CN105115421A - Method and device for positioning detection of image sensing chip - Google Patents
Method and device for positioning detection of image sensing chip Download PDFInfo
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Abstract
The invention provides a method and device for positioning detection of an image sensing chip. The method may includes the steps of: packaging a chip selected by a user from a predefined image sensing chip packaging library on a PCB, thereby forming a chip assembly; obtaining predefined scanning parameters corresponding to the selected chip package, and according to the predefined scanning parameters and an arrangement situation of the selected chip package on the PCB, determining overall actual scanning parameters of the chip assembly; and according to a matching situation of the overall actual scanning parameters and overall target scanning parameters of a chip assembly which are input by a user, outputting a corresponding positioning detection result. Through the technical scheme of the invention, a positioning direction of the image sensing chip can be automatically detected in a PCB design stage, thereby contributing to timely discovery and elimination of a positioning error of the image sensing chip.
Description
Technical field
The present invention relates to acquisition technology field, particularly relate to position finding and detection method and the device of image sensor chip.
Background technology
Along with the develop rapidly of acquisition technology, user is more and more higher for the requirement of picture quality.Image is changed into electric signal by image sensor chip (Sensor) by image capture device, realizes image acquisition operation.In addition, Sensor also control and exposes the parameters such as relevant electronic shutter, and its performance directly affects final imaging effect.
There is photosensitive direction in Sensor itself, is only mounted on pcb board according to correct photosensitive direction by Sensor, can guarantees the photosensitive effect of Sensor, realizes the image acquisition operation needed for user.
Summary of the invention
In view of this, the invention provides a kind of position finding and detection method and device of image sensor chip, can automatically detect by the orientation in the PCB design stage to image sensor chip, contribute to Timeliness coverage and the Wrong localization of removal of images sensing chip.
For achieving the above object, the invention provides technical scheme as follows:
According to a first aspect of the invention, propose a kind of position finding and detection method of image sensor chip, comprising:
The chip package that user chooses from predefined image sensor chip encapsulation storehouse is placed on pcb board, forms chip assembly;
Obtain the predefine sweep parameter corresponding with selected chip package, and according to described predefine sweep parameter and described selected chip package the facilities on described pcb board, determine the overall actual scanning parameter of described chip assembly;
Match condition between the overall goals sweep parameter of the described chip assembly inputted according to described overall actual scanning parameter and described user, exports corresponding detection and localization result.
According to a second aspect of the invention, propose a kind of locating and detecting device of image sensor chip, comprising:
Module units, is placed on pcb board by the chip package that user chooses from predefined image sensor chip encapsulation storehouse, forms chip assembly;
Determining unit, obtains the predefine sweep parameter corresponding with selected chip package, and according to described predefine sweep parameter and described selected chip package the facilities on described pcb board, determine the overall actual scanning parameter of described chip assembly;
Matching unit, the match condition between the overall goals sweep parameter of the described chip assembly inputted according to described overall actual scanning parameter and described user, exports corresponding detection and localization result.
From above technical scheme, the present invention is by image sensor chip encapsulation process, the sweep parameter of pre-defined each chip package, thus according to the actual facilities of chip package on pcb board, the overall actual scanning parameter of chip assembly can be determined; Simultaneously, by the overall goals sweep parameter needed for the overall actual scanning parameter of chip assembly and user is contrasted, can determine whether selected chip package is correctly mounted on pcb board, thus Timeliness coverage and corrigendum can be carried out in the PCB design stage to Wrong localization.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of the photo-process in correlation technique;
Fig. 2-3 is schematic diagram of the image output procedure in correlation technique;
Fig. 4 is the process flow diagram of the position finding and detection method of a kind of image sensor chip in the present invention one exemplary embodiment;
Fig. 5 is the process flow diagram of the position finding and detection method of another kind of image sensor chip in the present invention one exemplary embodiment;
Fig. 6 is the schematic diagram in a kind of image sensor chip encapsulation storehouse in the present invention one exemplary embodiment;
Fig. 7 is the schematic diagram of a kind of image sensor chip in the present invention one exemplary embodiment;
Fig. 8-9 is the schematic diagram at the detection and localization interface of a kind of image sensor chip in the present invention one exemplary embodiment;
Figure 10 is the complete machine structure schematic diagram of a kind of image capture device in the present invention one exemplary embodiment;
Figure 11 is the structural representation of a kind of electronic equipment in the present invention one exemplary embodiment;
Figure 12 is the block diagram of the locating and detecting device of a kind of image sensor chip in the present invention one exemplary embodiment.
Embodiment
Image capture device is when performing image acquisition, its principle can be reduced to: after the camera lens on the light therethrough image capture device of subject reflection, project in image capture device the photosensitive region (not indicating in figure) of the image sensor chip be arranged on pcb board, and image sensor chip is by the scanning to light, and export the image for finally presenting.In above process, there is repeatedly direction change:
1) as shown in Figure 1, when the reflection ray of image sensitive chip to subject is directly responded to, the light projecting chip front side in fact with subject in the relation turned upside down.
2), as shown in Figure 2, when image sensor chip scans the light sensed, there is the starting point that pre-sets and direction, such as with the A in lower left corner point be starting point, horizontal direction from left to right, vertical direction from bottom to top, realize scan operation.
And when image sensor chip output image, also there is the starting point and direction that pre-set, such as with the B in upper left corner point be starting point, horizontal direction from left to right, vertical direction from top to bottom, realize image output function.So, because the starting point of scan operation and image output function, direction cooperatively interact, make final output image consistent with the subject shown in Fig. 1.
In fact, the scan operation of image sensor chip and the process of image output function, inputted in image sensor chip by programming mode all in advance, and give tacit consent to this image sensor chip to be installed in a prescribed manner on pcb board, such as the image sensor chip shown in Fig. 2, A point is the lower left corner of this chip, A point is in the lower left corner relative to pcb board simultaneously, " horizontal direction from left to right ", " vertical direction from top to bottom " are also applicable to image sensor chip and pcb board all simultaneously simultaneously, can think that this image sensor chip is correctly arranged on pcb board; So, if this image sensor chip is when being mounted to pcb board, does not install according to the direction shown in Fig. 2, occurring difference by causing the subject shown in final output image and Fig. 1.
Shown in the legend in such as Fig. 3 upper left corner, assuming that image sensor chip is when mounted along there occurs 90 ° of rotations clockwise.Because the scan operation of image sensor chip and image output function are predetermined, so for this image sensor chip, the change whether existing and install can not be perceived, because A point is positioned at the lower left corner of this image sensor chip all the time, but be changed to the upper left corner of pcb board, be different from the image acquisition scene shown in Fig. 2.Therefore, for the ease of observing and comparing, A point can be returned to the lower left corner, obtain the legend in Fig. 3 upper right corner, then the image that in fact this chip scanning goes out has been different from the image scanned in Fig. 2, is equivalent to the scan image in Fig. 2 to rotate counterclockwise 90 °.Therefore, the scan operation of Fig. 3 chips and the starting point of image output function, direction cannot cooperatively interact, and cause there occurs direction between the subject shown in output image final in the legend in Fig. 3 lower right corner and Fig. 1 and change.
Visible, if image sensor chip there occurs above-mentioned error in the design phase, cause there occurs deflection between chip and actual location direction, then the image capture device of final production cannot correctly output image, needs to carry out rotation correction to image; But the rotation correction of image needs powerful image processing function (such as output image final for Fig. 3 being rotated counterclockwise 90 °), but the process chip in image capture device does not possess such ability usually.Or, be merely able to redesign and produce, cause the prolongation of product development cycle and the serious waste of resource.
For the problems referred to above, evade only by the collaborative communication between each side such as structure expert, hardware experts and PCB design expert and informing in correlation technique, but this will cause the information interaction of multiple link, not only inefficiency, and be easy to occur, as situations such as misunderstandings, thus effectively to solve the problems referred to above in correlation technique on certain interactive session.
Therefore, the present invention passes through the detection and localization in the design phase to image sensor chip, to solve the problems referred to above existed in correlation technique.For being further described the present invention, provide the following example:
Fig. 4 is the process flow diagram of the position finding and detection method of a kind of image sensor chip in the present invention one exemplary embodiment, and as shown in Figure 4, the method is applied to terminal, can comprise the following steps:
Step 402, is placed on pcb board by the chip package that user chooses from predefined image sensor chip encapsulation storehouse, forms chip assembly.
Those skilled in the art should understand that: image sensor chip encapsulation storehouse, chip package, pcb board are the computer data in PCB performance history, these computer datas simulate actual physics components and parts, then technician can combine the physics components and parts of these simulations, designs the complete machine of image capture device and the simulated data of each functional part; Then, manufacture according to the simulated data of these designs, the actual physical device being matched with this simulated data can be obtained.
Step 404, obtains the predefine sweep parameter corresponding with selected chip package, and according to described predefine sweep parameter and described selected chip package the facilities on described pcb board, determine the overall actual scanning parameter of described chip assembly.
In the present embodiment, predefine scanning t test parameter can comprise following one of at least: sweep starting point or direction of scanning.Such as in fig. 2, sweep starting point is the lower left corner A point of image sensor chip, direction of scanning be horizontal direction from left to right, vertical direction from bottom to top.
Step 406, the match condition between the overall goals sweep parameter of the described chip assembly inputted according to described overall actual scanning parameter and described user, exports corresponding detection and localization result.
From above-described embodiment, the present invention, by image sensor chip encapsulation process, pre-defines the sweep parameter of each chip package, thus according to the actual facilities of chip package on pcb board, can determine the overall actual scanning parameter of chip assembly; Simultaneously, by the overall goals sweep parameter needed for the overall actual scanning parameter of chip assembly and user is contrasted, can determine whether selected chip package is correctly mounted on pcb board, thus Timeliness coverage and corrigendum can be carried out in the PCB design stage to Wrong localization.
Fig. 5 is the process flow diagram of the position finding and detection method of another kind of image sensor chip in the present invention one exemplary embodiment, and as shown in Figure 5, the method is applied to terminal, can comprise the following steps:
Step 502, sets up image sensor chip encapsulation storehouse.
Step 504, adds sweep parameter in chip package.
In the present embodiment, image sensor chip encapsulation storehouse is the database of various chip package.As shown in Figure 6, setting up often kind in advance can applicable chip package (as encapsulated 1, encapsulation 2 etc.), and be that corresponding sweep parameter (as sweep parameter 1, sweep parameter 2 etc.) is added in often kind of encapsulation, then will mutually concentrate on accordingly between chip package and sweep parameter in image sensor chip encapsulation storehouse.So, when PCB design personnel need to apply certain chip package, only need to carry out calling, without the need to repeatedly creating and defining chip package from this image sensor chip encapsulation storehouse.
Step 506, selects operation according to user, from image sensor chip encapsulation storehouse, choose chip package.
Step 508, according to selected chip package, obtains corresponding predefine sweep parameter.
In the present embodiment, scanning process can regard the view data input process of image sensor chip as; And scanning t test parameter refers to the parameter being applied to this input process.Wherein, scanning t test parameter can comprise following one of at least: sweep starting point or direction of scanning.
1) sweep starting point.Sweep starting point refers to that image sensor chip performs first pixel (FirstPixel) of scan operation, i.e. first pixel.
2) direction of scanning.Direction of scanning refers to that this image sensor chip performs the direction of scan operation from sweep starting point.
For CIS (CMOSImageSensor) chip shown in Fig. 7, the sweep starting point of this CIS chip is first pixel in the lower left corner, direction of scanning be horizontal direction from left to right, vertical direction from bottom to top.CIS chip shown in Fig. 7, in square, is difficult to, from the situation identifying chip in appearance and whether exist deflection 90 °, 180 ° or 270 °, cause final output image probably not meet the actual demand of user in the design process; Even and if rectangle structure, be also difficult to from identify in appearance chip whether exist 180 ° attitude deflection.Therefore, by in pre-defined sweep starting point and direction of scanning one of at least, be equivalent to define attitude to this CIS chip, make between its four edges and no longer of equal value between four summits, thus can determine whether this CIS chip exists deviations problem in the design process.
Step 510, is mounted on pcb board by selected chip package, forms chip assembly.
Step 512, the facilities on PCB according to predefine sweep parameter and chip package, determines the overall actual scanning parameter of chip assembly.
As Figure 8-9, CIS chip and pcb board are looked as a whole, i.e. chip assembly.Because predefine sweep parameter is for CIS chip self, thus for CIS chip, which kind of no matter with attitude, this CIS chip is mounted on pcb board, this predefine sweep parameter can not change all the time, ratio as shown in Figure 8 and Figure 9, although there is angle change when being mounted to pcb board in CIS chip, but for this CIS chip, the relative position of the first pixel on this CIS chip as sweep starting point is constant all the time, and direction of scanning is considered to relatively constant too.
But assuming that the set-up mode of pcb board is constant, then obviously there is change in the predefine sweep parameter of CIS chip for pcb board; Similar, check that mode is constant due to user, thus can obviously find out between Fig. 8 and Fig. 9 distinct.So, can think and keep consistency between user and pcb board, and relation is set based on CIS chip and pcb board, think that user and this chip assembly are consistent on the whole further, thus obtain the overall actual scanning parameter of this chip assembly.
Therefore, according to predefine sweep parameter and the facilities of this CIS chip on pcb board (such as setting direction, the anglec of rotation etc. of CIS chip, terminal can when user calls CIS chip and is arranged at pcb board, determine this facilities), the overall actual scanning parameter of chip assembly can be determined.
Particularly, when predefine sweep parameter comprise state sweep starting point time, according to the relative position relation between selected chip package and pcb board, sweep starting point is converted to second place information relative to pcb board relative to the primary importance information of selected chip package; When predefine sweep parameter comprises direction of scanning, according to the relative position relation between selected chip package and pcb board, direction of scanning is converted to the actual direction relative to pcb board.
For example, in the embodiment shown in fig. 8, based on the predefine sweep parameter of the CIS chip shown in Fig. 8, and the facilities of this CIS chip on pcb board, can determine that the overall actual scanning parameter of chip assembly is: sweep starting point be positioned at the lower right corner, horizontal scan direction for from right to left, vertical scanning direction is for from bottom to top.And in the embodiment shown in fig. 9, based on the predefine sweep parameter of the CIS chip shown in Fig. 9, and the facilities of this CIS chip on pcb board, can determine that the overall actual scanning parameter of chip assembly is: sweep starting point be positioned at the upper left corner, horizontal scan direction for from left to right, vertical scanning direction is for from the top down.
Step 514, determines the overall goals sweep parameter that user inputs.
In the present embodiment, overall goals sweep parameter be according to the current pose of the predefine Installation posture of chip assembly in corresponding image capture device, chip assembly and and the predefine image way of output of this image capture device determine to obtain.
In other words, the first matching relationship (such as the anglec of rotation) is there is between CIS chip and pcb board (being in " current pose "), also the second matching relationship (such as the anglec of rotation) is there is between chip assembly and image capture device, so according to the final required image way of output of this image capture device, above-mentioned the second matching relationship (being equivalent to define the predefine Installation posture of chip assembly) can be determined, and in conjunction with the current pose of this pcb board, overall goals sweep parameter (being equivalent to the first matching relationship between CIS chip and pcb board) can be obtained.
For the image capture device shown in Figure 10.Assuming that the predefine image way of output is export from the upper left corner, then the targeted scans parameter needing chip assembly to realize for: from the lower left corner under attitude shown in Figure 10, respectively according to level from left to right, vertically direction from bottom to top scan.Wherein, the Installation posture of chip assembly in image capture device is fixing, namely installs according to the predefine Installation posture (breach namely on pcb board is positioned at the upper left corner) shown in Figure 10; But, actual chip package is set time, the current pose of chip assembly is not necessarily consistent with this predefine Installation posture, such as in such as Fig. 8-9, differ between the current pose (breach namely on pcb board is positioned at the lower left corner) of chip assembly and above-mentioned predefine Installation posture 90 ° (current pose rotates clockwise after 90 °, can obtain the predefine Installation posture in Figure 10).
Therefore, in order to ensure the predefine image way of output meeting image capture device, need above-mentioned targeted scans parameter (assuming that sweep starting point is the lower left corner, direction of scanning be level from left to right, vertical from bottom to top) along being rotated counterclockwise 90 °, obtain overall goals sweep parameter (assuming that sweep starting point is the lower right corner, direction of scanning be level from right to left, vertical from bottom to top); Then, chip assembly finally turn clockwise 90 ° and be mounted to image capture device time, offset the impact that this anglec of rotation is brought.
Step 516, by more overall actual scanning parameter and overall goals sweep parameter, exports detection and localization result.
For the embodiment shown in Fig. 8, overall actual scanning parameter and overall goals sweep parameter as shown in table 1 below.As known from Table 1, overall goals sweep parameter (" target output " namely in Fig. 8) is consistent with overall actual scanning parameter, thus determines that the detection and localization result of CIS chip is for " putting correct ".
Table 1
For the embodiment shown in Fig. 9, overall actual scanning parameter and overall goals sweep parameter as shown in table 2 below.As known from Table 2, overall goals sweep parameter (" target output " namely in Fig. 9) is inconsistent with overall actual scanning parameter, and sweep starting point and vertical scanning direction are all different, thus determines that the detection and localization result of CIS chip is for " putting mistake ".
Table 2
Further, when detection and localization result is for locating unsuccessfully, can according to the difference between overall actual scanning parameter and overall goals sweep parameter, export and the adjustment of the facilities of selected chip package is advised, make the overall actual scanning parameter matching after adjustment in overall goals sweep parameter.As shown in Figure 9, the overall goals sweep parameter adopted is wished for the overall actual scanning parameter of CIS chip and user, can recognize: CIS chip is relative to the put correctly mode shown in Fig. 8, to have rotated 180 °, thus relatively can generate the adjustment suggestion shown in Fig. 9 is " chip rotates 180 ° ", after then user adjusts CIS chip according to this adjustment suggestion, this CIS chip can be adjusted to the put correctly mode shown in Fig. 8.
Certainly, here " adjustment suggestion " exports " relative " according to overall actual scanning parameter with the difference between overall goals sweep parameter and adjusts mode, and in another case, also can according to the overall goals sweep parameter of the predefine sweep parameter of selected chip package and chip module, determine the recommendation chip set-up mode being matched with selected chip package, and when detection and localization result is for locating unsuccessfully, export this recommendation chip set-up mode, make user directly according to which to arrange chip package, thus obtain the put correctly mode shown in Fig. 8.
In addition, except the anglec of rotation of chip package when putting, can also position the coordinate position of this chip package on pcb board.Wherein, physical centre position and the optical centre position of selected chip package can be obtained, and according to the target physical center that pcb board configures and objective optics center, and the facilities of selected chip package on this pcb board, judge and export physics center and optical centre position respectively with the match condition of target physical center and objective optics center.So, only have when physical centre position overlap with target physical center, optical centre position overlaps with objective optics center, just thinks that location is correct.
Wherein, physical centre position refers to the diagonal line position of intersecting point of chip package, and optical centre position refers to the diagonal line position of intersecting point of the photosensitive region on chip package, and both may overlap, and also may not overlap, and need to determine according to the concrete structure of chip package.For the ease of observing, as Figure 8-9, graphical representation can be carried out to CIS chip, pcb board, and by physical centre position and optical centre location mark in patterned CIS chip internal.
Figure 11 shows the schematic configuration diagram of the electronic equipment of the exemplary embodiment according to the application.Please refer to Figure 11, at hardware view, this electronic equipment comprises processor, internal bus, network interface, internal memory and nonvolatile memory, certainly also may comprise the hardware required for other business.Processor reads corresponding computer program and then runs in internal memory from nonvolatile memory, and logic level is formed the locating and detecting device of image sensor chip.Certainly, except software realization mode, the application does not get rid of other implementations, mode of such as logical device or software and hardware combining etc., that is the executive agent of following treatment scheme is not limited to each logical block, also can be hardware or logical device.
Please refer to Figure 12, in Software Implementation, the locating and detecting device of this image sensor chip can comprise module units, determining unit and matching unit.Wherein:
Module units, is placed on pcb board by the chip package that user chooses from predefined image sensor chip encapsulation storehouse, forms chip assembly;
Determining unit, obtains the predefine sweep parameter corresponding with selected chip package, and according to described predefine sweep parameter and described selected chip package the facilities on described pcb board, determine the overall actual scanning parameter of described chip assembly;
Matching unit, the match condition between the overall goals sweep parameter of the described chip assembly inputted according to described overall actual scanning parameter and described user, exports corresponding detection and localization result.
Optionally, described predefine sweep parameter comprise following one of at least: sweep starting point or direction of scanning.
Optionally, described determining unit specifically for:
When described predefine sweep parameter comprises described sweep starting point, according to the relative position relation between described selected chip package and described pcb board, described sweep starting point is converted to second place information relative to described pcb board relative to the primary importance information of described selected chip package;
When described predefine sweep parameter comprises described direction of scanning, according to the relative position relation between described selected chip package and described pcb board, described direction of scanning is converted to the actual direction relative to described pcb board.
Optionally, also comprise:
Suggestion unit, when described detection and localization result is for locating unsuccessfully, according to the difference between described overall actual scanning parameter and described overall goals sweep parameter, export and the adjustment of the facilities of described selected chip package is advised, make the overall actual scanning parameter matching after adjustment in described overall goals sweep parameter.
Optionally, also comprise:
Direction-determining unit, according to described predefine sweep parameter and described overall goals sweep parameter, determines the recommendation chip set-up mode being matched with described selected chip package;
Mode output unit, when described detection and localization result is for locating unsuccessfully, exports described recommendation chip set-up mode.
Optionally, also comprise:
Position acquisition unit, obtains physical centre position and the optical centre position of described selected chip package;
Judging unit, according to the target physical center that described pcb board configures and objective optics center, and the facilities of described selected chip package on described pcb board, judge and export described physical centre position and optical centre position respectively with the match condition of described target physical center and described objective optics center.
Optionally, described overall goals sweep parameter determines to obtain according to the current pose of the predefine Installation posture of described chip assembly in corresponding image capture device, described chip assembly and the predefine image way of output of described image capture device.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, within the spirit and principles in the present invention all, any amendment made, equivalent replacement, improvement etc., all should be included within the scope of protection of the invention.
Claims (14)
1. a position finding and detection method for image sensor chip, is characterized in that, comprising:
The chip package that user chooses from predefined image sensor chip encapsulation storehouse is placed on pcb board, forms chip assembly;
Obtain the predefine sweep parameter corresponding with selected chip package, and according to described predefine sweep parameter and described selected chip package the facilities on described pcb board, determine the overall actual scanning parameter of described chip assembly;
Match condition between the overall goals sweep parameter of the described chip assembly inputted according to described overall actual scanning parameter and described user, exports corresponding detection and localization result.
2. method according to claim 1, is characterized in that, described predefine sweep parameter comprise following one of at least: sweep starting point or direction of scanning.
3. method according to claim 2, is characterized in that, described according to described predefine sweep parameter and described selected chip package the facilities on described pcb board, determine the overall actual scanning parameter of described chip assembly, comprising:
When described predefine sweep parameter comprises described sweep starting point, according to the relative position relation between described selected chip package and described pcb board, described sweep starting point is converted to second place information relative to described pcb board relative to the primary importance information of described selected chip package;
When described predefine sweep parameter comprises described direction of scanning, according to the relative position relation between described selected chip package and described pcb board, described direction of scanning is converted to the actual direction relative to described pcb board.
