CN116017923A - Power device - Google Patents

Power device Download PDF

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Publication number
CN116017923A
CN116017923A CN202211549147.7A CN202211549147A CN116017923A CN 116017923 A CN116017923 A CN 116017923A CN 202211549147 A CN202211549147 A CN 202211549147A CN 116017923 A CN116017923 A CN 116017923A
Authority
CN
China
Prior art keywords
power device
mounting surface
housing
mounting
power
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202211549147.7A
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Chinese (zh)
Inventor
陈建宏
林健鹏
尤培艾
孟岳勇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Delta Electronics Shanghai Co Ltd
Original Assignee
Delta Electronics Shanghai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Delta Electronics Shanghai Co Ltd filed Critical Delta Electronics Shanghai Co Ltd
Priority to CN202211549147.7A priority Critical patent/CN116017923A/en
Publication of CN116017923A publication Critical patent/CN116017923A/en
Pending legal-status Critical Current

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Abstract

The invention discloses a power device, comprising: a housing having an inclined mounting surface; and the power device is obliquely arranged on the mounting surface. The invention can effectively solve the problem of limited installation of the power device by designing the installation surface as the inclined surface.

Description

Power device
Technical Field
The present invention relates to a power device.
Background
The power device is a key device in the switching power supply, and has high heat dissipation requirement. For the plug-in type power device, the plug-in type power device needs to be directly installed on a radiating surface to radiate heat so as to ensure the performance of the power device. The common heat dissipation assembly mode at present comprises a flat installation mode or a vertical installation mode. As the power density of the switching power supply is higher, the size is smaller, the appearance is diversified, and the heat dissipation design is more difficult. In the past, the design of the radiating surface is limited by a flat mounting or vertical mounting mode, so that the problem of mounting the power device is very critical.
Disclosure of Invention
The present invention is directed to a power device that overcomes one or more of the shortcomings of the prior art.
In order to achieve the above object, the present invention provides a power device including: a housing having an inclined mounting surface; and the power device is obliquely arranged on the mounting surface.
In some embodiments of the invention, the housing includes opposing first and second faces, the mounting face being formed by the first face portion region being inclined toward the second face.
In some embodiments of the invention, the mounting surface includes a first mounting surface and a second mounting surface, the first mounting surface and the second mounting surface are respectively located at two sides of a normal plane of the first surface, and the first mounting surface and the second mounting surface are inclined towards the normal plane.
In some embodiments of the invention, the housing further has: and the positioning part is positioned at one end of the mounting surface close to the second surface and extends in a direction away from the second surface, and the positioning part is configured to be capable of being contacted with one end of the power device.
In some embodiments of the invention, the power device further comprises: the elastic piece comprises a fixing part and a contact part, wherein the fixing part is detachably arranged on the shell, and the contact part is contacted with the power device to fix the power device on the mounting surface. Preferably, the contact portion includes an arc portion, and the elastic member contacts the power device through the arc portion. Preferably, the mounting surface comprises a first mounting surface and a second mounting surface, the first mounting surface and the second mounting surface are respectively positioned at two sides of a normal plane of the first surface, and the first mounting surface and the second mounting surface incline towards the normal plane. Preferably, the casing further has: and the positioning part is positioned at one end of the mounting surface close to the second surface and extends towards the direction away from the second surface, and the positioning part is configured to be capable of being contacted with one end of the power device. Preferably, the positioning portion extends to form a boss, and a vertical height of a top surface of the boss is greater than a vertical height of the first surface. Preferably, the fixing portion of the elastic member is fixed to the top surface of the boss through a detachable connecting member.
In some embodiments of the invention, the power device further comprises: and the printed circuit board is arranged above the shell and the power device and is configured to be connected with pins of the power device.
In some embodiments of the invention, the printed circuit board has an opening capable of exposing the power device.
In some embodiments of the invention, the power device is adhesively mounted to the mounting surface.
In some embodiments of the invention, the housing is a heat dissipating housing, and the mounting surface is thermally connected to the power device.
In some embodiments of the invention, the heat dissipating casing is formed with heat dissipating channels.
The invention can effectively solve the problem of limited installation of the power device by designing the installation surface as the inclined surface. Moreover, the inclination angle of the inclined plane can be adjusted by matching with the depth of the shell, so that the heat dissipation problem of the power device can be well solved under the condition that the dimension in the horizontal or vertical direction is limited and the dimension in the depth direction is adjustable.
The invention can control the pin distance between the power device and the printed circuit board by changing the installation mode of the power device, and can also solve the performance problem caused by overlong pins. For example, when the pins are too long, parasitic inductance on the pins is too large when the power device works, thereby affecting the working performance of the power device. The invention can adjust the length of the pins between the power device and the printed circuit board, thereby solving the problem that the overlong pins affect the performance of the power device.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and other features and advantages of the present invention will become more apparent by describing in detail exemplary embodiments thereof with reference to the attached drawings.
FIG. 1 is a schematic perspective view of a power device according to a preferred embodiment of the invention;
FIG. 2 is a front view of the power device shown in FIG. 1;
FIG. 3 is a top view of the power device shown in FIG. 1;
fig. 4 is a side view of the power device shown in fig. 1.
Detailed Description
Example embodiments will now be described more fully with reference to the accompanying drawings. However, the exemplary embodiments can be embodied in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the example embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and thus detailed descriptions thereof will be omitted.
When introducing elements/components/etc. that are described and/or illustrated herein, the terms "a," "an," "the," and "at least one" are intended to mean that there are one or more of the elements/components/etc. The terms "comprising," "including," and "having" are intended to be inclusive and mean that there may be additional elements/components/etc., in addition to the listed elements/components/etc. Furthermore, the terms "first," "second," and the like in the claims are used merely as labels, and are not intended to limit the numerals of their objects.
As shown in fig. 1-4, the present invention preferably provides a power device 100, which may include a housing 10 and a power device 20. Wherein the housing 10 has an inclined mounting surface 11. The power device 20 is mounted obliquely on the mounting surface 11. The invention can effectively solve the problem of limited installation of the power device by designing the installation surface as the inclined surface.
In the present invention, the power device 20 may be directly adhesively mounted on the mounting surface 11. Alternatively, the attachment may be by other attachment means, including but not limited to attachment using an elastic member 30 as shown in fig. 1-4 (the specific structure will be described in detail later). Alternatively, the fixation may be performed by a combination of two or more different fixation means, which again are not limiting of the invention.
In the preferred embodiment, as shown in fig. 1 and 2, the elastic member 30 is detachably mounted on the casing 10, and contacts the power device 20 through the contact portion 32 to fix the power device 20 on the mounting surface 11. Preferably, the contact portion 32 may include a circular arc portion (more clearly shown in fig. 2), through which the elastic member 30 contacts the power device 20.
In the preferred embodiment, as shown in fig. 1-4, the power device 100 may further include a printed circuit board (Printed Circuit Board, PCB) 50 disposed above the housing 10 and the power device 20 and configured to be connected to the pins 21 of the power device 20. Preferably, the printed circuit board 50 may have an opening 51 capable of exposing the power device 20.
In the present invention, the power device 100 may be, for example, a switching power supply, but the present invention is not limited thereto.
In the present preferred embodiment, as shown in fig. 1 and 2, the casing 10 includes a first surface 101 and a second surface 102 opposite to each other, and the mounting surface 11 is disposed on the first surface 101 and is inclined in a direction approaching the second surface 102. Further, the casing 10 may further include two side surfaces 103 connected between the first surface 101 and the second surface 102 and opposite to each other, so that the casing 10 may form a channel 106. In other embodiments of the present invention, the housing 10 may preferably be a heat dissipating housing, and the mounting surface 11 and the power device 20 may be thermally connected, i.e., the power device 20 may dissipate heat through the mounting surface 11 or even the entire heat dissipating housing. The channel 106 is preferably a heat dissipation channel, through which a heat dissipation medium such as a gas or a fluid for dissipating heat can flow, but the invention is not limited thereto.
As shown in fig. 2, referring to fig. 1 in combination, in the present preferred embodiment, the mounting surface 11 may include, for example, a first mounting surface 11a and a second mounting surface 11b respectively located on both sides of a normal plane I of the first surface 101, on which the power devices 20a and 20b are respectively mounted, and the first mounting surface 11a and the second mounting surface 11b are inclined toward the normal plane I, that is, from both sides toward the normal plane I and toward the second surface 102. In the present preferred embodiment, the first mounting surface 11a and the second mounting surface 11b are equal to each other in angle θ (0 ° < θ < 90 °) with respect to the first surface 101. However, it is understood that in other embodiments, the angles between the first and second mounting surfaces 11a, 11b and the first surface 101 may be unequal, which is not a limitation of the present invention. In the present invention, the inclination angle of the mounting surface 11 (e.g., the angle θ between the mounting surface 11 and the first surface 101) is adjustable, which can be adjusted in accordance with the depth H3 of the casing 10 (i.e., the depth of the channel 106 in fig. 2, for example, the distance between the inner sides of the first surface 101 and the second surface 102). In other words, the inclination angle of the inclined plane (i.e., the mounting surface 11) can be adjusted in cooperation with the depth of the housing, so that the heat dissipation problem of the power device can be well solved when the dimension in the horizontal or vertical direction is limited and the dimension in the depth direction is adjustable.
