CN116072628A - Heat dissipation cover plate for enhancing chip package reliability, package structure and method - Google Patents
Heat dissipation cover plate for enhancing chip package reliability, package structure and method Download PDFInfo
- Publication number
- CN116072628A CN116072628A CN202211722415.0A CN202211722415A CN116072628A CN 116072628 A CN116072628 A CN 116072628A CN 202211722415 A CN202211722415 A CN 202211722415A CN 116072628 A CN116072628 A CN 116072628A
- Authority
- CN
- China
- Prior art keywords
- chip
- cover plate
- heat dissipation
- cross
- outer frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 60
- 230000002708 enhancing effect Effects 0.000 title claims abstract description 26
- 238000000034 method Methods 0.000 title claims abstract description 9
- 238000004806 packaging method and process Methods 0.000 claims abstract description 24
- 239000005022 packaging material Substances 0.000 claims abstract description 19
- 239000000853 adhesive Substances 0.000 claims abstract description 12
- 230000001070 adhesive effect Effects 0.000 claims abstract description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000007769 metal material Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 abstract description 7
- 238000004026 adhesive bonding Methods 0.000 abstract description 3
- 239000000758 substrate Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3157—Partial encapsulation or coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
Abstract
The invention provides a heat dissipation cover plate, a packaging structure and a method for enhancing the packaging reliability of a chip, wherein the heat dissipation cover plate comprises a hollow outer frame structure; a cross-shaped structure disposed within the outer frame structure; four ends of the cross-shaped structure are respectively connected with the outer frame structure, and four openings are formed. In the packaging structure of the heat dissipation cover plate with the cross structure, the plastic packaging material can play a role in fixing the heat dissipation cover plate, and compared with the traditional adhesive bonding of the adhesive cover plate, the heat dissipation cover plate is firmer. And the periphery of the chip can be covered by plastic packaging materials completely below the heat dissipation cover plate, so that air does not exist, the chip is well protected, and the integral reliability strength of the packaging structure is improved. Meanwhile, the upper part of the heat dissipation cover plate is in direct contact with air, so that the area is large, and the heat dissipation condition is good. And the thermal conductivity of the plastic package material is better than that of air, and compared with the traditional package in which the periphery of the chip is air, the package structure of the invention has more advantages in heat dissipation.
Description
Technical Field
The invention relates to the technical field of chip packaging, in particular to a heat dissipation cover plate for enhancing the reliability of chip packaging, a packaging structure and a method.
Background
The FCBGA (Flip Chip Ball Grid Array ) is a semiconductor package structure having a chip disposed at one side end of a substrate and a ball grid array disposed at the other side end of the substrate, which can mount the FCBGA on a printed circuit board. The heat generated during operation of the chip needs to be dissipated to a fluid medium such as air to ensure that the FCBGA is operating properly.
The conventional FC chip package structure with a heat dissipating cover is shown in fig. 1a, 1b, and 1c, wherein the heat dissipating cover is disposed above the chip, and is usually connected to the back surface of the chip by a TIM (Thermal Interface Material ) heat dissipating adhesive, so as to dissipate heat generated by the operation of the chip into the outside air. Besides the space filled by underfill (filler) between the chip and TIM glue and between the chip and the metal bump (the metal bump for connecting the chip and the substrate), the rest space is air, and no more protection and fixation measures are provided for the chip. The heat dissipation cover and the substrate are adhered through the cover adhesive on the periphery, and the adhesive strength is limited. When encountering large vibration, the heat dissipation cover may be dropped, resulting in package reliability problems.
Disclosure of Invention
The invention aims to provide a heat dissipation cover plate, a packaging structure and a method for enhancing the packaging reliability of a chip, so as to solve the problem of low bonding strength of the traditional FC chip packaging structure with a heat dissipation cover.
The invention provides a heat dissipation cover plate for enhancing the reliability of chip packaging, which comprises the following components:
a hollow outer frame structure;
a cross-shaped structure disposed within the outer frame structure;
four ends of the cross-shaped structure are respectively connected with the outer frame structure, and four openings are formed.
