CN116027112B - Superconducting joint back field-free testing device and testing method thereof - Google Patents
Superconducting joint back field-free testing device and testing method thereof Download PDFInfo
- Publication number
- CN116027112B CN116027112B CN202310325435.2A CN202310325435A CN116027112B CN 116027112 B CN116027112 B CN 116027112B CN 202310325435 A CN202310325435 A CN 202310325435A CN 116027112 B CN116027112 B CN 116027112B
- Authority
- CN
- China
- Prior art keywords
- current lead
- superconducting joint
- superconducting
- communicated
- joint
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E40/00—Technologies for an efficient electrical power generation, transmission or distribution
- Y02E40/60—Superconducting electric elements or equipment; Power systems integrating superconducting elements or equipment
Landscapes
- Containers, Films, And Cooling For Superconductive Devices (AREA)
Abstract
The invention relates to the field of superconducting magnet tests and discloses a device and a method for testing a superconducting joint without a back field. The beneficial effects of the invention are as follows: the superconducting joint is arranged on a fixed tool, parameters such as resistance, voltage drop and the like of one or more superconducting joints can be tested simultaneously, different types of superconducting joints can be tested, the resistance under the current of dozens of KA levels can be tested, the resistance as low as 0.1nΩ can be tested, the voltage drop test under 4.2K and the voltage drop test under normal temperature can be performed, the test efficiency is high, the test data error is small, and the precision is high.
Description
Technical Field
The invention relates to the field of superconducting magnet tests, in particular to a device and a method for testing a superconducting joint without a back field.
Background
In the winding process of the superconducting magnet coil, the length of the superconducting wire cannot be infinitely long or is customized segment by segment according to actual engineering requirements, and the length problem is required to be solved by connecting the superconducting wire, so that the connecting technology of the superconducting wire is a key technology in practical application. Currently, the types of superconducting joints are box joints, sintered joints, butt joints, coaxial lap joints and the like, and the performance of the joints needs to be tested and evaluated in the development process, for example, the joint resistance under no back field and the like, and particularly for sintered joints, the back field resistance under 4.2K is as low as 0.1n omega. Therefore, it is important to develop a device and a method for testing a superconducting joint without back field, but the prior art does not have a device and a corresponding method for testing a superconducting joint in a back field environment.
Disclosure of Invention
The device and the method can test the superconducting joint efficiently, quickly and accurately obtain the resistance of the superconducting joint, and can complete the voltage drop test under various temperature conditions.
The purpose of the application is realized through the following technical scheme:
a superconducting joint backless field testing apparatus comprising:
the device comprises a power supply, a terminal box, a testing component, a first cooling part, a first recycling part, a second cooling part and a second recycling part, wherein the terminal box is provided with a containing space, and the testing component is arranged in the containing space;
the testing assembly comprises a first current lead, a fixing tool, a connecting part and a second current lead, wherein the positive electrode of the power supply is electrically connected with the first end of the first current lead, the second end of the first current lead and the fixing tool jointly define a first installation position for installing a superconducting joint, the fixing tool and the first end of the second current lead jointly define a second installation position for installing the superconducting joint, the first installation position and the second installation position are connected through the connecting part, the connecting part is arranged on one side, away from the first current lead, of the first installation position, and the second end of the second current lead is electrically connected with the negative electrode of the power supply;
the first cooling part is communicated with the first end of the first current lead, the first recovery part is communicated with the second end of the first current lead, the first cooling part is communicated with the second end of the second current lead, and the first recovery part is communicated with the first end of the second current lead;
the second cooling part is communicated with the second end of the first current lead, and the second recovery part is communicated with the first end of the second current lead;
the first cooling part is cooled by liquid nitrogen, and the second cooling part is cooled by liquid helium;
the first end of the first current lead is a feed end and one helium tube, two helium tubes are arranged in the middle of the first current lead, one helium tube is communicated with the second end of the first current lead, and the other helium tube is communicated with the helium tube at the first end of the first current lead; the second end of the second current lead is a feed end and one helium tube, two helium tubes are arranged in the middle of the second current lead, one helium tube is communicated with the first end of the second current lead, the other helium tube is communicated with the helium tube at the second end of the second current lead, and the two feed ends are respectively connected with the positive electrode and the negative electrode of the power supply.
In some embodiments of the present application, an air extraction system is further included, the air extraction system being in communication with the receiving space.
In some embodiments of the present application, a leak detection system is further included, the leak detection system in communication with the receiving space.
In some embodiments of the present application, the terminal box further comprises a cold screen, the cold screen is attached to the inner side of the terminal box, an inlet end of the cold screen is communicated with the first cooling portion, and an outlet end of the cold screen is communicated with the first recovery portion.
In some embodiments of the present application, the first current lead is connected to the first end of the second current lead by a first connecting pipe, and the second current lead is connected to the second end of the second current lead by a second connecting pipe.
The superconducting joint back field-free testing method, which is applied to the superconducting joint back field-free testing device, comprises the following steps:
mounting a first superconducting joint on the first mounting position, mounting a second superconducting joint on the second mounting position, enabling the first superconducting joint to be communicated with the first current lead and the connecting part respectively, and enabling the second superconducting joint to be communicated with the connecting part and the second current lead respectively;
pressure transmitters are respectively arranged at two ends of the first superconducting joint and two ends of the second superconducting joint;
installing thermometers at two ends and the middle position of the first superconducting joint and two ends and the middle position of the second superconducting joint respectively;
a first potential line is arranged at the connection position of the first current lead and the first superconducting joint, a second potential line is arranged at the two ends of the first superconducting joint, a third potential line is arranged at the two ends of the second superconducting joint, and a fourth potential line is arranged at the connection position of the second superconducting joint and the second current lead;
starting the first cooling part and the first recovery part, starting the second cooling part and the second recovery part, starting the power supply and gradually increasing the transmission current, recording the data of the pressure transmitter, the thermometer and the potential line, and calculating the resistance of the superconducting joint by utilizing a linear fitting current-voltage curve;
stabilizing the superconducting joint in a superconducting state, then controlling the cooling flow of the second cooling part to gradually decrease, recording data of the pressure transmitter, recording thermometer data of one side of the first superconducting joint close to the connecting part, and recording thermometer data of one side of the second superconducting joint close to the connecting part;
and (3) stabilizing the superconducting joint at a room temperature state, then controlling the cooling flow of the second cooling part to gradually decrease, recording data of the pressure transmitter, recording thermometer data of one side of the first superconducting joint close to the connecting part, and recording thermometer data of one side of the second superconducting joint close to the connecting part.
In some embodiments of the present application, the first superconducting joint, the first current lead, the second superconducting joint and the second current lead each have a single joint box, the single joint box of the first superconducting joint and the single joint box of the first current lead are connected through an indium crimping process to form a first double joint box, the single joint box of the second superconducting joint and the single joint box of the second current lead are connected through an indium crimping process to form a second double joint box, the first potential wire is connected to two ends of the first double joint box, and the fourth potential wire is connected to two ends of the second double joint box.
In some embodiments of the present application, the pressure transmitter is provided with an insulator between the first superconducting joint and the second superconducting joint, and the pressure transmitter is provided with the insulator between the second superconducting joint and the first superconducting joint.
According to the superconducting joint back-field-free testing device and the testing method thereof, the superconducting joint is mounted on the fixed tool, parameters such as resistance, voltage drop and the like of one or more superconducting joints can be tested simultaneously, different types of superconducting joints can be tested, the resistance at the current level of dozens of KAs can be tested, the resistance as low as 0.1nΩ can be tested, the voltage drop test under 4.2K and the voltage drop test under normal temperature can be performed, the testing efficiency is high, the testing data error is small, and the precision is high.
Drawings
FIG. 1 is a schematic diagram of a superconducting joint no back field test device of the present application;
FIG. 2 is a schematic diagram of the mounting locations of the pressure transmitter and thermometer of the present application;
fig. 3 is a schematic view of the installation position of the potential line of the present application.
In the figure, 1, a power supply; 2. a terminal box; 3. a testing component; 31. a first current lead; 32. fixing the tool; 33. a connection part; 34. a second current lead; 35. a first superconducting joint; 36. a second superconducting joint; 4. a first cooling unit; 5. a first recovery unit; 6. a second cooling unit; 7. a second recovery unit; 8. an accommodating space; 9. a first mounting location; 10. a second mounting location; 11. an air extraction system; 12. a leak detection system; 13. a cold screen; 14. a first connection pipe; 15. a second connection pipe; 16. a pressure transmitter; 17. a thermometer; 18. a first potential line; 19. a second potential line; 20. a third potential line; 21. a fourth potential line; 22. an insulator.
Detailed Description
The following describes in further detail the embodiments of the present invention with reference to the drawings and examples. The following examples are illustrative of the invention and are not intended to limit the scope of the invention.
