CN116053157B

CN116053157B - Detection device

Info

Publication number: CN116053157B
Application number: CN202310021768.6A
Authority: CN
Inventors: 苏清顺
Original assignee: Shenzhen Yanmade Technology Co ltd
Current assignee: Shenzhen Yanmade Technology Co ltd
Priority date: 2023-01-06
Filing date: 2023-01-06
Publication date: 2023-09-22
Anticipated expiration: 2043-01-06
Also published as: CN116053157A

Abstract

The invention relates to a detection device, which comprises a workbench, a detection module and a positive pressure module; the detection module comprises a support plate assembly, a detection assembly and a first driving assembly; the supporting plate component is connected to the workbench and is provided with a storage area for placing the bound grains; the first driving component is used for driving the detection component to move, so that the detection component can be electrically connected with the test point of the bound crystal grain placed in the storage area; the positive pressure module comprises a second driving component and a positive pressure component; the second driving component is connected to the workbench and used for driving the positive pressure component to move up and down; the positive pressure component is positioned above the supporting plate component, and can be contacted with the supporting plate component to form a cavity when the positive pressure component moves downwards, and the storage area is positioned in the cavity; the positive pressure assembly is used for being connected with an air source so as to ventilate the cavity, and the bound crystal grains are pressed on the supporting plate assembly. The detection device can detect the bound crystal grains and avoid damaging the bound crystal grains.

Description

Detection device

Technical Field

The invention belongs to the technical field of chip production, and particularly relates to a detection device.

Background

After wafer testing, the wafer needs to be singulated into dies and the dies bound, including Die Bonding and Wire Bonding. Die bonding refers to a small piece of "Die" with circuitry cut from a Wafer (Wafer) and mechanically pressed and welded at a high temperature in a moment with the gold layer on the back side and the gold-plated surface in the center of a Frame (Lead Frame). Wire Bonding refers to the use of wires (gold wires, aluminum wires, etc.) to complete the connection of interconnect wiring within solid state circuitry in microelectronic devices using heat and pressure or ultrasonic energy. Dividing the Die Bonding and Wire Bonding into independent wafers, packaging and protecting the independent wafers by using a plastic shell, and performing finished product packaging test after packaging, wherein unqualified finished products can be scrapped in the packaging test, so that the cost is increased.

Researchers have found that failure of the bonding operation is an important cause of failed packages, and that in the prior art, the production process between wafer testing and package testing is not tested, nor is there a special inspection device used to test the bonded die. If a detection device can be designed to detect the bound crystal grains so as to screen out the products which are unqualified in binding, the cost of subsequent packaging can be saved. Therefore, how to design a testing device to test the bound crystal grains is a research subject of research personnel.

Disclosure of Invention

The technical problems to be solved by the invention are as follows: aiming at the problem that no special detection device is used for testing the bound crystal grains in the prior art, the detection device is provided.

In order to solve the technical problems, an embodiment of the invention provides a detection device, which comprises a workbench, a detection module and a positive pressure module; the detection module comprises a support plate assembly, a detection assembly and a first driving assembly; the supporting plate component is connected to the workbench, and a storage area for placing the bound grains is arranged on the supporting plate component; the first driving component is used for driving the detection component to move, so that the detection component can be electrically connected with the test point of the bound crystal grain placed in the storage area; the positive pressure module comprises a second driving component and a positive pressure component; the second driving component is connected to the workbench; the positive pressure component is connected to the second driving component and is positioned above the supporting plate component; the second driving assembly is used for driving the positive pressure assembly to move up and down between a first position and a second position, and when the positive pressure assembly moves downwards from the first position to the second position, the positive pressure assembly can be contacted with the supporting plate assembly to enclose a cavity, and the storage area is positioned in the cavity; the positive pressure assembly is used for being connected with an air source so as to ventilate the cavity through the air source, and the bound crystal grains placed in the storage area are pressed on the supporting plate assembly.

Optionally, the support plate assembly includes a first support plate and a second support plate, the first support plate is connected to the workbench, and the second support plate is detachably connected to the first support plate; the first supporting plate is used for enclosing the positive pressure component to form the cavity; the storage area is positioned on the second support plate, and when the first support plate and the positive pressure assembly enclose to form the cavity, the second support plate is positioned in the cavity.

Optionally, the second supporting plate is provided with a negative pressure hole, and the negative pressure hole is located in the storage area to adsorb the bound grains placed in the storage area; the test assembly further includes a vacuum level detector for detecting a vacuum level within the negative pressure hole.

Optionally, the detection assembly includes a carrier plate, a pin die, a probe, and a circuit board; the support plate assembly is provided with an avoidance space, and the avoidance space is positioned in the storage area and penetrates through the support plate assembly; the bearing plate is arranged below the supporting plate assembly, the pin die and the circuit board are connected to the bearing plate, and the probe is connected to the pin die and is electrically connected with the circuit board; the first driving component can drive the bearing plate to move up and down so as to drive the needle mould, the probe and the circuit board to move up and down; when the probe moves upwards, the probe can pass through the avoidance space to be abutted against the bound crystal grains placed in the storage area.

Optionally, the detection assembly further includes a carrier plate guiding mechanism, where the carrier plate guiding mechanism is respectively connected to the carrier plate and the support plate assembly, and is used for guiding the up-and-down movement of the carrier plate.

Optionally, the first driving assembly comprises a first power source, an upper top plate, a plurality of elastic pieces and a floating plate; each elastic piece is connected between the upper top plate and the floating plate, so that the floating plate can float up and down relative to the upper top plate; the first power source is connected with the upper top plate and is used for driving the upper top plate to move up and down so as to drive the floating plate to move up and down; the floating plate is positioned below the detection assembly, and can jack up the detection assembly when moving upwards.

