CN116062999A

CN116062999A - Glass powder combination and preparation method thereof, electronic paste and battery

Info

Publication number: CN116062999A
Application number: CN202211600740.XA
Authority: CN
Inventors: 郭豫阳; 王登; 丁冰冰; 王胜
Original assignee: Guangzhou Ruxing Technology Development Co ltd
Current assignee: Guangzhou Ruxing Technology Development Co ltd; WUXI RUXING TECHNOLOGY DEVELOPMENT CO LTD
Priority date: 2022-12-12
Filing date: 2022-12-12
Publication date: 2023-05-05

Abstract

The invention relates to the field of photoelectric materials, in particular to a glass powder combination and a preparation method thereof, electronic paste and a battery. The invention develops a combination of two different glass powder systems, namely a high tellurium glass powder system T, which has a wider contact window and can ensure that the slurry has better contact performance when being applied to batteries with different passivation structures; the high silicon glass powder system G has lower corrosion level, and can ensure that the slurry can not cause excessive corrosion to the silicon wafer under the condition that the passivation film is thinner when the slurry is applied. In addition, the manufacturing process of the glass powder is adjusted, so that the grid line falling problem does not occur after the glass powder is dried when the optimized glass powder is applied to the slurry, and the attractiveness and stability of the battery piece are greatly improved.

Description

Glass powder combination and preparation method thereof, electronic paste and battery

Technical Field

The invention relates to the field of photoelectric materials, in particular to a glass powder combination and a preparation method thereof, electronic paste and a battery.

Background

Since 2022, the national photovoltaic installation of 1-5 months in this year accumulates 23.71GW, which is increased by 139.25%, the sum of the installation of 1-8 months in 2021 is exceeded (22.05 GW), and the requirement of improving efficiency and reducing cost of the solar battery is never stopped while the photovoltaic installation quantity is continuously increased. At present, the battery produced by the main flow is a PERC battery, but the mass production efficiency is approximate to the theoretical mass production efficiency, the space for improving efficiency and reducing cost is limited, and a plurality of high-efficiency crystalline silicon batteries such as a TOPCO battery, a HJT battery, an IBC battery, a perovskite battery and the like are developed in the process, wherein the TOPCO battery and the IBC battery are subjected to metallization by using high-temperature silver paste, and the HJT battery is subjected to metallization by using low-temperature silver paste.

The improvement of the efficiency of TOPCon batteries, IBC batteries and the current mainstream PERC batteries depends on the optimization of front surface and back surface passivation technologies to a great extent, in recent years, when an aluminum oxide passivation film grown by an atomic layer deposition technology is proved to be a better passivation material, compared with common passivation materials such as silicon oxide, silicon nitride, silicon oxynitride and the like, the concentration of fixed negative charges in the aluminum oxide film can reach higher concentration, so that a very good field effect passivation effect can be provided, the metal composite J0 and metal are reduced, the efficiency is improved, but the difficulty is brought to slurry contact while the passivation effect is good, the metalized slurry needs to have better contact performance, and the burning through caused by overlarge corrosion performance is prevented, and the efficiency is reduced.

The main flow slurry is mainly suitable for passivation structures such as common silicon oxide and silicon nitride, and when an alumina passivation structure is adopted, serious EL cloud and fog can appear, the efficiency is low, and the stability is poor. Conventional slurry is printed, powder is scraped off in the drying process, so that a large number of EL broken grids appear after sintering, and the efficiency and the attractiveness are affected. Therefore, it is imperative to develop a metallization paste suitable for use in aluminum oxide passivation structures.

Disclosure of Invention

In view of the above, the invention provides a glass powder combination and a preparation method thereof, electronic paste and a battery.

