CN116053366A - Film pressing equipment for coating fluorescent glue on LED wafer - Google Patents
Film pressing equipment for coating fluorescent glue on LED wafer Download PDFInfo
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- CN116053366A CN116053366A CN202310051276.1A CN202310051276A CN116053366A CN 116053366 A CN116053366 A CN 116053366A CN 202310051276 A CN202310051276 A CN 202310051276A CN 116053366 A CN116053366 A CN 116053366A
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- fixedly connected
- inner cavity
- shell
- die
- sliding connection
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- 238000003825 pressing Methods 0.000 title claims abstract description 37
- 239000003292 glue Substances 0.000 title claims abstract description 18
- 239000011248 coating agent Substances 0.000 title claims abstract description 16
- 238000000576 coating method Methods 0.000 title claims abstract description 16
- 238000000926 separation method Methods 0.000 claims abstract description 13
- 238000005096 rolling process Methods 0.000 claims description 27
- 239000007787 solid Substances 0.000 claims description 25
- 238000012857 repacking Methods 0.000 claims description 24
- 239000012528 membrane Substances 0.000 claims description 21
- 238000007664 blowing Methods 0.000 claims description 8
- 230000006978 adaptation Effects 0.000 claims description 3
- 244000309464 bull Species 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 claims 8
- 238000007723 die pressing method Methods 0.000 claims 7
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims 1
- 238000004512 die casting Methods 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 27
- 230000000694 effects Effects 0.000 abstract description 5
- 230000001629 suppression Effects 0.000 abstract description 3
- 238000002955 isolation Methods 0.000 description 9
- 210000002489 tectorial membrane Anatomy 0.000 description 8
- 238000001125 extrusion Methods 0.000 description 7
- 239000000843 powder Substances 0.000 description 5
- 238000004804 winding Methods 0.000 description 5
- 238000001179 sorption measurement Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 241000883990 Flabellum Species 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000011218 segmentation Effects 0.000 description 2
- 230000003044 adaptive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 230000005587 bubbling Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 239000007888 film coating Substances 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention belongs to the technical field of film sticking, in particular to film pressing equipment for coating fluorescent glue on an LED wafer, which comprises a fixed frame, wherein a control sliding block is connected in an inner cavity of the fixed frame in a sliding manner, a clamping connecting rod is fixedly connected in an inner cavity of the control sliding block, external inserting rods are fixedly connected on two sides of the surface of the fixed frame, and a supporting stand is fixedly connected in the middle of the surface of the external inserting rods. The device is in the in-process of carrying out the press mold work, and go up mould and bed die though be the state of mutual separation, but because connecting device's fixed effect, go up mould and bed die and guarantee the axial lead the same all the time, so go up the mould and carry out the press mold during the work to the bed die, can not appear going up the dislocation of bed die and lead to a series of problems such as bubble easily appear in the less one side of the surface atress of LED piece of diaphragm of suppression to connecting device can easily guide upward mould and bed die separation, auxiliary mould's removal process.
Description
Technical Field
The invention belongs to the technical field of film sticking, and particularly relates to film pressing equipment for coating fluorescent glue on an LED wafer.
Background
In the production process, the white light LED is manufactured, and fluorescent powder excitation is generally required to be carried out on the blue light LED: the white light source can be obtained by exciting the fluorescent powder by transmitting the light emitted by the blue light LED through the fluorescent powder of the specific material, so that the fluorescent powder needs to be coated on the blue light LED in order to obtain the white light LED. The process of coating the fluorescent powder on the LED chip comprises a fluorescent glue dispensing technology, a fluorescent glue spraying technology, a fluorescent glue film coating technology and the like.
The fluorescent glue film pressing forming is a relatively mature process, and the film pressing of the LED chip is realized through the cooperation of the upper die set and the lower die set, but because the upper die set and the lower die set are easy to generate dislocation error in the moving process, the upper die set is easy to be aligned with the lower die set in the pressing process, the pressed film is caused to be uneven in surface stress of the LED sheet, and a series of problems such as bubbling easily occur on one side with smaller stress, and therefore, the system error needs to be eliminated.
Disclosure of Invention
Aiming at the defects of the prior art, the invention solves the technical problems by adopting the following technical scheme: the film pressing equipment for coating fluorescent glue on the LED wafer comprises a fixed frame, wherein a control sliding block is slidingly connected to an inner cavity of the fixed frame, a clamping connecting rod is fixedly connected to an inner cavity of the control sliding block, external inserting rods are fixedly connected to two sides of the surface of the fixed frame, a supporting stand is fixedly connected to the middle of the surface of the external inserting rods, control winding drums are rotatably connected to two ends of the supporting stand, and film winding belts are rotatably connected to the middle of the inner cavity of the control winding drum; the top of the inner cavity of the fixed frame is slidably connected with a vertical sliding rod, the top of the vertical sliding rod is fixedly connected with a sliding top plate, the axis of the top of the surface of the sliding top plate is fixedly connected with an air inlet shell, the top of the inner cavity of the air inlet shell is fixedly connected with a rotor motor, the surface of an output shaft of the rotor motor is fixedly connected with a threaded rotating rod, the bottom of the surface of the sliding top plate is slidably connected with a vertical through pipe, the middle of the surface of the vertical through pipe is fixedly connected with an external sleeve shell, the surface of the external sleeve is fixedly connected with a connecting device, the bottom of the inner cavity of the vertical through pipe is slidably connected with a solid push rod, the top of the solid push rod is fixedly connected with a spring washer, and the bottom of the vertical through pipe is fixedly connected with an upper die; in the process of film pressing operation, the control slider of inner cavity pulls the joint connecting rod, make the vertical siphunculus in middle part and the axle center department at slip roof inner cavity top align, the bottom of shell is admitted air this moment and the top of vertical siphunculus is linked together, fixed frame makes the slip roof decline through pulling vertical slide bar, slip roof presses vertical siphunculus, the last mould of messenger's bottom is pegged graft in the socket of bed die inner cavity, accomplish first fixed work, rotor motor control screw thread bull stick in the inner cavity of shell is admitted air afterwards is rotatory, the shell is inhaled from the outside, then pour into the inner cavity of vertical siphunculus, the spring washer is elongated this moment, but solid push rod can be along the inner cavity gliding of vertical siphunculus because of atmospheric pressure, the bottom of solid push rod is extruded the upper surface of roll up the membrane area, carry out the pad pasting work to the wafer board of below, the roll membrane area of being extruded is cut off the side because of extrusion afterwards, the control reel traction roll membrane area of both sides carries out the removal and switches. The device is in the in-process of carrying out the tectorial membrane work, adopt the mode of segmentation tectorial membrane, insert the top slot of repacking dull and stereotyped inner chamber with last mould earlier, then the solid push rod of rethread vertical siphunculus inner chamber will roll up the membrane area and suppress at the upper surface of wafer board, if the bottom vertical action of solid push rod is in the middle part of wafer board upper surface, the top of vertical siphunculus can be put through with the bottom of shell that admits air completely this moment, otherwise vertical siphunculus can appear leaking gas problem, the top pressurized of leading to solid push rod reduces, can't carry out the tectorial membrane work to the wafer board, the problem of solid push rod tectorial membrane dislocation has been avoided automatically.
Preferably, the connecting device comprises a clamping top sleeve, two ends of the clamping top sleeve are fixedly connected with switching arc arms, the middle part of an inner cavity of each switching arc arm is rotationally connected with a rotating joint, the bottom end of each switching arc arm is rotationally connected with a lower die, two ends of each rotating joint are fixedly connected with vertical supporting legs, the bottom ends of supporting stand are fixedly connected with bottom plate blocks, and the bottom ends of the vertical supporting legs are in sliding connection with the surfaces of the bottom plate blocks. The device is in the in-process of carrying out the press mold work, and go up mould and bed die though be the state of mutual separation, but because connecting device's fixed effect, go up mould and bed die and guarantee the axial lead the same all the time, so go up the mould and carry out the press mold during the work to the bed die, can not appear going up the dislocation of bed die and lead to a series of problems such as bubble easily appear in the less one side of the surface atress of LED piece of diaphragm of suppression to connecting device can easily guide upward mould and bed die separation, auxiliary mould's removal process.
Preferably, the upper die comprises a side insert block, the axis of the inner cavity of the upper die is in sliding connection with the surface of the film rolling belt, one end of the side insert block, which is close to the film rolling belt, is rotationally connected with a spring clamping plate, one side of the inner cavity of the side insert block, which is close to the film rolling belt, is in sliding connection with a traction pull rod, two ends of the traction pull rod are both in sliding connection with a fixed side shell, the surface of the fixed side shell is in fixed connection with the inner cavity of the upper die, one side of the inner cavity of the fixed side shell is fixedly connected with a clamping spring, and the other side of the inner cavity of the fixed side shell is fixedly connected with a control magnetic block. In the process of film pasting work, the side position inserts on two sides clamp the two sides of the film rolling belt through the spring clamp plate, the film rolling belt can slide back and forth along the inner wall of the spring clamp plate in the process of ensuring that the film rolling belt can smoothly pass through the upper die, but in the process of clamping the side position inserts on two sides, the traction pull rod can be pushed by the side position inserts, at the moment, the traction pull rod can slide along the inner cavity of the fixed side shell, the clamping spring is compressed, the traction pull rod is far away from the control magnetic block on the other side of the fixed side shell, when the spring clamp plate loosens due to clamping, the side position inserts can slide outwards along the side groove of the upper die, at the moment, the traction pull rod pushed by the side position inserts slides towards the control magnetic block under the action of the clamping spring in the inner cavity of the fixed side shell, and then an alarm system of the fixed side shell is started, so that an operator is reminded to fasten operation.
Preferably, the axis of the top of the inner cavity of the upper die is provided with a through socket, the bottom end of the solid push rod is in sliding connection with the inner cavity of the upper die through the through socket, the bottom end of the solid push rod is in sliding connection with the surface of the film rolling belt through the clamping cover, and the bottom end of the upper die is in sliding connection with the top end of the lower die. In order to avoid the roll up the membrane area and appear wearing and tearing problem when sliding along last mould inner chamber, use the supplementary roll up membrane area of side position inserted block to slide in the both sides of last mould, but roll up the membrane area and take place the problem of sliding with the inner chamber of spring clamp plate easily along with last mould removal's in-process, will take place not hard up to roll up the centre gripping of membrane area this moment, the alarm system of the fixed side shell in both sides can start automatically to remind operating personnel to carry out fastening operation, avoid appearing rolling up the membrane area and appear wearing and tearing problem when sliding.
Preferably, the one end that fixed frame was kept away from to the joint link is connected with the surface fixed of external cover shell, through hole has evenly been seted up to the bottom of air inlet shell inner chamber, the top on vertical siphunculus surface has cup jointed the spring washer, and the bottom of spring washer and the top fixed connection of external cover shell, the surface of rolling up the membrane area is through running through the middle part sliding connection of grooving and last mould inner chamber. The lower die comprises a modified flat plate, a limiting top frame is fixedly connected to the axis of the top of the inner cavity of the modified flat plate, a wafer plate is fixedly connected to the top of the surface of the limiting top frame, a plunger rod sliding plate is slidably connected to the middle of the inner cavity of the limiting top frame, a rotating motor is fixedly connected to the bottom of the inner cavity of the limiting top frame, and a thrust rotating plate is fixedly connected to the surface of an output shaft of the rotating motor. The bottom fixedly connected with of repacking dull and stereotyped surface removes the sliding leg, the inner chamber sliding connection who removes the sliding leg has a ball slide, the one side that the spacing top frame was kept away from to repacking dull and stereotyped inner chamber is through adaptation slot fixedly connected with blast apparatus, the both sides on repacking dull and stereotyped surface all rotate with the bottom of switching arc arm and be connected. Before using the device to carry out the press mold work, need place the wafer board on the bed die earlier, because the distance between bed die and the last mould is less, so need pull open connecting device, the contained angle of switching arc arm both sides increases this moment, bed die and last mould separation, vertical supporting leg shrink, place the wafer board on the bed die after, rethread revolute joint reduces the contained angle of switching arc arm both sides, accomplishes the material loading work this moment.
Preferably, the top of spacing top frame inner chamber has evenly been seted up and has been run through the socket, the top of inserted bar slide is through the top sliding connection of running through socket and spacing top frame inner chamber, the both sides of inserted bar slide are all through the top fixed connection of spring area and spacing top frame inner chamber, the surface of thrust revolving plate and the bottom sliding connection of inserted bar slide surface. In the process of film pressing, the upper surface of the wafer plate receives downward extrusion force because of film pressing, and the lower surface of the wafer plate can generate larger adsorption force to the top of the surface of the limiting top frame because of film pasting at the moment, so that after film pressing work each time, the rotating motor at the bottom of the inner cavity of the limiting top frame controls the thrust rotating plate to rotate, at the moment, the top end of the thrust rotating plate pushes the inserting rod sliding plate upwards, the top end of the inserting rod sliding plate penetrates through the top of the inner cavity of the limiting top frame to push the wafer plate upwards, and at the moment, the wafer plate is separated from the limiting top frame and can be taken down smoothly. Whenever the wafer board is through pressing the membrane work back, the diaphragm of wafer board surface can produce great adsorption affinity with the upper surface of bottom repacking dull and stereotyped, and then causes the wafer board to be difficult to follow the problem of repacking dull and stereotyped upper surface of repacking, causes inconveniently, so repacking the middle part of repacking dull and stereotyped, through spacing roof frame fixed wafer board, can be through inside inserted bar slide with wafer board and spacing roof frame quick separation after pressing, avoid appearing wafer board and the phenomenon of repacking dull and stereotyped adhesion.
Preferably, the blast apparatus includes the grafting shell, the top fixedly connected with guide siphunculus of grafting shell, the top of grafting shell inner chamber is through socket sliding connection having the removal slide plug, the bottom fixedly connected with coupling spring of removal slide plug, and the bottom fixedly connected with isolation shell of coupling spring, the axle center department rotation of isolation shell inner chamber is connected with one-way flabellum. When carrying out the press mold work, go up the mould and can insert the top slot of repacking dull and stereotyped inner chamber, press the even board and can follow the vertical spout of grafting shell because of the extrusion force of last mould and slide downwards this moment, press even board and can pull the slip stopper of removal and slide downwards this moment, the through-hole at grafting shell inner chamber top is opened, and remove the bottom of slip stopper and apply the extrusion force to the top button of isolation shell through connecting spring after, the rotation machine control one-way flabellum in isolation shell inner chamber rotates, the isolation shell carries out blast air work in the side seam of upper mould through the guide siphunculus.
Preferably, one side of the surface of the movable sliding plug, which is close to the wafer plate, is fixedly connected with a pressing connecting plate, the pressing connecting plate is in sliding connection with the inner cavity of the plug-in cylinder shell through a vertical sliding groove, the bottom end of the upper die is in sliding connection with the top of the modified flat plate inner cavity through an adaptive slot, and one end of the pressing connecting plate, which is far away from the movable sliding plug, is mutually extruded with the bottom end of the upper die. In the process of film pressing work, the lateral air blowing device can automatically open the through hole of the guiding through pipe and automatically start, dust impurities in the clamping seams of the upper surface of the refitted flat plate are blown away through the air blowing effect of the guiding through pipe, the bottom of the upper die is subjected to air blowing work through the side groove of the plug-in cylinder shell, the problem that the upper die is inserted into the inner cavity of the refitted flat plate deeply, and the abrasion of the upper die to the inner cavity of the refitted flat plate is serious when the upper die is pulled out from the inner part of the refitted flat plate is avoided.
The beneficial effects of the invention are as follows:
1. the device is in the in-process of carrying out the press mold work, and go up mould and bed die though be the state of mutual separation, but because connecting device's fixed effect, go up mould and bed die and guarantee the axial lead the same all the time, so go up the mould and carry out the press mold during the work to the bed die, can not appear going up the dislocation of bed die and lead to a series of problems such as bubble easily appear in the less one side of the surface atress of LED piece of diaphragm of suppression to connecting device can easily guide upward mould and bed die separation, auxiliary mould's removal process.
2. The device is in the in-process of carrying out the tectorial membrane work, adopt the mode of segmentation tectorial membrane, insert the top slot of repacking dull and stereotyped inner chamber with last mould earlier, then the solid push rod of rethread vertical siphunculus inner chamber will roll up the membrane area and suppress at the upper surface of wafer board, if the bottom vertical action of solid push rod is in the middle part of wafer board upper surface, the top of vertical siphunculus can be put through with the bottom of shell that admits air completely this moment, otherwise vertical siphunculus can appear leaking gas problem, the top pressurized of leading to solid push rod reduces, can't carry out the tectorial membrane work to the wafer board, the problem of solid push rod tectorial membrane dislocation has been avoided automatically.
3. In order to avoid the roll up the membrane area and appear wearing and tearing problem when sliding along last mould inner chamber, use the supplementary roll up membrane area of side position inserted block to slide in the both sides of last mould, but roll up the membrane area and take place the problem of sliding with the inner chamber of spring clamp plate easily along with last mould removal's in-process, will take place not hard up to roll up the centre gripping of membrane area this moment, the alarm system of the fixed side shell in both sides can start automatically to remind operating personnel to carry out fastening operation, avoid appearing rolling up the membrane area and appear wearing and tearing problem when sliding.
4. Whenever the wafer board is through pressing the membrane work back, the diaphragm of wafer board surface can produce great adsorption affinity with the upper surface of bottom repacking dull and stereotyped, and then causes the wafer board to be difficult to follow the problem of repacking dull and stereotyped upper surface of repacking, causes inconveniently, so repacking the middle part of repacking dull and stereotyped, through spacing roof frame fixed wafer board, can be through inside inserted bar slide with wafer board and spacing roof frame quick separation after pressing, avoid appearing wafer board and the phenomenon of repacking dull and stereotyped adhesion.
5. In the process of film pressing work, the lateral air blowing device can automatically open the through hole of the guiding through pipe and automatically start, dust impurities in the clamping seams of the upper surface of the refitted flat plate are blown away through the air blowing effect of the guiding through pipe, the bottom of the upper die is subjected to air blowing work through the side groove of the plug-in cylinder shell, the problem that the upper die is inserted into the inner cavity of the refitted flat plate deeply, and the abrasion of the upper die to the inner cavity of the refitted flat plate is serious when the upper die is pulled out from the inner part of the refitted flat plate is avoided.
Drawings
FIG. 1 is a front view of the present invention;
FIG. 2 is a cross-sectional view of the present invention;
FIG. 3 is a schematic view of the structure of the connecting device of the present invention;
FIG. 4 is a cross-sectional view of a sliding top plate of the present invention;
FIG. 5 is a cross-sectional view of an upper die of the present invention;
FIG. 6 is a cross-sectional view of the lower die of the present invention;
FIG. 7 is a cross-sectional view of a retrofit panel of the present invention;
fig. 8 is a cross-sectional view of the blower apparatus of the present invention.
In the figure: 1. a fixed frame; 11. a control slider; 12. clamping the connecting rod; 13. a support stand; 14. controlling the winding drum; 15. externally connected with a plug rod; 16. a bottom plate block; 17. film rolling belts; 2. a sliding top plate; 21. an air intake housing; 22. a rotor motor; 23. a threaded rotating rod; 24. a vertical slide bar; 25. a vertical through pipe; 26. a spring washer; 27. a solid push rod; 3. a connecting device; 31. clamping the top sleeve; 32. a switching arc arm; 33. rotating the joint; 34. a vertical support leg; 4. an upper die; 41. a side position plug block; 42. a spring clamping plate; 43. fixing the side shell; 44. a traction pull rod; 45. a clamping spring; 5. a lower die; 51. refitting the flat plate; 52. moving the sliding leg; 53. a ball sliding cylinder; 54. a wafer plate; 55. a limiting top frame; 56. a rod inserting slide plate; 57. a rotating motor; 58. a thrust rotating plate; 6. a blower device; 61. a plug-in cylinder shell; 62. guiding the through pipe; 63. moving the slide plug; 64. pressing the connecting plate; 65. an isolation case; 66. one-way fan blade.
Detailed Description
The invention will be described in further detail with reference to the drawings and the detailed description. The embodiments of the invention have been presented for purposes of illustration and description, and are not intended to be exhaustive or limited to the invention in the form disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, and to enable others of ordinary skill in the art to understand the invention for various embodiments with various modifications as are suited to the particular use contemplated.
Example 1
Referring to fig. 1-5, the present invention provides a technical solution: the utility model provides a press mold equipment of LED wafer coating fluorescent glue, includes fixed frame 1, the inner chamber sliding connection of fixed frame 1 has control slider 11, the inner chamber fixedly connected with joint connecting rod 12 of control slider 11, the both sides on fixed frame 1 surface all fixedly connected with external inserted bar 15, the middle part fixedly connected with support frame 13 on external inserted bar 15 surface, the both ends of support frame 13 all rotate and are connected with control reel 14, the middle part of control reel 14 inner chamber rotates and is connected with a roll membrane area 17;
the top of the inner cavity of the fixed frame 1 is slidably connected with a vertical slide rod 24, the top of the vertical slide rod 24 is fixedly connected with a sliding top plate 2, the axis of the top of the surface of the sliding top plate 2 is fixedly connected with an air inlet shell 21, the top of the inner cavity of the air inlet shell 21 is fixedly connected with a rotor motor 22, the surface of an output shaft of the rotor motor 22 is fixedly connected with a threaded rotating rod 23, the bottom of the surface of the sliding top plate 2 is slidably connected with a vertical through pipe 25, the middle of the surface of the vertical through pipe 25 is fixedly connected with an external sleeve, the surface of the external sleeve is fixedly connected with a connecting device 3, the bottom of the inner cavity of the vertical through pipe 25 is slidably connected with a solid push rod 27, the top of the solid push rod 27 is fixedly connected with a spring washer 26, and the bottom of the vertical through pipe 25 is fixedly connected with an upper die 4;
the connecting device 3 comprises a clamping top sleeve 31, two ends of the clamping top sleeve 31 are fixedly connected with a switching arc arm 32, a rotating joint 33 is rotationally connected to the middle of an inner cavity of the switching arc arm 32, a lower die 5 is rotationally connected to the bottom end of the switching arc arm 32, vertical supporting legs 34 are fixedly connected to two ends of the rotating joint 33, a bottom plate block 16 is fixedly connected to the bottom end of the supporting frame 13, and the bottom end of the vertical supporting legs 34 are slidably connected with the surface of the bottom plate block 16.
The upper die 4 comprises a side insert block 41, the axis of the inner cavity of the upper die 4 is in sliding connection with the surface of the film rolling belt 17, one end, close to the film rolling belt 17, of the side insert block 41 is rotationally connected with a spring clamping plate 42, one side, close to the film rolling belt 17, of the inner cavity of the side insert block 41 is in sliding connection with a traction pull rod 44, two ends of the traction pull rod 44 are both in sliding connection with a fixed side shell 43, the surface of the fixed side shell 43 is fixedly connected with the inner cavity of the upper die 4, one side of the inner cavity of the fixed side shell 43 is fixedly connected with a clamping spring 45, and the other side of the inner cavity of the fixed side shell 43 is fixedly connected with a control magnetic block.
The axis of the top of the inner cavity of the upper die 4 is provided with a through socket, the bottom end of the solid push rod 27 is in sliding connection with the inner cavity of the upper die 4 through the through socket, the bottom end of the solid push rod 27 is in sliding connection with the surface of the film rolling belt 17 through a clamping cover, and the bottom end of the upper die 4 is in sliding connection with the top end of the lower die 5.
The clamping connecting rod 12 is fixedly connected with the surface of the external connecting sleeve at the end far away from the fixed frame 1, a through hole is uniformly formed in the bottom of the inner cavity of the air inlet shell 21, a spring washer 26 is sleeved at the top of the surface of the vertical through pipe 25, the bottom end of the spring washer 26 is fixedly connected with the top end of the external connecting sleeve, and the surface of the film rolling belt 17 is in sliding connection with the middle part of the inner cavity of the upper die 4 through a through groove.
Before the device is used for film pressing, the wafer plate 54 needs to be placed on the lower die 5, the connecting device 3 needs to be pulled open because the distance between the lower die 5 and the upper die 4 is smaller, at the moment, the included angles at two sides of the switching arc arm 32 are increased, the lower die 5 is separated from the upper die 4, the vertical supporting legs 34 are contracted, after the wafer plate 54 is placed on the lower die 5, the included angles at two sides of the switching arc arm 32 are reduced through the rotating joint 33, and at the moment, the feeding work is completed.
In the film pressing process, the control slide block 11 of the inner cavity pulls the clamping connecting rod 12 to enable the vertical through pipe 25 in the middle to be aligned with the axis of the top of the inner cavity of the sliding top plate 2, at the moment, the bottom end of the air inlet shell 21 is communicated with the top end of the vertical through pipe 25, the fixed frame 1 enables the sliding top plate 2 to descend through pulling the vertical slide rod 24, the sliding top plate 2 presses the vertical through pipe 25 to enable the upper die 4 at the bottom end to be inserted into the socket of the inner cavity of the lower die 5, primary fixing is completed, then the rotor motor 22 in the inner cavity of the air inlet shell 21 controls the threaded rotating rod 23 to rotate, the air inlet shell 21 is sucked from the outside and then poured into the inner cavity of the vertical through pipe 25, at the moment, the spring washer 26 is lengthened, but the solid push rod 27 can slide downwards along the inner cavity of the vertical through pipe 25 due to air pressure, the bottom end of the solid push rod 27 presses the upper surface of the film rolling belt 17, film pasting work is carried out on the lower wafer plate 54, then the pressed film rolling belt 17 is cut off due to the pressing, and the control winding drums 14 at two sides pull the film rolling belt 17 to move and switch.
In the process of film pasting work, the two sides of the film rolling belt 17 are clamped by the side position inserting blocks 41 on the two sides through the spring clamping plates 42, in the process of ensuring that the film rolling belt 17 can smoothly pass through the upper die 4, the film rolling belt 17 can slide back and forth along the inner wall of the spring clamping plates 42, but in the process of clamping the side position inserting blocks 41 on the two sides, the side position inserting blocks 41 can push the traction pull rod 44, at the moment, the traction pull rod 44 can slide along the inner cavity of the fixed side shell 43, the clamping springs 45 are compressed, the traction pull rod 44 is far away from the control magnetic blocks on the other side of the fixed side shell 43, when the spring clamping plates 42 are loosened due to clamping, the side position inserting blocks 41 can slide outwards along the side grooves of the upper die 4, at the moment, the traction pull rod 44 pushed by the side position inserting blocks 41 slides towards the control magnetic blocks under the action of the clamping springs 45 in the inner cavity of the fixed side shell 43, and then an alarm system of the fixed side shell 43 is started, so that an operator is reminded of fastening operation.
Example two
Referring to fig. 1-8, the present invention provides a technical solution: on the basis of the first embodiment, the lower die 5 comprises a modified flat plate 51, a limiting top frame 55 is fixedly connected to the axle center of the top of the inner cavity of the modified flat plate 51, a wafer plate 54 is fixedly connected to the top of the surface of the limiting top frame 55, a plug rod sliding plate 56 is slidably connected to the middle of the inner cavity of the limiting top frame 55, a rotating motor 57 is fixedly connected to the bottom of the inner cavity of the limiting top frame 55, and a thrust rotating plate 58 is fixedly connected to the surface of the output shaft of the rotating motor 57.
The bottom fixedly connected with of repacking dull and stereotyped 51 surface removes the sliding leg 52, remove the inner chamber sliding connection of sliding leg 52 and have ball slide 53, the one side that the spacing top frame 55 was kept away from to repacking dull and stereotyped 51 inner chamber is through adaptation slot fixedly connected with blast apparatus 6, the both sides on repacking dull and stereotyped 51 surface all rotate with the bottom of switching arc arm 32 and be connected.
The top of spacing top frame 55 inner chamber has evenly offered the through socket, the top of inserted bar slide 56 is through the top sliding connection of through socket and spacing top frame 55 inner chamber, the both sides of inserted bar slide 56 are all through the top fixed connection of spring area with spacing top frame 55 inner chamber, the bottom sliding connection of thrust rotating plate 58 surface and inserted bar slide 56 surface.
The air blowing device 6 comprises an inserting cylinder shell 61, a guiding through pipe 62 is fixedly connected to the top end of the inserting cylinder shell 61, a movable sliding plug 63 is slidably connected to the top of an inner cavity of the inserting cylinder shell 61 through a socket, a connecting spring is fixedly connected to the bottom end of the movable sliding plug 63, a separation shell 65 is fixedly connected to the bottom end of the connecting spring, and a one-way fan blade 66 is rotatably connected to the axis of the inner cavity of the separation shell 65.
The surface of the movable sliding plug 63 is fixedly connected with a pressing connecting plate 64 on one side close to the wafer plate 54, the pressing connecting plate 64 is in sliding connection with the inner cavity of the plug-in cylinder shell 61 through a vertical sliding groove, the bottom end of the upper die 4 is in sliding connection with the top of the inner cavity of the refitted flat plate 51 through an adapting slot, and one end of the pressing connecting plate 64 far away from the movable sliding plug 63 is mutually extruded with the bottom end of the upper die 4.
In the process of film pressing, the upper surface of the wafer plate 54 receives downward extrusion force because of film pressing, and at the moment, the lower surface of the wafer plate 54 generates larger adsorption force to the top of the surface of the limiting top frame 55 because of film pasting, so that after film pressing work each time, the rotating motor 57 at the bottom of the inner cavity of the limiting top frame 55 controls the thrust rotating plate 58 to rotate, at the moment, the top end of the thrust rotating plate 58 pushes the inserting rod sliding plate 56 upwards, the top end of the inserting rod sliding plate 56 penetrates through the top of the inner cavity of the limiting top frame 55 to push the wafer plate 54 upwards, and at the moment, the wafer plate 54 is separated from the limiting top frame 55 and can be taken down smoothly.
When the film pressing operation is performed, the upper die 4 is inserted into the top slot of the inner cavity of the refitted flat plate 51, at this time, the pressing connecting plate 64 can slide downwards along the vertical sliding groove of the plug-in cylinder shell 61 due to the extrusion force of the upper die 4, at this time, the pressing connecting plate 64 can pull the movable sliding plug 63 to slide downwards, the through hole at the top of the inner cavity of the plug-in cylinder shell 61 is opened, the bottom end of the movable sliding plug 63 applies extrusion force to the top button of the isolation shell 65 through the connecting spring, the rotating machine of the inner cavity of the isolation shell 65 controls the one-way fan blade 66 to rotate, and the isolation shell 65 performs blasting operation on the side seam of the upper die 4 through the guide through pipe 62.
It will be apparent that the described embodiments are only some, but not all, embodiments of the invention. All other embodiments, which can be made by those skilled in the art and which are included in the embodiments of the present invention without the inventive step, are intended to be within the scope of the present invention. Structures, devices and methods of operation not specifically described and illustrated herein, unless otherwise indicated and limited, are implemented according to conventional means in the art.
Claims (9)
1. The utility model provides a die pressing equipment of LED wafer coating fluorescent glue, includes fixed frame (1), the inner chamber sliding connection of fixed frame (1) has control slider (11), the inner chamber fixedly connected with joint connecting rod (12) of control slider (11), the equal fixedly connected with in both sides on fixed frame (1) surface is external inserted bar (15), the middle part fixedly connected with support frame (13) on external inserted bar (15) surface, the equal rotation in both ends of support frame (13) is connected with control reel (14), the middle part of control reel (14) inner chamber rotates and is connected with rolls up membrane area (17), its characterized in that:
the top of fixed frame (1) inner chamber sliding connection has vertical slide bar (24), the top fixedly connected with slip roof (2) of vertical slide bar (24), the axle center department fixedly connected with air inlet shell (21) at slip roof (2) surface top, the top fixedly connected with rotor motor (22) of air inlet shell (21) inner chamber, the surface fixedly connected with screw thread bull stick (23) of rotor motor (22) output shaft, the bottom sliding connection of slip roof (2) surface has vertical siphunculus (25), the middle part fixedly connected with external sleeve shell on vertical siphunculus (25) surface, and the surface fixedly connected with connecting device (3) of external sleeve, the bottom sliding connection of vertical siphunculus (25) inner chamber has solid push rod (27), the top fixedly connected with spring washer (26) of solid push rod (27), the bottom fixedly connected with cope mold (4) of vertical siphunculus (25);
connecting device (3) are including joint top cover (31), the equal fixedly connected with switching arc arm (32) in both ends of joint top cover (31), the middle part of switching arc arm (32) inner chamber rotates and is connected with rotary joint (33), the bottom of switching arc arm (32) rotates and is connected with bed die (5), the equal fixedly connected with vertical supporting leg (34) in both ends of rotary joint (33), the bottom fixedly connected with bottom plate piece (16) of supporting rack (13), the bottom of vertical supporting leg (34) and the surface sliding connection of bottom plate piece (16).
2. The die pressing device for coating fluorescent glue on LED wafer according to claim 1, wherein: the upper die (4) comprises a side insert block (41), the axis of the inner cavity of the upper die (4) is in sliding connection with the surface of the film rolling belt (17), one end, close to the film rolling belt (17), of the side insert block (41) is rotationally connected with a spring clamping plate (42), one side, close to the film rolling belt (17), of the inner cavity of the side insert block (41) is in sliding connection with a traction pull rod (44), two ends of the traction pull rod (44) are both in sliding connection with a fixed side shell (43), the surface of the fixed side shell (43) is fixedly connected with the inner cavity of the upper die (4), one side, close to the inner cavity of the fixed side shell (43), of the fixed side shell (43) is fixedly connected with a clamping spring (45), and the other side, close to the inner cavity of the fixed side shell (43), of the fixed side shell is fixedly connected with a control magnetic block.
3. The die pressing device for coating fluorescent glue on LED wafers as set forth in claim 2, wherein: a through socket is arranged at the axis of the top of the inner cavity of the upper die (4), the bottom end of the solid push rod (27) is connected with the inner cavity of the upper die (4) in a sliding way through the through socket, the bottom of the solid push rod (27) is in sliding connection with the surface of the film rolling belt (17) through a clamping cover, and the bottom of the upper die (4) is in sliding connection with the top of the lower die (5).
4. A die-casting apparatus for coating fluorescent glue on an LED die as recited in claim 3, wherein: the utility model discloses a fixed frame, including fixed frame (1) and outer cover shell, joint connecting rod (12), through-hole has evenly been seted up to the bottom of fixed frame (1) and the surface fixed connection of outer cover shell are kept away from to joint connecting rod (12), the top on vertical siphunculus (25) surface has cup jointed spring washer (26), and the top fixed connection of bottom and outer cover shell of spring washer (26), the surface of rolling up membrane area (17) is through running through the middle part sliding connection of grooving and last mould (4) inner chamber.
5. The die pressing device for coating fluorescent glue on LED wafer according to claim 1, wherein: the lower die (5) comprises a modified flat plate (51), a limiting top frame (55) is fixedly connected to the axis of the top of the inner cavity of the modified flat plate (51), a wafer plate (54) is fixedly connected to the top of the surface of the limiting top frame (55), a plug rod sliding plate (56) is slidably connected to the middle of the inner cavity of the limiting top frame (55), a rotating motor (57) is fixedly connected to the bottom of the inner cavity of the limiting top frame (55), and a thrust rotating plate (58) is fixedly connected to the surface of an output shaft of the rotating motor (57).
6. The die attach apparatus for coating phosphor paste on an LED die as recited in claim 5, wherein: the bottom fixedly connected with of repacking dull and stereotyped (51) surface removes slide leg (52), the inner chamber sliding connection who removes slide leg (52) has ball slide (53), the one side that spacing top frame (55) was kept away from to repacking dull and stereotyped (51) inner chamber is through adaptation slot fixedly connected with blast apparatus (6), the both sides on repacking dull and stereotyped (51) surface all rotate with the bottom of switching arc arm (32) and be connected.
7. The die pressing apparatus for coating fluorescent glue on LED wafer as set forth in claim 6, wherein: the top of spacing roof-box (55) inner chamber has evenly been seted up and has been run through the socket, the top of inserted bar slide (56) is through running through the top sliding connection of socket and spacing roof-box (55) inner chamber, the both sides of inserted bar slide (56) are all through the top fixed connection of spring area and spacing roof-box (55) inner chamber, the bottom sliding connection of thrust runner (58) surface and inserted bar slide (56) surface.
8. The die pressing apparatus for coating fluorescent glue on LED wafer as set forth in claim 6, wherein: the air blowing device (6) comprises an inserting cylinder shell (61), the top end of the inserting cylinder shell (61) is fixedly connected with a guiding through pipe (62), the top of an inner cavity of the inserting cylinder shell (61) is slidably connected with a movable sliding plug (63) through a socket, the bottom end of the movable sliding plug (63) is fixedly connected with a connecting spring, the bottom end of the connecting spring is fixedly connected with a separation shell (65), and the axial center of the inner cavity of the separation shell (65) is rotationally connected with a one-way fan blade (66).
9. The die pressing apparatus for coating fluorescent glue on an LED die as recited in claim 8, wherein: one side of the surface of the movable sliding plug (63) close to the wafer plate (54) is fixedly connected with a pressing connecting plate (64), the pressing connecting plate (64) is in sliding connection with the inner cavity of the plug-in cylinder shell (61) through a vertical sliding groove, the bottom end of the upper die (4) is in sliding connection with the top of the inner cavity of the refitting flat plate (51) through an adapting slot, and one end of the pressing connecting plate (64) far away from the movable sliding plug (63) is mutually extruded with the bottom end of the upper die (4).
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310051276.1A CN116053366B (en) | 2023-02-02 | 2023-02-02 | Film pressing equipment for coating fluorescent glue on LED wafer |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310051276.1A CN116053366B (en) | 2023-02-02 | 2023-02-02 | Film pressing equipment for coating fluorescent glue on LED wafer |
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| CN116053366A true CN116053366A (en) | 2023-05-02 |
| CN116053366B CN116053366B (en) | 2023-09-15 |
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| JP2005179141A (en) * | 2003-12-22 | 2005-07-07 | Sumitomo Heavy Ind Ltd | Press molding apparatus |
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| KR101939542B1 (en) * | 2018-08-31 | 2019-01-16 | 정성진 | Film forming device |
| US20190181030A1 (en) * | 2017-12-13 | 2019-06-13 | Beijing Chuangyu Technology Co., LTD | Separation Device and Separation Method for Film and Wafer |
| CN216708142U (en) * | 2021-12-20 | 2022-06-10 | 黄山永皓新材料科技有限公司 | Plastic product forming die |
| WO2022127031A1 (en) * | 2020-12-19 | 2022-06-23 | 浙江天台祥和实业股份有限公司 | Full-automatic rubber part demolding device |
| CN218315700U (en) * | 2022-08-22 | 2023-01-17 | 深圳鑫富艺科技股份有限公司 | Flexible supporting membrane compound equipment capable of reducing bubble quantity |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2005179141A (en) * | 2003-12-22 | 2005-07-07 | Sumitomo Heavy Ind Ltd | Press molding apparatus |
| US20190181030A1 (en) * | 2017-12-13 | 2019-06-13 | Beijing Chuangyu Technology Co., LTD | Separation Device and Separation Method for Film and Wafer |
| CN108556449A (en) * | 2018-04-05 | 2018-09-21 | 桐乡市洲泉佳力塑料制品厂 | A kind of reciprocal continuous film pressing device |
| CN108481881A (en) * | 2018-05-23 | 2018-09-04 | 东莞理工学院 | A kind of automatic film applicator of annular LED lamp tube |
| KR101939542B1 (en) * | 2018-08-31 | 2019-01-16 | 정성진 | Film forming device |
| WO2022127031A1 (en) * | 2020-12-19 | 2022-06-23 | 浙江天台祥和实业股份有限公司 | Full-automatic rubber part demolding device |
| CN216708142U (en) * | 2021-12-20 | 2022-06-10 | 黄山永皓新材料科技有限公司 | Plastic product forming die |
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| CN116053366B (en) | 2023-09-15 |
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