CN116130394A - Wafer transfer apparatus - Google Patents
Wafer transfer apparatus Download PDFInfo
- Publication number
- CN116130394A CN116130394A CN202310186561.4A CN202310186561A CN116130394A CN 116130394 A CN116130394 A CN 116130394A CN 202310186561 A CN202310186561 A CN 202310186561A CN 116130394 A CN116130394 A CN 116130394A
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- Prior art keywords
- transmission mechanism
- horizontal
- position measurer
- drive
- vertical
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- 238000012546 transfer Methods 0.000 title claims description 21
- 230000005540 biological transmission Effects 0.000 claims abstract description 51
- 230000033001 locomotion Effects 0.000 claims abstract description 42
- 230000005570 vertical transmission Effects 0.000 claims description 45
- 230000005571 horizontal transmission Effects 0.000 claims description 28
- 238000004891 communication Methods 0.000 claims description 26
- 238000013519 translation Methods 0.000 claims description 22
- 230000001360 synchronised effect Effects 0.000 claims description 20
- 239000012634 fragment Substances 0.000 abstract description 4
- 235000012431 wafers Nutrition 0.000 description 25
- 238000005259 measurement Methods 0.000 description 11
- 238000010586 diagram Methods 0.000 description 5
- 238000012544 monitoring process Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 239000003638 chemical reducing agent Substances 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
Abstract
The invention provides wafer conveying equipment, which comprises a conveying device and a clamping executing device, wherein the clamping executing device is used for clamping a wafer; the conveying device comprises a transmission mechanism and a position measurer, wherein the position measurer is configured to measure the movement distance of the transmission mechanism so as to monitor the transmission of the transmission mechanism; the clamping executing device is movably arranged on the transmission mechanism, and is used for clamping the wafer and moving along the transmission path under the drive of the transmission mechanism. According to the wafer conveying equipment disclosed by the invention, the position measurer is arranged on the transmission mechanism and is used for measuring the movement distance of the transmission mechanism in real time and feeding back to the control system, so that a worker can know the accuracy of the movement distance of the transmission mechanism in real time, the accuracy of the position during wafer conveying is ensured, the wafer conveying efficiency is improved, and the occurrence of fragments caused by collision during wafer conveying is avoided.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to wafer conveying equipment.
Background
The common process route in the wafer photoresist removing equipment is as follows: wafer pop (CS-OUT), soak (IMM), photoresist (ST), rinse (SR), wafer push (CS-IN). The use of robots for full-automatic wafer transfer between each process unit is becoming popular. With the increasing demand of chips, each large chip manufacturer needs to upgrade the productivity of the wafer photoresist removing device.
At present, the speed of a manipulator transmission mechanism is increased to improve productivity in a large multi-chip manufacturing factory, but the transmission mechanism can be irreversibly reduced in precision at an uncontrollable time node under the continuous use of the manipulator transmission mechanism with high strength for a long time. The transmission mechanism is reduced in transmission precision due to various reasons, such as abrasion of transmission components or fatigue deformation of metal structural parts, and if maintenance cannot be found timely, the mechanical arm can not accurately put the wafer into the process unit suddenly, and fragments can be caused seriously.
Disclosure of Invention
The invention aims to provide wafer conveying equipment, which ensures the accuracy of the position during wafer conveying, improves the efficiency of wafer conveying and avoids the occurrence of fragments caused by collision during wafer conveying.
In order to achieve the above object, in a first aspect, the present invention provides a wafer transfer apparatus, including a transfer device and a clamping executing device;
the conveying device comprises a transmission mechanism and a position measurer, wherein the position measurer is configured to measure the movement distance of the transmission mechanism so as to monitor the transmission of the transmission mechanism;
the clamping executing device is movably arranged on the transmission mechanism, and is used for clamping the wafer and moving along the transmission path under the drive of the transmission mechanism.
In some embodiments, the transmission mechanism comprises a vertical transmission mechanism and a horizontal rotation mechanism rotatably arranged on the clamping executing device;
the vertical transmission mechanism is configured to drive the clamping executing device to perform lifting movement through the horizontal rotation mechanism;
the horizontal rotating mechanism is fixedly arranged on the vertical transmission mechanism and is configured to drive the clamping executing device to rotate around the axis of the clamping executing device.
In some embodiments, the position measurer includes a first position measurer disposed on the vertical transmission mechanism, the first position measurer configured to measure a movement distance of the vertical transmission mechanism in a vertical direction.
