-area, 1024-fourth sub-area, 1025-bonding structure, 1-driving back plate, 10-substrate, 11-transistor, 111-gate, 112-active layer, 113-first pole, 114-second pole, 115-gate insulating layer, 12-first transistor, 13-second transistor, 14-contact hole, 15-insulating layer, 151-interlayer dielectric layer, 152-protective layer, 153-planarization layer, 16-third conductive layer, 18-buffer layer, 19-drive circuit layer, 2-pixel layer, 21-first conductive layer, 22-light emitting unit layer, 23-second conductive layer, 220-subpixel, 2201-first subpixel, 2202-second subpixel, 2203-third subpixel, 221-first electrode, 222-second electrode, 223-light emitting unit, 224-pixel defining layer, 3-color film layer, 31-black matrix, 32-sub-filter unit, 4-package layer group, 41-first package layer, 42-second package layer, 5-cover plate, 6-adhesive layer, 7-flexible circuit board.
Detailed Description
Example embodiments will now be described more fully with reference to the accompanying drawings. However, the exemplary embodiments can be embodied in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the example embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and thus detailed descriptions thereof will be omitted. Furthermore, the drawings are merely schematic illustrations of the present disclosure and are not necessarily drawn to scale.
Although relative terms such as "upper" and "lower" are used in this specification to describe the relative relationship of one component of an icon to another component, these terms are used in this specification for convenience only, such as in terms of the orientation of the examples described in the figures. It will be appreciated that if the device of the icon is flipped upside down, the recited "up" component will become the "down" component. When a structure is "on" another structure, it may mean that the structure is integrally formed with the other structure, or that the structure is "directly" disposed on the other structure, or that the structure is "indirectly" disposed on the other structure through another structure.
The terms "a," "an," "the," "said" and "at least one" are used to indicate the presence of one or more elements/components/etc.; the terms "comprising" and "having" are intended to be inclusive and mean that there may be additional elements/components/etc. in addition to the listed elements/components/etc.; the terms "first," "second," and "third," etc. are used merely as labels, and do not limit the number of their objects.
The Micro-OLED Micro display device adopts a monocrystalline silicon Wafer (Wafer) as a backboard, has the characteristics of self-luminescence, thin thickness, light weight, large visual angle, short response time, high luminous efficiency and the like, is easier to realize the excellent characteristics of high pixel density (PPI), small volume, easy carrying, low power consumption and the like, and is widely applied to the near-eye display, virtual reality and augmented reality fields, in particular to an AR/VR head-mounted display device.
The AR/VR device may be present in different environments, and thus reliability of the display module is critical. The reliability of the electrical connection and the reliability of the mechanical connection of the bonding pad of the display panel to the flexible circuit board (Flexible Printed Circuit, FPC) have a decisive influence on the reliability. After the flexible circuit board is connected with the binding pads, an adhesive layer is arranged between the binding structure and the flexible circuit board for adhesion, so that the flexible circuit board can be fixed on the binding structure, and normal output of electrical signals is realized.
As shown in fig. 1, the flexible circuit board has a dimension in the first direction of 8-10 millimeters. The adhesive layer 6 is in the first directionDimension d of (2) 1 The area overlapping the flexible circuit board 7 in the first direction is approximately 0.7-0.8 mm in size and the width d of the area adjacent to the display area 101, which is the area not overlapping the flexible circuit board 7, is 1 mm 2 From 0.2 to 0.3 mm, which is 0.02 to 0.0375 times the dimension of the flexible circuit board 7 in the second direction. The area of the display panel which is not overlapped with the flexible circuit board 7 is partially exposed to the outside without a protective film layer. The dimension of the adhesive layer 6 in the second direction is slightly larger than the flexible circuit board 7 between the edge of the flexible circuit board 7 in the second direction and the edge of the adhesive layer 6 in the second direction, the second direction being perpendicular to the first direction.
The first direction is a direction perpendicular to the edge of the display area 101 and the edge of the flexible circuit board 7, i.e., the x direction shown in the drawing. The second direction is a direction parallel to the edge of the display area 101 and the edge of the flexible circuit board 7, i.e., the y direction shown in the figure.
In addition, the edge of the adhesive layer 6 is closer to the display area 101 in the first direction than the edge of the binding structure 1025, and the distance between the edge of the binding structure 1025 and the edge of the adhesive layer 6 in the first direction is 50 to 150 micrometers, which is 0.005 to 0.01875 times the size of the flexible circuit board 7 in the second direction. The edge of the adhesive layer 6 in the second direction is flush with the edge of the binding structure 1025 in the second direction.
It can be appreciated that the arrangement of the adhesive layer 6 is not reasonable enough, resulting in poor reliability of the display module.
Based on the above, the embodiment of the disclosure provides a display module. As shown in fig. 2 to 6, the display module includes a display panel 100, a flexible circuit board 7 and an adhesive layer 6, the display panel 100 has a display area 101 and a non-display area 102 located outside the display area 101, the non-display area 102 includes a binding area, the binding area is provided with a binding structure 1025, the flexible circuit board 7 is bound on the binding structure 1025, the adhesive layer 6 is connected between the flexible circuit board 7 and the binding structure 1025, an edge of the adhesive layer 6 is closer to the display area 101 than an edge of the flexible circuit board 7 in a first direction, and a distance between the edge of the flexible circuit board 7 and the edge of the adhesive layer 6 in the first direction is 0.05-0.125 times a dimension of the flexible circuit board 7 in a second direction.
The flexible circuit board 7 and the binding structure 1025 are bonded together through the bonding layer 6, the edge of the bonding layer 6 is closer to the display area 101 than the edge of the flexible circuit board 7 in the first direction, the distance between the edge of the flexible circuit board 7 and the edge of the bonding layer 6 in the first direction is 0.05-0.125 times of the size of the flexible circuit board 7 in the second direction, the area of the bonding layer 6 covering the flexible circuit board 7 and the binding structure 1025 can be increased, and therefore the electric connection reliability and mechanical connection strength between the flexible circuit board 7 and the binding structure 1025 are enhanced, and the reliability of the display module is improved.
The display module according to the present disclosure will be described in detail with reference to specific embodiments.
As shown in fig. 2 and 3, the display module is a silicon-based OLED display module, and a flexible circuit board type module structure may be adopted. The display module comprises a display panel 100 and a flexible circuit board 7, wherein the display panel 100 is provided with a display area 101 and a non-display area 102, a driving circuit is integrated in the display panel 100, the display area 101 is provided with a plurality of sub-pixels 220 connected with the driving circuit, the non-display area 102 comprises a binding area, the binding area is provided with a plurality of binding structures 1025 connected with the driving circuit, the binding structures 1025 comprise a plurality of pins, the binding pins are bound with the flexible circuit board 7, and the flexible circuit board 7 can transmit external signals to the driving circuit through the binding pins, so that different sub-pixels 220 are driven to emit light, and picture display is realized.
In order to ensure the reliability of the display module, the display module further comprises an adhesive layer 6, wherein the adhesive layer 6 is connected between the flexible circuit board 7 and the binding structure 1025, the edge of the adhesive layer 6 is closer to the display area 101 than the edge of the flexible circuit board 7 in the first direction, and the distance d between the edge of the flexible circuit board 7 and the edge of the adhesive layer 6 in the first direction 2 0.05-0.125 times the size of the flexible circuit board 7 in the second direction. The edge of the flexible circuit board 7 in the second direction is located between the edges of the adhesive layer 6 in the second direction, and the distance d between the edge of the flexible circuit board 7 and the edge of the adhesive layer 6 in the second direction 3 Is 0.02-0 of the dimension of the flexible circuit board 7 in the second direction.0625 times, the second direction is perpendicular to the first direction.
When the dimension of the flexible circuit board 7 in the first direction is 8-10 mm, the dimension d of the adhesive layer in the first direction 1 A distance d between the edge of the flexible circuit board 7 and the edge of the adhesive layer 6 in the first direction of 1.5 mm 2 A distance d between the edge of the flexible circuit board 7 and the edge of the adhesive layer 6 in the second direction of 0.5-1 mm 3 0.2-0.5 mm. In this embodiment, in contrast to the positional relationship between the adhesive layer 6 and the flexible circuit board 7 in the figure, the coating size of the adhesive layer 6 in the first direction is increased by 0.03 to 0.0825 times, and the coating size in the second direction is increased by 0.02 to 0.0625 times, extending to both sides of the flexible circuit board 7. The contact area between the bonding layer 6 and the flexible circuit board 7 is increased, so that the warping problem of the flexible circuit board 7 can be effectively solved, and the mechanical connection strength of the flexible circuit board 7 is improved, thereby improving the binding reliability problem.
The edge of the binding structure 1025 is closer to the display area 101 than the edge of the flexible circuit board 7 in the first direction, and the edge of the adhesive layer 6 is closer to the display area 101 than the edge of the binding structure 1025 in the first direction; the edge of the binding structure 1025 in the second direction is located outside the edge of the flexible circuit board 7 in the second direction and between the edges of the adhesive layer 6 in the second direction.
In the present embodiment, the distance d between the edge of the binding structure 1025 and the edge of the adhesive layer 6 in the first direction 4 0.025-0.04375 times the size of the flexible circuit board 7 in the second direction. Distance d between edge of binding structure 1025 and edge of adhesive layer 6 in the second direction 5 0.01-0.0375 times the size of the flexible circuit board 7 in the second direction. The distance between the edge of the binding structure 1025 and the edge of the adhesive layer 6 in the first direction is 0.25-0.35 mm, and the distance between the edge of the binding structure 1025 and the edge of the adhesive layer 6 in the second direction is 0.1-0.3 mm.
In this embodiment, in contrast to the positional relationship between the adhesive layer 6 and the binding structure 1025 in fig. 1, the coating size of the adhesive layer 6 in the first direction is increased by a factor of 0.02 to 0.025, and the coating size in the second direction is increased by a factor of at least 0.01 to 0.0375, extending to both sides of the binding structure 1025. The area of the binding structure 1025 covered by the bonding layer 6 can be increased, the area where the display panel 100 is not overlapped with the flexible circuit board 7 can be effectively protected, the problem of failure of a driving circuit caused by scratching the display panel 100 in manufacturing is solved, the service life of the display module can be prolonged, and the yield of the display module is improved.
The display module further comprises a cover plate 5, wherein the cover plate 5 is arranged on one side, far away from the display panel 100, of the pixel layer, and the cover plate 5 can realize light emission and plays a role in protecting the display panel. The area of the cover plate 5 is larger than the area of the display area 101 and smaller than the area of the display panel 100. I.e. the front projection of the cover plate 5 on the display panel covers the display area 101 and is located in the area of the display panel 100. As shown in fig. 1, the cover plate 5 and the edge of the display panel may have a certain distance, so that the positioning and fixing of the display module and the housing may be realized.
As shown in fig. 4, in order to better protect the display panel, the coverage area of the cover plate 5 may be appropriately increased, and the cover plate 5 may cover the display area 101 and a part of the non-display area 102, specifically, the non-display area 102 includes a first sub-area 1021 and a second sub-area 1022 located at both sides of the display area 101 along a first direction, and a third sub-area 1023 and a fourth sub-area 1024 located at both sides of the display area 101 along a second direction, and the front projection of the cover plate 5 on the display panel covers the first sub-area 1021, the third sub-area 1023, the fourth sub-area 1024, and a part of the second sub-area 1022, and exposes a part of the second sub-area 1022 as a binding area. The adhesive layer 6 extends in the first direction to the edge of the cover plate 5 and is connected to the edge of the cover plate 5, i.e. the cover plate 5 completely covers the binding area.
It should be noted that, the side of the adhesive layer 6 close to the cover plate 5 is flush with the side of the cover plate 5 away from the display panel, the adhesive layer 6 can be made of an opaque adhesive material, so as to prevent the display panel from light leakage, and specifically, UV adhesive can be adopted.
As shown in fig. 4, the non-display area may include an alignment area 1026, where the alignment area 1026 is close to a side of the non-display area 102 away from the display area 101 along the first direction, and the front projection of the adhesive layer 6 on the display panel 100 and the alignment area 1026 do not overlap. It will be appreciated that the alignment areas 1026 partially overlap the binding areas, and that the alignment areas 1026 are disposed on both sides of the flexible circuit board 7 in the second direction. The alignment region 1026 is used as a reference to facilitate alignment with the adhesive layer 6 in the second direction when the flexible circuit board 7 is bonded.
Fig. 5 shows a schematic diagram of a display module provided by the present disclosure. The display module comprises a driving backboard 1, a pixel layer 2, a color film layer 3, a packaging layer group 4 and a cover plate 5, wherein the pixel layer 2 is arranged on the driving side of the driving backboard 1, the color film layer 3 is arranged on one side, far away from the driving backboard 1, of the pixel layer 2, the packaging layer group 4 comprises a first packaging layer 41 and a second packaging layer 42, the first packaging layer 41 and the second packaging layer 42 are respectively arranged on two opposite sides of the color film layer 3, and the first packaging layer 41 is arranged on one side, far away from the driving backboard 1, of the pixel layer 2; the second encapsulation layer 42 is disposed on a side of the color film layer 3 away from the driving back plate 1. The first packaging layer 41 and the second packaging layer 42 are used for packaging the display panel twice, so that water vapor and oxygen are effectively isolated, and peeling between layers is prevented, and the display effect is affected. The cover plate 5 is disposed on a side of the second encapsulation layer 42 away from the driving back plate 1.
The pixel layer 2 may include a plurality of pixel units, and the pixel unit in fig. 5 may include a first sub-pixel 2201, a second sub-pixel 2202, and a third sub-pixel 2203, for example, the first sub-pixel 2201, the second sub-pixel 2202, and the third sub-pixel 2203 are respectively located in different sub-pixel regions, and two adjacent sub-pixels are separated by the pixel definition layer 224. The pixel unit can emit full-color light in combination with the color film layer 3, the color film layer 3 comprises three sub-filter units 32 with different colors, the orthographic projection of one sub-filter unit 32 on the pixel layer 2 covers one sub-pixel 220, two adjacent sub-filter units 32 are separated by a black matrix 31, and the orthographic projection of the black matrix 31 on the pixel layer 2 overlaps with the pixel definition layer 224. The three different color sub-filter units 32 are respectively a red sub-filter unit, a green sub-filter unit and a blue sub-filter unit, and the three different color sub-filter units respectively correspond to one sub-pixel 220.
As shown in fig. 6, the display panel includes a driving backplate 1 and a pixel layer, the driving backplate 1 includes a substrate base plate 10 and a driving circuit layer 19, only a first sub-pixel region and a second sub-pixel region adjacent to the pixel layer are shown in the figure for clarity, and for each sub-pixel region, only a sub-pixel and a transistor 11 directly connected to the sub-pixel in the driving circuit layer 19 are shown. For example, the transistor 11 may be a driving transistor configured to control the magnitude of a current driving the light emission of the sub-pixel. For example, the transistor 11 may be a light emission control transistor for controlling whether or not a current for driving the sub-pixel to emit light flows. Embodiments of the present disclosure are not limited in this regard.
As shown in fig. 6, the display panel includes a substrate base 10, a first conductive layer 21, a light emitting unit layer 22, and a second conductive layer 23 disposed on the substrate base 10, the first conductive layer 21 including a first electrode 221 of a first sub-pixel 2201 and a first electrode 221 of a second sub-pixel 2202, which are insulated from each other, in a first sub-pixel region and a second sub-pixel region, respectively, the first electrode 221 of the first sub-pixel 2201 and the first electrode 221 of the second sub-pixel 2202 being disconnected from each other. The second conductive layer 23 includes a second electrode 222 of the first subpixel 2201 and a second electrode 222 of the second subpixel 2202 connected to each other in the first subpixel region and the second subpixel region, respectively.
The first electrodes 221 of different pixel units 220 are disconnected from each other and insulated from each other in a plane, and the first electrodes 221 of all pixel units 220 constitute the first conductive layer 21. The second electrodes 222 of the different pixel units 220 are in an integral structure, that is, the second electrodes 222 of the different pixel units 220 are in a continuous and smooth structure formed by the same conductive material layer, the second electrodes 222 of all the pixel units 220 form the second conductive layer 23, and no interface exists between different areas in the second conductive layer 23. All the light emitting cells 223 constitute a light emitting cell layer 22, and the light emitting cell layer 22 is disposed between the first conductive layer 21 and the second conductive layer 23.
As shown in fig. 6, the display panel provided in the embodiment of the present disclosure uses a silicon substrate as the substrate 10, and the driving circuit layer 19 may be integrated on the silicon substrate to form the driving back plate 1, in which case, higher accuracy may be achieved due to the silicon-based circuit. The first and second sub-pixels are formed on a driving backplate 1, the driving backplate 1 including a substrate base 10, such as monocrystalline silicon or high purity silicon, and a driving circuit layer 19 formed on the substrate base 10.
The driving circuit layer 19 is formed on the substrate base 10 through a semiconductor process, for example, an active layer 112 (i.e., a semiconductor layer), a first electrode 113, and a second electrode 114 of the transistor 11 are formed in the substrate base 10 through a doping process, and an insulating layer 15 is formed through a silicon chemical process, and a plurality of third conductive layers 16 are formed through a sputtering process, and the like. The semiconductor layer of the transistor 11 (e.g., the active layer in fig. 6) is located inside the substrate 10 or is part of the substrate 10.
As shown in fig. 6, the first subpixel is electrically connected to the first transistor 12, and the second subpixel is electrically connected to the second transistor 13. The embodiments of the present disclosure are not limited to the specific types of the first transistor 12 and the second transistor 13. The first transistor 12 is exemplarily described below, and the description is also applicable to the second transistor 13, so that a detailed description is omitted.
The first electrode 221 of the first sub-pixel is formed on the surface of the driving backplate 1 and is electrically connected to the first electrode 113 of the first transistor 12 through the contact hole 14 filled with a conductive material (e.g. tungsten) and the plurality of conductive layers. One insulating layer 15 and two third conductive layers 16 are exemplarily shown in fig. 6, however, the number of layers of the insulating layer 15 and the conductive layers is not limited by the embodiment of the present disclosure.
For example, the first transistor 12 includes a gate electrode 111, a gate insulating layer 115, an active layer 112, a first electrode 113, and a second electrode 114. The embodiment of the present disclosure is not limited to the type, material, and structure of the first transistor 12, and for example, it may be top gate, bottom gate, or the like, and the active layer 112 of the first transistor 12 may be an inorganic semiconductor material such as microcrystalline silicon, amorphous silicon, polysilicon (low temperature polysilicon or high temperature polysilicon), an oxide semiconductor (e.g., IGZO), or an organic material such as PBTTT, PDBT-co-TT, PDQT, PDVT-10, dinaphtho-Dithiophene (DNTT), or pentacene. For example, the first transistor 12 may be N-type or P-type.
Some embodiments of the present disclosure are described with reference to field effect transistors (e.g., MOS field effect transistors) formed in a silicon substrate, in which case the silicon substrate is doped (p-doped or n-doped) to form the active layer 112 of the transistor, i.e., the active layer 112 of the transistor is located within the silicon substrate, or the active layer 112 of the transistor is part of the silicon substrate. The source and drain of the transistor used herein may be symmetrical in structure, so that the source and drain may be indistinguishable in structure. In the embodiments of the present disclosure, in order to distinguish between two poles of a transistor other than a gate, for example, one of the poles 113 and the other pole 114 may be directly described.
The topmost conductive layer in the drive backplate 1 may be reflective, for example a titanium/titanium nitride/aluminium laminate structure. For example, the conductive layer includes a plurality of sub-layers disposed at intervals, and each sub-layer is disposed in one-to-one correspondence with the plurality of first electrodes 221 included in the first conductive layer 21. In the top emission structure, the conductive layer may be provided as a reflective layer for reflecting light emitted from the light emitting element, thereby improving light extraction efficiency. For example, the orthographic projection of each electrode in the first conductive layer 21 on the substrate 10 falls within the orthographic projection of the portion of the conductive layer corresponding to the electrode on the substrate 10. In this case, the first conductive layer 21 may employ a transparent conductive oxide material having a high work function, for example ITO, IZO, IGZO, AZO or the like.
The pixel layer includes a first subpixel 2201 and a second subpixel 2202 in a first subpixel region and a second subpixel region, respectively, the first subpixel 2201 and the second subpixel 2202 being separated by a pixel defining layer 224. The first subpixel 2201 and the second subpixel 2202 each include a light emitting unit 223, and the light emitting unit 223 faces the first electrode 221 and the second electrode 222. For example, the first subpixel 2201 and the second subpixel 2202 may be an Organic Light Emitting Diode (OLED) or a quantum dot light emitting diode (QLED), etc., and the embodiments of the present disclosure are not limited to the type of light emitting element. For example, the light emitting unit 223 may be a small molecular organic material or a high molecular organic material.
For example, the first subpixel 2201 and the second subpixel 2202 are top-emitting structures, and the first electrode 221 and the second electrode 222 are reflective. For example, the first electrode 221 includes a material having a high work function and high reflectivity to function as an anode, for example, a stacked structure of Ti/Al/Ti/Mo, in which metallic titanium may serve as a buffer layer to improve adhesion between layers, al serves as a high reflective material, and Mo may serve as a high work function material to directly contact with an organic functional layer to improve carrier injection capability. Accordingly, the second conductive layer 23 serves as a cathode, and for example, the second conductive layer 23 may be a transparent conductive material or a laminate structure of a transparent conductive material and a metal material. For example, the second conductive layer 23 may be a transparent metal oxide conductive material such as Indium Zinc Oxide (IZO), indium Tin Oxide (ITO), indium Gallium Zinc Oxide (IGZO), or a transparent nano conductive material such as carbon nanotube, graphene, or nano silver wire.
It should be noted that, the transistors 11 used in the embodiments of the present disclosure may be thin film transistors, field effect transistors, or other switching devices with the same characteristics. When the transistor 11 is a thin film transistor, the driving circuit layer 19 may include a plurality of driving circuit units, any one of which may include the transistor 11 and a storage capacitor, the plurality of driving circuit units constituting the driving circuit layer 19.
The embodiment of the disclosure also provides a display device, which may include the display module of any one of the embodiments of the disclosure. The specific structure and the beneficial effects of the display module have already been described in detail above, and therefore, will not be described here again.
It should be noted that, the display device includes other necessary components and components besides the display module, such as a housing, a control circuit board, a power cord, etc., and those skilled in the art can correspondingly supplement the components and components according to the specific usage requirements of the display device, which is not described herein.
When the display panel is of the structure in fig. 1 to 6, the display device may be a conventional electronic apparatus, for example: cell phones, computers, televisions, and camcorders. The display device may also be an emerging wearable device, such as: virtual reality devices and augmented reality devices are not listed here.
Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This application is intended to cover any adaptations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.
Claims (10)
1. A display module, comprising:
the display panel is provided with a display area and a non-display area positioned outside the display area, wherein the non-display area comprises a binding area, and the binding area is provided with a binding structure;
the flexible circuit board is bound on the binding structure;
the bonding layer is connected between the flexible circuit board and the binding structure, the edge of the bonding layer is closer to the display area than the edge of the flexible circuit board in a first direction, and the distance between the edge of the flexible circuit board and the edge of the bonding layer in the first direction is 0.05-0.125 times of the dimension of the flexible circuit board in a second direction, and the second direction is perpendicular to the first direction.
2. The display module of claim 1, wherein an edge of the flexible circuit board in a second direction is located between edges of the adhesive layer in the second direction, and a distance between the edge of the flexible circuit board and the edge of the adhesive layer in the second direction is 0.02-0.0625 times a size of the flexible circuit board in the second direction.
3. The display module of claim 2, wherein an edge of the binding structure is closer to the display area than an edge of the flexible circuit board in the first direction, and an edge of the adhesive layer is closer to the display area than an edge of the binding structure in the first direction; the edge of the binding structure in the second direction is positioned outside the edge of the flexible circuit board in the second direction and between the edges of the adhesive layer in the second direction.
4. A display module according to claim 3, wherein the distance between the edge of the binding structure and the edge of the adhesive layer in the first direction is 0.025-0.04375 times the dimension of the flexible circuit board in the second direction.
5. A display module according to claim 3, wherein the distance between the edge of the binding structure and the edge of the adhesive layer in the second direction is 0.01-0.0375 times the dimension of the flexible circuit board in the second direction.
6. The display module of claim 1, further comprising a cover plate disposed on a display side of the display panel, wherein an orthographic projection of the cover plate on the display panel covers the display area and a portion of the non-display area, and exposes the binding area, and wherein the adhesive layer extends to an edge of the cover plate along the first direction and is connected to the edge of the cover plate.
7. The display module of claim 6, wherein a side of the adhesive layer adjacent to the cover plate is flush with a side of the cover plate remote from the display panel, and the adhesive layer is made of an opaque adhesive material.
8. The display module of claim 1, wherein the non-display area includes an alignment area, the alignment area is adjacent to an edge of the non-display area away from the display area along the first direction, and an orthographic projection of the adhesive layer on the display panel does not overlap with the alignment area.
9. The display module of claim 1, wherein the display panel comprises:
a drive back plate;
the pixel layer is arranged on the driving side of the driving backboard;
the first packaging layer is arranged on one side of the pixel layer, which is far away from the driving backboard;
the color film layer is arranged on one side of the first packaging layer, which is far away from the driving backboard;
the second packaging layer is arranged on one side of the color film layer away from the driving backboard.
10. A display device comprising the display panel according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211517658.0A CN116133492A (en) | 2022-11-29 | 2022-11-29 | Display module and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211517658.0A CN116133492A (en) | 2022-11-29 | 2022-11-29 | Display module and display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116133492A true CN116133492A (en) | 2023-05-16 |
Family
ID=86308930
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211517658.0A Pending CN116133492A (en) | 2022-11-29 | 2022-11-29 | Display module and display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116133492A (en) |
-
2022
- 2022-11-29 CN CN202211517658.0A patent/CN116133492A/en active Pending
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