CN116086634A - Semiconductor chip testing device for integrated circuit - Google Patents
Semiconductor chip testing device for integrated circuit Download PDFInfo
- Publication number
- CN116086634A CN116086634A CN202211375583.7A CN202211375583A CN116086634A CN 116086634 A CN116086634 A CN 116086634A CN 202211375583 A CN202211375583 A CN 202211375583A CN 116086634 A CN116086634 A CN 116086634A
- Authority
- CN
- China
- Prior art keywords
- chip
- fixed
- integrated circuit
- semiconductor chip
- friction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/01—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using semiconducting elements having PN junctions
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
- G01K1/146—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations arrangements for moving thermometers to or from a measuring position
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K13/00—Thermometers specially adapted for specific purposes
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention discloses a semiconductor chip testing device for an integrated circuit, and relates to the technical field of chip testing. The semiconductor chip testing device for the integrated circuit comprises a testing platform, wherein a testing slot is formed in the top of the testing platform, a temperature measuring mechanism is mounted on the top of the testing platform, and the temperature measuring mechanism comprises a heat conducting metal plate, a temperature detector and a rotating control rod. This a semiconductor chip testing arrangement for integrated circuit can test the temperature of chip course of working through setting up test platform, test slot, heat conduction metal sheet, thermoscope and rotation control lever to test whether the chip is normal state, set up movable lever and spring simultaneously and make between heat conduction metal sheet and the rotation control lever be elasticity soft connection, thereby prevent the too big chip damage of conflict power between heat conduction metal sheet and the chip top, and then guarantee the life-span of chip when testing the chip of different thickness.
Description
Technical Field
The invention relates to the technical field of chip testing, in particular to a semiconductor chip testing device for an integrated circuit.
Background
The semiconductor chip is an electronic component made of semiconductor materials, the chip needs to be tested before leaving the factory, the most basic test is to test the temperature of the chip during working, and whether the chip is abnormal or not can be judged through the temperature test.
The prior art generally clamps the semiconductor chip through the fixture to ensure the stability of the chip testing process, but in the process of testing the temperature, the temperature measurement structure is required to be stuck to the top of the chip to measure the temperature, and the thicknesses of different chips are different, so that the heights of the top of the chip are different when the chip is placed on the clamping table, the falling distance of the temperature measurement structure is inconvenient to control due to manual operation in the chip testing process, the chip is easily damaged due to overlarge contact force between the temperature measurement structure and the chip, and the testing efficiency is influenced when the temperature measurement structure is stuck to the chip slowly every time, so that certain defects exist.
Disclosure of Invention
(one) solving the technical problems
In order to overcome the defects in the prior art, the invention provides a semiconductor chip testing device for an integrated circuit, which solves the problems in the prior art.
(II) technical scheme
In order to achieve the above purpose, the invention is realized by the following technical scheme: the utility model provides a semiconductor chip testing arrangement for integrated circuit, includes test platform, test slot has been seted up at test platform's top, temperature measuring mechanism is installed at test platform's top, temperature measuring mechanism includes heat conduction metal sheet, thermoscope and rotation control pole, the heat conduction metal sheet is located test slot top, and the heat conduction metal sheet slope upper surface is fixed with the temperature measurement end of thermoscope, and the heat conduction metal sheet can be with the temperature measurement end of chip conduction to the thermoscope to realize the temperature test in the chip working process, rotation control pole one end is articulated to be installed on the base, and base fixed mounting has seted up the movable slot at test platform top, and movable slot internally sliding has the movable rod, the one end that the movable slot was kept away from to the movable rod is fixed with the heat conduction metal sheet slope upper surface, the one end that the movable rod is close to the movable slot is fixed with one end of spring, and one other end of spring is fixed inside the movable slot, and the setting up of spring makes between heat conduction metal sheet and the rotation control pole can realize elasticity flexible effect, prevents that the pressure of heat conduction metal sheet to the chip from too big to lead to the chip to damaging.
Preferably, in order to prevent the heat conduction metal plate from pressing the rotation of rotation control lever behind the chip top and leading to the heat conduction metal plate to produce the removal, movable lever and movable groove are the arc setting, and the centre of a circle in movable lever and movable groove is located rotation control lever and base articulated junction.
Preferably, in order to realize the centre gripping effect in four corners of chip, thereby prevent that the chip from producing the removal by the heat conduction metal sheet after pushing down, and carry out the centre gripping simultaneously to the chip four corners and can prevent that the chip atress is uneven to lead to the chip to produce the activity, thereby further improve the stability of chip, test slot four corners top all is provided with supplementary grip block, supplementary grip block is connected with control mechanism, control mechanism includes slave piston, gas circulation storehouse, gas storage storehouse and initiative piston, slave piston one end is fixed with supplementary grip block, the other end and gas circulation storehouse one end inner wall in close contact with, the gas circulation storehouse other end communicates through connecting pipe and gas storage storehouse inside, and the connecting pipe can be with the inside air input of gas storage storehouse in the gas circulation storehouse, the gas storage storehouse bottom is fixed at the test platform top, initiative piston and gas storage storehouse top inner wall contact, and initiative piston top is connected with the rotation control pole.
Preferably, in order to realize the elastic control of the rotation control rod to the driving piston, the auxiliary clamping block is prevented from clamping the chip due to the air shrinkage pressure in the air storage bin, the inclined lower surface of the rotation control rod is fixed with the top end of the supporting spring, and the bottom end of the supporting spring is fixed at the top of the driving piston.
Preferably, in order to play the effect of slowing down to the downmovement of initiative piston, avoid initiative piston downmovement speed too fast to lead to auxiliary clamping block and chip collision and then lead to the chip to damage, the inside of gas storage storehouse is provided with increases and hinders speed reduction mechanism, increase and hinder speed reduction mechanism and include articulated link plate, slip cap, friction scraper blade and rubber friction bag, articulated link plate top is articulated to be installed in initiative piston bottom, articulated link plate bottom is articulated to be installed at slip cap top, and articulated link plate is the slope form setting, the slip cap activity cup joints at the fixed axle surface, the fixed axle is fixed inside the gas storage storehouse, the friction scraper blade is fixed in slip cap bottom, the rubber friction bag is equipped with a plurality ofly, and a plurality of rubber friction bags all are located one side that the friction scraper blade kept away from gas storage storehouse center department, friction scraper blade in-movement process can contact friction and extrusion rubber friction bag, friction force and the elastic support power of rubber friction bag can play the effect to the friction scraper blade.
Preferably, in order to realize that the friction scraper moves fast, the rubber friction bag blocks the movement of the friction scraper, so that the friction scraper is prevented from moving too fast, the rubber friction bag is hollow and is filled with non-Newtonian fluid, the rubber friction bag is fixed in the gas storage bin, a gap is arranged between the bottom of the rubber friction bag and the bottom of the inner wall of the gas storage bin, and the bottom of the friction scraper is arc-shaped.
Preferably, in order to utilize supplementary grip block to play the centre gripping effect to the chip top to prevent that the chip from producing the removal of vertical direction, supplementary grip block inboard is right angle form and is provided with supplementary stabilizing mean, supplementary stabilizing mean includes elastic brace, slider, connecting rope and lower layering, elastic brace both ends are fixed with two sliders respectively, can avoid supplementary grip block and chip direct contact to lead to the damage of chip corner after elastic brace and the chip contact, slider slidable mounting is inboard at supplementary grip block, connecting rope bottom and top are fixed with slider and lower layering respectively, lower layering is up and down to slidable mounting at supplementary grip block inboard.
Preferably, in order to realize the reset effect of slider, be equipped with the spring two between slider and the auxiliary clamp block inboard, the spring is located the spout between slider and the auxiliary clamp block, connecting rope one side and guiding axle contact, the guiding axle can be to connecting rope's conduction direction change, the guiding axle is fixed in the auxiliary clamp block inboard, be equipped with the spring three between lower layering and the auxiliary clamp block inboard, the spring three is located the spout between lower layering and the auxiliary clamp block, and lower layering bottom is the soft material of elasticity.
(III) beneficial effects
The invention provides a semiconductor chip testing device for an integrated circuit. The beneficial effects are as follows:
(1) According to the semiconductor chip testing device for the integrated circuit, the temperature in the working process of the chip can be tested by arranging the testing platform, the testing slot, the heat conducting metal plate, the temperature detector and the rotating control rod, so that whether the chip is in a normal state or not is tested, meanwhile, the movable rod and the spring I are arranged, so that the heat conducting metal plate and the rotating control rod are in elastic soft connection, the chip damage caused by overlarge interference force between the heat conducting metal plate and the top of the chip is prevented, and the service life of the chip is further ensured when chips with different thicknesses are tested; and because the chip is not required to be clamped, the tester does not need to precisely control the hand force, and the chip cannot be damaged as long as the force is not too large, so that the testing efficiency can be improved.
(2) This a semiconductor chip testing arrangement for integrated circuit through setting up supplementary grip block, slave piston, gas circulation storehouse, connecting pipe, gas storage storehouse and initiative piston can utilize the rotation of rotation control lever to realize the centre gripping effect to chip four corners department simultaneously, not only can improve the stability of chip, can also avoid the chip centre gripping department atress uneven to lead to the chip to at the inside skew of test slot and damage, set up supporting spring simultaneously and can prevent that the inside air of gas storage storehouse from receiving the too big pressure when extrudeing from leading to supplementary grip block to press from both sides the chip bad.
(3) According to the semiconductor chip testing device for the integrated circuit, the hinging plate, the sliding sleeve, the friction scraping plate and the rubber friction bag are arranged, so that the downward moving speed of the driving piston can be slowed down, meanwhile, the non-Newtonian fluid in the rubber friction bag can be instantly solidified when the friction scraping plate rapidly extrudes the rubber friction bag, the direct blocking effect on the movement of the friction scraping plate is achieved, and the damage to the chip caused by the excessively rapid movement of the follow-up auxiliary clamping block is prevented.
(4) This a semiconductor chip testing arrangement for integrated circuit through setting up elastic brace, slider, connecting rope, lower layering and guiding axle can realize improving the spacing effect at chip top when supplementary grip block is to chip four corners centre gripping, prevents that the chip from producing the removal of vertical direction to further improve the stability of chip, the elasticity setting of elastic brace can avoid supplementary grip block to press from both sides the chip simultaneously and hinder.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present invention;
FIG. 2 is a schematic diagram of a control mechanism according to the present invention;
FIG. 3 is a partial cross-sectional view of a gas flow cartridge of the present invention;
FIG. 4 is a partial cross-sectional view of a gas storage cartridge of the present invention;
FIG. 5 is a schematic view of the auxiliary clamping block according to the present invention;
FIG. 6 is a semi-sectional view of a rubber friction bladder according to the present invention.
In the figure: 1. a test platform; 11. testing the slot; 2. a temperature measuring mechanism; 21. a heat conductive metal plate; 211. a movable rod; 22. a temperature measurer; 23. rotating the control rod; 231. a support spring; 3. an auxiliary clamping block; 4. a control mechanism; 41. a slave piston; 42. a gas circulation bin; 421. a connecting pipe; 43. a gas storage bin; 44. a driving piston; 5. resistance increasing and speed reducing mechanism; 51. hinging the connecting plates; 52. a sliding sleeve; 53. a friction scraper; 54. a rubber friction bag; 6. a fixed shaft; 7. an auxiliary stabilizing mechanism; 71. an elastic brace; 72. a slide block; 73. a connecting rope; 74. a lower pressing bar; 8. and a guide shaft.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1-6, the present invention provides a technical solution: the utility model provides a semiconductor chip testing arrangement for integrated circuit, including test platform 1, test slot 11 has been seted up at test platform 1's top, temperature measuring mechanism 2 is installed at test platform 1's top, temperature measuring mechanism 2 includes heat conduction metal sheet 21, thermoscope 22 and rotation control lever 23, heat conduction metal sheet 21 is located test slot 11 top, and heat conduction metal sheet 21 slope upper surface is fixed with thermoscope 22's temperature measurement end, heat conduction metal sheet 21 can conduct the temperature of chip to thermoscope 22's temperature measurement end, thereby realize the temperature test in the chip working process, rotation control lever 23 one end is articulated to be installed on the base, base fixed mounting is at test platform 1 top, the movable slot has been seted up to the other end side, movable slot internally sliding mounting has movable lever 211, the one end of movable lever 211 keeping away from the movable slot is fixed with heat conduction metal sheet 21 slope upper surface, movable lever 211 is close to one end and spring one end of movable slot are fixed, spring one other end is fixed in the movable slot, the setting up of spring one makes between heat conduction metal sheet 21 and the rotation control lever 23 can realize flexible effect, prevent that metal sheet 21 from damaging the chip to the pressure of chip excessively.
