CN116041936A

CN116041936A - Resin composition, prepreg and application thereof

Info

Publication number: CN116041936A
Application number: CN202211655180.8A
Authority: CN
Inventors: 郭永军; 肖浩; 漆小龙
Original assignee: Research Institute Of Tsinghua Pearl River Delta; Guangdong Ying Hua New Mstar Technology Ltd
Current assignee: Research Institute Of Tsinghua Pearl River Delta; Guangdong Ying Hua New Mstar Technology Ltd
Priority date: 2022-12-22
Filing date: 2022-12-22
Publication date: 2023-05-02

Abstract

The application provides a resin composition, which is prepared by compounding modified polyphenyl ether resin, hydrocarbon resin and bismaleimide resin, and is cooperated with a flame retardant, a cross-linking agent and an initiator, so that the problem of the rigid structure of the polyphenyl ether resin can be solved, the thermal expansion coefficient of the resin composition is reduced, and the problem of warpage expansion of the resin composition can be further solved. And the reasonable compatibility of the modified polyphenyl ether resin, hydrocarbon resin, bismaleimide resin, the cross-linking agent and the components can ensure the low thermal expansion coefficient, low dielectric constant and low dielectric loss of the resin composition. Meanwhile, the resin composition can improve the solubility of the bismaleimide resin under the synergistic effect of the components, and can enhance the compatibility of the components.

Description

Resin composition, prepreg and application thereof

Technical Field

The application belongs to the field of high polymer materials, and particularly relates to a resin composition, a prepreg and application thereof.

Background

In recent years, with the development of electronic information technology, electronic equipment has been miniaturized and densified, and information has been increased in capacity and speed, and there has been a demand for higher performance of electronic materials. This places higher demands on the properties of the substrate material carrying the semiconductor elements, in particular on the Coefficient of Thermal Expansion (CTE).

In the semiconductor packaging process, if the thermal expansion coefficient between the semiconductor element and the substrate material is too large, the material warpage is easily caused by stress, so that serious problems such as poor connection between the semiconductor element and the substrate material, and poor connection between the substrate material and the PCB are caused. Therefore, a lower thermal expansion coefficient in the X/Y axis direction is required for the substrate material. Meanwhile, with the development and the large-scale of 5G, the high speed and high frequency of the transmission signal require materials with better dielectric properties, i.e., lower dielectric constant and dielectric loss.

Disclosure of Invention

In view of the foregoing problems in the prior art, an object of the present application is to provide a resin composition, a prepreg and applications thereof. The resin composition has a low coefficient of thermal expansion and also has a low dielectric constant and dielectric loss.

In order to achieve the above purpose, the present application adopts the following technical scheme:

the application provides a resin composition which comprises the following components in parts by weight:

wherein the structural formula of the modified polyphenyl ether resin is as follows:

wherein m and n are positive integers, the sum of m and n is 5-50, and the number average molecular weight of the modified polyphenyl ether resin is 500-4000; r is cycloalkyl or asymmetric branched alkyl.

In one embodiment, the cycloalkyl is C ₅ ～C ₇ Cycloalkyl;

the asymmetric branched alkyl group is C ₃ ～C ₆ An asymmetric branched alkyl group.

In one embodiment, the ratio of the modified polyphenylene ether resin to the hydrocarbon resin is 100 parts by weight to 20-60 parts by weight.

The coating comprises the following components in parts by weight:

in one embodiment, the cycloalkyl is selected from any one of cyclopentyl, cyclohexyl, cycloheptyl, 3-methylcyclohexyl, 3-methylcycloheptyl, or 3, 5-dimethylcyclohexyl;

the asymmetric branched alkyl is selected from any one of methylethyl, methylpropyl, ethylpropyl, methylbutyl or ethylbutyl.

In one embodiment, the hydrocarbon resin comprises one or two of polybutadiene, a copolymer of butadiene and styrene.

In one embodiment, the hydrocarbon resin is a copolymer of butadiene and styrene,

further, the number average molecular weight of the copolymer of butadiene and styrene is 1000-20000, the molar content of butadiene in the copolymer of butadiene and styrene is 40-90%, and the molar content of styrene in the copolymer of butadiene and styrene is 10-60%.