Preferably, the central region of the cruciform structure completely covers the chip.
Preferably, the thickness of the outer frame structure is the same as that of the cross-shaped structure.
Preferably, the outer frame structure is rectangular or circular.
Preferably, the four ends of the cross-shaped structure are welded with the outer frame structure respectively.
Preferably, the outer frame structure and the cross-shaped structure are integrally formed.
Preferably, the outer frame structure and the cross-shaped structure are made of metal materials.
Preferably, the outer frame structure and the cross-shaped structure are copper or aluminum.
The present invention also provides a package structure for enhancing reliability of chip package, comprising:
a plastic packaging material;
a printed circuit board mounted with a chip;
and a heat sink cover plate as claimed in any one of claims 1 to 8;
the heat dissipation cover plate is arranged on the printed circuit board, so that the middle area of the cross structure covers the chip, and the middle area of the cross structure is bonded with the chip through TIM adhesive;
the plastic packaging material is filled in gaps among the chip, the printed circuit board and the heat dissipation cover plate, and four openings of the heat dissipation cover plate.
The invention also provides a packaging method of the packaging structure for enhancing the packaging reliability of the chip, which comprises the following steps:
s1, mounting a chip on a printed circuit board;
s2, placing a heat dissipation cover plate on a printed circuit board, enabling the middle area of the cross structure to cover the chip, and bonding the middle area of the cross structure with the chip through TIM adhesive;
and S3, injecting plastic packaging materials from the four openings of the heat-dissipating cover plate, so that the plastic packaging materials are filled in gaps among the chip, the printed circuit board and the heat-dissipating cover plate and the four openings of the heat-dissipating cover plate.
In summary, due to the adoption of the technical scheme, the beneficial effects of the invention are as follows:
in the packaging structure of the heat dissipation cover plate with the cross structure, the plastic packaging material can play a role in fixing the heat dissipation cover plate, and compared with the traditional adhesive bonding of the adhesive cover plate, the heat dissipation cover plate is firmer. And the periphery of the chip can be covered by plastic packaging materials completely below the heat dissipation cover plate, so that air does not exist, the chip is well protected, and the integral reliability strength of the packaging structure is improved. Meanwhile, the upper part of the heat dissipation cover plate is in direct contact with air, so that the area is large, and the heat dissipation condition is good. And the thermal conductivity of the plastic package material is better than that of air, and compared with the traditional package in which the periphery of the chip is air, the package structure of the invention has more advantages in heat dissipation.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following description will briefly describe the drawings in the embodiments, it being understood that the following drawings only illustrate some embodiments of the present invention and should not be considered as limiting the scope, and that other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1a is a schematic cross-sectional structure of a conventional FC chip package structure with a heat dissipation cap.
Fig. 1b is a schematic top view of a conventional FC chip package structure with a heat dissipation cap.
Fig. 1c is a schematic cross-sectional view of a heat spreader lid in a conventional FC chip package with a heat spreader lid.
Fig. 2 is a schematic perspective view of a heat dissipating cover for enhancing reliability of a chip package according to an embodiment of the present invention.
Fig. 3a is a schematic top view of a rectangular outer frame of a heat dissipating cover for enhancing reliability of chip package according to an embodiment of the present invention.
Fig. 3b is a schematic top view of the heat dissipating cover plate for enhancing the reliability of the chip package according to the embodiment of the present invention when the outer frame structure is circular.
Fig. 4 is a flowchart of a packaging method of a packaging structure for enhancing reliability of chip packaging in an embodiment of the present invention.
Icon: 100-heat dissipation cover plate, 10-outer frame structure, 20-cross structure, 21-middle area, 30-opening.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments of the present invention. The components of the embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the invention, as presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Example 1
As shown in fig. 2, the present embodiment proposes a heat dissipation cover 100 for enhancing the reliability of a chip package, including:
a hollow outer frame structure 10;
and a cross-shaped structure 20 disposed within the outer frame structure 10;
four ends of the cross-shaped structure 20 are respectively connected with the outer frame structure 10, and four openings 30 are formed.
Preferably, the central region of the cruciform structure 20 completely covers the chip. I.e. the area of the cross-shaped structure 20 can be adjusted according to the chip size to adapt to the chip area.
Preferably, the thickness of the outer frame structure 10 is the same as that of the cross-shaped structure 20. The thicknesses of the outer frame structure 10 and the cross-shaped structure 20 can be regulated according to the overall thickness requirement of the packaging structure.
Preferably, the shape of the outer frame structure 10 is adapted to the shape of the printed circuit board, so as to facilitate installation, for example, a rectangle as shown in fig. 3a or a circle as shown in fig. 3b, and correspondingly, the shape of the four end surfaces of the cross-shaped structure 20 should be adapted to the shape of the outer frame structure 10.
Further, the four ends of the cross-shaped structure 20 are welded to the outer frame structure 10, respectively, and in order to enhance the reliability, it is preferable that the outer frame structure 10 and the cross-shaped structure 20 are integrally formed.
Preferably, the outer frame structure 10 and the cross-shaped structure 20 are made of metal materials having good heat dissipation performance, preferably copper or aluminum, for the convenience of heat dissipation.
Four ends of the cross-shaped structure 20 are respectively connected with four openings 30 formed by the outer frame structure 10 for injecting plastic packaging materials, so that the plastic packaging materials are filled in gaps between the chip and the printed circuit board and the heat dissipation cover plate 100 and in the four openings 30 of the heat dissipation cover plate 100. Therefore, in the package structure of the heat dissipation cover plate 100 provided by the embodiment, the plastic package material can play a role in fixing the heat dissipation cover plate 100, and is firmer compared with the traditional adhesive bonding. And the periphery of the chip can be covered by the plastic packaging material under the heat dissipation cover plate 100, so that air does not exist, the chip is well protected, and the integral reliability strength of the packaging structure is improved. Meanwhile, the upper part of the heat dissipation cover plate 100 is in direct contact with air, so that the area is large, and the heat dissipation condition is good. And the thermal conductivity of the plastic package material is better than that of air, compared with the conventional package in which the periphery of the chip is air, the package structure of the heat dissipation cover plate 100 provided by the embodiment also has more advantages in heat dissipation.
Example 2
On the basis of the heat dissipation cover plate 100 for enhancing the reliability of the chip package provided in embodiment 1, this embodiment provides a package structure for enhancing the reliability of the chip package, including:
a plastic packaging material;
a printed circuit board mounted with a chip;
and a heat sink cover plate 100 as described in example 1;
the heat dissipation cover plate 100 is placed on the printed circuit board, so that the middle area 21 of the cross-shaped structure 20 covers the chip, and the middle area 21 of the cross-shaped structure 20 is adhered to the chip through TIM adhesive;
the molding compound fills the gaps between the chip and the printed circuit board and the heat sink cover 100 and the four openings 30 of the heat sink cover 100.
Therefore, in the package structure provided in this embodiment, the plastic package material can play a role of fixing the heat dissipation cover plate 100, and the adhesion is firmer compared with the conventional adhesive. And the periphery of the chip can be covered by the plastic packaging material under the heat dissipation cover plate 100, so that air does not exist, the chip is well protected, and the integral reliability strength of the packaging structure is improved. Meanwhile, the upper part of the heat dissipation cover plate 100 is in direct contact with air, so that the area is large, and the heat dissipation condition is good. And the thermal conductivity of the plastic package material is better than that of air, and compared with the traditional package in which the periphery of the chip is air, the package structure provided by the embodiment has more advantages in heat dissipation.
Example 3
As shown in fig. 4, for the package structure for enhancing the reliability of the chip package provided in embodiment 2, the present embodiment provides a corresponding packaging method, which includes the following steps:
s1, mounting a chip on a printed circuit board; specifically, a chip is placed on a printed circuit board and is electrically connected with the printed circuit board through metal bumps on the functional surface of the chip;
s2, placing the heat dissipation cover plate 100 on a printed circuit board, enabling the middle area 21 of the cross-shaped structure 20 to cover the chip, and bonding the middle area 21 of the cross-shaped structure 20 with the chip through TIM (TIM adhesive);
and S3, injecting plastic packaging materials from the four openings 30 of the heat dissipation cover plate 100, so that the plastic packaging materials are filled in gaps between the chip and the printed circuit board and the heat dissipation cover plate 100 and in the four openings 30 of the heat dissipation cover plate 100.
The above description is only of the preferred embodiments of the present invention and is not intended to limit the present invention, but various modifications and variations can be made to the present invention by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A heat sink cover plate for enhancing chip package reliability, comprising:
a hollow outer frame structure (10);
and a cross-shaped structure (20) disposed within the outer frame structure (10);
four ends of the cross-shaped structure (20) are respectively connected with the outer frame structure (10) and form four openings (30).
2. The heat spreading cover plate for enhancing reliability of a chip package according to claim 1, wherein a central area of the cross-shaped structure (20) completely covers the chip.
3. The heat sink cover for enhancing reliability of chip package according to claim 1, wherein the thickness of the outer frame structure (10) is the same as the thickness of the cross-shaped structure (20).
4. The heat sink cover for enhancing reliability of chip package according to claim 1, wherein the outer frame structure (10) is rectangular or circular.
5. The heat sink cover plate for enhancing reliability of chip package according to claim 1, wherein four ends of the cross-shaped structure (20) are welded with the outer frame structure (10), respectively.
6. The heat sink cover for enhancing reliability of chip package according to claim 1, wherein the outer frame structure (10) is integrally formed with the cross-shaped structure (20).
7. The heat sink cover for enhancing reliability of chip package according to claim 1, wherein the outer frame structure (10) and the cross-shaped structure (20) are of a metallic material.
8. The heat spreader lid for enhancing reliability of chip packages according to claim 7, wherein the outer frame structure (10) and the cross-shaped structure (20) are copper or aluminum.
9. A package structure for enhancing reliability of a chip package, comprising:
a plastic packaging material;
a printed circuit board mounted with a chip;
and a heat sink cover plate (100) according to any of claims 1-8;
the heat dissipation cover plate (100) is arranged on the printed circuit board, so that the middle area (21) of the cross-shaped structure (20) covers the chip, and the middle area (21) of the cross-shaped structure (20) is adhered with the chip through TIM adhesive;
the plastic packaging material fills gaps between the chip and the printed circuit board and the heat dissipation cover plate (100), and four openings (30) of the heat dissipation cover plate (100).
10. A packaging method of the package structure for enhancing reliability of chip package according to claim 9, comprising the steps of:
s1, mounting a chip on a printed circuit board;
s2, placing the heat dissipation cover plate (100) on a printed circuit board, enabling the middle area (21) of the cross-shaped structure (20) to cover the chip, and bonding the middle area (21) of the cross-shaped structure (20) with the chip through TIM (TIM) adhesive;
s3, injecting plastic packaging materials from four openings (30) of the heat dissipation cover plate (100), so that the plastic packaging materials are filled in gaps between the chip and the printed circuit board and the heat dissipation cover plate (100) and in the four openings (30) of the heat dissipation cover plate (100).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211722415.0A CN116072628A (en) | 2022-12-30 | 2022-12-30 | Heat dissipation cover plate for enhancing chip package reliability, package structure and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211722415.0A CN116072628A (en) | 2022-12-30 | 2022-12-30 | Heat dissipation cover plate for enhancing chip package reliability, package structure and method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116072628A true CN116072628A (en) | 2023-05-05 |