Optionally, the first driving assembly further comprises a first mounting plate and a first guiding mechanism; the first mounting plate is connected to the workbench, and the first power source is connected to the first mounting plate; the first guide mechanism is connected with the first mounting plate and the upper top plate and is used for guiding the up-and-down movement of the upper top plate.

Optionally, the positive pressure component comprises a positive pressure plate, and a positive pressure cavity is arranged on the lower surface of the positive pressure plate; the positive pressure plate is provided with a vent hole, the vent hole penetrates through the outer surface of the positive pressure plate to be communicated with the positive pressure cavity, and the vent hole is used for being connected with an air source; the second driving component is connected with the positive pressure plate and used for driving the positive pressure plate to move up and down; when the positive pressure plate moves downwards, the positive pressure plate can be pressed on the supporting plate assembly, so that the opening of the positive pressure cavity can be closed by the supporting plate assembly, and the cavity is formed by enclosing.

Optionally, the inner surface of the positive pressure cavity is provided with a concave structure, and the vent holes penetrate through to the inner surface of the concave structure, wherein the diameter of the concave structure is larger than that of the vent holes.

Optionally, the second driving assembly comprises a supporting frame, a second mounting plate, a pressing plate, a second guiding mechanism and a second power source; the support frame is connected to the workbench; the second mounting plate is connected to the supporting frame; the second power source is connected to the second mounting plate and is connected with the pressing plate; the pressing plate is connected with the positive pressure component; the second power source is used for driving the pressing plate to move up and down so as to drive the positive pressure component to move up and down; the second guide mechanism is connected with the second mounting plate and the pressing plate and is used for guiding the up-and-down movement of the pressing plate.

In the detection device provided by the embodiment of the invention, the bound crystal grains can be supported by the support plate assembly, and the bound crystal grains can be detected by the detection assembly so as to judge whether the bound crystal grains are good products or not. When the bound crystal grains are good products, the subsequent packaging operation can be performed; when the bound crystal grain is defective, the crystal grain can be bound again. In addition, through setting up such as malleation subassembly, can realize exerting pressure to the die after binding through gas pressure to offset the application of force of detection subassembly, can avoid damaging components and parts such as die and metal wire like this, and reduce detection device's cost.

Drawings

FIG. 1 is a schematic diagram of a detection device according to an embodiment of the present invention;

FIG. 2 is a schematic diagram showing the cooperation of a support plate assembly and a detection assembly of a detection device according to an embodiment of the present invention;

FIG. 3 is a schematic diagram II of the cooperation between the support plate assembly and the detection assembly of the detection device according to an embodiment of the present invention;

fig. 4 is an enlarged view of the area M in fig. 3;

FIG. 5 is a schematic diagram of a first driving assembly of a detecting device according to an embodiment of the present invention;

FIG. 6 is a schematic diagram of a first driving assembly of a detecting device according to an embodiment of the present invention;

FIG. 7 is a schematic diagram of a positive pressure component of a detection device according to an embodiment of the present invention;

FIG. 8 is a schematic diagram of a second driving assembly of the detecting device according to an embodiment of the present invention;

fig. 9 is a schematic diagram of a second driving assembly of the detection device according to an embodiment of the invention.

Reference numerals in the specification are as follows:

100. a detection device; 10. a work table; 20. a detection module; 30. a positive pressure module; 40. a cabinet; 50. a pressure detection gauge; 60. a start button; 70. an emergency stop button;

1. a support plate assembly; 11. a storage area; 12. a first support plate; 121. a receiving groove; 122. a via hole; 13. a second support plate; 131. a first avoidance hole; 132. a negative pressure hole;

2. A detection assembly; 21. a carrying plate; 22. a needle mold; 23. a probe; 24. a circuit board; 25. a carrier plate guide mechanism;

3. a first drive assembly; 31. a first power source; 32. an upper top plate; 33. an elastic member; 34. a floating plate; 35. a first mounting plate; 36. a first guide mechanism;

4. a second drive assembly; 41. a support frame; 42. a second mounting plate; 43. a pressing plate; 44. a second guide mechanism; 45. a second power source;

5. a positive pressure assembly; 51. a positive pressure plate; 52. a positive pressure chamber; 521. a first hole; 522. a second hole; 53. a first notch; 54. a second notch; 55. a concave structure; 56. a seal ring;

6. vacuum degree detector.

Detailed Description

In order to make the technical problems, technical schemes and beneficial effects solved by the invention more clear, the invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.

As shown in fig. 1, in an embodiment, the inspection device 100 is used for inspecting the bonded die, so as to detect whether the bonded die is good. The detecting device 100 includes a workbench 10, a detecting module 20 and a positive pressure module 30, wherein the detecting module 20 and the positive pressure module 30 are both connected to the workbench 10, the detecting module 20 is used for detecting bound grains, and the positive pressure module 30 is used for applying force to the bound grains so as to prevent the detecting module 20 from deforming and damaging the bound grains when detecting the bound grains.

The bound die has a plurality of test points, and the detection module 20 detects whether the bound die is electrically connected with the corresponding test points of the bound die. In addition, the principle of detecting whether the bonded die is good or not and the principle of detecting whether the die package is good or not after the die package is finished can be the same, and the embodiment does not make much description. In addition, the term "plurality" in the present application means two or more.

In addition, the inspection points of the bonded die are typically located on a Frame (Lead Frame), where the Frame has a first surface and a second surface disposed opposite to each other, and the die and the metal wire are typically bonded to the first surface, and each inspection point is located on the second surface.

As shown in fig. 1, the inspection apparatus 100 further includes a cabinet 40, and the table 10 is connected to the cabinet 40 and located above the cabinet 40.

As shown in fig. 2 to 6, the detection module 20 includes a support plate assembly 1, a detection assembly 2, and a first driving assembly 3. The supporting plate assembly 1 is connected to the workbench 10, and a storage area 11 is arranged on the supporting plate assembly 1 to place the bound crystal grains, namely, when the bound crystal grains are detected, the bound crystal grains are actually placed in the storage area 11; in addition, after the bonded die is placed in the storage area 11, the second surface of the fixing frame contacts the support plate assembly 1, and the first surface of the fixing frame is located above the support plate assembly 1. The first driving component 3 is configured to drive the detecting component 2 to move, so that the detecting component 2 can be electrically connected with a test point of the bonded die placed in the storage area 11, and after the detecting component 2 is electrically connected with the test point of the bonded die, the bonded die can be detected to determine whether the bonded die is good. When the bound crystal grains are good products, the subsequent packaging operation can be performed; when the bound crystal grains are defective products, the crystal grains can be bound again, so that the yield of packaged products can be improved, the waste of the crystal grains can be avoided, and the cost is reduced.

In addition, the inspection component 2 is usually disposed below the supporting board component 1, and at this time, the first driving component 3 drives the inspection component 2 to move upwards, so that the inspection component 2 approaches the supporting board component 1, and finally, the inspection component 2 is electrically connected with the test point of the bonded die placed in the storage area 11.

As shown in fig. 7-9, in one embodiment, positive pressure module 30 includes second drive assembly 4 and positive pressure assembly 5. The second driving component 4 is connected to the workbench 10; the positive pressure component 5 is connected to the second driving component 4 and is positioned above the supporting plate component 1; the second driving component 4 is used for driving the positive pressure component 5 to move up and down between a first position and a second position, and when the positive pressure component 5 moves downwards from the first position to the second position, the positive pressure component 5 can be contacted with the supporting plate component 1 to form a cavity in a surrounding manner; when the positive pressure component 5 and the supporting plate component 1 are enclosed to form a cavity, the storage area 11 is positioned in the cavity, and the bound crystal grains placed in the storage area 11 are positioned in the cavity; in addition, the positive pressure assembly 5 is adapted to be connected to a gas source for venting the gas source into the cavity to create a gas pressure within the cavity such that the bonded die disposed in the holding area 11 is compressed against the support plate assembly 1.

In addition, after the bound grains are detected, the second driving component 4 drives the positive pressure component 5 to move upwards from the second position to the first position, so that the reset is realized.

When the inspection component 2 is electrically connected to the test points of the bonded die, the inspection component 2 generally applies a force to the bonded die to ensure close contact between the inspection component 2 and each test point of the bonded die. Through the compaction effect of the gas in the cavity, the bound grains can be effectively prevented from being tilted and damaged due to the force application of the detection component 2.

During development of the inspection apparatus 100, researchers have also found that testing the bonded die presents the following difficulties: after die bonding, the fixture has thousands of test points, which means that the test assembly 2 needs thousands of contact points, one of which is in electrical contact with one of the test points; because the components such as the crystal grains and the metal wires are bound, the metal wires on the fixed frame are broken and damaged due to deformation of the fixed frame, the fixed frame is required to overcome large interference force without deformation, however, the fixed frame which is bound is a thin and soft plate, so that in order to prevent the fixed frame from deformation such as large bending caused by stress, corresponding pressure is required to be applied to the first surface of the fixed frame to counteract interference force of the detection component 2 on the second surface of the fixed frame; however, since the components such as the die and the metal wire are bonded, the available space on the first surface of the mount is very small, and it is difficult to apply force by directly contacting the structural member with the first surface of the mount, and the components such as the die and the metal wire are easily crushed by applying pressure by directly contacting the structural member with the first surface of the mount.

In this embodiment, the pressure is applied to the first surface of the fixed frame by the air pressure, so that the first surface of the fixed frame is stressed uniformly, components such as grains and metal wires are prevented from being damaged, and meanwhile, the cost of the detection device 100 is reduced.

As shown in fig. 2 and 3, in one embodiment, the support plate assembly 1 includes a first support plate 12 and a second support plate 13, the first support plate 12 being coupled to the table 10, the second support plate 13 being detachably coupled to the first support plate 12; the first supporting plate 12 is used for enclosing with the positive pressure component 5 to form a cavity; the storage area 11 is located on the second support plate 13, and when the first support plate 12 and the positive pressure component 5 enclose a cavity, the second support plate 13 is located in the cavity.

Since the first support plate 12 and the second support plate 13 are detachably connected, when one of the first support plate 12 and the second support plate 13 is damaged, only the damaged one needs to be replaced, so that maintenance costs can be reduced. In addition, the bonded die is actually placed on the upper surface of the second supporting plate 13, and the storage area 11 is a corresponding area of the upper surface of the second supporting plate 13.

It should be noted that, the first supporting plate 12 is provided with a first avoiding hole 131 (refer to fig. 4), the first avoiding hole 131 is a through hole penetrating through the first supporting plate 12 from top to bottom, the second supporting plate 13 is provided with a second avoiding hole, the second avoiding hole is a through hole penetrating through the second supporting plate 13 from top to bottom, the second avoiding hole and the first avoiding hole 131 are communicated to form an avoiding space, the avoiding space penetrates through the supporting plate assembly 1, and the detecting assembly 2 penetrates through the first avoiding hole 131 and the second avoiding hole so as to electrically contact with a detecting point on a fixed frame of the storage area 11. Wherein, the first avoiding hole 131 may be one, the second avoiding holes are multiple, each second avoiding hole is communicated with the first avoiding hole 131, and one detecting point generally corresponds to one second avoiding hole.

