CN116113166A - Manufacturing method of circuit board and manufacturing method of electronic tag - Google Patents

Manufacturing method of circuit board and manufacturing method of electronic tag Download PDF

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Publication number
CN116113166A
CN116113166A CN202310008017.0A CN202310008017A CN116113166A CN 116113166 A CN116113166 A CN 116113166A CN 202310008017 A CN202310008017 A CN 202310008017A CN 116113166 A CN116113166 A CN 116113166A
Authority
CN
China
Prior art keywords
circuit board
insulating layer
top surface
manufacturing
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202310008017.0A
Other languages
Chinese (zh)
Inventor
何忠亮
谢先军
李维成
赵标
沈正
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jiangxi Dinghua Xintai Technology Co ltd
Original Assignee
Jiangxi Dinghua Xintai Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jiangxi Dinghua Xintai Technology Co ltd filed Critical Jiangxi Dinghua Xintai Technology Co ltd
Priority to CN202310008017.0A priority Critical patent/CN116113166A/en
Publication of CN116113166A publication Critical patent/CN116113166A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

The invention discloses a manufacturing method of a circuit board and a manufacturing method of an electronic tag. The circuit board comprises a flexible or rigid base material and a circuit attached to the base material, and the manufacturing method of the circuit board comprises the following manufacturing steps: covering a first insulating layer on the top surface of the carrier sheet, wherein the first insulating layer comprises hollowed-out patterns corresponding to the shapes of the circuits; electroplating a conductive layer in the hollowed pattern of the first insulating layer, and plating electrophoretic paint on the top surface of the conductive layer; before the electrophoretic paint is cured, bonding the bearing surface of the base material with the top surface of the first insulating layer and the top surface of the electrophoretic paint, and bonding the conductive layer and the bearing surface of the base material through the electrophoretic paint; the carrier sheet is peeled off and the conductive layer is transferred from the carrier sheet to the receiving surface of the substrate. The circuit board manufacturing method provided by the invention is simple in process and low in cost.

Description

Manufacturing method of circuit board and manufacturing method of electronic tag
[ technical field ]
The present invention relates to circuit products, and more particularly, to a method for manufacturing a circuit board and a method for manufacturing an electronic tag.
[ background Art ]
Along with the development of science and technology, various electronic products have come into the life of people, and unprecedented shortages are brought to the life and work of people. Electronic products such as electronic tags, computer keyboards, and various remote controllers have been widely used.
The electronic tag and the reader are realized through the coupling elementRadio frequency signalIs a spatial (contactless) coupling of (a) a; and in the coupling channel, energy transmission and data exchange are realized according to the time sequence relation. Along with the development of the Internet of things technology, the electronic tag is used as a data carrier, has the functions of identification, article tracking and information acquisition, and is mainly applied to vehicle-mounted ETC, product anti-counterfeiting, production line management, warehouse management, fixed asset management,Book with book coverAnd leasing product management, medical and health fields.
The computer keyboard and the remote controller are media for human-computer interaction input or control of the human and electronic terminal equipment, are visible everywhere in life and work, and are indispensable electronic products.
Whether electronic products such as electronic tags, computer keyboards and remote controllers are electronic products, the keyboard, the remote controllers and the electronic tags are common electronic products, and the electronic products have large production quantity, simple process and low cost.
Traditional keyboard circuit board and electronic tags circuit board adopt silver thick liquid printing, and silver thick liquid price is high, and the cost of keyboard circuit board hardly falls. If an aluminum foil etching process is adopted, the process is complex and the environment is easy to be polluted.
For example, the invention with the application number of CN202211254879.3 discloses a method for producing a paper substrate electronic tag antenna capable of layering and an antenna, belonging to the technical field of antenna circuit production; the method comprises the steps of surface waterproofing: using paper as an antenna substrate, and coating with waterproof infiltration property; coating and drying the upper and lower surfaces of the paper layer to form an upper waterproof layer and a lower waterproof layer, wherein the thickness range of the waterproof layer coating is 1-10 microns; end face water-proof: forming wax seal end surfaces on all end surfaces of the paper layer in a spraying mode; antenna material compounding: coating composite glue on the surface of a paper material by adopting aluminum-plastic composite glue, and heating and drying a solvent by hot air to form a composite metal foil, wherein the thickness range of the metal foil is 10-35 microns; and (3) gloss oil printing: printing an antenna line type on the surface of an antenna material by using protective varnish; the antenna material is covered by the aluminum foil, and the antenna is formed by acid etching, so that the environment is easy to be polluted, the process is complex, and the cost of the antenna is high; in the invention, paper is used as an antenna substrate, and in order to realize a subsequent etching process, the paper substrate needs double-layer waterproof and end face waterproof, so that the process difficulty and the product cost are further increased.
[ summary of the invention ]
The invention aims to provide a circuit board manufacturing method with simple process and low cost.
The invention further aims to provide a manufacturing method of the electronic tag, which is simple in circuit board process and low in cost.
In order to solve the technical problems, the technical scheme adopted by the invention is that the manufacturing method of the circuit board comprises a flexible or rigid base material and a circuit attached to the base material, and comprises the following manufacturing steps:
101 Covering a first insulating layer on the top surface of the bearing sheet, wherein the first insulating layer comprises hollowed-out patterns corresponding to the shapes of the lines;
102 Electroplating a conductive layer in the hollowed-out pattern of the first insulating layer, and plating electrophoretic paint on the top surface of the conductive layer;
103 Before the electrophoretic paint is cured, bonding the bearing surface of the base material with the top surface of the first insulating layer and the top surface of the electrophoretic paint, and bonding the conductive layer with the bearing surface of the base material through the electrophoretic paint;
104 A carrier sheet from which the conductive layer is transferred to the receiving surface of the substrate.
According to the manufacturing method of the circuit board, the bearing sheet is a stainless steel sheet, the first insulating layer is a photosensitive resin layer, and the photosensitive resin layer is sensitized and developed to form hollowed patterns corresponding to the circuit shape.
In step 103, the supporting surface of the substrate is bonded to the top surface of the first insulating layer and the top surface of the electrophoretic coating, and then hot-pressed, so that the conductive layer is bonded to the supporting surface of the substrate through the electrophoretic coating; the hot pressing temperature is 60-150 ℃.
In the above-described method for manufacturing a circuit board, the peeled carrier sheet is subjected to step 102 again, step 103 with a new base material, and then step 104.
In the above method for manufacturing a circuit board, the flexible substrate comprises a paper, cloth or plastic sheet, and the rigid substrate comprises a metal sheet or a resin sheet.
According to the manufacturing method of the circuit board, the rigid base material comprises the metal sheet and the second insulating layer, the second insulating layer covers the top surface of the metal sheet, and the top surface of the second insulating layer is the bearing surface.
In the above method for manufacturing a circuit board, the conductive layer is a plating layer of at least one of copper, silver, nickel or tin.
The circuit board is an electronic tag circuit board, a keyboard backlight circuit board or a remote controller circuit board.
The circuit board of the electronic tag manufactured by the method is a paper substrate.
In the above manufacturing method, the circuit board is attached to the substrate, the circuit includes an antenna, the antenna includes two pads, and two electrodes of the RF id chip of the electronic tag are electrically connected to the two pads, respectively.
The manufacturing method of the circuit board has simple process and low cost.
[ description of the drawings ]
The invention will be described in further detail with reference to the drawings and the detailed description.
Fig. 1 is a schematic diagram of step 1 of a circuit board manufacturing method according to embodiment 1 of the present invention.
Fig. 2 is a schematic diagram of step 2 of the method for manufacturing a circuit board according to embodiment 1 of the present invention.
Fig. 3 is a schematic diagram of step 3 of the method for manufacturing a circuit board according to embodiment 1 of the present invention.
Fig. 4 is a schematic diagram of step 4 of the method for manufacturing a circuit board according to embodiment 1 of the present invention.
Fig. 5 is a schematic diagram of step 5 of the method for manufacturing a circuit board according to embodiment 1 of the present invention.
Fig. 6 is a top view of a backlight circuit board of a keyboard according to embodiment 2 of the present invention.
Fig. 7 is a bottom view of a backlight circuit board of a keyboard according to embodiment 2 of the present invention.
Fig. 8 is a left side view of a backlight circuit board of a keyboard according to embodiment 2 of the present invention.
Fig. 9 is a top view of a backlight circuit board-removed cover film of a keyboard according to embodiment 2 of the present invention.
Fig. 10 is a section A-A of fig. 6.
Fig. 11 is a top view of an electronic tag according to embodiment 3 of the present invention.
Fig. 12 is a section B-B of fig. 11.
Fig. 13 is a top view of an electronic tag flexible circuit board according to embodiment 3 of the present invention.
Detailed description of the preferred embodiments
As shown in fig. 1 to 5, the circuit board of embodiment 1 of the present invention includes a flexible or rigid substrate 10 and a circuit attached to the substrate 10, wherein the flexible substrate 10 may be a paper, cloth or plastic sheet (such as PET or P I), and the rigid substrate 10 may be a metal sheet or a resin sheet.
The manufacturing of the circuit board of the embodiment 1 of the invention comprises the following manufacturing steps:
1) As shown in fig. 1, the top surface of the carrier 20 is covered with a first insulating layer 30, and the first insulating layer 30 includes a hollowed pattern 31 corresponding to the shape of the circuit. In embodiment 1, the carrier sheet 20 is a stainless steel sheet, the first insulating layer 30 is a photosensitive resin layer, and the photosensitive resin layer is photosensitive and developed to form a hollowed pattern 31 corresponding to the circuit shape.
2) As shown in fig. 2, the conductive layer 40 is electroplated in the hollowed pattern 31 of the first insulating layer 30, and the electroplated conductive layer 40 may be a copper plating layer, a silver plating layer, a nickel plating layer or a tin plating layer, or may be a composite layer of a copper plating layer, a silver plating layer, a nickel plating layer or a tin plating layer.
3) As shown in fig. 3, an electrophoretic paint (e-coat paint) 50 is plated on the top surface of the conductive layer 40.
4) As shown in fig. 4, before the electrodeposition coating composition 50 is cured, the receiving surface of the substrate 10 is bonded to the top surface of the first insulating layer 30 and the top surface of the electrodeposition coating composition 50, and then hot-pressed, so that the conductive layer 40 and the receiving surface of the substrate 10 are bonded by the electrodeposition coating composition 50. The hot pressing temperature is 60-150 ℃. By hot pressing, the conductive layer 40 is bonded to the receiving surface of the substrate 10 by the electrodeposition paint 50.
5) As shown in fig. 5, the carrier sheet 20 is peeled off, and the conductive layer 40 is transferred from the carrier sheet 20 to the receiving surface of the substrate 10, resulting in the circuit board of embodiment 1 of the present invention.
The carrier sheet 20 may be reused. The peeled carrier sheet 20 may be subjected to steps 2 and 3 again, and then subjected to hot pressing with a new substrate 10 in step 4, transferring the conductive layer, and then subjected to step 5 to peel the carrier sheet 20. In this way, the carrier sheet 20 can be continuously plated and peeled off for repeatedly producing the circuit board, reducing the process cost.
If the rigid substrate 10 is used, the rigid substrate 10 includes a metal sheet and a second insulating layer, where the second insulating layer covers the top surface of the metal sheet, and the top surface of the second insulating layer is used as a receiving surface, so that insulation between the conductive layer 40 and the metal sheet can be better ensured.
The circuit board manufactured by the embodiment 1 of the invention can be used for a circuit board of an electronic tag, a circuit board of a keyboard, a backlight circuit board of the keyboard or a circuit board of a remote controller.
The structure of the backlight circuit board of the keyboard of embodiment 2 of the present invention is shown in fig. 6 to 10, and the backlight circuit board of the keyboard of embodiment 2 is manufactured by the manufacturing method of the circuit board of embodiment 1, and comprises a flexible substrate 10 (PET) and a circuit layer 30 attached to the substrate 10, wherein the bottom surface of the substrate 10 is covered with a black ink layer 40 for shading, and the top surface of the circuit layer 30 is covered with a white cover film 50. The wiring layer 30 includes a plated conductive layer 41 and an electrophoretic paint 42. The electroplated conductive layer 41 is bonded to the substrate 10 by the electrocoat 42.
The electronic tag of embodiment 3 of the present invention has a structure as shown in fig. 11 to 13, and includes an RF id chip 30 and a flexible circuit board 100 fabricated by the fabrication method of embodiment 1, the flexible circuit board 100 including a flexible substrate 10 and an antenna 20. The flexible substrate 10 is made of paper material, and the conductive layer 21 of the antenna 20 is thermally pressed and adhered to the upper surface of the paper material of the flexible substrate 10 through the electrophoretic paint 22. The conductive layer 21 is a copper plating layer.
As shown in fig. 11 to 13, the antenna 20 includes two vibrators 23, two pads 24, and a feed loop 25, the RF id chip 30 is a flip chip, and two bottom electrodes of the RF id chip 30 are respectively fixed on the two pads 24 and are respectively electrically connected to the two pads 24.
The manufacturing method of the circuit board provided by the embodiment of the invention has the following advantages:
1) The circuit molding does not need etching, and the process is simple, energy-saving and environment-friendly, the production period is short, and the product cost is low;
2) The carrier sheet can be recycled, and the process cost is low;
3) The circuit patterns can be made on conventional circuit board plates of FR-4, aluminum plates, copper plates and ceramic plates, and can be made on PET, P I, even paper, cloth and other materials according to the product requirements;
4) The circuit forming does not need etching, and when a paper or cloth base material is adopted, the base material does not need waterproof treatment;
5) The electric conductivity of the circuit layer is high, and the product performance is good.
The manufacturing method of the electronic tag disclosed by the embodiment of the invention has the advantages of the manufacturing method of the circuit board, and the substrate of the circuit board of the electronic tag is a paper substrate, so that the environmental protection performance is good.

Claims (10)

1. A method of manufacturing a circuit board comprising a flexible or rigid substrate and a circuit attached to the substrate, comprising the steps of:
101 Covering a first insulating layer on the top surface of the bearing sheet, wherein the first insulating layer comprises hollowed-out patterns corresponding to the shapes of the lines;
102 Electroplating a conductive layer in the hollowed-out pattern of the first insulating layer, and plating electrophoretic paint on the top surface of the conductive layer;
103 Before the electrophoretic paint is cured, bonding the bearing surface of the base material with the top surface of the first insulating layer and the top surface of the electrophoretic paint, and bonding the conductive layer with the bearing surface of the base material through the electrophoretic paint;
104 A carrier sheet from which the conductive layer is transferred to the receiving surface of the substrate.
2. The method of claim 1, wherein the carrier is a stainless steel sheet, the first insulating layer is a photosensitive resin layer, and the photosensitive resin layer is sensitized and developed to form a hollowed pattern corresponding to the shape of the circuit.
3. The method according to claim 1, wherein in step 103, the supporting surface of the substrate is bonded to the top surface of the first insulating layer and the top surface of the electrophoretic paint, and then the conductive layer and the supporting surface of the substrate are bonded by the electrophoretic paint; the hot pressing temperature is 60-150 ℃.
4. The method of manufacturing a circuit board according to claim 1, wherein the peeled carrier sheet is subjected to step 102 again, and step 103 is performed with a new base material, and then step 104 is performed.
5. The method of claim 1, wherein the flexible substrate comprises paper, cloth or plastic sheet, and the rigid substrate comprises metal sheet or resin sheet.
6. The method of claim 5, wherein the rigid substrate comprises a metal sheet and a second insulating layer, the second insulating layer covers the top surface of the metal sheet, and the top surface of the second insulating layer is the receiving surface.
7. The method of claim 1, wherein the conductive layer is a plating layer of at least one of copper, silver, nickel, or tin.
8. The method of claim 1, wherein the circuit board is an electronic tag circuit board, a keyboard backlight circuit board, or a remote controller circuit board.
9. A method for manufacturing an electronic tag, characterized in that a circuit board of the electronic tag is manufactured according to the method of claim 1, and a substrate of the circuit board is a paper substrate.
10. The method of claim 9, wherein the circuit board includes an antenna, the antenna including two pads, and the two electrodes of the RFID chip are electrically connected to the two pads, respectively.
CN202310008017.0A 2023-01-04 2023-01-04 Manufacturing method of circuit board and manufacturing method of electronic tag Pending CN116113166A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202310008017.0A CN116113166A (en) 2023-01-04 2023-01-04 Manufacturing method of circuit board and manufacturing method of electronic tag

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202310008017.0A CN116113166A (en) 2023-01-04 2023-01-04 Manufacturing method of circuit board and manufacturing method of electronic tag

Publications (1)

Publication Number Publication Date
CN116113166A true CN116113166A (en) 2023-05-12

Family

ID=86253700

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202310008017.0A Pending CN116113166A (en) 2023-01-04 2023-01-04 Manufacturing method of circuit board and manufacturing method of electronic tag

Country Status (1)

Country Link
CN (1) CN116113166A (en)

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