Family
ID=86176176
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211722415.0A Pending CN116072628A (en) | 2022-12-30 | 2022-12-30 | Heat dissipation cover plate for enhancing chip package reliability, package structure and method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116072628A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3043324B1 (en) * | 1998-12-15 | 2000-05-22 | 三菱マテリアル株式会社 | Wafer unloading apparatus and wafer manufacturing method |
| US20040188829A1 (en) * | 2003-03-31 | 2004-09-30 | Intel Corporation | Package with integrated wick layer and method for heat removal |
| CN102479499A (en) * | 2010-11-30 | 2012-05-30 | 英业达股份有限公司 | Electronic device and method for automatically adjusting and displaying color temperature |
| CN103681543A (en) * | 2012-09-14 | 2014-03-26 | 飞思卡尔半导体公司 | Matrix lid heatspreader for flip chip package |
| US20150035134A1 (en) * | 2013-08-02 | 2015-02-05 | Taiwan Semiconductor Manufacturing Company, Ltd. | 3dic packages with heat dissipation structures |
| CN114883276A (en) * | 2022-05-17 | 2022-08-09 | 无锡昌德微电子股份有限公司 | Silicon chip structure with strong impact resistance |
-
2022
- 2022-12-30 CN CN202211722415.0A patent/CN116072628A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3043324B1 (en) * | 1998-12-15 | 2000-05-22 | 三菱マテリアル株式会社 | Wafer unloading apparatus and wafer manufacturing method |
| US20040188829A1 (en) * | 2003-03-31 | 2004-09-30 | Intel Corporation | Package with integrated wick layer and method for heat removal |
| CN102479499A (en) * | 2010-11-30 | 2012-05-30 | 英业达股份有限公司 | Electronic device and method for automatically adjusting and displaying color temperature |
| CN103681543A (en) * | 2012-09-14 | 2014-03-26 | 飞思卡尔半导体公司 | Matrix lid heatspreader for flip chip package |
| US20150035134A1 (en) * | 2013-08-02 | 2015-02-05 | Taiwan Semiconductor Manufacturing Company, Ltd. | 3dic packages with heat dissipation structures |
| CN114883276A (en) * | 2022-05-17 | 2022-08-09 | 无锡昌德微电子股份有限公司 | Silicon chip structure with strong impact resistance |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10204848B2 (en) | Semiconductor chip package having heat dissipating structure | |
| US6188578B1 (en) | Integrated circuit package with multiple heat dissipation paths | |
| US6952050B2 (en) | Semiconductor package | |
| US6081037A (en) | Semiconductor component having a semiconductor chip mounted to a chip mount | |
| US6882041B1 (en) | Thermally enhanced metal capped BGA package | |
| TWI434379B (en) | Microelectronic packaging and fabrications thereof | |
| TWI529878B (en) | Hybrid thermal interface material for ic packages with integrated heat spreader | |
| US7339278B2 (en) | Cavity chip package | |
| EP1524690B1 (en) | Semiconductor package with heat spreader | |
| US6724080B1 (en) | Heat sink with elevated heat spreader lid | |
| US7361986B2 (en) | Heat stud for stacked chip package | |
| US6429513B1 (en) | Active heat sink for cooling a semiconductor chip | |
| US20040095727A1 (en) | Thermal heat spreaders designed for lower cost manufacturability, lower mass and increased thermal performance | |
| US20070205495A1 (en) | Electronic Component With Stacked Semiconductor Chips And Heat Dissipating Means | |
| US20050199998A1 (en) | Semiconductor package with heat sink and method for fabricating the same and stiffener | |
| JP3367554B2 (en) | Flip chip package | |
| US7388286B2 (en) | Semiconductor package having enhanced heat dissipation and method of fabricating the same | |
| US6239486B1 (en) | Semiconductor device having cap | |
| US11749631B2 (en) | Electronic package including a hybrid thermal interface material and low temperature solder patterns to improve package warpage and reliability | |
| US20060273467A1 (en) | Flip chip package and method of conducting heat therefrom | |
| JP2002190560A (en) | Semiconductor device | |
| CN113394178A (en) | Electronic package and manufacturing method thereof | |
| CN116072628A (en) | Heat dissipation cover plate for enhancing chip package reliability, package structure and method | |
| CN115249664A (en) | Elastic heat dissipation cover plate for chip packaging, packaging structure and packaging method | |
| JPH0917827A (en) | Semiconductor device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |