CN116013827A - Welding spot enhanced lead bonding equipment - Google Patents

Abstract

The invention discloses welding spot enhanced lead bonding equipment, which comprises a welding wire, dispensing and a laser station, wherein the welding wire machine also comprises a feeding mechanism; the feeding mechanism comprises a solenoid, an upper sucker, a lower sucker, an upper clamping arm and a lower clamping arm, wherein the upper sucker and the lower sucker are respectively arranged below the solenoid, and meanwhile, the upper clamping arm and the lower clamping arm are arranged on one side of the solenoid; the upper sucker and the lower sucker respectively drive the upper clamping arm and the lower clamping arm to clamp and convey materials, so that the materials can be conveyed accurately; the upper clamping arm is provided with an upper clamping jaw, the lower clamping arm is provided with a corresponding lower clamping jaw, and the upper clamping jaw corresponds to the lower clamping jaw so as to form clamping-shaped structural characteristics, and the clamping of materials is facilitated. The invention realizes the full-automatic assembly line operation of feeding, welding wires, dispensing and laser, simplifies the equipment structure, reduces the external dimension of the equipment, reduces the material cost of the equipment and greatly improves the production efficiency.

Description

Welding spot enhanced lead bonding equipment

Technical Field

The invention belongs to the technical field of semiconductor welding equipment, and particularly relates to welding spot enhanced lead bonding equipment for lead bonding.

Background

The bonding process of the wire bonding machine can be divided into a gold wire ball wire bonding machine and an aluminum wire bonding machine, wherein the gold wire is gold wire, copper wire, silver wire or alloy wire; the method is mainly applied to internal lead welding of high-power devices, diodes (LEDs), laser tubes (lasers), medium and small power triodes, integrated circuits and some special semiconductor devices.

The utility model discloses a bang-hair bonding wire mechanism of patent application 202210426129.3, including the chassis, be provided with platform and bonding wire device including the chassis top, the platform bottom surface flushes with bonding wire device bottom surface, and platform tip corresponds the setting with bonding wire device medial surface, the platform top is provided with the tray, the shell of tray top installation corresponds the matching with the positioner of bonding wire device. The 2D vision positioning accuracy of the camera is utilized, the data of pictures, such as identification accuracy, of each different welding piece is not high, and the welding pieces are contained and positioned by the tray, so that the automatic production is not facilitated.

As another example, patent application 202211043932.5 discloses an automatic resistor clamping and feeding device of an automatic LED wire welding machine, which comprises a driving box, a lower rack and an upper rack are connected in the driving box in a sliding manner, a gear which is meshed with the lower rack and the upper rack is also connected in the driving box in a rotating manner, a lower clamping plate is fixedly connected to the lower rack, an upper clamping plate is fixedly connected to the side wall of the upper rack, a V-shaped groove is formed in the lower end of the upper clamping plate, and the V-shaped plate is arranged in the V-shaped groove in a sliding manner, and a transverse moving groove is formed in the inner wall of the V-shaped groove. In this patent application, when the V-shaped deformation and the V-shaped groove are clamped, the pushing mechanism makes the horizontal rod enter the lifting groove, however, the specific V-shaped deformation and V-shaped groove structure makes the application limited, and the application is not well applicable to the welding production of most semiconductor devices.

In a word, current automation equipment carries out the material through conveyer belt or rack basically, leads to the material to carry the position and is difficult to accurate measurement, needs auxiliary device to fix a position, influences machining efficiency, has increased processing cost.

Disclosure of Invention

Therefore, the invention aims to provide the welding spot enhanced wire bonding equipment, which is used for feeding materials in a clamping manner, is convenient for accurate feeding of the materials, realizes full-automatic assembly line operation, and reduces manpower and material resources on the basis of meeting the material welding reliability process.

Another object of the present invention is to provide a solder joint enhanced wire bonding apparatus, which simplifies the structure of the apparatus, reduces the external dimensions of the apparatus, reduces the material cost of the apparatus, and greatly improves the production efficiency.

