CN116027112B - A kind of testing device and testing method for superconducting joint without back field - Google Patents
A kind of testing device and testing method for superconducting joint without back field Download PDFInfo
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- 238000012360 testing method Methods 0.000 title claims abstract description 98
- 238000000034 method Methods 0.000 claims abstract description 18
- 239000001307 helium Substances 0.000 claims description 69
- 229910052734 helium Inorganic materials 0.000 claims description 69
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 claims description 69
- 238000001816 cooling Methods 0.000 claims description 64
- 238000011084 recovery Methods 0.000 claims description 39
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 38
- 239000007788 liquid Substances 0.000 claims description 33
- 238000009434 installation Methods 0.000 claims description 28
- 229910052757 nitrogen Inorganic materials 0.000 claims description 19
- 239000012212 insulator Substances 0.000 claims description 14
- 238000001514 detection method Methods 0.000 claims description 10
- 238000000605 extraction Methods 0.000 claims description 8
- 238000002788 crimping Methods 0.000 claims description 7
- 229910052738 indium Inorganic materials 0.000 claims description 7
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 7
- 238000004891 communication Methods 0.000 claims description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims 1
- 230000009286 beneficial effect Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005086 pumping Methods 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- UDWPONKAYSRBTJ-UHFFFAOYSA-N [He].[N] Chemical compound [He].[N] UDWPONKAYSRBTJ-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
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Abstract
Description
技术领域technical field
本发明涉及超导磁体试验领域,特别是涉及一种超导接头无背场测试装置及其测试方法。The invention relates to the field of superconducting magnet testing, in particular to a superconducting joint non-back field testing device and a testing method thereof.
背景技术Background technique
在超导磁体线圈绕制过程中,由于超导线长度不可能无限长,或因实际工程需求进行逐段定做,这些都要求通过连接的方式解决长度问题,因此,超导线材的连接技术已成为实际应用中的一项关键技术。目前,超导接头的类型有盒式接头、烧结接头、对接接头、同轴搭接接头等,这些接头在研制的过程中,需要对其性能进行测试和评估,例如,无背场下的接头电阻等,特别是对于烧结接头,其4.2 K下无背场电阻要求低至0.1 nΩ。因此,发展一种超导接头无背场测试装置及其测试方法就显得尤为重要,但是,现有技术中并未有在无背场环境下进行超导接头测试的装置以及相应的测试方法。In the winding process of superconducting magnet coils, since the length of the superconducting wire cannot be infinitely long, or it can be customized segment by segment due to actual engineering requirements, these require the connection to solve the length problem. Therefore, the connection technology of the superconducting wire has become A key technology in practical application. At present, the types of superconducting joints include box joints, sintered joints, butt joints, coaxial lap joints, etc. During the development of these joints, their performance needs to be tested and evaluated, for example, joints under no back field Resistors, etc., especially for sintered joints, which have no back field resistance requirements as low as 0.1 nΩ at 4.2 K. Therefore, it is particularly important to develop a testing device and a testing method for a superconducting joint without a backing field. However, there is no device and a corresponding testing method for testing a superconducting joint in an environment without a backing field in the prior art.
发明内容Contents of the invention
本申请的目的是提供一种超导接头无背场测试装置及其测试方法,该装置和方法能够高效的对超导接头进行测试,快速准确的得到超导接头的电阻,并能够完成各个温度条件下的压降测试。The purpose of this application is to provide a superconducting joint non-back field testing device and its testing method, which can efficiently test superconducting joints, quickly and accurately obtain the resistance of superconducting joints, and can complete the Pressure drop test under conditions.
