CN116124277A - Integral piezoelectric film sensor - Google Patents
Integral piezoelectric film sensor Download PDFInfo
- Publication number
- CN116124277A CN116124277A CN202211653789.1A CN202211653789A CN116124277A CN 116124277 A CN116124277 A CN 116124277A CN 202211653789 A CN202211653789 A CN 202211653789A CN 116124277 A CN116124277 A CN 116124277A
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- CN
- China
- Prior art keywords
- pcb
- piezoelectric film
- shell
- adhesive layer
- potting adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012790 adhesive layer Substances 0.000 claims abstract description 22
- 238000004382 potting Methods 0.000 claims abstract description 22
- 238000003466 welding Methods 0.000 claims abstract description 17
- 239000010408 film Substances 0.000 claims description 36
- 239000010409 thin film Substances 0.000 claims description 6
- 230000000694 effects Effects 0.000 abstract description 6
- 230000002265 prevention Effects 0.000 abstract description 6
- 239000000428 dust Substances 0.000 abstract description 5
- 238000009434 installation Methods 0.000 abstract description 4
- 238000007789 sealing Methods 0.000 abstract description 4
- 239000000565 sealant Substances 0.000 abstract description 3
- JAYCNKDKIKZTAF-UHFFFAOYSA-N 1-chloro-2-(2-chlorophenyl)benzene Chemical compound ClC1=CC=CC=C1C1=CC=CC=C1Cl JAYCNKDKIKZTAF-UHFFFAOYSA-N 0.000 description 8
- 101100084627 Neurospora crassa (strain ATCC 24698 / 74-OR23-1A / CBS 708.71 / DSM 1257 / FGSC 987) pcb-4 gene Proteins 0.000 description 8
- 238000010586 diagram Methods 0.000 description 2
- 230000006698 induction Effects 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
- G01H11/00—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties
- G01H11/06—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means
- G01H11/08—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means using piezoelectric devices
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
Abstract
The invention discloses an integrated piezoelectric film sensor, which comprises a shell and a piezoelectric film piece, wherein a first buckling block and a second opening block are respectively arranged on the inner side of the shell, the shell is connected with a PCB (printed circuit board) through the first buckling block and the second buckling block in a buckling manner, an electric connection seat is arranged at the upper end of the PCB, welding needles are symmetrically arranged on the outer side of the piezoelectric film piece, the piezoelectric film piece is connected with the PCB in a welding manner through the welding needles, a dew area and a needle seat groove are respectively arranged on the inner side of the shell, a potting adhesive layer is arranged on the inner side of the shell, the potting adhesive layer covers the upper end of the PCB, and the upper end of the electric connection seat penetrates through the potting adhesive layer. According to the scheme, the piezoelectric film piece is fixedly welded on the PCB, then the PCB is placed in the shell, the piezoelectric film piece is tightly pressed between the PCB and the shell, then the PCB is sealed in the shell by the pouring sealant, and the sensor is in contact installation with the sensing surface through the screw hole, so that the effects of sealing, moisture prevention, dust prevention and interference resistance can be achieved.
Description
Technical Field
The invention relates to the technical field of sensors, in particular to an integrated piezoelectric thin film sensor.
Background
The piezoelectric film has unique characteristics, is used as a dynamic strain sensor, and is very suitable for monitoring vital signals on the surface of human skin or implanted into the human body. Some of the thin film elements are sensitive enough to detect the pulse of the human body through the sheath. Several typical applications of piezoelectric films in the monitoring of vital signs will be highlighted.
The piezoelectric film sensor is used for detecting weak vibration signals, and the traditional piezoelectric film sensor is composed of an independent piezoelectric film piece and an independent signal control unit, wherein the two parts are connected through a shielding wire. The piezoelectric film is stuck to the position to be detected to realize the detection function, and the piezoelectric film in the mode is exposed in the environment and cannot achieve the effects of moisture resistance, dust resistance and poor interference resistance, so that the service life and the application range of the product are limited.