In order to achieve the above purpose, the technical scheme of the invention is as follows:

the welding spot enhanced lead bonding equipment comprises a welding wire, dispensing and a laser station, and is characterized by further comprising a feeding mechanism;

the feeding mechanism comprises a solenoid, an upper sucker, a lower sucker, an upper clamping arm and a lower clamping arm, wherein the upper sucker and the lower sucker are respectively arranged below the solenoid, and meanwhile, the upper clamping arm and the lower clamping arm are arranged on one side of the solenoid; the upper sucker and the lower sucker respectively drive the upper clamping arm and the lower clamping arm to clamp and convey materials, so that the materials can be conveyed accurately;

the upper clamping arm is provided with an upper clamping jaw, the lower clamping arm is provided with a corresponding lower clamping jaw, and the upper clamping jaw corresponds to the lower clamping jaw so as to form clamping-shaped structural characteristics, and the clamping of materials is facilitated.

Further, the upper or lower jaw has a protruding downwardly projecting gripping surface.

Furthermore, the clamping surface is provided with convex points and wavy contact surfaces so as to be convenient for stably clamping materials.

After the clamping is carried out to a specific position, the solenoid is powered off, the upper sucker and the lower sucker do not have suction, so that the upper clamping arm and the lower clamping arm are loosened, and the clamping of materials is released;

the lower suction cup has a return spring thereon to return when the solenoid is de-energized.

Further, bearing tables are arranged in the wire bonding station, the dispensing station and the laser station to bear materials for processing.

Still further, the plummer is including clamp plate, clamp plate arm, support frame and cam bearing, the clamp plate is used for placing the material of waiting to process, and the clamp plate both sides are supported the clamp plate through the clamp plate arm, the clamp plate arm is supported by the support frame again, is provided with the cam bearing in the bottom of support frame simultaneously to adjust the position of plummer.

Further, the welding wire station comprises a base, a bonding head structure, a transverse driving device and a longitudinal driving device; wherein:

the transverse driving device comprises a transverse guide rail and a transverse motor positioned at the bottom of the head structure, the longitudinal driving device comprises a longitudinal guide rail and a longitudinal motor positioned at the rear end of the head structure, the head structure is connected with a longitudinal motor rotor in a sliding manner through the transverse guide rail, the head structure is connected with the transverse motor rotor in a sliding manner through the longitudinal guide rail, and the transverse motor and the longitudinal motor are both arranged on the top surface of the base and are both in driving connection with the head structure.

Further, the front ends of the two side parts of the base are respectively provided with a cooling fan for cooling the transverse motor, and the rear end part of the base is provided with a cooling fan for cooling the longitudinal motor.

Further, the base is of a T-shaped structure, the top surface of the wing part of the base is hollowed, a transverse motor is arranged in the hollowed-out part, the top of the rotor of the transverse motor is provided with a bonding head structure, and the longitudinal motor is correspondingly arranged on the top surface of the abdomen of the base.

Still further, the banquet head structure comprises a movable seat and a banquet head main body, the front end of the movable seat is provided with the banquet head main body, the front end of the banquet head main body is provided with a transducer and a wire clamp, the wire clamp is positioned above the transducer, the front end of the transducer is provided with a chopper, and the movable seat is also provided with a voice coil motor for driving the banquet head main body to rotate in the vertical direction so as to change the height position of the chopper;

the voice coil motor comprises a rotor with a coil inside and a stator with magnets inside; the two stators are correspondingly connected with the rear end of the upper main body, and are correspondingly positioned at two sides of the mover; the stator is provided with an air pipe joint for cooling the rotor.

Still further, the banquet structure still includes the shell fragment subassembly, the active cell passes through the shell fragment subassembly with banquet main part rear end and corresponds to be connected, the shell fragment subassembly includes two shell fragments, and two shell fragment different surfaces are perpendicular. The spring plate assemblies are arranged in two and are respectively positioned at two sides of the front end of the rotor.

Still further, the banquet head structure still includes the mount pad, the mount pad rigid coupling is in movable seat top, and is located the fastener top, the vision subassembly that imaging focus is located the product department of waiting to weld is installed at the mount pad top, the mount pad front end corresponds the position that is located the top side of the riving knife and deviates to one side and is equipped with the side light source that waits to weld the product and throw light on.

Still further, the vision component is typically implemented by an industrial camera, and the mount is provided with an optical channel coaxial with the industrial camera detection end at a position corresponding to the industrial camera detection end.