In this embodiment, in order to prevent the heat conductive metal plate 21 from moving due to the rotation of the rotation control lever 23 after the heat conductive metal plate 21 is pressed on the top of the chip, the movable lever 211 and the movable slot are both arc-shaped, and the circle centers of the movable lever 211 and the movable slot are located at the hinge connection position of the rotation control lever 23 and the base.
In this embodiment, in order to realize the centre gripping effect in four corners of chip, thereby prevent that the chip from producing the removal by heat conduction metal sheet 21 after pushing down, and carry out the centre gripping simultaneously to the chip four corners and can prevent that the chip atress is uneven and lead to the chip to produce the activity, thereby further improve the stability of chip, test slot 11 four corners top all is provided with supplementary grip block 3, supplementary grip block 3 is connected with control mechanism 4, control mechanism 4 includes slave piston 41, gas circulation storehouse 42, gas storage storehouse 43 and initiative piston 44, slave piston 41 one end is fixed with supplementary grip block 3, the other end and gas circulation storehouse 42 one end inner wall in close contact, the gas circulation storehouse 42 other end communicates with the gas storage storehouse 43 inside through connecting pipe 421, connecting pipe 421 can be with the inside air input of gas storage storehouse 43 in gas circulation storehouse 42, gas storage storehouse 43 bottom is fixed at test platform 1 top, initiative piston 44 contacts with gas storage storehouse 43 top inner wall, and initiative piston 44 top is connected with rotation control lever 23.
In this embodiment, in order to realize the elastic control of the rotation control rod 23 on the driving piston 44, the auxiliary clamping block 3 is prevented from clamping the chip due to the air shrinkage pressure in the air storage bin 43, the inclined lower surface of the rotation control rod 23 is fixed with the top end of the supporting spring 231, and the bottom end of the supporting spring 231 is fixed at the top of the driving piston 44.
In this embodiment, in order to play the effect of slowing down the downward movement of the driving piston 44, avoid the auxiliary clamping block 3 to collide with the chip and further damage the chip caused by the too fast downward movement speed of the driving piston 44, the inside of the gas storage bin 43 is provided with a resistance increasing and speed reducing mechanism 5, the resistance increasing and speed reducing mechanism 5 comprises a hinged connection plate 51, a sliding sleeve 52, a friction scraping plate 53 and a rubber friction bag 54, the top end of the hinged connection plate 51 is hinged to the bottom of the driving piston 44, the bottom of the hinged connection plate 51 is hinged to the top of the sliding sleeve 52, the hinged connection plate 51 is in an inclined arrangement, the sliding sleeve 52 is movably sleeved on the surface of the fixed shaft 6, the fixed shaft 6 is fixed inside the gas storage bin 43, the friction scraping plate 53 is fixed at the bottom of the sliding sleeve 52, the rubber friction bag 54 is provided with a plurality of rubber friction bags 54, and the rubber friction bags 54 are all located at one side of the center of the friction scraping plate 53 away from the gas storage bin 43, the friction scraping plate 53 can contact with the rubber friction bag 54 and squeeze the rubber friction bag 54 in the moving process, and the friction force and the elastic supporting force of the rubber friction bag 54 can play a role of slowing down the friction scraping plate 53.
In this embodiment, in order to prevent the movement of the friction scraper 53 by the rubber friction bag 54 when the friction scraper 53 moves rapidly, the friction scraper 53 is prevented from moving too rapidly, the rubber friction bag 54 is hollow, the rubber friction bag 54 is filled with a non-newton fluid, the rubber friction bag 54 is fixed in the air storage bin 43, a gap is formed between the bottom of the rubber friction bag 54 and the bottom of the inner wall of the air storage bin 43, and the bottom of the friction scraper 53 is arc-shaped.
In this embodiment, in order to utilize auxiliary clamp block 3 to play the centre gripping effect to the chip top to prevent that the chip from producing the removal of vertical direction, auxiliary clamp block 3 inboard is right angle form and is provided with auxiliary stabilization mechanism 7, auxiliary stabilization mechanism 7 includes elastic brace 71, slider 72, connecting rope 73 and lower layering 74, elastic brace 71 both ends are fixed with two sliders 72 respectively, can avoid auxiliary clamp block 3 and chip direct contact to lead to the chip corner damage after elastic brace 71 contacts with the chip, slider 72 slidable mounting is inboard at auxiliary clamp block 3, connecting rope 73 bottom and top are fixed with slider 72 and lower layering 74 respectively, lower layering 74 up-down slidable mounting is inboard at auxiliary clamp block 3.
In this embodiment, in order to achieve the resetting effect of the slider 72, a second spring is disposed between the slider 72 and the inner side of the auxiliary clamping block 3, the second spring is disposed in a chute between the slider 72 and the auxiliary clamping block 3, one side of the connecting rope 73 contacts with the guide shaft 8, the guide shaft 8 can change the conduction direction of the connecting rope 73, the guide shaft 8 is fixed on the inner side of the auxiliary clamping block 3, a third spring is disposed between the lower pressing bar 74 and the inner side of the auxiliary clamping block 3, the third spring is disposed in a chute between the lower pressing bar 74 and the auxiliary clamping block 3, and the bottom of the lower pressing bar 74 is made of elastic soft material.
In the specific implementation process, the working principle of the embodiment is as follows: placing the chip into the test slot 11, manually rotating the rotation control rod 23, and driving the heat conduction metal plate 21 to descend by the rotation control rod 23 through the first spring and the movable rod 211 until the heat conduction metal plate 21 contacts with the chip, electrifying the test platform 1 at the moment, directly conducting the heat generated by the chip onto the heat conduction metal plate 21, and knowing the heat generation effect of the chip through the temperature measured by the temperature measuring end of the temperature measuring device 22 at the moment, so as to judge whether the chip is normal or not; in the rotation process of the rotation control rod 23, the heat conduction metal plate 21 is directly contacted with the chip, and in the subsequent rotation process of the rotation control rod 23, the movable rod 211 presses the first spring, so that the heat conduction metal plate 21 and the temperature detector 22 cannot move, and the chip is prevented from being crushed by the heat conduction metal plate 21 due to excessive displacement of the rotation control rod 23;
the supporting spring 231 is extruded in the rotating process of the rotating control rod 23, a part of force applied to the supporting spring 231 can enable the supporting spring 231 to generate certain deformation, the other part of force can be conducted to the top of the driving piston 44 and push the driving piston 44 to descend, air in the air storage bin 43 is extruded by the driving piston 44 and then enters the air circulation bin 42 through the connecting pipe 421, the air pressure of the air circulation bin 42 is increased and the driven piston 41 is enabled to move towards the outside of the air circulation bin 42, at the moment, the driven piston 41 drives the auxiliary clamping blocks 3 to move towards a chip, and the four auxiliary clamping blocks 3 clamp four corners of the chip, so that the stability of the chip during testing is improved; meanwhile, the top end of the hinged connection plate 51 is pushed to move downwards in the process of moving downwards the driving piston 44, because the hinged connection plate 51 is in an inclined state, the top end of the hinged connection plate 51 rotates at the bottom of the driving piston 44, the bottom end of the hinged connection plate 51 rotates on the sliding sleeve 52, meanwhile, the inclined angle of the hinged connection plate 51 is gradually reduced, the bottom end of the hinged connection plate 51 drives the sliding sleeve 52 to move, the sliding sleeve 52 drives the friction scraper 53 to move and the friction scraper 53 is in friction contact with the top of the rubber friction bag 54, the friction energy consumption effect between the friction scraper 53 and the rubber friction bag 54 can reduce the moving speed of the driving piston 44, and meanwhile, when the driving piston 44 drives the sliding sleeve 52 and the friction scraper 53 to move fast through the hinged connection plate 51, the impact force of the friction scraper 53 to the rubber friction bag 54 is fast, therefore, the non-Newtonian fluid inside the rubber friction bag 54 is instantaneously solidified and the movement of the friction scraper 53 is blocked, and the movement of the driving piston 44 is further blocked, and the chip is prevented from being clamped due to the fact that the auxiliary clamping block 3 impacts the chip is prevented;