Disclosure of Invention
1. Technical problem to be solved
Aiming at the problems in the prior art, the invention aims to provide an integrated piezoelectric film sensor, which is characterized in that a piezoelectric film sheet is fixedly welded on a PCB (printed circuit board), then the PCB is placed in a shell, the piezoelectric film sheet is tightly pressed between the PCB and the shell, then the PCB is sealed in the shell by pouring sealant, and the sensor is in contact installation with an induction surface through screw holes, so that the effects of sealing, moisture resistance, dust resistance and interference resistance can be achieved.
2. Technical proposal
In order to solve the problems, the invention adopts the following technical scheme.
The utility model provides an integral type piezoelectricity film sensor, includes casing and piezoelectricity film piece, the inboard of casing is equipped with first knot piece and second mouth piece respectively, the casing is connected with the PCB board through first knot piece and second knot piece lock joint, the upper end of PCB board is equipped with connects the electric seat, the outside symmetry of piezoelectricity film piece is equipped with the welding needle, the piezoelectricity film piece passes through welding needle and PCB board welded connection, the inboard of casing is equipped with dew area and needle file groove respectively, the inboard of casing has the potting adhesive layer, the potting adhesive layer covers the upper end of PCB board, the upper end of connecing the electric seat runs through the potting adhesive layer.
Further, a rectangular hole is formed in the upper end of the potting adhesive layer, and the upper end of the power receiving seat penetrates through the potting adhesive layer.
Furthermore, positioning grooves are symmetrically formed in the outer side of the PCB, positioning blocks are symmetrically arranged in the inner side of the shell, and the positioning blocks are in plug connection with the positioning grooves.
Furthermore, the piezoelectric film piece is arranged right above the open area, and the welding needle is arranged at the inner side of the needle seat groove.
Further, 1 first buckling block is arranged in total, and 3 second buckling blocks are arranged in total.
3. Advantageous effects
Compared with the prior art, the invention has the advantages that:
according to the scheme, the piezoelectric film piece is fixedly welded on the PCB, then the PCB is placed in the shell, the piezoelectric film piece is tightly pressed between the PCB and the shell, then the PCB is sealed in the shell by the pouring sealant, and the sensor is in contact installation with the sensing surface through the screw hole, so that the effects of sealing, moisture prevention, dust prevention and interference resistance can be achieved.
Drawings
FIG. 1 is a schematic diagram of the structure of the present invention;
FIG. 2 is an exploded view of the present invention;
fig. 3 is a schematic diagram of a PCB board installation of the present invention;
fig. 4 is a schematic view of the internal structure of the housing of the present invention.
The reference numerals in the figures illustrate:
1. the device comprises a shell, 101, a hollow area, 102, a needle seat groove, 103, a positioning block, 2, a potting adhesive layer, 201, a rectangular hole, 3, a second buckling block, 4, a PCB, 401, a power receiving seat, 402, a positioning groove, 5, a piezoelectric film piece, 501, a welding needle, 6 and a first buckling block.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention; it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments, and that all other embodiments obtained by persons of ordinary skill in the art without making creative efforts based on the embodiments in the present invention are within the protection scope of the present invention.
In the description of the present invention, it should be noted that the positional or positional relationship indicated by the terms such as "upper", "lower", "inner", "outer", "top/bottom", etc. are based on the positional or positional relationship shown in the drawings, are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "configured to," "engaged with," "connected to," and the like are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
Example 1:
referring to fig. 1-4, an integrated piezoelectric film sensor includes a housing 1 and a piezoelectric film piece 5, wherein a first buckling block 6 and a second opening block are respectively disposed on the inner side of the housing 1, the housing 1 is connected with a PCB board 4 through the first buckling block 6 and the second buckling block 3 in a buckling manner, an electric connection seat 401 is disposed at the upper end of the PCB board 4, welding pins 501 are symmetrically disposed on the outer side of the piezoelectric film piece 5, the piezoelectric film piece 5 is connected with the PCB board 4 through the welding pins 501 in a welding manner, a dew area 101 and a needle seat groove 102 are respectively disposed on the inner side of the housing 1, a potting adhesive layer 2 is disposed on the inner side of the housing 1, the potting adhesive layer 2 covers the upper end of the PCB board 4, and the upper end of the electric connection seat 401 penetrates through the potting adhesive layer 2.
Referring to fig. 2, a rectangular hole 201 is formed at the upper end of the potting adhesive layer 2, the upper end of the power connection seat 401 penetrates through the potting adhesive layer 2, and the power connection seat 401 penetrates through the potting adhesive layer 2 through the PCB 4, so that sealing can be conveniently performed; this penetration is the structure of the cured potting adhesive layer 2.
Referring to fig. 3, the piezoelectric film 5 is disposed right above the open area 101, the welding pin 501 is disposed inside the pin seat groove 102, and the piezoelectric film 5 is disposed in the inductive open area 101 to provide micro deformation space for the piezoelectric film 5 to press to the area, and meanwhile, the pin seat groove 102 is added at the bottom of the housing 1 to prevent the welding pin 501 of the piezoelectric film 5 from jacking up to make the film adhere to the bottom of the housing 1.
Referring to fig. 4, 1 first fastening blocks 6 are provided, 3 second fastening blocks 3 are provided, and the PCB 4 can be pressed at the bottom of the casing 1 by adding the first fastening blocks 6 and the second fastening blocks 3 on the inner side of the casing 1.
When the invention is used, the welding needle 501 of the piezoelectric film piece 5 is welded at the lower end of the PCB 4, then the PCB 4 is placed into the shell 1, the PCB 4 is positioned by the positioning groove 402 and the positioning block 103 in the shell 1, then the PCB 4 is tightly pressed by matching the first buckling block 6 and the second buckling block 3, meanwhile, the piezoelectric film piece 5 of the PCB 4 is covered on the induction open area 101, the welding needle 501 of the piezoelectric film piece 5 is placed in the needle seat groove 102 of the shell 1, and finally the whole PCB 4 is sealed by using the potting adhesive layer 2, so that the effects of groove prevention, dust prevention and interference resistance are achieved.
The above description is only of the preferred embodiments of the present invention; the scope of the invention is not limited in this respect. Any person skilled in the art, within the technical scope of the present disclosure, may apply to the present invention, and the technical solution and the improvement thereof are all covered by the protection scope of the present invention.
Claims (5)
1. The utility model provides an integral type piezoelectricity film sensor, includes casing and piezoelectricity film piece, its characterized in that: the inner side of casing is equipped with first knot piece and second mouth piece respectively, the casing has the PCB board through first knot piece and second knot piece lock joint, the upper end of PCB board is equipped with connects the electric seat, the outside symmetry of piezoelectric film piece is equipped with the welding needle, the piezoelectric film piece passes through welding needle and PCB board welded connection, the inboard of casing is equipped with dew district and needle file groove respectively, the inboard of casing has the potting adhesive layer, the potting adhesive layer covers the upper end of PCB board, connect the upper end of electric seat to run through the potting adhesive layer.
2. An integrated piezoelectric thin film sensor according to claim 1, wherein: the upper end of the potting adhesive layer is provided with a rectangular hole, and the upper end of the power receiving seat penetrates through the potting adhesive layer.
3. An integrated piezoelectric thin film sensor according to claim 1, wherein: locating grooves are symmetrically formed in the outer side of the PCB, locating blocks are symmetrically arranged in the inner side of the shell, and the locating blocks are in plug-in connection with the locating grooves.
4. An integrated piezoelectric thin film sensor according to claim 1, wherein: the piezoelectric film piece is arranged right above the open area, and the welding needle is arranged at the inner side of the needle seat groove.
5. An integrated piezoelectric thin film sensor according to claim 1, wherein: the first buckling blocks are 1 in number, and the second buckling blocks are 3 in number.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211653789.1A CN116124277A (en) | 2022-12-22 | 2022-12-22 | Integral piezoelectric film sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211653789.1A CN116124277A (en) | 2022-12-22 | 2022-12-22 | Integral piezoelectric film sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116124277A true CN116124277A (en) | 2023-05-16 |
Family
ID=86296598
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211653789.1A Pending CN116124277A (en) | 2022-12-22 | 2022-12-22 | Integral piezoelectric film sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116124277A (en) |
-
2022
- 2022-12-22 CN CN202211653789.1A patent/CN116124277A/en active Pending
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