The main functions realized by the equipment are wire bonding, dispensing and laser. The whole operation process is that the feeding mechanism sends the material to a working area of a welding line station, the material is identified through the optical mechanism, and the welding line process is carried out on the material according to a program which is programmed in advance. After the wire bonding process is finished, the material is sent to a second working area of the dispensing station by the feeding mechanism, the gold wire welded at the wire bonding station by the material is identified by the optical mechanism, and the dispensing valve is moved to the position above the two welding points by the moving assembly to perform the dispensing process.

After the dispensing process is finished, the material is sent to the working area of the vibrating mirror laser module by the feeding mechanism, the glue dispensed by the material above the gold wire two-welding at the dispensing station is identified through the vibrating mirror laser optical mechanism, and the vibrating mirror laser emits laser beams to irradiate the glue, so that the glue is heated and cured.

Therefore, compared with the prior art, the invention has the beneficial effects that:

the invention realizes the full-automatic assembly line operation of feeding, welding lines, dispensing and laser, reduces manpower and material resources on the basis of meeting the material welding reliability process, simplifies the equipment structure, reduces the outline dimension of the equipment, reduces the material cost of the equipment and greatly improves the production efficiency.

Drawings

Fig. 1 is a front view of an implementation of the present invention.

Fig. 2 is a top view of an implementation of the present invention.

Fig. 3 is an exploded view of a feed mechanism embodying the present invention.

Fig. 4 is a schematic view of the structure of the upper jaw embodying the present invention.

Fig. 5 is a schematic view of a structure of a carrying platform according to the present invention.

Fig. 6 is a schematic structural diagram of a bonding wire structure provided by the present invention.

Fig. 7 is an assembly schematic diagram of the bond head body and voice coil motor provided by the present invention.

Fig. 8 is an exploded view of the bond head body and voice coil motor provided by the present invention.

Detailed Description

The present invention will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present invention more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.

In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", "transverse", "longitudinal", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention.

Fig. 1 and 2 show a welding spot enhanced wire bonding device, which is implemented by the present invention, and includes a wire bonding station 100, a dispensing station 200, and a laser station 300, and a feeding mechanism 400 is further disposed between the stations; the feeding mechanism 400 is used for conveying materials to realize functions of bonding wires (ultrasonic hot-press welding), dispensing and laser.

The bonding wire station 100, the dispensing station 200 and the laser station 300 are all horizontally arranged on the workbench so as to sequentially realize flow operation, and the bearing platforms 500 are arranged in the bonding wire station 100, the dispensing station 200 and the laser station 300 so as to bear materials for processing.

The wire bonding station 100, the dispensing station 200, and the laser station 300 may be implemented by the prior art, so the detailed structures of the above stations are not described herein. Only with the core of the invention: feeding mechanism 400, carrier 500 and wire bonding configuration are described in the following.

Specifically, as shown in fig. 3 and 4, the feeding mechanism 400 includes a solenoid 402, an upper suction cup 401, a lower suction cup 404, an upper clamping arm 405 and a lower clamping arm 406, wherein the upper suction cup 401 and the lower suction cup 404 are respectively disposed above and below the solenoid 402, and meanwhile, the upper clamping arm 405 and the lower clamping arm 406 are disposed at one side of the solenoid 402; the upper sucker 401 and the lower sucker 404 respectively drive the upper clamping arm 405 and the lower clamping arm 406 to clamp and convey materials, so that the materials can be conveyed accurately;

the upper clamping arm 405 is provided with an upper clamping jaw 408, the lower clamping arm 406 is provided with a corresponding lower clamping jaw 409, and the upper clamping jaw 408 corresponds to the lower clamping jaw 409 to form a clamping-shaped structure, so that materials can be conveniently clamped.

A solenoid housing 403 is provided outside the solenoid 402 to protect and mount the solenoid 402, and a mounting bracket 410 is provided outside the solenoid housing 403, and an upper clip arm 405 and a lower clip arm 406 are assembled by the mounting bracket 410.

As shown in connection with fig. 4, the front end of the upper jaw 408 has a protruding downwardly projecting gripping surface 412, while said gripping surface 412 has a wave-shaped contact surface 413 (which may also be realized by means of bumps) for a stable gripping of the material.