本申请的目的是通过如下技术方案实现的:The purpose of this application is achieved through the following technical solutions:
一种超导接头无背场测试装置,包括:A test device for a superconducting joint without a back field, comprising:
电源、终端箱、测试组件、第一冷却部、第一回收部、第二冷却部和第二回收部,所述终端箱具有容置空间,所述测试组件设于所述容置空间内;A power supply, a terminal box, a test component, a first cooling unit, a first recovery unit, a second cooling unit, and a second recovery unit, the terminal box has an accommodating space, and the test component is arranged in the accommodating space;
所述测试组件包括第一电流引线、固定工装、连接部和第二电流引线,所述电源的正极与所述第一电流引线的第一端电连接,所述第一电流引线的第二端与所述固定工装共同限定形成用于供超导接头安装的第一安装位,所述固定工装与所述第二电流引线的第一端共同限定形成用于供超导接头安装的第二安装位,所述第一安装位和所述第二安装位之间通过所述连接部连接,且所述连接部设于所述第一安装位背离所述第一电流引线的一侧,所述第二电流引线的第二端与所述电源的负极电连接;The test assembly includes a first current lead, a fixing tool, a connection part and a second current lead, the positive pole of the power supply is electrically connected to the first end of the first current lead, and the second end of the first current lead A first installation position for installing a superconducting joint is defined together with the fixing tool, and a second installation position for installing a superconducting joint is formed by the fixing tool and the first end of the second current lead. position, the first installation position and the second installation position are connected through the connection part, and the connection part is provided on the side of the first installation position away from the first current lead, the The second end of the second current lead is electrically connected to the negative pole of the power supply;
所述第一冷却部与所述第一电流引线的第一端连通,所述第一回收部与所述第一电流引线的第二端连通,所述第一冷却部与所述第二电流引线的第二端连通,所述第一回收部与所述第二电流引线的第一端连通;The first cooling part communicates with the first end of the first current lead, the first recovery part communicates with the second end of the first current lead, and the first cooling part communicates with the second current lead. The second end of the lead is connected, and the first recovery part is connected with the first end of the second current lead;
所述第二冷却部与所述第一电流引线的第二端连通,所述第二回收部与所述第二电流引线的第一端连通;The second cooling part communicates with the second end of the first current lead, and the second recovery part communicates with the first end of the second current lead;
所述第一冷却部通过液氮进行冷却,所述第二冷却部通过液氦进行冷却;The first cooling part is cooled by liquid nitrogen, and the second cooling part is cooled by liquid helium;
所述第一电流引线的第一端为馈电端和一个氦管,所述第一电流引线的中间有两个氦管,其中一个氦管与所述第一电流引线的第二端连通,另一个氦管与所述第一电流引线第一端的氦管连通;所述第二电流引线的第二端为馈电端和一个氦管,所述第二电流引线的中间有两个氦管,其中一个氦管与所述第二电流引线的第一端连通,另一个氦管与所述第二电流引线的第二端的氦管连通,两个馈电端分别连接所述电源的正负极。The first end of the first current lead is a feed end and a helium tube, there are two helium tubes in the middle of the first current lead, and one of the helium tubes communicates with the second end of the first current lead, Another helium tube communicates with the helium tube at the first end of the first current lead; the second end of the second current lead is a feeder end and a helium tube, and there are two helium tubes in the middle of the second current lead One of the helium tubes communicates with the first end of the second current lead, the other helium tube communicates with the helium tube at the second end of the second current lead, and the two feed ends are respectively connected to the positive side of the power supply. negative electrode.
本申请的一些实施例中,还包括抽气系统,所述抽气系统与所述容置空间连通。In some embodiments of the present application, an air extraction system is also included, and the air extraction system communicates with the accommodating space.
本申请的一些实施例中,还包括检漏系统,所述检漏系统与所述容置空间连通。In some embodiments of the present application, a leak detection system is also included, and the leak detection system communicates with the accommodating space.
本申请的一些实施例中,还包括冷屏,所述冷屏贴合于所述终端箱的内侧设置,所述冷屏的进口端与所述第一冷却部连通,所述冷屏的出口端与所述第一回收部连通。In some embodiments of the present application, a cold shield is also included, the cold shield is attached to the inner side of the terminal box, the inlet end of the cold shield communicates with the first cooling part, and the outlet of the cold shield The end communicates with the first recovery part.
本申请的一些实施例中,还包括第一连接管和第二连接管,所述第一连接管连通所述第一电流引线的第一端和所述第二电流引线的第二端,且所述第一连接管与所述第一冷却部连通,所述第二连接管连通所述第一电流引线的第二端和所述第二电流引线的第一端,且所述第二连接管与所述第一回收部连通。In some embodiments of the present application, it further includes a first connecting pipe and a second connecting pipe, the first connecting pipe communicates with the first end of the first current lead and the second end of the second current lead, and The first connection pipe communicates with the first cooling part, the second connection pipe communicates with the second end of the first current lead and the first end of the second current lead, and the second connection The pipe communicates with the first recovery part.