In order to achieve the above object, the present invention provides the following technical solutions:

in a first aspect, the present invention provides a glass frit combination comprising a glass frit system T and a glass frit system G;

the oxides of the glass frit system T include: tellurium oxide and lead oxide;

the oxide of the glass frit system G includes: silicon oxide and tungsten oxide;

the mass ratio of the glass powder system T to the glass powder system G is (1.5-4): 1.

preferably, the oxide of the glass frit system T includes, in parts by mass: 30-50 parts of tellurium oxide and 30-45 parts of lead oxide;

the oxide of the glass powder system G comprises the following components in parts by mass: 10-30 parts of silicon oxide and 8-15 parts of tungsten oxide.

Preferably, the glass frit system T comprises: bismuth oxide, tungsten oxide, tellurium oxide, lead oxide, and alkali metal oxide;

the glass frit system G includes: bismuth oxide, tungsten oxide, tellurium oxide, lead oxide, silicon oxide, alkaline earth metal oxide, and boron oxide.

Preferably, a glass frit system T and a glass frit system G are included;

the oxide of the glass powder system T comprises the following components in parts by mass:

the oxide of the glass powder system G comprises the following components in parts by mass:

preferably, in the glass frit system T, the mass ratio of tellurium oxide to lead oxide comprises 40:25.

Preferably, in the oxide of the glass frit system T, the mass ratio of the bismuth oxide, the tungsten oxide, the tellurium oxide, the lead oxide to the alkali metal oxide is 18:7:40:25:10.

preferably, in the glass frit system G, the mass ratio of the silicon oxide to the tungsten oxide comprises 20:10.

Preferably, in the oxide of the glass frit system G, the mass ratio of the bismuth oxide, the tungsten oxide, the tellurium oxide, the lead oxide, the silicon oxide, the alkaline earth metal oxide to the boron oxide is 20:10:15:25:20:4:6.

preferably, the mass ratio of the glass frit system T to the glass frit system G is 70:30.

In a second aspect, the present invention also provides a method for preparing a glass frit composition comprising any one of the above-described glass frit compositions, comprising: and mixing, smelting and drying the raw materials of the glass powder system T and the glass powder system G, and respectively carrying out water grinding, air flow grinding, drying and crushing to obtain the glass powder combination.

Preferably, the water mill adopts four zirconium balls, wherein the mass ratio of the round zirconium balls with the diameter of 7mm to the cylindrical zirconium balls with the diameter of 5mm is 2:2:1:1;

preferably, the grinding air pressure of the jet mill is 0.65Mpa, and the rotating speed of the classifying wheel is 100Hz.

In a third aspect, the invention also provides the use of a glass frit combination comprising any one of the above, or a glass frit combination prepared by a preparation method as described in any one of the above, in the preparation of an electronic paste or a battery.

In a fourth aspect, the present invention also provides an electronic paste comprising the glass frit combination as described above, or the glass frit combination produced by the production method as described above, and silver powder and an organic binder.

Preferably, the composition comprises the following components in parts by mass:

75-92 parts of silver powder

6-14 parts of organic adhesive.

Preferably, the silver powder comprises one or more of spheroidic and microcrystalline powder, and the average particle size of the silver powder is 1.0-3.0 μm.

Preferably, the organic binder comprises a solvent, a thickener, a plasticizer or a composition of one or more of the two.

Preferably, the solvent comprises one or more of DOP, DBE, terpineol, butyl carbitol acetate, benzyl alcohol, ethylene glycol monomethyl ether or diethylene glycol diethyl ether.

Preferably, the thickener comprises one or more of ethyl cellulose, cellulose acetate, solid acrylic resin or ABS resin.

Preferably, the preparation method of the organic binder comprises the following steps: mixing the raw materials, stirring and melting at 70-100 ℃ to obtain the uniform organic adhesive.

Preferably, the preparation method of the electronic paste comprises the following steps: mixing the silver powder, the glass powder and the organic adhesive in proportion, wetting, grinding and dispersing for 1-4 h, and filtering to obtain the electronic paste.

In a fifth aspect, the invention also provides the use of an electronic paste comprising any of the above in the preparation of a battery.