In this way, after the feeding mechanism 400 is clamped to a specific position, the solenoid 402 is powered off, the upper sucker 401 and the lower sucker 404 do not have suction any more, so that the upper clamping arm 405 and the lower clamping arm 406 are loosened, and the clamping of the materials is released, so that the welding lines, dispensing and laser processing of the materials can be conveniently performed.

The side wall of the lower suction cup 404 has a return spring 411 to return when the solenoid 402 is de-energized.

Referring to fig. 5, the carrying platform 500 includes a pressing plate 501, a pressing plate arm 502, a supporting frame 503 and a cam bearing 504, wherein the pressing plate 501 is used for placing a material to be processed, the pressing plate arms 502 are arranged at two sides of the pressing plate 501, and the pressing plate arms 502 support the pressing plate 501 from the side surface of the pressing plate 501; the bottom of the pressing plate arm 502 is provided with a supporting frame 503, and the pressing plate arm 502 is supported by the supporting frame 503; at the same time, a cam bearing 504 is arranged at the bottom of the supporting frame 503, and the position of the bearing table 500 can be adjusted through the cam bearing 504.

As shown in fig. 6, the bonding wire structure realized by the invention comprises a base 1, a bonding head structure 2, a transverse driving device 3 and a longitudinal driving device 4; wherein,,

the transverse driving device 3 comprises a transverse guide rail 31 and a transverse motor 32 positioned at the bottom of the head structure 2, the longitudinal driving device 4 comprises a longitudinal guide rail 41 and a longitudinal motor 42 positioned at the rear end of the head structure 2, the head structure 2 is slidably connected with a rotor of the longitudinal motor 42 through the transverse guide rail 31, the head structure 2 is slidably connected with the rotor of the transverse motor 32 through the longitudinal guide rail 41, and the transverse motor 32 and the longitudinal motor 42 are both arranged on the top surface of the base 1 and are both in driving connection with the head structure 2.

In use, the longitudinal guide rail 41 can be driven to move transversely by the transverse movement of the mover of the transverse motor 32, the longitudinal guide rail 41 drives the head bonding structure 2 to move transversely, so that the head bonding structure 2 is movably matched with the transverse guide rail 31; the transverse guide rail 31 can be driven to transversely move by the longitudinal movement of the mover of the longitudinal motor 42, and the transverse guide rail 31 drives the head structure 2 to longitudinally move, so that the head structure 2 is movably matched with the longitudinal guide rail 41

Specifically, the base 1 is of a T-shaped structure, the top surface of the wing part of the base 1 is hollowed out, a transverse motor 32 is arranged in the hollowed-out part, the top of a rotor of the transverse motor 32 is provided with a bonding head structure 2, and a longitudinal motor 42 is correspondingly arranged on the top surface of the abdomen of the base 1.

When the transverse motor 32 drives the bonding head structure 2 to transversely move, the longitudinal motor 42 does not transversely move, and when the longitudinal motor 42 drives the bonding head structure 2 to longitudinally move, the transverse motor 32 does not longitudinally move, so that the technical problem that in the prior art, two driving devices are mutually independent, a driving motor rotor in one driving device needs to transversely move along with the bonding head structure body, and further the driving motor stator needs to transversely move with a larger width for the driving motor rotor is solved, and the whole device is larger in size is solved.

In some embodiments, the transverse motor 32 and the longitudinal motor 42 may also be linear motors, where the stators of the transverse motor 32 and the longitudinal motor 42 correspond to rails, and the movers of the transverse motor 32 and the longitudinal motor 42 correspond to motor bodies moving along the corresponding rails, where the rails may be fixedly mounted on the base 1, which is not described in detail herein.

In order to ensure the working environment temperature of the transverse motor 32 and the longitudinal motor 42, the front ends of the two side parts of the base 1 are respectively provided with a cooling fan 5 for cooling the transverse motor 32, the rear end part of the base 1 is provided with a cooling fan 5 for cooling the longitudinal motor 42, and the positions of the base 1, corresponding to the positions of the cooling fan 5 and the transverse motor 32 and the longitudinal motor 42, are provided with ventilation structures according to requirements; when in use, the air flow generated by the cooling fan 5 is blown to the transverse motor 32 and the longitudinal motor 42 through the ventilation structure, so that the cooling efficiency of the transverse motor 32 and the longitudinal motor 42 is improved.

The longitudinal motor 42 and the hollowed-out position on the top surface of the base 1 are provided with a cover body, and the outer end surface and the top surface of the cover body are provided with cooling fans 5.

The transverse motor 32 and the longitudinal motor 42 may be implemented by voice coil motors, but the above implementation manner of the present invention makes the mover of the longitudinal motor 42 not need to move transversely, so that the width of the stator of the longitudinal motor 42 may be reduced, and thus the width of the longitudinal driving device 4 may be reduced, without considering the space that the mover of the longitudinal motor 42 needs to move transversely in the prior art, and without considering the magnetic field change where the mover of the longitudinal motor 42 is located after the mover of the longitudinal motor 42 moves transversely.

And the stators of the transverse motor 32 and the longitudinal motor 42 are respectively provided with a cooling fan 5 for cooling the movers of the transverse motor 32 and the longitudinal motor 42.

In order to improve the moving precision of the head structure 2, the positions of the mover of the transverse motor 32 corresponding to the two sides of the head structure 2 are provided with longitudinal guide rails 41, that is, two longitudinal guide rails 41 are arranged in parallel at intervals, and the head structure 2 ensures the moving precision of the head structure through the combined action of the two longitudinal guide rails 41;

specifically, the top of the rotor of the transverse motor 32 is provided with a sliding plate, and two sides of the sliding plate are respectively provided with a longitudinal guide rail 41 longitudinally connected with the bonding head structure 2 in a sliding manner, so that the longitudinal guide rails 41 can be better installed and fixed.

In order to further improve the moving precision of the bonding head structure 2, the base 1 is provided with a guide structure which is parallel to the transverse guide rail 31 at intervals, so that the bonding head structure 2 is transversely matched with the base 1 in a sliding way along the base 1 through the guide structure; to further improve the accuracy of movement of the banquet structure 2, cross roller guides are used for both the transverse guide 31 and the longitudinal guide 41, as required.

7-8, the bonding head structure 2 comprises a movable seat 21 and a bonding head main body 22, the bonding head main body 22 is arranged at the front end of the movable seat 21, a transducer 23 and a wire clamp 24 are arranged at the front end of the bonding head main body 22, the wire clamp 24 is positioned above the transducer 23, a chopper 25 is arranged at the front end of the transducer 23, a voice coil motor 26 is further arranged on the movable seat 21, and the voice coil motor 26 is used for driving the bonding head main body 22 to rotate in the vertical direction so as to drive the chopper 25 to rotate in the vertical direction, so that the height position of the chopper 25 is changed.

The voice coil motor 26 includes a mover 261 having a coil inside and a stator 262 having magnets inside; the two stators 262 are correspondingly arranged at the two sides of the rotor 261; the stator 262 is provided with an air pipe connector 263 for cooling the rotor 261, and specifically, the air pipe connector 263 is connected with an air source.

As shown in fig. 7-8, the bonding head structure 2 further includes a spring assembly 27, the mover 261 is correspondingly connected with the rear end of the bonding head main body 22 through the spring assembly 27, the spring assembly 27 includes two spring plates, and the different surfaces of the two spring plates are vertical; specifically, one of the two elastic sheets is vertically arranged, and the other elastic sheet is horizontally arranged; at this time, the rotation center axis of the bonding head main body 22 is collinear with the corresponding intersecting line of the two elastic sheets.

The two spring plate assemblies 27 are respectively located at two sides of the front end of the rotor 261, and specifically, intersecting lines in the two spring plate assemblies 27 are collinear.

In order to ensure the accuracy of the welding position of the welding wire structure, the bonding head structure 2 further comprises a mounting seat 28, the mounting seat 28 is fixedly connected to the top of the movable seat 21 and is positioned above the wire clamp 24, a visual assembly 29 with an imaging focus positioned at the product to be welded is mounted on the top of the mounting seat 28, and a side light source 210 for illuminating the product to be welded is arranged at the front end of the mounting seat 28 corresponding to the position above the riving knife 25 and deviated to one side.

During the use, can throw light on through side light source 210 treating the welded product, guarantee that vision subassembly 29 can be treated the clearer real-time shooting of welded product and image, then will shoot the product position of formation of image and compare with the riving knife 25 position to can adjust bang first structure 2 through control transverse motor 32 or vertical motor 42, in order to do benefit to improvement bonding wire quality.

The vision component 29 comprises an industrial camera, and an optical channel coaxial with the industrial camera detection end is arranged at a position of the mounting seat 28 corresponding to the industrial camera detection end; the industrial camera detection end is horizontally arranged, the front end of the optical channel is provided with a downward bent angle, and a 45-degree reflecting mirror is arranged at the corner of the optical channel, so that the imaging focus of the industrial camera is ensured to be positioned on a product to be welded.

The main functions realized by the equipment are wire bonding, dispensing and laser. The whole operation process is that the feeding mechanism sends the material to a working area of a welding line station, the material is identified through the optical mechanism, and the welding line process is carried out on the material according to a program which is programmed in advance. After the wire bonding process is finished, the material is sent to a second working area of the dispensing station by the feeding mechanism, the gold wire welded at the wire bonding station by the material is identified by the optical mechanism, and the dispensing valve is moved to the position above the two welding points by the moving assembly to perform the dispensing process.

After the dispensing process is finished, the material is sent to the working area of the vibrating mirror laser module by the feeding mechanism, the glue dispensed by the material above the gold wire two-welding at the dispensing station is identified through the vibrating mirror laser optical mechanism, and the vibrating mirror laser emits laser beams to irradiate the glue, so that the glue is heated and cured.

And dispensing, namely dispensing by using a dispensing machine, allowing the dispensing head to move above a fixed material when the dispensing head moves in X, Y and Z axes, and applying the adhesive to the material in a small-point manner.

To ensure the quality of the bond point production, the press plate must ensure that the material is in the locked position and is held absolutely parallel to the X, Y axis.

The laser irradiates the colloid mainly through laser beam to heat and solidify the colloid. Firstly, identifying materials by a galvanometer laser optical mechanism, wherein the identified objects are glue which is dispensed above a gold wire second weld at a glue dispensing station, and then radiating laser beams on the glue by a galvanometer laser to heat and solidify the glue.

Note that: wherein, the welding wire adopts the conventional welding wire technology, the welding wire is commonly used in wire specification size of 0.7-1.7 mil, the normal width of the fish tail is 2.5-4 times of the wire diameter, and the specification size range of the ball is 2.5-4 times of the wire diameter. The trace of bonding cannot be less than 2/3 of the bonding area and there cannot be a dummy solder joint and a desoldering.

The reliability tension of the two-welding of the wire rod of 1.7mil in the current semiconductor wire welding machine field is generally about 8g, the current reinforcement technology generally uses firstly adding balls or later adding balls, the reliability thrust of the two-welding can reach 80g, but the two-welding reliability tension can not meet the requirements in the field with higher reliability requirements.

Aiming at the situation that the reliability thrust of the two-welding in the current market is insufficient, the invention adopts a dispensing process with higher reliability, directly covers the colloid on the surface of the two-welding precisely, so that the colloid and the bonding pad are bonded together, and after the colloid is solidified, the connectivity of the two-welding can be greatly improved, so as to meet the requirement of higher reliability.

After the dispensing process is added, another problem is that the curing time of the glue is longer and the working procedure is complicated. The current common mode is baking, sintering and curing, the temperature of sintering and curing the silver colloid is generally 150 ℃, and the baking and sintering time is 2 hours. Can be adjusted to 170 ℃ for 1 hour according to the actual conditions. The insulating glue is typically at 150℃for 1 hour. This requires a new baking section to cure the gel, which increases both the length of time and the effort and resources.

Aiming at the problems of long colloid curing time and newly increased manpower and material resources, the invention realizes a full-automatic and novel colloid curing process. The method adopts the laser curing mode, and the laser generator emits laser beams to cure the colloid, so that the time is only about 300ms, the problem of long colloid curing time is solved, and the problem of manpower and material resources newly added in baking and curing is also solved.

In summary, the full-automatic assembly line operation of welding lines, dispensing and laser is realized by utilizing the feeding mechanism, manpower and material resources are reduced on the basis of meeting the material welding reliability process, and meanwhile, the design structure simplifies the equipment structure, reduces the outline dimension of the equipment, reduces the material cost of the equipment and greatly improves the production efficiency.

The foregoing description of the preferred embodiments of the invention is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the invention.

Claims (10)

1. The welding spot enhanced lead bonding equipment comprises a welding wire, dispensing and a laser station, and is characterized by further comprising a feeding mechanism;

the feeding mechanism comprises a solenoid, an upper sucker, a lower sucker, an upper clamping arm and a lower clamping arm, wherein the upper sucker and the lower sucker are respectively arranged below the solenoid, and meanwhile, the upper clamping arm and the lower clamping arm are arranged on one side of the solenoid; the upper sucker and the lower sucker respectively drive the upper clamping arm and the lower clamping arm to clamp and convey materials;

the upper clamping arm is provided with an upper clamping jaw, the lower clamping arm is provided with a corresponding lower clamping jaw, and the upper clamping jaw corresponds to the lower clamping jaw so as to clamp materials conveniently.

2. The solder joint enhanced wire bonding apparatus of claim 1 wherein either the upper jaw or the lower jaw has a protruding downwardly projecting clamping surface.

3. The solder joint enhanced wire bonding apparatus of claim 2 wherein said clamping surface has a bump, wave-shaped contact surface for facilitating stable clamping of the material.

4. The solder joint enhanced wire bonding apparatus of claim 1 wherein the lower suction cup has a return spring thereon for resetting when the solenoid is de-energized.

5. The solder joint enhancement mode wire bonding apparatus of claim 1, wherein a carrier is provided in each of the wire bonding station, the dispensing station, and the laser station to carry material for processing.

6. The apparatus of claim 5 wherein the carrier comprises a platen, platen arms, a support frame and cam bearings, wherein the platen is configured to hold a material to be processed, the platen arms are configured to support the platen on opposite sides of the platen, the platen arms are supported by the support frame, and cam bearings are disposed at the bottom of the support frame to adjust the position of the carrier.

7. The solder joint enhancement mode wire bonding apparatus of claim 1, wherein the wire bonding station comprises a base, a bonding head structure, and lateral and longitudinal drive means; wherein:

the transverse driving device comprises a transverse guide rail and a transverse motor positioned at the bottom of the head structure, the longitudinal driving device comprises a longitudinal guide rail and a longitudinal motor positioned at the rear end of the head structure, the head structure is connected with a rotor of the longitudinal motor in a sliding manner through the transverse guide rail, the head structure is connected with the rotor of the transverse motor in a sliding manner through the longitudinal guide rail, and the transverse motor and the longitudinal motor are both arranged on the top surface of the base and are both in driving connection with the head structure.

8. The welding point enhanced type wire bonding apparatus according to claim 7, wherein the front ends of both side portions of the base are provided with a heat radiation fan for radiating heat from the transverse motor, and the rear end portion of the base is provided with a heat radiation fan for radiating heat from the longitudinal motor;

the base is of a T-shaped structure, the top surface of the wing part of the base is hollowed, a transverse motor is arranged in the hollowed-out part, the top of the rotor of the transverse motor is provided with a bonding head structure, and the longitudinal motor is correspondingly arranged on the top surface of the abdomen of the base.

9. The welding spot enhanced type lead bonding equipment according to claim 8, wherein the bonding head structure comprises a movable seat and a bonding head main body, the front end of the movable seat is provided with the bonding head main body, the front end of the bonding head main body is provided with a transducer and a wire clamp, the wire clamp is positioned above the transducer, the front end of the transducer is provided with a chopper, and the movable seat is also provided with a voice coil motor for driving the bonding head main body to rotate in the vertical direction so as to change the height position of the chopper;

the voice coil motor comprises a rotor with a coil inside and a stator with magnets inside; the two stators are correspondingly connected with the rear end of the upper main body, and are correspondingly positioned at two sides of the mover; the stator is provided with an air pipe joint for cooling the rotor.

10. The welding point enhanced lead bonding device according to claim 9, wherein the bonding head structure further comprises a spring plate assembly, the mover is correspondingly connected with the rear end of the bonding head main body through the spring plate assembly, the spring plate assembly comprises two spring plates, and the different surfaces of the two spring plates are vertical; the spring plate assemblies are arranged in two and are respectively positioned at two sides of the front end of the rotor.

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