4. method according to claim 1, is characterized in that, also comprises:
When described detection and localization result is for locating unsuccessfully, according to the difference between described overall actual scanning parameter and described overall goals sweep parameter, export and the adjustment of the facilities of described selected chip package is advised, make the overall actual scanning parameter matching after adjustment in described overall goals sweep parameter.
5. method according to claim 1, is characterized in that, also comprises:
According to described predefine sweep parameter and described overall goals sweep parameter, determine the recommendation chip set-up mode being matched with described selected chip package;
When described detection and localization result is for locating unsuccessfully, export described recommendation chip set-up mode.
6. method according to claim 1, is characterized in that, also comprises:
Obtain physical centre position and the optical centre position of described selected chip package;
According to the target physical center that described pcb board configures and objective optics center, and the facilities of described selected chip package on described pcb board, judge and export described physical centre position and optical centre position respectively with the match condition of described target physical center and described objective optics center.
7. method according to claim 1, it is characterized in that, described overall goals sweep parameter determines to obtain according to the current pose of the predefine Installation posture of described chip assembly in corresponding image capture device, described chip assembly and the predefine image way of output of described image capture device.
8. a locating and detecting device for image sensor chip, is characterized in that, comprising:
Module units, is placed on pcb board by the chip package that user chooses from predefined image sensor chip encapsulation storehouse, forms chip assembly;
Determining unit, obtains the predefine sweep parameter corresponding with selected chip package, and according to described predefine sweep parameter and described selected chip package the facilities on described pcb board, determine the overall actual scanning parameter of described chip assembly;
Matching unit, the match condition between the overall goals sweep parameter of the described chip assembly inputted according to described overall actual scanning parameter and described user, exports corresponding detection and localization result.
9. device according to claim 8, is characterized in that, described predefine sweep parameter comprise following one of at least: sweep starting point or direction of scanning.
10. device according to claim 8, is characterized in that, described determining unit specifically for:
When described predefine sweep parameter comprises described sweep starting point, according to the relative position relation between described selected chip package and described pcb board, described sweep starting point is converted to second place information relative to described pcb board relative to the primary importance information of described selected chip package;
When described predefine sweep parameter comprises described direction of scanning, according to the relative position relation between described selected chip package and described pcb board, described direction of scanning is converted to the actual direction relative to described pcb board.
11. devices according to claim 8, is characterized in that, also comprise:
Suggestion unit, when described detection and localization result is for locating unsuccessfully, according to the difference between described overall actual scanning parameter and described overall goals sweep parameter, export and the adjustment of the facilities of described selected chip package is advised, make the overall actual scanning parameter matching after adjustment in described overall goals sweep parameter.
12. devices according to claim 8, is characterized in that, also comprise:
Direction-determining unit, according to described predefine sweep parameter and described overall goals sweep parameter, determines the recommendation chip set-up mode being matched with described selected chip package;
Mode output unit, when described detection and localization result is for locating unsuccessfully, exports described recommendation chip set-up mode.
13. devices according to claim 8, is characterized in that, also comprise:
Position acquisition unit, obtains physical centre position and the optical centre position of described selected chip package;
Judging unit, according to the target physical center that described pcb board configures and objective optics center, and the facilities of described selected chip package on described pcb board, judge and export described physical centre position and optical centre position respectively with the match condition of described target physical center and described objective optics center.
14. devices according to claim 8, it is characterized in that, described overall goals sweep parameter determines to obtain according to the current pose of the predefine Installation posture of described chip assembly in corresponding image capture device, described chip assembly and the predefine image way of output of described image capture device.
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| CN116011396A (en) * | 2023-01-13 | 2023-04-25 | 深圳市云采网络科技有限公司 | Method and device for building component simulation data and electronic equipment |
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| CN116011396A (en) * | 2023-01-13 | 2023-04-25 | 深圳市云采网络科技有限公司 | Method and device for building component simulation data and electronic equipment |
| CN116011396B (en) * | 2023-01-13 | 2023-11-17 | 深圳市云采网络科技有限公司 | Method and device for building component simulation data and electronic equipment |
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| CN105115421B (en) | 2018-07-13 |
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