In one embodiment, the resin composition has one or more of the following features:

(1) The bismaleimide resin comprises one or more of biphenyl bismaleimide resin, polyphenylmethane maleimide and bis (3-ethyl-5-methyl-4-maleimidophenyl) methane;

(2) The crosslinking agent comprises one or more of allyl compounds, styrene, divinylbenzene, acrylate compounds, methacrylate compounds, polybutadiene, and bismaleimide compounds;

(3) The flame retardant comprises

Wherein n1 and n2 are positive integers;

(4) The initiator comprises one or more of alpha, alpha ' -bis (tertiary butyl peroxyisopropyl) benzene, dicumyl peroxide, 2, 5-dimethyl-2, 5-di (tertiary butyl peroxy) hexane, di-tertiary butyl peroxide, 2, 5-dimethyl-2, 5-di (tertiary butyl peroxy) -3-hexyne, benzoyl peroxide, 3', 5' -tetramethyl-1, 4-diphenoquinone, tetrachlorobenzoquinone, 2,4, 6-tri-tertiary butyl phenoxy, tertiary butyl peroxyisopropyl monocarbonate and azobisisobutyronitrile;

(4) The inorganic filler includes one or more of silica, alumina, titania, mica, aluminum hydroxide, magnesium hydroxide, talc, aluminum borate, barium sulfate, and calcium carbonate.

In one embodiment, the flame retardant is

。

The application also provides a prepreg comprising a substrate and the resin composition according to any one of the embodiments above supported on the substrate.

The application also provides an application of the prepreg in the preparation of a laminated board, a copper-clad plate or a wiring board.

The application provides a resin composition, which is prepared by compounding modified polyphenyl ether resin, hydrocarbon resin and bismaleimide resin, and is cooperated with a flame retardant, a cross-linking agent and an initiator, so that the problem of the rigid structure of the polyphenyl ether resin can be solved, the thermal expansion coefficient of the resin composition is reduced, and the problem of warpage expansion of the resin composition can be solved. And the reasonable compatibility of the modified polyphenyl ether resin, hydrocarbon resin, bismaleimide resin, the cross-linking agent and the components can ensure the low thermal expansion coefficient, low dielectric constant and low dielectric loss of the resin composition. Meanwhile, the resin composition can improve the solubility of the bismaleimide resin under the synergistic effect of the components, and can enhance the compatibility of the components.

Detailed Description

The resin composition, prepreg and application thereof of the present application will be described in further detail with reference to specific examples. This application may be embodied in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete. Of course, they are merely examples and are not intended to limit the present application.

When a range of values is disclosed herein, the range is considered to be continuous and includes both the minimum and maximum values for the range, as well as each value between such minimum and maximum values. Further, when a range refers to an integer, each integer between the minimum and maximum values of the range is included. Further, when multiple range description features or characteristics are provided, the ranges may be combined. In other words, unless otherwise indicated, all ranges disclosed herein are to be understood to include any and all subranges subsumed therein.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. Unless otherwise indicated or contradicted, terms or phrases used herein have the following meanings:

in the present application, the technical features described in an open manner include a closed technical scheme composed of the listed features, and also include an open technical scheme including the listed features.

In the present application, the term "percentage content" refers to mass percentage for both solid-liquid and solid-solid phase mixtures and volume percentage for liquid-liquid phase mixtures unless otherwise specified.

In this application, reference to percent concentration, unless otherwise indicated, refers to the final concentration. The final concentration refers to the ratio of the additive component in the system after the component is added.

In this application, "×" indicates a ligation site.

In this application, where no attachment site is indicated in a group, an optionally attachable site in the group is meant as an attachment site.

In the present application, the single bond to which the substituent is attached extends through the corresponding ring, a tableThe substituents may be attached to optional positions of the ring, e.g

R is connected with any substitutable site of benzene ring, and the functional group of R is not limited to 1. For example, a->

Meaning that the benzene ring contains 1-6R functional groups. Suitable examples include, but are not limited to:

as used herein, "cycloalkyl" refers to a non-aromatic hydrocarbon containing ring carbon atoms, and may be a monocyclic alkyl group, or a spirocycloalkyl group, or a bridged cycloalkyl group. Phrases containing this term, e.g., "C ₅ ～C ₇ Cycloalkyl "means cycloalkyl containing 5 to 7 carbon atoms, and each occurrence may be, independently of the other, C ₅ Cycloalkyl, C ₆ Cycloalkyl, C ₇ Cycloalkyl groups. Suitable examples include, but are not limited to: cyclopentyl, cyclohexyl, and cycloheptyl. In addition, "cycloalkyl" may also contain one or more double bonds, and representative examples of cycloalkyl groups containing double bonds include cyclopentenyl, cyclohexenyl, and cyclohexadienyl.

In this application, phrases containing "asymmetric branched alkyl" such as, "C ₃ ～C ₆ The term "asymmetric branched alkyl" refers to an asymmetric branched alkyl group containing 3 to 6 carbon atoms, which may be, independently of one another, C at each occurrence ₃ Asymmetric branched alkyl, C ₄ Asymmetric branched alkyl, C ₅ Asymmetric branched alkyl, C ₆ An asymmetric branched alkyl group. Suitable examples include, but are not limited to: methylethyl, methylpropyl, ethylpropyl, methylbutyl, ethylbutyl or methylpentyl.

In one example, the cycloalkyl is C ₅ ～C ₇ Cycloalkyl groups.

In one example, the asymmetric branched alkyl group is C ₃ ～C ₆ An asymmetric branched alkyl group.

Preferably, the modified polyphenylene ether resin has a number average molecular weight of 800 to 3000. Further, the modified polyphenylene ether resin has a number average molecular weight of 1000 to 2500. More preferably, the modified polyphenylene ether resin has a number average molecular weight of 1200 to 2200.

In the present application, the number average molecular weight may be any value obtained by measuring by a usual molecular weight measurement method, and may be, but is not limited to, a value obtained by Gel Permeation Chromatography (GPC).

In the application, the modified polyphenyl ether resin has smaller molecular weight by limiting the number average molecular weight, the values of m and n and the R functional group of the modified polyphenyl ether resin, and has the advantages of good distribution and high solvent selectivity; the modified polypropylene resin composition has the advantages of good heat resistance, good structural stability, good toughness, high solvent selectivity, small polymerization molecular weight and good distribution when being applied to a resin composition.

It is understood that, in the present application, the average number of vinyl groups per molecule of the modified polyphenylene ether compound in the modified polyphenylene ether resin is not particularly limited. Specifically, it is preferably 1 to 5, more preferably 1 to 3, and still more preferably 1.5 to 3. If the number of the terminal functional groups is too small, it tends to be difficult to obtain a sufficient heat resistance of the cured product. Further, if the number of terminal functional groups is too large, the reactivity becomes too high, and there is a possibility that a problem such as a decrease in the storage stability of the resin composition or a decrease in the fluidity of the resin composition may occur. That is, if the modified polyphenylene ether compound is used, there is a possibility that a problem of moldability may occur due to insufficient fluidity, for example, a molding defect such as void formation occurs at the time of multilayer molding, and it is difficult to obtain a wiring board with high reliability.

In one example, the resin composition includes 50 parts to 150 parts of the modified polyphenylene ether resin in parts by weight. Specifically, the parts by weight of the modified polyphenylene ether resin include, but are not limited to, 50 parts, 60 parts, 70 parts, 80 parts, 90 parts, 100 parts, 120 parts, 140 parts, or 150 parts.

In one example, the resin composition includes 10 parts to 100 parts of hydrocarbon resin in parts by weight. Specifically, the parts by weight of the hydrocarbon resin include, but are not limited to, 10 parts, 20 parts, 50 parts, 70 parts, 80 parts, 90 parts, or 100 parts. Further, the resin composition includes 20 to 100 parts by weight of hydrocarbon resin.

In one example, the resin composition includes 10 parts to 100 parts of the bismaleimide resin in parts by weight. Specifically, the parts by weight of the bismaleimide resin include, but are not limited to, 10 parts, 20 parts, 40 parts, 50 parts, 60 parts, 80 parts, or 100 parts. Further, the resin composition includes 20 to 80 parts by weight of a bismaleimide resin.

In one example, the resin composition includes 100 parts to 400 parts of the inorganic filler in parts by weight. Specifically, the parts by weight of the inorganic filler include, but are not limited to, 100 parts, 200 parts, 300 parts, or 400 parts.

In one example, the resin composition includes 5 parts to 100 parts of the flame retardant in parts by weight. Specifically, the parts by weight of the flame retardant include, but are not limited to, 5 parts, 6 parts, 7 parts, 10 parts, 20 parts, 30 parts, 40 parts, 50 parts, 60 parts, 70 parts, 80 parts, 90 parts, or 100 parts.

In one example, the resin composition includes 20 parts to 80 parts of the crosslinking agent in parts by weight. Specifically, the cross-linking agent includes, but is not limited to, 20 parts, 30 parts, 35 parts, 38 parts, 39 parts, 40 parts, 42 parts, 45 parts, 50 parts, 60 parts, 70 parts, 79 parts, or 80 parts by weight.

In one example, the resin composition includes 0.05 parts to 5 parts of an initiator in parts by weight. Specifically, the weight parts of the initiator include, but are not limited to, 0.05 parts, 0.09 parts, 0.1 parts, 0.11 parts, 0.15 parts, 0.2 parts, 1 part, 2 parts, 3 parts, 4 parts, or 5 parts.

In one example, the ratio of the modified polyphenylene ether resin to the hydrocarbon resin is 100 parts to (20-60) parts.

By adjusting the mass parts of the modified polyphenylene ether resin and the hydrocarbon resin, the dielectric property of the resin composition can be sufficiently improved, the viscosity of the resin composition can be effectively controlled, and the permeability of the resin composition into a substrate can be improved.

In one example, the composition comprises the following components in parts by weight:

in one example, the cycloalkyl group is selected from any one of cyclopentyl, cyclohexyl, cycloheptyl, 3-methylcyclohexyl, 3-methylcycloheptyl, or 3, 5-dimethylcyclohexyl.

In one example, the asymmetric branched alkyl group is selected from any one of methylethyl, methylpropyl, ethylpropyl, methylbutyl, or ethylbutyl.

In one example, the hydrocarbon resin includes one or two of polybutadiene, a copolymer of butadiene and styrene.

Understandably, the butadieneThe structural formula of the copolymer with styrene is

Wherein m represents the number of moles of butadiene and n represents the number of moles of styrene.

The number average molecular weight of the copolymer of polybutadiene and styrene plays an important role in increasing the glass transition temperature and heat resistance of the resin composition. If the molecular weight of the hydrocarbon resin is too small, the glass transition temperature or the heat resistance of the cured product tends to be lowered. If the molecular weight of the hydrocarbon resin is too large, the viscosity of the resin composition or the viscosity at the time of thermoforming may be large. Therefore, when the weight average molecular weight of the hydrocarbon resin is within the above range, the glass transition temperature and the heat resistance are further excellent, and the occurrence of thermal degradation with respect to dielectric characteristics can be further suppressed.

In one example, the hydrocarbon resin is a copolymer of butadiene and styrene.

In one example, the bismaleimide resin includes one or more of biphenyl-type bismaleimide resin, polyphenylenemaleimide, and bis (3-ethyl-5-methyl-4-maleimidophenyl) methane.

Preferably, the structural formula of the bismaleimide resin is:

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wherein n is a positive integer.

In one example, the crosslinking agent includes one or more of an allyl compound, styrene, divinylbenzene, an acrylate compound, a methacrylate compound, polybutadiene, and a bismaleimide compound.

In one example, the flame retardant includes

、/>

Wherein n1 and n2 are positive integers.

The halogen-free flame retardant selected by the application can effectively reduce the dielectric property under the condition of not influencing the glass transition temperature.

In one example, the initiator includes one or more of α, α ' -bis (t-butylperoxym-isopropyl) benzene, dicumyl peroxide, 2, 5-dimethyl-2, 5-di (t-butylperoxy) hexane, di-t-butyl peroxide, 2, 5-dimethyl-2, 5-di (t-butylperoxy) -3-hexyne, benzoyl peroxide, 3', 5' -tetramethyl-1, 4-diphenoquinone, tetrachlorobenzoquinone, 2,4, 6-tri-t-butylphenoxy, t-butylperoxyisopropyl monocarbonate, and azobisisobutyronitrile.

In one example, the inorganic filler includes one or more of silica, alumina, titania, mica, aluminum hydroxide, magnesium hydroxide, talc, aluminum borate, barium sulfate, and calcium carbonate.

Preferably, the inorganic filler includes one or more of silica, mica, and talc.

More preferably, the inorganic filler is spherical silica.

In one example, the flame retardant is

。

In one example, the resin composition further includes a solvent.

The solvent can change the solid content of the resin composition and adjust the viscosity of the resin composition.

In one example, the solvent includes one or more of methanol, ethanol, ethylene glycol monomethyl ether, acetone, butanone, methyl isobutyl ketone, cyclohexanone, toluene, xylene, methoxyethyl acetate, ethoxyethyl acetate, propoxyethyl acetate, ethyl acetate, dimethylformamide, dimethylacetamide, and propylene glycol methyl ether.

In one example, the resin composition further includes a functional resin.

In one example, the functional resin includes one or more of epoxy resin, phenolic resin, anhydride, benzoxazine resin, rubber, and modified PTFE.

The present application provides a prepreg comprising a substrate and the resin composition of any one of the above examples supported on the substrate.

The application also provides a preparation method of the prepreg, which comprises the following steps:

mixing the components in the resin composition in a solvent to prepare a resin composition;

the resin composition is supported on a substrate to prepare a prepreg.

It is to be understood that the manner in which the components are mixed in the solvent is not limited in this application, as long as the manner in which the components can be mixed. For example, each component which is soluble in the organic solvent may be put into the organic solvent to be completely dissolved, and heating may be performed as needed; thereafter, an organic solvent-insoluble component such as a flame retardant and an inorganic filler is added thereto, and stirred and mixed using a ball mill, a bead mill, a planetary mixer, a roll mill, or the like.

The manner in which the resin composition is supported on the substrate is not limited in the present application. Examples thereof include impregnation, coating and spraying. The method for producing the prepreg includes a step of supporting the resin composition on a substrate, and then drying and heating the resin composition. In addition, the impregnation, coating, and spraying steps in the present application may be repeated as many times as necessary. In addition, the composition and the solid content of the thermosetting resin composition may be adjusted to the final composition and the final gum content by repeated impregnation using a plurality of thermosetting resin compositions having different compositions and different solid contents.

In this application, the substrate is a well-known inorganic or organic fibrous material, and the inorganic fibrous substrate includes, but is not limited to, glass fiber cloth, carbon fiber, silicon carbide fiber, or asbestos fiber. Organic fibrous substrates include, but are not limited to, nylon, ultra-high molecular weight polyethylene fibers, aramid fibers, polyimide fibers, polyester fibers, or cotton fibers. The fiberglass cloth includes, but is not limited to, E, NE, D, S, T type.

Preferably, the substrate is a glass fiber cloth.

More preferably, the substrate is a flattened fiberglass cloth. The flattening process is a process of continuously pressing a glass cloth with a press roll at a proper pressure to compress the yarn into a flat shape.

and heating the prepreg to prepare the prepreg.

In one example, the heated process parameters include: the temperature is set to 80-200 ℃ and the time is set to 1-20 min.

Further, the process parameters of heating include: the temperature is set to be 110-190 ℃ and the time is set to be 2-10 min.

The application also provides an application of the prepreg in any example in preparation of a laminated board, a copper-clad plate or a wiring board.

The application also provides a laminated board, which comprises the prepreg according to the embodiment.

The application also provides a preparation method of the laminated board, which comprises the following steps:

one or more prepregs are selected for lamination to prepare the laminated board.

In one example, the lamination process parameters include: the temperature is set to 170 ℃ to 250 ℃ and the pressure is set to 10kgf/cm ² ～30kgf/cm ² And the vacuum degree is less than 2kPa, and the hot press molding is carried out for 60-120 min.

The application also provides a copper-clad plate, which comprises the prepreg and the metal foils coated on one side or two sides of the prepreg after lamination.

In one example, the metal foil has a thickness of 3 μm to 70 μm.

In order to make the objects and advantages of the present invention more apparent, the resin composition, prepreg and use thereof according to the present invention will be described in further detail with reference to the following examples, which are to be construed as merely illustrative, and not limitative of the present invention. The following examples are not specifically described but do not include other components than the unavoidable impurities. The drugs and apparatus used in the examples are all routine choices in the art, unless specifically indicated. The experimental methods without specific conditions noted in the examples were carried out according to conventional conditions, such as those described in the literature, books, or recommended by the manufacturer.

The raw materials used in the following examples and comparative examples are as follows:

[ modified polyphenylene ether resin ]

SA9000, a methacrylic acid-modified polyphenylene ether resin, manufactured by Sabic company;

OPE-1200-2st, styrene-modified polyphenylene ether resin, mitsubishi company;

[ Cross-linking agent ]

TAIC, triallyl isocyanurate, manufactured by japan chemical industry company;

[ Hydrocarbon resin ]

R100, a butadiene and styrene copolymer, manufactured by gram Lei Weili company;

b-1000, polybutadiene manufactured by Cao corporation;

[ bismaleimide resin ]

MIR-3000, biphenyl bismaleimide resin manufactured by Japanese chemical Co., ltd;

BMI-2300, polyphenylenemaleimide, manufactured by Japanese Kagaku chemical Co., ltd;

BMI-5100, bis (3-ethyl-5-methyl-4-maleimidophenyl) methane, manufactured by Daand chemical company of Japan;

[ flame retardant ]

GU304, double DPO type phosphorus-containing flame retardant, melting point 320 ℃, P% = 12%, molecular formula

Manufactured by koyi corporation;

PX-200, resorcinol bisxylyl phosphate, P% = 9%, manufactured by large eight company;

SPB-100, phosphazene compound, P% = 13%, manufactured by tsukamu corporation;

[ inorganic filler ]

SC2300-SVJ, double bond treated spherical silica manufactured by Admatechs;

[ initiator ]

PERBUTYL P,1, 3-bis (butylperoxyisopropyl) benzene, manufactured by Japanese day oil Co., ltd;

[ glass fiber cloth ]

Fiberglass cloth, 2116 cloth, macro and company.

The compositions of the resin compositions provided in the examples and comparative examples are as follows:

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the preparation process of the resin compositions of examples and comparative examples is specifically as follows:

the modified polyphenylene ether resin was mixed with toluene, and the mixture was heated to 60℃and stirred sufficiently to dissolve the modified polyphenylene ether resin sufficiently in toluene, to obtain a toluene solution having a solid content of 50% by mass. Then, a crosslinking agent, a hydrocarbon resin and a bismaleimide resin were added thereto so as to be brought into the proportions of each example and comparative example in the table, and stirred for 2 hours to be sufficiently dissolved. Finally, adding fire retardant, inorganic filler, initiator and proper amount of toluene, and dispersing thoroughly with a bead mill to obtain the resin composition.

The prepregs of examples and comparative examples were prepared as follows:

glass fiber cloth was immersed in the resin compositions prepared in examples and comparative examples, the temperature was set at 160 ℃, and the mixture was heated for 5 minutes to prepare prepregs. At this time, the solid content of the resin composition may be adjusted to obtain a prepreg having a mass ratio of 50%.

The preparation process of the copper-clad plates of the examples and the comparative examples is specifically as follows:

8 prepregs prepared in each example and comparative example are respectively stacked, and 35 mu m HVLP2 copper foil is placed on two sides of each prepreg, and the prepregs are heated, pressed and pressed for 2 hours under the conditions of the temperature of 210 ℃ and the pressure of 3MPa, so that the copper-clad plate with the thickness of about 0.8mm is prepared.

Performance test of copper-clad plates of examples and comparative examples

1. Peel strength: the test method is carried out according to IPC-TM-650.2.4.8 by using a universal tensile machine.

2. Glass transition temperature (Tg): glass transition temperature (Tg) was measured using a dynamic mechanical analyzer (dynamic mechanical analyzer, DMA) (DMA 850 manufactured by TA Instruments) at a heating rate of 3 ℃/min. The glass transition temperature test specification uses methods of electronic circuit interconnect and packaging society (TheInstitute for Interconnecting and Packaging Electronic Circuits, IPC) IPC-TM-650.4.25C and 24C.

3. Dielectric constant and dielectric loss measurements: the dielectric constants (dielectric constant, dk) and dielectric losses (dissipation factor, df) were measured at an operating frequency of 10 megahertz (GHz) according to the IPC-TM-650.5.5.13 specification by a network analyzer of Agilent company model E5071C.

4. Solder resistance and heat resistance test at 288 ℃: immersing the test piece steamed for 2 hours by a PCT pressure cooker in a 288 ℃ soldering tin furnace for 6 minutes, and recording whether the test piece explodes.

5. Thermal expansion coefficient test and X/Y/Z axis expansion rate: the thermal expansion coefficient and the expansion rate of the sample in the X/Y/Z axis direction are measured by a thermal expansion analyzer of TA Instrument model TA Q800, wherein the measurement temperature is 50-260 ℃, the heating rate is 10 ℃/min.

6. Flame retardant test: referring to UL-94 specifications, the self-extinguishing time after burning of the samples was tested using a bunsen burner, methane gas and a marform, and the rating was determined based on this time.

7. Modulus of elasticity: according to GB/T22315-2008 specification, the elastic modulus is tested by using a universal tensile machine.

The test results of the copper-clad plates of the above examples and comparative examples are as follows:

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the performance of the copper-clad plate provided by the above examples and comparative examples can be seen as follows: in comparison between the embodiment 1 and the comparative example 1, the copper-clad plate prepared by using the styrene modified polyphenyl ether resin as the modified polyphenyl ether resin can enhance the peel strength of the copper-clad plate while ensuring lower dielectric constant and dielectric loss. By comparing the embodiment 4 with the comparative example 2, the prepared copper-clad plate has better performance than methacrylic acid modified polyphenyl ether resin and polybutadiene when the styrene modified polyphenyl ether resin is matched with the butadiene and styrene copolymer, and the copper-clad plate in the embodiment 4 can ensure lower dielectric constant and dielectric loss and has lower expansion coefficient; as can be seen from a comparison of example 1 and comparative example 3, an excessively low addition ratio of the inorganic filler to the resin composition causes an insufficient elastic modulus, and a higher X/Y expansion coefficient and a higher dielectric loss.

The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The above examples merely represent a few embodiments of the present application, which facilitate a specific and detailed understanding of the technical solutions of the present application, but are not to be construed as limiting the scope of the invention. It should be noted that it would be apparent to those skilled in the art that various modifications and improvements could be made without departing from the spirit of the present application, which would be within the scope of the present application. It should be understood that those skilled in the art, based on the technical solutions provided in the present application, can obtain technical solutions through logical analysis, reasoning or limited experiments, all fall within the protection scope of the claims attached to the present application. The scope of the patent application is therefore intended to be indicated by the appended claims, and the description may be used to interpret the contents of the claims.

Claims

1. The resin composition is characterized by comprising the following components in parts by weight:

2. The resin composition according to claim 1, wherein the cycloalkyl group is C ₅ ～C ₇ Cycloalkyl;

3. The resin composition according to claim 1, wherein the ratio of the modified polyphenylene ether resin to the hydrocarbon resin is 100 parts by weight to (20 to 60 parts by weight).

4. The resin composition according to claim 1, which comprises the following components in parts by weight:

5. the resin composition according to any one of claims 1 to 4, wherein the cycloalkyl group is selected from any one of cyclopentyl, cyclohexyl, cycloheptyl, 3-methylcyclohexyl, 3-methylcycloheptyl, and 3, 5-dimethylcyclohexyl;

6. The resin composition according to any one of claims 1 to 4, wherein the hydrocarbon resin comprises one or two of polybutadiene, a copolymer of butadiene and styrene.

7. The resin composition of claim 6 wherein the hydrocarbon resin is a copolymer of butadiene and styrene;

8. The resin composition according to any one of claims 1 to 4, wherein the resin composition has one or more of the following features:

(3) The flame retardant comprises

Wherein n1 and n2 are positive integers;

(5) The inorganic filler includes one or more of silica, alumina, titanium oxide, mica, aluminum hydroxide, magnesium hydroxide, talc, aluminum borate, barium sulfate, and calcium carbonate.

9. The resin composition according to claim 8, wherein the flame retardant is

。

10. A prepreg comprising a substrate and the resin composition of any one of claims 1 to 9 supported on the substrate.

11. Use of the prepreg according to claim 10 for the preparation of a laminate, a copper-clad plate or a wiring board.