when the auxiliary clamping block 3 moves towards the chip, four corners of the chip are contacted with the elastic braces 71 and push the elastic braces 71 to deform, two sliding blocks 72 are pulled to slide in the deformation process of the elastic braces 71, one end of a connecting rope 73 is pulled to move in the sliding process of the sliding blocks 72, the connecting rope 73 can be in an L-shaped state after passing through the guide shaft 8, the top end of the connecting rope 73 downwards pulls the lower pressing strip 74, so that the lower pressing strip 74 is contacted with the top of the chip, the vertical direction of the chip is limited, and the chip is prevented from moving in the vertical direction.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. The utility model provides a semiconductor chip testing arrangement for integrated circuit, includes test platform (1), test slot (11) have been seted up at the top of test platform (1), its characterized in that: temperature measuring mechanism (2) are installed at the top of test platform (1), temperature measuring mechanism (2) are including heat conduction metal sheet (21), thermoscope (22) and rotation control pole (23), heat conduction metal sheet (21) are located test slot (11) top, and heat conduction metal sheet (21) slope upper surface is fixed with the temperature measurement end of thermoscope (22), rotation control pole (23) one end is articulated to be installed on the base, base fixed mounting is at test platform (1) top, and the movable groove has been seted up to the other end side, and movable groove internally sliding has movable rod (211), the one end that the movable groove was kept away from to movable rod (211) is fixed with heat conduction metal sheet (21) slope upper surface, one end that movable rod (211) is close to the movable groove is fixed with one end of spring, and one other end of spring is fixed in the movable groove inside.
2. A semiconductor chip testing apparatus for an integrated circuit according to claim 1, wherein: the movable rod (211) and the movable groove are arc-shaped, and the circle centers of the movable rod (211) and the movable groove are positioned at the hinged joint of the rotary control rod (23) and the base.
3. A semiconductor chip testing apparatus for an integrated circuit according to claim 1, wherein: the testing slot (11) four corners top all is provided with supplementary grip block (3), supplementary grip block (3) are connected with control mechanism (4), control mechanism (4) are including slave piston (41), gas circulation storehouse (42), gas storage storehouse (43) and initiative piston (44), slave piston (41) one end is fixed with supplementary grip block (3), the other end and gas circulation storehouse (42) one end inner wall in close contact, gas circulation storehouse (42) other end passes through connecting pipe (421) and the inside intercommunication of gas storage storehouse (43), gas storage storehouse (43) bottom is fixed at testing platform (1) top, initiative piston (44) and gas storage storehouse (43) top inner wall contact, and initiative piston (44) top and rotation control pole (23) are connected.
4. A semiconductor chip testing apparatus for an integrated circuit according to claim 3, wherein: the inclined lower surface of the rotation control rod (23) is fixed with the top end of the supporting spring (231), and the bottom end of the supporting spring (231) is fixed at the top of the driving piston (44).
5. A semiconductor chip testing apparatus for an integrated circuit according to claim 3, wherein: the inside of gas storage storehouse (43) is provided with increases and hinders speed-reducing mechanism (5), increase and hinder speed-reducing mechanism (5) including articulated link plate (51), slip cap (52), friction scraper blade (53) and rubber friction bag (54), articulated link plate (51) top is articulated to be installed in initiative piston (44) bottom, articulated link plate (51) bottom is articulated to be installed at slip cap (52) top, and articulated link plate (51) are the slope form and set up, slip cap (52) activity cup joints at fixed axle (6) surface, fixed axle (6) are fixed inside gas storage storehouse (43), friction scraper blade (53) are fixed in slip cap (52) bottom, rubber friction bag (54) are equipped with a plurality of, and a plurality of rubber friction bags (54) all are located one side that friction scraper blade (53) kept away from gas storage storehouse (43) center department.
6. A semiconductor chip testing apparatus for an integrated circuit according to claim 5, wherein: the rubber friction bag (54) is arranged in a hollow mode, non-Newtonian fluid is filled in the rubber friction bag (54), the rubber friction bag (54) is fixed in the air storage bin (43), a gap is formed between the bottom of the rubber friction bag (54) and the bottom of the inner wall of the air storage bin (43), and the bottom of the friction scraping plate (53) is arranged in an arc mode.
