CN116133357A - Vacuum pressure monitoring system and method for chip mounter - Google Patents
Vacuum pressure monitoring system and method for chip mounter Download PDFInfo
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- CN116133357A CN116133357A CN202310395710.8A CN202310395710A CN116133357A CN 116133357 A CN116133357 A CN 116133357A CN 202310395710 A CN202310395710 A CN 202310395710A CN 116133357 A CN116133357 A CN 116133357A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/087—Equipment tracking or labelling, e.g. tracking of nozzles, feeders or mounting heads
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
Abstract
The invention relates to the technical field of control, and particularly discloses a vacuum pressure monitoring system and a method for a chip mounter, wherein the system realizes a control function based on an FPGA chip and comprises the following steps: the monitoring threshold generating module is used for generating corresponding monitoring thresholds according to the suction nozzle types of the shafts under different working conditions, updating the monitoring thresholds in real time and outputting a baseline acquisition signal, the monitoring thresholds, a baseline change value or a monitoring enabling signal; the abnormal monitoring module is used for judging monitoring abnormal zone bits of each shaft according to the baseline acquisition signal, the monitoring threshold, the baseline change value and the monitoring enabling signal output by the monitoring threshold generating module and outputting the monitoring abnormal zone bits to the monitoring threshold generating module. According to the scheme, the vacuum pressure monitoring is realized based on the FPGA, so that real-time polling can be performed and whether the element falls down or not is judged; meanwhile, the relative baseline change is used for monitoring, so that the difficulty of structural design is reduced; the scheme of sub-working condition monitoring is adopted, so that the misjudgment rate is reduced.
Description
Technical Field
The invention relates to the technical field of control, in particular to a vacuum pressure monitoring system and method for a chip mounter.
Background
The chip mounter is responsible for placing components at corresponding positions of the printed circuit board at high speed and high precision in the SMT production line, determines productivity and precision of the SMT production line, and is the most important component with highest technical difficulty in the SMT production line. The mounting head module of the chip mounter is used for completing the sucking and mounting functions of the components, and the sucking and mounting process is realized through the vacuum pressure change of the suction nozzle. The mounting head needs to follow the XY module for high-speed movement. Therefore, the falling situation of the component can occur, and the falling situation needs to be monitored in real time. According to the length of the air pipe, the air pressure of the air supply, the type of the suction nozzle, and the like, the change rule of the vacuum pressure which occurs along with the suction and dropping of the component is also different. At the same time, the mutual interference condition of the vacuum pressure exists between different suction nozzles, which makes the condition of vacuum pressure monitoring more complex.
In the prior art, the vacuum pressure data monitored and inquired by the CPU are used for judging, the falling condition of the element is judged by using the vacuum pressure, and the consistency of the vacuum pressure condition of each machine is required, so that the misjudgment rate of the vacuum pressure monitoring is high, and the design difficulty of the structure is increased.
Disclosure of Invention
The invention aims to overcome the problems in the prior art and provides a vacuum pressure monitoring system and a method for a chip mounter.
In order to achieve the above object, a first aspect of the present invention provides a vacuum pressure monitoring system for a chip mounter, the system implementing a control function based on an FPGA chip, including:
the monitoring threshold generating module is used for generating corresponding monitoring thresholds according to the suction nozzle types of the shafts under different working conditions, updating the monitoring thresholds in real time and outputting a baseline acquisition signal, the monitoring thresholds, a baseline change value or a monitoring enabling signal;
the abnormal monitoring module is used for judging monitoring abnormal zone bits of each shaft according to the baseline acquisition signal, the monitoring threshold, the baseline change value and the monitoring enabling signal output by the monitoring threshold generating module, and outputting the monitoring abnormal zone bits to the monitoring threshold generating module when the monitoring abnormal zone bit of a certain shaft is effective, so that the monitoring threshold generating module updates the monitoring threshold.
Preferably, the working conditions are classified into component suction, component mounting, and non-component suction/mounting.
Preferably, when the working condition is component suction or mounting, the monitoring enabling signals of the non-enabled shafts enable the abnormal monitoring module to suspend monitoring; and after the component is absorbed or mounted, enabling the monitoring enabling signals of the shafts to enable the abnormal monitoring module to monitor, and simultaneously enabling the monitoring threshold generating module to generate corresponding baseline variation values according to the types of the suction nozzles of the shafts and update the monitoring threshold.