The number and location of the bonded inspection points may also be different for different dies, so that it may be necessary to match different support plate assemblies 1 for different dies. In this embodiment, the second supporting plate 13 is used to support the bonded die, and the first supporting plate 12 is used to cooperate with the positive pressure component 5 to form a cavity, so that for different die, only the second supporting plate 13 needs to be replaced. That is, for the chip manufacturer, only the second support plate 13 matched with the die type is needed, so that the equipment cost can be reduced.

In addition, the first support plate 12 and the second support plate 13 are in sealing connection through a sealing element, and the sealing element surrounds the periphery of the first avoiding hole 131, so that gas in the cavity is prevented from leaking from a gap between the first support plate 12 and the second support plate 13. In particular, the seal may be an annular structure which is compressed between the first support plate 12 and the second support plate 13.

In addition, after the bound crystal grains are placed on the second supporting plate 13, the bound crystal grains can shield and seal the second avoidance holes on the second supporting plate 13, so that gas in the cavity can be prevented from leaking from the second avoidance holes.

As shown in fig. 4, in an embodiment, the second support plate 13 is provided with a negative pressure hole 132, where the negative pressure hole 132 is located in the storage area 11 to adsorb the bonded die placed in the storage area 11, and the specific negative pressure hole 132 is actually the first surface of the adsorption bracket. As shown in fig. 1, the detecting module 20 further includes a vacuum degree detector 6, and the vacuum degree detector 6 is used for detecting the vacuum degree in the negative pressure hole 132. The negative pressure holes 132 are connected to corresponding negative pressure sources, and when the negative pressure sources are operated, the negative pressure holes 132 can absorb the bound grains placed in the storage area 11. It is also possible to determine whether or not the bonded die is adsorbed at the negative pressure hole 132 by the detection of the vacuum degree detector 6, so that it is possible to determine whether or not the bonded die is placed on the second support plate 13. Specifically, when the vacuum degree in the negative pressure hole 132 is greater than or equal to the predetermined value, it is indicated that the opening formed by the negative pressure hole 132 in the storage area 11 is blocked, and further it is indicated that the bound die is placed on the second support plate 13; when the vacuum degree in the negative pressure hole 132 is smaller than the predetermined value, it is indicated that the opening of the negative pressure hole 132 formed in the storage area 11 is not blocked, and further it is indicated that the bonded die is not placed on the second supporting plate 13.

The vacuum degree detector 6 may be a vacuum pressure gauge or the like. In addition, the negative pressure hole 132 is connected with a negative pressure source through a corresponding electromagnetic valve, and the electromagnetic valve can control the connection and disconnection of the negative pressure hole 132 and the negative pressure source, so that whether the negative pressure is generated at the negative pressure hole 132 can be controlled according to the requirement.

In one embodiment, a plurality of negative pressure holes 132 may be provided. For example, in the embodiment shown in fig. 3, two vacuum holes 132 are provided, and the two vacuum holes 132 are provided at opposite ends of the storage area 11, respectively. Each negative pressure hole 132 is connected to a negative pressure source through a corresponding solenoid valve, wherein each negative pressure hole 132 may be connected to a negative pressure source through a solenoid valve.

In an embodiment, the negative pressure hole 132 forms openings at the side and upper surface of the second support plate 13, respectively, wherein the opening of the negative pressure hole 132 formed at the side of the second support plate 13 is used for mounting an air connector so as to be connected with a negative pressure source through the air connector.

As shown in fig. 4, in an embodiment in which the upper surface of the first support plate 12 is provided with the receiving groove 121, a portion of the air joint connected to the side of the second support plate 13 (the air joint is connected to the negative pressure hole 132) may be located in the receiving groove 121, which is advantageous in reducing the thickness of the second support plate 13.

As shown in fig. 4, in an embodiment, the first support plate 12 is further provided with a via hole 122, and the via hole 122 penetrates through the first support plate 12 from top to bottom, and an air pipe for connecting the negative pressure hole 132 and the negative pressure source penetrates through the first support plate 12 from the via hole 122. In addition, when the positive pressure component 5 and the first supporting plate 12 enclose a cavity, the through hole 122 communicates the cavity with the outside, so that the air pipe can extend into the cavity from the outside. At the same time, the size of the gas tube matches the size of the via 122 so that the via 122 is plugged by the gas tube so that the gas in the cavity leaks from the via 122. In particular, the diameter of the air tube may be greater than the diameter of the via 122. Further, the via hole 122 may be disposed in the receiving groove 121.

In an embodiment, the second supporting plate 13 is further provided with a corresponding positioning structure, and the placement position of the bound die on the second supporting plate 13 can be defined by the positioning structure, so that the bound die is more conveniently placed at a proper position of the second supporting plate 13. Wherein, the positioning structure may be a plurality of stoppers disposed on the upper surface of the second support plate 13. Each limiting block is distributed around the storage area 11, and the bound crystal grains can respectively collide with each limiting block after being placed in the storage area 11. In addition, in an implementation manner, the number of the positioning blocks may be four, and the four positioning blocks are respectively disposed in four directions of front, rear, left and right of the storage area 11.

As shown in fig. 2, in one embodiment, the detection assembly 2 includes a carrier plate 21, a pin die 22, a probe 23, and a circuit board 24; the bearing plate 21 is arranged below the supporting plate assembly 1, the needle mould 22 and the circuit board 24 are connected to the bearing plate 21, and the probe 23 is connected to the needle mould 22 and is electrically connected with the circuit board 24; the first driving component 3 can drive the bearing plate 21 to move up and down so as to drive the needle mould 22, the probe 23 and the circuit board 24 to move up and down; the probe 23 can pass through the avoiding space to collide with the detection point of the bound die placed in the storage area 11 when moving upward.

The circuit board 24 may be disposed on the upper surface of the carrier 21, the pin die 22 may be disposed on the upper surface of the circuit board 24, and the pin die 22 and the carrier 21 may be connected by bolts to clamp the circuit board 24, and in addition, the circuit board 24 and the pin die 22 are disposed between the carrier 21 and the support plate assembly 1. The probes 23 are provided in plurality, one probe 23 is used for abutting against one detection point to realize electric connection, and each probe 23 is electrically connected with the circuit board 24.

The probe 23 may be a double-ended probe 23, which is installed in a pinhole of the pin die 22, and both ends of the probe 23 extend out of the pinhole, at this time, both ends of the probe 23 are located at upper and lower sides of the pin die 22, respectively, wherein the end of the probe 23 located at the lower surface side of the pin die 22 is electrically connected to a corresponding solder joint on the circuit board 24, and the end of the probe 23 located at the upper surface side of the pin die 22 is electrically connected to a test point of the bonded die after passing through the avoiding space. The combination of the pin die 22 and the probe 23 is prior art and this embodiment is not described here too much.

The detecting assembly 2 further includes a detector for detecting and determining whether the corresponding detecting points are electrically connected, wherein the detector is connected with the circuit board 24, and the circuit board 24 can electrically connect the detector with each probe 23, and when a certain probe 23 collides with a detecting point of the bound die, the detector is electrically connected with the detecting point. Specifically, when the detector is electrically connected to two detection points through the probe 23 to form a closed circuit, it is indicated that the two detection points are electrically conducted, otherwise, it is indicated that there is no electrical conduction between the two detection points. In addition, the detector for detecting whether the two detection points are electrically conductive may be a prior art, and this embodiment will not be described herein.

In addition, when the first driving assembly 3 drives the carrier plate 21, the pin die 22, the probes 23 and the circuit board 24 to move upwards, the carrier plate 21 or the pin die 22 can collide with the supporting plate assembly 2 (specifically, collide with the first supporting plate), so that the height of the upward movement of the probes 23 can be limited, and the damage to the bonded crystal grains due to the excessive upward movement distance of the probes can be avoided.

As shown in fig. 2, in an embodiment, the detecting assembly 2 further includes a carrier plate guiding mechanism 25, where the carrier plate guiding mechanism 25 is connected to the carrier plate 21 and the support plate assembly 1, respectively, for guiding the up-and-down movement of the carrier plate 21. Wherein the bearing plate guiding mechanism 25 comprises a bearing plate guiding column and a bearing plate linear bearing; the bearing plate guide post is connected to the first support plate 12 and is positioned below the first support plate 12; the bearing plate linear bearings are connected to the bearing plate 21 and are matched with the bearing plate guide posts to limit and guide the bearing plate guide posts. In addition, the bearing plate 21 is provided with a mounting hole, the mounting hole penetrates through the bearing plate 21 from top to bottom, and the bearing plate is arranged in the mounting hole in a linear bearing manner. In addition, mounting hole, loading board guide post and loading board linear bearing all are equipped with a plurality ofly, and a case hole and a loading board linear bearing cooperation, a loading board linear bearing and a loading board guide post cooperation.

In an embodiment, the lower end of the bearing plate guide post is further provided with a limiting structure, when the first driving component 3 removes the force applied to the bearing plate 21, the bearing plate 21 can descend and reset under the action of gravity, and finally the bearing plate 21 (or the bearing plate linear bearing) can collide with the limiting structure, so as to prevent the bearing plate guide post and the bearing plate linear bearing from being disengaged. In addition, the limit structure can also be provided with a plurality of, and the lower extreme of every loading board guide post all is equipped with a limit structure.

As shown in fig. 5 and 6, in one embodiment, the first driving assembly 3 includes a first power source 31, an upper top plate 32, a plurality of elastic members 33, and a floating plate 34; each elastic member 33 is connected between the upper top plate 32 and the floating plate 34, so that the floating plate 34 can float up and down relative to the upper top plate 32; the first power source 31 is connected with the upper top plate 32 and is used for driving the upper top plate 32 to move up and down so as to drive the floating plate 34 to move up and down; the floating plate 34 is located below the detection assembly 2, and when the floating plate 34 moves upward, the detection assembly 2 can be lifted.

Wherein, both ends of each elastic member 33 are respectively connected to the upper top plate 32 and the floating plate 34, and each elastic member 33 may be a spring or the like. In addition, each elastic member 33 may be uniformly arranged between the upper top plate 32 and the floating plate 34. Compared with the arrangement of directly jacking up the detection assembly 2 through the upper top plate 32, the arrangement of the elastic piece 33 and the floating plate 34 can increase the fitting degree of the first driving assembly 3 and the detection assembly 2, and meanwhile, the buffer effect of the first driving assembly 3 and the detection assembly 2 can be further realized, so that the rigid collision of the first driving assembly 3 and the detection assembly 2 is avoided. In addition, when the floating plate 34 jacks up the detecting assembly 2, it is in fact in contact with the carrier plate 21 of the detecting assembly 2, that is, the floating plate 34 applies an upward force to the carrier plate 21, so that the carrier plate 21 drives the needle mold 22, the probe 23, and the like to move upward.

In an implementation, the floating plate 34 may be initially located below the carrier plate 21 and spaced a distance from the carrier plate 21; alternatively, in another possible embodiment, the floating plate 34 may be initially located below the carrier plate 21 and in contact with the carrier plate 21. In addition, the bearing plate 21 and the floating plate 34 may be connected together, and when the floating plate 34 moves downwards, the bearing plate 21 may be forced to drive the bearing plate 21 to move downwards; alternatively, there may be no connection between the carrier plate 21 and the floating plate 34, and when the floating plate 34 moves downward, the carrier plate 21 may move downward by its own weight.

The first power source 31 may be a driving mechanism capable of driving the object to move linearly, such as a cylinder, an electric cylinder, or a combination of a motor and a screw mechanism.

As shown in fig. 5 and 6, in one embodiment, the first drive assembly 3 further comprises a first mounting plate 35 and a first guide mechanism 36; the first mounting plate 35 is connected to the table 10, and the first power source 31 is connected to the first mounting plate 35; the first guide mechanism 36 connects the first mounting plate 35 and the upper top plate 32 for guiding the up-and-down movement of the upper top plate 32. When the first power source 31 is a cylinder, the cylinder body of the cylinder is connected to the first mounting plate 35, and the piston rod of the cylinder is connected to the upper top plate 32. In addition, the first mounting plate 35 is provided with a first avoiding through hole, the first avoiding through hole penetrates through the first mounting plate 35 from top to bottom, the cylinder body of the cylinder can be connected to the surface of the first mounting plate 35, and the piston rod of the cylinder can penetrate through the first mounting plate 35 from the first avoiding through hole and then is connected with the upper top plate 32.

In one embodiment, the first guide mechanism 36 includes a first guide post and a first linear bearing; the first guide post is connected to the upper top plate 32 and is positioned below the upper top plate 32; the first linear bearing is attached to the first mounting plate 35 and cooperates with the first guide post to limit guide the first guide post. In addition, the first mounting plate 35 is provided with a first mounting hole, the first mounting hole penetrates through the first mounting plate 35 from top to bottom, and the first linear bearing is mounted in the first mounting hole. In addition, the first mounting hole, the first guide post and the first linear bearing are all provided with a plurality of, and a first mounting hole is matched with a first linear bearing, and a first linear bearing is matched with a first guide post.

In one embodiment, a window is provided in the table 10, through which the interior of the cabinet 40 may communicate with the outside. The first support plate 12 may be an upper surface of the mounting table 10 and close the window. The detection assembly 2 may be located in the cabinet 40, and the probe 23 of the detection assembly 2 may pass through the avoidance space of the support plate assembly 1 from the window. In addition, the first drive assembly 3 is also located within the cabinet 40. This arrangement can reduce the space occupied by the entire detection apparatus 100.

As shown in fig. 7, in one embodiment, the positive pressure assembly 5 includes a positive pressure plate 51, and a positive pressure chamber 52 is provided on a lower surface of the positive pressure plate 51; the positive pressure plate 51 is provided with a vent hole, the vent hole penetrates through the outer surface of the positive pressure plate 51 to be communicated with the positive pressure cavity 52, the vent hole is used for being connected with an air source, and air of the air source enters the positive pressure cavity 52 through the vent hole; the second driving component 4 is connected with the positive pressure plate 51 and is used for driving the positive pressure plate 51 to move up and down between a first position and a second position; when the positive pressure plate 51 moves downward, it can press against the support plate assembly 1, so that the support plate assembly 1 can close the opening of the positive pressure chamber 52 to enclose a cavity. Wherein, the positive pressure plate 51 can be pressed on the first support plate 12 when moving downwards, the first support plate 12 seals the opening of the positive pressure cavity 52 on the lower surface of the positive pressure plate 51, and the positive pressure cavity 52 is sealed to form a cavity. The vent holes may be provided on the side of the positive pressure plate 51 or on the upper surface of the positive pressure plate 51. In addition, the positive pressure plate 51 moves up and down between the first position and the second position, that is, the positive pressure assembly 5 moves up and down between the first position and the second position.

In an embodiment, the positive pressure plate 51 is further provided with an exhaust hole, and the exhaust hole is also penetrated from the outer surface of the positive pressure plate 51 to be communicated with the positive pressure cavity 52. The vent hole is connected with the air source through the corresponding electromagnetic valve, the vent hole is also connected with the corresponding electromagnetic valve, and the electromagnetic valve connected to the electromagnetic valve and the vent hole can be the same electromagnetic valve. When the air in the cavity needs to be exhausted, the air exhaust hole is closed through the electromagnetic valve, and the air vent hole is opened, and when the air in the cavity needs to be exhausted, the air exhaust hole is opened through the battery valve, and the air vent hole is closed.

In one embodiment, the vent holes and the exhaust holes are all penetrated from the side surface of the positive pressure plate 51 to be communicated with the positive pressure cavity 52, and the openings of the vent holes and the exhaust holes on the side surface of the positive pressure plate 51 are respectively connected with air connectors. As shown in fig. 7, a first notch 53 and a second notch 54 are provided on the side surface of the positive pressure plate 51, the first notch 53 and the second notch 54 penetrate through the positive pressure plate 51 from top to bottom, the vent hole is provided in the first notch 53, the vent hole is provided in the second notch 54, the air connector connected to the vent hole is located in the first notch 53 after assembly, and the air connector connected to the vent hole is located in the second notch 54. This allows the air connection at the vent and vent holes to be protected and the overall device volume to be reduced.

In one embodiment, as shown in fig. 7, the positive pressure cavity 52 is a blind hole that forms an opening only in the lower surface of the positive pressure plate 51. In addition, the positive pressure chamber 52 is a stepped hole, and the size of the lower region of the positive pressure chamber 52 is larger than the size of the upper region thereof. Specifically, along the top-down direction, the positive pressure cavity 52 includes a first hole 521 and a second hole 522 that are sequentially communicated, where in an implementation manner, the first hole 521 and the second hole 522 are square holes, the first hole 521 and the second hole 522 may be coaxially disposed, the length of the first hole 521 is greater than the length of the second hole 522, the width of the first hole 521 is greater than the width of the second hole 522, and the periphery of the second hole 522 forms a stepped structure. In another possible embodiment, the first hole 521 and the second hole 522 may be circular holes, in which case the diameter of the first hole 521 is larger than the diameter of the second hole 522, and the first hole 521 and the second hole 522 may be coaxially disposed.

The vent holes penetrate through to be communicated with the upper area of the positive pressure cavity 52, namely the vent holes penetrate through to be communicated with the second hole 522, so that the gas introduced into the cavity firstly enters the first hole 521 and then enters the second hole 522, and the flow rate is reduced when the gas flows to the second hole 522 due to the fact that the size of the second hole 522 is larger, and larger impact of the gas flow on the components on the bonded crystal grains can be effectively avoided.

As shown in fig. 7, in an embodiment, the inner surface of the positive pressure cavity 52 is provided with a concave structure 55, the vent holes penetrate to the inner surface of the concave structure 55, and the diameter of the concave structure 55 is larger than the diameter of the vent holes. The gas introduced into the cavity first enters the concave structure 55 from the vent hole to slow down the flow rate, thereby reducing the impact of the gas flow on the components on the bonded die. The concave structure 55 may be disposed on the bottom surface of the positive pressure cavity 52, and the concave structure 55 is also a blind hole, and the vent hole penetrates to the side surface of the concave structure 55, that is, the opening of the vent hole in the positive pressure cavity 52 is located on the side surface of the concave structure 55. In addition, when the cross section of the concave structure 55 may be circular, square, or the like, the diameter of the concave structure 55 is the equivalent diameter of its cross section when the cross section of the concave structure 55 is not circular.

In addition, as shown in fig. 7, the positive pressure plate 51 assembly further includes a sealing ring 56, the sealing ring 56 is connected to the positive pressure plate 51, and the sealing ring 56 surrounds the positive pressure chamber 52. When the positive pressure plate 51 moves downwards, the sealing ring 56 can be driven to move downwards, and finally the sealing ring 56 is pressed on the support plate assembly 1, so that the positive pressure plate 51 and the support plate assembly 1 are in sealing contact, and leakage of gas in the cavity from a gap between the positive pressure plate 51 and the support plate assembly 1 is avoided. Specifically, the sealing ring 56 may be connected to the lower surface of the positive pressure plate 51 by means of screw fastening or bonding, and when the positive pressure plate 51 moves downward, the sealing ring 56 may be pressed against the first support plate 12. In other embodiments, the sealing ring 56 may be disposed on the first support plate 12, and may press on the sealing ring 56 when the positive pressure plate 51 moves downward, where the sealing ring 56 surrounds the positive pressure chamber 52.

As shown in fig. 8 and 9, in one embodiment, the second driving assembly 4 includes a support 41, a second mounting plate 42, a pressing plate 43, a second guide mechanism 44, and a second power source 45; the support 41 is attached to the table 10; a second mounting plate 42 is connected to the support 41, and a second power source 45 is connected to the second mounting plate 42 and connected to the pressure plate 43; the pressing plate 43 is connected with the positive pressure assembly 5; the second power source 45 is used for driving the pressing plate 43 to move up and down, so as to drive the positive pressure component 5 to move up and down; the second guide mechanism 44 connects the second mounting plate 42 and the pressing plate 43 for guiding the up-and-down movement of the pressing plate 43.

The supporting member 41 includes two upright posts, the two upright posts are arranged at intervals, the lower ends of the two upright posts are respectively connected with the workbench 10, and the upper ends of the two upright posts are respectively connected with the second mounting plate 42; the pressure plate 43 is located below the second mounting plate 42, and the pressure plate 43 may be connected to the positive pressure plate 51 and located above the positive pressure plate 51. The second guide mechanism 44 includes a second guide post and a second linear bearing, the second guide post is connected to the second mounting plate 42, the second linear bearing is connected to the platen 43, and the up-and-down movement of the platen 43 can be guided by the cooperation of the second guide post and the second linear bearing.

The second power source 45 may be a cylinder, wherein a cylinder body of the cylinder is connected to the second mounting plate 42, and a piston rod of the cylinder is connected to the pressure plate 43. The cylinder may be connected to the upper surface of the second mounting plate 42, at this time, the second mounting plate 42 is further provided with a second avoidance through hole, the second avoidance through hole penetrates through the second mounting plate 42 from top to bottom, and a piston rod of the cylinder penetrates through the second mounting plate 42 from the second avoidance through hole and is then connected to the pressing plate 43. Of course, the second power source 45 may be a driving mechanism capable of driving the object to move linearly, such as an electric cylinder or a combination of a motor and a screw mechanism.

As shown in fig. 1, the detecting device 100 further includes a pressure detecting gauge 50, and the pressure detecting gauge 50 is configured to detect whether the air pressure in the cavity reaches a predetermined value, and if so, stop ventilation into the cavity. The pressure gauge 50 may be mounted on the cabinet 40.

It should be understood that the detecting device 100 further includes a controller, which is connected to the first driving assembly 3, the second driving assembly 4, the vacuum degree detector 6, and the pressure detecting gauge 50, respectively, and the above-mentioned solenoid valve of the negative pressure hole 132, the solenoid valve connected to the air vent hole, and the solenoid valve connected to the air vent hole are also connected to the controller; meanwhile, the detector for detecting whether the two detection points are electrically conducted or not can also be connected with the controller. This allows the controller to control the operation of the entire test device 100. In addition, the controller may be a PLC, a single chip microcomputer, or the like, and the controller may be installed in the cabinet 40.

As shown in fig. 1, in an embodiment, the detection device 100 further includes an activation button 60, where the activation button 60 is connected to the control device, and when the activation button 60 is pressed, the control device starts to control the operation of the relevant components of the entire detection device 100. In addition, the number of the start buttons 60 is two, and when the two start buttons 60 are pressed simultaneously, the control device starts to control the operation of the relevant components of the detection device 100. In addition, the start button 60 may be mounted on the cabinet 40.

As shown in fig. 1, in an embodiment, the detection device 100 further includes a scram button 70, where the scram button 70 is connected to the control device, and when the scram button 70 is pressed, the whole detection device 100 can be controlled to be powered off and air-off. In addition, the scram button 70 may be mounted on the cabinet 40.

In one embodiment, the detection device 100 further includes a safety light curtain mounted on the table 10 and connected to the control device, the safety light curtain being used to provide safety protection for the operator's work.

The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The foregoing description of the preferred embodiments of the invention is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the invention.

Claims

1. The detection device is characterized by comprising a workbench, a detection module and a positive pressure module, wherein the detection device is used for detecting the bound crystal grains;

The detection module comprises a support plate assembly, a detection assembly and a first driving assembly;

the supporting plate component is connected to the workbench, and a storage area for placing the bound grains is arranged on the supporting plate component;

the first driving component is used for driving the detection component to move, so that the detection component can be electrically connected with the test point of the bound crystal grain placed in the storage area;

the positive pressure module comprises a second driving component and a positive pressure component;

the second driving component is connected to the workbench; the positive pressure component is connected to the second driving component and is positioned above the supporting plate component;

the second driving assembly is used for driving the positive pressure assembly to move up and down between a first position and a second position, and when the positive pressure assembly moves downwards from the first position to the second position, the positive pressure assembly can be contacted with the supporting plate assembly to enclose a cavity, and the storage area is positioned in the cavity;

the positive pressure assembly is used for being connected with an air source so as to ventilate the cavity through the air source, and the bound crystal grains placed in the storage area are pressed on the supporting plate assembly.

2. The inspection device of claim 1, wherein the support plate assembly includes a first support plate and a second support plate, the first support plate being coupled to the table, the second support plate being removably coupled to the first support plate;

the first supporting plate is used for enclosing the positive pressure component to form the cavity;

the storage area is positioned on the second support plate, and when the first support plate and the positive pressure assembly enclose to form the cavity, the second support plate is positioned in the cavity.

3. The inspection apparatus according to claim 2, wherein the second support plate is provided with a negative pressure hole, and the negative pressure hole is located in the storage area to adsorb the bound die placed in the storage area;

the detection module further comprises a vacuum degree detector, and the vacuum degree detector is used for detecting the vacuum degree in the negative pressure hole.

4. The test device of claim 1, wherein the test assembly comprises a carrier plate, a pin die, a probe, and a circuit board;

the support plate assembly is provided with an avoidance space, and the avoidance space is positioned in the storage area and penetrates through the support plate assembly;

The bearing plate is arranged below the supporting plate assembly, the pin die and the circuit board are connected to the bearing plate, and the probe is connected to the pin die and is electrically connected with the circuit board;

the first driving component can drive the bearing plate to move up and down so as to drive the needle mould, the probe and the circuit board to move up and down;

when the probe moves upwards, the probe can pass through the avoidance space to be abutted against the bound crystal grains placed in the storage area.

5. The inspection apparatus of claim 4, wherein the inspection assembly further comprises a carrier guide mechanism coupled to the carrier and the support plate assembly, respectively, for guiding the up and down movement of the carrier.

6. The detection device of claim 1, wherein the first drive assembly comprises a first power source, an upper top plate, a plurality of elastic members, and a floating plate;

each elastic piece is connected between the upper top plate and the floating plate, so that the floating plate can float up and down relative to the upper top plate;

the first power source is connected with the upper top plate and is used for driving the upper top plate to move up and down so as to drive the floating plate to move up and down;

The floating plate is positioned below the detection assembly, and can jack up the detection assembly when moving upwards.

7. The detection device of claim 6, wherein the first drive assembly further comprises a first mounting plate and a first guide mechanism;

the first mounting plate is connected to the workbench, and the first power source is connected to the first mounting plate;

the first guide mechanism is connected with the first mounting plate and the upper top plate and is used for guiding the up-and-down movement of the upper top plate.

8. The apparatus according to claim 1, wherein the positive pressure assembly comprises a positive pressure plate having a positive pressure chamber provided on a lower surface thereof;

the positive pressure plate is provided with a vent hole, the vent hole penetrates through the outer surface of the positive pressure plate to be communicated with the positive pressure cavity, and the vent hole is used for being connected with an air source;

the second driving component is connected with the positive pressure plate and used for driving the positive pressure plate to move up and down;

when the positive pressure plate moves downwards, the positive pressure plate can be pressed on the supporting plate assembly, so that the opening of the positive pressure cavity can be closed by the supporting plate assembly, and the cavity is formed by enclosing.

9. The device of claim 8, wherein the inner surface of the positive pressure cavity is provided with a concave structure, and the vent hole penetrates to the inner surface of the concave structure, wherein the diameter of the concave structure is larger than the diameter of the vent hole.

10. The detection device of claim 1, wherein the second drive assembly comprises a support frame, a second mounting plate, a platen, a second guide mechanism, and a second power source;

the support frame is connected to the workbench;

the second mounting plate is connected to the supporting frame;

the second power source is connected to the second mounting plate and is connected with the pressing plate;

the pressing plate is connected with the positive pressure component;

the second power source is used for driving the pressing plate to move up and down so as to drive the positive pressure component to move up and down;

the second guide mechanism is connected with the second mounting plate and the pressing plate and is used for guiding the up-and-down movement of the pressing plate.