CN116053159A

CN116053159A - Semiconductor processing equipment

Info

Publication number: CN116053159A
Application number: CN202211318946.3A
Authority: CN
Inventors: 刘学滨; 李冬冬; 郭浩; 徐奎
Original assignee: Beijing Naura Microelectronics Equipment Co Ltd
Current assignee: Beijing Naura Microelectronics Equipment Co Ltd
Priority date: 2022-10-26
Filing date: 2022-10-26
Publication date: 2023-05-02
Anticipated expiration: 2042-10-26
Also published as: CN116053159B

Abstract

The application discloses a semiconductor process apparatus comprising a pre-clean process chamber (100), an impurity receiving liner (200) and a cooling plate (300), the pre-clean process chamber (100) having a chamber space (130); the cooling plate (300) is arranged in the cavity space (130); the impurity receiving liner (200) is arranged in the cavity space (130), the impurity receiving liner (200) comprises a cylindrical portion (210) and a top plate (220), the top plate (220) is attached to the cooling disc (300), the top plate (220) covers a port, adjacent to the cooling disc (300), of the cylindrical portion (210) and is connected with the cylindrical portion (210), and the top plate (220) and the cylindrical portion (210) enclose a pre-cleaning space (131). The scheme can solve the problem that the semiconductor process equipment related to the related technology has poor refrigerating effect.

Description

Semiconductor processing equipment

Technical Field

The application belongs to the technical field of semiconductor process equipment design, and particularly relates to a wafer supporting device and semiconductor process equipment.

Background

The pre-cleaning process is an important ring in the semiconductor process, and aims to remove oil stains, oxides and other impurities on the surface of the wafer before depositing the film, so that the wafer has a cleaner surface before depositing the film. It has been demonstrated that the pre-cleaning process significantly improves the adhesion of the deposited film during subsequent processing of the wafer, improving the electrical performance and reliability of the final formed chip.

The pre-cleaning process is usually performed in a pre-cleaning process chamber of a semiconductor process device, and in the pre-cleaning process, the pre-cleaning process chamber is provided with a refrigerant channel, a refrigerant is arranged in the refrigerant channel, and the impurity receiving lining is cooled by the refrigerant. However, the semiconductor processing apparatus according to the related art has a problem in that the cooling effect is not good. In addition, the part of the pre-cleaning process chamber provided with the refrigerant channel is in contact with the external environment of the semiconductor process equipment, so that frosting and icing phenomena are easily caused. In the overhaul process, the frosted and frozen parts are easy to melt and drip, so that an alarm is triggered by mistake, and the normal overhaul operation is affected.

Disclosure of Invention

The invention discloses semiconductor process equipment, which aims to solve the problem of poor cooling effect of the semiconductor process equipment related to the related technology.

In order to solve the technical problems, the invention provides the following technical scheme:

a semiconductor processing apparatus includes a pre-clean process chamber, an impurity receiving liner, and a cooling plate, wherein,

the pre-cleaning process chamber is provided with a chamber space, and the cooling disc is arranged in the chamber space;

the impurity is accepted the inside lining and is located in the cavity space, the impurity is accepted the inside lining and is included tube-shape portion and roof, the roof with the cooling disk laminating, the roof covers tube-shape portion's the neighbouring the port of cooling disk, and with tube-shape portion links to each other, the roof with tube-shape portion encloses into the pre-cleaning space.

The technical scheme adopted by the invention can achieve the following technical effects:

the semiconductor process equipment disclosed by the embodiment of the application is improved in the structure of the semiconductor process equipment in the related technology, and the components (namely the cooling disc) for cooling the impurity receiving lining are all arranged in the cavity space, so that the phenomenon that frost and ice are easy to occur in the vicinity of the exposed part due to the fact that the cooling disc is exposed can be avoided, and false alarm caused by melting and dripping of frost during maintenance of the semiconductor process equipment can be relieved.

Meanwhile, the cooling disc arranged in the cavity space is attached to the top plate of the impurity-bearing lining, so that the contact area between a component for cooling the impurity-bearing lining and the impurity-bearing lining can be increased, efficient heat conduction is facilitated, and the cooling effect of the impurity-bearing lining can be improved finally. In this case, there is no need to adopt a mode of waiting for cooling by additionally introducing a heat conducting medium due to poor cooling effect in the related art, which can certainly reduce shutdown cooling, and thus is beneficial to improving the equipment productivity of the semiconductor process equipment. Of course, because the heat conducting medium does not need to be introduced, and the impurity bearing lining can be continuously and well cooled by the cooling disc, the situation that the impurity bearing lining is repeatedly expanded with heat and contracted with cold to cause the impurity attached to the impurity bearing lining to fall off does not occur.

Drawings

Fig. 1 is a schematic structural view of a semiconductor processing apparatus disclosed in an embodiment of the present application;

FIG. 2 is a schematic view of the structure of an upper receiving ring disclosed in an embodiment of the present application;

FIG. 3 is an enlarged schematic view of a portion A of FIG. 2;

FIG. 4 is a schematic view of a partial structure of a semiconductor processing apparatus disclosed in an embodiment of the present application;

FIGS. 5 and 6 are schematic views of the impurity receiving liner of the present disclosure from different perspectives;

FIGS. 7 and 8 are schematic views of the cooling plate according to the embodiment of the present application, respectively, from different angles of view;

FIG. 9 is a schematic diagram illustrating a cooling plate having a first refrigerant channel;

FIG. 10 is a schematic view of the structure of a chamber cover disclosed in an embodiment of the present application;

FIG. 11 is a schematic view of the structure of a first joint or a second joint disclosed in an embodiment of the present application;

FIG. 12 is a schematic structural view of a mounting bracket disclosed in an embodiment of the present application;

FIG. 13 is a schematic view of a portion of the structure of FIG. 12;

fig. 14 is an exploded schematic view of a part of the structure of the semiconductor processing apparatus disclosed in the embodiment of the present application.

Reference numerals illustrate:

100-pre-clean process chamber, 110-chamber body, 110 a-coil installation space, 111-upper receiving ring, 1111-supporting surface, 1112-positioning boss, 112-magnetic shield cartridge, 113-lower receiving ring, 114-insulating cartridge, 115-radio frequency coil, 116-third vent hole, 120-chamber cover, 121-second connecting hole, 122-connector, 123-first vent hole, 124-second vent hole, 125-first seal isolation structure, 126-first pressure balance hole, 127-second pressure balance hole, 128-second seal isolation structure, 125 a-first annular boss, 125 b-first seal ring, 128 a-third annular boss, 128 b-third seal ring, 129-first inlet section, 1210-second annular boss, 1211-second seal ring, 1213-second refrigerant channel, 1213 a-second refrigerant inlet, 1213 b-second refrigerant outlet, 1214-first vent hole, 1215-flange, 1216-positioning surface, 130-chamber space, 131-pre-clean space, 101-elastic ground connection, 140-elastic ground connection, and elastic ground connection mechanism,

200-impurity receiving lining, 210-cylindrical part, 211-strip hole, 220-top plate, 221-first groove, 222-third air inlet section, 223-first auxiliary screw hole, 224-first mark,

300-cooling disk, 301-sinking groove, 302-first connecting hole, 303-air guide groove, 304-first refrigerant channel, 3041-first refrigerant inlet, 3042-first refrigerant outlet, 305-first joint, 306-second joint, 307-second air inlet section, 300 a-connecting protrusion, 308-second auxiliary threaded hole, 309-third mark,

400-mounting bracket, 410-fixing bracket, 420-rotating shaft, 430-connecting arm,

500-grounding cover body, 600-fan,

700-wafer carrying device, 810-dry pump, 820-cold pump, 830-lower matcher, 840-upper matcher, 850-clasper.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be clearly and completely described below with reference to specific embodiments of the present invention and corresponding drawings. It will be apparent that the described embodiments are only some, but not all, embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.

The technical scheme disclosed by each embodiment of the invention is described in detail below with reference to the accompanying drawings.

Referring to fig. 1 to 14, a semiconductor processing apparatus is disclosed in an embodiment of the present application. The disclosed semiconductor process equipment is a pre-cleaning equipment for pre-cleaning a wafer, thereby pre-cleaning impurities such as dirt, oxide and the like on the surface of the wafer. Pre-cleaning the wafer is a critical operation for subsequent processing (e.g., etching) of the wafer.

Referring to fig. 1, a semiconductor processing apparatus according to an embodiment of the present application includes a pre-clean process chamber 100, an impurity receiving liner 200, and a cooling plate 300.

The pre-clean process chamber 100 is a body member of a semiconductor processing apparatus that implements pre-cleaning. The pre-clean process chamber 100 has a chamber volume 130. Specifically, the pre-cleaning process chamber 100 may include a chamber body 110 and a chamber cover 120, wherein the chamber cover 120 is connected to the chamber body 110 and may enclose a chamber space 130.

Specifically, the chamber cover 120 may be detachably mounted on the chamber body 110, so as to enclose a chamber space 130 with the chamber body 110. Of course, the chamber cover 120 can be detached by being separated from the chamber body 110. Of course, in this case, the pre-cleaning process chamber 100 is in an open state, and an operator can perform operations such as overhauling, maintenance, etc. on the inside of the pre-cleaning process chamber 100.

In other embodiments, the chamber lid 120 may be movably coupled (e.g., rotatably coupled, slidably coupled, etc.) to the chamber body 110 to manipulate the chamber lid 120 relative to the chamber body 110 to enable the pre-clean process chamber 100 to be opened or closed. The manner in which the chamber cover 120 is movably connected to the chamber body 110 is particularly varied, and is not limited in this application.

It will be appreciated by those skilled in the art that with the chamber lid 120 coupled to the chamber body 110 and enclosing the chamber space 130, the chamber lid 120 sealingly engages the chamber body 110 such that a vacuum environment is created within the chamber space 130 during the pre-cleaning process.

The impurity receiving liner 200 is a member lining the pre-clean process chamber 100, and the impurity receiving liner 200 is disposed in the chamber space 130. During the pre-cleaning process, impurities such as dirt and oxide sputtered from the surface of the wafer adhere to the impurity receiving liner 200. Of course, after the impurities adhering to the impurity receiving liner 200 are deposited to a certain extent, the operator may open the chamber cover 120, and then take out the impurity receiving liner 200 from the chamber space 130 for subsequent cleaning operations.

The cooling plate 300 is a cooling structure, and the cooling plate 300 is mainly used for cooling the impurity receiving liner 200, so as to avoid the problem that the temperature of the impurity receiving liner 200 is too high to be beneficial to the pre-cleaning process. The cooling plate 300 may have a flat plate-like structure, or may have other structures, and the embodiment of the present application is not limited to the specific structure of the cooling plate 300.

In the embodiment of the present application, the cooling plate 300 is provided in the chamber space 130, thereby cooling the impurity receiving liner 200 provided in the chamber space 130. Optionally, the cooling plate 300 is coupled to the chamber cover 120, thereby enabling the mounting of the cooling plate 300 within the chamber space 130. Of course, the cooling plate 300 may also be coupled to the chamber body 110 to achieve installation within the chamber space 130. The specific manner of assembly of cooling disk 300 is not limited by this application.

Considering that the chamber cover 120 can be opened, in the preferred embodiment, the cooling plate 300 is connected to the chamber cover 120, and then can move to a position convenient for disassembly and assembly along with the chamber cover 120, so as to achieve the purpose of facilitating disassembly and assembly of the cooling plate 300.

To improve the stability of the assembly, avoiding movement during the pre-cleaning process, the cooling plate 300 may be fixed in a fixed manner within the chamber space 130. Taking the case that the cooling plate 300 is connected to the chamber cover 120 as an example, the cooling plate 300 and the chamber cover 120 may be connected in a fixed manner. Specifically, the cooling plate 300 and the chamber cover 120 may be welded, riveted, clamped, connected by a connector (such as the connector 122 described below), and the like, and the embodiment of the present application does not limit the specific connection manner between the cooling plate 300 and the chamber cover 120.

The impurity receiving liner 200 includes a cylindrical portion 210 and a top plate 220, and the top plate 220 is bonded to the cooling plate 300, thereby realizing contact heat conduction over a large area. The top plate 220 covers a port of the cylindrical portion 210 adjacent to the cooling plate 300 (i.e., a first port of the cylindrical portion 210) and is connected to the cylindrical portion 210. The top plate 220 and the cylindrical portion 210 enclose a pre-cleaning space 131. The pre-clean space 131 is essentially a portion of the chamber space 130. In order to make the pre-cleaning space 131 as large as possible, the cylindrical portion 210 may be disposed next to the inner wall of the pre-cleaning process chamber 100 surrounding the chamber space 130.

Of course, the port of the cylindrical portion 210 that is remote from the cooling disc 300 (i.e., the second port of the cylindrical portion 210) is not covered. The semiconductor processing apparatus further includes a wafer carrier 700. In a specific pre-cleaning process, the wafer carrier 700 can pass the wafer carried by the wafer carrier through the second port into the pre-cleaning space 131, so that the wafer can be subjected to the pre-cleaning process in the pre-cleaning space 131. The first port and the second port are two ports opposite to each other in the cylindrical portion 210, and the first port is located above the second port.

The top plate 220 and the cylindrical portion 210 may be connected by welding, caulking, connection by a connector (e.g., screw), or the like. Of course, the top plate 220 and the cylindrical portion 210 may be of a unitary structure, which can reduce in-situ assembly operations, thereby facilitating installation of the impurity receiving liner 200 within the chamber space 130. The specific connection manner of the top plate 220 and the cylindrical portion 210 is not limited in the embodiments of the present application.

The semiconductor processing equipment disclosed in the embodiment of the present application improves the structure of the semiconductor processing equipment in the related art, and the components for cooling the impurity receiving liner 200 (i.e., the cooling disc 300) are all disposed in the chamber space 130, so that the phenomenon that frost and ice are easily formed in the vicinity of the exposed portion due to the exposure of the cooling disc 300 can be avoided, and false alarm caused by water drops when frost melting and water dropping during maintenance of the semiconductor processing equipment can be relieved.

Meanwhile, the cooling plate 300 placed in the chamber space 130 is attached to the top plate 220 of the impurity receiving liner 200, so that the contact area between the impurity receiving liner 200 and the member for cooling the impurity receiving liner 200 can be increased, efficient heat conduction is facilitated, and finally the cooling effect of the impurity receiving liner 200 can be improved. In this case, there is no need to adopt a mode of waiting for cooling by additionally introducing a heat conducting medium due to poor cooling effect in the related art, which can certainly reduce shutdown cooling, and thus is beneficial to improving the equipment productivity of the semiconductor process equipment. Of course, since the heat transfer medium does not need to be introduced, and the impurity receiving liner 200 can be cooled continuously by the cooling pan 300, the impurity receiving liner 200 is not repeatedly expanded with heat and contracted with cold, and the impurities attached to the impurity receiving liner 200 are not removed.

The chamber body 110 is the body portion of the pre-clean process chamber 100. The structure of the chamber body 110 may be various. For example, the chamber body 110 may be a unitary structure or a split structure. In view of flexible assembly and adaptively configuring the respective functional components, in an alternative, the chamber body 110 may include an upper receiving ring 111, a magnetic shielding cylinder 112, a lower receiving ring 113, an insulating cylinder 114, and a radio frequency coil 115, the magnetic shielding cylinder 112 and the insulating cylinder 114 being supported between the upper receiving ring 111 and the lower receiving ring 113, the upper receiving ring 111 being located above the lower receiving ring 113. The insulating cylinder 114 is sleeved outside the cylindrical portion 210 of the impurity receiving liner 200, and a first gap is formed between the insulating cylinder 114 and the cylindrical portion, so that the problem that the impurity receiving liner 200 is inconvenient to assemble and disassemble due to the fact that the impurity receiving liner 200 is too close to the insulating cylinder 114 can be avoided.

The magnetic shielding cylinder 112 is sleeved outside the insulating cylinder 114 with a second gap therebetween, and the upper receiving ring 111 and the lower receiving ring 113 are respectively blocked at two ends of the second gap, thereby enclosing a coil installation space 110a, and the radio frequency coil 115 can be installed inside the coil installation space 110 a. The magnetic shielding cylinder 112 not only can form the coil installation space 110a, but also can prevent radio frequency energy from escaping into the external environment where the semiconductor process equipment is located, thereby achieving the purpose of dual purposes. Of course, the rf coil 115 is installed in the coil installation space 110a, and can be well protected from damage due to exposure.

The semiconductor process equipment disclosed in the embodiments of the present application may include an upper matcher 840 and a lower matcher 830, where the upper matcher 840 is connected to the rf coil 115, and the lower matcher 830 is connected to the wafer carrier 700.

During a particular pre-clean process, a portion of the rf energy is coupled into the rf coil 115 through the upper match 840, and then the rf coil 115 is energized such that the portion of the rf energy enters the chamber volume 130 and ionizes the process gas (e.g., argon) within the chamber volume 130, thereby generating a plasma. Another part of the rf energy is connected to the wafer carrier 700 through the lower matcher 830, and generates a negative bias voltage on the wafer carrier 700, where the negative bias voltage attracts the plasma in the pre-cleaning space 131 to bombard the wafer on the wafer carrier 700, so as to remove the impurities such as oxide, oil stain, etc. attached to the surface of the wafer. During this process, sputtered impurities may adhere to the impurity receiving liner 200. Of course, in order not to block the rf energy, the cylindrical portion 210 of the impurity receiving liner 200 is provided with a plurality of strip-shaped holes 211, and the plurality of strip-shaped holes 211 are distributed along the circumferential direction of the cylindrical portion 210. During operation, rf energy entering the chamber volume 130 passes through the strip holes 211 and further enters the pre-clean volume 131 to assist in the pre-clean process. Of course, impurities sputtered from the wafer may pass through the strip-shaped holes 211 and adhere to the insulating cylinder 114. Thus, at intervals, it is necessary to detach the impurity receiving liner 200 and the insulating cylinder 114 for subsequent cleaning, and the insulating cylinder 114 can be reattached for reuse after cleaning.