In some embodiments, an upper limit trigger communication device is arranged at the top of the vertical transmission mechanism, and the upper limit trigger communication device is electrically connected with the first position measurer;
when the lifting plate on the vertical transmission mechanism is contacted with the first position measurer, the first position measurer measures the movement distance of the vertical transmission mechanism in the vertical direction, and the movement distance is recorded by the upper limit trigger communication device and then is sent to the control system.
In some embodiments, the vertical transmission mechanism comprises a first driver, a first driving wheel, a first synchronous belt, a first follower wheel, a first linear guide rail kinematic pair and the lifting plate;
the first driver is connected with the first driving wheel and is used for providing power;
the first driving wheel is connected with the first follower wheel through the first synchronous belt;
the lifting plate is arranged on the first linear guide rail kinematic pairs at two sides of the lifting plate and is connected with the first synchronous belt through the toothed plate, and the first synchronous belt moves to drive the lifting plate to move;
the horizontal rotating mechanism is fixed on the lifting plate.
In some embodiments, the first position measurer is disposed near a top end of the first linear guide kinematic pair on one side of the lifter plate.
In some embodiments, the transmission mechanism further comprises a horizontal transmission mechanism fixedly arranged at the bottom end part of the vertical transmission mechanism, and the horizontal transmission mechanism is configured to drive the vertical transmission mechanism to perform horizontal linear motion.
In some embodiments, the position measurer further comprises a second position measurer disposed on the horizontal drive mechanism, the second position measurer configured to measure a distance of movement of the horizontal drive mechanism in a horizontal direction.
In some embodiments, a horizontal limit trigger communication device is further arranged at one end of the horizontal transmission mechanism, and the horizontal limit trigger communication device is electrically connected with the second position measurer;
when the translation plate on the horizontal transmission mechanism is contacted with the second position measurer, the second position measurer is used for measuring the moving distance of the horizontal transmission mechanism in the horizontal direction, and the moving distance is recorded by the horizontal limit position triggering communication device and then is sent to the control system.
In some embodiments, the horizontal transmission mechanism comprises a second driver, a second driving wheel, a second synchronous belt, a second follower wheel, a second linear guide rail kinematic pair and the translation plate;
the second driver is connected with the second driving wheel and is used for providing power;
the second driving wheel is connected with the second follow-up wheel through the second synchronous belt;
the translation plate is arranged on the second linear guide rail kinematic pairs at two sides of the translation plate and is connected with the second synchronous belt through a toothed plate, and the second synchronous belt moves to drive the translation plate to move;
the vertical transmission mechanism is fixed on the translation plate.
In some embodiments, the second position measurer is disposed near one end of the second linear guide motion pair on one side of the translation plate.
The wafer conveying equipment provided by the invention has the beneficial effects that: through set up the position measurement ware on drive mechanism for measure drive mechanism's motion distance in real time, and feed back to control system, the staff of being convenient for knows drive mechanism motion distance's accuracy in real time, thereby has guaranteed the accuracy of position when brilliant conveying, has improved the efficiency that the wafer was conveyed, and the condition of the piece emergence appears in the collision when avoiding the wafer conveying.
Drawings
FIG. 1 is a schematic diagram of a wafer transfer apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic view of a vertical transmission mechanism according to an embodiment of the present invention;
FIG. 3 is an enlarged view of FIG. 2 at A;
FIG. 4 is a schematic diagram of a horizontal transmission mechanism according to an embodiment of the present invention;
fig. 5 is an enlarged view at B in fig. 4.
Reference numerals:
the vertical transmission mechanism 1, the first driver 11, the first driving wheel 12, the first synchronous belt 13, the first follower wheel 14, the first linear guide rail kinematic pair 15, the lifting plate 16, the first speed reducer 17, the horizontal rotation mechanism 2, the horizontal transmission mechanism 3, the second driver 31, the second driving wheel 32, the second synchronous belt 33, the second follower wheel 34, the second linear guide rail kinematic pair 35, the translation plate 36, the second speed reducer 37, the clamping executing device 4, the first position measurer 51, the first contact 511, the upper limit triggering communication device 52, the second position measurer 53, the second contact 531, the horizontal limit triggering communication device 54, the horizontal conveying auxiliary device 6 and the toothed plate 7.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention. Unless otherwise defined, technical or scientific terms used herein should be given the ordinary meaning as understood by one of ordinary skill in the art to which this invention belongs. As used herein, the word "comprising" and the like means that elements or items preceding the word are included in the element or item listed after the word and equivalents thereof without precluding other elements or items. As used herein, "attached" refers to an attachment that is either direct or indirect, i.e., through an intermediate, unless specifically indicated otherwise.
