CN116031351A

CN116031351A - Optical semiconductor element sealing sheet and display

Info

Publication number: CN116031351A
Application number: CN202310112192.4A
Authority: CN
Inventors: 浅井量子; 仲野武史; 福富秀平; 田中俊平; 植野大树
Original assignee: Nitto Denko Corp
Current assignee: Nitto Denko Corp
Priority date: 2022-03-25
Filing date: 2023-02-14
Publication date: 2023-04-28
Anticipated expiration: 2043-02-14
Also published as: KR20230140498A; CN116031351B; JP2023160847A; TW202347832A

Abstract

The present invention relates to an optical semiconductor element sealing sheet and a display, and provides an optical semiconductor element sealing sheet capable of producing a display excellent in antireflection and high in luminance by sealing an optical semiconductor element. The optical semiconductor element sealing sheet (1) is a sheet for sealing 1 or more optical semiconductor elements (6) arranged on a substrate (5). The optical semiconductor element sealing sheet (1) is provided with a sealing resin layer (2) that includes at least a colored layer (22) and a non-colored layer (23). When the hardness of the non-colored layer (23) is A and the hardness of the colored layer (22) is B, A > B is satisfied.

Description

Optical semiconductor element sealing sheet and display

Technical Field

The present invention relates to an optical semiconductor element sealing sheet. More specifically, the present invention relates to a sealing sheet suitable for sealing an optical semiconductor element of a self-luminous display device such as a mini/micro LED.

Background

In recent years, as a new generation display device, a self-luminous display device typified by a Mini/micro LED display device (Mini/Micro Light Emitting Diode Display) has been designed. As a basic configuration of a mini/micro LED display device, a substrate in which a large number of micro optical semiconductor elements (LED chips) are densely arranged is used as a display panel, the optical semiconductor elements are sealed with a sealing material, and a cover member such as a resin film or a glass plate is laminated on the outermost layer.

In a display body including a self-luminous display device such as a mini/micro LED display device, wiring (metal wiring) of a metal oxide such as metal or ITO is arranged on a substrate of a display panel. Such a display device has the following problems, for example: when the light is turned off, the light is reflected by the metal wiring or the like, and the appearance of the screen is deteriorated. Therefore, as a sealing material for sealing the optical semiconductor element, a technique using an antireflection layer for preventing reflection by a metal wiring is adopted.

Patent document 1 discloses an adhesive sheet in which a colored adhesive layer and a colorless adhesive layer are laminated so that the colorless adhesive layer is in contact with an optical semiconductor element. According to the adhesive sheet, it is described that, when the adhesive sheet contacts and follows the concave-convex shape formed by the substrate and the optical semiconductor element provided on the substrate, the appearance can be improved when the display is turned off, and the luminance unevenness can be suppressed.

Prior art literature

Patent literature

Patent document 1: japanese patent laid-open No. 2020-169262

Disclosure of Invention

Problems to be solved by the invention

However, the adhesive sheet provided with the colored adhesive layer has the following problems, although the adhesive sheet can be expected to have the effect of preventing reflection by metal wiring or suppressing luminance unevenness when sealing an optical semiconductor element: the transmittance of light emitted from the optical semiconductor element decreases, and as a result, the front luminance of the display decreases. When the front luminance is lowered, the power consumption is increased in order to increase the luminance. Therefore, a display having excellent antireflection and high brightness is demanded.

The present invention has been made in view of these circumstances, and an object thereof is to provide an optical semiconductor element sealing sheet capable of producing a display excellent in antireflection and high in luminance by sealing an optical semiconductor element.

Solution for solving the problem

The present inventors have made intensive studies to achieve the above object, and as a result, have found that a sealing sheet for an optical semiconductor element, which comprises a sealing resin layer including a colored layer and a non-colored layer, wherein the non-colored layer has a hardness harder than that of the colored layer, can provide a display excellent in antireflection and high in luminance when sealing an optical semiconductor element provided on a substrate. The present invention has been completed based on these findings.

Specifically, the present invention provides an optical semiconductor element sealing sheet for sealing 1 or more optical semiconductor elements disposed on a substrate, the sheet comprising a sealing resin layer including a colored layer and a non-colored layer, wherein the hardness A of the non-colored layer and the hardness B of the colored layer satisfy A > B.

In the above-described optical semiconductor element sealing sheet, when sealing an optical semiconductor element with the colored layer side as the optical semiconductor element side as compared with the non-colored layer, the colored layer and the non-colored layer are laminated in this order from the optical semiconductor element side. In this case, the hardness a of the non-colored layer on the front surface side of the display body is harder than the hardness B of the colored layer on the optical semiconductor element side. In this way, in the sealed state of the optical semiconductor element, the colored layer located on the front surface of the optical semiconductor element is sandwiched and compressed between the optical semiconductor element and the non-colored layer, and light emitted from the optical semiconductor element can be efficiently transmitted to the front surface side. On the other hand, the colored layer on the substrate on which the optical semiconductor element is not disposed is compressed to a smaller extent than the colored layer on the front surface of the optical semiconductor element, and therefore reflection of the metal wiring on the substrate can be sufficiently suppressed. Therefore, the display body sealed with the optical semiconductor element by using the optical semiconductor element sealing sheet is excellent in antireflection property and high in luminance.

The hardness may be 1 or more selected from the group consisting of residual stress, elastic modulus, young's modulus, and hardness measured by nanoindentation.

The hardness may be a residual stress, and a ratio [ residual stress A1/residual stress B1] of the residual stress A1 of the non-colored layer to the residual stress B1 of the colored layer may be 1.2 or more. When the ratio is 1.2 or more, the colored layer located on the front surface of the optical semiconductor element is further compressed during sealing of the optical semiconductor element, and the luminance is further improved.

The sealing resin layer preferably further includes a non-colored layer having a hardness C on the side opposite to the non-colored layer. The hardness C of the non-colored layer and the hardness B of the colored layer preferably satisfy C > B. With such a configuration, the colored layers located on the front surface of the optical semiconductor element and located between the 2 non-colored layers are sufficiently compressed by being sandwiched between the two non-colored layers at the time of sealing the optical semiconductor element, and the luminance is further improved.

The sealing resin layer preferably includes a diffusion functional layer. With such a configuration, light emitted from the optical semiconductor element can be diffused in the diffusion functional layer, and the front luminance can be further improved.

The present invention also provides a display body including: a substrate, an optical semiconductor element disposed on the substrate, and the optical semiconductor element sealing sheet or a cured product thereof for sealing the optical semiconductor element. Such a light display is excellent in antireflection property and high in brightness.

The display body preferably includes a self-luminous display device.

The display body is preferably an image display device.

ADVANTAGEOUS EFFECTS OF INVENTION

According to the optical semiconductor element sealing sheet of the present invention, a display excellent in antireflection and high in luminance can be provided by sealing an optical semiconductor element. Therefore, the display is bright and beautiful without increasing the power consumption, and has excellent appearance when turned off.

Drawings

Fig. 1 is a cross-sectional view of an optical semiconductor element sealing sheet according to an embodiment of the present invention.

Fig. 2 is a partial cross-sectional view showing an embodiment of a display body using the optical semiconductor element sealing sheet shown in fig. 1.

Fig. 3 is a partial cross-sectional view showing another embodiment of a display body using the optical semiconductor element sealing sheet shown in fig. 1.

Fig. 4 is a partial cross-sectional view showing another embodiment of a display body using the optical semiconductor element sealing sheet shown in fig. 1.

Description of the reference numerals

1 optical semiconductor element sealing sheet

2 resin layer for sealing

21 diffusion functional layer (non-coloring layer C)

22 colored layer (colored layer B)

23 non-coloring layer (non-coloring layer A)

3 Release liner

4 base material portion

41. Substrate film

42. Functional layer

5 substrate

6-photon semiconductor element

7 sealing resin layer

71. Diffusion functional layer

72. Coloring layer

73. Non-colored layer

10. Optical semiconductor device

Detailed Description

[ sheet for sealing optical semiconductor element ]

The optical semiconductor element sealing sheet of the present invention comprises at least a sealing resin layer including a colored layer and a non-colored layer. In the present specification, the optical semiconductor element sealing sheet refers to a sheet for sealing 1 or more optical semiconductor elements arranged on a substrate with a sealing resin layer. In the present specification, "sealing the optical semiconductor element" means embedding at least a part of the optical semiconductor element into the sealing resin layer or covering the optical semiconductor element by following the sealing resin layer. The sealing resin layer has flexibility that enables at least a part of the optical semiconductor element to be embedded therein or to be covered by following the sealing resin layer.

< sealing resin layer >

In the sealing resin layer, when the hardness of the non-colored layer is a and the hardness of the colored layer is B, a > B is satisfied. That is, the sealing resin layer includes at least a non-colored layer having a hardness a satisfying a > B and a colored layer having a hardness B. The non-colored layer having a hardness of a is sometimes referred to as "non-colored layer a" and the colored layer having a hardness of B is sometimes referred to as "colored layer B". The sealing resin layer may have a layer other than the non-colored layer a and the colored layer B. The total number of layers constituting the sealing resin layer may be 2 or more, including the non-colored layer a and the non-colored layer B, or 3 or more. The total number of layers may be, for example, 10 or less, or 5 or less or 4 or less from the viewpoint of reducing the thickness of the optical semiconductor element sealing sheet and the optical semiconductor device.

Each of the layers (colored layer and non-colored layer) constituting the sealing resin layer may be a single layer or may be a plurality of layers having the same or different compositions. When the colored layer and the non-colored layer include a plurality of layers, the plurality of layers may be stacked in contact with each other or may be stacked with a space therebetween (for example, 2 colored layers are stacked with 1 non-colored layer interposed therebetween). When the sealing resin layer has 1 or more of a plurality of colored layers and non-colored layers, at least 1 colored layer is a colored layer B and at least 1 non-colored layer is a non-colored layer a. The non-colored layers included in the sealing resin layer may be diffusion functional layers described later, or may be non-diffusion functional layers, independently of each other.

In the above-described optical semiconductor element sealing sheet, when the optical semiconductor element is sealed with the colored layer B side as the optical semiconductor element side as compared with the non-colored layer a, the colored layer B and the non-colored layer a are laminated in this order from the optical semiconductor element side. At this time, the hardness a of the non-colored layer a on the front side of the display body is harder than the hardness B of the colored layer B on the optical semiconductor element side. In this way, in the sealed state of the optical semiconductor element, the colored layer B located on the front surface of the optical semiconductor element is sandwiched and compressed between the optical semiconductor element and the non-colored layer a, and light emitted from the optical semiconductor element can be efficiently transmitted to the front surface side. On the other hand, the colored layer B on the substrate on which the optical semiconductor element is not disposed is compressed to a smaller extent than the colored layer B on the front surface of the optical semiconductor element, and therefore reflection of the metal wiring on the substrate can be sufficiently suppressed. Therefore, the display body sealed with the optical semiconductor element by using the optical semiconductor element sealing sheet is excellent in antireflection property and high in luminance.

The hardness of the colored layer and the non-colored layer includes residual stress, elastic modulus, young's modulus, and the like. The hardness may be measured by nanoindentation. In the nanoindentation method, for example, the exposed surfaces of the colored layer and the non-colored layer in the surfaces and cross sections of the colored layer and the non-colored layer may be measured. The hardness by the nanoindentation method is obtained by continuously measuring the load and the depth of penetration of the indenter when the indenter is pressed into the surface of the object during loading and unloading, and obtaining the curve of the load and the depth of penetration. Among these, residual stress is preferable from the viewpoint of suppressing the influence of the tackiness of the layer on the hardness of the measurement result. The hardness may be adjusted by a known and conventional method. Specifically, the hardness of the layers can be controlled by adjusting the amount of a crosslinkable compound such as a curing agent, a crosslinking agent, or a polyfunctional monomer, or a polymerization initiator when the resin constituting each layer is produced.

The difference between the residual stress of the non-colored layer A (sometimes referred to as "residual stress A1") and the residual stress of the colored layer B (sometimes referred to as "residual stress B1") [ residual stress A1-residual stress B1]]The concentration is not particularly limited, but is preferably 1.0N/cm ² The above, more preferably 3.0N/cm ² The above, more preferably 5.0N/cm ² The above. The difference is 1.0N/cm ² In the above manner, the colored layer B located on the front surface of the optical semiconductor element is further compressed during sealing of the optical semiconductor element, and the luminance is further improved. The difference is, for example, 30.0N/cm from the viewpoint of excellent sealing properties of the optical semiconductor element due to the sealing resin layer ² The concentration may be 20.0N/cm ² The following is given.