In the description of the present application, it should be understood that the terms "upper," "lower," "top," "bottom," "inner," "outer," and the like as used herein indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate description of the present invention and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the present invention, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be the communication between the inner parts of two elements or the interaction relationship between the two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
As shown in fig. 1, an embodiment of the present application provides a device for testing a superconducting joint without back surface field, including:
the power supply 1, the terminal box 2, the test assembly 3, the first cooling part 4, the first recovery part 5, the second cooling part 6 and the second recovery part 7, wherein the terminal box 2 is provided with a containing space 8, and the test assembly 3 is arranged in the containing space 8;
the test assembly 3 comprises a first current lead 31, a fixing tool 32, a connecting part 33 and a second current lead 34, wherein the positive electrode of the power supply 1 is electrically connected with a first end of the first current lead 31, a first mounting position 9 for mounting a superconducting joint is formed by the second end of the first current lead 31 and the fixing tool 32, a second mounting position 10 for mounting the superconducting joint is formed by the fixing tool 32 and the first end of the second current lead 34, the first mounting position 9 and the second mounting position 10 are connected through the connecting part 33, the connecting part 33 is arranged on one side, away from the first current lead 31, of the first mounting position 9, and the second end of the second current lead 34 is electrically connected with the negative electrode of the power supply 1;
the first cooling part 4 is communicated with the first end of the first current lead 31, the first recovery part 5 is communicated with the second end of the first current lead 31, the first cooling part 4 is communicated with the second end of the second current lead 34, and the first recovery part 5 is communicated with the first end of the second current lead 34;
the second cooling part 6 is communicated with the second end of the first current lead 31, and the second recovery part 7 is communicated with the first end of the second current lead 34;
the first cooling part 4 is cooled by liquid nitrogen, and the second cooling part 6 is cooled by liquid helium;
the first end of the first current lead 31 is a feeding end and one helium tube, two helium tubes are arranged in the middle of the first current lead 31, one helium tube is communicated with the second end of the first current lead 31, and the other helium tube is communicated with the helium tube at the first end of the first current lead 31; the second end of the second current lead 34 is a feeding end and a helium tube, two helium tubes are arranged in the middle of the second current lead 34, one helium tube is communicated with the first end of the second current lead 34, the other helium tube is communicated with the helium tube at the second end of the second current lead 34, and the two feeding ends are respectively connected with the positive electrode and the negative electrode of the power supply 1.
Based on the above technical scheme, in the superconducting joint non-back field testing device, the power supply 1 provides testing current for the whole testing device, the current of the power supply 1 sequentially passes through the first current lead 31, the superconducting joint of the first installation position 9, the connecting part 33, the superconducting joint of the second installation position 10 and the second current lead 34 to return to the cathode, wherein the superconducting joint is preferably made of a CICC superconducting conductor, the connecting part 33 is preferably of a U-shaped bent structure, the first end of the first current lead 31 is a feed end and one helium tube, two helium tubes are arranged in the middle of the first current lead 31, one helium tube is communicated with the second end of the first current lead 31, and the other helium tube is communicated with the helium tube at the first end of the first current lead 31; the second end of the second current lead 34 is a feeding end and a helium tube, two helium tubes are arranged in the middle of the second current lead 34, one helium tube is communicated with the first end of the second current lead 34, the other helium tube is communicated with the helium tube at the second end of the second current lead 34, the two feeding ends are respectively connected with the positive electrode and the negative electrode of the power supply 1, and the helium tubes can play a role of introducing refrigerants, such as liquid helium, liquid nitrogen and the like.
The first cooling part 4 is preferably an 80K liquid nitrogen supply system, the first recovery part 5 is preferably an 80K liquid nitrogen recovery system, the second cooling part 6 is preferably a 4.2K liquid nitrogen supply system, the second recovery part 7 is preferably a 300K helium recovery system, the first cooling part 4 supplies 80K liquid nitrogen, the 80K liquid nitrogen enters the first current lead 31 through a helium tube at the first end of the first current lead 31 and flows out to the first recovery part 5 through one helium tube in the middle of the first current lead 31, so as to form a cooling channel of the first current lead 31; the 80K liquid nitrogen enters the second current lead wire 34 through the helium tube at the second end of the second current lead wire 34 and flows out to the first recovery part 5 through one helium tube in the middle of the second current lead wire 34, so that a cooling channel of the second current lead wire 34 is formed, and the cooling of the two current lead wires is completed through the structural cooperation. The second cooling part 6 supplies liquid helium with a temperature of 4.2K, and the 4.2K liquid helium enters the first current lead 31 through the other helium pipe in the middle of the first current lead 31, passes through the first current lead 31, the first superconducting joint 35, the connecting part 33, the second superconducting joint 36 and the second current lead 34, and finally flows out to the second recovery part 7 through the other helium pipe in the middle of the second current lead 34, thereby constituting a cooling passage of the test assembly 3. The reason that the current lead and the test component 3 adopt different cooling modes is that the current lead only needs to be cooled by liquid nitrogen with the temperature of 80K, the test component 3 needs to reach a superconducting state to meet the requirement of the test, the test component 3 needs to reach the superconducting state to be lower than the temperature of 80K, at the moment, the liquid nitrogen cannot meet the ultralow temperature condition, so that liquid helium with better refrigeration effect needs to be adopted, the temperature of 4.2K meeting the superconducting condition is reached, and the cost of the liquid helium is far greater than that of the liquid nitrogen, so that the liquid helium only needs to be used at a proper position, the whole device does not need to be cooled by adopting the liquid helium, and the test is performed by adopting the liquid nitrogen and liquid helium matched use mode.
In some embodiments of the present application, as shown in fig. 1, the air extraction system 11 is further included, and the air extraction system 11 is in communication with the accommodating space 8. The air extraction system 11 can vacuumize the accommodating space 8 in the terminal box 2, so that the superconducting requirement of the superconducting joint is met.
Specifically, as shown in fig. 1, the leakage detection system 12 is further included, and the leakage detection system 12 is communicated with the accommodating space 8. The leak detection system 12 can detect whether the accommodating space 8 of the terminal box 2 has a tiny gap or not, and prevent inaccurate test data caused by cold air leakage.
In some embodiments of the present application, as shown in fig. 1, the terminal box further includes a cold screen 13, the cold screen 13 is attached to the inner side of the terminal box 2, an inlet end of the cold screen 13 is communicated with the first cooling portion 4, and an outlet end of the cold screen 13 is communicated with the first recovery portion 5. The cold shield 13 is a shielding structure provided inside the terminal enclosure 2, which is capable of introducing a cooling substance such as liquid nitrogen or the like in the first cooling portion 4, thereby creating a low-temperature environment for the terminal enclosure 2, maintaining the low temperature of the test assembly 3.
In some embodiments of the present application, as shown in fig. 1, the first cooling portion 4 is cooled by liquid nitrogen. The liquid nitrogen cooling effect is good, the cost is low, and the requirement of creating a low-temperature environment can be simply and effectively met.
Specifically, as shown in fig. 1, the second cooling unit 6 is cooled by liquid helium. The cost of liquid helium is higher, but the liquid helium can be manufactured at low temperature as low as 4.2K, can perfectly simulate the low-temperature superconducting environment of the superconducting joint, and meets the test requirement.
In some embodiments of the present application, as shown in fig. 1, the first connecting pipe 14 is connected to the first end of the first current lead 31 and the second end of the second current lead 34, and the first connecting pipe 14 is connected to the first cooling portion 4, the second connecting pipe 15 is connected to the second end of the first current lead 31 and the first end of the second current lead 34, and the second connecting pipe 15 is connected to the first recovery portion 5. The first and second current leads 31 and 34 are connected to the first cooling unit 4 and the first recovery unit 5 by the first and second connection pipes 14 and 15, and the connection is not required separately. The first connecting pipe 14 and the second connecting pipe 15 are preferably made of stainless steel, so that the temperature sensor can adapt to the ambient temperature, is easy to obtain, and is low in cost.
As shown in fig. 1-3, an embodiment of the present application provides a method for testing a superconducting joint without a back field, and the method for testing a superconducting joint without a back field, which is applied to the device for testing a superconducting joint without a back field, includes the following steps:
mounting a first superconducting joint 35 on the first mounting position 9, mounting a second superconducting joint 36 on the second mounting position 10, and enabling the first superconducting joint 35 to be communicated with the first current lead 31 and the connecting portion 33 respectively, and enabling the second superconducting joint 36 to be communicated with the connecting portion 33 and the second current lead 34 respectively;
installing pressure transducers 16 at both ends of the first superconducting joint 35 and both ends of the second superconducting joint 36, respectively;
the thermometers 17 are respectively installed at both ends and the intermediate position of the first superconducting joint 35 and both ends and the intermediate position of the second superconducting joint 36;
a first potential line 18 is installed at a connection position of the first current lead 31 and the first superconducting joint 35, a second potential line 19 is installed at both ends of the first superconducting joint 35, a third potential line 20 is installed at both ends of the second superconducting joint 36, and a fourth potential line 21 is installed at a connection position of the second superconducting joint 36 and the second current lead 34;
starting a first cooling part 4 and a first recovery part 5, starting a second cooling part 6 and a second recovery part 7, starting a power supply 1 and gradually increasing a transmission current, recording data of the pressure transmitter 16, the thermometer 17 and the potential line, and calculating the resistance of the superconducting joint by using a linear fitting current-voltage curve;
stabilizing the superconducting joint in a superconducting state, then controlling the cooling flow rate of the second cooling part 6 to gradually decrease, recording data of the pressure transducer 16, recording data of the thermometer 17 on the side of the first superconducting joint 35 close to the connecting part 33, and recording data of the thermometer 17 on the side of the second superconducting joint 36 close to the connecting part 33;
the superconducting joint is stabilized at room temperature, and then the cooling flow rate of the second cooling part 6 is controlled to gradually decrease, data of the pressure transducer 16 is recorded, and data of the thermometer 17 on the side of the first superconducting joint 35 close to the connecting part 33 is recorded, and data of the thermometer 17 on the side of the second superconducting joint 36 close to the connecting part 33 is recorded.
In some embodiments of the present application, as shown in fig. 1-3, the first superconducting joint 35, the first current lead 31, the second superconducting joint 36 and the second current lead 34 each have a single joint box, the single joint box of the first superconducting joint 35 and the single joint box of the first current lead 31 are connected through an indium crimping process to form a first double joint box, the single joint box of the second superconducting joint 36 and the single joint box of the second current lead 34 are connected through an indium crimping process to form a second double joint box, the first potential line 18 is connected to both ends of the first double joint box, and the fourth potential line 21 is connected to both ends of the second double joint box. In some embodiments, the test piece is integrally formed and includes a first superconducting joint 35, a second superconducting joint 36, and a connection portion 33, wherein a single joint box on the first superconducting joint 35 is integrally formed with the first superconducting joint 35, and a single joint box on the second superconducting joint 36 is integrally formed with the second superconducting joint 36. Thus, when the test sample needs to be replaced, the test sample is only detached from the fixing tool 32, the two single connector boxes on the two superconducting connectors are detached from the two current leads, then a new test sample is replaced, and the two single connector boxes on the new test sample are then subjected to indium crimping on the two current leads.
In some embodiments of the present application, as shown in fig. 2, the pressure transmitter 16 further includes an insulator 22, the insulator 22 is disposed between the pressure transmitter 16 and the first superconducting joint 35, and the insulator 22 is disposed between the pressure transmitter 16 and the second superconducting joint 36. The insulator 22 can prevent the high current of the testing device from affecting the pressure testing accuracy of the pressure transmitter 16, and the insulator 22 is preferably an axial insulator 22, which can effectively shield the axial current of the wire.
The detailed procedure of the whole test method is described herein:
and opening a side cabin door of the terminal box 2, installing current leads on the terminal box 2, installing a test assembly 3 inside the terminal box 2, and respectively connecting a pair of single connector boxes of the test assembly 3 and a pair of single connector boxes of the current leads by using an indium crimping process to form a pair of feed double connector boxes. Two single connector boxes of the feed double connector box are connected through stainless steel pipes.
The thermometers 17 are installed at both ends of the first superconducting joint 35 of the test assembly 3, and the thermometer 17 is installed at the intermediate position of the first superconducting joint 35.
The thermometers 17 are installed at both ends of the second superconducting joint 36 of the test assembly 3, and the thermometer 17 is installed at the middle position of the second superconducting joint 36.
A pair of first potential lines 18 are installed at both ends of the feeding double junction box between the first superconducting joint 35 and the first current lead 31. Two pairs of second potential lines 19 are installed at both ends of the first superconducting joint 35, wherein one pair of second potential lines 19 is a spare line.
Two pairs of third potential lines 20 are installed at both ends of the second superconducting joint 36, wherein one pair of third potential lines 20 is a spare line. A pair of fourth potential lines 21 are mounted at both ends of the feeding double junction box between the second superconducting joint 36 and the second current lead 34.
Sealing the terminal box 2, opening an air suction system 11 and a leakage detection system 12 of the terminal box 2, and vacuumizing and detecting leakage of the terminal box 2. And opening a temperature acquisition system, a pressure acquisition system and a potential acquisition system, and debugging the systems. After the completion of the debugging, when the vacuum degree of the terminal box 2 reached below 1Pa, the 80K liquid nitrogen supply system and the 80K liquid nitrogen recovery system were turned on, and when the terminal box 2 and the current lead temperature were reduced to about 80K, the 4.2K liquid helium supply system and the 300K helium recovery system were turned on.
And two current lead feeding ends are respectively connected to the positive electrode and the negative electrode of the power supply 1.
When the temperature of the test assembly 3 stabilized at 4.2-6K, the power supply 1 was turned on, current was injected into the system, and the current was slowly increased to 0 kA,10 kA,20 kA,30 kA,40 kA,50 kA and above, each current stabilized for at least 2 min. All data of the thermometer 17, the potential line, and the pressure transmitter 16 are recorded. The resistance of the joint was calculated using a linear fit I-V curve.
After the above resistance test is completed, when the temperature of the superconducting joint is stabilized at 4.6-6K:
controlling the flow rate of helium to be 5+/-0.2 g/s and keeping the helium stable for 2 min, and recording the data of the pressure transmitter 16 at the moment and the data of the thermometer 17 on the side of the second superconducting joint 36 close to the connecting part 33;
controlling the flow rate of helium to be 4.5+/-0.2 g/s and keeping the helium stable for 2 min, and recording the data of the pressure transmitter 16 at the moment and the data of the thermometer 17 on the side of the second superconducting joint 36 close to the connecting part 33;
controlling the flow rate of helium to be 4+/-0.2 g/s and keeping the helium stable for 2 minutes, and recording the data of the pressure transmitter 16 at the moment and the data of the thermometer 17 on the side of the second superconducting joint 36 close to the connecting part 33;
controlling the flow rate of helium to be 3.5+/-0.2 g/s and keeping the helium stable for 2 min, and recording the data of the pressure transmitter 16 at the moment and the data of the thermometer 17 on the side of the second superconducting joint 36 close to the connecting part 33;
the flow rate of helium was controlled to 3.+ -. 0.2g/s and kept stable for 2 min, and data from the pressure transducer 16 at this time and data from the thermometer 17 on the side of the second superconducting joint 36 near the connection 33 were recorded.
After the pressure drop test of 4.2K of the test assembly 3 was completed, the temperature of the test assembly 3 was initially raised, and throughout the entire temperature raising process, the temperature gradient of the inlet and outlet lines of the superconducting joint of the test assembly 3 was maintained < 50K.
The whole system is warmed up to room temperature, and when the temperature of the superconducting joint is stabilized at room temperature:
the flow rate of helium was controlled to be 5.+ -. 0.2g/s and kept stable for 2 min, and data from the pressure transducer 16 at this time and data from the thermometer 17 on the side of the second superconducting joint 36 close to the connection 33 were recorded.
The flow rate of helium was controlled to be 4.5.+ -. 0.2g/s and kept stable for 2 min, and data from the pressure transducer 16 at this time and data from the thermometer 17 on the side of the second superconducting joint 36 close to the connection 33 were recorded.
The flow rate of helium was controlled to be 4.+ -. 0.2g/s and kept stable for 2 min, and data from the pressure transducer 16 at this time and data from the thermometer 17 on the side of the second superconducting joint 36 close to the connection 33 were recorded.
The flow rate of helium was controlled to 3.5.+ -. 0.2g/s and kept stable for 2 min, and data from the pressure transducer 16 at this time and data from the thermometer 17 on the side of the second superconducting joint 36 near the connection 33 were recorded.
The flow rate of helium was controlled to 3.+ -. 0.2g/s and kept stable for 2 min, and data from the pressure transducer 16 at this time and data from the thermometer 17 on the side of the second superconducting joint 36 near the connection 33 were recorded.
After the above pressure drop test at room temperature is completed, the terminal box 2 door is opened, and the test assembly 3 is removed from the current lead.
In summary, the superconducting joint back field-free testing device and the testing method thereof of the application install the superconducting joint on the fixed tool 32, can test parameters such as resistance, voltage drop and the like of one or more superconducting joints simultaneously, can test different types of superconducting joints, can test resistance under current of dozens of KA levels, can test resistance as low as 0.1nΩ, can perform voltage drop test under 4.2K and voltage drop test under normal temperature, and has high testing efficiency, small testing data error and high precision.
The foregoing is merely a preferred embodiment of the present application and it should be noted that modifications and substitutions will now occur to those skilled in the art without departing from the technical principles of the present application, and these modifications and substitutions should also be considered to be within the scope of the present application.
Claims (8)
1. A superconducting joint backless field testing apparatus, comprising:
the device comprises a power supply, a terminal box, a testing component, a first cooling part, a first recycling part, a second cooling part and a second recycling part, wherein the terminal box is provided with a containing space, and the testing component is arranged in the containing space;
the testing assembly comprises a first current lead, a fixing tool, a connecting part and a second current lead, wherein the positive electrode of the power supply is electrically connected with the first end of the first current lead, the second end of the first current lead and the fixing tool jointly define a first installation position for installing a superconducting joint, the fixing tool and the first end of the second current lead jointly define a second installation position for installing the superconducting joint, the first installation position and the second installation position are connected through the connecting part, the connecting part is arranged on one side, away from the first current lead, of the first installation position, and the second end of the second current lead is electrically connected with the negative electrode of the power supply;
the first cooling part is communicated with the first end of the first current lead, the first recovery part is communicated with the second end of the first current lead, the first cooling part is communicated with the second end of the second current lead, and the first recovery part is communicated with the first end of the second current lead;
the second cooling part is communicated with the second end of the first current lead, and the second recovery part is communicated with the first end of the second current lead;
the first cooling part is cooled by liquid nitrogen, and the second cooling part is cooled by liquid helium;
the first end of the first current lead is a feed end and one helium tube, two helium tubes are arranged in the middle of the first current lead, one helium tube is communicated with the second end of the first current lead, and the other helium tube is communicated with the helium tube at the first end of the first current lead; the second end of the second current lead is a feed end and one helium tube, two helium tubes are arranged in the middle of the second current lead, one helium tube is communicated with the first end of the second current lead, the other helium tube is communicated with the helium tube at the second end of the second current lead, and the two feed ends are respectively connected with the positive electrode and the negative electrode of the power supply.
2. The device of claim 1, further comprising an air extraction system in communication with the receiving space.
3. The device for testing the superconducting joint back field free of the superconducting joint according to claim 2, further comprising a leak detection system, wherein the leak detection system is communicated with the accommodating space.
4. The device for testing the superconducting joint back field free of the superconducting joint according to claim 1, further comprising a cold screen attached to the inner side of the terminal box, wherein an inlet end of the cold screen is communicated with the first cooling portion, and an outlet end of the cold screen is communicated with the first recovery portion.
5. The superconducting joint backless field test apparatus of claim 1, further comprising a first connection tube and a second connection tube, the first connection tube communicating the first end of the first current lead and the second end of the second current lead, and the first connection tube communicating with the first cooling portion, the second connection tube communicating the second end of the first current lead and the first end of the second current lead, and the second connection tube communicating with the first recovery portion.
6. A method for testing a superconducting joint without back field, characterized in that the device for testing a superconducting joint without back field according to any one of claims 1 to 5 is applied, comprising the steps of:
mounting a first superconducting joint on the first mounting position, mounting a second superconducting joint on the second mounting position, enabling the first superconducting joint to be communicated with the first current lead and the connecting part respectively, and enabling the second superconducting joint to be communicated with the connecting part and the second current lead respectively;
pressure transmitters are respectively arranged at two ends of the first superconducting joint and two ends of the second superconducting joint;
installing thermometers at two ends and the middle position of the first superconducting joint and two ends and the middle position of the second superconducting joint respectively;
a first potential line is arranged at the connection position of the first current lead and the first superconducting joint, a second potential line is arranged at the two ends of the first superconducting joint, a third potential line is arranged at the two ends of the second superconducting joint, and a fourth potential line is arranged at the connection position of the second superconducting joint and the second current lead;
starting the first cooling part and the first recovery part, starting the second cooling part and the second recovery part, starting the power supply and gradually increasing the transmission current, recording the data of the pressure transmitter, the thermometer and the potential line, and calculating the resistance of the superconducting joint by utilizing a linear fitting current-voltage curve;
stabilizing the superconducting joint in a superconducting state, then controlling the cooling flow of the second cooling part to gradually decrease, recording data of the pressure transmitter, recording thermometer data of one side of the first superconducting joint close to the connecting part, and recording thermometer data of one side of the second superconducting joint close to the connecting part;
and (3) stabilizing the superconducting joint at a room temperature state, then controlling the cooling flow of the second cooling part to gradually decrease, recording data of the pressure transmitter, recording thermometer data of one side of the first superconducting joint close to the connecting part, and recording thermometer data of one side of the second superconducting joint close to the connecting part.
7. The method of claim 6, wherein the first superconducting joint, the first current lead, the second superconducting joint and the second current lead each have a single junction box, the single junction box of the first superconducting joint and the single junction box of the first current lead are connected by an indium crimping process to form a first double junction box, the single junction box of the second superconducting joint and the single junction box of the second current lead are connected by an indium crimping process to form a second double junction box, the first potential line is connected to both ends of the first double junction box, and the fourth potential line is connected to both ends of the second double junction box.
8. The method of claim 6, further comprising an insulator, wherein the insulator is disposed between the pressure transducer and the first superconducting joint, and wherein the insulator is disposed between the pressure transducer and the second superconducting joint.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310325435.2A CN116027112B (en) | 2023-03-30 | 2023-03-30 | Superconducting joint back field-free testing device and testing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310325435.2A CN116027112B (en) | 2023-03-30 | 2023-03-30 | Superconducting joint back field-free testing device and testing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN116027112A CN116027112A (en) | 2023-04-28 |
| CN116027112B true CN116027112B (en) | 2023-07-04 |
Family
ID=86089650
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310325435.2A Active CN116027112B (en) | 2023-03-30 | 2023-03-30 | Superconducting joint back field-free testing device and testing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116027112B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116794577B (en) * | 2023-08-23 | 2023-11-21 | 中国科学院电工研究所 | Nb is measured fast and accurately 3 Method for critical current of Sn superconducting joint |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003044424A2 (en) * | 2001-11-21 | 2003-05-30 | Oxford Magnet Technology Limited | A cryogenic assembly |
| CN100570380C (en) * | 2008-04-08 | 2009-12-16 | 清华大学 | A kind of isolated plant of measuring superconducting line joint resistance |
| CN101839943B (en) * | 2010-05-19 | 2012-12-12 | 中国科学院电工研究所 | Resistance measurement device of conduction cooling type superconduction adapter |
| CN102426324A (en) * | 2011-08-24 | 2012-04-25 | 中国科学院等离子体物理研究所 | Tester for testing insulation low-temperature performance of superconducting electrical component |
| CN103336179B (en) * | 2013-06-21 | 2016-12-28 | 中国科学院合肥物质科学研究院 | The low-temperature resistance of CICC superconducting joint measures making and the measuring method of system |
| US9552906B1 (en) * | 2015-09-01 | 2017-01-24 | General Electric Company | Current lead for cryogenic apparatus |
| CN112880756B (en) * | 2021-01-19 | 2022-05-10 | 中国科学院合肥物质科学研究院 | Device and method for testing flow distribution of liquid helium in CICC conductor |
-
2023
- 2023-03-30 CN CN202310325435.2A patent/CN116027112B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN116027112A (en) | 2023-04-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN116027112B (en) | Superconducting joint back field-free testing device and testing method thereof | |
| CN102928718B (en) | Superconductivity insulation material electrical characteristic test device | |
| US8084698B2 (en) | Current leadthrough for cryostat | |
| CN102426324A (en) | Tester for testing insulation low-temperature performance of superconducting electrical component | |
| JP2014041103A (en) | Magnetic resonance signal detection module | |
| CN106123109B (en) | Pipeline monitoring system | |
| CN109738701A (en) | A kind of conductivity measuring device and method | |
| CN112630620A (en) | Testing device, testing system and testing method for semiconductor sample | |
| CN211528262U (en) | Material heat conductivity testing system | |
| CN111602039A (en) | Device and method for monitoring the temperature of a cable joint of a cable connected to a gas-insulated switchgear | |
| CN109655725A (en) | The quickly device and method of detection solid insulating layer Paschen performance at low pressure | |
| CN108801563A (en) | Helium leak detection fixture, helium leak detection device and method | |
| JP2014167394A (en) | Four point resistance measurement instrument and four point measurement probe | |
| CN109273120B (en) | Compact type small nuclear reactor cold section temperature measuring method | |
| CN108917970A (en) | A kind of the filming collecting transmitter and method of temperature signal | |
| CN210294465U (en) | Superconducting chip low temperature testing arrangement | |
| CN213986260U (en) | Ferromagnetic resonance device | |
| US11393614B2 (en) | Current lead assembly for cryogenic apparatus | |
| CN113359001B (en) | Chip testing system | |
| KR20000048066A (en) | A cooling device of superconductor | |
| CN107202967A (en) | Apply voltage measurement against the SQUID sample lever systems of magnetoelectric effect in situ | |
| CN208399041U (en) | A kind of filming Miniature temperature detector | |
| CN216978896U (en) | Nuclear magnetic resonance coil structure and nuclear magnetic resonance device with same | |
| CN117517396A (en) | High-temperature superconducting coil defect monitoring device and monitoring method | |
| CN103454406A (en) | Sealing apparatus for electrical apparatus oil sampler and conditioner for solid state sensors |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |