CN116013903A - Power conversion module packaging structure and method with electromagnetic shielding and high heat conducting performance - Google Patents
Power conversion module packaging structure and method with electromagnetic shielding and high heat conducting performance Download PDFInfo
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- CN116013903A CN116013903A CN202310156624.1A CN202310156624A CN116013903A CN 116013903 A CN116013903 A CN 116013903A CN 202310156624 A CN202310156624 A CN 202310156624A CN 116013903 A CN116013903 A CN 116013903A
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Abstract
The invention discloses a power conversion module packaging structure with electromagnetic shielding and high heat conducting performance and a method thereof, wherein the packaging structure comprises a PCBA, a plastic package body, a winding copper sleeve and an input/output electrical pin; the PCBA is subjected to double-sided reflow soldering, a device needing heat dissipation is assembled, and the circuit function of the PCBA is used for realizing power conversion; placing PCBA in a plastic packaging mould, and forming a plastic packaging body by injection molding through a semiconductor plastic packaging process; the plastic package body forms a package frame through drilling, cleaning, electroplating and patterning, and comprises a winding copper sleeve and an input/output electric pin, wherein the winding copper sleeve is used as a heat dissipation welding surface and a shielding grounding surface of the power conversion module; and cutting the plastic package body, and exposing the input and output electrical pins by the single power conversion module to form a final finished product. The invention has the advantages of high power density, excellent heat dissipation, excellent electromagnetic shielding, simple and reliable use and installation of clients and the like, and can obviously improve the reliability of the power conversion module in the use process.
Description
Technical Field
The invention belongs to the technical field of packaging, in particular to a packaging method of an electronic product with electromagnetic shielding and high heat conduction performance, and particularly relates to a packaging method of a power conversion module.
Background
In the fields of modern new energy automobile electronics, 5G communication base stations, unmanned aerial vehicles and aviation, aerospace and military industry with higher requirements, the requirements on the characteristics of miniaturization, modularization, high power density, high heat conduction, high integration, high reliability and the like of a power conversion module are higher and higher. Under the condition that heat dissipation is required, the conventional high-power-density power conversion module is generally encapsulated by forced air cooling or pouring sealant, but the pouring sealant has low heat conductivity coefficient, so that development prospect is limited. Meanwhile, more and more power conversion modules adopt microelectronic packaging technology of chips, and the modules are formed by using thermosetting and thermoplastic material plastic packaging, so that the protection can be provided in aspects of heat, mechanical performance, external environment isolation and the like in a certain range, but the protection is limited in a high-power-density and severe use environment. The plastic package module in the prior art generally adopts a single-sided conduction heat dissipation mode when being used at a client, cannot overcome the defects of large thermal resistance, temperature rise and the like of a device at one side of the power conversion module, and does not have an electromagnetic shielding function to a certain extent.
Disclosure of Invention
The invention aims to solve the problems in the prior art and provides a power conversion module packaging structure and method with electromagnetic shielding and high heat conducting performance.
The technical solution for realizing the purpose of the invention is as follows: a power conversion module packaging structure with electromagnetic shielding and high heat conducting performance comprises a PCBA, a plastic package body and input and output electric pins; the PCBA is subjected to double-sided reflow soldering, a device needing heat dissipation is assembled, and the circuit function of the PCBA is used for realizing power conversion; placing PCBA in a plastic packaging mould, and forming a plastic packaging body by injection molding through a semiconductor plastic packaging process; the plastic package body forms a package frame through drilling, cleaning, electroplating and patterning, and comprises a winding copper sleeve and an input/output electric pin, wherein the winding copper sleeve is used as a heat dissipation welding surface and a shielding grounding surface of the power conversion module; and cutting the plastic package body, and exposing the input and output electrical pins by the single power conversion module to form a final finished product.
Further, the winding copper sleeve comprises a first copper layer, a second copper layer, a nickel layer and a gold layer which are sequentially arranged from bottom to top along the surface vertical to the plastic package body.
Further, the thickness of the second copper layer is greater than the thickness of the first copper layer.
Further, the input and output electrical pins are metallized by side walls, and the surfaces of the input and output electrical pins are subjected to gold precipitation.
Further, the PCBA is subjected to plastic package by adopting an epoxy plastic package material.
The packaging method based on the packaging structure comprises the following steps:
step 6, copper deposition is carried out on the treated plastic package body, and then electroplating is carried out, wherein a first copper layer is formed on the surface of the plastic package body and the surface of the hole;
step 7, carrying out graphic processing on the electroplated plastic package body, and removing the redundant copper layer by using laser through prefabricating an electric pin graphic;
step 9, carrying out gold melting process treatment on the plastic package body subjected to secondary electroplating, wherein a nickel layer is electroplated on the surface of the plastic package body, and then the nickel layer is electroplated;
and 10, cutting the electroplated plastic package body through the outline graph, and leaking all input and output electrical pins of a finished product of the final power conversion module.
Further, before the step 4 is executed, the method further comprises the step of carrying out double-sided thinning on the plastic packaged product through a thinning machine, and exposing the magnetic component.
Compared with the prior art, the invention has the remarkable advantages that: 1) The package body is filled with the high-heat-conductivity plastic package material, and the high-heat-conductivity property and the proper thermal expansion coefficient of the package body can obviously reduce the internal thermal stress of the power conversion module and enhance the integral mechanical strength of the power conversion module; 2) The packaging body winding type copper sleeve can effectively enhance the thermal uniformity of the top layer and the bottom layer of the power conversion module, reduce the influence of hot spots on the reliability of products, reduce the use difficulty of users, and can be effectively applied by SMT reflow soldering without double-sided heat dissipation treatment; 3) The package body winding type copper sleeve forms electromagnetic shielding, so that the electromagnetic interference resistance can be effectively improved, and the reliability is remarkably improved; 4) An advanced semiconductor plastic packaging process is adopted, and plastic packaging materials with higher heat conductivity coefficient are used for improving heat dissipation inside the module; 5) And the electric pins formed by electroplating on two sides of the plastic package body are used for welding the final power conversion module, so that the electric pins do not need to occupy the space of components on the top and bottom surfaces of the PCBA, and the power density of the power conversion module is obviously improved.
The invention is described in further detail below with reference to the accompanying drawings.
Drawings
Fig. 1 is an overall schematic diagram of a power conversion module according to an embodiment.
FIG. 2 is an overall exploded schematic diagram of a power conversion module in one embodiment.
Fig. 3 is a schematic diagram of a PCBA prior to plastic encapsulation in one embodiment.
Fig. 4 is a schematic diagram of plastic packaging of the PCBA in a plastic packaging mold according to an embodiment, wherein fig. (a) is a schematic exploded view of plastic packaging, and fig. (b) is a side sectional view of the whole after plastic packaging.
Fig. 5 is a schematic diagram of the PCBA after plastic encapsulation, in one embodiment.
Fig. 6 is a schematic diagram of an embodiment of a plastic package after grinding.
Fig. 7 is a schematic diagram of a patterned drilling of a plastic package in one embodiment.
FIG. 8 is a schematic diagram of patterned electroplating of a plastic package in one embodiment.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application will be further described in detail with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the present application.
It should be noted that, if directional indications (such as up, down, left, right, front, and rear … …) are included in the embodiments of the present invention, the directional indications are merely used to explain the relative positional relationship, movement conditions, etc. between the components in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indications are correspondingly changed.
In addition, if there is a description of "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present invention.
In one embodiment, in combination with fig. 1 to 6, a power conversion module packaging structure with electromagnetic shielding and high heat conduction performance is provided, wherein the packaging structure comprises a PCBA1, a plastic package body 2 and input/output electric pins 3 (3.1 to 3.9); the PCBA1 is subjected to double-sided reflow soldering and is assembled with a device needing heat dissipation, and the circuit function of the device is used for realizing power conversion; the PCBA1 is placed in a plastic packaging mould, and a plastic packaging body 2 is formed by injection molding through a semiconductor plastic packaging process; the plastic package body 2 forms a package frame through drilling, cleaning, electroplating and patterning, and comprises a winding copper sleeve 4 and an input and output electric pin 3, wherein the winding copper sleeve 4 is used as a heat dissipation welding surface and a shielding grounding surface of the power conversion module; and the plastic package body 2 is subjected to a cutting procedure, and the single power conversion module exposes the input and output electrical pins to form a final finished product.
Further, in one embodiment, the plastic package mold comprises a hollow tetrahedron structure formed by an upper mold 6 and a lower mold 7, the PCBA1 is installed in the hollow tetrahedron structure, and the BOM surface of the PCBA is closely attached to steps around the lower mold cavity; the upper surface of the lower die 7 is provided with a first groove, a positioning pin is arranged on the first groove and used for providing limit in the horizontal and height directions for the PCBA1 and the lower die 7, the upper die 6 is provided with a glue inlet 8 for plastic packaging material, and the lower surface is provided with a second groove; when the upper die 6 is covered on the lower die 7, the first groove corresponds to the second groove and fixes the PCBA1 together, and meanwhile, the runner of the glue inlet 8 is communicated with the first groove and the second groove.
Further, in one embodiment, the wound copper sleeve 4 includes a first copper layer 4.1, a second copper layer 4.2, a nickel layer 4.3 and a gold layer 4.4 sequentially disposed from bottom to top along a surface perpendicular to the plastic package 2.
Further, in one of the embodiments, the thickness of the second copper layer 4.2 is greater than the thickness of the first copper layer 4.1.
Further, in one embodiment, the input/output electrical pins 3 are metallized by a sidewall, and the surface is subjected to a gold plating process.
Further, in one embodiment, the PCBA1 is encapsulated with an epoxy molding compound.
Further, in one embodiment, the thermal conductivity of the epoxy molding compound is higher than 3.5W/m.K.
In one embodiment, a method of packaging a power conversion module having electromagnetic shielding and high thermal conductivity is provided, the method comprising the steps of:
here, the double solvent cleaning is mainly used for residual soldering flux in the PCBA welding process, and the plasma cleaning is mainly used for various contamination such as tiny dust on the PCBA surface, resin residue organic matters and the like in the PCBA assembling process before plastic packaging;
here, the cavity between the PCBA1 and the package frame 2 is subjected to plastic package, and the specific process is as follows: injecting plastic packaging material from the glue inlet, and feeding glue to grooves in the upper die 6 and the lower die 7 through a runner of the glue inlet until a cavity between the PCBA1 and the upper die and the lower die is filled;
here, by double-sided thinning, the heat dissipation performance of the magnetic component can be improved;
step 6, performing two-fluid washing and drying on the product subjected to mechanical drilling, and then performing plasma cleaning;
step 7, copper deposition is carried out on the processed plastic package body, then electroplating is carried out, and a first copper layer 4.1 with the thickness of about 10um is formed on the surface of the plastic package body and the surface of the hole;
step 9, performing two-fluid washing and drying on the plastic package body with the patterns, and performing secondary electroplating to form a second copper layer 4.2 with the thickness of about 100um on the surface of the plastic package body and the surface of the hole;
step 10, carrying out gold melting process treatment on the plastic package body subjected to secondary electroplating, wherein the surface of the plastic package body is firstly electroplated with a nickel layer 4.3 with the thickness of 2.5un, and then electroplated with a gold layer 4.4 with the thickness of 0.05 um;
here, the steps 6 to 10 realize the metallized PIN and the winding copper sleeve, the metallized PIN uses the copper foil on the side wall of the PCBA to occupy the minimum area of the PCB, and the winding copper sleeve can effectively improve the electromagnetic interference resistance of the power conversion module and the reliability of the product;
and 11, cutting the periphery of the electroplated plastic package body through the outline pattern, and leaking all the electric pins 3 of the final power conversion module finished product.
And step 12, performing two-fluid washing and drying on the cut final product.
In conclusion, the packaging structure and the packaging method have the advantages of high power density, excellent heat dissipation, electromagnetic shielding, simple installation, high reliability and the like, and can remarkably improve the reliability of the power conversion module product in the use process.
The foregoing has outlined and described the basic principles, features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present invention, and various changes and modifications may be made without departing from the spirit and scope of the invention, which is defined in the appended claims.
Claims (10)
1. The power conversion module packaging structure with electromagnetic shielding and high heat conducting performance is characterized by comprising a PCBA (1), a plastic package body (2) and an input/output electrical pin (3); the PCBA (1) is subjected to double-sided reflow soldering and is assembled with a device needing heat dissipation, and the circuit function of the PCBA is used for realizing power conversion; the PCBA (1) is placed in a plastic packaging mould, and a plastic packaging body (2) is formed by injection molding through a semiconductor plastic packaging process; the plastic package body (2) forms a package frame through drilling, cleaning, electroplating and patterning, and comprises a winding copper sleeve (4) and an input and output electric pin (3), wherein the winding copper sleeve (4) is used as a heat dissipation welding surface and a shielding grounding surface of the power conversion module; and cutting the plastic package body (2), and exposing the input and output electrical pins by the single power conversion module to form a final finished product.
2. The power conversion module packaging structure with electromagnetic shielding and high heat conducting performance according to claim 1, wherein the plastic packaging die comprises a hollow tetrahedron structure formed by an upper die (6) and a lower die (7), the PCBA (1) is arranged in the hollow tetrahedron structure, and the BOM surface of the PCBA is tightly attached to steps arranged around the lower die cavity; the upper surface of the lower die (7) is provided with a first groove, a positioning pin is arranged on the first groove and used for providing limit in the horizontal and height directions for the PCBA (1) and the lower die (7), the upper die (6) is provided with a plastic package material inlet (8), and the lower surface is provided with a second groove; when the upper die (6) is covered on the lower die (7), the first groove corresponds to the second groove and fixes the PCBA (1) together, and meanwhile, the runner of the glue inlet (8) is communicated with the first groove and the second groove.
3. The power conversion module packaging structure with electromagnetic shielding and high heat conducting performance according to claim 1, wherein the winding copper sleeve (4) comprises a first copper layer (4.1), a second copper layer (4.2), a nickel layer (4.3) and a gold layer (4.4) which are sequentially arranged from bottom to top along the surface vertical to the plastic package body (2).
4. A power conversion module package structure with electromagnetic shielding and high thermal conductivity according to claim 3, characterized in that the thickness of said second copper layer (4.2) is larger than the thickness of the first copper layer (4.1).
5. The power conversion module packaging structure with electromagnetic shielding and high heat conducting performance according to claim 1, wherein the input and output electric pins (3) are subjected to side wall metallization treatment and surface gold precipitation treatment.
6. The power conversion module packaging structure with electromagnetic shielding and high heat conducting performance according to claim 1, wherein the PCBA (1) is plastic-packaged by using epoxy plastic packaging material.
7. The power conversion module packaging structure with electromagnetic shielding and high heat conducting performance according to claim 6, wherein the heat conducting coefficient of the epoxy plastic packaging material is higher than 3.5W/m.k.
8. Packaging method based on a packaging structure according to any of claims 1 to 7, characterized in that the method comprises the steps of:
step 1, performing double-solvent gas phase cleaning and plasma cleaning on PCBA subjected to welding and assembly;
step 2, placing the PCBA in a lower die cavity, and performing plastic packaging after the upper die and the lower die are clamped;
step 3, after the plastic packaging is completed, performing post-curing treatment;
step 4, the plastic package body vertically penetrates through an electrical PIN of the internal PCBA and a shielding grounding PIN in a mechanical drilling mode through a prefabricated electrical PIN pattern to form an electroplating hole;
step 5, performing two-fluid washing and drying on the product subjected to mechanical drilling, and then performing plasma cleaning;
step 6, copper deposition is carried out on the treated plastic package body, and then electroplating is carried out, wherein a first copper layer is formed on the surface of the plastic package body and the surface of the hole;
step 7, carrying out graphic processing on the electroplated plastic package body, and removing the redundant copper layer by using laser through prefabricating an electric pin graphic;
step 8, performing two-fluid washing and drying on the plastic package body with the patterns, and then performing secondary electroplating to form a second copper layer on the surface of the plastic package body and the surface of the holes;
step 9, carrying out gold melting process treatment on the plastic package body subjected to secondary electroplating, wherein a nickel layer is electroplated on the surface of the plastic package body, and then the nickel layer is electroplated;
and 10, cutting the electroplated plastic package body through the outline graph, and leaking all input and output electrical pins of a finished product of the final power conversion module.
9. The packaging method according to claim 8, wherein the step 4 is further performed before the step of performing double-sided thinning on the plastic-packaged product by a thinning machine, so as to expose the magnetic component (5).
10. The packaging method of claim 8, wherein the first copper layer has a thickness of 10um, the second copper layer has a thickness of 100um, the nickel layer has a thickness of 2.5um, and the gold layer has a thickness of 0.05um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310156624.1A CN116013903A (en) | 2023-02-23 | 2023-02-23 | Power conversion module packaging structure and method with electromagnetic shielding and high heat conducting performance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310156624.1A CN116013903A (en) | 2023-02-23 | 2023-02-23 | Power conversion module packaging structure and method with electromagnetic shielding and high heat conducting performance |
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| Publication Number | Publication Date |
|---|---|
| CN116013903A true CN116013903A (en) | 2023-04-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310156624.1A Pending CN116013903A (en) | 2023-02-23 | 2023-02-23 | Power conversion module packaging structure and method with electromagnetic shielding and high heat conducting performance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116013903A (en) |
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- 2023-02-23 CN CN202310156624.1A patent/CN116013903A/en active Pending
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Effective date of registration: 20230606 Address after: 201306 building C, No. 888, Huanhu West 2nd Road, Lingang New District, China (Shanghai) pilot Free Trade Zone, Pudong New Area, Shanghai Applicant after: SHANGHAI JIERUIZHAO NEW INFORMATION TECHNOLOGY CO.,LTD. Address before: 222061 No.18, Shenghu Road, Haizhou District, Lianyungang City, Jiangsu Province Applicant before: LIANYUNGANG JIERUI ELECTRONIC Co.,Ltd. |