In view of the problems existing in the prior art, an embodiment of the present invention provides a wafer conveying apparatus, and referring to fig. 1, fig. 1 is a schematic structural diagram of the wafer conveying apparatus according to the embodiment of the present invention. Specifically, the wafer transfer apparatus includes a transfer device (not shown) and a clamp actuator 4. The conveying device comprises a transmission mechanism and a position measurer, wherein the position measurer is configured to measure the movement distance of the transmission mechanism so as to monitor the transmission of the transmission mechanism, and the actual movement distance of the transmission mechanism is convenient for a worker to know.
The clamping executing device 4 is movably arranged on the transmission mechanism, and the clamping executing device 4 is used for clamping the wafer and moves along the transmission path under the drive of the transmission mechanism so that the wafer is transmitted among all the process units.
In this embodiment, the position measurer is disposed on the transmission mechanism, so that the movement distance of the transmission mechanism is measured in real time and fed back to the control system, so that a worker can know the accuracy of the movement distance of the transmission mechanism in real time, the accuracy of the position during crystal conveying is ensured, the efficiency of conveying wafers is improved, and the occurrence of fragments caused by collision during conveying the wafers is avoided.
Fig. 2 is a schematic structural diagram of a vertical transmission mechanism according to an embodiment of the present invention. Fig. 3 is an enlarged view at a in fig. 2. Fig. 4 is a schematic structural diagram of a horizontal transmission mechanism according to an embodiment of the present invention. Fig. 5 is an enlarged view at B in fig. 4.
Referring to fig. 2 and 3, in some embodiments, the transmission mechanism includes a vertical transmission mechanism 1 and a horizontal rotation mechanism 2 rotatably provided to the clamp actuation device 4. The horizontal rotating mechanism 2 is fixed on the vertical transmission mechanism 1, the vertical transmission mechanism 1 can drive the horizontal rotating mechanism 2 to perform lifting motion, and the horizontal rotating mechanism 2 is configured to drive the clamping executing device 4 to rotate around the axis of the clamping executing device 4 so as to realize adjustment of the clamping executing device 4 in different directions.
The position measuring device includes a first position measuring device 51 provided on the vertical transmission mechanism 1, and the first position measuring device 51 is configured to measure a movement distance of the vertical transmission mechanism 1 in a vertical direction. In addition, an upper limit trigger communication device 52 is disposed on the top of the vertical transmission mechanism 1, and the upper limit trigger communication device 52 is electrically connected to the first position measurer 51.
When the lifting plate 16 on the vertical transmission mechanism 1 contacts with the first position measurer 51, the first position measurer 51 measures the movement distance of the vertical transmission mechanism 1 in the vertical direction, and the movement distance is recorded by the upper limit trigger communication device 52 and then sent to the control system, so that a worker can know whether the transmission distance of the vertical transmission mechanism 1 changes.
In this embodiment, the first position measurer 51 may be an electronic ruler, and the upper limit trigger communication device 52 may be a data transmission communication module. In actual monitoring, the vertical transmission mechanism 1 contacts with the contact of the electronic ruler when reaching the upper limit position of vertical movement each time, the electronic ruler obtains a numerical value, the position can be marked as a zero position, then, measurement data can be obtained each time the vertical transmission mechanism 1 moves and contacts with the contact of the electronic ruler, the measurement data is compared with the measurement data in initial contact to judge whether the measurement data is high or low, and the measurement data is transmitted to a control system (upper computer) through the upper limit trigger communication device 52, so that the accuracy of vertical movement is monitored.
Specifically, referring to fig. 2, the vertical transmission mechanism 1 includes a first driver 11, a first driving wheel 12, a first timing belt 13, a first follower wheel 14, a first linear guide rail kinematic pair 15, and the lifting plate 16. The first driver 11 is connected to the first driving wheel 12 for providing power. The first driving wheel 12 is connected to the first follower wheel 14 through the first timing belt 13 to realize movement of the first timing belt 13. The lifting plate 16 is mounted on the first linear guide rail kinematic pair 15 on both sides thereof and is connected with the first synchronous belt 13 through the toothed plate 7. When the first synchronous belt 13 moves, the lifting plate 16 is driven to move along the first linear guide rail kinematic pair 15. The horizontal rotation mechanism 2 is fixed on the lifting plate 16, so that the horizontal rotation mechanism 2 is driven to move in the vertical direction. Also, a first decelerator 17 may be connected to the first driver 11 to secure stability of the vertical movement.
In this embodiment, the first driver 11 may be a servo motor.