In the embodiment of the present application, the insulating cylinder 114 may be a ceramic cylinder, or may be a cylindrical insulating member made of other insulating materials, which is not limited to the specific material of the insulating cylinder 114 in this application.

In order to facilitate the disassembly and assembly of the impurity receiving liner 200, in an alternative embodiment, the surface of the top plate 220 facing the cooling plate 300 may be provided with a first auxiliary threaded hole 223, and in the process of disassembling and assembling the impurity receiving liner 200, an operator may connect a first auxiliary disassembly and assembly screw member to the first auxiliary threaded hole 223, and then hoist the entire impurity receiving liner 200 from the chamber space 130 by lifting the first auxiliary disassembly and assembly screw member to achieve disassembly or hoist the entire impurity receiving liner 200 into the chamber space 130 to achieve assembly. This structure can reduce the contact with the impurity receiving liner 200 during the disassembly and assembly process, and further avoid the adverse effect on the impurity receiving liner 200. Moreover, by means of the first auxiliary dismounting screw member being matched with the first auxiliary screw hole 223, the impurity receiving liner 200 has a good acting point in the dismounting process, so that the operation of dismounting the impurity receiving liner 200 becomes easier.

Specifically, the number of the first auxiliary screw holes 223 may be plural (e.g., 2), and the first auxiliary screw holes 223 may be symmetrically distributed with respect to the center of the top plate 220. The symmetrical structure can facilitate the balanced lifting of the impurity receiving liner 200 during the disassembly and assembly process.

In order to facilitate accurate assembly, the top plate 220 may be provided with a first identifier 224, and correspondingly, a second identifier may be provided in the chamber space 130, so that in the process of assembling the impurity receiving liner 200, once the first identifier 224 is opposite to the second identifier, it is indicated that the impurity receiving liner 200 is accurate in the circumferential direction of the cylindrical portion 210, and subsequent corresponding operations may be performed. The first identifier 224 and the second identifier may be arrow identifiers, and may also be other identifiers, which are not limited by the embodiments of the present application.

Similarly, in order to facilitate the disassembly of the cooling disc 300, in an alternative solution, the surface of the cooling disc 300 facing the chamber cover 120 may be provided with a second auxiliary threaded hole 308, and in the process of disassembling the cooling disc 300, an operator may connect the second auxiliary disassembly threaded member to the second auxiliary threaded hole 308, and then, by lifting the second auxiliary disassembly threaded member, the entire cooling disc 300 is taken out from the chamber space 130 to achieve disassembly or the entire cooling disc 300 is lifted into the chamber space 130 to achieve assembly. This structure can reduce contact with the cooling plate 300 during the mounting and dismounting process, and further avoid adverse effects on the cooling plate 300. Moreover, by means of the cooperation of the second auxiliary dismounting screw member and the second auxiliary screw hole 308, the cooling disc 300 has a better acting point in the dismounting process, so that the operation of dismounting the cooling disc 300 becomes easier.

Specifically, the number of the second auxiliary screw holes 308 may be plural (e.g., 2), and the second auxiliary screw holes 308 may be symmetrically distributed with respect to the center of the cooling plate 300. This symmetrical structure can facilitate balanced lifting of the cooling pan 300 during disassembly and assembly.

In a preferred embodiment, the first auxiliary screw hole 223 and the second auxiliary screw hole 308 have the same specifications, so that the first auxiliary screw member and the second auxiliary screw member have the same specifications. In this case, the inner liner 200 and the cooling disk 300 can be attached and detached only by one of the first auxiliary attachment/detachment screw member and the second auxiliary attachment/detachment screw member, and no more components need to be disposed.

As described above, the chamber body 110 may include a radio frequency coil 115. During specific operation, the RF coil 115 may emit more heat. In order to avoid the temperature of the rf coil 115 being too high, in an alternative solution, the semiconductor process apparatus disclosed in the embodiments of the present application may further include a fan 600, where the coil installation space 110a may be in communication with an external environment of the semiconductor process apparatus, so that the rf coil 115 installed in the coil installation space 110a exchanges heat with the external environment (in an air convection manner).

The fan 600 is used for driving the air in the coil installation space 110a to exchange heat with the air in the external environment in a convection manner so as to realize heat dissipation of the rf coil 115, and achieve the purpose of avoiding the temperature of the rf coil 115 from being too high. Of course, it should be noted that, in this context, the coil installation space 110a is sealed from the chamber space 130. That is, the coil installation space 110a communicating with the external environment where the semiconductor process equipment is located is not communicated with the chamber space 130, so as to avoid the influence on the vacuum environment of the chamber space 130 during the process.

In a further aspect, the semiconductor processing apparatus disclosed in the embodiments of the present application may further include a grounding cover 500. As described above, the chamber body 110 is provided with the coil installation space 110a, the chamber body 110 may include the rf coil 115, the rf coil 115 is disposed in the coil installation space 110a, the ground cover 500 may be covered on the chamber cover 120 and enclose the first ventilation space 101 with the pre-cleaning process chamber 100, the chamber body 110 may be provided with the first ventilation hole 1214, in case that the chamber body 110 includes the upper receiving ring 111, the first ventilation hole 1214 may be opened on the upper receiving ring 111, the structure of the chamber body 110 for enclosing the coil installation space 110a is provided with the second ventilation hole communicating with the external environment of the semiconductor process equipment, the first ventilation space 101, the first ventilation hole 1214, the coil installation space 110a and the second ventilation hole are sequentially communicated to form a heat dissipation channel sealed from the chamber space 130, and the fan 600 is disposed on the ground cover 500 for delivering air in the external environment of the semiconductor process equipment into the first ventilation space 101 or delivering air in the first ventilation space 101 into the external environment of the semiconductor process equipment.

In a specific operation, the fan 600 drives air into the first ventilation space 101, and the air entering the first ventilation space 101 passes through the first ventilation hole 1214 and the coil installation space 110a in sequence, and flows into the external environment of the semiconductor processing equipment from the second ventilation hole. Of course, the fan 600 may also drive the first ventilation space 101 to flow into the external environment of the semiconductor processing apparatus, in which case air in the external environment of the semiconductor processing apparatus may enter the first ventilation space 101 by entering the second ventilation hole and thus passing through the coil installation space 110a and the first ventilation hole 1214.

The ground cover 500 is a grounded cover that facilitates the ground connection of some components of the semiconductor processing equipment that require grounding (e.g., the resilient ground 150 described below). These components requiring grounding may be directly or indirectly electrically connected to the grounding cap 500 to achieve grounding. The grounding cover 500 not only plays a role of constituting the first ventilation space 101, but also plays a role of grounding, thereby achieving a multipurpose effect.

At the same time, in such a manner that the ground cover 500 is provided on the chamber cover 120 and forms the first ventilation space 101 with the chamber cover 120, not only heat dissipation can be performed on the rf coil 115, but also heat dissipation can be performed on the chamber cover 120. In addition, the ground cover 500 is a member with a large volume to cover the chamber cover 120, and the fan 600 with a large volume is provided on the ground cover 500, thereby facilitating the installation of the fan 600. The fan 600 is prevented from being mounted on the chamber body 110 having a relatively crowded structure.

As described above, the first ventilation hole 1214 communicates with the first ventilation space 101. In a preferred embodiment, the chamber cover 120 has a wider flange 1215, as shown in fig. 10, the flange 1215 can ensure that the chamber cover 120 and the chamber body 110 have a larger assembly area, so as to be beneficial to improving the stability of assembly. Of course, it is also advantageous to provide functional components such as a sealing structure between the chamber cover 120 and the chamber body 110.

Based on this, in a further alternative, the chamber cover 120 may be provided with a third vent hole 116, and the third vent hole 116 may be opened on the flange 1215. The first vent 1214 is opposite the third vent 116, the first vent 1214. Specifically, the first ventilation hole 1214 may communicate with the first ventilation space 101 through the third ventilation hole 116, and accordingly, the third ventilation hole 116 may communicate with the coil installation space 110a through the first ventilation hole 1214.

In order to facilitate the installation of the ground cover 500 on the chamber cover 120, the chamber cover 120 may be provided with a step positioning surface 1216, and the ground cover 500 is covered on the chamber cover 120 and is matched with the step positioning surface 1216 in a positioning manner, so that the positioning installation of the ground cover 500 on the chamber cover 120 is facilitated. Of course, the step locating surface 1216 can provide support for the ground cover 500. As shown in fig. 10, in a preferred embodiment, the step positioning surfaces 1216 may be two and symmetrically disposed on both sides of the center of the chamber cover 120. The two step locating surfaces 1216 clearly enable the ground shield 500 to be located and supported relatively uniformly in the chamber cover 120.

As described above, the cooling plate 300 may be fixed with the chamber cover 120. The cooling plate 300 is fixed to the chamber cover 120, thereby realizing the installation of the cooling plate 300. In the embodiment of the present application, the chamber body 110 may have a supporting surface 1111, and the chamber cover 120 may be supported on the supporting surface 1111 in a lap joint manner. Of course, a sealing member may be disposed between the chamber cover 120 and the supporting surface 1111, so that the sealing performance of the chamber cover 120 and the chamber body 110 is easily ensured. Of course, in the case where the chamber body 110 includes the upper receiving ring 111, the support surface 1111 may be an end surface of the upper receiving ring 111 facing the chamber cover 120. Of course, the support surface 1111 is dependent on the specific structure of the chamber body 110, and the embodiments of the present application do not limit what kind of member the support surface 1111 is specifically formed on the chamber body 110.

The chamber cover 120 is supported on the supporting surface 1111, and the cooling plate 300 is fixedly connected to the chamber cover 120, and the top plate 220 is attached to the cooling plate 300. In this case, the top plate 220 may also directly overlap the support surface 1111. However, in consideration of processing errors, in the case where both the top plate 220 and the chamber cover 120 overlap the supporting surface 1111, it is difficult to ensure that the top plate 220 is further bonded to the cooling plate 300 with high quality of surface-to-surface due to the processing errors. In this regard, in a preferred embodiment, the supporting surface 1111 is provided with an elastic supporting member 140, and the elastic supporting member 140 is elastically supported between the supporting surface 1111 and the top plate 220, and the elastic supporting member 140 has an elastic restoring force, so that it can act on the top plate 220. The elastic support 140 urges the top plate 220 to closely fit the cooling plate 300.

This kind of structure can make after the in-process of installation, the cavity lid 120 supports on the holding surface 1111, elastic support spare 140 elastic support is between holding surface 1111 and roof 220, along with the cavity lid 120 is pressed on the holding surface 1111, elastic support spare 140 can compress, and then drive roof 220 through self elastic deformation, and then make roof 220 and cavity lid 120 take place to contradict, finally can guarantee to form better laminating effect between roof 220 and the cavity lid 120, this can guarantee better heat conduction laminating, be favorable to guaranteeing the cooling effect better.

In the embodiment of the present application, the elastic supporting member 140 may be a coil spring, a torsion spring, or other elastic structural members made of elastic high temperature resistant materials. The specific structure and materials of the elastic support 140 are not limited in the embodiments of the present application. In the alternative, the spring support 140 may be a push-in ball plunger. The pressed ball plunger is a standard component, and is easy to purchase and assemble.

In the embodiment of the present application, the number of the elastic supporting members 140 may be one or more, and the embodiment of the present application does not limit the number of the elastic supporting members 140.

Referring to fig. 5 and 6, in a preferred embodiment, a plurality of first grooves 221 may be formed on an edge of the top plate 220. The first groove 221 has a first bottom wall facing the supporting surface 1111, the supporting surface 1111 is provided with a plurality of positioning protrusions 1112, and the elastic supporting member 140 is respectively elastically supported between the opposite positioning protrusions 1112 and the opposite first bottom wall, wherein, among the plurality of positioning protrusions 1112, at least a part of the positioning protrusions 1112 are matched with the first groove 221 opposite to the positioning protrusions 1112, thereby realizing positioning of the impurity receiving liner 200 and further improving the installation effect of the impurity receiving liner 200.

Of course, among the plurality of positioning protrusions 1112, all of the positioning protrusions 1112 and the first groove 221 opposite thereto may be in positioning engagement. In a preferred embodiment, among the plurality of positioning protrusions 1112 (i.e., all of the positioning protrusions 1112), a part of the positioning protrusions 1112 is in positioning engagement with the first groove 221 opposite thereto; another part of the positioning protrusions 1112 has a gap between the side wall of the first groove 221 opposite thereto. The assembly mode can play a role in positioning and assembling, and can also avoid the problem that all positioning protrusions 1112 are matched with the opposite first grooves 221 in a positioning manner, so that the disassembly and assembly are difficult due to excessive constraint.

In this structure, the positioning protrusions 1112 protrude from the supporting surface 1111, and the positioning protrusions 1112 are configured to place the elastic supporting member 140 on the positioning protrusions 1112, which is equivalent to the positioning protrusions 1112 lifting the elastic supporting member 140, so that a larger compression amount of the elastic supporting member 140 is more facilitated, and further, the elastic supporting member 140 applies a larger elastic force to the top plate 220, so that the elastic supporting member 140 drives the top plate 220 to better adhere to the cooling disc 300.

It should be noted that the positioning protrusions 1112 and the opposing positioning protrusions that position the first groove 221 described above refer to positioning protrusions 1112 and the first groove 221 that are aligned in the circumferential direction of the cylindrical portion 210. The positioning protrusions 1112 are engaged with the first grooves 221 to prevent the impurity receiving liner 200 from moving in the circumferential direction of the cylindrical portion 210.

In a further embodiment, the positioning protrusions 1112 are provided with second grooves, and a portion of the elastic supporting member 140 extends into the second grooves and is matched with the second grooves in a positioning manner, that is, positioning in a plane perpendicular to the extending direction of the elastic supporting member 140 is achieved. The second groove has a second bottom wall facing the top plate 220, and the elastic support 140 is elastically supported between the first bottom wall and the second bottom wall. In this case, the elastic support 140 can be stably engaged with the positioning protrusion 1112 by being engaged with the positioning of the second groove, so as to prevent the elastic support 140 from tilting, sideslip, etc.

In a preferred embodiment, when there are a plurality of elastic supports 140, all the elastic supports 140 are spaced apart along the circumferential direction of the cylindrical portion 210, so that a more uniform support is achieved, and an excessive number of elastic supports 140 can be avoided. In a further embodiment, the plurality of elastic supporting members 140 are uniformly distributed along the circumferential direction of the cylindrical portion 210, thereby achieving more uniform support. In a specific embodiment, as shown in fig. 2, the number of the elastic supporting members 140 may be 6, and the 6 elastic supporting members 140 are uniformly distributed, and the central angle between two adjacent elastic supporting members is 60 ° in the corresponding circumferential direction.

As described above, the chamber body 110 may include the upper receiving ring 111, in which case the end surface of the upper receiving ring 111 facing the chamber cover 120 is the supporting surface 1111. In an alternative, the supporting surface 1111 or a surface of the chamber cover 120 opposite to the supporting surface 1111 may be provided with a first mounting groove, in which a sealing ring may be mounted, and the chamber cover 120 may be connected with the supporting surface 1111 by sealing the sealing ring. This approach has the advantage of simple structure. Of course, in the case where the chamber cover 120 includes the flange 1215, the first mounting groove may be opened on a surface of the flange 1215 facing the support surface 1111.

Because the supporting surface 1111 is an assembly surface, in order to avoid the escape of rf energy between the two assembly surfaces, in a preferred embodiment, a second mounting groove may be formed on the surface of the supporting surface 1111 or the chamber cover 120 opposite to the supporting surface 1111, and an induction coil may be mounted in the second mounting groove. When the radio frequency energy enters between the assembly surfaces, the induction coil can induce an induction current, and the induction coil is grounded (for example, can be electrically connected with the grounding cover 500), so that the induction current can be grounded, and the radio frequency energy can be prevented from escaping into the external environment where the semiconductor process equipment is located through between the assembly surfaces. The principle of inducing the coil to prevent the escape of radio frequency energy from between the mounting surfaces is known in the art and will not be described in detail herein.

In the present embodiment, the support surface 1111 may be grounded to prevent rf energy from escaping to the surrounding environment.

In a specific working process, the impurity receiving liner 200 needs to be grounded, and various grounding modes and structures can be implemented. Referring to fig. 4, in an alternative, an inner wall of the chamber body 110 facing the cylindrical portion 210 may be provided with an elastic grounding member 150, and the elastic grounding member 150 contacts the cylindrical portion 210, thereby achieving an electrical connection to ground. The elastic grounding member 150 may be a conductive spring, a conductive spring sheet, or the like. The elastic grounding 150 can achieve elastic connection with the cylindrical portion 210, thereby ensuring stability of contact.

In the case where the chamber body 110 includes the upper receiving ring 111, the elastic grounding member 150 may be provided between the inner wall of the upper receiving ring 111 and the cylindrical portion 210.

Specifically, the elastic grounding member 150 may be a beryllium copper reed, that is, the elastic grounding member 150 may be a metal spring sheet made of beryllium copper. The specific materials of the elastic grounding member 150 are not limited in the embodiments of the present application.

Of course, the elastic grounding 150 may be detachably mounted on the inner wall of the chamber body 110 facing the cylindrical portion 210. In this way, when the elastic grounding member 150 is damaged, replacement can be achieved by disassembly. Specifically, the resilient ground 150 may be secured to the chamber body 110 by threaded fasteners 151. Of course, in the case where the chamber body 110 includes the upper receiving ring 111, the elastic grounding 150 may be mounted on the inner wall of the upper receiving ring 111 facing the cylindrical portion 210.

In order to achieve a more stable grounding connection, in a preferred embodiment, the elastic grounding members 150 are plural and are distributed at intervals around the circumferential direction of the cylindrical portion 210. In a further embodiment, all the elastic grounding members 150 enclose an elastic positioning space, and the cylindrical portion 210 is positioned in the elastic positioning space. In this case, the elastic grounding member 150 not only plays a role of grounding connection, but also can cooperate with each other to form an elastic positioning space, so that the position of the impurity receiving liner 200 is restricted by positioning cooperation with the cylindrical portion 210, and occurrence of play is avoided.

As described above, the cooling plate 300 is connected to the chamber cover 120. The cooling plate 300 may be attached to the inner wall of the chamber cover 120 and fixedly connected to the inner wall of the chamber cover 120. In another alternative, the first surface of the cooling plate 300 facing the chamber cover 120 may be provided with a plurality of coupling protrusions 300a, and the plurality of coupling protrusions 300a are coupled with the chamber cover 120. In this case, the plurality of connection protrusions 300a are supported between the cooling plate 300 and the chamber cover 120, and in this manner, the connection is achieved by the plurality of connection protrusions 300a, so that the cooling plate 300 and the chamber cover 120 can be prevented from contacting with each other in a larger area, and the temperature of the chamber cover 120 can be prevented from being too low due to the larger contact area between the cooling plate 300 and the chamber cover 120. It should be understood by those skilled in the art that the lower temperature of the chamber cover 120 may cause frosting and icing on the outer surfaces of the chamber cover 120 and the external environment where the semiconductor processing equipment is located, which is clearly prone to causing a false alarm caused by dripping during maintenance.

Specifically, the plurality of connection protrusions 300a may be fixedly connected with the cavity cover 120 by using high temperature resistant glue in an adhesive manner, or may be connected by using a clamping and riveting manner. Referring to fig. 1, 7 and 8, a sinking groove 301 is formed on a second surface of the cooling disc 300, which is attached to the top plate 220, a first connecting hole 302 is formed on a bottom wall of the sinking groove 301, the first surface is opposite to the second surface, and the first connecting hole 302 penetrates through the connecting protrusion 300a from the bottom wall of the sinking groove 301 along a protruding direction of the connecting protrusion 300a; the chamber cover 120 is provided with a second connection hole 121, and the cooling plate 300 is fixedly connected with the first connection hole 302 and the second connection hole 121 by matching with the connection piece 122, and a part of the connection piece 122 is positioned in the sink 301. In this case, the connecting member 122 does not protrude from the second surface of the cooling plate 300 facing the top plate 220, and thus the adhesion between the top plate 220 and the cooling plate 300 is not affected. The connection 122 may be a screw, bolt, or the like. Of course, the second connection hole 121 may be a screw connection hole, accordingly.

As described above, in a particular pre-cleaning process, the chamber space 130 needs to be evacuated. Based on this, the semiconductor process apparatus disclosed in the embodiments of the present application further includes a dry pump 810 and a cold pump 820, and the dry pump 810 and the cold pump 820 are mounted on the chamber body 110 or connected to the chamber body 110 through corresponding pipes, and the dry pump 810 can enable the chamber space 130 to reach a medium vacuum. The cold pump 820 can bring the chamber space 130 to a high vacuum. In the embodiment of the present application, the medium vacuum and the high vacuum are relative concepts, and represent the relative concepts of the vacuum degrees of the medium vacuum and the high vacuum, and the embodiment of the present application does not limit the specific vacuum degree values of the medium vacuum and the high vacuum.

Because the cooling plate 300 is attached to the top plate 220, it is easy to make it difficult to smoothly discharge the air remaining in the sink 301, and therefore, referring to fig. 7 and 8, in a further technical solution, the second surface of the cooling plate 300 may be provided with an air guide groove 303, the air guide groove 303 corresponds to the sink 301, the first port of the air guide groove 303 is communicated with the sink 301, and the second port of the air guide groove 303 is located at the edge of the cooling plate 300 and located at the side surface of the cooling plate 300. The first surface may be considered as the top surface of the cooling plate 300, and the second surface may be considered as the bottom surface of the cooling plate 300, and the side surface of the cooling plate 300 may be located between the top surface of the cooling plate 300 and the bottom surface of the cooling plate 300. In this case, after the assembly of the semiconductor process equipment is completed, the cooling plate 300 is attached to the top plate 220, and in the process of vacuumizing, the air remaining in the immersion tank 301 is pumped out from the air guide tank 303 under the adsorption effect of the vacuum negative pressure, so that the air remaining in the immersion tank 301 is better ensured not to exist, and further, a better vacuum degree is ensured, and the pre-cleaning process condition is easier to be satisfied.

Specifically, the air guide grooves 303 may or may not correspond to the sinking grooves 301 one by one. Referring to fig. 7 and 8 again, in a preferred embodiment, the air guide grooves 303 and the sink grooves 301 are in a one-to-many relationship, that is, at least two sink grooves 301 may share one air guide groove 303, or one air guide groove 303 may pass through two sink grooves 301, in this case, the number of air guide grooves 303 can be reduced, so as to avoid the influence of the excessive air guide grooves 303 on the bonding area between the second surface of the cooling disc 300 and the top plate 220.

Referring again to fig. 7 and 8, in an alternative, the cooling plate 300 may be provided with a third identifier 309 and, correspondingly, a fourth identifier may be provided in the plenum 130. In the process of assembling the cooling disk 300, the third mark 309 is generally opposite to the fourth mark, which indicates that the cooling disk 300 is oriented accurately in the circumferential direction of the cylindrical portion 210, and a subsequent corresponding operation can be performed. The third identifier 309 and the fourth identifier may be arrow identifiers, but may also be other identifiers, which are not limited by the embodiments of the present application.

In the present embodiment, the cooling pan 300 plays a cooling role. Referring to fig. 9, specifically, the cooling plate 300 may be provided with a first refrigerant channel 304, where the first refrigerant channel 304 is provided with a first refrigerant inlet 3041 and a first refrigerant outlet 3042, the semiconductor process device further includes a first joint 305, a second joint 306, and a first refrigerant input pipe and a first refrigerant output pipe disposed outside the chamber space 130, the first joint 305 is in sealing butt joint with the first refrigerant inlet 3041, and a portion of the first joint 305 passes through the chamber cover 120 and is communicated with the first refrigerant input pipe; the second connector 306 is in sealing butt joint with the first refrigerant outlet 3042, and a part of the second connector 306 penetrates through the chamber cover 120 and is communicated with the first refrigerant output pipeline. The first joint 305 and the second joint 306 penetrating through the chamber cover 120 are respectively communicated with the first refrigerant input pipeline and the first refrigerant output pipeline, so that connection is realized in a shorter path.

In this embodiment, the first refrigerant channel 304 is filled with a first refrigerant, which may be cooling water or a refrigerant medium with better water refrigerating performance (such as low-temperature nitrogen, fluoride, etc.), and the embodiment of the present application does not limit the specific type of the first refrigerant.

The first refrigerant input pipeline and the first refrigerant output pipeline can be connected with a first refrigerant source, and the first refrigerant source can be a first refrigerant tank or a first heat exchanger. When the first refrigerant source is a first heat exchanger, the first heat exchanger exchanges heat to reduce the temperature of the first refrigerant, so that the first refrigerant enters the cooling disc 300 again to perform a cooling function.

Of course, the design of the first connector 305 and the second connector 306 through the chamber lid 120 is easier to cause the chamber space 130 to communicate with the external environment of the pre-clean process chamber 100, which eventually damages the vacuum environment within the chamber space 130. Based on this, the first and

second joints

305 and 306 may each be formed as a unitary structure using a unitary fabrication process, thereby avoiding leakage between the first and

second joints

305 and 306 and the chamber cover 120.

Of course, in a further technical solution, the chamber cover 120 may be provided with a first avoidance hole 123 and a second avoidance hole 124, and the first joint 305 is detachably matched with the cooling disc 300 and the chamber cover 120 respectively, and a portion of the first joint 305 passes through the first avoidance hole 123 and is communicated with the first refrigerant input pipeline. Similarly, the second connector 306 is detachably matched with the cooling disc 300 and the chamber cover 120 respectively, and a part of the second connector 306 passes through the second avoidance hole 124 and is communicated with the first refrigerant output pipeline. The first relief hole 123 is sealed from the chamber space 130 and the second relief hole 124 is sealed from the chamber space 130 so as not to affect the vacuum environment of the chamber space 130 during processing.

There are various ways to realize sealing isolation, in an alternative solution, two first sealing isolation structures 125 may be disposed between the cooling disc 300 and the chamber cover 120, where the two first sealing isolation structures 125 respectively surround the first joint 305 and the second joint 306 to respectively seal and isolate the first avoidance hole 123 from the chamber space 130 and the second avoidance hole 124 from the chamber space 130. Specifically, the first joint 305 only passes through the first avoidance hole 123, the first joint 305 is detachably and fixedly connected with the cooling disc 300 through a threaded connector, and a sealing element (for example, a fourth sealing ring) is arranged between the first joint 305 and the first refrigerant inlet 3041 of the cooling disc 300 to realize sealing butt joint of the first joint 305 and the cooling disc 300. Similarly, the second joint 306 only passes through the second avoidance hole 124, the second joint 306 and the cooling disc 300 can be detachably and fixedly connected through a threaded connector, and a sealing element (such as a fifth sealing ring) is arranged between the second joint 306 and the first refrigerant outlet 3042 of the cooling disc 300 to realize sealing butt joint of the second joint 306 and the cooling disc 300.

The first connector 305 and the second connector 306 can be detachably replaced, and the structure of the chamber cover 120 can be simplified, so that the chamber cover is convenient to manufacture.

In an alternative, the first sealing isolation structure 125 includes a first annular protrusion 125a and a first seal ring 125b. The first annular protrusion 125a is provided on a first surface of the cooling plate 300 facing the chamber cover 120. The first annular protrusion 125a surrounds the first refrigerant inlet 3041 or the first refrigerant outlet 3042, and the first seal ring 125b surrounds the first avoidance hole 123 or the second avoidance hole 124, and is clamped and fixed between the first annular protrusion 125a and the chamber cover 120. Compared with the structure that only the first sealing ring 125b is arranged between the chamber cover 120 and the cooling disc 300, in this structure, the first annular protrusion 125a is equivalent to raising the mating surface of the cooling disc 300 and the first sealing ring 125b, so that the first sealing ring 125b can be better compressed, and further, a larger deformation amount can be more easily obtained to ensure sealing.

In order to improve the stability of the first sealing ring 125b and avoid sideslip, as shown in fig. 7, in a further technical solution, a first annular groove is provided at the top end of the first annular protrusion 125a, and a portion of the first sealing ring 125b may be positioned in the first annular groove.

Referring to fig. 1 again and referring to fig. 10 together, in order to make the first joint 305 and the second joint 306 relatively easy to pass through the first avoidance hole 123 and the second avoidance hole 124, respectively, a gap is formed between the hole wall of the first avoidance hole 123 and the first joint 305, and a gap is formed between the hole wall of the second avoidance hole 124 and the second joint 306, and these gaps can make the first joint 305 and the second joint 306 bear the atmospheric pressure in the external environment of the pre-cleaning process chamber 100, which ultimately results in uneven stress on the cooling disc 300, thereby affecting the stability of the cooling disc 300.

Based on this, in a further technical solution, the chamber cover 120 is provided with a first pressure balance hole 126 and a second pressure balance hole 127, where the first pressure balance hole 126 and the second pressure balance hole 127 are communicated with the external environment of the pre-cleaning process chamber 100, and symmetrically distributed on two sides of the center of the cooling disc 300 with the first avoidance hole 123 and the second avoidance hole 124; the first pressure balance hole 126 and the second pressure balance hole 127 are sealed from the chamber space 130 so as not to affect the vacuum environment of the chamber space 130 during the process.

The first and second pressure balance holes 126 and 127 are formed such that the area of the cooling plate 300 opposite to the first and second pressure balance holes 126 and 127 is also subjected to the atmospheric pressure in the external environment of the cleaning process chamber 100. Because the structures formed by the first pressure balance hole 126 and the second pressure balance hole 127 and the first avoidance hole 123 and the second avoidance hole 124 are symmetrically distributed on two sides of the center of the cooling disc 300, the cooling disc 300 can receive relatively balanced atmospheric pressure, the problem of uneven stress caused by the bias of the cooling disc 300 is avoided, and adverse effects caused by uneven stress can be avoided.

Similarly, in an alternative solution, two second sealing and isolating structures 128 may be disposed between the cooling disc 300 and the chamber cover 120, and the two second sealing and isolating structures 128 are distributed around the first pressure balance hole 126 and the second pressure balance hole 127, so as to respectively seal and isolate the first pressure balance hole 126 from the chamber space 130 and the second pressure balance hole 127 from the chamber space 130.

In this embodiment, the first sealing and isolating structure 125 and the second sealing and isolating structure 128 both play a role in sealing and isolating, and the types of the two may be various, for example, the first sealing and isolating structure 125 and the second sealing and isolating structure 128 may be purely sealing rings. The structures of the first sealing isolation structure 125 and the second sealing isolation structure 128 may be the same or different.

In an alternative, the second sealing isolation structures 128 may each include a third annular protrusion 128a and a third sealing ring 128b, where the third annular protrusion 128a is disposed on a first surface of the cooling disk 300 facing the chamber cover 120 and is configured integrally with the cooling disk 300, the third sealing ring 128b surrounds the first pressure balance hole 126 or the second pressure balance hole 127, and the third sealing ring 128b is clamped and fixed between the third annular protrusion 128a and the chamber cover 120. The third annular protrusion 128a can make the third sealing ring 128b be raised, so that the third sealing ring 128b is more deformed, and a better sealing effect is easier to achieve.

In order to improve the stability of the third sealing ring 128b and avoid sideslip, as shown in fig. 7, in a further technical solution, a third annular groove is provided at the top end of the third annular protrusion 128a, and a portion of the third sealing ring 128b may be positioned in the third annular groove.

In a further technical scheme, the semiconductor process equipment disclosed in the embodiments of the present application may further include two clasping members 850 and a heat-insulating member, where the joint between the first joint 305 and the first refrigerant input pipe is provided with the heat-insulating member, and the heat-insulating member is clasped by the clasping member 850, so that the heat-insulating member is fixed at the joint between the first joint 305 and the first refrigerant input pipe. Similarly, a heat-insulating member is also disposed at the connection between the second joint 306 and the first refrigerant output pipe, where the heat-insulating member is held tightly by another holding member 850, and is further fixed at the connection between the second joint 306 and the second refrigerant output pipe. The arrangement of the heat preservation piece can enable the junction between the first joint 305 and the first refrigerant input pipeline and the junction between the second joint 306 and the first refrigerant output pipeline to be better protected, and the phenomenon of icing and frosting at the junction due to too low temperature is avoided. Meanwhile, the holding member 850 holds the heat insulating member tightly, thereby preventing the heat insulating member from falling off when the chamber cover 120 is repeatedly opened and closed.

In an alternative, the clasping member 850 may be a hoop member, and embodiments of the present application are not limited to the specific type and configuration of clasping member 850. The heat preservation piece can be heat preservation cotton, heat preservation rubber etc., and likewise, the concrete structure and the material of heat preservation piece are not restricted to this application embodiment.

In the pre-cleaning process, it is necessary to supply a process gas, which may be an inert gas such as argon, for the pre-cleaning process into the evacuated chamber space 130. The chamber cover 120 may be provided with a first air inlet section 129, the cooling plate 300 is provided with a second air inlet section 307, the center of the top plate 220 is provided with a third air inlet section 222, the semiconductor processing equipment is provided with a process gas input channel, and the process gas input channel comprises the first air inlet section 129, the second air inlet section 307 and the third air inlet section 222 which are in sealing butt joint in sequence, and is communicated with the pre-cleaning space 131 through the third air inlet section 222. The mode of forming the gas transmission channel through the chamber cover 120, the cooling disc 300 and the top plate 220 can input the process gas from the position relatively close to the middle of the pre-cleaning space 131 more easily, is beneficial to improving the air intake uniformity in the pre-cleaning process, and is relatively beneficial to realizing the uniformity of the pre-cleaning effect.

Similarly, to achieve sealing, the cooling disc 300 is fixedly connected with the chamber cover 120, and a second annular protrusion 1210 and a second sealing ring 1211 may be disposed between the cooling disc 300 and the cooling disc 300, where the second annular protrusion 1210 may be in an integral structure and located on a first surface of the cooling disc 300 facing the chamber cover 120, the second annular protrusion 1210 is disposed around an inlet of the second air inlet section 307, the second sealing ring 1211 is disposed around an outlet of the first air inlet section 129, and the second sealing ring 1211 is clamped and fixed between the second annular protrusion 1210 and the chamber cover 120. The second annular projection 1210 is higher than the first surface of the cooling disk 300 facing the chamber cover 120, thereby facilitating greater compression of the second seal ring 1211 and thus better sealing of the first air intake section 129 from the second air intake section 307.

Similarly, in order to improve stability of the second sealing ring 1211 and avoid sideslip, as shown in fig. 7, in a further technical solution, a second annular groove is provided at the top end of the second annular protrusion 1210, and a portion of the second sealing ring 1211 may be positioned in the second annular groove.

Referring to fig. 10, the chamber cover 120 according to the embodiment of the present application may be provided with a second refrigerant channel 1213, and the second refrigerant channel 1213 is filled with a second refrigerant. The second refrigerant may be cooling water, but may also be other media used as a refrigeration medium. Considering that the second refrigerant channel 1213 is opened on the chamber cover 120, and icing and frosting are avoided under the condition of playing a certain cooling role, in a preferred scheme, the second refrigerant is cooling water or cooling oil, and the specific type of the second refrigerant is not limited in the application.

In a preferred embodiment, the second projection of the second refrigerant channel 1213 at least partially coincides with the first projection of the first refrigerant channel 304 in a projection perpendicular to the direction of the cooling pan 300. In a specific operation, the cooling capacity of the cooling disc 300 is strong, that is, the temperature of the first refrigerant in the first refrigerant channel 304 is low (compared to the second refrigerant), and the temperature of the second refrigerant in the second refrigerant channel 1213 is relatively high, and the second refrigerant is also used for guiding the first refrigerant in the direction toward the chamber cover 120, so as to avoid the temperature of the chamber cover 120 being too low. The second projection and the first projection are at least partially overlapped, so that the second refrigerant can conduct the cooling of the area with the lower temperature of the cooling disc 300 in a targeted manner, and the conduction efficiency can be improved.

Referring next to fig. 12, 13 and 14, the semiconductor processing apparatus disclosed in the embodiments of the present application may further include a mounting bracket 400, where the mounting bracket 400 is used to mount the chamber cover 120 on a mounting base. The mounting bracket 400 can be movable to move the chamber cover 120, thereby enabling the pre-cleaning process chamber 100 to be opened or closed.

The structure of the mounting bracket 400 may be various, for example, the mounting bracket 400 may be a lever bracket. In an alternative solution, the mounting bracket 400 may include a fixing bracket 410, a rotating shaft 420 and two connecting arms 430, where the rotating shaft 420 is rotationally disposed on the fixing bracket 410, the two connecting arms 430 are fixedly connected with the rotating shaft 420 and can rotate along with the rotating shaft 420, and the two connecting arms 430 are fixedly connected with the chamber cover 120. The rotation of the rotating shaft 420 drives the two connecting arms 430 to rotate, and then drives the chamber cover 120 to move, and the chamber cover 120 can be connected with or separated from the chamber main body 110 along with the rotation of the two connecting arms 430, so that the chamber cover 120 can be in an open state or a closed state. Specifically, the rotating shaft 420 may be connected to a manual labor-saving mechanism, so as to realize manual driving of an operator. Of course, the rotating shaft 420 may be connected to a driving mechanism, and the rotating shaft 420 may be rotated under the driving of the driving mechanism. The mounting bracket 400 enables mounting and driving of the chamber cover 120.

In a further embodiment, one connecting arm 430 is a second refrigerant input pipe, the other connecting arm 430 is a second refrigerant output pipe, the second refrigerant channel 1213 has a second refrigerant inlet 1213a and a second refrigerant outlet 1213b, the rotating shaft 420 is provided with a third refrigerant inlet and a third refrigerant outlet, the second refrigerant input pipe is communicated with the third refrigerant inlet and the second refrigerant inlet 1213a, and the second refrigerant output pipe is communicated with the third refrigerant outlet and the second refrigerant outlet 1213b. In this case, the rotation shaft 420 and the two connection arms 430 not only return to the driving function, but also perform the function of transporting the second refrigerant, thereby achieving the purpose of one object. Compared with the mode that the second refrigerant input pipeline and the second refrigerant output pipeline are directly connected to the chamber cover 120, the structure is not easy to cause the first refrigerant input pipeline and the second refrigerant input pipeline to be wound.

The second refrigerant output pipeline and the second refrigerant input pipeline can be connected with a second refrigerant source, and the second refrigerant source can be a second refrigerant tank or a second heat exchanger. In the case that the second refrigerant source is a second heat exchanger, the second heat exchanger realizes the reduction of the temperature of the second refrigerant through heat exchange, and then the second refrigerant enters the chamber cover 120 again to exert the cooling effect.

In the embodiments of the present invention, the different embodiments are mainly described, and as long as the different optimization features of the embodiments are not contradictory, the different optimization features can be combined to form a better embodiment, and in consideration of brevity of line text, the description is omitted here.

The embodiments of the present invention have been described above with reference to the accompanying drawings, but the present invention is not limited to the above-described embodiments, which are merely illustrative and not restrictive, and many forms may be made by those having ordinary skill in the art without departing from the spirit of the present invention and the scope of the claims, which are to be protected by the present invention.

Claims

1. A semiconductor processing apparatus comprising a pre-clean process chamber (100), an impurity receiving liner (200), and a cooling platen (300), wherein,

The pre-cleaning process chamber (100) is provided with a chamber space (130), and the cooling disc (300) is arranged in the chamber space (130);

the impurity-carrying liner (200) is arranged in the cavity space (130), the impurity-carrying liner (200) comprises a cylindrical portion (210) and a top plate (220), the top plate (220) is attached to the cooling disc (300), the top plate (220) covers the port, adjacent to the cooling disc (300), of the cylindrical portion (210) and is connected with the cylindrical portion (210), and the top plate (220) and the cylindrical portion (210) enclose a pre-cleaning space (131).

2. The semiconductor processing apparatus of claim 1, wherein the pre-clean process chamber (100) comprises a chamber body (110) and a chamber lid (120), the chamber lid (120) being connected to the chamber body (110) and being adapted to enclose the chamber space (130);

the cooling plate (300) is fixed with the chamber cover body (120), the chamber main body (110) is provided with a supporting surface (1111), the chamber cover body (120) is supported on the supporting surface (1111), the supporting surface (1111) is provided with an elastic supporting piece (140), the elastic supporting piece (140) is elastically supported between the supporting surface (1111) and the top plate (220), and the elastic supporting piece (140) drives the top plate (220) to be tightly attached to the cooling plate (300).

3. The semiconductor processing apparatus according to claim 2, wherein a plurality of first grooves (221) are provided at an edge of the top plate (220), the first grooves (221) having a first bottom wall facing the supporting surface (1111), the supporting surface (1111) being provided with a plurality of positioning protrusions (1112), the elastic support members (140) being respectively elastically supported between the opposing positioning protrusions (1112) and the opposing first bottom wall, wherein at least a part of the positioning protrusions (1112) among the plurality of positioning protrusions (1112) are in positioning engagement with the opposing first grooves (221).

4. A semiconductor processing apparatus according to claim 3, wherein among said plurality of positioning projections (1112), a part of said positioning projections (1112) is in positioning engagement with said first recess (221) opposed thereto; a gap is provided between the other part of the positioning protrusion (1112) and the side wall of the first groove (221) opposite thereto.

5. A semiconductor processing apparatus according to claim 3, wherein said positioning protrusion (1112) is provided with a second recess, a portion of said elastic support (140) extending into and being in positioning engagement with said second recess, said second recess having a second bottom wall facing said top plate (220), said elastic support (140) being elastically supported between said first bottom wall and said second bottom wall.

6. The semiconductor processing apparatus of any of claims 2-5, wherein the elastic supports (140) are spaced apart and uniformly distributed along the circumferential direction of the cylindrical portion (210).

7. The semiconductor processing apparatus of claim 2, wherein an inner wall of the chamber body (110) facing the cylindrical portion (210) is provided with a resilient ground (150), the resilient ground (150) being in conductive contact with the cylindrical portion (210).

8. The semiconductor processing apparatus of claim 7, wherein the chamber body (110) includes an upper receiving ring (111), an end surface of the upper receiving ring (111) facing the chamber lid (120) is the supporting surface (1111), and the elastic grounding member (150) is disposed between an inner wall of the upper receiving ring (111) and the cylindrical portion (210).

9. The semiconductor processing apparatus according to claim 8, wherein a first mounting groove is provided on a surface of the supporting surface (1111) or the chamber cover (120) opposite to the supporting surface (1111), a sealing ring is installed in the first mounting groove, and the chamber cover (120) is connected with the supporting surface (1111) in a sealing manner through the sealing ring; and/or the number of the groups of groups,

A second mounting groove is formed in the surface, opposite to the supporting surface (1111), of the supporting surface (1111) or the chamber cover body (120), and an induction coil is mounted in the second mounting groove, and/or,

the upper receiving ring (111) is provided with a first vent hole (1214).

10. The semiconductor processing apparatus of claim 7, wherein the plurality of elastic grounding members (150) are distributed at intervals around the circumferential direction of the cylindrical portion (210), all of the elastic grounding members (150) enclosing an elastic positioning space, and the cylindrical portion (210) is positioned within the elastic positioning space.

11. The semiconductor processing apparatus of claim 1, wherein the pre-clean process chamber (100) comprises a chamber lid (120), a first surface of the cooling plate (300) facing the chamber lid (120) is provided with a plurality of connection protrusions (300 a), the plurality of connection protrusions (300 a) being connected to the chamber lid (120).

12. The semiconductor processing apparatus according to claim 11, wherein a second surface of the cooling plate (300) that is attached to the top plate (220) is provided with a sink groove (301), a bottom wall of the sink groove (301) is provided with a first connection hole (302), the first surface is opposite to the second surface, and the first connection hole (302) penetrates through the connection protrusion (300 a) from the bottom wall of the sink groove (301) along a protrusion direction of the connection protrusion (300 a); the chamber cover body (120) is provided with a second connecting hole (121), the cooling disc (300) is fixedly connected with the connecting piece (122) matched with the first connecting hole (302) and the second connecting hole (121), and part of the connecting piece (122) is positioned in the sinking groove (301).

13. The semiconductor processing apparatus of claim 12, wherein the second surface of the cooling plate (300) is provided with an air guide groove (303), the air guide groove (303) corresponds to the sink groove (301), a first port of the air guide groove (303) is communicated with the sink groove (301), and a second port of the air guide groove (303) is located at an edge of the cooling plate (300) and is located at a side surface of the cooling plate (300).

14. The semiconductor processing apparatus of claim 1, wherein the pre-clean process chamber (100) comprises a chamber lid (120), the cooling plate (300) is provided with a first coolant channel (304), the first coolant channel (304) is provided with a first coolant inlet (3041) and a first coolant outlet (3042), the semiconductor processing apparatus further comprises a first joint (305), a second joint (306), and a first coolant input pipe and a first coolant output pipe provided outside the chamber space (130), the first joint (305) is in sealed abutment with the first coolant inlet (3041), and a portion of the first joint (305) passes through the chamber lid (120) and is in communication with the first coolant input pipe; the second joint (306) is in sealing butt joint with the first refrigerant outlet (3042), and a part of the second joint (306) penetrates through the cavity cover body (120) and is communicated with the first refrigerant output pipeline.

15. The semiconductor processing apparatus of claim 14, wherein the junction of the first joint (305) and the first coolant input pipe, and the junction of the second joint (306) and the first coolant output pipe are each provided with a thermal insulation member, and the thermal insulation member is fixed at the junction by a clasping member (850).

16. The semiconductor processing apparatus of claim 14, wherein the chamber cover (120) is provided with a first avoidance hole (123) and a second avoidance hole (124), the first joint (305) is detachably engaged with the cooling plate (300) and the chamber cover (120), and a portion of the first joint (305) passes through the first avoidance hole (123) and is communicated with the first refrigerant input pipe; the second connector (306) is detachably matched with the cooling disc (300) and the chamber cover body (120) respectively, a part of the second connector (306) penetrates through the second avoidance hole (124) and is communicated with the first refrigerant output pipeline, and the first avoidance hole (123) is hermetically isolated from the chamber space (130) and the second avoidance hole (124) is hermetically isolated from the chamber space (130).

17. The semiconductor processing apparatus of claim 16, wherein two first seal isolation structures (125) are disposed between the cooling plate (300) and the chamber cover (120), the two first seal isolation structures (125) surrounding the first joint (305) and the second joint (306), respectively, to seal the first relief hole (123) from the chamber space (130) and the second relief hole (124) from the chamber space (130), respectively.

18. The semiconductor processing apparatus of claim 17, wherein the first sealing isolation structure (125) includes a first annular protrusion (125 a) and a first sealing ring (125 b), the first annular protrusion (125 a) is disposed on a first surface of the cooling plate (300) facing the chamber cover (120), the first annular protrusion (125 a) surrounds the first coolant inlet (3041) or the first coolant outlet (3042), and the first sealing ring (125 b) surrounds the first avoidance hole (123) or the second avoidance hole (124) and is clamped and fixed between the first annular protrusion (125 a) and the chamber cover (120).

19. The semiconductor processing apparatus of claim 16, wherein the chamber cover (120) is provided with a first pressure balance hole (126) and a second pressure balance hole (127), the first pressure balance hole (126) and the second pressure balance hole (127) are communicated with an external environment of the pre-cleaning process chamber (100), and are symmetrically distributed on both sides of a center of the cooling plate (300) with the first avoidance hole (123) and the second avoidance hole (124), and the first pressure balance hole (126) and the second pressure balance hole (127) are sealed from the chamber space (130).

20. The semiconductor processing apparatus of claim 19, wherein two second sealing and isolating structures (128) are provided between the cooling plate (300) and the chamber cover (120), the two second sealing and isolating structures (128) being divided around the first pressure balance hole (126) and the second pressure balance hole (127) to seal and isolate the first pressure balance hole (126) from the chamber space (130) and the second pressure balance hole (127) from the chamber space (130), respectively.

21. The semiconductor processing apparatus of claim 20, wherein the second seal isolation structure (128) includes a third annular protrusion (128 a) and a third seal ring (128 b), the third annular protrusion (128 a) is disposed on a first surface of the cooling plate (300) facing the chamber lid (120), the third annular protrusion (128 a) surrounds the first pressure balance hole (126) or the second pressure balance hole (127), and the third seal ring (128 b) surrounds the first pressure balance hole (126) or the second pressure balance hole (127) and is clamped between the third annular protrusion (128 a) and the chamber lid (120).

22. The semiconductor process equipment of claim 1, wherein the pre-clean process chamber (100) comprises a chamber lid (120), the cooling plate (300) is connected to the chamber lid (120), the chamber lid (120) is provided with a first air inlet section (129), the cooling plate (300) is provided with a second air inlet section (307), the center of the top plate (220) is provided with a third air inlet section (222), the semiconductor process equipment is provided with a process gas input channel, the process gas input channel comprises the first air inlet section (129), the second air inlet section (307) and the third air inlet section (222) which are in sealing butt joint in sequence, and the process gas input channel is communicated with the pre-clean space (131) through the third air inlet section (222).

23. The semiconductor processing apparatus of claim 22, wherein the cooling plate (300) is fixedly connected to the chamber lid (120) with a second annular protrusion (1210) and a second sealing ring (1211) therebetween, the second annular protrusion (1210) and the cooling plate (300) being of unitary construction and being located on a first surface of the cooling plate (300) facing the chamber lid (120), the second annular protrusion (1210) being disposed about an inlet of the second air inlet section (307), the second sealing ring (1211) being disposed about an outlet of the first air inlet section (129), the second sealing ring (1211) being clamped between the second annular protrusion (1210) and the chamber lid (120).

24. The semiconductor processing apparatus of claim 1, wherein the pre-clean process chamber (100) comprises a chamber lid (120), the chamber lid (120) being provided with a second coolant channel (1213).

25. The semiconductor processing apparatus of claim 24, wherein the cooling plate (300) is provided with a first coolant channel (304), and wherein in a projection perpendicular to the direction of the cooling plate (300), a second projection formed by the second coolant channel (1213) at least partially coincides with a first projection formed by the first coolant channel (304).

26. The semiconductor processing apparatus of claim 24, further comprising a fixed bracket (410), a rotating shaft (420), and two connecting arms (430), wherein the rotating shaft (420) is rotatably disposed on the fixed bracket (410), the two connecting arms (430) are fixedly connected with the rotating shaft (420) and can rotate along with the rotating shaft (420), and the chamber cover (120) can be connected with or separated from the chamber body (110) along with the rotation of the two connecting arms (430).

27. The semiconductor processing apparatus of claim 26, wherein one of said connecting arms (430) is a second refrigerant input conduit and is fixedly connected to said chamber cover (120), and the other of said connecting arms (430) is a second refrigerant output conduit and is fixedly connected to said chamber cover (120), said second refrigerant channel (1213) having a second refrigerant inlet (1213 a) and a second refrigerant outlet (1213 b), said shaft (420) being provided with a third refrigerant inlet and a third refrigerant outlet, said second refrigerant input conduit communicating said third refrigerant inlet with said second refrigerant inlet (1213 a), said second refrigerant output conduit communicating said third refrigerant outlet with said second refrigerant outlet (1213 b).

28. The semiconductor processing apparatus of claim 1, wherein the pre-clean process chamber (100) comprises a chamber body (110) and a chamber lid (120), the chamber lid (120) being connected to the chamber body (110) and being adapted to enclose the chamber space (130);

the semiconductor process equipment further comprises a fan (600), the chamber main body (110) is provided with a coil installation space (110 a) communicated with the external environment of the semiconductor process equipment, the chamber main body (110) comprises a radio frequency coil (115), the radio frequency coil (115) is arranged in the coil installation space (110 a), the coil installation space (110 a) is sealed and isolated from the chamber space (130), and the fan (600) is used for driving air in the coil installation space (110 a) to exchange heat with air in the external environment in a convection mode.

29. The semiconductor processing apparatus of claim 28, further comprising a ground cover (500), the ground cover (500) being arranged to cover the chamber cover (120) and enclose a first ventilation space (101) with the pre-clean process chamber (100), the chamber body (110) being provided with a first ventilation hole (1214), the structure of the chamber body (110) for enclosing the coil mounting space (110 a) being provided with a second ventilation hole communicating with the external environment, the first ventilation space (101), the first ventilation hole, the coil mounting space (110 a) and the second ventilation hole being in turn communicated to form a heat dissipation channel sealed from the chamber space (130), the fan (600) being arranged to cover the ground cover (500) for delivering air in the external environment into the first ventilation space (101) or delivering air in the first ventilation space (101) into the external environment.