一种超导接头无背场测试方法,应用如上述所述的超导接头无背场测试装置,包括以下步骤:A method for testing a superconducting joint without a backing field, using the above-mentioned superconducting joint without a backing field testing device, comprising the following steps:
将第一超导接头安装在所述第一安装位上,将第二超导接头安装在所述第二安装位上,使所述第一超导接头分别与所述第一电流引线和所述连接部连通,使所述第二超导接头分别与所述连接部和所述第二电流引线连通;Installing the first superconducting joint on the first installation position, installing the second superconducting joint on the second installation position, so that the first superconducting joint is respectively connected to the first current lead and the communicating with the connecting portion, so that the second superconducting joint communicates with the connecting portion and the second current lead respectively;
在所述第一超导接头的两端和所述第二超导接头的两端分别安装压力变送器;installing pressure transmitters at both ends of the first superconducting joint and at both ends of the second superconducting joint;
在所述第一超导接头的两端和中间位置、以及所述第二超导接头的两端和中间位置分别安装温度计;installing thermometers at both ends and the middle position of the first superconducting joint, and at both ends and the middle position of the second superconducting joint;
在所述第一电流引线和所述第一超导接头的连接位置安装第一电位线,在所述第一超导接头的两端安装第二电位线,在所述第二超导接头的两端安装第三电位线,在所述第二超导接头和所述第二电流引线的连接位置安装第四电位线;Install a first potential line at the connection position between the first current lead and the first superconducting joint, install a second potential line at both ends of the first superconducting joint, and install A third potential line is installed at both ends, and a fourth potential line is installed at the connection position between the second superconducting joint and the second current lead;
开启所述第一冷却部和所述第一回收部,之后开启所述第二冷却部和所述第二回收部,开启所述电源并逐渐增加输送电流,记录所述压力变送器、所述温度计和所述电位线的数据,利用线性拟合电流-电压曲线计算超导接头的电阻;Turn on the first cooling unit and the first recovery unit, then turn on the second cooling unit and the second recovery unit, turn on the power supply and gradually increase the delivery current, record the pressure transmitter, the According to the data of the thermometer and the potential line, the resistance of the superconducting joint is calculated by using the linear fitting current-voltage curve;
使超导接头稳定在超导状态,然后控制所述第二冷却部的冷却流量逐渐降低,记录所述压力变送器的数据,以及记录所述第一超导接头靠近所述连接部一侧的温度计数据,记录所述第二超导接头靠近所述连接部一侧的温度计数据;Stabilize the superconducting joint in the superconducting state, then control the cooling flow rate of the second cooling part to gradually decrease, record the data of the pressure transmitter, and record the side of the first superconducting joint close to the connecting part record the thermometer data on the side of the second superconducting joint close to the connecting portion;
使超导接头稳定在室温状态,然后控制所述第二冷却部的冷却流量逐渐降低,记录所述压力变送器的数据,以及记录所述第一超导接头靠近所述连接部一侧的温度计数据,记录所述第二超导接头靠近所述连接部一侧的温度计数据。Stabilize the superconducting joint at room temperature, then control the cooling flow rate of the second cooling part to gradually decrease, record the data of the pressure transmitter, and record the temperature of the first superconducting joint near the connecting part. Thermometer data, recording the thermometer data on the side of the second superconducting joint close to the connection part.
本申请的一些实施例中,所述第一超导接头、所述第一电流引线、所述第二超导接头和所述第二电流引线均具有单接头盒,所述第一超导接头的单接头盒和所述第一电流引线的单接头盒通过铟压接工艺连接形成第一双接头盒,所述第二超导接头的单接头盒和所述第二电流引线的单接头盒通过铟压接工艺连接形成第二双接头盒,所述第一电位线连接于所述第一双接头盒的两端,所述第四电位线连接于所述第二双接头盒的两端。In some embodiments of the present application, the first superconducting joint, the first current lead, the second superconducting joint and the second current lead all have a single joint box, and the first superconducting joint The single junction box of the first current lead and the single junction box of the first current lead are connected by an indium crimping process to form a first double junction box, the single junction box of the second superconducting junction and the single junction box of the second current lead The second double junction box is formed by indium crimping process, the first potential line is connected to both ends of the first double junction box, and the fourth potential line is connected to both ends of the second double junction box .
本申请的一些实施例中,还包括绝缘子,所述压力变送器与所述第一超导接头之间设有所述绝缘子,所述压力变送器与所述第二超导接头之间设有所述绝缘子。In some embodiments of the present application, an insulator is also included, the insulator is provided between the pressure transmitter and the first superconducting joint, and the insulator is provided between the pressure transmitter and the second superconducting joint. The insulator is provided.
本申请的超导接头无背场测试装置及其测试方法,将超导接头安装在固定工装上,可以同时测试一个或多个超导接头的电阻、压降等参数,并且能够测试不同类型的超导接头,能够测试几十KA级别电流下的电阻,能够测试低至0.1nΩ的电阻,能够进行4.2K下的压降测试和常温下的压降测试,测试效率高,测试数据误差小,精度高。The superconducting joint non-back field testing device and testing method thereof of the present application install the superconducting joint on a fixed tooling, can simultaneously test parameters such as resistance and voltage drop of one or more superconducting joints, and can test different types of superconducting joints Superconducting joints can test the resistance of dozens of KA-level currents, and can test the resistance as low as 0.1nΩ. It can perform the voltage drop test at 4.2K and the voltage drop test at room temperature. It has high test efficiency and small test data error. High precision.
附图说明Description of drawings
图1是本申请的超导接头无背场测试装置的结构示意图;Fig. 1 is the structure diagram of the superconducting joint without back field testing device of the present application;
图2是本申请的压力变送器和温度计的安装位置示意图;Fig. 2 is the schematic diagram of the installation position of pressure transmitter and thermometer of the present application;
图3是本申请的电位线的安装位置示意图。Fig. 3 is a schematic diagram of the installation position of the potential line of the present application.
图中,1、电源;2、终端箱;3、测试组件;31、第一电流引线;32、固定工装;33、连接部;34、第二电流引线;35、第一超导接头;36、第二超导接头;4、第一冷却部;5、第一回收部;6、第二冷却部;7、第二回收部;8、容置空间;9、第一安装位;10、第二安装位;11、抽气系统;12、检漏系统;13、冷屏;14、第一连接管;15、第二连接管;16、压力变送器;17、温度计;18、第一电位线;19、第二电位线;20、第三电位线;21、第四电位线;22、绝缘子。In the figure, 1. power supply; 2. terminal box; 3. test component; 31. first current lead; 32. fixed tooling; 33. connecting part; 34. second current lead; 35. first superconducting joint; 36 . The second superconducting joint; 4. The first cooling part; 5. The first recovery part; 6. The second cooling part; 7. The second recovery part; The second installation position; 11. Air extraction system; 12. Leak detection system; 13. Cold screen; 14. First connecting pipe; 15. Second connecting pipe; 16. Pressure transmitter; 17. Thermometer; 18. The second A potential line; 19, a second potential line; 20, a third potential line; 21, a fourth potential line; 22, an insulator.
具体实施方式Detailed ways
下面结合附图和实施例,对本发明的具体实施方式作进一步详细描述。以下实施例用于说明本发明,但不用来限制本发明的范围。The specific implementation manners of the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.
在本申请的描述中,应当理解的是,本申请中采用的术语“上”、“下”、“顶”、“底”、“内”、“外”等指示方位或位置关系基于附图所示的方位或位置关系,仅是为了便于描述本发明和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本发明的限制。此外,术语“第一”、“第二”等仅用于描述目的,而不能理解为指示或暗示相对重要性。In the description of the present application, it should be understood that the terms "upper", "lower", "top", "bottom", "inner", "outer", etc. used in the present application indicate orientation or positional relationship based on the drawings The orientations or positional relationships shown are only for the convenience of describing the present invention and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be construed as an important aspect of the present invention. limits. In addition, the terms "first", "second", etc. are used for descriptive purposes only, and should not be construed as indicating or implying relative importance.
在本发明中,除非另有明确的规定和限定,术语“安装”、“相连”、“连接”、“固定”等术语应做广义理解,例如,可以是固定连接,也可以是可拆卸连接,或成一体;可以是机械连接,也可以是电连接;可以是直接相连,也可以通过中间媒介间接相连,可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言,可以根据具体情况理解上述术语在本发明中的具体含义。In the present invention, unless otherwise clearly specified and limited, terms such as "installation", "connection", "connection" and "fixation" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection , or integrated; it can be mechanically connected or electrically connected; it can be directly connected or indirectly connected through an intermediary, and it can be the internal communication of two components or the interaction relationship between two components. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present invention according to specific situations.
如图1所示,本申请的实施例提出一种超导接头无背场测试装置,包括:As shown in Figure 1, the embodiment of the present application proposes a superconducting joint without back field testing device, including:
电源1、终端箱2、测试组件3、第一冷却部4、第一回收部5、第二冷却部6和第二回收部7,所述终端箱2具有容置空间8,所述测试组件3设于所述容置空间8内;
所述测试组件3包括第一电流引线31、固定工装32、连接部33和第二电流引线34,所述电源1的正极与所述第一电流引线31的第一端电连接,所述第一电流引线31的第二端与所述固定工装32共同限定形成用于供超导接头安装的第一安装位9,所述固定工装32与所述第二电流引线34的第一端共同限定形成用于供超导接头安装的第二安装位10,所述第一安装位9和所述第二安装位10之间通过所述连接部33连接,且所述连接部33设于所述第一安装位9背离所述第一电流引线31的一侧,所述第二电流引线34的第二端与所述电源1的负极电连接;The
所述第一冷却部4与所述第一电流引线31的第一端连通,所述第一回收部5与所述第一电流引线31的第二端连通,所述第一冷却部4与所述第二电流引线34的第二端连通,所述第一回收部5与所述第二电流引线34的第一端连通;The first cooling part 4 communicates with the first end of the first
所述第二冷却部6与所述第一电流引线31的第二端连通,所述第二回收部7与所述第二电流引线34的第一端连通;The second cooling part 6 communicates with the second end of the first
所述第一冷却部4通过液氮进行冷却,所述第二冷却部6通过液氦进行冷却;The first cooling part 4 is cooled by liquid nitrogen, and the second cooling part 6 is cooled by liquid helium;
所述第一电流引线31的第一端为馈电端和一个氦管,所述第一电流引线31的中间有两个氦管,其中一个氦管与所述第一电流引线31的第二端连通,另一个氦管与所述第一电流引线31第一端的氦管连通;所述第二电流引线34的第二端为馈电端和一个氦管,所述第二电流引线34的中间有两个氦管,其中一个氦管与所述第二电流引线34的第一端连通,另一个氦管与所述第二电流引线34的第二端的氦管连通,两个馈电端分别连接所述电源1的正负极。The first end of the first
基于上述技术方案,本申请的超导接头无背场测试装置,电源1为整个测试装置提供测试电流,电源1电流从正极依次经过第一电流引线31、第一安装位9的超导接头、连接部33、第二安装位10的超导接头和第二电流引线34回到负极,其中,超导接头优选为CICC超导导体制成,连接部33优选的采用U型弯结构,第一电流引线31的第一端为馈电端和一个氦管,第一电流引线31的中间有两个氦管,其中一个氦管与第一电流引线31的第二端连通,另一个氦管与第一电流引线31第一端的氦管连通;第二电流引线34的第二端为馈电端和一个氦管,第二电流引线34的中间有两个氦管,其中一个氦管与第二电流引线34的第一端连通,另一个氦管与第二电流引线34的第二端的氦管连通,两个馈电端分别连接电源1的正负极,氦管能够起到导入冷媒的作用,例如液氦、液氮等。Based on the above-mentioned technical scheme, in the superconducting joint non-back field testing device of the present application, the
第一冷却部4优选为80K液氮供应系统,第一回收部5优选为80K液氮回收系统,第二冷却部6优选为4.2K液氮供应系统,第二回收部7优选为300K氦气回收系统,第一冷却部4供应温度为80K的液氮,80K液氮通过第一电流引线31第一端的氦管进入第一电流引线31内,并通过第一电流引线31中间的一个氦管流出到第一回收部5,从而构成第一电流引线31的冷却通道;80K液氮通过第二电流引线34的第二端的氦管进入第二电流引线34内,并通过第二电流引线34中间的一个氦管流出到第一回收部5,从而构成第二电流引线34的冷却通道,以上的结构配合完成了两个电流引线的冷却。第二冷却部6供应温度为4.2K的液氦,4.2K液氦通过第一电流引线31中间的另一个氦管进入第一电流引线31,并通过第一电流引线31、第一超导接头35、连接部33、第二超导接头36和第二电流引线34,最终通过第二电流引线34中间的另一个氦管流出到第二回收部7,从而构成测试组件3的冷却通道。此处电流引线和测试组件3采用不同的冷却方式的原因是,电流引线只需通过80K温度的液氮进行冷却降温即可,而测试组件3则需要达到超导状态才能够符合测试的要求,而测试组件3要达到超导状态需要比80K更低的温度,这时采用液氮无法满足超低的温度条件,因此需要采用制冷效果更好的液氦,从而达到满足超导条件的4.2K温度,又因为液氦的成本要远大于液氮,因此只需要在合适的位置使用液氦即可,无需整个装置均采用液氦进行冷却,因此采用这种液氮液氦配合使用的方式进行测试。The first cooling unit 4 is preferably an 80K liquid nitrogen supply system, the first recovery unit 5 is preferably an 80K liquid nitrogen recovery system, the second cooling unit 6 is preferably a 4.2K liquid nitrogen supply system, and the second recovery unit 7 is preferably a 300K helium gas Recovery system, the first cooling part 4 supplies liquid nitrogen with a temperature of 80K, 80K liquid nitrogen enters the first
