CN116011396A - Method and device for building component simulation data and electronic equipment - Google Patents
Method and device for building component simulation data and electronic equipment Download PDFInfo
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Abstract
The application relates to the technical field of electronic elements, in particular to a method and a device for building component simulation data and electronic equipment. The method for building the component simulation data comprises the steps of obtaining a standard encapsulation database; acquiring a standard encapsulation search application programming interface according to the standard encapsulation database; acquiring packaging related data of the components; and acquiring the association relation between the package related data and the simulated graphic data in the standard package database according to the package related data of the component and the standard package search application programming interface. The method utilizes the corresponding relation between the components and the standard packaging data, corresponds the components with the analog data associated with the standard packaging, corresponds the analog data with a huge number of various components one by one, matches the application programming interface to search and match the packaging item value, facilitates manufacturability analysis of PCBA before production and manufacture, and solves or improves the problem of massive loss of the analog data of the components at present.
Description
Technical Field
The application relates to the technical field of electronic elements, in particular to a method and a device for building component simulation data and electronic equipment.
Background
With the development of society, people's life is more and more closely related to electronic products. Among them, the PCB (Printed Circuit Board, chinese name printed circuit board, also called printed circuit board) is an important component of the electronic product, which is closely related to whether the function of the electronic product is implemented or not. The production of the PCB and the PCBA (Printed Circuit Board Assembly, that is, the whole process of the empty PCB passing through the SMT or the DIP plug-in, the PCBA) involve very complex processes and technologies, and once the final product is not qualified, more effort is required to modify the final product, and even the scrapping may occur, which wastes resources and manpower. Therefore, it is necessary to perform manufacturability analysis of the production file of the PCB.
The existing analysis mode generally uses a 3D simulation technology, and the technology can be used for checking production files of the PCB in advance and detecting defects and anomalies in the PCB production files in advance.
In the practical application process, the number of components is tens of millions, and the number of components is increased day by day, and the related data of EMA (Electronic manufacturing automation, electrical production automation) of the components cannot be matched with the actual number in time due to difficult maintenance and massive loss, which results in that some components lack corresponding data of a model in detection, and influences the project comprehensiveness, detection integrity and system safety of the PCB manufacturability analysis.
Disclosure of Invention
In view of this, the present application provides a method, an apparatus and an electronic device for building component simulation data, which solve or improve the technical problem that in the prior art, the number of components is huge, but the corresponding data of the three-dimensional simulation model cannot be updated in real time, which affects the manufacturable analysis progress of the PCBA.
According to a first aspect of the present application, there is provided a method of building component simulation data, the method of building component simulation data comprising: obtaining a standard encapsulation database; acquiring a standard encapsulation search application programming interface according to the standard encapsulation database; acquiring packaging related data of the components; and acquiring the association relation between the package related data and the simulated graph data in the standard package database according to the package related data of the component and the standard package search application programming interface.
In one possible implementation manner, the obtaining, according to the package related data of the component and the standard package search application programming interface, an association relationship between the package related data and the analog graphic data in the standard package database includes: obtaining a standard packaging item value according to the packaging related data; obtaining the score of the standard packaging item value according to the standard packaging item value and a preset scoring rule; acquiring a hit package item value and hit package related data according to the score; and acquiring the simulated graph data corresponding to the hit package related data according to the hit package item value, the hit package related data and the standard package search application programming interface.
In a possible implementation manner, the obtaining the score of the standard packaging item value according to the standard packaging item value and a preset scoring rule includes: obtaining the item value type of the standard encapsulation item value; according to the item value type, obtaining a preset score of the standard packaging item value; and obtaining the score of the standard packaging item value according to the standard packaging item value and the preset score.
In one possible implementation manner, the item value type includes a padding item, a filtering item and an optional item, and the obtaining the preset score of the standard encapsulation item value according to the item value type includes: when the standard packaging item value in the packaging related data comprises a mandatory filling item value, acquiring a preset score of the standard packaging item value; or when the standard package item value in the package-related data does not include a fill item value, not scoring the package-related data; and/or when the standard package item value in the package-related data includes a filter item value, the standard package item value is increased by a first preset score; and/or when the standard package item value in the package-related data includes a bonus item value, the standard package item value is increased by a second preset score.
In one possible implementation manner, the obtaining the hit package item value and the hit package related data according to the score includes: and when the score is greater than or equal to a preset score threshold, the standard package item value is the hit package item value, and the package related data is the hit package related data.
In one possible implementation manner, the obtaining a standard package item value according to the package related data includes: acquiring an initial package item value according to the package related data; and removing invalid symbols and/or unifying formats and/or splitting keywords of the initial package item value to obtain a standard package item value.
In one possible implementation manner, the obtaining a standard package search application programming interface according to the standard package database includes: obtaining standard packaging information according to the standard packaging database; acquiring the association relation between the standard encapsulation information and the simulated graphic data; and acquiring the standard encapsulation search application programming interface according to the association relation between the standard encapsulation information and the simulated graphic data.
In one possible implementation, the simulated graphics data includes three-dimensional model data and/or vector data of pads.
According to a second aspect of the present application, there is also provided an apparatus for building component simulation data, the apparatus for building component simulation data comprising: the standard encapsulation database acquisition module is used for acquiring a standard encapsulation database; the standard encapsulation search application programming interface module is used for acquiring a standard encapsulation search application programming interface according to the standard encapsulation database; the package related data acquisition module is used for acquiring package related data of the components; and the association relation acquisition module is used for acquiring the association relation between the package related data and the simulated graphic data in the standard package database according to the package related data of the component and the standard package search application programming interface.
According to a third aspect of the present application, there is also provided an electronic device, comprising: a processor; and a memory for storing the processor-executable information; the processor is configured to execute the method for building component simulation data according to any one of the above.
The application provides a method and device for building component simulation data and electronic equipment. The method for building the component simulation data comprises the following steps: obtaining a standard encapsulation database; acquiring a standard encapsulation search application programming interface according to the standard encapsulation database; acquiring packaging related data of the components; and acquiring the association relation between the package related data and the simulated graphic data in the standard package database according to the package related data of the component and the standard package search application programming interface. The method for building the simulation data of the components utilizes the corresponding relation between the components and the standard packaging data, corresponds the components to the simulation data related to the standard packaging, and realizes the purpose of one-to-one correspondence between the simulation data and a huge number of various components by taking the standard packaging library as a medium through building a search API interface on the standard packaging library. Meanwhile, the package item value is searched and matched by matching with an application programming interface, so that manufacturability analysis of PCBA before production and manufacture is facilitated, the problem of massive missing of simulation data of the existing components is solved or improved, and the possibility is brought for comprehensive, complete and safe detection targets of the manufacturability analysis.
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Fig. 1 is a flow chart of a method for building component simulation data according to an embodiment of the present application.
Fig. 2 is a flow chart of a method for building component simulation data according to another embodiment of the present application.
Fig. 3 is a flowchart illustrating a method for obtaining a standard package item value scoring method in a method for building component simulation data according to another embodiment of the present application.
Fig. 4 is a flowchart illustrating a method for obtaining a standard package item value scoring method in a method for building component simulation data according to another embodiment of the present application.
Fig. 5 is a flow chart of a method for building component simulation data according to another embodiment of the present application.
Fig. 6 is a flowchart illustrating a method for obtaining a standard package item value in a method for building component simulation data according to another embodiment of the present application.
Fig. 7 is a flowchart of a method for building component simulation data according to another embodiment of the present application.
Fig. 8 is a schematic diagram of an apparatus for building component simulation data according to an embodiment of the present application.
Fig. 9 is a schematic structural diagram of an electronic device according to an embodiment of the present application.
Detailed Description
In the description of the present application, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise. All directional indications (such as up, down, left, right, front, back, top, bottom … …) in the embodiments of the present application are merely used to explain the relative positional relationship, movement, etc. between the components in a particular gesture (as shown in the drawings), and if the particular gesture changes, the directional indication changes accordingly. Furthermore, the terms "comprise" and "have," as well as any variations thereof, are intended to cover a non-exclusive inclusion. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those listed steps or elements but may include other steps or elements not listed or inherent to such process, method, article, or apparatus.
Furthermore, references herein to "an embodiment" mean that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the present application. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of skill in the art will explicitly and implicitly appreciate that the embodiments described herein may be combined with other embodiments.
Summary of the application
Aiming at the problems that the quantity of components is huge and the corresponding data of a three-dimensional simulation model cannot be updated in real time and the manufacturable analysis progress of PCBA is affected in the background technology, the application provides a method and device for building component simulation data and electronic equipment.
The method for constructing the simulation data of the components comprises the following steps: obtaining a standard encapsulation database; acquiring a standard encapsulation search application programming interface according to the standard encapsulation database; acquiring packaging related data of the components; and acquiring the association relation between the package related data and the simulated graphic data in the standard package database according to the package related data of the component and the standard package search application programming interface. The method for building the simulation data of the components utilizes the corresponding relation between the components and the standard packaging data, corresponds the components to the simulation data related to the standard packaging, and realizes the purpose of one-to-one correspondence between the simulation data and a huge number of various components by taking the standard packaging library as a medium through building a search API interface on the standard packaging library. Meanwhile, the package item value is searched and matched by matching with an application programming interface, so that manufacturability analysis of PCBA before production and manufacture is facilitated, the problem of massive missing of simulation data of the existing components is solved or improved, and the possibility is brought for comprehensive, complete and safe detection targets of the manufacturability analysis.
The following description of the technical solutions in the embodiments of the present application will be made clearly and completely with reference to the drawings in the embodiments of the present application, and it is apparent that the described embodiments are only some embodiments of the present application, not all embodiments. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.
Fig. 1 is a flow chart of a method for building component simulation data according to an embodiment of the present application. As shown in fig. 1, the method for building the component simulation data specifically includes the following steps:
step 100: a standard encapsulation database is obtained.
The standard packaging database is a preset database comprising standard packaging related data, analog graphic data and corresponding or incidence relation between the standard packaging related data and the analog graphic data of the components, wherein the standard packaging related data can comprise package names, sizes, shapes, pin numbers and the like, and the analog graphic data can comprise a pad diagram, a pin diagram, a 3D model diagram and the like. The database can be a manually maintained text database such as Excel, and the included data can be written in manually, or can be written in automatically or manually after data collection by crawler software. It is easy to understand that in the construction and use process of the website of the electronic component, a large amount of packaging related data of the component can be involved in the website, and the two types of data are consolidated and maintained into a standard database together with other public data in the existing network, so that the existing huge database of the website can be effectively utilized, and the working links such as manufacturability analysis and the like can be better served.
Step 200: and acquiring a standard encapsulation search application programming interface according to the standard encapsulation database.
An application programming interface (Application Programming Interface, abbreviated as API) is "code for use in application calls" provided by the 'computer Operating system' or 'library'. The main purpose is to allow an application developer to invoke a set of routine functions without regard to why its underlying source code is, or to understand the details of its internal operating mechanisms. The index library is one of the modes of unified management of data, and can classify and process the multi-source heterogeneous logs to form related indexes. And combining the standard encapsulation database with a preset index rule to generate an index library for standard encapsulation search, generating a standard encapsulation search application programming interface by using the index library, further generating a search API capable of realizing a standard encapsulation search function by using the index library, and providing search matching service for subsequent query of standard encapsulation data of the component by a user, wherein the three-dimensional simulation graphic data of the component can be queried correspondingly by using the application programming interface if a plurality of encapsulation items of the component are input correspondingly in the search items.
Step 300: and acquiring package related data of the component.
The components, namely electronic components, are components of electronic elements and small-sized machines and instruments, are often composed of a plurality of parts, and can be commonly used in similar products; some parts of the industry such as electrical appliances, radios, meters and the like are commonly referred to as electronic devices such as capacitors, transistors, resistors, inductors and the like. The package is an appearance form of the electronic component, and the package specification item data refers to specification item data of such parameters in a plurality of specification items of the component. The package related data refers to package specification item data of a certain type of component, such as the pin number, pin pitch, length, width, height, shape and other specification items of the component. The package type specification item data is the most important reference data of the components in the PCB installation link, and the final associated simulation data is more accurate only by acquiring the package related data of the components and utilizing the standard package data to search the API program for matching.
Step 400: and acquiring the association relation between the package related data and the simulated graphic data in the standard package database according to the package related data of the component and the standard package search application programming interface.
The simulated graphic data refers to three-dimensional simulation model data of the PCBA, related vector data and the like, and is an important basis for manufacturability analysis of the PCBA. The method utilizes the corresponding relation between the existing components and the graphic data to correspond the components with the analog data associated with the standard package. By building a search API interface on the standard encapsulation database, the aim of one-to-one correspondence between analog data and a huge number of various components is fulfilled by taking the standard encapsulation database as a medium. The method solves or improves the problem of massive loss of simulation data of the prior components, and brings possibility to comprehensive, complete and safe detection targets realized by manufacturability analysis, thereby effectively improving the qualification rate of subsequent electronic product production and reducing the phenomenon of waste of manpower and material resources.
Optionally, as described above, the simulated graphics data includes three-dimensional model data and/or vector data of the pads. The three-dimensional model data are existing three-dimensional model data, bonding pad vector data and the like, and by the method provided by the application, the packaging related data of the components can be relatively and accurately related to the existing three-dimensional model data or bonding pad vector data and the like, and an application programming interface for searching standard packaging data can be formed. Therefore, when a user performs PCBA manufacturability analysis, three-dimensional simulation model data with high correlation degree can be obtained through the standard package data search service provided by the application programming interface, and the problems that the number of components is large but the number of simulation models is insufficient at present are solved.
In one possible implementation, fig. 2 is a flow chart of a method for building component simulation data according to another embodiment of the present application. As shown in fig. 2, step 400 may further include the steps of:
step 410: and acquiring a standard package item value according to the package related data.
The package item value is the specific package item content in the package related data, for example, the package related data of the component includes pin number, pin length, pin interval and the like, the three parameters are the package related data of the component, the pin number is one of the package item values of the component, and similarly, the pin length and the pin interval are the package item values of the component respectively. The standard package item value refers to the package item value after the format is unified or invalid character is cleared. After the extraction of the standard package item value of the package related data, the package item value is convenient to use when the application programming interface search is called.
Step 420: and obtaining the score of the standard packaging item value according to the standard packaging item value, the standard packaging search application programming interface and a preset scoring rule.
The preset grading rule is a grading rule preset by an administrator user, and the grading rule is used for grading the standard packaging item values of the components one by one and outputting the total grading of the packaging related data of the standard packaging item values after grading. Through the searching function of the standard package searching application programming interface, hit standard packages are searched, and the standard package item values are scored, whether package related data of the current component is matched with package data in a standard package database can be judged more accurately, and further the package related data of the component and simulation pattern data are related more effectively and reasonably, so that the accuracy of manufacturability analysis before PCBA production and manufacturing in the practical application process is improved.
It should be noted that, when setting the scores of the standard package item values, the administrator user may set the scores of the different standard package item values to be consistent according to the actual situation, or may set the scores of the different standard package item values to be inconsistent, and the specific score addition and subtraction situations and whether the scores are equal or not should depend on the types, the models and the usage scenarios of the components, which is not further limited in the application.
Step 430: and acquiring hit package item values and hit package related data according to the scores.
Hit package item values refer to standard package item values in the standard package item values that have a relatively high degree of match with those in the standard package database; similarly, the hit package related data refers to the package related data to which the hit package item value belongs. It is easy to understand that some component packaging related data acquired by the website can have some error data or invalid data, and the score of the data is often lower after the data is scored by a preset scoring rule, so that the error data or the invalid data can be removed by setting the lowest threshold value of the score and the like, and the reliability of the correlation between the component packaging related data and the simulation pattern data is further improved.
Step 440: and acquiring the analog graph data corresponding to the hit packaging related data according to the hit packaging item value and the hit packaging related data.
Through the scoring rule and scoring of the standard package item values, package related data with higher matching degree in a standard package database, namely hit package related data, can be screened out. The hit package related data is associated and corresponds to the existing analog graph data in the standard package database, so that the accuracy of the association and correspondence of the package related data of the components and the analog graph data can be effectively ensured, and the subsequent use accuracy of the index library is improved.
Specifically, in an embodiment, fig. 3 is a flow chart illustrating a method for obtaining a standard package item value scoring method in a method for building component simulation data according to another embodiment of the present application. As shown in fig. 3, step 420 may further include the steps of:
step 4201: the item value type of the standard package item value is obtained.
The item value type is a category to which the specific content of the standard package item value belongs, and the category can be preset for an administrator user, for example, a necessary item, an optional item and the like can be used as the category of the standard package item value. In addition, what kind of standard encapsulation item value belongs to what kind of classification, can all be set up in advance by administrator user after evaluating the importance level of this item value to components and parts according to the type and model of components and parts to this improves the rationality and the accuracy of grading.
Step 4202: and obtaining a preset score of the standard packaging item value according to the item value type.
The preset score is a score value corresponding to different types of item values. If the item value is a specification item of a package name and a package form, the specification item can be used as a necessary filling item, and because the importance degree is higher, an administrator user can set the score of the two items to be 3 points/item; while the specification items such as the pin count, the pin pitch, etc. are also important, the importance level is lower than the former two, and the administrator user can set the score of these two items to 1 min/item, and so on.
Step 4203: and obtaining the score of the standard packaging item value according to the standard packaging item value and the preset score.
After the setting of the scoring rule is completed, the standard packaging item value and the packaging related data can be scored according to each item value in the standard packaging item value, and thus the finally obtained score is more objective and reliable.
Optionally, fig. 4 is a flow chart illustrating a method for obtaining a standard package item value scoring method in a method for building component simulation data according to another embodiment of the present application. As shown in FIG. 4, the item value types described above may include, in particular, a fill item, a filter item, and selectable items. On this basis, step 4202 may include one or more of the following steps.
Step 42020: and when the standard encapsulation item value in the encapsulation related data comprises the necessary filling item value, acquiring a preset score of the standard encapsulation item value.
Step 42021: when the standard package item value in the package-related data does not include the mandatory item value, the package-related data is not scored.
The necessary filling item refers to the type of the item value which is necessary to be set, namely the essential item value of the foundation, and one or more standard packaging item values must hit the necessary filling item, when any necessary filling item is not hit in the standard packaging item values, the package related data which the current standard packaging item value belongs to is invalid data, the condition of calling an API interface is not met, and the standard packaging which is not matched with the component is directly returned without carrying out subsequent search scoring processing, so that the processing efficiency is improved.
Step 42022: when the standard package item value in the package-related data includes the filter item value, the standard package item value is increased by a first preset score.
The filter item is of an item value type which can not be set, but when a certain filter item is set, the standard package item value needs to be hit, which means that the filter item is the package item value which is required to be hit in the current component, and if the filter item is not hit, the standard package item value is invalid data and is discarded. The first preset score is different score values, such as 1 score, 2 scores or 3 scores, which are preset by the administrator user according to different importance degrees of the filtering items.
Step 42023: when the standard package item value in the package-related data includes the score item value, the standard package item value is increased by a second preset score.
When the scoring items are set, the scoring values can be set flexibly relatively, and the administrator user can correspondingly set the scoring values according to the actual conditions of the components and the PCB, including scoring values during hit, non-scoring or deduction during miss, and the like. And similarly, the first preset score and the second preset score are score values set by an administrator user according to importance degrees of different added items on components and PCBs, wherein the score values comprise-1 score, 0 score, 1 score and the like.
By setting the three different types of item values, the scoring rule is more comprehensive and reliable, and the accuracy of final association of the package related data and the simulated graph data is further improved.
In another possible implementation manner, fig. 5 is a flow chart of a method for building component simulation data according to another embodiment of the present application. As shown in fig. 5, step 430 may further include the steps of:
step 4301: when the score is greater than or equal to a preset score threshold, the standard package item value is a hit package item value, and the package related data is hit package related data.
The preset grading threshold value is a final grading range set by a system or a person, when the final grading value is included in the threshold value, the packaging related data of the current component can be related to standard packaging data and analog graph data in a standard packaging database, and the association relation between the packaging related data and the corresponding analog graph data is reserved. However, when the final score does not meet the preset score threshold, that is, is lower than the lowest score value, it is indicated that the current package related data only includes the item value of the necessary filling item, and the matching degree with the standard package data in the standard package database is low, even if the final score is associated with the simulated graphic data, the reliability of the association relationship is low, but the accuracy of subsequent use is affected, so that the data is missed data.
Specifically, in another embodiment, fig. 6 is a flow chart illustrating a method for obtaining a standard package item value in the method for building component simulation data according to another embodiment of the present application. As shown in fig. 6, step 410 may further include the steps of:
step 4101: and acquiring an initial package item value according to the package related data.
The initial package item value is an item value in package related data preliminarily acquired by the system, and may be in different formats, different units and invalid characters.
Step 4102: and (3) clearing invalid symbols and/or unifying formats and/or splitting keywords of the initial package item value to obtain a standard package item value.
The initial package item values of different formats and different units are unified into a format consistent form and a unit consistent form, including but not limited to case consistent and name consistent. And invalid characters such as redundant blank spaces, underlines and the like are removed, so that the method is convenient to use when the application programming interface is called for searching. For the initial package item value combined with more than one keyword, the splitting of the keywords can be performed, for example, the tantalum capacitor is split into two keywords of tantalum and capacitor, so that the searching coverage area is improved.
In one possible implementation manner, fig. 7 is a flow chart of a method for building component simulation data according to another embodiment of the present application. As shown in fig. 7, step 200 may further include the steps of:
step 210: and obtaining standard encapsulation information according to the standard encapsulation database.
The standard package information refers to a single piece of package information in the standard package database, and each piece of standard package information corresponds to corresponding three-dimensional model data, bonding pad vector data and the like.
Step 220: and acquiring the association relation between the standard encapsulation information and the analog graphic data.
The association relation can be obtained by a manual association mode; the association relation between the package data and the three-dimensional graphic data disclosed on the network can be obtained by means of a crawler tool; and the related data of the package of the existing components and the three-dimensional graphic data can be related through the corresponding relation between the standard package information and the existing components in the website, so that the standard package database is supplemented.
Step 230: and acquiring a standard encapsulation search application programming interface according to the association relation between the standard encapsulation information and the analog graphic data.
And generating a standard encapsulation index library and a search application programming interface thereof by using the association relation between the standard encapsulation information and the simulated graphic data obtained in the mode and using a search engine technology.
In addition, another aspect of the application also provides a device for building the component simulation data.
Fig. 8 is a schematic diagram of an apparatus for building component simulation data according to an embodiment of the present application. As shown in fig. 8, the device for building simulation data of a component provided in the present application may specifically include: the system comprises a standard package database acquisition module 100, a standard package search application programming interface acquisition module 200, a package related data acquisition module 300 and an association relation acquisition module 400. The standard encapsulation database acquisition module 100 is used for acquiring a standard encapsulation database; the standard encapsulation search application programming interface module 200 is configured to obtain a standard encapsulation search application programming interface according to a standard encapsulation database; the package related data obtaining module 300 is configured to obtain package related data of a component; the association relation obtaining module 400 is configured to obtain association relation between the package related data and the simulated graphic data in the standard package database according to the package related data of the component and the standard package search application programming interface.
The device for building the simulation data of the components specifically comprises: the system comprises a standard package database acquisition module 100, a standard package search application programming interface module 200, a package related data acquisition module 300 and an association relation acquisition module 400. The device can obtain a standard encapsulation database; acquiring a standard encapsulation search application programming interface according to the standard encapsulation database; acquiring packaging related data of the components; and acquiring the association relation between the package related data and the simulated graphic data in the standard package database according to the package related data of the component and the standard package search application programming interface. The device for building the simulation data of the components utilizes the corresponding relation between the components and the standard packaging data to correspond the components to the simulation data related to the standard packaging, and realizes the purpose of one-to-one correspondence between the simulation data and a huge number of various components by taking the standard packaging library as a medium through building a search API interface on the standard packaging library. Meanwhile, the package item value is searched and matched by matching with an application programming interface, so that manufacturability analysis of PCBA before production and manufacture is facilitated, the problem of massive missing of simulation data of the existing components is solved or improved, and the possibility is brought for comprehensive, complete and safe detection targets of the manufacturability analysis.
Next, an electronic device according to an embodiment of the present application is described with reference to fig. 9. Fig. 9 is a schematic structural diagram of an electronic device according to an embodiment of the present application.
As shown in fig. 9, the electronic device 600 includes one or more processors 601 and memory 602.
The processor 601 may be a Central Processing Unit (CPU) or other form of processing unit having data processing and/or information execution capabilities and may control other components in the electronic device 600 to perform desired functions.
The memory 602 may include one or more computer program products that may include various forms of computer-readable storage media, such as volatile memory and/or non-volatile memory. The volatile memory may include, for example, random Access Memory (RAM) and/or cache memory (cache), and the like. The non-volatile memory may include, for example, read Only Memory (ROM), hard disk, flash memory, and the like. One or more computer program information may be stored on the computer readable storage medium, which may be executed by the processor 601 to implement the method of building component simulation data or other desired functions of the various embodiments of the present application described above.
In one example, the electronic device 600 may further include: input device 603 and output device 604, which are interconnected by a bus system and/or other form of connection mechanism (not shown).
The input device 603 may include, for example, a keyboard, a mouse, and the like.
The output device 604 can output various information to the outside. The output means 604 may comprise, for example, a display, a communication network, a remote output device to which it is connected, and so forth.
Of course, only some of the components of the electronic device 600 that are relevant to the present application are shown in fig. 9 for simplicity, components such as buses, input/output interfaces, etc. are omitted. In addition, the electronic device 600 may include any other suitable components depending on the particular application.
In addition to the methods and apparatus described above, embodiments of the present application may also be a computer program product comprising computer program information which, when executed by a processor, causes the processor to perform the steps in the methods of building component simulation data according to the various embodiments of the present application described in the present specification.
The computer program product may write program code for performing the operations of embodiments of the present application in any combination of one or more programming languages, including an object oriented programming language such as Java, C++ or the like and conventional procedural programming languages, such as the "C" programming language or similar programming languages. The program code may execute entirely on the user's computing device, partly on the user's device, as a stand-alone software package, partly on the user's computing device, partly on a remote computing device, or entirely on the remote computing device or server.
Furthermore, embodiments of the present application may also be a computer-readable storage medium, on which computer program information is stored, which, when being executed by a processor, causes the processor to perform steps in a method of building component simulation data according to various embodiments of the present application.
The computer readable storage medium may employ any combination of one or more readable media. The readable medium may be a readable signal medium or a readable storage medium. The readable storage medium may include, for example, but is not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or a combination of any of the foregoing. More specific examples (a non-exhaustive list) of the readable storage medium would include the following: an electrical connection having one or more wires, a portable disk, a hard disk, random Access Memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fiber, portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing.
The basic principles of the present application have been described above in connection with specific embodiments, however, it should be noted that the advantages, benefits, effects, etc. mentioned in the present application are merely examples and not limiting, and these advantages, benefits, effects, etc. are not to be considered as necessarily possessed by the various embodiments of the present application. Furthermore, the specific details disclosed herein are for purposes of illustration and understanding only, and are not intended to be limiting, as the application is not intended to be limited to the details disclosed herein as such.
The block diagrams of the devices, apparatuses, devices, systems referred to in this application are only illustrative examples and are not intended to require or imply that the connections, arrangements, configurations must be made in the manner shown in the block diagrams. As will be appreciated by one of skill in the art, the devices, apparatuses, devices, systems may be connected, arranged, configured in any manner. Words such as "including," "comprising," "having," and the like are words of openness and mean "including but not limited to," and are used interchangeably therewith. The terms "or" and "as used herein refer to and are used interchangeably with the term" and/or "unless the context clearly indicates otherwise. The term "such as" as used herein refers to, and is used interchangeably with, the phrase "such as, but not limited to.
It is also noted that in the apparatus, devices and methods of the present application, the components or steps may be disassembled and/or assembled. Such decomposition and/or recombination should be considered as equivalent to the present application.
The previous description of the disclosed aspects is provided to enable any person skilled in the art to make or use the present application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other aspects without departing from the scope of the application. Thus, the present application is not intended to be limited to the aspects shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
The foregoing description of the preferred embodiments is provided for the purpose of illustration only, and is not intended to limit the invention to the particular embodiments disclosed, but on the contrary, the intention is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention as defined by the appended claims.
Claims (10)
1. A method of building component simulation data, comprising:
obtaining a standard encapsulation database;
acquiring a standard encapsulation search application programming interface according to the standard encapsulation database;
acquiring packaging related data of the components; and
and acquiring the association relation between the package related data and the simulated graph data in the standard package database according to the package related data of the component and the standard package search application programming interface.
2. The method for building component simulation data according to claim 1, wherein the obtaining the association relationship between the package related data and the simulation graphic data in the standard package database according to the package related data of the component and the standard package search application programming interface comprises:
obtaining a standard packaging item value according to the packaging related data;
obtaining the score of the standard packaging item value according to the standard packaging item value, the standard packaging search application programming interface and a preset scoring rule;
acquiring a hit package item value and hit package related data according to the score;
and acquiring the simulated graph data corresponding to the hit package related data according to the hit package item value and the hit package related data.
3. The method for building component simulation data according to claim 2, wherein the obtaining the score of the standard package item value according to the standard package item value and a preset scoring rule includes:
obtaining the item value type of the standard encapsulation item value;
according to the item value type, obtaining a preset score of the standard packaging item value;
and obtaining the score of the standard packaging item value according to the standard packaging item value and the preset score.
4. A method for constructing component simulation data according to claim 3, wherein the item value types include a fill item, a filter item, and an optional item, and the obtaining the preset score of the standard package item value according to the item value types includes:
when the standard packaging item value in the packaging related data comprises a mandatory filling item value, acquiring a preset score of the standard packaging item value; or (b)
When the standard package item value in the package related data does not comprise the necessary filling item value, not grading the package related data; and/or
When the standard packaging item value in the packaging related data comprises a filtering item value, the standard packaging item value is increased by a first preset score; and/or
When the standard package item value in the package-related data includes a score item value, the standard package item value is increased by a second preset score value.
5. The method for constructing component simulation data according to claim 2, wherein the obtaining the hit package item value and the hit package related data according to the score includes:
and when the score is greater than or equal to a preset score threshold, the standard package item value is the hit package item value, and the package related data is the hit package related data.
6. The method for building component simulation data according to claim 2, wherein the obtaining standard package item values according to the package-related data comprises:
acquiring an initial package item value according to the package related data;
and removing invalid symbols and/or unifying formats and/or splitting keywords of the initial package item value to obtain a standard package item value.
7. The method for constructing component simulation data according to claim 1, wherein the obtaining a standard package search application programming interface according to the standard package database comprises:
obtaining standard packaging information according to the standard packaging database;
acquiring the association relation between the standard encapsulation information and the simulated graphic data;
and acquiring the standard encapsulation search application programming interface according to the association relation between the standard encapsulation information and the simulated graphic data.
8. The method of constructing component simulation data of claim 7, wherein the simulated graphics data comprises three-dimensional model data and/or vector data of pads.
9. An apparatus for building component simulation data, comprising:
the standard encapsulation database acquisition module is used for acquiring a standard encapsulation database;
the standard encapsulation search application programming interface module is used for acquiring a standard encapsulation search application programming interface according to the standard encapsulation database;
the package related data acquisition module is used for acquiring package related data of the components;
and the association relation acquisition module is used for acquiring the association relation between the package related data and the simulated graphic data in the standard package database according to the package related data of the component and the standard package search application programming interface.
10. An electronic device, the electronic device comprising:
a processor; and
a memory for storing the processor-executable information;
wherein the processor is configured to perform the method for building component simulation data of any one of claims 1 to 8.
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