The ratio of the residual stress A1 to the residual stress B1 [ residual stress A1/residual stress B1] is not particularly limited, but is preferably 1.2 or more, more preferably 1.5 or more, and still more preferably 2.0 or more. When the ratio is 1.2 or more, the colored layer B located on the front surface of the optical semiconductor element is further compressed during sealing of the optical semiconductor element, and the luminance is further improved. The ratio may be, for example, 10.0 or less or 5.0 or less from the viewpoint of excellent sealing properties of the optical semiconductor element by the sealing resin layer.

Residual stress A1 is under A>B is preferably higher than 6.0N/cm ² More preferably 7.0N/cm ² The above, more preferably 10.0N/cm ² The above. Residual stress A1 is under A>B is preferably within the range of 50.0N/cm ² Hereinafter, it is more preferably 40.0N/cm ² The following is more preferably 30.0N/cm ² The following is given.

Residual stress B1 is satisfied A>B is preferably in the range of 0.5N/cm ² The above, more preferably 1.0N/cm ² The above, more preferably 3.0N/cm ² The above. Residual stress B1 is satisfied A>B is preferably in the range of 20.0N/cm ² Hereinafter, it is more preferably 15.0N/cm ² The following is more preferably 10.0N/cm ² The following is given.

In the optical semiconductor element sealing sheet of the present invention, the sealing resin layer includes a colored layer B and a non-colored layer a in this order from the optical semiconductor element side when sealing an optical semiconductor element. The sealing resin layer may further include a non-colored layer on the side of the colored layer B opposite to the non-colored layer a (i.e., on the side of the optical semiconductor element than the colored layer B in a state where the optical semiconductor element is sealed). The non-colored layer other than the non-colored layer a, which is further provided on the side of the colored layer B opposite to the non-colored layer a, may be referred to as "non-colored layer C".

In the sealing resin layer, when the hardness of the non-colored layer C is C, C > B is preferably satisfied. With such a configuration, the colored layer B located on the front surface of the optical semiconductor element and located between the non-colored layer a and the non-colored layer C is sufficiently compressed by being sandwiched between the non-colored layer a and the non-colored layer C at the time of sealing the optical semiconductor element, and the luminance is further improved. Examples of the hardness of the non-colored layer C include the hardness exemplified as the hardness of the non-colored layer a and the colored layer B.

The difference between the residual stress of the non-colored layer C (sometimes referred to as "residual stress C1") and the residual stress B1 [ residual stress C1-residual stress B1]]The concentration is not particularly limited, but is preferably 0.01N/cm ² The above, more preferably 0.05N/cm ² The above, more preferably 0.1N/cm ² Above, or 0.5N/cm ² Above, 1.0N/cm ² Above, or 2.0N/cm ² The above. The difference is 0.01N/cm ² In the above manner, the colored layer B located on the front surface of the optical semiconductor element is further compressed during sealing of the optical semiconductor element, and the luminance is further improved. The difference is, for example, 20.0N/cm ² The concentration may be 10.0N/cm ² The following is given.

The ratio of the residual stress C1 to the residual stress B1 [ residual stress C1/residual stress B1] is not particularly limited, but is preferably 0.05 or more, more preferably 0.1 or more, still more preferably 0.5 or more, and may be 1.1 or more, 1.2 or more, or 1.3 or more. When the ratio is 0.05 or more, the colored layer B located on the front surface of the optical semiconductor element is further compressed during sealing of the optical semiconductor element, and the luminance is further improved. The ratio may be, for example, 10.0 or less, or 5.0 or less.

The residual stress C1 is preferably 3.0N/cm ² The above, more preferably 4.0N/cm ² The above, more preferably 7.0N/cm ² The above. The residual stress C1 is preferably 50.0N/cm ² Hereinafter, it is more preferably 40.0N/cm ² The following is more preferably 30.0N/cm ² The following is given.

In the sealing resin layer, a > C is preferably satisfied. With such a configuration, the colored layer B located between the non-colored layer a and the non-colored layer C on the optical semiconductor element is more sufficiently compressed by the non-colored layer a at the time of sealing the optical semiconductor element, and the luminance is further improved.

Difference between residual stress A1 and residual stress C1 [ residual stress A1-residual stress C1]]The concentration is not particularly limited, but is preferably 0.5N/cm ² The above, more preferably 1.0N/cm ² The above, more preferably 2.0N/cm ² The above. The difference is 0.5N/cm ² In the above manner, the colored layer B located on the front surface of the optical semiconductor element is further compressed during sealing of the optical semiconductor element, and the luminance is further improved. The difference is, for example, 30.0N/cm ² The concentration may be 20.0N/cm ² The following is given.

The ratio of the residual stress A1 to the residual stress C1 [ residual stress A1/residual stress C1] is not particularly limited, but is preferably 1.1 or more, more preferably 1.2 or more, and still more preferably 1.3 or more. When the ratio is 1.1 or more, the colored layer B located on the front surface of the optical semiconductor element is further compressed during sealing of the optical semiconductor element, and the luminance is further improved. The ratio may be, for example, 10.0 or less, or 5.0 or less.

The sealing resin layer preferably includes a diffusion functional layer. With such a configuration, light emitted from the optical semiconductor element can be diffused in the diffusion functional layer, and the front luminance can be further improved. The diffusion functional layer is preferably a layer which is a non-colored layer in the present specification. Among them, the non-colored layer a and/or the non-colored layer C is preferably a diffusion functional layer, and the non-colored layer C is preferably a diffusion functional layer.

When the sealing resin layer includes the diffusion functional layer, the sealing resin layer preferably includes the diffusion functional layer, the colored layer, and the non-colored layer in this order from the optical semiconductor element side. The non-colored layer may be any one of a diffusion functional layer and a non-diffusion functional layer. With such a configuration, the front luminance can be further improved, and the appearance of the display can be further improved both at the time of turning off and at the time of light emission.

In the sealing resin layer, the non-colored layer a is preferably flat (planar) with a surface opposite to the side on which the optical semiconductor element is sealed. In this case, in a state where the optical semiconductor element is sealed, external light is less likely to be reflected by the surface of the sealing resin layer, and the display body is more attractive both when the optical semiconductor element is turned off and when the optical semiconductor element emits light.

Each of the layers (the colored layer and the non-colored layer) constituting the sealing resin layer may or may not have an adhesive property and/or an adhesive property, independently. Among them, adhesion and/or adhesiveness are preferable. With such a configuration, the sealing resin layer can easily seal the optical semiconductor element, and the sealing resin layer has excellent adhesion and/or adhesiveness between the layers, and further has excellent sealing properties. It is particularly preferable that at least the layer in contact with the optical semiconductor element has adhesion and/or adhesiveness. With such a configuration, the optical semiconductor element based on the sealing resin layer is excellent in following property and landfill property. As a result, the optical semiconductor device has excellent appearance even when the height difference due to the optical semiconductor device is high. The layer other than the layer in contact with the optical semiconductor element may not have adhesiveness and/or adhesiveness. In this case, the adhesion between the adjacent sealing resin layers in the flat state is low, and when the adjacent small-sized laminate (laminate in which the sealing resin layers seal the optical semiconductor elements arranged on the substrate) is pulled apart from each other, chipping of the sheet and adhesion of the adjacent sealing resin layers are less likely to occur.

Each of the layers (the colored layer and the non-colored layer) constituting the sealing resin layer may be a resin layer (radiation curable resin layer) having a property of being cured by radiation irradiation, or may be a resin layer (non-radiation curable resin layer) not having a property of being cured by radiation irradiation. Examples of the radiation include electron beam, ultraviolet ray, α ray, β ray, γ ray, and X ray.

(colored layer)

The colored layer in the sealing resin layer is a layer for the purpose of preventing reflection of light by a metal wiring or the like provided on a substrate in a display. The coloring layer at least contains a colorant. The colored layer is preferably a resin layer made of a resin. The colorant may be a dye or a pigment as long as it is soluble or dispersible in the colored layer. Dyes are preferred from the viewpoint that low haze can be achieved even with a small amount of addition, no sedimentation is possible as in pigments, and uniform distribution is easy. In addition, pigments are also preferred in terms of high color rendering properties even when added in small amounts. When pigments are used as colorants, it is preferred that the conductivity be low or not. The colorant may be used alone or in combination of two or more.

The colorant is preferably a black colorant. The black-based colorant may be any of known conventional colorants (pigments, dyes, etc.) for black color, and examples thereof include carbon black (furnace black, channel black, acetylene black, thermal black, lamp black, pine black, etc.), graphite, copper oxide, manganese dioxide, aniline black, perylene black, titanium black, cyanine black, activated carbon, ferrite (nonmagnetic ferrite, magnetic ferrite, etc.), magnet (magnetite), chromium oxide, iron oxide, molybdenum disulfide, chromium complex, anthraquinone-based colorant, zirconium nitride, etc. Further, a colorant that is combined and mixed to exhibit a color other than black may be used and functions as a black-based colorant.

When the colored layer is a radiation curable resin layer, the colorant is preferably a colorant that absorbs visible light and has light transmittance at a wavelength at which the radiation curable resin layer can be cured.

The content ratio of the colorant in the colored layer is preferably 0.2 mass% or more, more preferably 0.4 mass% or more, based on 100 mass% of the total amount of the colored layer, from the viewpoint of imparting an appropriate antireflection capability to the display. The content of the colorant is, for example, 10 mass% or less, preferably 5 mass% or less, and more preferably 3 mass% or less. The content ratio may be appropriately set according to the type of the colorant, the color tone of the display, the light transmittance, and the like. The colorant may be added to the composition in the form of a solution or dispersion dissolved or dispersed in a suitable solvent.

The haze value (initial haze value) of the colored layer is not particularly limited, but is preferably 50% or less, more preferably 40% or less, further preferably 30% or less, and particularly preferably 20% or less from the viewpoint of ensuring the front luminance and the visibility of the display. In order to efficiently reduce the luminance unevenness of the display, the haze value of the colored layer is preferably 1% or more, more preferably 3% or more, still more preferably 5% or more, particularly preferably 8% or more, and may be 10% or more.

The total light transmittance of the colored layer is not particularly limited, but is preferably 80% or less, more preferably 60% or less, further preferably 40% or less, and particularly preferably 30% or less, from the viewpoint of further improving the function of preventing reflection of metal wiring or the like in the display. Further, from the viewpoint of ensuring the brightness of the display, the total light transmittance of the colored layer is preferably 0.5% or more, more preferably 1% or more, still more preferably 1.5% or more, particularly preferably 2% or more, and may be 2.5% or more, or 3% or more.

The haze value and the total light transmittance of the colored layer are each a single-layer value, which can be measured by a method defined in JIS K7136 and JIS K7361-1, and can be controlled by the type, thickness, type of colorant, blending amount, and the like.

(non-colored layer)

The non-colored layer is a layer different from the colored layer, and is a layer that does not aim to prevent reflection of light by a metal wiring or the like provided on a substrate in a display. The non-colored layer may be a colorless layer or may be slightly colored. The non-colored layer may be, for example, a diffusion functional layer for the purpose of diffusing light, or may be a non-diffusion functional layer for the purpose of not diffusing light. The non-colored layer may be transparent or non-transparent. The non-colored layer is preferably a resin layer made of a resin.

The content ratio of the colorant in the non-colored layer is preferably less than 0.2 mass%, more preferably less than 0.1 mass%, still more preferably less than 0.05 mass%, and may be less than 0.01 mass% or less than 0.005 mass% relative to 100 mass% of the total non-colored layer.

The total light transmittance of the non-colored layer is not particularly limited, but is preferably 40% or more, more preferably 60% or more, still more preferably 70% or more, and particularly preferably 80% or more from the viewpoint of securing brightness. The upper limit of the total light transmittance of the non-colored layer is not particularly limited, and may be less than 100%, 99.9% or less, or 99% or less.

The total light transmittance of the non-colored layer is a single-layer value, which can be measured by a method defined in JIS K7136 or JIS K7361-1, and can be controlled by the type, thickness, etc. of the non-colored layer.

The diffusion functional layer is a layer for diffusing light. When the sealing resin layer has the diffusion functional layer, light emitted from the optical semiconductor element diffuses in the diffusion functional layer, and for example, light emitted from the side surface of the optical semiconductor element is released in the front direction of the display body, and the front luminance of the display body is improved. The diffusion functional layer is preferably a resin layer made of a resin. The diffusion functional layer is not limited, and preferably contains light diffusing fine particles. That is, the diffusion functional layer preferably contains light diffusing fine particles dispersed in a resin layer. The light diffusing fine particles may be used alone or in combination of two or more.

The light diffusing fine particles have an appropriate refractive index difference from the resin constituting the diffusion functional layer, and impart diffusion performance to the diffusion functional layer. Examples of the light diffusing fine particles include inorganic fine particles and polymer fine particles. Examples of the material of the inorganic fine particles include silica, calcium carbonate, aluminum hydroxide, magnesium hydroxide, clay, talc, and metal oxide. Examples of the material of the polymer microparticles include silicone resins, acrylic resins (for example, a polymethacrylate resin such as polymethyl methacrylate), polystyrene resins, polyurethane resins, melamine resins, polyethylene resins, and epoxy resins.

The polymer fine particles are preferably fine particles made of silicone resin. The inorganic fine particles are preferably fine particles composed of a metal oxide. The metal oxide is preferably titanium oxide or barium titanate, more preferably titanium oxide. With such a configuration, the diffusion functional layer is more excellent in light diffusibility and further suppressed in luminance unevenness.

The shape of the light diffusing fine particles is not particularly limited, and may be, for example, spherical, flat, or irregular.

The average particle diameter of the light diffusing fine particles is preferably 0.1 μm or more, more preferably 0.15 μm or more, still more preferably 0.2 μm or more, and particularly preferably 0.25 μm or more, from the viewpoint of imparting an appropriate light diffusing property. In addition, the average particle diameter of the light diffusing fine particles is preferably 12 μm or less, more preferably 10 μm or less, and even more preferably 8 μm or less, from the viewpoint of preventing the haze value from becoming too high and displaying a high-definition image. The average particle diameter can be measured, for example, using a coulter counter.

The refractive index of the light diffusing fine particles is preferably 1.2 to 5, more preferably 1.25 to 4.5, still more preferably 1.3 to 4, and particularly preferably 1.35 to 3.

From the viewpoint of reducing luminance unevenness of the display body more efficiently, the absolute value of the refractive index difference between the light-diffusing fine particles and the resin constituting the diffusion functional layer (the resin layer excluding the light-diffusing fine particles in the diffusion functional layer) is preferably 0.001 or more, more preferably 0.01 or more, still more preferably 0.02 or more, particularly preferably 0.03 or more, and also may be 0.04 or more, or 0.05 or more. In addition, from the viewpoint of preventing the haze value from becoming too high and displaying a high-definition image, the absolute value of the refractive index difference between the light diffusing fine particles and the resin is preferably 5 or less, more preferably 4 or less, and still more preferably 3 or less.

The content of the light diffusing fine particles in the diffusion functional layer is preferably 0.01 parts by mass or more, more preferably 0.05 parts by mass or more, still more preferably 0.1 parts by mass or more, and particularly preferably 0.15 parts by mass or more, relative to 100 parts by mass of the resin constituting the diffusion functional layer, from the viewpoint of imparting an appropriate light diffusing performance to the optical semiconductor element sealing sheet. Further, from the viewpoint of preventing the haze value from becoming too high and displaying a high-definition image, the content of the light diffusing fine particles is preferably 80 parts by mass or less, more preferably 70 parts by mass or less, relative to 100 parts by mass of the resin constituting the diffusion functional layer.

The haze value (initial haze value) of the diffusion functional layer is not particularly limited, but is preferably 30% or more, more preferably 40% or more, further preferably 50% or more, particularly preferably 60% or more, and may be 70% or more, 80% or more, 90% or more, 95% or more, 97% or more, and further, the effect of improving the luminance unevenness of the haze value in the vicinity of 99.9% is more excellent, from the viewpoint of efficiently reducing the luminance unevenness. The upper limit of the haze value of the diffusion functional layer is not particularly limited, that is, may be 100%.

The total light transmittance of the diffusion functional layer is not particularly limited, but is preferably 40% or more, more preferably 60% or more, still more preferably 70% or more, and particularly preferably 80% or more from the viewpoint of securing brightness. The upper limit of the total light transmittance of the diffusion functional layer is not particularly limited, and may be less than 100%, 99.9% or less, or 99% or less.

The haze value and the total light transmittance of the diffusion functional layer are each a single layer, and can be measured by a method defined in JIS K7136 and JIS K7361-1, and can be controlled by the type, thickness, type of light diffusing fine particles, the amount of blending, and the like of the diffusion functional layer.

The haze value (initial haze value) of the non-diffusion functional layer is not particularly limited, but is preferably less than 30%, more preferably 10% or less, further preferably 5% or less, particularly preferably 1% or less, and may be 0.5% or less, from the viewpoint of making the brightness of the display excellent. The lower limit of the haze value of the non-diffusion functional layer is not particularly limited.

The total light transmittance of the non-diffusion functional layer is not particularly limited, but is preferably 60% or more, more preferably 70% or more, still more preferably 80% or more, and particularly preferably 90% or more from the viewpoint of securing the luminance of the display. The upper limit of the total light transmittance of the non-diffusion functional layer is not particularly limited, and may be less than 100%, 99.9% or less, or 99% or less.

The haze value and the total light transmittance of the non-diffusion functional layer are each a single layer, and can be measured by a method defined in JIS K7136 and JIS K7361-1, and can be controlled by the type, thickness, and the like of the non-diffusion functional layer.

The content of the colorant and/or the light-diffusing fine particles in the non-diffusion functional layer is preferably less than 0.01 parts by mass, more preferably less than 0.005 parts by mass, relative to 100 parts by mass of the resin constituting the non-diffusion functional layer, from the viewpoint of making the display excellent in brightness.

The lamination structure of the sealing resin layer includes: [ coloring layer/diffusion functional layer ], [ coloring layer/non-diffusion functional layer ], [ coloring layer/diffusion functional layer/non-diffusion functional layer ], [ coloring layer/non-diffusion functional layer/diffusion functional layer ], [ coloring layer/non-diffusion functional layer ], [ diffusion functional layer/coloring layer/diffusion functional layer ], [ non-diffusion functional layer/coloring layer/non-diffusion functional layer ], [ coloring layer/diffusion functional layer/coloring layer/non-diffusion functional layer ] (order from the optical semiconductor element side) and the like.

Fig. 1 is a cross-sectional view showing an embodiment of the optical semiconductor element sealing sheet of the present invention. As shown in fig. 1, the optical semiconductor element sealing sheet 1 is used for sealing 1 or more optical semiconductor elements arranged on a substrate, and includes a base material portion 4 and a sealing resin layer 2 formed on the base material portion 4. The base material portion 4 is composed of the base material film 41 and the functional layer 42 as the surface treatment layer, but may be composed of the base material film 41 without the functional layer 42. The sealing resin layer 2 is formed of a laminate of a diffusion functional layer 21, a colored layer 22, and a non-colored layer 23. The colored layer 22 is directly laminated on the diffusion functional layer 21, and the non-colored layer 23 is directly laminated on the colored layer 22. A release liner 3 is attached to the diffusion functional layer 21, and a base material portion 4 is attached to the non-colored layer 23. The diffusion functional layer 21 is a non-colored layer C, the colored layer 22 is a colored layer B, and the non-colored layer 23 is a non-colored layer a. The non-colored layer 23 has a hardness harder than that of the colored layer 22. The non-colored layer 23 has a hardness harder than that of the diffusion functional layer 21. The hardness of the diffusion functional layer 21 is harder than the hardness of the colored layer 22.

Although fig. 1 shows an example of a 3-layer structure in which the sealing resin layer is composed of 2 non-colored layers and 1 colored layer, the total number of layers constituting the sealing resin layer is not particularly limited as long as it is 2 or more layers including 1 layer each of the non-colored layer a and the colored layer B.

(resin layer)

In the case where the colored layer and the non-colored layer are the resin layers, the resin constituting the resin layers may be any of known conventional resins, for example, acrylic resins, urethane acrylate resins, urethane resins, rubber resins, epoxy acrylate resins, oxetane resins, silicone acrylic resins, polyester resins, polyether resins (such as polyvinyl ether), polyamide resins, fluorine resins, vinyl acetate/vinyl chloride copolymers, modified polyolefins, and the like. The resin may be used alone or in combination of two or more. The resins constituting the sealing resin layers may be the same or different from each other.

In the case where the resin layer is a layer having an adhesive property (adhesive layer), a known and conventionally used pressure-sensitive adhesive can be used as the resin. Examples of the adhesive include acrylic adhesives, rubber adhesives (natural rubber adhesives, synthetic rubber adhesives, and mixed systems thereof), silicone adhesives, polyester adhesives, urethane adhesives, polyether adhesives, polyamide adhesives, and fluorine adhesives. The binder may be used alone or in combination of two or more.

The acrylic resin is a polymer containing a structural unit derived from an acrylic monomer (a monomer component having a (meth) acryloyl group in a molecule) as a structural unit of the polymer. The acrylic resin may be used alone or in combination of two or more.

The acrylic resin is preferably a polymer in which the structural unit derived from (meth) acrylic acid ester is most contained in terms of mass ratio. In the present specification, "(meth) acrylic acid" means "acrylic acid" and/or "methacrylic acid" ("acrylic acid" and "methacrylic acid" either or both), and the other is the same.

Examples of the (meth) acrylate include hydrocarbon group-containing (meth) acrylates. Examples of the hydrocarbon group-containing (meth) acrylate include (meth) acrylic acid esters having an alicyclic hydrocarbon group such as alkyl (meth) acrylate and cycloalkyl (meth) acrylate having a linear or branched aliphatic hydrocarbon group, and (meth) acrylic acid esters having an aromatic hydrocarbon group such as aryl (meth) acrylate. The hydrocarbon group-containing (meth) acrylate may be used alone or in combination of two or more.

Examples of the alkyl (meth) acrylate include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, isopropyl (meth) acrylate, butyl (meth) acrylate, isobutyl (meth) acrylate, sec-butyl (meth) acrylate, tert-butyl (meth) acrylate, pentyl (meth) acrylate, isopentyl (meth) acrylate, hexyl (meth) acrylate, heptyl (meth) acrylate, octyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, isooctyl (meth) acrylate, nonyl (meth) acrylate, isononyl (meth) acrylate, decyl (meth) acrylate, isodecyl (meth) acrylate, undecyl (meth) acrylate, dodecyl (meth) acrylate, tridecyl (meth) acrylate, tetradecyl (meth) acrylate, pentadecyl (meth) acrylate, hexadecyl (meth) acrylate, octadecyl (meth) acrylate, and nonadecyl (meth) acrylate.

Among these alkyl (meth) acrylates, preferred are alkyl (meth) acrylates having a linear or branched aliphatic hydrocarbon group having 1 to 20 carbon atoms (preferably 1 to 14 carbon atoms, more preferably 2 to 10 carbon atoms). When the carbon number is within the above range, the glass transition temperature of the acrylic resin can be easily adjusted, and the adhesiveness of the resin layer can be easily improved.

Examples of the alicyclic hydrocarbon group-containing (meth) acrylate include: (meth) acrylic esters having a monocyclic aliphatic hydrocarbon ring such as cyclopentyl (meth) acrylate, cyclohexyl (meth) acrylate, cycloheptyl (meth) acrylate, and cyclooctyl (meth) acrylate; (meth) acrylic esters having a bicyclic aliphatic hydrocarbon ring such as isobornyl (meth) acrylate; and (meth) acrylic esters having an aliphatic hydrocarbon ring having three or more rings, such as dicyclopentyl (meth) acrylate, dicyclopentyloxyethyl (meth) acrylate, tricyclopentyl (meth) acrylate, 1-adamantyl (meth) acrylate, 2-methyl-2-adamantyl (meth) acrylate, and 2-ethyl-2-adamantyl (meth) acrylate.

Examples of the (meth) acrylic acid ester having an aromatic hydrocarbon group include phenyl (meth) acrylate and benzyl (meth) acrylate.

Among these (meth) acrylic acid esters containing hydrocarbon groups, alkyl (meth) acrylates containing a linear or branched aliphatic hydrocarbon group are preferable, and (meth) acrylic acid esters containing an alicyclic hydrocarbon group are more preferable. In this case, the balance of the adhesiveness of the resin layer is good, and the sealing property of the optical semiconductor element is more excellent.

In order to properly exhibit basic characteristics such as adhesiveness due to the hydrocarbon group-containing (meth) acrylate and adhesiveness to the semiconductor element in the resin layer, the ratio of the hydrocarbon group-containing (meth) acrylate in all the monomer components constituting the acrylic resin is preferably 40% by mass or more, more preferably 50% by mass or more, and still more preferably 60% by mass or more, relative to the total amount (100% by mass) of all the monomer components. The ratio is preferably 95% by mass or less, more preferably 80% by mass or less, from the viewpoint that the effect of the other monomer component can be obtained by copolymerizing the monomer component with the other monomer component.

The ratio of the alkyl (meth) acrylate having a linear or branched aliphatic hydrocarbon group in the total monomer components constituting the acrylic resin is preferably 30 mass% or more, more preferably 40 mass% or more, relative to the total amount (100 mass%) of the total monomer components. The ratio is preferably 90% by mass or less, more preferably 70% by mass or less.

The ratio of the (meth) acrylate having an alicyclic hydrocarbon group in the total monomer components constituting the acrylic resin is preferably 1% by mass or more, more preferably 5% by mass or more, relative to the total amount (100% by mass) of the total monomer components. The ratio is preferably 30% by mass or less, more preferably 20% by mass or less.

The acrylic resin may contain a structural unit derived from another monomer component copolymerizable with the hydrocarbon group-containing (meth) acrylate for the purpose of introducing the 1 st functional group described later and for the purpose of modifying the cohesive force, heat resistance, and the like. Examples of the other monomer component include monomers containing polar groups such as carboxyl group-containing monomers, acid anhydride monomers, hydroxyl group-containing monomers, glycidyl group-containing monomers, sulfonic acid group-containing monomers, phosphoric acid group-containing monomers, and nitrogen atom-containing monomers. The other monomer components may be used singly or in combination of two or more.

Examples of the carboxyl group-containing monomer include acrylic acid, methacrylic acid, carboxyethyl (meth) acrylate, carboxypentyl (meth) acrylate, itaconic acid, maleic acid, fumaric acid, and crotonic acid. Examples of the acid anhydride monomer include maleic anhydride and itaconic anhydride.

Examples of the hydroxyl group-containing monomer include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 6-hydroxyhexyl (meth) acrylate, 8-hydroxyoctyl (meth) acrylate, 10-hydroxydecyl (meth) acrylate, 12-hydroxylauryl (meth) acrylate, and (4-hydroxymethylcyclohexyl) methyl (meth) acrylate.

Examples of the glycidyl group-containing monomer include glycidyl (meth) acrylate and methyl glycidyl (meth) acrylate.

Examples of the sulfonic acid group-containing monomer include styrene sulfonic acid, allyl sulfonic acid, 2- (meth) acrylamide-2-methylpropanesulfonic acid, (meth) acrylamide propane sulfonic acid, sulfopropyl (meth) acrylate, and (meth) acryloxynaphthalene sulfonic acid.

Examples of the phosphate group-containing monomer include 2-hydroxyethyl acryloyl phosphate.

Examples of the nitrogen atom-containing monomer include morpholino-containing monomers such as (meth) acryloylmorpholine, cyano-containing monomers such as (meth) acrylonitrile, and amide-containing monomers such as (meth) acrylamide.

The polar group-containing monomer constituting the acrylic resin preferably contains a hydroxyl group-containing monomer. The hydroxyl group-containing monomer facilitates the introduction of the 1 st functional group described later. The acrylic resin and the resin layer are excellent in water resistance, and the optical semiconductor element sealing sheet is less likely to be hazed and excellent in whitening resistance even when used in an environment of high humidity.

The hydroxyl group-containing monomer is preferably 2-hydroxyethyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, and more preferably 2-hydroxyethyl (meth) acrylate.

In order to properly exhibit basic properties such as adhesiveness due to the hydrocarbon group-containing (meth) acrylate and adhesiveness to the semiconductor element in the resin layer, the ratio of the polar group-containing monomer in the total monomer components (100 mass%) constituting the acrylic resin is preferably 5 to 50 mass%, more preferably 10 to 40 mass%. In particular, the ratio of the hydroxyl group-containing monomer is preferably within the above range from the viewpoint that the water resistance of the resin layer is also more excellent.

The other monomer component may further include a vinyl monomer such as a caprolactone adduct of (meth) acrylic acid, vinyl acetate, vinyl propionate, styrene, and α -methylstyrene; glycol-based acrylate monomers such as polyethylene glycol (meth) acrylate, polypropylene glycol (meth) acrylate, methoxyethylene glycol (meth) acrylate, and methoxypolypropylene glycol (meth) acrylate; tetrahydrofurfuryl (meth) acrylate, fluoro (meth) acrylate, silicone (meth) acrylate, alkoxy-substituted hydrocarbon group-containing (meth) acrylate (such as 2-methoxyethyl (meth) acrylate and 3-phenoxybenzyl (meth) acrylate).

The ratio of the other monomer components in the total monomer components (100 mass%) constituting the acrylic resin may be, for example, about 3 to 50 mass%, or may be 5 to 40 mass% or 10 to 30 mass%.

The acrylic resin may contain a structural unit derived from a multifunctional (meth) acrylate copolymerizable with a monomer component constituting the acrylic resin in order to form a crosslinked structure in the polymer skeleton thereof. Examples of the polyfunctional (meth) acrylate include hexanediol di (meth) acrylate, (poly) ethylene glycol di (meth) acrylate, (poly) propylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, pentaerythritol di (meth) acrylate, trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, dipentaerythritol hexa (meth) acrylate, and the like. The polyfunctional monomer may be used alone or in combination of two or more.

In order to properly exhibit basic characteristics such as adhesiveness due to the hydrocarbon group-containing (meth) acrylate and adhesiveness to the semiconductor element in the resin layer, the ratio of the polyfunctional monomer in all monomer components (100 mass%) constituting the acrylic resin is preferably 40 mass% or less, more preferably 30 mass% or less.

When the resin layer is a radiation curable resin layer, examples of the resin layer include: a layer containing a base polymer and a radiation-polymerizable monomer component and an oligomer component having a functional group such as a radiation-polymerizable carbon-carbon double bond; a layer containing a polymer having a radiation polymerizable functional group (particularly, an acrylic resin) as a base polymer, and the like.

Examples of the radiation polymerizable functional group include a radiation radical polymerizable group such as a group containing a carbon-carbon unsaturated bond such as an ethylenically unsaturated group, a radiation cation polymerizable group, and the like. Examples of the group containing a carbon-carbon unsaturated bond include vinyl, propenyl, isopropenyl, acryl, and methacryl. Examples of the radiation cationically polymerizable group include an epoxy group, an oxetanyl group, and an oxetanyl group. Among them, a group containing a carbon-carbon unsaturated bond is preferable, and acryl and methacryl are more preferable. The radiation polymerizable functional group may be one kind or two or more kinds. The position of the radiation polymerizable functional group may be any of a polymer side chain, a polymer main chain, and a polymer main chain terminal.

The polymer having a radiation polymerizable functional group can be produced, for example, by a method in which a polymer having a reactive functional group (1 st functional group) and a compound having a functional group (2 nd functional group) capable of reacting with the 1 st functional group to form a bond are reacted and bonded in a state in which the radiation polymerization property of the radiation polymerizable functional group is maintained. Therefore, the polymer having a radiation polymerizable functional group preferably includes a structural portion derived from the polymer having a 1 st functional group and a structural portion derived from the compound having a 2 nd functional group and a radiation polymerizable functional group.

Examples of the combination of the 1 st functional group and the 2 nd functional group include a carboxyl group and an epoxy group, an epoxy group and a carboxyl group, a carboxyl group and an aziridine group, an aziridine group and a carboxyl group, a hydroxyl group and an isocyanate group, and an isocyanate group and a hydroxyl group. Among these, a combination of a hydroxyl group and an isocyanate group and a combination of an isocyanate group and a hydroxyl group are preferable from the viewpoint of ease of reaction tracking. The combination may be one kind or two or more kinds.

Examples of the compound having a radiation polymerizable functional group and an isocyanate group include methacryloyl isocyanate, 2-acryloyloxyethyl isocyanate, 2-methacryloyloxyethyl isocyanate (MOI), m-isopropenyl- α, α -dimethylbenzyl isocyanate, and the like. The above-mentioned compounds may be used singly or in combination of two or more.

The content of the structural portion derived from the compound having the 2 nd functional group and the radiation polymerizable functional group in the acrylic resin having the radiation polymerizable functional group is preferably 0.5 mol or more, more preferably 1 mol or more, still more preferably 3 mol or more, and still more preferably 10 mol or more, based on 100 mol of the total amount of the structural portion derived from the acrylic resin having the 1 st functional group, from the viewpoint of enabling further progress of curing of the radiation curable resin layer. The content is, for example, 100 mol or less.

The molar ratio of the 2 nd functional group to the 1 st functional group [ 2 nd functional group/1 st functional group ] in the acrylic resin having a radiation-polymerizable functional group is preferably 0.01 or more, more preferably 0.05 or more, still more preferably 0.2 or more, and particularly preferably 0.4 or more, from the viewpoint of enabling further progress of curing of the radiation-curable resin layer. In addition, from the viewpoint of further reducing the low molecular weight substance in the radiation curable resin layer, the above molar ratio is preferably less than 1.0, more preferably 0.9 or less.

The acrylic resin is obtained by polymerizing the various monomer components. The polymerization method is not particularly limited, and examples thereof include a solution polymerization method, an emulsion polymerization method, a bulk polymerization method, a polymerization method by irradiation of active energy rays (active energy ray polymerization method), and the like. The acrylic resin obtained may be any of a random copolymer, a block copolymer, a graft copolymer, and the like.

The acrylic resin having a radiation polymerizable functional group can be produced, for example, by the following method: after polymerizing (copolymerizing) a raw material monomer containing a monomer component having the 1 st functional group to obtain an acrylic resin having the 1 st functional group, the above-mentioned compound having the 2 nd functional group and the radiation polymerizable functional group is subjected to a condensation reaction or an addition reaction with the acrylic resin in a state where the radiation polymerization property of the radiation polymerizable functional group is maintained.

In the polymerization of the monomer component, various general solvents can be used. Examples of the solvent include: esters such as ethyl acetate and n-butyl acetate; aromatic hydrocarbons such as toluene and benzene; aliphatic hydrocarbons such as n-hexane and n-heptane; alicyclic hydrocarbons such as cyclohexane and methylcyclohexane; organic solvents such as ketones including methyl ethyl ketone and methyl isobutyl ketone. The solvent may be used alone or in combination of two or more.

The polymerization initiator, chain transfer agent, emulsifier, etc. used in the radical polymerization of the monomer component are not particularly limited, and may be appropriately selected and used. The weight average molecular weight of the acrylic polymer can be controlled by the amount of the polymerization initiator, the amount of the chain transfer agent, and the reaction conditions, and the appropriate amount thereof can be adjusted according to the kind of the polymerization initiator, the chain transfer agent, and the reaction conditions.

As the polymerization initiator used in the polymerization of the monomer component, a thermal polymerization initiator, a photopolymerization initiator (photoinitiator), or the like can be used depending on the kind of polymerization reaction. The polymerization initiator may be used alone or in combination of two or more.

The thermal polymerization initiator is not particularly limited, and examples thereof include azo-based polymerization initiators, peroxide-based polymerization initiators, redox-based polymerization initiators, and the like. The amount of the thermal polymerization initiator used is preferably 1 part by mass or less, more preferably 0.005 to 1 part by mass, and still more preferably 0.02 to 0.5 part by mass, based on 100 parts by mass of the total amount of all monomer components constituting the acrylic resin having the 1 st functional group.

Examples of the photopolymerization initiator include benzoin ether photopolymerization initiators, acetophenone photopolymerization initiators, α -ketol photopolymerization initiators, aromatic sulfonyl chloride photopolymerization initiators, photoactive oxime photopolymerization initiators, benzoin photopolymerization initiators, benzil photopolymerization initiators, benzophenone photopolymerization initiators, ketal photopolymerization initiators, thioxanthone photopolymerization initiators, acylphosphine oxide photopolymerization initiators, and titanocene photopolymerization initiators. Among them, acetophenone photopolymerization initiators are preferable.

Examples of the acetophenone photopolymerization initiator include 2, 2-diethoxyacetophenone, 2-dimethoxy-2-phenylacetophenone, 1-hydroxycyclohexylphenyl ketone, 4-phenoxydichloroacetophenone, 4- (tert-butyl) dichloroacetophenone, 1- [4- (2-hydroxyethoxy) -phenyl ] -2-hydroxy-2-methyl-1-propan-1-one, 2-hydroxy-2-methyl-1-phenyl-propan-1-one, and methoxyacetophenone.

The amount of the photopolymerization initiator used is preferably 0.005 to 1 part by mass, more preferably 0.01 to 0.7 part by mass, and even more preferably 0.18 to 0.5 part by mass, based on 100 parts by mass of the total amount of all the monomer components constituting the acrylic resin. When the amount used is 0.005 parts by mass or more (particularly 0.18 parts by mass or more), the following tends to be the case: the molecular weight of the acrylic resin can be easily controlled to be small, and the residual stress of the resin layer becomes high, so that the level difference absorbability becomes more excellent.

The reaction of the acrylic resin having the 1 st functional group and the compound having the 2 nd functional group and the radiation polymerizable functional group may be carried out, for example, by stirring in a solvent in the presence of a catalyst. The solvent may be the solvent described above. The above-mentioned catalyst is appropriately selected according to the combination of the 1 st functional group and the 2 nd functional group. The reaction temperature in the above reaction is, for example, 5 to 100℃and the reaction time is, for example, 1 to 36 hours.

The acrylic resin may have a structural part derived from a crosslinking agent. For example, the acrylic resin can be crosslinked to further reduce the low molecular weight substance in the resin layer. In addition, the weight average molecular weight of the acrylic resin can be increased. When the acrylic resin has a radiation polymerizable functional group, the crosslinking agent is a substance that crosslinks functional groups other than the radiation polymerizable functional group (for example, the 1 st functional group, the 2 nd functional group, or the 1 st functional group and the 2 nd functional group). The crosslinking agent may be used alone or in combination of two or more.

Examples of the crosslinking agent include isocyanate-based crosslinking agents, epoxy-based crosslinking agents, melamine-based crosslinking agents, peroxide-based crosslinking agents, urea-based crosslinking agents, metal alkoxide-based crosslinking agents, metal chelate-based crosslinking agents, metal salt-based crosslinking agents, carbodiimide-based crosslinking agents, oxazoline-based crosslinking agents, aziridine-based crosslinking agents, amine-based crosslinking agents, silicone-based crosslinking agents, and silane-based crosslinking agents. Among these, isocyanate-based crosslinking agents and epoxy-based crosslinking agents are preferable, and isocyanate-based crosslinking agents are more preferable, from the viewpoint of excellent adhesion to the semiconductor element and low impurity ions.

Examples of the isocyanate-based crosslinking agent (polyfunctional isocyanate compound) include: lower aliphatic polyisocyanates such as 1, 2-ethylene diisocyanate, 1, 4-butylene diisocyanate, and 1, 6-hexamethylene diisocyanate; alicyclic polyisocyanates such as cyclopentylene diisocyanate, cyclohexylene diisocyanate, isophorone diisocyanate, hydrogenated toluene diisocyanate, and hydrogenated xylene diisocyanate; aromatic polyisocyanates such as 2, 4-toluene diisocyanate, 2, 6-toluene diisocyanate, 4' -diphenylmethane diisocyanate, and xylylene diisocyanate. Examples of the isocyanate-based crosslinking agent include trimethylolpropane/toluene diisocyanate adduct, trimethylolpropane/hexamethylene diisocyanate adduct, and trimethylolpropane/xylylene diisocyanate adduct.

The content of the structural part derived from the crosslinking agent is not particularly limited, but is preferably 5 parts by mass or less, more preferably 0.001 to 5 parts by mass, and still more preferably 0.01 to 3 parts by mass, based on 100 parts by mass of the total amount of the acrylic resin excluding the structural part derived from the crosslinking agent.

The resin layer may contain other components than the above components in the respective layers within a range that does not impair the effects of the present invention. Examples of the other components include a curing agent, a crosslinking accelerator, a tackifying resin (rosin derivative, polyterpene resin, petroleum resin, oil-soluble phenol, etc.), an oligomer, an anti-aging agent, a filler (metal powder, organic filler, inorganic filler, etc.), an antioxidant, a plasticizer, a softener, a surfactant, an antistatic agent, a surface lubricant, a leveling agent, a light stabilizer, an ultraviolet absorber, a polymerization inhibitor, a particulate matter, a foil-like matter, and the like. The other components may be used alone or in combination of two or more.

< substrate portion >

In the optical semiconductor element sealing sheet of the present invention, the sealing resin layer may be provided on at least one surface of the base material portion. When the optical semiconductor element sealing sheet of the present invention includes the base material portion, the non-colored layer a of the sealing resin layer is in contact with the base material portion on the opposite side of the colored layer B. When the base material portion is provided on the opposite side of the sealing resin layer from the optical semiconductor element side in the optical semiconductor element sealing sheet, the surface of the sealing resin layer can be flattened, whereby light reflection disorder is less likely to occur, and the display body can be improved in appearance both at the time of extinction and at the time of light emission. Further, by forming an antiglare layer and an antireflection layer described later on the base material portion, antiglare property and antireflection property can be imparted to the display. Further, the support body serving as the sealing resin layer in the optical semiconductor element sealing sheet has excellent handleability by including the base material portion. The base material portion may not be provided.

The base material portion may be a single layer or may be a plurality of layers having the same composition, different thickness, or the like. When the base material portion is a plurality of layers, the layers may be bonded by other layers such as an adhesive layer. The base material layer used in the base material portion is a portion that is adhered to the substrate provided with the optical semiconductor element together with the sealing resin layer, and the release liner that is peeled off at the time of use (at the time of adhesion) of the optical semiconductor element sealing sheet and the surface protection film that is only used to protect the surface of the base material portion are not included in the "base material portion".

Examples of the substrate layer constituting the substrate portion include glass, a plastic substrate (particularly, a plastic film), and the like. Examples of the resin constituting the plastic base material include: polyolefin resins such as low density polyethylene, linear low density polyethylene, medium density polyethylene, high density polyethylene, ultra low density polyethylene, random copolymer polypropylene, block copolymer polypropylene, homo-polypropylene, polybutene, polymethylpentene, ionomer, ethylene- (meth) acrylic acid copolymer, ethylene- (meth) acrylic acid ester (random, alternating) copolymer, ethylene-vinyl acetate copolymer (EVA), ethylene-propylene copolymer, cyclic olefin polymer, ethylene-butene copolymer, ethylene-hexene copolymer; polyurethane; polyesters such as polyethylene terephthalate (PET), polyethylene naphthalate, polybutylene terephthalate (PBT), and the like; a polycarbonate; polyimide resin; polyether ether ketone; a polyetherimide; polyamides such as aramid and wholly aromatic polyamide; polyphenylene sulfide; a fluororesin; polyvinyl chloride; polyvinylidene chloride; cellulose resins such as triacetyl cellulose (TAC); a silicone resin; acrylic resins such as polymethyl methacrylate (PMMA); polysulfone; polyarylate; polyvinyl acetate, and the like. The resin may be used alone or in combination of two or more. The base material layer may be various optical films such as an Antireflection (AR) film, a polarizing plate, and a retardation plate.

The thickness of the plastic film is preferably 20 to 300. Mu.m, more preferably 40 to 250. Mu.m. When the thickness is 20 μm or more, the supporting property and handling property of the optical semiconductor element sealing sheet are further improved. When the thickness is 300 μm or less, the display can be further thinned.

For the purpose of improving the adhesion to the sealing resin layer, the holding property, and the like, the surface of the substrate portion on the side provided with the sealing resin layer may be subjected to physical treatments such as corona discharge treatment, plasma treatment, sandblasting treatment, ozone exposure treatment, flame exposure treatment, high-voltage electric shock exposure treatment, and ionizing radiation treatment; chemical treatments such as chromic acid treatment; surface treatment such as easy adhesion treatment by a coating agent (primer). The surface treatment for improving the adhesion is preferably performed on the entire surface of the sealing resin layer side of the base material portion.

The thickness of the base material portion is preferably 5 μm or more, more preferably 10 μm or more, from the viewpoint of excellent functions as a support and scratch resistance of the surface. The thickness of the base material portion is preferably 300 μm or less, more preferably 250 μm or less, from the viewpoint of further excellent transparency.

< sheet for sealing optical semiconductor element >

The optical semiconductor element sealing sheet may include a layer having antiglare properties and/or antireflection properties. With such a configuration, when the optical semiconductor element is sealed, gloss and reflection of light can be suppressed, and the appearance can be improved. The antiglare layer may be an antiglare layer. The antireflective layer may be an antireflective treatment layer. The antiglare treatment and the antireflection treatment can be carried out by known and conventional methods, respectively. The antiglare layer and the antireflection layer may be the same layer or may be different layers. The antiglare and/or antireflection layer may be provided in one layer or two or more layers.

The haze value (initial haze value) of the optical semiconductor element sealing sheet is not particularly limited, but is preferably 80% or more, more preferably 85% or more, still more preferably 90% or more, and particularly preferably 95% or more, from the viewpoint of making the effect of suppressing luminance unevenness and the appearance more excellent. The upper limit of the haze value is not particularly limited.

The total light transmittance of the optical semiconductor element sealing sheet is not particularly limited, but is preferably 40% or less, more preferably 30% or less, and even more preferably 20% or less, from the viewpoint of further improving the function of preventing reflection of metal wiring or the like and the contrast. From the viewpoint of securing brightness, the total light transmittance is preferably 0.5% or more.

The haze value and the total light transmittance can be measured by the methods defined in JIS K7136 and JIS K7361-1, respectively, and can be controlled by the lamination order, type, thickness, and the like of the layers constituting the sealing resin layer and the base material portion.

The thickness of the optical semiconductor element sealing sheet is preferably 10 to 600 μm, more preferably 20 to 550 μm, further preferably 30 to 500 μm, further preferably 40 to 450 μm, and particularly preferably 50 to 400 μm, from the viewpoints of improving the function of preventing reflection of metal wiring and the like, improving contrast, and reducing color shift more efficiently. The release liner is not included in the above thickness.

The thickness of the non-colored layer A is preferably 30 to 480. Mu.m, more preferably 40 to 380. Mu.m, still more preferably 50 to 280. Mu.m. When the thickness of the non-colored layer a is 30 μm or more, the surface on the opposite side to the colored layer B is easily flattened, and when the optical semiconductor element is sealed, the surface of the sealing resin layer is less likely to cause irregular reflection of external light, and the appearance of the display is improved both at the time of extinction and at the time of light emission. When the thickness of the non-colored layer a is 480 μm or less, the thickness of the optical semiconductor element sealing sheet can be reduced.

The thickness of the colored layer B is preferably 5 to 100. Mu.m, more preferably 10 to 80. Mu.m, still more preferably 20 to 70. Mu.m. When the thickness of the colored layer B is 5 μm or more, the antireflection property is more excellent when the optical semiconductor element is sealed. When the thickness of the colored layer B is 100 μm or less, the thickness becomes sufficiently small in a state compressed by the non-colored layer a when the optical semiconductor element is sealed, and it is easy to further secure the luminance at the time of light emission of the optical semiconductor element. The thickness of the colored layer B is preferably smaller than the height of the optical semiconductor element (the height from the substrate surface to the end on the front surface side of the optical semiconductor element).

The thickness of the non-colored layer C is, for example, 5 to 480. Mu.m, preferably 5 to 100. Mu.m, more preferably 10 to 80. Mu.m, still more preferably 20 to 70. Mu.m. When the thickness of the non-colored layer C is 5 μm or more, the sealing property of the optical semiconductor element becomes more excellent. When the thickness of the non-colored layer C is 480 μm or less, it is easier to secure the luminance at the time of light emission of the optical semiconductor element.

The thickness of the sealing resin layer is, for example, 100 to 500. Mu.m, preferably 120 to 400. Mu.m, and more preferably 150 to 300. Mu.m. When the thickness is 100 μm or more, the sealing property of the optical semiconductor element becomes more excellent. When the thickness is 500 μm or less, the thickness of the display becomes thinner.

The optical semiconductor element sealing sheet has a functional layer laminated on one surface thereof, and has a sealing resin layer laminated on a non-colored layer A on a side having a colored layer B, and a wafer with a height of 120 μm raised, and has L measured from the functional layer side under conditions of 10 DEG field of view and light source D65 ^* a ^* b ^* L in (SCI) ^* (SCI) is preferably less than 54, more preferably 40 or less, and still more preferably 30 or less. The light reflected by the object includes regular reflected light, which is light that is difficult to recognize by naked eyes, and diffuse reflected light. L (L) ^* (SCE) is a value obtained by measuring reflected light not including regular reflected light, and L ^* (SCI) is a value obtained by measuring reflected light including regular reflected light, and can measure a color tone similar to the true color tone of an object, although the correlation with visibility to the naked eye is low. Thus, L ^* When (SCI) is lower than 54, the visibility of the display body is improved even when there is an influence of the environmentThe appearance is also excellent in the case.

Above L ^* a ^* b ^* A in (SCI) ^* (SCI) is preferably-5.0 to 5.0, more preferably-3.0 to 3.0, and still more preferably-2.0 to 2.0. Above L ^* a ^* b ^* B in (SCI) ^* (SCI) is preferably-5.0 to 5.0, more preferably-3.0 to 3.0, and still more preferably-2.5 to 2.5.a, a ^* (SCI) and/or b ^* When (SCI) is within the above range, the color tone of light emitted from the optical semiconductor element is good and the visibility is excellent.

Above L ^* a ^* b ^* L in (SCI) ^* (SCI)、a ^* (SCI) and b ^* The (SCI) may be measured by a known and customary spectrocolorimeter, specifically by the method described in the examples.

The functional layer is not included in the sealing resin layer, and examples thereof include layers that can impart various functions to the optical semiconductor element sealing sheet of the present invention. Examples of the functional layer include a layer including a surface treatment layer. With such a configuration, the optical semiconductor element sealing sheet in which the functional layer including the surface treatment layer is laminated is excellent in light diffusion property and light extraction efficiency. Examples of the surface treatment layer include an antiglare treatment layer (antiglare treatment layer), an antireflection treatment layer, and a hard coat treatment layer. The functional layer may be laminated on the sealing resin layer in the optical semiconductor element sealing sheet of the present invention, or may be laminated on the base material portion, preferably on the base material portion, and preferably on the side opposite to the side of the base material portion on which the sealing resin layer is provided when the base material portion is provided.

The optical semiconductor element sealing sheet of the present invention may include the functional layer. When the functional layer is provided, the L may be provided without stacking a separate functional layer ^* a ^* b ^* (SCI) determination. When the optical semiconductor element sealing sheet of the present invention does not have the functional layer, the L is formed by stacking a functional layer separately ^* a ^* b ^* (SCI) determination. The functional layer is preferably opposite toThe color layer B side is laminated on the non-colored layer a side.

The optical semiconductor element sealing sheet preferably has an average concave brightness of 10 to 30 and/or a maximum convex brightness of higher than 143 when the sealing resin layer on the side having the colored layer B with respect to the non-colored layer a is stuck to a wafer with a height of 120 μm by convex processing and observed from the sealing resin layer side by a microscope. The maximum brightness of the convex portion is more preferably 150 or more, and still more preferably 160 or more. When the average luminance of the concave portion and/or the maximum luminance of the convex portion are within the above ranges, the antireflection property and the luminance height when the optical semiconductor element is sealed are more excellent.

[ Release liner ]

The sealing resin layer may be formed on a release treated surface of a release liner. When the sealing resin layer is formed on the release liner, the side of the sealing resin layer opposite to the non-colored layer a of the colored layer B is brought into contact with the release liner. When the base material portion is not provided, both surfaces of the sealing resin layer may be the sides in contact with the release liner. The release liner is used as a protective material for the optical semiconductor element sealing sheet, and is peeled off when sealing an optical semiconductor element. It should be noted that the release liner may not be provided.

The release liner is a component for protecting the surface of the optical semiconductor element sealing sheet by coating the surface, and is peeled off from the optical semiconductor element sealing sheet when the sheet is bonded to a substrate on which the optical semiconductor element is disposed.

Examples of the release liner include polyethylene terephthalate (PET) film, polyethylene film, polypropylene film, plastic film surface-coated with a release agent such as a fluorine-based release agent or a long-chain alkyl acrylate-based release agent, and papers.

The thickness of the release liner is, for example, 10 to 200. Mu.m, preferably 15 to 150. Mu.m, more preferably 20 to 100. Mu.m. When the thickness is 10 μm or more, breakage due to slitting is less likely to occur during processing of the release liner. When the thickness is 200 μm or less, the release liner is more easily peeled from the optical semiconductor element sealing sheet at the time of use.

[ method for producing optical semiconductor element sealing sheet ]

An embodiment of a method for manufacturing an optical semiconductor element sealing sheet according to the present invention will be described. For example, for the optical semiconductor element sealing sheet 1 shown in fig. 1, for example, a diffusion functional layer 21, a colored layer 22, and a non-colored layer 23 each sandwiched by release treated surfaces of 2 release liners are produced, respectively. One release liner attached to the diffusion functional layer 21 is the release liner 3.

Then, one of the release liners attached to the non-colored layer 23 is peeled off to expose the surface of the non-colored layer 23, and the exposed surface is attached to the base material portion 4. Then, one of the release liners attached to the colored layer 22 is peeled off, and the exposed surface of the colored layer 22 is bonded to the surface of the non-colored layer 23 exposed by peeling off the release liner on the surface of the non-colored layer 23.

Then, one of the release liners (not the release liner 3) attached to the diffusion functional layer 21 is peeled off, and the exposed surface of the diffusion functional layer 21 is attached to the surface of the coloring layer 22 exposed by peeling off the release liner on the surface of the coloring layer 22. The lamination of the various layers may be performed using a known roll or laminator. In this way, the optical semiconductor element sealing sheet 1 shown in fig. 1 in which the non-colored layer 23, the colored layer 22, the diffusion functional layer 21, and the release liner 3 are laminated in this order on the base material portion 4 can be produced.

[ optical semiconductor device ]

The optical semiconductor device such as a display can be manufactured using the optical semiconductor element sealing sheet of the present invention. A display manufactured by using the optical semiconductor element sealing sheet of the present invention comprises: the optical semiconductor device sealing sheet of the present invention is a sheet for sealing an optical semiconductor device, which comprises a substrate, an optical semiconductor device disposed on the substrate, and the optical semiconductor device. In the case where the optical semiconductor element sealing sheet of the present invention includes a radiation curable resin layer, the cured product is a cured product obtained by curing the radiation curable resin layer by irradiation with radiation.

Examples of the optical semiconductor element include Light Emitting Diodes (LEDs) such as blue light emitting diodes, green light emitting diodes, red light emitting diodes, and ultraviolet light emitting diodes.

In the above-described optical semiconductor device, the optical semiconductor element sealing sheet of the present invention has excellent following property for the concave-convex shape when the optical semiconductor element is a convex portion and the gaps between the plurality of optical semiconductor elements are concave portions, and thus the optical semiconductor element sealing sheet is preferably sealed to the plurality of optical semiconductor elements at one time.

The height of the optical semiconductor element on the substrate (the height from the substrate surface to the end on the front surface side of the optical semiconductor element) is preferably 500 μm or less. When the height is 500 μm or less, the sealing resin layer is more excellent in following the concave-convex shape.

Fig. 2 shows an embodiment of an optical semiconductor device using the optical semiconductor element sealing sheet 1 shown in fig. 1. The optical semiconductor device 10 shown in fig. 2 includes: the semiconductor device includes a substrate 5, a plurality of optical semiconductor elements 6 arranged on one surface of the substrate 5, a sealing resin layer 7 sealing the optical semiconductor elements 6, and a base material portion 4 laminated on the sealing resin layer 7. The plurality of optical semiconductor elements 6 are sealed by the sealing resin layer 7 at one time. The sealing resin layer 7 is formed by laminating a diffusion functional layer 71, a coloring layer 72, and a non-coloring layer 73. The diffusion functional layer 21 adheres to the optical semiconductor element 6 and the substrate 5 in accordance with the concave-convex shape formed by the plurality of optical semiconductor elements 6, and fills the optical semiconductor element 6. The diffusion functional layer 71 follows the concave-convex shape, and thus the interface on the optical semiconductor element 6 side has the concave-convex shape, and the interface on the other side is flat.

The sealing resin layer 7 is formed of the sealing resin layer 2. Specifically, in the optical semiconductor element sealing sheet 1, when the sealing resin layer 2 does not have a radiation curable resin layer, the sealing resin layer 2 becomes the sealing resin layer 7 in the optical semiconductor device 10. On the other hand, in the optical semiconductor element sealing sheet 1, when the sealing resin layer 2 has a radiation curable resin layer, for example, when the colored layer 22 is a radiation curable resin layer, the colored layer 22 is cured to form the colored layer 72, thereby forming the sealing resin layer 7.

In the optical semiconductor device 10 shown in fig. 2, the optical semiconductor element 6 is completely embedded in the diffusion functional layer 71 and sealed, and is indirectly sealed by the colored layer 72 and the non-colored layer 73. That is, the optical semiconductor element 6 is sealed with the sealing resin layer 7 formed of a laminate of the diffusion functional layer 71, the colored layer 72, and the non-colored layer 73. The optical semiconductor device is not limited to this type, and for example, as shown in fig. 3, the optical semiconductor element 6 may be entirely embedded in the diffusion functional layer 71 and the colored layer 72 and sealed, and may be indirectly sealed with the non-colored layer 73. As shown in fig. 4, the optical semiconductor element 6 may be entirely embedded in the diffusion functional layer 71, the colored layer 72, and the non-colored layer 73, and sealed.

In the above optical semiconductor device, it is preferable that the relationship between the hardness a, the hardness B, and the hardness C be satisfied for the non-colored layer in the sealing resin layer formed of the non-colored layer a, the colored layer in the sealing resin layer formed of the colored layer B, and the non-colored layer in the sealing resin layer formed of the non-colored layer C, respectively.

The optical semiconductor device may be a device in which the respective optical semiconductor devices are tiled. That is, the optical semiconductor device may be a device in which a plurality of optical semiconductor devices are arranged in a tile shape in a planar direction.

The display body preferably includes a self-luminous display device. The self-luminous display device can be combined with a display panel as needed to form a display body as an image display device. The optical semiconductor element in this case is an LED element. Examples of the self-luminous display device include an LED display, a backlight, and an organic electroluminescence (organic EL) display device. The backlight is particularly preferably a full-surface direct type backlight. The backlight includes, for example, a laminate including the substrate and a plurality of optical semiconductor elements disposed on the substrate as at least a part of a constituent member. For example, in the self-luminous display device, a metal wiring layer for transmitting a light emission control signal to each LED element is laminated on the substrate. The LED elements that emit light of red (R), green (G), and blue (B) are alternately arranged on the substrate with a metal wiring layer interposed therebetween. The metal wiring layer is made of a metal such as copper, and displays each color by adjusting the light emission degree of each LED element.

The optical semiconductor element sealing sheet can be used for an optical semiconductor device that is used for bending, for example, an optical semiconductor device having a bendable image display device (flexible display) (particularly, a foldable image display device (foldable display)). Specifically, the present invention can be used for a foldable backlight, a foldable self-luminous display device, and the like.

The optical semiconductor element sealing sheet of the present invention is excellent in the following property and landfill property of the optical semiconductor element, and therefore can be preferably used both in the case where the optical semiconductor device is a mini LED display device and in the case where the optical semiconductor device is a micro LED display device.

[ method for manufacturing optical semiconductor device ]

The optical semiconductor device can be manufactured, for example, by bonding the optical semiconductor element sealing sheet of the present invention to a substrate on which an optical semiconductor element is disposed and sealing the optical semiconductor element with a sealing resin layer.

(sealing Process)

The method for manufacturing an optical semiconductor device using the optical semiconductor element sealing sheet includes the following sealing steps: the optical semiconductor element sealing sheet is bonded to a substrate on which the optical semiconductor element is disposed, and the optical semiconductor element is sealed with a sealing resin layer. Specifically, in the sealing step, the release liner is peeled off from the optical semiconductor element sealing sheet to expose the sealing resin layer. Then, when the laminate is provided with a plurality of optical semiconductor elements, the plurality of optical semiconductor elements are further arranged so that the sealing resin layer fills gaps between the plurality of optical semiconductor elements, and the plurality of optical semiconductor elements are sealed together. Specifically, the release liner 3 is peeled off from the optical semiconductor element sealing sheet 1 shown in fig. 1, the exposed diffusion functional layer 21 is disposed so as to face the surface of the substrate 5 on which the optical semiconductor element 6 is disposed, the optical semiconductor element sealing sheet 1 is bonded to the surface of the substrate 5 on which the optical semiconductor element 6 is disposed, and the optical semiconductor element 6 is embedded in the sealing resin layer 2.

The temperature at the time of bonding is, for example, in the range of room temperature to 110 ℃. In addition, the pressure may be reduced or increased during the bonding. By the pressure reduction and the pressure increase, formation of a void between the sealing resin layer and the substrate or the optical semiconductor element can be suppressed. In the sealing step, it is preferable that the optical semiconductor element sealing sheet is bonded under reduced pressure and then pressurized. The pressure at the time of depressurization is, for example, 1 to 100Pa, and the depressurization time is, for example, 5 to 600 seconds. The pressure at the time of pressurization is, for example, 0.05 to 0.5MPa, and the pressurization time is, for example, 5 to 600 seconds.

(radiation irradiation step)

When the sealing resin layer includes a radiation curable resin layer, the manufacturing method may further include a radiation irradiation step of: and irradiating a laminate including the substrate, the optical semiconductor element disposed on the substrate, and the optical semiconductor element sealing sheet for sealing the optical semiconductor element with radiation, and curing the radiation-curable resin layer to form a cured layer. Examples of the radiation include electron beam, ultraviolet ray, α ray, β ray, γ ray, and X ray, as described above. Among them, ultraviolet rays are preferable. The temperature at the time of irradiation with the radiation is, for example, in the range of room temperature to 100℃and the irradiation time is, for example, 1 minute to 1 hour.

(cutting step)

The above manufacturing method may further include the following dicing step: cutting a laminate including the substrate, the optical semiconductor element disposed on the substrate, and the optical semiconductor element sealing sheet for sealing the optical semiconductor element. The laminate may be subjected to the radiation irradiation step. When the laminate includes a cured product layer obtained by curing the radiation-curable resin layer by irradiation with the radiation, the cured product layer of the optical semiconductor element sealing sheet and the side end portion of the substrate are cut and removed in the dicing step. This makes it possible to expose the surface of the cured product layer, which is sufficiently cured and has low adhesion, on the side surface. The cutting may be performed by a known and conventional method, for example, by a method using a cutting blade or by irradiation with a laser.

(tiling step)

The above manufacturing method may further include a tiling step of: the plurality of optical semiconductor devices obtained in the dicing step are arranged so as to be in contact with each other in the planar direction. In the tiling step, the plurality of laminated bodies obtained in the dicing step are aligned so as to be in contact with each other in the planar direction, and are tiled. In this way, 1 large display can be manufactured.

As described above, an optical semiconductor device can be manufactured. In the optical semiconductor element sealing sheet 1, when the sealing resin layer 2 does not have a radiation-curable resin layer, the sealing resin layer 2 becomes the sealing resin layer 7 in the optical semiconductor device 10. On the other hand, in the optical semiconductor element sealing sheet 1, when the sealing resin layer 2 has a radiation curable resin layer, for example, when the colored layer 22 is a radiation curable resin layer, the colored layer 22 is cured to form the colored layer 72, thereby forming the sealing resin layer 7.

Examples

The present invention will be described in more detail with reference to the following examples, but the present invention is not limited to these examples.

Production example 1

(preparation of acrylic prepolymer solution A)

Into a separable flask equipped with a thermometer, a stirrer, a reflux condenser, and a nitrogen inlet tube, 78 parts by mass of 2-ethylhexyl acrylate (2-EHA), 18 parts by mass of N-vinyl-2-pyrrolidone (NVP), and 5 parts by mass of 2-hydroxyethyl acrylate (HEA) were charged as monomer componentsAfter 0.035 parts by mass of a photopolymerization initiator (trade name "omnirad 184", manufactured by IGM Resins Italia Srl company) and 0.035 parts by mass of a photopolymerization initiator (trade name "omnirad 651", manufactured by IGM Resins Italia Srl company), nitrogen was flowed, and nitrogen substitution was performed for about 1 hour while stirring. Then, at 5mW/cm ² Irradiating ultraviolet rays to polymerize, and adjusting the reaction rate to 5-15% to obtain an acrylic prepolymer solution A.

Production example 2

(preparation of acrylic oligomer solution)

100 parts by mass of toluene, 60 parts by mass of dicyclopentyl methacrylate (DCPMA) (trade name "FA-513M", manufactured by Hitachi chemical industry Co., ltd.), 40 parts by mass of Methyl Methacrylate (MMA) and 3.5 parts by mass of alpha-thioglycerol as a chain transfer agent were charged into a four-necked flask. Then, after stirring at 70℃under nitrogen atmosphere for 1 hour, 0.2 parts by mass of AIBN as a thermal polymerization initiator was charged, and reacted at 70℃for 2 hours, followed by reaction at 80℃for 2 hours. Then, the reaction solution was put into a temperature atmosphere of 130 ℃, and toluene, a chain transfer agent and an unreacted monomer were dried and removed, thereby obtaining a solid acrylic oligomer. The Tg of the acrylic oligomer was 144℃and the Mw was 4300. 50 parts by mass of 2-ethylhexyl acrylate (2-EHA) was added to 50 parts by mass of the above-mentioned acrylic oligomer and dissolved, to obtain an acrylic oligomer solution.

Production example 3

(preparation of adhesive composition A)

17.6 parts by mass of 2-hydroxyethyl acrylate (HEA), 11.8 parts by mass of the acrylic oligomer solution prepared in production example 2, 0.088 part by mass of a 2-functional monomer (trade name "NK ESTER A-HD-N", manufactured by Xinzhou Chemie Co., ltd.) and 0.353 part by mass of a silane coupling agent (trade name "KBM-403", manufactured by Xinyue chemical Co., ltd., 3-glycidoxypropyl trimethoxysilane) were added to the acrylic prepolymer solution A prepared in production example 1 (the total amount of prepolymers is 100 parts by mass), to obtain an adhesive composition A.

Production example 4

(preparation of adhesive composition B)

17.6 parts by mass of 2-hydroxyethyl acrylate (HEA), 11.8 parts by mass of the acrylic oligomer solution prepared in production example 2, 0.294 parts by mass of a 2-functional monomer (trade name "NK ESTER A-HD-N", manufactured by Xinzhou Chemie Co., ltd.) and 0.353 parts by mass of a silane coupling agent (trade name "KBM-403", manufactured by Xinyue chemical Co., ltd., 3-glycidoxypropyl trimethoxysilane) were added to the acrylic prepolymer solution A prepared in production example 1 (the total amount of prepolymers is 100 parts by mass), to obtain an adhesive composition B.

Production example 5

(preparation of acrylic prepolymer solution B)

67 parts by mass of Butyl Acrylate (BA), 14 parts by mass of cyclohexyl acrylate (CHA), 19 parts by mass of 4-hydroxybutyl acrylate (4-HBA), 0.09 parts by mass of a photopolymerization initiator (trade name "omnirad184", manufactured by IGM Resins Italia Srl Co.) and 0.09 parts by mass of a photopolymerization initiator (trade name "omnirad 651", manufactured by IGM Resins Italia Srl Co.) were charged into a separable flask equipped with a thermometer, a stirrer, a reflux condenser and a nitrogen inlet tube, and nitrogen was introduced thereinto, followed by stirring for nitrogen substitution for about 1 hour. Then, at 5mW/cm ² Irradiating ultraviolet rays to polymerize, and adjusting the reaction rate to 5-15% to obtain the acrylic prepolymer solution B.

Production example 6

(preparation of adhesive composition C)

To the acrylic prepolymer solution B prepared in production example 5 (100 parts by mass of the total amount of prepolymers), 9 parts by mass of 2-hydroxyethyl acrylate (HEA), 8 parts by mass of 4-hydroxybutyl acrylate (4-HBA), 0.1 part by mass of dipentaerythritol hexaacrylate (trade name "KAYARAD DPHA", manufactured by new middle village chemical industries, co.) as a polyfunctional monomer, and 0.4 part by mass of a silane coupling agent (trade name "KBM-403", manufactured by believed chemical industries, co., 3-glycidoxypropyl trimethoxysilane) were added to obtain an adhesive composition C.

PREPARATION EXAMPLE 7

(preparation of adhesive composition D)

To the acrylic prepolymer solution B prepared in production example 5 (the total amount of the prepolymer was 100 parts by mass), 9 parts by mass of 2-hydroxyethyl acrylate (HEA), 8 parts by mass of 4-hydroxybutyl acrylate (4-HBA), 0.02 part by mass of dipentaerythritol hexaacrylate (trade name "KAYARAD DPHA", manufactured by new middle village chemical industries, co.) as a polyfunctional monomer, 0.35 part by mass of a silane coupling agent (3-glycidoxypropyl trimethoxysilane, manufactured by Xinyue chemical industries, co.) and 0.3 part by mass of a photopolymerization initiator (trade name "omnirad 651", manufactured by IGM Resins Italia Srl) were added to obtain an adhesive composition D.

Production example 8

(production of non-light-diffusing adhesive layers 1 to 8)

The adhesive compositions a to D and the additives were mixed in the mass ratio shown in table 1. The mixture was applied to a release-treated surface of a release liner (trade name "MRE38", mitsubishi chemical corporation, a release treatment was applied to one side of a polyethylene terephthalate film, and the thickness was 38 μm) to form a resin composition layer, and then the release-treated surface of the release liner (trade name "MRF38", mitsubishi chemical corporation) was also bonded to the resin composition layer. Next, the ultraviolet rays of illuminance described in Table 1 were irradiated with a black light until the cumulative light amount was 3600mJ/cm ² Polymerization was performed to prepare non-diffusion functional layers (non-light diffusion adhesive layers) 1 to 8 having adhesiveness.

Production example 9

(production of antireflection layers 1 to 2)

The adhesive composition D and the additive were mixed in the mass ratio of table 1. The mixture was applied to a release-treated surface of a release liner (trade name "MRE38", mitsubishi chemical corporation, a release treatment was applied to one side of a polyethylene terephthalate film, and the thickness was 38 μm) to form a resin composition layer, and then the release-treated surface of the release liner (trade name "MRF38", mitsubishi chemical corporation) was also bonded to the resin composition layer. Next, ultraviolet rays of illuminance described in the black light irradiation table 1 were used until the cumulative light amount was 3600mJ/cm ² Thereby conducting polymerizationThe colored layers (antireflection layers) 1 to 2 were produced. 9256BLACK is a 20% dispersion of BLACK pigment (trade name "9256BLACK", manufactured by tokusiki co., ltd.).

Production example 10

(preparation of light diffusing adhesive layer 1)

The adhesive composition D and the additive were mixed in the mass ratio of table 1. The mixture was applied to a release-treated surface of a release liner (trade name "MRE38", mitsubishi chemical corporation, a release treatment was applied to one side of a polyethylene terephthalate film, and the thickness was 38 μm) to form a resin composition layer, and then the release-treated surface of the release liner (trade name "MRF38", mitsubishi chemical corporation) was also bonded to the resin composition layer. Next, the ultraviolet rays of illuminance described in Table 1 were irradiated with a black light until the cumulative light amount was 3600mJ/cm ² Polymerization is performed to produce a diffusion functional layer (light diffusion adhesive layer) 1 having adhesiveness. The Tospin 145 is a silicone resin having a trade name "Tospin 145" (manufactured by Momentive Performance Materials Japan, refractive index: 1.42, average particle diameter: 4.5 μm). POB-A is also known as "LIGHT ACRYLATE POB-A" (manufactured by Kyowase:Sub>A Kagaku Co., ltd.).

Production example 11

(production of base film with antiglare treatment layer)

As the resin contained in the antiglare treatment layer forming material, 40 parts by mass of an ultraviolet curable multifunctional acrylate resin (trade name "UA-53H", manufactured by new yokogaku chemical industry co., ltd.) and 60 parts by mass of a multifunctional acrylate containing pentaerythritol triacrylate as a main component (trade name "Viscot #300", manufactured by osaka organic chemical industry co., ltd.) were prepared. For 100 parts by mass of the total solid content of the resins of the above resins, 7.0 parts by mass of copolymerized particles of acrylic acid and styrene (trade name "techmer SSX-103DXE", manufactured by water-logging finished product industry co., ltd.) as particles for forming the antiglare treatment layer, 3 parts by mass of silicone resin (trade name "TOSPEARL130", manufactured by Momentive Performance Materials Japan), 2.5 parts by mass of synthetic smectite (trade name "SUMECTON SAN", KUNIMINE INDUSTRIES co., manufactured by ltd. Manufactured) as a thixotropic agent, 3 parts by mass of photopolymerization initiator (trade name "OMNIRAD907", manufactured by BASF corporation) and 0.15 parts by mass of leveling agent (trade name "GRANDIC PC4100", manufactured by DIC corporation) were mixed. The mixture was diluted with a toluene/cyclopentanone mixed solvent (mass ratio 80/20) so that the solid content concentration became 40 mass%, to prepare an antiglare treatment layer forming material (coating liquid).

As the light-transmitting substrate, a transparent plastic film substrate (trade name "KC4UY", TAC, konica Minolta, inc. Manufactured) was prepared. The antiglare layer-forming material (coating liquid) is applied to one side of the transparent plastic film substrate to form a coating film using a bar coater. Then, the transparent plastic film base material having the coating film formed thereon is transported to a drying step. In the drying step, the coating film was dried by heating at 80℃for 1 minute. Then, the accumulated light amount was irradiated with a high-pressure mercury lamp at 300mJ/cm ² The above-mentioned coating film was subjected to a curing treatment to form an antiglare treatment layer having a thickness of 8.5. Mu.m, to obtain an antiglare film (base film with antiglare treatment layer) having a haze of 25%.

Example 1

(production of optical semiconductor element sealing sheet)

The release liner (trade name "MRE 38") was peeled off from the non-light diffusing adhesive layer 1 obtained in production example 8 to expose the adhesive surface. The exposed surface of the light-diffusing adhesive layer 1 was bonded to the surface of the base film with the antiglare treatment layer produced in production example 11, which was subjected to the adhesion-facilitating treatment, and the non-light-diffusing adhesive layer 1 was formed on the base film.

Then, a release liner (trade name "MRF 38") was peeled off from the surface of the non-light diffusing adhesive layer 1 to expose the adhesive surface. An anti-reflection layer 1 was formed on the non-light diffusing adhesive layer 1 by bonding an adhesive surface exposed by peeling a release liner (trade name "MRE 38") from the anti-reflection layer 1 obtained in production example 9 to an exposed surface of the non-light diffusing adhesive layer 1.

Then, a release liner (trade name "MRF 38") was peeled off from the surface of the antireflection layer 1 to expose the adhesive surface. The adhesive surface of the light diffusion adhesive layer 1 obtained in production example 10, from which the release liner (trade name "MRE 38") was peeled off, was bonded to the exposed surface of the antireflection layer 1, and the light diffusion adhesive layer 1 was formed on the antireflection layer 1.

Then, the resultant was bonded with a manual roller at room temperature (23 ℃) so as not to mix air bubbles, and left under light shielding for two days. Thus, a sheet for sealing an optical semiconductor element was obtained, which was formed of [ release liner/light-diffusing adhesive layer 1 (50 μm)/antireflection layer 1 (50 μm)/non-light-diffusing adhesive layer 1 (100 μm)/base film ].

Example 2

An optical semiconductor element sealing sheet formed of [ release liner/light diffusion adhesive layer 1 (50 μm)/antireflection layer 1 (50 μm)/non-light diffusion adhesive layer 2 (100 μm)/base film ] was obtained in the same manner as in example 1, except that the non-light diffusion adhesive layer 2 was used instead of the non-light diffusion adhesive layer 1.

Example 3

An optical semiconductor element sealing sheet formed of [ release liner/light diffusion adhesive layer 1 (50 μm)/antireflection layer 1 (50 μm)/non-light diffusion adhesive layer 3 (100 μm)/base film ] was obtained in the same manner as in example 1, except that the non-light diffusion adhesive layer 3 was used instead of the non-light diffusion adhesive layer 1.

Example 4

An optical semiconductor element sealing sheet formed of [ release liner/light diffusion adhesive layer 1 (50 μm)/antireflection layer 1 (50 μm)/non-light diffusion adhesive layer 4 (100 μm)/base film ] was obtained in the same manner as in example 1, except that the non-light diffusion adhesive layer 4 was used instead of the non-light diffusion adhesive layer 1.

Example 5

An optical semiconductor element sealing sheet formed of [ release liner/light diffusion adhesive layer 1 (50 μm)/antireflection layer 1 (50 μm)/non-light diffusion adhesive layer 5 (100 μm)/base film ] was obtained in the same manner as in example 1, except that the non-light diffusion adhesive layer 5 was used instead of the non-light diffusion adhesive layer 1.

Example 6

An optical semiconductor element sealing sheet formed of [ release liner/light diffusion adhesive layer 1 (50 μm)/antireflection layer 1 (50 μm)/non-light diffusion adhesive layer 6 (100 μm)/base film ] was obtained in the same manner as in example 1, except that the non-light diffusion adhesive layer 6 was used instead of the non-light diffusion adhesive layer 1.

Example 7

The release liner (trade name "MRE 38") was peeled off from the non-light diffusing adhesive layer 7 obtained in production example 8 to expose the adhesive surface. The exposed surface of the light-diffusing adhesive layer 7 was bonded to the surface of the base film with the antiglare treatment layer prepared in production example 11, which was subjected to the adhesion-facilitating treatment, and the non-light-diffusing adhesive layer 7 was formed on the base film.

Then, a release liner (trade name "MRF 38") was peeled off from the surface of the non-light diffusing adhesive layer 7 to expose the adhesive surface. The adhesive surface of the antireflection layer 2 obtained in production example 9, from which the release liner (trade name "MRE 38") was peeled off, was bonded to the exposed surface of the non-light-diffusing adhesive layer 7, and the antireflection layer 2 was formed on the non-light-diffusing adhesive layer 7.

Then, the resultant was bonded with a manual roller at room temperature (23 ℃) so as not to mix air bubbles, and left under light shielding for two days. Thus, a sheet for sealing an optical semiconductor element, which was formed of [ release liner/antireflection layer 2 (50 μm)/non-light-diffusing adhesive layer 7 (100 μm)/base film ], was obtained.

Comparative example 1

An optical semiconductor element sealing sheet formed of [ release liner/light diffusion adhesive layer 1 (50 μm)/antireflection layer 1 (50 μm)/non-light diffusion adhesive layer 8 (100 μm)/base film ] was obtained in the same manner as in example 1, except that the non-light diffusion adhesive layer 8 was used instead of the non-light diffusion adhesive layer 1.

Comparative example 2

The release liner (trade name "MRE 38") was peeled off from the antireflection layer 1 obtained in production example 9 to expose the adhesive surface. The exposed surface of the antireflection layer 1 was bonded to the surface of the base film with the antiglare treatment layer produced in production example 11, which was subjected to the adhesion treatment, and the antireflection layer 1 was formed on the base film.

Then, a release liner (trade name "MRF 38") was peeled off from the surface of the antireflection layer 1 to expose the adhesive surface. The non-light-diffusing adhesive layer 8 obtained in production example 8 was laminated on the exposed surface of the antireflection layer 1 by peeling the release liner (trade name "MRE 38") off the non-light-diffusing adhesive layer 8, and the non-light-diffusing adhesive layer 8 was formed on the antireflection layer 1.

Then, the resultant was bonded with a manual roller at room temperature (23 ℃) so as not to mix air bubbles, and left under light shielding for two days. Thus, a sheet for sealing an optical semiconductor element, which was formed of [ release liner/non-light-diffusing adhesive layer 8 (150 μm)/antireflection layer 1 (50 μm)/base film ], was obtained.

Comparative example 3

The release liner (trade name "MRE 38") was peeled off from the non-light diffusing adhesive layer 8 obtained in production example 8 to expose the adhesive surface. The exposed surface of the light-diffusing adhesive layer 8 was bonded to the surface of the base film with the antiglare treatment layer prepared in production example 11, which was subjected to the adhesion-facilitating treatment, and the non-light-diffusing adhesive layer 8 was formed on the base film.

Then, the resultant was bonded with a manual roller at room temperature (23 ℃) so as not to mix air bubbles, and left under light shielding for two days. Thus, a sheet for sealing an optical semiconductor element, which was formed of [ release liner/non-light-diffusing adhesive layer 8 (200 μm)/base film ], was obtained.

< evaluation >

The following evaluations were performed on the layers produced in each production example and the optical semiconductor element sealing sheets obtained in the examples and comparative examples. The results are shown in Table 2.

(1) Residual stress

The light-diffusing adhesive layer, the antireflection layer (adhesive layer having antireflection property) and the non-light-diffusing adhesive layer produced in each production example were cut into 40mm×40mm pieces, and the adhesive layer was wound up from one side to produce a string-like wound test piece having a length of 40 mm. The test piece was stretched using a universal tester (trade name "Autograph AG-IS", manufactured by Shimadzu corporation) at a stretching magnification of 300% (distance between chucks after stretching of 80 mm) and a stretching speed of 300 mm/sec, with the initial distance between chucks set to 20mm, and the residual stress after being held in a stretched state for 300 seconds was measured.

(2) Brightness of light

(preparation of evaluation sample)

The release liner was peeled off from the optical semiconductor element sealing sheet, and the exposed adhesive surface was bonded to an 8-inch wafer with a height of 120 μm by bump processing. The adhesion was performed by differential pressure adhesion using the apparatus "MSV300" manufactured by Nito Seiko Co. The conditions for differential pressure bonding were set to vacuum: 20Pa, bonding pressure: 0.1MPa, wafer surface temperature: 60 ℃.

(measurement of brightness)

An image of a range including a plurality of projections and recesses was obtained by focusing the projections of the concave-convex wafer on the substrate film side with the antiglare treatment layer with 50 magnification and annular illumination (maximum brightness) using a microscope (trade name "VHX-7000", manufactured by KEYENCE corporation) and a high-performance low magnification zoom lens (trade name "VH-Z00R", manufactured by KEYENCE corporation). Image parsing uses "ImageJ". In the obtained image, 3 convex portions were selected and a histogram was formed, and the maximum brightness of the convex portions was recorded, and the average value of n3 was taken as the maximum brightness of the convex portions. In the obtained image, 3 concave portions were selected, a histogram was formed, and the average value of n3 was used as the concave portion average luminance.

The higher the maximum brightness of the convex portion, the more the reflection of light emitted from the microscope at the convex portion is observed, and it is determined that the convex portion is excellent in transmittance. When the transmittance is excellent, the efficiency of extracting light emitted from the optical semiconductor element is excellent, and the light becomes high brightness. In table 2, the case where the maximum brightness of the convex portion is 150 or more is evaluated as brightness "Σ", and the case where the maximum brightness of the convex portion is less than 150 is evaluated as brightness "×". The lower the average brightness of the concave portion, the more the reflection of light emitted from the microscope at the concave portion can be suppressed, and if the average brightness is 10 to 30, it is determined that the anti-reflection effect (anti-reflection "∈") is sufficient. On the other hand, in comparative example 3, it was not possible to lower than 140, and it was judged that reflection was prevented.

(compromise of anti-reflection and brightness)

The case where both the anti-reflection and the luminance were "o" was evaluated as "o", and the case where at least one of the anti-reflection and the luminance was "x" was evaluated as "x".

(3)L ^* a ^* b ^* (SCI)

The evaluation sample prepared in the evaluation of the brightness of (2) above was left standing on a flat surface so that the base film of the sheet for sealing an optical semiconductor element faced outward. L is carried out by disposing the entire measuring section of a spectrocolorimeter (trade name "CM-26dG", manufactured by Konica Minolta, inc.) on the surface of the base film of the optical semiconductor element sealing sheet ^* (SCI)、a ^* (SCI) and b ^* (SCI) determination. The measurement area of the colorimeter was set so as to reach the center of the measurement sample, and the measurement was performed under the following conditions. Before measurement by the above-mentioned spectrocolorimeter, zero point correction, white correction, and GROSS correction were performed according to the manufacturer's manual. When only the concave-convex wafer is measured, L ^* (SCI) 66.8, a ^* (SCI) of 0.6, b ^* (SCI) was-6.1.

< measurement conditions >

The measuring method comprises the following steps: color and luster

Geometry: di:8 °, de:8 degree

Regular reflected light treatment: SCI+SCE

Observation light source: d65 (D65)

Observation conditions: 10 degree view

Diameter measurement: MAV (8 mm)

UV conditions: 100% full

Automatic average measurement: 3 times

Zero point correction: effectiveness [ Table 1]

TABLE 2

The following describes variations of the disclosed invention.

[ additional note 1] an optical semiconductor element sealing sheet for sealing 1 or more optical semiconductor elements disposed on a substrate,

the sheet comprises a sealing resin layer comprising a colored layer and a non-colored layer,

the hardness A of the non-colored layer and the hardness B of the colored layer satisfy A > B.

The optical semiconductor element sealing sheet according to appendix 2, wherein the hardness is 1 or more selected from the group consisting of residual stress, elastic modulus, young's modulus, and hardness measured by nanoindentation.

The optical semiconductor element sealing sheet according to item 1, wherein the hardness is a residual stress, and the ratio of the residual stress A1 of the non-colored layer to the residual stress B1 of the colored layer [ residual stress A1/residual stress B1] is 1.2 or more.

The optical semiconductor element sealing sheet according to any one of the additional notes 1 to 3, wherein the sealing resin layer further comprises a non-colored layer having a hardness of C on the side opposite to the non-colored layer of the colored layer.

The optical semiconductor element sealing sheet according to item 4, wherein the hardness C of the non-colored layer and the hardness B of the colored layer satisfy C > B.

The sheet for sealing an optical semiconductor element according to any one of supplementary notes 6 to 1 to 5, wherein the sealing resin layer includes a diffusion functional layer.

[ additionally described 7] a display body, comprising: a substrate; an optical semiconductor element disposed on the substrate; and the optical semiconductor element sealing sheet or the cured product thereof according to any one of supplementary notes 1 to 6 for sealing the optical semiconductor element.

The display body according to item 7, which is provided with a self-luminous display device.

The display body according to any one of supplementary notes 7 to 8, which is an image display device.

Claims

1. A sealing sheet for sealing at least 1 optical semiconductor element disposed on a substrate,

2. The sheet for sealing an optical semiconductor element according to claim 1, wherein the hardness is 1 or more selected from the group consisting of residual stress, elastic modulus, young's modulus, and hardness measured by nanoindentation.

3. The optical semiconductor element sealing sheet according to claim 1, wherein the hardness is a residual stress, and a ratio [ residual stress A1/residual stress B1] of the residual stress A1 of the non-colored layer to the residual stress B1 of the colored layer is 1.2 or more.

4. The optical semiconductor element sealing sheet according to any one of claims 1 to 3, wherein the sealing resin layer further comprises a non-colored layer having a hardness of C on a side of the colored layer opposite to the non-colored layer.

5. The sheet for sealing an optical semiconductor element according to any one of claims 1 to 3, wherein the sealing resin layer comprises a diffusion functional layer.

6. A display body is provided with: a substrate; an optical semiconductor element disposed on the substrate; and the optical semiconductor element sealing sheet or cured product thereof according to any one of claims 1 to 3 for sealing the optical semiconductor element.

7. The display according to claim 6, comprising a self-luminous display device.

8. The display according to claim 6, which is an image display device.