7. A semiconductor chip testing apparatus for an integrated circuit according to claim 3, wherein: the auxiliary clamping block (3) is right-angle-shaped and is provided with an auxiliary stabilizing mechanism (7), the auxiliary stabilizing mechanism (7) comprises an elastic brace (71), a sliding block (72), a connecting rope (73) and a lower pressing strip (74), two ends of the elastic brace (71) are respectively fixed with the two sliding blocks (72), the sliding block (72) is slidably mounted on the inner side of the auxiliary clamping block (3), the bottom end and the top end of the connecting rope (73) are respectively fixed with the sliding block (72) and the lower pressing strip (74), and the lower pressing strip (74) is vertically slidably mounted on the inner side of the auxiliary clamping block (3).
8. A semiconductor chip testing apparatus for an integrated circuit according to claim 7, wherein: the spring II is arranged between the sliding block (72) and the inner side of the auxiliary clamping block (3), one side of the connecting rope (73) is in contact with the guide shaft (8), the guide shaft (8) is fixed on the inner side of the auxiliary clamping block (3), the spring III is arranged between the lower pressing strip (74) and the inner side of the auxiliary clamping block (3), and the bottom of the lower pressing strip (74) is made of elastic soft materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211375583.7A CN116086634A (en) | 2022-11-04 | 2022-11-04 | Semiconductor chip testing device for integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211375583.7A CN116086634A (en) | 2022-11-04 | 2022-11-04 | Semiconductor chip testing device for integrated circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116086634A true CN116086634A (en) | 2023-05-09 |
Family
ID=86205253
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211375583.7A Pending CN116086634A (en) | 2022-11-04 | 2022-11-04 | Semiconductor chip testing device for integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116086634A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116990151A (en) * | 2023-09-28 | 2023-11-03 | 江苏晖恒芯片科技有限责任公司 | Chip tolerance test machine |
-
2022
- 2022-11-04 CN CN202211375583.7A patent/CN116086634A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116990151A (en) * | 2023-09-28 | 2023-11-03 | 江苏晖恒芯片科技有限责任公司 | Chip tolerance test machine |
| CN116990151B (en) * | 2023-09-28 | 2023-12-12 | 江苏晖恒芯片科技有限责任公司 | Chip tolerance test machine |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN116086634A (en) | Semiconductor chip testing device for integrated circuit | |
| CN113933686B (en) | Detection equipment for integrated circuit packaging finished product | |
| CN110823324A (en) | Water meter detection device | |
| CN112394280A (en) | Testing arrangement of power chip production usefulness | |
| CN210411598U (en) | Automatic sorting device based on resistance value detection | |
| CN116359028B (en) | Electronic pressure testing machine | |
| CN113867323A (en) | Motor controller detection device for high-power new energy automobile | |
| CN112577636A (en) | Temperature sensor test fixture | |
| CN215766811U (en) | Device for measuring height of passenger room top plate of urban rail vehicle | |
| CN213181004U (en) | Steel raw material strength detection equipment for bridge construction | |
| CN221238903U (en) | Ultrasonic evaluation device for steel structure detection | |
| CN118092381B (en) | Detection equipment is used in production of electric motor car controller | |
| CN210724966U (en) | Cell-phone screen automated inspection equipment based on computer control | |
| CN210268589U (en) | Soft-packaged electrical core testing device | |
| CN110823805B (en) | Cable surface printing firmness detection equipment | |
| CN215984268U (en) | Utensil is examined to quick fixed car handle seat of being convenient for | |
| CN214585303U (en) | Detection device for detecting mould in food | |
| CN216956266U (en) | Electric shock prevention quick testing device for integrated circuit | |
| CN219201207U (en) | Water pipe check out test set is used in water pipe production | |
| CN216968713U (en) | Screen pressing device | |
| CN221726209U (en) | Operating table for detecting performance of LED lamp | |
| CN221528290U (en) | Quality detection equipment for building engineering materials | |
| CN215117261U (en) | Synchronous detection machine for KSD301 temperature controller | |
| CN211452120U (en) | Flexible detection tool for detecting automobile parts | |
| CN106989910B (en) | Flying wire spring detection device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |