CN116072498A - 等离子体处理方法和等离子体处理装置 - Google Patents

等离子体处理方法和等离子体处理装置 Download PDF

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Publication number
CN116072498A
CN116072498A CN202211285523.6A CN202211285523A CN116072498A CN 116072498 A CN116072498 A CN 116072498A CN 202211285523 A CN202211285523 A CN 202211285523A CN 116072498 A CN116072498 A CN 116072498A
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CN
China
Prior art keywords
processing
plasma
control
ignition
plasma processing
Prior art date
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Pending
Application number
CN202211285523.6A
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English (en)
Chinese (zh)
Inventor
植松治志
富田尚宏
齐藤均
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Tokyo Electron Ltd
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Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of CN116072498A publication Critical patent/CN116072498A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/32174—Circuits specially adapted for controlling the RF discharge
    • H01J37/32183—Matching circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32816—Pressure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
    • H01J37/3211—Antennas, e.g. particular shapes of coils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/332—Coating
    • H01J2237/3321—CVD [Chemical Vapor Deposition]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/334—Etching

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
CN202211285523.6A 2021-10-29 2022-10-20 等离子体处理方法和等离子体处理装置 Pending CN116072498A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-178304 2021-10-29
JP2021178304A JP2023067238A (ja) 2021-10-29 2021-10-29 プラズマ処理方法及びプラズマ処理装置

Publications (1)

Publication Number Publication Date
CN116072498A true CN116072498A (zh) 2023-05-05

Family

ID=86180931

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202211285523.6A Pending CN116072498A (zh) 2021-10-29 2022-10-20 等离子体处理方法和等离子体处理装置

Country Status (4)

Country Link
JP (1) JP2023067238A (ja)
KR (1) KR20230062379A (ja)
CN (1) CN116072498A (ja)
TW (1) TW202335029A (ja)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5375118B2 (ja) 2009-01-19 2013-12-25 東京エレクトロン株式会社 レシピの作成装置、この作成方法、処理装置、このメンテナンス方法、処理装置のインターロックシステム及びこのインターロック方法

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Publication number Publication date
TW202335029A (zh) 2023-09-01
KR20230062379A (ko) 2023-05-09
JP2023067238A (ja) 2023-05-16

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