Preferably, when the working condition is non-component suction/mounting, the monitoring threshold generating module generates a corresponding monitoring threshold according to the suction nozzle type of each shaft, pulls up the monitoring enabling signal, and sets the baseline variation value to 0.
Preferably, when the abnormality monitoring module does not monitor the effective monitoring abnormality flag bit, the monitoring threshold generating module generates a baseline acquisition signal of each axis and outputs the baseline acquisition signal to the abnormality monitoring module; when the abnormality monitoring module monitors that the monitoring abnormality flag bit of a certain shaft is valid, the threshold generating module updates the monitoring threshold of each shaft according to the type of the shaft suction nozzle.
Preferably, when the baseline acquisition signal is triggered, the monitoring enable signal enables the abnormal monitoring module to suspend the vacuum pressure monitoring, and the abnormal monitoring module acquires the vacuum pressure value to judge whether the monitoring abnormal flag bit is valid or not:
and when the value of the absolute vacuum pressure, the value of the vacuum pressure base line and the value of the base line change are equal to or larger than the monitoring threshold value, the monitoring abnormal marker bit is effective.
Preferably, the system further comprises a vacuum pressure inquiring module for inquiring the vacuum pressure value and transmitting the vacuum pressure value to the abnormality monitoring module.
Preferably, the system further comprises an error reporting module, which is used for uploading the monitoring abnormal flag bit to the upper computer when the monitoring abnormal flag bit is valid.
Preferably, the system further comprises a flow control module for judging the working condition and the suction nozzle type and controlling the information interaction flow between the monitoring threshold generating module and the abnormality monitoring module.
The first aspect of the invention provides a vacuum pressure monitoring method for a chip mounter, comprising the following steps:
when the working condition is component suction or mounting, monitoring enabling signals of all the non-enabled shafts pause monitoring;
after the component is absorbed or mounted, monitoring the monitoring enabling signals of all the shafts, generating corresponding baseline variation values according to the types of the suction nozzles of all the shafts and updating the monitoring threshold;
if no effective monitoring abnormal marker bit is monitored, generating a baseline acquisition signal of each shaft, suspending monitoring and judging whether the monitoring abnormal marker bit is effective;
if the monitoring abnormality flag bit of a certain shaft is effective, the monitoring threshold value of each shaft is updated according to the type of the shaft suction nozzle, and the abnormality information is reported and the monitoring is continued.
Preferably, when the working condition is non-component suction/mounting, a corresponding monitoring threshold is generated according to the suction nozzle type of each shaft, and the monitoring enabling signal is pulled high, and the baseline variation value is set to 0.
Preferably, the judging and monitoring abnormal flag bit specifically includes:
and when the value of the absolute vacuum pressure, the value of the vacuum pressure base line and the value of the base line change are equal to or larger than the monitoring threshold value, the monitoring abnormal marker bit is effective.
Through the technical scheme, the vacuum pressure monitoring is realized based on the FPGA, the characteristics of parallel operation and high real-time performance of the FPGA are fully utilized, and real-time polling can be performed and whether the element falls down or not is judged; meanwhile, the relative baseline change is used for monitoring, so that the difficulty of structural design is reduced; the scheme of sub-working condition monitoring is adopted, so that the misjudgment rate is reduced.
Drawings
Fig. 1 is a schematic diagram of a vacuum pressure monitoring system for a chip mounter according to an embodiment of the present invention;
fig. 2 is a schematic diagram of a vacuum pressure monitoring flow for a chip mounter according to an embodiment of the present invention.
Detailed Description
The following describes the detailed implementation of the embodiments of the present invention with reference to the drawings. It should be understood that the detailed description and specific examples, while indicating and illustrating the invention, are not intended to limit the invention.
As shown in fig. 1, a first aspect of the embodiment of the present invention provides a vacuum pressure monitoring system for a chip mounter, where the system implements a control function based on an FPGA chip, including:
the monitoring threshold generating module is used for generating corresponding monitoring thresholds according to the suction nozzle types of the shafts under different working conditions, updating the monitoring thresholds in real time and outputting a baseline acquisition signal, the monitoring thresholds, a baseline change value or a monitoring enabling signal;
the abnormal monitoring module is used for judging monitoring abnormal zone bits of each shaft according to the baseline acquisition signal, the monitoring threshold, the baseline change value and the monitoring enabling signal output by the monitoring threshold generating module, and outputting the monitoring abnormal zone bits to the monitoring threshold generating module when the monitoring abnormal zone bit of a certain shaft is effective, so that the monitoring threshold generating module updates the monitoring threshold.
As shown in fig. 1, the input quantity of the threshold generating module is the type of the suction nozzle, the working condition and the monitoring abnormality zone bit, the output is the baseline acquisition signal, the monitoring threshold, the baseline variation value and the monitoring enabling signal, and when the number of the suction nozzles is n, n baseline acquisition signals, n monitoring thresholds, n baseline variation values and n monitoring enabling signals are respectively output. The working conditions are as follows: component sucking, component mounting, non-component sucking/mounting. The monitoring threshold values corresponding to different working conditions and suction nozzle types need to be measured in advance. Each suction nozzle is correspondingly provided with an abnormality monitoring module, the input quantity of the abnormality monitoring module is a vacuum pressure value, a baseline acquisition signal, a monitoring enabling signal, a baseline change value and a monitoring threshold value, and the output quantity is a monitoring abnormality zone bit. The FPGA parallel control principle can complete the functions of inquiry, calculation, control, feedback and the like in real time. The mounting head module adopts the FPGA as a main control chip to complete a series of control of the mounting head, so that the current working state can be known in real time, and an effective means is provided for carrying out real-time sub-working condition monitoring and threshold updating.
According to one embodiment of the invention, when the working condition is non-component suction/mounting, the monitoring threshold generating module generates a corresponding monitoring threshold according to the suction nozzle type of each shaft, and pulls up the monitoring enabling signal, and the change value of the base line (the change value of the base line is the change value which should occur when the monitoring threshold generating module theoretically calculates the base line according to the actual working flow) is set to 0, so that the base line does not need to be changed; when the working condition is component suction or mounting, the monitoring enabling signals of the non-enabled shafts enable the abnormal monitoring module to suspend monitoring; enabling the monitoring enabling signals of each shaft to enable the abnormal monitoring module to monitor after the component is absorbed or mounted, meanwhile, enabling the monitoring threshold generating module to generate corresponding baseline change values according to the types of the suction nozzles of each shaft and update the monitoring threshold, and disabling the monitoring enabling signals of the shaft when the component is not absorbed by one shaft; when the abnormality monitoring module does not monitor the effective monitoring abnormality zone bit, the monitoring threshold generating module generates a baseline acquisition signal of each shaft and outputs the baseline acquisition signal to the abnormality monitoring module; when the abnormality monitoring module monitors that the monitoring abnormality flag bit of a certain shaft is valid, the threshold generating module updates the monitoring threshold of each shaft according to the type of the shaft suction nozzle; when the baseline acquisition signal is triggered, the monitoring enabling signal enables the abnormal monitoring module to suspend the vacuum pressure monitoring, and the abnormal monitoring module acquires the vacuum pressure value to judge whether the monitoring abnormal flag bit is effective or not: and when the value of the absolute vacuum pressure, the value of the vacuum pressure base line and the value of the base line change are equal to or larger than the monitoring threshold value, the monitoring abnormal marker bit is effective.
The vacuum pressure monitoring is realized based on the FPGA, the characteristics of parallel operation and high real-time performance of the FPGA are fully utilized, and real-time polling can be performed and whether the element falls off or not is judged; meanwhile, the relative baseline change is used for monitoring, so that the difficulty of structural design is reduced; the scheme of sub-working condition monitoring is adopted, so that the misjudgment rate is reduced. In addition, the prior art utilizes the vacuum pressure data monitored and inquired by the CPU to judge, and the CPU has low inquiry frequency due to the characteristic of serial operation, and meanwhile, the CPU utilization rate is high.
Further, as shown in fig. 1, the vacuum pressure monitoring system for a chip mounter provided by the embodiment of the invention further includes a vacuum pressure query module, an error reporting module and a flow control module, where the vacuum pressure query module is configured to poll vacuum pressure values corresponding to n suction nozzles in real time and send the values to the anomaly monitoring module; the error reporting module is used for uploading the monitoring abnormal flag bit to the upper computer when the monitoring abnormal flag bit is valid; the flow control module is used for judging the working condition and the suction nozzle type and controlling the information interaction flow among the vacuum pressure inquiring module, the error reporting module, the monitoring threshold generating module and the abnormality monitoring module.
As shown in fig. 2, based on the same inventive concept, a second aspect of the embodiment of the present invention provides a vacuum pressure monitoring method for a chip mounter, including the steps of:
s1, when the working condition is component suction or mounting, monitoring of monitoring enabling signals of all non-enabled shafts is suspended;
s2, after the component is absorbed or mounted, when the working condition is non-component absorption/mounting, enabling the monitoring enabling signals of all the shafts to monitor, and simultaneously generating corresponding baseline change values according to the types of the suction nozzles of all the shafts and updating the monitoring threshold;
s3, if no effective monitoring abnormal zone bit is monitored (namely no abnormality is monitored), generating a baseline acquisition signal of each shaft, suspending monitoring and judging whether the monitoring abnormal zone bit is effective;
s4, if the monitoring abnormality flag bit of a certain shaft is effective (namely monitoring abnormality), updating the monitoring threshold value of each shaft according to the type of the shaft suction nozzle, reporting abnormality information, and returning to the step S3 to continue monitoring; the judgment and monitoring of the abnormal marker bit is specifically as follows:
and when the value of the absolute vacuum pressure, the value of the vacuum pressure base line and the value of the base line change are equal to or larger than the monitoring threshold value, the monitoring abnormal marker bit is effective.
It is worth to be noted that, after step S2 is completed, if no monitoring abnormality flag bit is detected to be valid, step S2 is directly entered into step S3; if the monitoring abnormal flag bit is effective, the step S2 is directly carried out in the step S4.
According to one embodiment of the invention, when the working condition is non-component suction/mounting, a corresponding monitoring threshold is generated according to the suction nozzle type of each shaft, a monitoring enabling signal is pulled high, and a baseline variation value is set to be 0.
Illustratively, according to the actual measurement: (1) In the suction flow of the 301 suction nozzle element, the influence on the working shaft is-7.0 to-8.5 kpa, and the influence on other shafts is-0.3 to-1 kpa; (2) In the 301 suction nozzle mounting process, the influence on the working shaft is +7.0 to +8.5kpa, and the influence on other shafts is +0.3 to +1.0kpa; (3) The influence of the falling of the element on the working shaft is-7.0 to-8.5 kpa, and the influence of the falling of the element on other shafts is-0.3 to-1 kpa; (4) When the work is stable, the absolute value of the vacuum pressure change of each shaft is smaller than 1kpa; (5) 302 the suction nozzle component falls, the influence on the work is-20.0 to-24.0 kpa, and the influence on other shafts is-2 to-4 kpa. Five axes are involved in monitoring, named as Z1, Z2-Z5 respectively, and the working condition changes to: (1) stabilization, (2) absorption of Z1, (3) stabilization, (4) mounting of Z1, (5) stabilization; z1 adopts a 301 suction nozzle; the Z2-Z5 axes adopt 302 suction nozzles, and all suction elements are arranged. Based on a vacuum pressure monitoring system for a chip mounter, the vacuum pressure monitoring method comprises the following steps:
the vacuum pressure inquiry module is used for carrying out real-time polling to obtain the vacuum pressure value of each shaft, and updating the vacuum pressure value of each shaft every 1 ms; the flow control module controls the flow of the mounting head and outputs working conditions. Each shaft is provided with an abnormality monitoring module;
2) When the working condition (1) is met, the flow control module controls a monitoring enabling signal of a non-enabling Z1 of the monitoring threshold generating module, enables monitoring enabling signals of Z2-Z5, sets the monitoring threshold of each shaft to be 2kpa, and sets the change value of the vacuum pressure base line of each shaft to be 0;
3) When Z1 is switched to (2) a suction working condition, the monitoring threshold generating module does not enable monitoring enabling signals of Z1-Z5 axes; setting the baseline variation value of Z1 to be-8.0 kpa, and setting the baseline variation value of Z2-Z5 to be-0.7 kpa; setting a monitoring threshold value of Z1 to 6.0kpa, and setting monitoring threshold values of Z2-Z5 to 3.0kpa;
4) When Z1 is switched to a stable working condition (3), a monitoring threshold generating module enables monitoring enabling signals of Z1-Z5 axes, and an abnormality monitoring module monitors vacuum pressure for 32 ms;
5) After the vacuum pressure monitoring for 32ms is completed, the monitoring threshold generating module triggers baseline acquisition signals of Z1-Z5, the baseline change value of Z1-Z5 is set to be 0kpa, and the monitoring threshold of Z1-Z5 is set to be 2kpa. After receiving the baseline acquisition signal, the abnormality monitoring module pauses the vacuum pressure monitoring and acquires a vacuum pressure value of 64ms, and takes the average value as a new baseline;
6) When Z1 is switched to the mounting working condition (4), the monitoring threshold generating module does not enable monitoring enabling signals of Z1-Z5 axes; setting the baseline variation value of Z1 to be +8.0kpa, and setting the baseline variation value of Z2-Z5 to be +0.7kpa; setting a monitoring threshold value of Z1 to 6.0kpa, and setting monitoring threshold values of Z2-Z5 to 3.0kpa;
7) When Z1 is switched to a stable working condition (5), enabling a monitoring enabling signal of Z2-Z5 by a monitoring threshold generating module, and monitoring the vacuum pressure for 32ms by an abnormality monitoring module;
8) After the vacuum pressure monitoring for 32ms is completed, if the abnormality monitoring module does not monitor an effective monitoring abnormality zone bit (namely, no vacuum pressure abnormality occurs), the flow control module controls the monitoring threshold generating module to trigger baseline acquisition signals of Z1-Z5, the baseline change value of Z1-Z5 is set to be 0kpa, and the monitoring threshold of Z1-Z5 is set to be 2kpa. After receiving the baseline acquisition signal, the abnormality monitoring module can suspend vacuum pressure monitoring and acquire the vacuum pressure of 64ms, and takes the average value as a new baseline;
9) If the abnormality monitoring module monitors the Z1 effective monitoring abnormality zone bit (namely, the Z1 vacuum pressure value is monitored to be abnormal), the abnormality monitoring module enables the abnormality monitoring zone bit and reports the error to the upper computer through the error reporting module. Meanwhile, the vacuum pressure threshold generating module modifies the monitoring threshold of Z2-Z5 to be 3.0kpa according to the type of the 301 suction nozzle of Z1 and the abnormal marker bit. After the fluctuation value of 32ms of the Z1 axis is smaller than the monitoring threshold value, the abnormality monitoring module does not enable the abnormality monitoring flag bit. After the monitoring threshold generating module monitors that the abnormal monitoring zone bit is changed from enabling to disabling, setting the monitoring threshold of Z1-Z5 to be 2ms, and triggering a baseline acquisition signal of Z1-Z5;
10 If the abnormality monitoring module monitors the Z2 effective monitoring abnormality zone bit (the Z2 vacuum pressure value is monitored to be abnormal), the abnormality monitoring module enables the abnormality monitoring zone bit and reports the error to the upper computer through the error reporting module. Meanwhile, the monitoring threshold generating module modifies the monitoring thresholds of Z1, Z3-Z5 to be 8.0kpa according to the type of the 302 suction nozzle of Z2 and the abnormal marker bit. After the fluctuation value of 32ms of the Z2 axis is smaller than the monitoring threshold value, the abnormality monitoring module does not enable the abnormality monitoring flag bit. After the monitoring threshold generating module monitors that the abnormal monitoring zone bit is changed from enabling to disabling, the monitoring threshold of Z1-Z5 is set to be 2kpa, and the baseline acquisition signals of Z1-Z5 are triggered. A certain axis from Z3 to Z5 generates abnormal vacuum pressure, and the monitoring scheme is similar.
The vacuum pressure monitoring method of the invention is adopted to record the misjudgment times as 0 after 10 ten thousand times of vacuum pressure monitoring, thereby realizing the misjudgment rate of less than 0.001%.
In summary, the technical scheme of the invention realizes vacuum pressure monitoring based on the FPGA, fully utilizes the characteristics of parallel operation and high real-time performance of the FPGA, and can carry out real-time polling and judge whether the element falls off or not; meanwhile, the relative baseline change is used for monitoring, so that the difficulty of structural design is reduced; the scheme of sub-working condition monitoring is adopted, so that the misjudgment rate is reduced. In addition, the prior art utilizes the vacuum pressure data monitored and inquired by the CPU to judge, and the CPU has low inquiry frequency due to the characteristic of serial operation, and meanwhile, the CPU utilization rate is high.
The preferred embodiments of the present invention have been described in detail above with reference to the accompanying drawings, but the present invention is not limited thereto. Within the scope of the technical idea of the invention, a number of simple variants of the technical solution of the invention are possible, including the combination of the individual specific technical features in any suitable way. The various possible combinations of the invention are not described in detail in order to avoid unnecessary repetition. Such simple variations and combinations are likewise to be regarded as being within the scope of the present disclosure.
Claims (12)
1. A vacuum pressure monitoring system for chip mounter, its characterized in that, the system realizes control function based on the FPGA chip, includes:
the monitoring threshold generating module is used for generating corresponding monitoring thresholds according to the suction nozzle types of the shafts under different working conditions, updating the monitoring thresholds in real time and outputting a baseline acquisition signal, the monitoring thresholds, a baseline change value or a monitoring enabling signal;
the abnormal monitoring module is used for judging monitoring abnormal zone bits of each shaft according to the baseline acquisition signal, the monitoring threshold, the baseline change value and the monitoring enabling signal output by the monitoring threshold generating module, and outputting the monitoring abnormal zone bits to the monitoring threshold generating module when the monitoring abnormal zone bit of a certain shaft is effective, so that the monitoring threshold generating module updates the monitoring threshold.
2. The system of claim 1, wherein the operating conditions are divided into component suction, component mounting, and non-component suction/mounting.
3. The system of claim 2, wherein the monitoring enable signal for each shaft is disabled to cause the anomaly monitoring module to suspend monitoring when the condition is component suction or mounting; and after the component is absorbed or mounted, enabling the monitoring enabling signals of the shafts to enable the abnormal monitoring module to monitor, and simultaneously enabling the monitoring threshold generating module to generate corresponding baseline variation values according to the types of the suction nozzles of the shafts and update the monitoring threshold.
4. The system of claim 2, wherein the monitor threshold generation module generates a corresponding monitor threshold according to the nozzle type of each axis and pulls the monitor enable signal high to set the baseline variation value to 0 when the operating condition is non-component suction/mounting.
5. The system of claim 3 or 4, wherein when the anomaly monitoring module does not monitor a valid monitoring anomaly flag bit, the monitoring threshold generation module generates a baseline acquisition signal for each axis and outputs to the anomaly monitoring module; when the abnormality monitoring module monitors that the monitoring abnormality flag bit of a certain shaft is valid, the threshold generating module updates the monitoring threshold of each shaft according to the type of the shaft suction nozzle.
6. The system of claim 5, wherein when triggered by a baseline acquisition signal, an enable monitoring enable signal causes the anomaly monitoring module to suspend vacuum pressure monitoring, and wherein the anomaly monitoring module acquires a vacuum pressure value to determine whether a monitoring anomaly flag bit is valid:
and when the value of the absolute vacuum pressure, the value of the vacuum pressure base line and the value of the base line change are equal to or larger than the monitoring threshold value, the monitoring abnormal marker bit is effective.
7. The system of claim 1, further comprising a vacuum pressure query module for querying a vacuum pressure value and delivering to the anomaly monitoring module.
8. The system of claim 1, further comprising an error reporting module configured to upload the monitoring exception flag bit to the upper computer when the monitoring exception flag bit is valid.
9. The system of claim 1, further comprising a flow control module for determining a condition and a nozzle type and controlling a flow of information interaction between the monitoring threshold generation module and the anomaly monitoring module.
10. The vacuum pressure monitoring method for the chip mounter is characterized by comprising the following steps of:
when the working condition is component suction or mounting, monitoring enabling signals of all the non-enabled shafts pause monitoring;
after the component is absorbed or mounted, monitoring the monitoring enabling signals of all the shafts, generating corresponding baseline variation values according to the types of the suction nozzles of all the shafts and updating the monitoring threshold;
if no effective monitoring abnormal marker bit is monitored, generating a baseline acquisition signal of each shaft, suspending monitoring and judging whether the monitoring abnormal marker bit is effective;
if the monitoring abnormality flag bit of a certain shaft is effective, the monitoring threshold value of each shaft is updated according to the type of the shaft suction nozzle, and the abnormality information is reported and the monitoring is continued.
11. The method of claim 10, wherein when the working condition is non-component suction/mounting, a corresponding monitoring threshold is generated according to the type of the suction nozzle of each axis, and the monitoring enable signal is pulled high, and the baseline variation value is set to 0.
12. The monitoring method according to claim 10 or 11, wherein the determining the monitoring abnormality flag bit specifically includes:
and when the value of the absolute vacuum pressure, the value of the vacuum pressure base line and the value of the base line change are equal to or larger than the monitoring threshold value, the monitoring abnormal marker bit is effective.
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