In a sixth aspect, the present invention also provides a battery comprising: the glass frit composition according to any one of the above or the glass frit composition produced by any one of the above production methods, or the electronic paste according to any one of the above, and acceptable other auxiliary materials

According to the invention, two different glass powder systems and a high tellurium glass powder system T are developed, and the system has a wider contact window, so that the slurry can be ensured to have better contact performance when being applied to batteries with different passivation structures; the high silicon glass powder system G has lower corrosion level, and can ensure that the slurry can not cause excessive corrosion to the silicon wafer under the condition that the passivation film is thinner when the slurry is applied. In addition, the manufacturing process of the glass powder is adjusted, so that the grid line falling problem does not occur after the glass powder is dried when the optimized glass powder is applied to the slurry, and the attractiveness and stability of the battery piece are greatly improved.

Drawings

The above, as well as additional purposes, features, and advantages of exemplary embodiments of the present disclosure will become readily apparent from the following detailed description when read in conjunction with the accompanying drawings. Several embodiments of the present disclosure are illustrated by way of example, and not by way of limitation, in the figures of the accompanying drawings and in which like reference numerals refer to similar or corresponding parts and in which:

FIG. 1 shows the metal composite behavior of an optimized group A on different passivation structures;

FIG. 2 shows the contact performance behavior of the optimized group A on different passivation structures;

FIG. 3 shows the metal composite behavior of the optimized group B on different passivation structures;

FIG. 4 shows the contact performance of the optimized group B on different passivation structures;

FIG. 5 shows the metal composite behavior of the optimized group C on different passivation structures;

FIG. 6 shows the contact performance behavior of the optimized group C on different passivation structures;

FIG. 7 shows a comparison of glass powder contact performance for different ball milling processes;

FIG. 8 shows a comparison of glass-powder metal composites of different ball milling processes;

FIG. 9 shows a comparison of glass powder contact performance after an improved ball milling process;

fig. 10 shows a comparison of metal composite properties after the improved ball milling process.

Detailed Description

The invention discloses a glass powder combination and a preparation method thereof, electronic paste and a battery, and a person skilled in the art can properly improve the technological parameters by referring to the content of the invention. It is expressly noted that all such similar substitutions and modifications will be apparent to those skilled in the art, and are deemed to be included in the present invention. While the methods and applications of this invention have been described in terms of preferred embodiments, it will be apparent to those skilled in the relevant art that variations and modifications can be made in the methods and applications described herein, and in the practice and application of the techniques of this invention, without departing from the spirit or scope of the invention.

The glass powder combination, the preparation method thereof, the electronic paste and the battery provided by the invention can be obtained from the market by using raw materials and reagents.

The invention is further illustrated by the following examples:

example 1 fumbling of the proportions of the different oxides in the glass frit System T

The contact resistivity test adopts a TLM method, namely a rectangular transmission line method, a printed and sintered solar cell is cut into strips with a certain width (the width is set as W), resistances (RL) among grid lines with different distances are measured by adopting an instrument constant current source, the different distances and the measured resistances are fitted into a straight line, the contact resistivity ρc is obtained according to a formula RL (Ln) =2Rc× (Rs/W) Ln (wherein the resistance measured by RL is the total contact resistance, rs is the semiconductor sheet resistance, W is the width of the cut strips, ln is the distance of the different grid lines), and Rc and Rs are obtained according to a formula ρc= (Rc2.W2)/Rs.

The metal composite test is to print a metal composite screen plate (seven area patterns with different line widths are arranged on the screen plate and represent the metallization degree levels of different degrees, namely 2.52%, 3.02%, 3.95%, 4.61%, 10.54%, 14.37% and 18.41%, and the corresponding line widths are 30 mu m, 45 mu m, 60 mu m, 80 mu m, 180 mu m, 280 mu m and 380 mu m) for slurry on a silicon wafer, and test each area by a SunsVoc tester to obtain J01; and taking the metalized area as an x axis, taking the measured J01 as a y axis, and fitting the x axis and the y axis into a straight line, wherein the slope k in the obtained equation is the metal composite value.