本申请的一些实施例中,如图1所示,还包括抽气系统11,所述抽气系统11与所述容置空间8连通。抽气系统11能够将终端箱2内的容置空间8抽真空,从而满足超导接头的超导要求。In some embodiments of the present application, as shown in FIG. 1 , an
具体的,如图1所示,还包括检漏系统12,所述检漏系统12与所述容置空间8连通。检漏系统12能够检测终端箱2的容置空间8是否存在微小的缝隙,防止冷气泄露造成试验数据不准。Specifically, as shown in FIG. 1 , a
本申请的一些实施例中,如图1所示,还包括冷屏13,所述冷屏13贴合于所述终端箱2的内侧设置,所述冷屏13的进口端与所述第一冷却部4连通,所述冷屏13的出口端与所述第一回收部5连通。冷屏13是设置在终端箱2内部的屏蔽结构,其能够引入第一冷却部4中的冷却物质,如液氮等,从而为终端箱2创造出低温的环境,维持测试组件3的低温。In some embodiments of the present application, as shown in FIG. 1 , a
本申请的一些实施例中,如图1所示,所述第一冷却部4通过液氮进行冷却。液氮冷却效果好,成本低,能够简单有效的达到创造低温环境的要求。In some embodiments of the present application, as shown in FIG. 1 , the first cooling part 4 is cooled by liquid nitrogen. The cooling effect of liquid nitrogen is good, the cost is low, and it can simply and effectively meet the requirements of creating a low temperature environment.
具体的,如图1所示,所述第二冷却部6通过液氦进行冷却。液氦的成本较高,但其能够制造低至4.2K的低温,能够完美的模拟超导接头的低温超导环境,满足试验的要求。Specifically, as shown in FIG. 1 , the second cooling part 6 is cooled by liquid helium. The cost of liquid helium is relatively high, but it can produce a low temperature as low as 4.2K, which can perfectly simulate the low-temperature superconducting environment of the superconducting joint and meet the requirements of the test.
本申请的一些实施例中,如图1所示,还包括第一连接管14和第二连接管15,所述第一连接管14连通所述第一电流引线31的第一端和所述第二电流引线34的第二端,且所述第一连接管14与所述第一冷却部4连通,所述第二连接管15连通所述第一电流引线31的第二端和所述第二电流引线34的第一端,且所述第二连接管15与所述第一回收部5连通。利用第一连接管14和第二连接管15进行引流,从而将第一电流引线31和第二电流引线34与第一冷却部4和第一回收部5连通,无需分别单独进行连接。第一连接管14和第二连接管15优选为不锈钢材质,不仅能够适应环境温度,而且容易获取,成本低廉。In some embodiments of the present application, as shown in FIG. 1 , a first connecting
如图1-3所示,本申请的实施例提出一种超导接头无背场测试方法,应用如上述所述的超导接头无背场测试装置,包括以下步骤:As shown in Figures 1-3, the embodiment of the present application proposes a method for testing a superconducting joint without a backing field, using the above-mentioned testing device for a superconducting joint without a backing field, including the following steps:
将第一超导接头35安装在所述第一安装位9上,将第二超导接头36安装在所述第二安装位10上,使所述第一超导接头35分别与所述第一电流引线31和所述连接部33连通,使所述第二超导接头36分别与所述连接部33和所述第二电流引线34连通;The first superconducting joint 35 is installed on the
在所述第一超导接头35的两端和所述第二超导接头36的两端分别安装压力变送器16;Install
在所述第一超导接头35的两端和中间位置、以及所述第二超导接头36的两端和中间位置分别安装温度计17;Install
在所述第一电流引线31和所述第一超导接头35的连接位置安装第一电位线18,在所述第一超导接头35的两端安装第二电位线19,在所述第二超导接头36的两端安装第三电位线20,在所述第二超导接头36和所述第二电流引线34的连接位置安装第四电位线21;Install the first
开启第一冷却部4和第一回收部5,之后开启第二冷却部6和第二回收部7,开启电源1并逐渐增加输送电流,记录所述压力变送器16、所述温度计17和所述电位线的数据,利用线性拟合电流-电压曲线计算超导接头的电阻;Open the first cooling unit 4 and the first recovery unit 5, then open the second cooling unit 6 and the second recovery unit 7, turn on the
使超导接头稳定在超导状态,然后控制所述第二冷却部6的冷却流量逐渐降低,记录所述压力变送器16的数据,以及记录所述第一超导接头35靠近所述连接部33一侧的温度计17数据,记录所述第二超导接头36靠近所述连接部33一侧的温度计17数据;Stabilize the superconducting joint in the superconducting state, then control the cooling flow rate of the second cooling part 6 to gradually decrease, record the data of the
使超导接头稳定在室温状态,然后控制所述第二冷却部6的冷却流量逐渐降低,记录所述压力变送器16的数据,以及记录所述第一超导接头35靠近所述连接部33一侧的温度计17数据,记录所述第二超导接头36靠近所述连接部33一侧的温度计17数据。Stabilize the superconducting joint at room temperature, then control the cooling flow rate of the second cooling part 6 to gradually decrease, record the data of the
本申请的一些实施例中,如图1-3所示,所述第一超导接头35、所述第一电流引线31、所述第二超导接头36和所述第二电流引线34均具有单接头盒,所述第一超导接头35的单接头盒和所述第一电流引线31的单接头盒通过铟压接工艺连接形成第一双接头盒,所述第二超导接头36的单接头盒和所述第二电流引线34的单接头盒通过铟压接工艺连接形成第二双接头盒,所述第一电位线18连接于所述第一双接头盒的两端,所述第四电位线21连接于所述第二双接头盒的两端。在一些实施例中,测试样件是一体成型的,包括第一超导接头35、第二超导接头36以及连接部33,第一超导接头35上的单接头盒与第一超导接头35一体成型,第二超导接头36上的单接头盒与第二超导接头36一体成型。这样,当需要更换测试样件时,仅需将测试样件从固定工装32上拆卸下来,并将两个超导接头上的两个单接头盒从两个电流引线上拆开,然后更换新的测试样件,将新的测试样件上的两个单接头盒再铟压接在两个电流引线上即可。In some embodiments of the present application, as shown in Figures 1-3, the first superconducting joint 35, the first
本申请的一些实施例中,如图2所示,还包括绝缘子22,所述压力变送器16与所述第一超导接头35之间设有所述绝缘子22,所述压力变送器16与所述第二超导接头36之间设有所述绝缘子22。绝缘子22能够防止测试装置的大电流影响压力变送器16的压力测试准确性,绝缘子22优选为轴向绝缘子22,能够有效屏蔽电线的轴向电流。In some embodiments of the present application, as shown in FIG. 2 , an
在此说明整个测试方法的详细过程:The detailed process of the whole test method is explained here:
打开终端箱2侧边舱门,安装电流引线于终端箱2上,安装测试组件3于终端箱2内部,使用铟压接工艺分别连接测试组件3的一对单接头盒和一对电流引线的单接头盒,形成一对馈电双接头盒。通过不锈钢管连接馈电双接头盒的两个单接头盒。Open the side hatch of the
在测试组件3的第一超导接头35两端分别安装压力变送器16,在测试组件3的第二超导接头36两端分别安装压力变送器16。
在测试组件3的第一超导接头35两端安装温度计17,在第一超导接头35的中间位置安装温度计17。A
在测试组件3的第二超导接头36两端安装温度计17,在第二超导接头36的中间位置安装温度计17。A
在第一超导接头35的与第一电流引线31之间的馈电双接头盒的两端安装一对第一电位线18。在第一超导接头35两端安装两对第二电位线19,其中一对第二电位线19为备用线。A pair of first
在第二超导接头36两端安装两对第三电位线20,其中一对第三电位线20为备用线。在第二超导接头36的与第二电流引线34之间的馈电双接头盒的两端安装一对第四电位线21。Two pairs of third
密封终端箱2,打开终端箱2的抽气系统11和检漏系统12,对所述终端箱2进行抽真空和检漏。打开温度采集系统、压力采集系统及电位采集系统,并对这些系统进行调试。完成调试后,当终端箱2的真空度达到1Pa以下时,打开80 K液氮供应系统和80 K液氮回收系统,当终端箱2和电流引线温度降至约80 K时,打开4.2 K液氦供应系统和300 K氦气回收系统。Seal the
分别连接两个电流引线馈电端至所述电源1正负极。Connect the two current lead feed ends to the positive and negative poles of the
当测试组件3的温度稳定在4.2-6 K时,打开电源1,给系统注入电流,缓慢增加电流至0 kA,10 kA,20 kA,30 kA,40 kA,50 kA及以上,每个电流稳定至少2 min。记录全部的温度计17,电位线,压力变送器16的数据。使用线性拟合I-V曲线计算接头的电阻。When the temperature of the
完成以上电阻测试之后,当超导接头的温度稳定在4.6-6 K时:After completing the above resistance test, when the temperature of the superconducting joint is stable at 4.6-6 K:
控制氦气的流量为5±0.2g/s,并保持稳定2 min,记录此时的压力变送器16数据,以及第二超导接头36靠近所述连接部33一侧的温度计17数据;Control the flow rate of helium to 5±0.2g/s, and keep it stable for 2 minutes, record the data of the
控制氦气的流量为4.5±0.2g/s,并保持稳定2 min,记录此时的压力变送器16数据,以及第二超导接头36靠近所述连接部33一侧的温度计17数据;Control the flow of helium to 4.5±0.2g/s, and keep it stable for 2 minutes, record the data of the
控制氦气的流量为4±0.2g/s,并保持稳定2 min,记录此时的压力变送器16数据,以及第二超导接头36靠近所述连接部33一侧的温度计17数据;Control the flow of helium to 4±0.2g/s, and keep it stable for 2 minutes, record the data of the
控制氦气的流量为3.5±0.2g/s,并保持稳定2 min,记录此时的压力变送器16数据,以及第二超导接头36靠近所述连接部33一侧的温度计17数据;Control the flow of helium to 3.5±0.2g/s, and keep it stable for 2 minutes, record the data of the
控制氦气的流量为3±0.2g/s,并保持稳定2 min,记录此时的压力变送器16数据,以及第二超导接头36靠近所述连接部33一侧的温度计17数据。Control the flow rate of helium to 3±0.2g/s, and keep it stable for 2 minutes, record the data of the
完成测试组件3的4.2 K压降测试后,开始对测试组件3进行升温,在整个升温过程中,保持测试组件3超导接头入口管路和出口管路的温度梯度<50 K。After the 4.2 K pressure drop test of
升温整个系统至室温,当超导接头的温度稳定在室温时:Warm up the entire system to room temperature, and when the temperature of the superconducting junction stabilizes at room temperature:
控制氦气的流量为5±0.2g/s,并保持稳定2 min,记录此时的压力变送器16数据,以及第二超导接头36靠近所述连接部33一侧的温度计17数据。Control the flow rate of helium to 5±0.2g/s, and keep it stable for 2 minutes, record the data of the
控制氦气的流量为4.5±0.2g/s,并保持稳定2 min,记录此时的压力变送器16数据,以及第二超导接头36靠近所述连接部33一侧的温度计17数据。Control the flow rate of helium to 4.5±0.2g/s, and keep it stable for 2 minutes, record the data of the
控制氦气的流量为4±0.2g/s,并保持稳定2 min,记录此时的压力变送器16数据,以及第二超导接头36靠近所述连接部33一侧的温度计17数据。Control the flow rate of helium to 4±0.2g/s, and keep it stable for 2 minutes, record the data of the
控制氦气的流量为3.5±0.2g/s,并保持稳定2 min,记录此时的压力变送器16数据,以及第二超导接头36靠近所述连接部33一侧的温度计17数据。Control the flow rate of helium to 3.5±0.2g/s, and keep it stable for 2 minutes, record the data of the
控制氦气的流量为3±0.2g/s,并保持稳定2 min,记录此时的压力变送器16数据,以及第二超导接头36靠近所述连接部33一侧的温度计17数据。Control the flow rate of helium to 3±0.2g/s, and keep it stable for 2 minutes, record the data of the
完成以上室温下的压降测试后,打开终端箱2舱门,从电流引线上卸下测试组件3。After completing the above voltage drop test at room temperature, open the
综上,本申请的超导接头无背场测试装置及其测试方法,将超导接头安装在固定工装32上,可以同时测试一个或多个超导接头的电阻、压降等参数,并且能够测试不同类型的超导接头,能够测试几十KA级别电流下的电阻,能够测试低至0.1nΩ的电阻,能够进行4.2K下的压降测试和常温下的压降测试,测试效率高,测试数据误差小,精度高。In summary, the superconducting joint non-back field testing device and its testing method of the present application install the superconducting joint on the fixed
以上仅是本申请的优选实施方式,应当指出,对于本技术领域的普通技术人员来说,在不脱离本申请技术原理的前提下,还可以做出若干改进和替换,这些改进和替换也应视为本申请的保护范围。The above are only the preferred embodiments of the present application. It should be pointed out that for those of ordinary skill in the art, some improvements and substitutions can be made without departing from the technical principles of the present application. These improvements and substitutions should also be It is regarded as the scope of protection of this application.
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