In some embodiments, the first position measurer 51 is disposed near the top end of the first linear guide rail kinematic pair 15 on one side of the lifting plate 16. That is, the first position measuring device 51 is close to the top end of one of the first linear guide rail kinematic pairs 15, and when the lifting plate 16 is lifted vertically, one side wall of the lifting plate 16 is contacted with the first contact 511 of the first position measuring device 51, so that the monitoring of the vertical distance can be completed.
Referring to fig. 4 and 5, in some embodiments, the transmission mechanism further includes a horizontal transmission mechanism 3 fixedly disposed at a bottom end portion of the vertical transmission mechanism 1, and the horizontal transmission mechanism 3 is configured to drive the vertical transmission mechanism 1 to perform a horizontal linear motion. Therefore, the transmission mechanism can simultaneously complete the movement in the horizontal and vertical directions.
Further, the position measurer further includes a second position measurer 53 disposed on the horizontal transmission mechanism 3, where the second position measurer 53 is configured to measure a movement distance of the horizontal transmission mechanism 3 in a horizontal direction, and the second position measurer 53 is configured to monitor the movement distance of the horizontal transmission mechanism 3.
In addition, a horizontal limit trigger communication device 54 is further disposed at one end portion of the horizontal transmission mechanism 3, specifically at the end portion located at the left side, and the horizontal limit trigger communication device 54 is electrically connected to the second position measurer 53.
When the translation plate 36 on the horizontal transmission mechanism 3 contacts with the second contact 531 of the second position measurer 53, the second position measurer 53 is configured to measure the moving distance of the horizontal transmission mechanism 3 in the horizontal direction, and record the moving distance by the horizontal limit trigger communication device 54, and send the moving distance to the control system, so that the real-time monitoring of the staff is facilitated, and the moving accuracy of the horizontal transmission mechanism 3 in the horizontal direction is ensured.
In this embodiment, the second position measurer 53 may be an electronic ruler, and the horizontal limit trigger communication device 54 may be a data transmission communication module. In actual monitoring, as with the monitoring distance of the vertical transmission mechanism 1, the translation plate 36 moves horizontally until reaching the left limit position in the initial stage, and contacts with the contact of the electronic ruler, at this time, the electronic ruler obtains a numerical value, the position can be marked as a zero position, then each time the horizontal transmission mechanism 3 moves to contact with the contact of the electronic ruler, measurement data can be obtained, the measurement data is compared with the measurement data in the initial contact, whether the measurement data is high or low is judged, and the measurement data is transmitted to a control system (upper computer) through the horizontal limit triggering communication device 54, so that the accuracy of horizontal movement is monitored.
In some embodiments, the horizontal transmission mechanism 3 and the vertical transmission mechanism 1 may share a data transmission communication module.
In some embodiments, referring to fig. 4, the horizontal transmission mechanism 3 includes a second driver 31, a second driving wheel 32, a second timing belt 33, a second follower wheel 34, a second linear guide motion pair 35, and the translation plate 36. The second driver 31 is connected to the second driving wheel 32 for providing power. The second driving wheel 32 is connected to the second follower wheel 34 via the second timing belt 33. The translation plate 36 is mounted on the second linear guide rail kinematic pair 35 at two sides of the translation plate, and is connected with the second synchronous belt 33 through the toothed plate 7, and the second synchronous belt 33 moves to drive the translation plate 36 to move along the second linear guide rail kinematic pair 35. The vertical transmission mechanism 1 is fixed on the translation plate 36, so that the horizontal transmission mechanism 3 can drive the vertical transmission mechanism 1 to move along the horizontal direction.
In this embodiment, the second driver 31 may be a servo motor. And, a second decelerator 37 may be connected to the second driver 31 to secure the stability of the horizontal movement.
In some embodiments, the second position measurer 53 is disposed near one end of the second linear guide motion pair 35 on one side of the translation plate 36. And in particular at the left end of the second linear guide kinematic pair 35.
In this embodiment, in order to secure stability of horizontal movement, a horizontal transfer assist device configured to guide the vertical transmission mechanism 1 to move in an extending direction of the horizontal transfer assist device may be provided at a top end of the vertical transmission mechanism 1. The horizontal transfer assist device may be a sliding rail.
The foregoing is merely a specific implementation of the embodiments of the present application, but the protection scope of the embodiments of the present application is not limited thereto, and any changes or substitutions within the technical scope disclosed in the embodiments of the present application should be covered by the protection scope of the embodiments of the present application. Therefore, the protection scope of the embodiments of the present application shall be subject to the protection scope of the claims.
Claims (11)
1. The wafer conveying equipment is characterized by comprising a conveying device and a clamping executing device;
the conveying device comprises a transmission mechanism and a position measurer, wherein the position measurer is configured to measure the movement distance of the transmission mechanism so as to monitor the transmission of the transmission mechanism;
the clamping executing device is movably arranged on the transmission mechanism, and is used for clamping the wafer and moving along the transmission path under the drive of the transmission mechanism.
2. The wafer transfer apparatus according to claim 1, wherein the transmission mechanism includes a vertical transmission mechanism and a horizontal rotation mechanism rotatably provided to the clamp performing device;
the vertical transmission mechanism is configured to drive the clamping executing device to perform lifting movement through the horizontal rotation mechanism;
the horizontal rotating mechanism is fixedly arranged on the vertical transmission mechanism and is configured to drive the clamping executing device to rotate around the axis of the clamping executing device.
3. The wafer transfer apparatus of claim 2, wherein the position measurer comprises a first position measurer disposed on the vertical transmission mechanism, the first position measurer configured to measure a movement distance of the vertical transmission mechanism in a vertical direction.
4. The wafer transfer apparatus of claim 3, wherein a first position measurer is provided on top of the vertical transmission mechanism, the upper limit trigger communication device being electrically connected to the first position measurer;
when the lifting plate on the vertical transmission mechanism is contacted with the first position measurer, the first position measurer measures the movement distance of the vertical transmission mechanism in the vertical direction, and the movement distance is recorded by the upper limit trigger communication device and then is sent to the control system.
5. The wafer transfer apparatus of claim 4, wherein the vertical transmission mechanism comprises a first driver, a first drive wheel, a first timing belt, a first follower wheel, a first linear guide kinematic pair, and the lifter plate;
the first driver is connected with the first driving wheel and is used for providing power;
the first driving wheel is connected with the first follower wheel through the first synchronous belt;
the lifting plate is arranged on the first linear guide rail kinematic pairs at two sides of the lifting plate and is connected with the first synchronous belt through the toothed plate, and the first synchronous belt moves to drive the lifting plate to move;
the horizontal rotating mechanism is fixed on the lifting plate.
6. The wafer transfer apparatus according to claim 5, wherein the first position measurer is disposed near a top end of the first linear guide kinematic pair on the lifting plate side.
7. The wafer transfer apparatus of claim 2, wherein the drive mechanism further comprises a horizontal drive mechanism fixedly disposed at a bottom end of the vertical drive mechanism, the horizontal drive mechanism configured to drive the vertical drive mechanism to perform a horizontal linear motion.
8. The wafer transfer apparatus of claim 7, wherein the position measurer further comprises a second position measurer disposed on the horizontal transmission mechanism, the second position measurer configured to measure a movement distance of the horizontal transmission mechanism in a horizontal direction.
9. The wafer transfer apparatus of claim 8, wherein an end of the horizontal transmission mechanism is further provided with a horizontal limit trigger communication device, the horizontal limit trigger communication device being electrically connected to the second position measurer;
when the translation plate on the horizontal transmission mechanism is contacted with the second position measurer, the second position measurer is used for measuring the moving distance of the horizontal transmission mechanism in the horizontal direction, and the moving distance is recorded by the horizontal limit position triggering communication device and then is sent to the control system.
10. The wafer transfer apparatus of claim 9, wherein the horizontal transmission mechanism comprises a second driver, a second drive wheel, a second timing belt, a second follower wheel, a second linear guide motion pair, and the translating plate;
the second driver is connected with the second driving wheel and is used for providing power;
the second driving wheel is connected with the second follow-up wheel through the second synchronous belt;
the translation plate is arranged on the second linear guide rail kinematic pairs at two sides of the translation plate and is connected with the second synchronous belt through a toothed plate, and the second synchronous belt moves to drive the translation plate to move;
the vertical transmission mechanism is fixed on the translation plate.
11. The wafer transfer apparatus according to claim 10, wherein the second position measurer is provided near one end of the second linear guide kinematic pair on one side of the translation plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310186561.4A CN116130394A (en) | 2023-03-01 | 2023-03-01 | Wafer transfer apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310186561.4A CN116130394A (en) | 2023-03-01 | 2023-03-01 | Wafer transfer apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116130394A true CN116130394A (en) | 2023-05-16 |
Family
ID=86304709
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310186561.4A Pending CN116130394A (en) | 2023-03-01 | 2023-03-01 | Wafer transfer apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116130394A (en) |
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2023
- 2023-03-01 CN CN202310186561.4A patent/CN116130394A/en active Pending
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