TABLE 1 comparison of the compositions of glass powders T after adjustment

Sample numbering	Tellurium oxide containingQuantity/%	Lead oxide content/%
			Preferred group A	40	25
Experimental group A1	45	20
			Experimental group A2	35	30

As can be seen from table 1, the overall performance on both passivation structures is best by the optimized group a after the adjustment of the ratio; meanwhile, the high tellurium glass powder system T has better contact performance on different passivation structures, but because the damage to the silicon wafer is larger, the metal composition is better, the open pressure is lower when the high tellurium glass powder system T is used alone, and the design for preventing excessive corrosion is needed to be made in the formula when the high tellurium glass powder system T is used alone.

By adjusting the proportions of different oxides in the glass powder system T, the following optimal proportions are obtained, namely bismuth oxide: tungsten oxide: tellurium oxide: lead oxide: alkali metal, when the mass ratio of these several oxides is 18:7:40:25:10, the glass powder has wider contact window, but has larger corrosion, and needs to be matched with another glass powder system when in use.

Example 2 ratio of different oxides in glass frit System G

TABLE 2 comparison of the compositions of glass powder G after adjustment

Sample numbering	Silicon oxide content/%	Tungsten oxide content/%
			Preferred group B	20	10
Experimental group B1	15	15
			Experimental group B2	10	20

As can be seen from table 2, the performance on both passivation structures is best by the optimized group B after the scaling. Meanwhile, the high-silicon glass powder system G has lower metal composite on different passivation structures, but because the high-silicon glass powder system G has smaller damage to a silicon wafer, the contact performance is general, the open pressure can be higher when the high-silicon glass powder system G is used alone, the window can be narrower, the cloud and fog situations can occur, and the design for improving the contact performance needs to be made in a formula when the high-silicon glass powder system G is used.

By adjusting the proportions of different oxides in the glass powder system G, the following optimal proportions are obtained, namely bismuth oxide: tungsten oxide: tellurium oxide: lead oxide: silicon oxide: alkaline earth metals: boron oxide, when the mass ratio of the several oxides is 20:10:15:25:20:4: and 6, the prepared glass powder has better control on corrosion performance, but has deviation of contact performance, and needs to be matched with a glass powder system T for use.

Example 3

From the results of examples 1 and 2, it is clear that the high tellurium glass powder system T has better contact performance, but is too much corroded, which easily causes excessive corrosion to the silicon wafer; the high-silicon glass powder system G has lower metal recombination, but the contact performance is relatively general, and poor contact is easy to occur; in summary, the two glass frit systems are used in combination, and the best performance is achieved by adjusting the ratio of the two.

TABLE 3 ratio of glass frit T to glass frit G in the adjusted slurry

Model number	Glass powder system T percentage%	Glass frit system G% by weight
			Preferred group C	70	30
Experimental group C1	85	15
			Experimental group C2	55	45

From the experimental data in Table 3, it can be seen that the slurry has the best comprehensiveness, particularly on the alumina passivation layer, when the glass frit system T is 70% and the glass frit system G is 30%.

Example 4 comparison of particle size data at D50 around 1.5 μm from different ball milling processes

The manufacturing process of the water milling mode comprises the steps of proportioning, mixing, smelting (heat preservation at 1100 ℃ for 80 min), drying (150 ℃), water milling in a ball milling tank (10 h), filtering and standing, drying (150 ℃), crushing and obtaining the finished glass powder. Wherein the ball milling process adopts a 4L ball milling tank, and the zirconium balls adopt four types, namely round zirconium balls with the diameter of 7 mm: cylindrical zirconium balls with a diameter of 7 mm: round zirconium spheres with a diameter of 5 mm: cylindrical zirconium spheres with a diameter of 5mm = 2:2:1:1, the total mass of the zirconium spheres being 4Kg.

The sand grinding mode is produced through compounding, mixing, smelting (maintaining at 1100 deg.c for 80 min), stoving (150 deg.c), preliminary crushing in crusher, ball milling in sand mill, filtering, setting, stoving (150 deg.c), crushing and final product of glass powder. Wherein the main regulating parameter of the sand mill is the rotating speed, which is set to 1000r/min, and the times are two times.

The manufacturing process of the jet mill comprises the steps of proportioning, mixing, smelting (heat preservation for 80min at 1100 ℃), drying (150 ℃), preliminary crushing by a crusher, ball milling by the jet mill, drying (150 ℃), crushing and obtaining the finished glass powder. Wherein, the air flow mill ball milling process mainly adjusts the parameter grinding air pressure to be 0.65Mpa, adjusts the rotating speed of the classifying wheel to be 100Hz.

The traditional ball milling method mostly adopts a roller type water mill to process the smelted glass powder to the required particle size, but the glass powder manufactured by the ball milling method has large particle size span, large difference of the inner sizes of the particle sizes and large Dmax, and when the glass powder is applied to slurry, the printing broken grid is easy to increase, the grid line is separated after being dried, namely the printing performance is poor, the drying window is narrow, but the glass powder D10 processed by the water milling method is smaller, namely the glass powder manufactured by the method has higher activity in sintering, and has better contact window; the glass powder manufactured by the sanding process has a certain reduction of the grain size span, but has certain conditions of powder removal when being torn by 3M, the broken grid proportion is also reduced when the glass powder is applied to slurry, and the electric performance is slightly inferior to that of a water grinding mode; glass powder manufactured by using the air current mill has the smallest span, almost no broken grid occurs in continuous printing, 3M tearing and pulling are free from powder falling, but the electric performance is slightly inferior to that of a water mill mode.

TABLE 4 particle size distribution of glass powders by different ball milling processes

Process for producing a solid-state image sensor	D10/μm	D50/μm	D90/μm	D100/μm	K
						Water mill	0.451	1.532	7.946	18.453	4.89
Sanding	0.645	1.513	5.89	9.543	3.47
						Air flow mill	0.845	1.495	4.103	6.432	2.18

Table 5 comparison of glass frit Performance for different ball milling processes

Process for producing a solid-state image sensor	EL performance	Proportion of gate break/%	3M tear-off
				Water mill	Cloud-freeMist with a large number of broken grids	15.3	Severely destoner
Sanding	No cloud and little broken grid	8.7	Slightly destoner
				Air flow mill	No cloud and fog and almost no broken grid	0.3	No powder falling

As can be seen from Table 5, the glass powder produced by the single water milling method has larger D100 and larger grain size span, and a large number of broken grids appear when the glass powder is applied to slurry, and the glass powder is severely descaled by 3M tearing after drying; the proportion of broken grids of the glass powder manufactured by a single sanding mode is obviously reduced, and 3M tearing and pulling slightly remove the powder; the glass powder manufactured by the air flow mill is almost free from broken grids when being applied to slurry, and 3M tearing and pulling are free from powder falling.

As can be seen from the comparison of the performances of fig. 7 and 8, the glass powder produced by the single water mill method has the best contact performance, can form better contact with the passivation structure of silicon nitride and aluminum oxide, and has the contact performance to be improved by the single sand mill and the air mill.

The results show that the three ball milling modes have the characteristics, so that the three ball milling modes can be combined for ball milling, and the optimal ball milling process is selected. Therefore, the smelted glass powder is firstly ball-milled to a D50 of about 20 mu m by a water milling mode, and then is respectively processed by sand milling and air flow milling, so that the contrast performance is changed.

Example 5

The three ball milling modes in example 4 were subjected to combined ball milling, so that the optimal ball milling process was selected. Therefore, the smelted glass powder is firstly ball-milled to a D50 of about 20 mu m by a water milling mode, and then is respectively processed by sand milling and air flow milling, so that the contrast performance is changed.

The manufacturing process of the water mill and sand mill mode comprises the steps of burdening, mixing, smelting (heat preservation at 1100 ℃ for 80 min), drying (150 ℃), water milling in a ball milling tank (4 h), ball milling in a sand mill, filtering and standing, drying (150 ℃), crushing and obtaining the finished glass powder. Wherein the ball milling process adopts a 4L ball milling tank, and the zirconium balls adopt four types, namely round zirconium balls with the diameter of 7 mm: cylindrical zirconium balls with a diameter of 7 mm: round zirconium spheres with a diameter of 5 mm: cylindrical zirconium spheres with a diameter of 5mm = 2:2:1:1, the total mass of the zirconium spheres being 4Kg. Wherein the main regulating parameter of the sand mill is the rotating speed, which is set to 1000r/min, and the times are two times.

The manufacturing process of the water mill and air mill mode comprises the steps of batching, mixing, smelting (heat preservation at 1100 ℃ for 80 min), drying (150 ℃), ball milling tank water mill (4 h), air mill processing, drying (150 ℃), crushing and finished glass powder. Wherein the ball milling process adopts a 4L ball milling tank, and the zirconium balls adopt four types, namely round zirconium balls with the diameter of 7 mm: cylindrical zirconium balls with a diameter of 7 mm: round zirconium spheres with a diameter of 5 mm: cylindrical zirconium spheres with a diameter of 5mm = 2:2:1:1, the total mass of the zirconium spheres being 4Kg. Wherein, the air flow mill ball milling process mainly adjusts the parameter grinding air pressure to be 0.65Mpa, adjusts the rotating speed of the classifying wheel to be 100Hz.

Table 6 particle size distribution of glass powder for improved ball milling process

Process for producing a solid-state image sensor	D10/μm	D50/μm	D90/μm	D100/μm	K
						Water mill	0.451	1.532	7.946	18.453	4.89
Water mill and sand mill	0.503	1.497	6.545	13.274	4.04
						Water mill and air mill	0.552	1.516	4.504	7.07	2.61

As is clear from the results shown in Table 6, the glass powder D10 produced by the combination ball milling method was reduced to some extent, D100 was increased to some extent, and the span was slightly increased.

Table 7 comparison of glass powder properties after improved ball milling process

Process for producing a solid-state image sensor	EL performance	Proportion of gate break/%	3M tear-off
				Water mill	No cloud and large number of broken grids	15.3	Severely destoner
Water mill and sand mill	No cloud and large number of broken grids	10.45	Slightly destoner
				Water mill and air mill	No cloud and fog and almost no broken grid	0.41	No powder falling

As can be seen from the results in table 7, the glass powder produced by the process of water milling and sand milling still has a large number of broken grids when applied to the slurry, and the 3M tear is slightly destoner; when the glass powder manufactured by using the water mill and the air mill is applied to slurry, the broken grid is almost avoided, and the 3M tearing and the powder falling are avoided, so that the performance is better.

As can be seen from the results of fig. 9 and 10, the glass frit manufactured using the water mill + air mill performed best in contact performance and metal composite performance.

By combining the results, the glass powder manufactured by using the water mill and the air mill has better performance through the improved ball milling process.

The foregoing is merely a preferred embodiment of the present invention and it should be noted that modifications and adaptations to those skilled in the art may be made without departing from the principles of the present invention, which are intended to be comprehended within the scope of the present invention.

Claims

1. A glass frit combination, characterized by comprising a glass frit system T and a glass frit system G;

the oxides of the glass frit system T include: tellurium oxide and lead oxide;

2. the glass frit combination according to claim 1, wherein the oxide of the glass frit system T comprises, in parts by mass: 30-50 parts of tellurium oxide and 30-45 parts of lead oxide;

3. The glass frit combination according to claim 1 or 2, wherein the glass frit system T comprises: bismuth oxide, tungsten oxide, tellurium oxide, lead oxide, and alkali metal oxide;

4. A glass frit combination according to any one of claims 1 to 3, comprising a glass frit system T and a glass frit system G;

5. the glass frit combination according to claim 4, wherein the mass ratio of tellurium oxide to lead oxide in the glass frit system T comprises 40:25.

6. The glass frit combination according to claim 4, wherein the mass ratio of bismuth oxide, tungsten oxide, tellurium oxide, lead oxide to alkali metal oxide in the oxide of the glass frit system T is 18:7:40:25:10.

7. the glass frit combination according to claim 4, wherein the mass ratio of the silicon oxide to the tungsten oxide in the glass frit system G comprises 20:10.

8. The glass frit combination according to claim 4, wherein the mass ratio of the bismuth oxide, the tungsten oxide, the tellurium oxide, the lead oxide, the silicon oxide, the alkaline earth metal oxide and the boron oxide in the oxide of the glass frit system G is 20:10:15:25:20:4:6.

9. the glass frit combination according to claim 1, wherein the mass ratio of the glass frit system T to the glass frit system G is 70:30.

10. The method of preparing a glass frit composition according to any one of claims 1 to 9, wherein the method of preparing is: and mixing, smelting and drying the raw materials of the glass powder system T and the glass powder system G, and respectively carrying out water grinding, air flow grinding, drying and crushing to obtain the glass powder combination.

11. The preparation method according to claim 10, wherein the water mill adopts four kinds of zirconium balls, namely round zirconium balls with the diameter of 7mm, cylindrical zirconium balls with the diameter of 7mm, round zirconium balls with the diameter of 5mm and cylindrical zirconium balls with the diameter of 5mm, and the mass ratio of the round zirconium balls to the cylindrical zirconium balls is 2:2:1:1.

12. The method of claim 10, wherein the jet mill has a grinding pressure of 0.65Mpa and a classifying wheel rotation of 100Hz.

13. Use of a glass frit combination according to any one of claims 1 to 9 or a glass frit combination produced by a production method according to any one of claims 10 to 12 for producing an electronic paste or a battery.

14. An electronic paste comprising the glass frit combination according to any one of claims 1 to 9 or the glass frit combination produced by the production method according to any one of claims 10 to 12, and silver powder and an organic binder.

15. The electronic paste according to claim 14, comprising the following components in parts by mass:

16. the electronic paste according to claim 14 or 15, wherein the silver powder comprises one or more of a spheroid-like powder and a microcrystalline powder, and the average particle size of the silver powder is 1.0 μm to 3.0 μm.

17. The electronic paste of claim 14 or 15, wherein the organic binder comprises a composition of one or more of a solvent, a thickener, a plasticizer, or a thixotropic agent.

18. The electronic paste of claim 14 or 15, wherein the solvent comprises one or more of DOP, DBE, terpineol, butyl carbitol acetate, benzyl alcohol, ethylene glycol monomethyl ether, or diethylene glycol diethyl ether.

19. The electronic paste of claim 14 or 15, wherein the thickener comprises a composition of one or more of ethylcellulose, cellulose acetate, solid acrylic resin, or ABS resin.

20. The electronic paste according to claim 14 or 15, wherein the organic binder is prepared by a method comprising: mixing the raw materials, stirring and melting at 70-100 ℃ to obtain the uniform organic adhesive.

21. The electronic paste according to claim 14 or 15, wherein the electronic paste is prepared by a method comprising: mixing the silver powder, the glass powder and the organic adhesive in proportion, wetting, grinding and dispersing for 1-4 h, and filtering to obtain the electronic paste.

22. Use of an electronic paste according to any of claims 14 to 21 for the preparation of a battery.

23. A battery comprising a glass frit combination according to any one of claims 1 to 9 or a glass frit combination produced according to the production method of any one of claims 10 to 12, or an electronic paste according to any one of claims 14 to 21, and acceptable other auxiliary materials.