As shown in fig. 1 and 2, the casing 10 may further preferably have a positioning portion 12, which is located at an end of the mounting surface 11 near the second surface 102 and extends in a direction away from the second surface 102. Wherein the positioning portion 12 is configured to be capable of contacting one end (e.g., a lower end in the drawing) of the power device 20. In the preferred embodiment, the positioning portion 12 is, for example, a boss formed by extending, for example, in a trapezoid shape with a narrower top and a wider bottom, wherein two inclined surfaces 121 of the boss can be used to control the positions of the power devices 20a and 20b mounted on the first mounting surface 11a and the second mounting surface 11b on both sides, respectively. More preferably, the vertical height H2 of the top surface 122 of the boss (e.g., may be defined as the distance between the top surface 122 and the outer side surface of the second surface 102) is greater than the vertical height H1 of the first surface 101 (e.g., may be defined as the distance between the outer side surface of the first surface 101 and the outer side surface of the second surface 102), that is, the positioning portion 12 protrudes from the first surface 101 of the casing 10. Of course, it should be understood that in other embodiments, the positioning portion 12 may be relatively recessed in the first surface 101 of the housing 10, which is not a limitation of the present invention.
With continued reference to fig. 2, in some embodiments of the present invention, the pins 21 of the power device 20 may be bent and connected to the adjacent printed circuit board 50, for example, may be bent to have an inclined portion 211 and a vertical portion 212, wherein the inclined portion 211 may be parallel to the corresponding mounting surface 11a, 11b, for example, and the vertical portion 212 may be perpendicular to the printed circuit board 50, for example, but the present invention is not limited thereto.
In the present invention, the adjustment of the position of the power device 20 can be achieved by adjusting the inclination angle of the mounting surface 11 and/or the angle of the inclined surface 121 of the positioning portion 12, so that not only the problem of limited mounting of the power device and the problem of heat dissipation can be solved, but also the length of the pins between the power device 20 and the printed circuit board 50 can be adjusted, thereby solving the problem that the performance of the power device 20 is affected by the overlong pins.
As shown in fig. 3, referring to fig. 1 and 2 in combination, in the present preferred embodiment, four power devices 20 are mounted on the first mounting surface 11a and the second mounting surface 11b, respectively, and the power device 20a mounted on the first mounting surface 11a and the power device 20b mounted on the second mounting surface 11b are disposed in pairs. It will be understood, of course, that in other embodiments, the number of mounting surfaces 11 on the housing 10 may be other numbers, and accordingly, the number of power devices 20 mounted on each mounting surface 11 may be other numbers, as desired, without limiting the invention. In addition, the arrangement and disposition of the plurality of mounting surfaces 11 on the casing 10 is not limited to the manner shown in the above-described embodiment, but may be changed or modified accordingly as needed, which is also not a limitation of the present invention.
With continued reference to fig. 2, in the preferred embodiment, the fixing portion 31 of the elastic member 30 is fixed to the top surface 122 of the boss by a detachable connecting member 40 (including but not limited to a bolt, etc.), and the contact portions 32 at two ends of the elastic member 30 are respectively contacted with the power devices 20a and 20b at two sides by circular arc portions, for example, preferably contacted with the center positions of the power devices 20a and 20b, so that two oppositely disposed power devices 20a and 20b can be fixed by one elastic member 30. Of course, it will be appreciated that in other embodiments, one elastic member 30 may be used to fix one power device 20, or multiple contact portions of one elastic member 30 may be used to fix multiple power devices 20 at the same time, which is not a limitation of the present invention.
The invention can effectively solve the problem of limited installation of the power device by designing the installation surface as the inclined surface. Moreover, the angle of the inclined plane can be adjusted by matching with the depth of the shell, so that the heat dissipation problem of the power device can be well solved under the condition that the dimension in the horizontal or vertical direction is limited and the dimension in the depth direction is adjustable.
The invention can control the pin distance between the power device and the printed circuit board by changing the installation mode of the power device, and can also solve the performance problem caused by overlong pins. For example, when the pins are too long, parasitic inductance on the pins is too large when the power device works, thereby affecting the working performance of the power device. The invention can adjust the length of the pins between the power device and the printed circuit board, thereby solving the problem that the overlong pins affect the performance of the power device.
The exemplary embodiments of the present invention have been particularly shown and described above. It is to be understood that the invention is not to be limited to the disclosed embodiments, but on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims.

Claims (15)

1. A power device, comprising:
a housing having an inclined mounting surface;
and the power device is obliquely arranged on the mounting surface.
2. The power device of claim 1, wherein the housing includes opposing first and second faces, the mounting face being formed by the first face portion region being sloped toward the second face.
3. The power device of claim 2, wherein the mounting surface comprises a first mounting surface and a second mounting surface, the first mounting surface and the second mounting surface are respectively located on two sides of a normal plane of the first surface, and the first mounting surface and the second mounting surface are inclined toward the normal plane.
4. The power device of claim 2, wherein the housing further has:
and the positioning part is positioned at one end of the mounting surface close to the second surface and extends in a direction away from the second surface, and the positioning part is configured to be capable of being contacted with one end of the power device.
5. The power device of claim 2, further comprising:
the elastic piece comprises a fixing part and a contact part, wherein the fixing part is detachably arranged on the shell, and the contact part is contacted with the power device to fix the power device on the mounting surface.
6. The power device of claim 5, wherein the contact portion includes a circular arc portion through which the elastic member contacts the power element.
7. The power device of claim 5, wherein the mounting surface comprises a first mounting surface and a second mounting surface, the first mounting surface and the second mounting surface are located on two sides of a normal plane of the first surface, respectively, and the first mounting surface and the second mounting surface are inclined toward the normal plane.
8. The power device of claim 7, wherein the housing further has:
and the positioning part is positioned at one end of the mounting surface close to the second surface and extends in a direction away from the second surface, and the positioning part is configured to be capable of being contacted with one end of the power device.
9. The power device of claim 8, wherein the positioning portion extends to form a boss, and a vertical height of a top surface of the boss is greater than a vertical height of the first surface.
10. The power device of claim 9, wherein the securing portion of the resilient member is secured to the top surface of the boss by a detachable connection.
11. The power device of claim 1, further comprising:
and the printed circuit board is arranged above the shell and the power device and is configured to be connected with pins of the power device.
12. The power device of claim 11, wherein the printed circuit board has an opening capable of exposing the power device.
13. The power device of claim 1, wherein the power component is adhesively mounted to the mounting surface.
14. The power device of any one of claims 1-13, wherein the housing is a heat dissipating housing, and wherein the mounting surface is thermally coupled to the power component.
15. The power device of claim 14, wherein the heat dissipating housing is formed with heat dissipating channels.
CN202211549147.7A 2022-12-05 2022-12-05 Power device Pending CN116017923A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202211549147.7A CN116017923A (en) 2022-12-05 2022-12-05 Power device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202211549147.7A CN116017923A (en) 2022-12-05 2022-12-05 Power device

Publications (1)

Publication Number Publication Date
CN116017923A true CN116017923A (en) 2023-04-25

Family

ID=86036310

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202211549147.7A Pending CN116017923A (en) 2022-12-05 2022-12-05 Power device

Country Status (1)

Country Link
CN (1) CN116017923A (en)

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