CN116011388B - Circuit board winding method and device, storage medium and electronic equipment - Google Patents
Circuit board winding method and device, storage medium and electronic equipment Download PDFInfo
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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Abstract
The invention discloses a winding method and device of a circuit board, a storage medium and electronic equipment, and relates to the field of computers, wherein the method comprises the following steps: acquiring an initial winding result of an integrated circuit module in a printed circuit board, wherein the initial winding result refers to a result that each pin of the integrated circuit module is connected with other components through leads; judging whether the initial winding result meets the winding allowance requirement, wherein the satisfaction of the winding allowance requirement indicates that the winding result meets the requirement of circuit design, and inputting the winding parameters of the integrated circuit module into a target strategy model to output the winding adjustment actions of all pins of the integrated circuit module under the condition that the initial winding result does not meet the winding allowance requirement; and adjusting the winding of each pin of the integrated circuit module according to the winding adjustment action to obtain a target winding result. The invention solves the technical problem that the development speed and quality of wiring are difficult to improve when the circuit board is wired manually in the related art.
Description
Technical Field
The embodiment of the application relates to the field of computers, in particular to a winding method and device of a circuit board, a storage medium and electronic equipment.
Background
In the process of layout of a printed circuit board, wiring of the circuit board is always a key element of the layout process. The trip wire of integrated circuits (IC: integrated Circuit) of Ball Grid Array packages (BGA: ball Grid Array) is a challenge. Because the ball grid array package has a plurality of pins, and each pin is arranged in a two-dimensional manner, if the pins in the integrated circuit need to be pulled to the outside for other parts or circuits, the wires must bypass other pins to reach the required places. In addition, there is a need to comply with design rule checks for various printed circuit board traces. When some design rules change or the design of the device changes, the wiring of the whole printed circuit board needs to be rearranged and wound again.
In order to solve the problem that the circuit board needs to be rewound when the rule is sent to change, in the traditional technology, the circuit board can be wired in a manual operation mode, but the mode is very dependent on the knowledge and experience of a wiring engineer, however, the output speed of the method is limited by the manpower quality and the cost, and a great amount of manpower cost and development time are consumed in the frequently modified development situation.
Based on the above problems, in order to improve the development time of wiring of a circuit board, a software tool is used to automatically wire the printed circuit board, but there are many problems with this method: in order to ensure that a circuit board meeting the requirements is produced when the automatic wiring tool is operated, a wiring engineer is required to input parameters and prompt conditions related to modification from the operation of the automatic wiring software, and therefore, a great deal of time and labor cost are consumed for setting corresponding parameters when the automatic wiring software is operated.
Disclosure of Invention
The embodiment of the invention provides a winding method and device of a circuit board, a storage medium and electronic equipment, which at least solve the technical problem that automatic wiring software in the related technology also needs to use manpower to improve the development speed and quality of wiring.
According to one embodiment of the present application, there is provided a winding method of a circuit board, including: acquiring an initial winding result of an integrated circuit module in a printed circuit board, wherein the initial winding result refers to a result that each pin of the integrated circuit module is connected with other components through leads; judging whether an initial winding result meets a winding enabling requirement or not, and inputting winding parameters of the integrated circuit module into a target strategy model under the condition that the initial winding result does not meet the winding enabling requirement, and outputting winding adjustment actions of all pins of the integrated circuit module, wherein the winding parameters of the integrated circuit module are used for describing the initial winding result, and the winding enabling requirement refers to the winding requirement conforming to a preset circuit design; and adjusting the winding of each pin of the integrated circuit module according to the winding adjustment action to obtain a target winding result.
Optionally, in an exemplary embodiment, before obtaining the initial winding result of the integrated circuit module in the printed circuit board, the method further includes: and winding each pin of the integrated circuit module according to a winding sequence rule to obtain an initial winding result, wherein the winding sequence rule at least comprises one of the following steps: the first winding rule is to perform winding according to the high-low sequence of the data transmission speed of the signal line; the second winding rule is to sequentially wind according to the distance between the pin and a target object, wherein the target object is an object to be wound of the pin; a third winding rule, wherein the third winding rule refers to the sequential winding according to the number of the layout design rules to be followed by the signal line; and a fourth winding rule, wherein the fourth winding rule refers to sequential winding from a pair winding requirement to no pair winding requirement according to the signal line.
Optionally, in an exemplary embodiment, in a case where each pin of the integrated circuit module is wound using a plurality of winding rules, priorities of the first winding rule, the second winding rule, the third winding rule, and the fourth winding rule are sequentially decreased.
Optionally, in an exemplary embodiment, the initial winding result includes a plurality of sub-winding results, where each sub-winding result refers to a result that a current pin is connected to other components except the current pin through a lead, and each sub-winding result is obtained by: determining a target object to which the current pin needs to be connected; determining a wire distance to be kept between a lead and an obstacle during wire winding, and determining the shortest path between the current pin and a target object under the wire distance in a grid of a printed circuit board; and arranging the leads between the current pin and the target object according to the shortest path to obtain a sub-winding result of the current pin.
Optionally, in an exemplary embodiment, determining the wire pitch and determining a shortest path between the current pin and the target object at the wire pitch in the grid of the printed circuit board includes: setting virtual barriers according to the interval distance requirement between wires and the width of the wiring, and determining the width of the virtual barriers as the wire distance; a shortest path between the current pin and the target object at the line distance is determined in the grid of the printed circuit board that bypasses the obstacle, wherein the obstacle includes a physical obstacle as well as a virtual obstacle.
Optionally, in one exemplary embodiment, a shortest path between the current pin and the target object that bypasses the obstacle is determined using a trip point search algorithm.
Optionally, in an exemplary embodiment, the initial winding result includes a plurality of sub-winding results, where each sub-winding result is a result that one pin is connected to another component through a lead, and determining whether the initial winding result meets a winding enabling requirement includes: for each sub-winding result, determining the sub-winding fraction according to the condition conforming to the layout design rule; calculating the sum of the winding scores of all the sub-windings to obtain the winding score of the initial winding result; judging whether the winding fraction of the initial winding result meets the winding allowance fraction condition or not; and under the condition that the winding fraction of the initial winding result meets the winding allowance fraction condition, determining that the initial winding result meets the winding allowance requirement.
Optionally, in an exemplary embodiment, for each sub-winding result, determining the sub-winding score according to the case of meeting the layout design rule includes: judging whether the sub-winding result accords with the layout design rule; under the condition that the sub-winding result accords with the layout design rule, determining the winding allowed fraction as the sub-winding fraction of the sub-winding result; under the condition that the sub-winding result does not accord with the layout design rule, determining the type and degree of the sub-winding result which does not accord with the layout design rule; determining each initial score according to the degree that the sub-winding result does not accord with the layout design rules of different types, determining each weight according to the type that the sub-winding result does not accord with the layout design rules of different types, and carrying out weighted summation on the initial scores according to the weights to obtain the sub-winding score of the sub-winding result.
Optionally, in one exemplary embodiment, determining whether the winding fraction of the initial winding result satisfies the winding allowed fraction condition includes: judging whether the winding fraction of the initial winding result is larger than or equal to the winding allowance fraction, and determining that the initial winding result does not meet the winding allowance requirement under the condition that the winding fraction of the initial winding result is larger than or equal to the winding allowance fraction; or determining the winding grade according to the winding fraction of the initial winding result, judging whether the winding grade of the initial winding result is greater than or equal to the winding allowable grade, and determining that the initial winding result does not meet the winding allowable requirement under the condition that the winding grade is greater than the winding allowable grade.
Optionally, in one exemplary embodiment, the target policy model determines the wire-wrap adjustment actions of the integrated circuit module as follows: under the condition that the initial winding result does not meet the winding allowance requirement and the winding allowance degree is larger than the winding allowance degree, the target strategy model determines a winding adjustment action of the integrated circuit module according to a first adjustment strategy; and under the condition that the degree of the initial winding result which does not meet the winding allowance requirement is smaller than or equal to the winding allowance degree, the target strategy model determines the winding adjustment action of the integrated circuit module according to a second adjustment strategy, wherein the adjustment amplitude of the first adjustment strategy is larger than that of the second adjustment strategy.
Optionally, in one exemplary embodiment, the extent to which the initial winding result does not meet the winding enable requirement is determined by a difference between a winding fraction of the initial winding result and the winding enable fraction, or by a relationship between a winding grade of the initial winding result and the winding enable winding grade.
Optionally, in an exemplary embodiment, the winding adjustment action includes at least one of the following types: the winding sequence of each pin is adjusted; the method comprises the steps of adjusting the size of a virtual barrier and the position of the virtual barrier, wherein the virtual barrier is used for determining the line distance of a winding action; and adjusting the position of the middle point where the lead wire of the winding operation passes.
Optionally, in an exemplary embodiment, the order of the individual wire winding adjustment actions in the first adjustment strategy is as follows: the winding sequence of each pin is adjusted, the size of a virtual barrier arranged on the printed circuit board is adjusted, the position of the virtual barrier is adjusted, and the position of a middle point through which a lead wire of a winding action passes is adjusted.
Optionally, in an exemplary embodiment, the order of the individual wire winding adjustment actions in the second adjustment strategy is as follows: the method comprises the steps of adjusting the position of a middle point where a lead wire of a winding operation passes, adjusting the winding sequence of each pin, and adjusting the size and the position of a virtual barrier arranged on a printed circuit board.
Optionally, in one exemplary embodiment, the target policy model is trained by: and iteratively training an initial strategy model by adopting a plurality of groups of winding data until the value of a loss function of the strategy model obtained by training reaches a preset value allowed by winding, wherein each group of winding data comprises winding parameters of a current winding event of the integrated circuit module, scores of winding results and winding adjustment actions.
Optionally, in an exemplary embodiment, the value of the loss function is a result of a weighted summation of a sub-winding fraction of a sub-winding result of each pin of the current winding event and attenuation factors, wherein each attenuation factor characterizes a degree of influence of one winding on a total winding condition of the integrated circuit module, and each sub-winding fraction is used to describe a degree to which one sub-winding result conforms to a layout design rule.
Optionally, in an exemplary embodiment, iteratively training the initial strategy model using the plurality of sets of winding data until a value of a loss function of the trained strategy model reaches a preset value for winding allowance includes: and determining whether the value of the loss function of the strategy model reaches a preset value allowed by winding or not through a gradient descent algorithm.
According to another embodiment of the present application, there is provided a winding apparatus for a circuit board, including: the device comprises an acquisition unit, a control unit and a control unit, wherein the acquisition unit is used for acquiring an initial winding result of an integrated circuit module in a printed circuit board, wherein the initial winding result refers to a result that each pin of the integrated circuit module is connected with other components through leads; the judging unit is used for judging whether the initial winding result meets the winding enabling requirement or not, and inputting winding parameters of the integrated circuit module into the target strategy model under the condition that the initial winding result does not meet the winding enabling requirement, and processing to obtain winding adjustment actions of all pins of the integrated circuit module, wherein the winding parameters of the integrated circuit module are used for describing the initial winding result; and the adjusting unit is used for adjusting the winding of each pin of the integrated circuit module according to the winding adjusting action to obtain a target winding result.
According to a further embodiment of the present application, there is also provided a computer readable storage medium having a computer program stored therein, wherein the computer program is arranged to perform the steps of any of the method embodiments described above when run.
According to a further embodiment of the present application, there is also provided an electronic device comprising a memory having stored therein a computer program and a processor arranged to run the computer program to perform the steps of any of the method embodiments described above.
According to the method and the device, an initial winding result of the integrated circuit module in the printed circuit board is obtained, wherein the initial winding result refers to a result that all pins of the integrated circuit module are connected with other components through leads; judging whether an initial winding result meets a winding enabling requirement or not, and inputting winding parameters of the integrated circuit module into a target strategy model under the condition that the initial winding result does not meet the winding enabling requirement, and outputting winding adjustment actions of all pins of the integrated circuit module, wherein the winding parameters of the integrated circuit module are used for describing the initial winding result, and the winding enabling requirement refers to the winding requirement conforming to a preset circuit design; and adjusting the winding of each pin of the integrated circuit module according to the winding adjustment action to obtain a target winding result. The technical problem that wiring development speed and quality are difficult to improve when wiring is carried out on the circuit board manually in the related art is solved, and the initial winding result is input into the strategy model to obtain a winding adjustment action on the winding result, so that the initial winding result is adjusted, and the effect of improving the wiring speed of the circuit board is achieved.
Drawings
Fig. 1 is a hardware block diagram of a mobile terminal of a winding method of a circuit board according to an embodiment of the present application;
Fig. 2 is a flowchart of a method of winding a circuit board according to an embodiment of the present application;
FIG. 3 is a schematic diagram of a target strategy model in a circuit board winding method according to an embodiment of the present application;
FIG. 4 is a schematic diagram of a sub-winding plan provided in accordance with an embodiment of the present application;
fig. 5 is a schematic diagram of a circuit board winding device according to an embodiment of the present application;
fig. 6 is a block diagram of a hardware structure of an electronic device (or a mobile device) of a winding method of a circuit board according to an embodiment of the present application.
Detailed Description
Embodiments of the present application will be described in detail below with reference to the accompanying drawings in conjunction with the embodiments.
It should be noted that the terms "first," "second," and the like in the description and claims of the present application and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order.
The method embodiments provided in the embodiments of the present application may be performed in a mobile terminal, a computer terminal or similar computing device. Taking a mobile terminal as an example, fig. 1 is a block diagram of a hardware structure of a mobile terminal of a winding method of a circuit board according to an embodiment of the present application, as shown in fig. 1, the mobile terminal may include one or more (only one is shown in fig. 1) processors 102 (the processors 102 may include, but are not limited to, a microprocessor MCU or a programmable logic device FPGA, etc.) and a memory 104 for storing data, where the mobile terminal may further include a transmission device 106 for a communication function and an input/output device 108. It will be appreciated by those skilled in the art that the structure shown in fig. 1 is merely illustrative and not limiting of the structure of the mobile terminal described above. For example, the mobile terminal may also include more or fewer components than shown in fig. 1, or have a different configuration than shown in fig. 1.
The memory 104 may be used to store a computer program, for example, a software program of application software and a module, such as a computer program corresponding to a winding method of a circuit board in the embodiment of the present application, and the processor 102 executes the computer program stored in the memory 104 to perform various functional applications and data processing, that is, implement the above-mentioned method. Memory 104 may include high-speed random access memory, and may also include non-volatile memory, such as one or more magnetic storage devices, flash memory, or other non-volatile solid-state memory. In some examples, the memory 104 may further include memory remotely located relative to the processor 102, which may be connected to the mobile terminal via a network. Examples of such networks include, but are not limited to, the internet, intranets, local area networks, mobile communication networks, and combinations thereof.
The transmission device 106 is used to receive or transmit data via a network. Specific examples of the network described above may include a wireless network provided by a communication provider of the mobile terminal. In one example, the transmission device 106 includes a network adapter (Network Interface Controller, simply referred to as NIC) that can connect to other network devices through a base station to communicate with the internet. In one example, the transmission device 106 may be a Radio Frequency (RF) module, which is configured to communicate with the internet wirelessly.
In this embodiment, a method for operating a circuit board winding system is provided, and fig. 2 is a flowchart of a circuit board winding method according to an embodiment of the present application, as shown in fig. 2, where the flowchart includes the following steps:
step S201, an initial winding result of the integrated circuit module in the printed circuit board is obtained, where the initial winding result refers to a result that each pin of the integrated circuit module is connected with other components through a lead.
The printed circuit board (PCB: printed circuit boards) is a provider of electrical connection of electronic components, and can be divided into a single-panel board, a double-panel board, a four-layer board, a six-layer board and other multi-layer circuit boards according to the number of layers of the circuit board. Pins refer to wires led out from the internal circuit of the integrated circuit and connected with peripheral circuits, and all the pins form the interface of the chip. The components may include resistors, inductors, transistors, and the like. The initial winding result refers to the result of connecting each pin with other components through a lead, and the other components refer to components at the periphery of each pin of the integrated circuit module.
It should be noted that, since different routing modes of pins in an integrated circuit module of a printed circuit board affect time delay and signal quality, in order to enable the integrated circuit module to have routing with a shortest path, minimize time delay and improve signal quality of routing, it is necessary to perform judgment and analysis on an initial winding result of the printed circuit board, and when the result indicates that the result does not meet the requirement, it is necessary to modify the routing condition of the pins, so that the initial winding result needs to be obtained first.
Step S202, judging whether the initial winding result meets the winding enabling requirement, and inputting the winding parameters of the integrated circuit module into a target strategy model and outputting the winding adjustment actions of all pins of the integrated circuit module under the condition that the initial winding result does not meet the winding enabling requirement, wherein the winding enabling requirement refers to the winding requirement conforming to the preset circuit design, and the winding parameters of the integrated circuit module are used for describing the initial winding result.
Optionally, in the winding method of the circuit board provided by the embodiment of the present invention, the target policy model is trained by: and adopting a plurality of groups of winding data to iteratively train an initial strategy model until the value of a loss function of the strategy model obtained by training reaches a preset value, wherein each group of winding data comprises winding parameters of a current winding event of the integrated circuit module, scores of winding results and winding adjustment actions.
Specifically, the winding allowance requirement refers to a pin winding result capable of meeting the wiring requirement, for example, the winding allowance requirement can be that the level of the winding result needs to reach a low level, or when the total division of the winding result is 10 minutes, the fraction of the winding result needs to be less than or equal to 4 minutes, the target strategy model is a strategy model trained according to training set data formed by a plurality of groups of historical winding, the target strategy model can be a model of adjusting strategies according to different inputs and outputs, and the strategy model can be adjusted according to the training set data, wherein the strategy model outputs winding adjustment actions capable of meeting the winding allowance requirement.
Step S203, the winding of each pin of the integrated circuit module is adjusted according to the winding adjustment action, and a target winding result is obtained.
Specifically, the winding adjustment action output by the policy model may include adjusting the pin order, adjusting the position of the obstacle, and the like. And the position and winding sequence of the middle point, through which the lead passes, of the pin in the integrated circuit is adjusted through the winding adjustment action output by the strategy model, and the position and the size of the virtual barrier are adjusted, so that a target winding result meeting the winding allowance requirement is obtained.
Fig. 3 is a schematic diagram of a target policy model in a winding method of a circuit board according to an embodiment of the present application, as shown in fig. 3, an initial winding result is input into a trained policy model to obtain an adjustment policy, then a winding result is obtained after adjustment according to the adjustment policy, a checking result and related position information are fed back by the winding result, and finally the target winding result is obtained after further adjustment according to the position information, wherein the adjustment policy includes an adjustment action for adjusting the winding result, and the checking result includes a winding fraction and a winding grade corresponding to the winding result.
Through the steps: obtaining an initial winding result of an integrated circuit module in a printed circuit board, wherein the initial winding result refers to a result that all pins of the integrated circuit module are connected with other components through leads, and the other components refer to components at the periphery of all pins of the integrated circuit module; judging whether the initial winding result meets the winding allowance requirement or not, and inputting winding parameters of the integrated circuit module into a target strategy model under the condition that the initial winding result does not meet the winding allowance requirement, and outputting winding adjustment actions of all pins of the integrated circuit module, wherein the winding parameters of the integrated circuit module are used for describing the initial winding result; the method comprises the steps of adjusting the winding of each pin of the integrated circuit module according to the winding adjustment action to obtain a target winding result, solving the technical problem that the wiring development speed and quality are difficult to improve when the circuit board is wired manually in the related art, and obtaining the winding adjustment action on the winding result by inputting the initial winding result into the strategy model, so as to adjust the initial winding result, thereby achieving the effect of improving the wiring speed of the circuit board.
The main execution body of the above steps may be a server, a terminal, or the like, but is not limited thereto.
The execution order of step S202 and step S203 may be interchanged, i.e. step S203 may be executed first and then step S202 may be executed.
Embodiments of the present invention will be described in detail with reference to the following steps.
In the method for winding a circuit board according to the embodiment of the present invention, before obtaining an initial winding result of an integrated circuit module in a printed circuit board, the method further includes: and winding each pin of the integrated circuit module according to a winding sequence rule to obtain an initial winding result, wherein the winding sequence rule at least comprises one of the following steps: the first winding rule is to perform winding according to the high-low sequence of the data transmission speed of the signal line; the second winding rule is to sequentially wind according to the distance between the pin and a target object, wherein the target object is an object to be wound of the pin; a third winding rule, wherein the third winding rule refers to the sequential winding according to the number of the layout design rules to be followed by the signal line; and a fourth winding rule, wherein the fourth winding rule refers to sequential winding from a pair winding requirement to no pair winding requirement according to the signal line.
When the wiring rule is needed, the connection order rule to be observed when the pins are wound in the circuit is defined, and the wiring is conducted, if all the pins in the integrated circuit can meet the wiring rule, the quality requirement on the signals can be met.
Specifically, the first winding rule is to arrange the high-speed signal to the low-speed signal according to the speed of the signal line for transmitting data as a winding sequence standard, that is, the pin with the fastest data transmission is wound in advance, and the last winding with the slowest data transmission is performed. The high-speed bus signal lines (such as devices conforming to the high-speed serial computer expansion bus standard, serial advanced technology accessories, etc.), and clock signals can be used as the high-speed signal lines.
The second winding rule is to sequence according to the sequence from the far signal to the near signal, i.e. the pin farthest from the object to be wound is used as the pin of the first winding, and the pin closest to the object to be wound is wound finally.
The third routing rule refers to that the pins with more layout design rules are routed first, and the routing order is sequentially decreased according to the number of the layout design rules to be complied with, wherein the layout design rules are Design Rule Check.
The fourth winding rule is that if the signal line of the pin has a pin with a pair of winding requirements, the pin with no pair of winding requirements is wound in advance, and the pin with no pair of winding requirements is wound finally.
In the method for winding a circuit board according to the embodiment of the present invention, when the pins of the integrated circuit module are wound by using a plurality of winding rules, the priorities of the first winding rule, the second winding rule, the third winding rule and the fourth winding rule decrease in sequence.
Specifically, the routing of each pin creates a set of pin-to-pin traces. The trace generated by the previous pin is considered an obstacle on the same plane. Therefore, the first group of wires can reach the shortest wire distance, and the last group of wires need to find the shortest distance after avoiding all obstacles. Because more winding spaces and alternative paths can be obtained when the pins which are more difficult to achieve the conditions are wound in advance, the priorities of the four winding rules are sequentially decreased, namely, when the pins which meet the first winding rule are wound in advance, the pins which meet the second winding rule are wound after the pins which meet the first winding rule are wound, the pins which meet the first and second winding rules are wound after the pins which meet the third winding rule are wound, and finally, the pins which meet the fourth winding rule are wound.
Optionally, in the winding method of the circuit board provided by the embodiment of the present invention, the initial winding result includes a plurality of sub-winding results, where each sub-winding result refers to a result that a current pin is connected to other components except the current pin through a lead, and each sub-winding result is obtained by: determining a target object to which the current pin needs to be connected; determining a wire distance to be kept between a lead and an obstacle during wire winding, and determining the shortest path between the current pin and a target object under the wire distance in a grid of a printed circuit board; and arranging the leads between the current pin and the target object according to the shortest path to obtain a sub-winding result of the current pin.
Specifically, the initial winding result is a winding result obtained by winding a plurality of pins respectively, the winding result of each pin is recorded as a sub-winding result, and when the pins are wound, a target object to which the pins need to be connected is firstly required to be confirmed, wherein the target object can comprise another pin, a component and the like; secondly, determining a line distance between the virtual barrier and the line, wherein the line distance refers to a certain distance between the lines, the virtual barrier can be a through hole of a printed circuit board, and the line distance can influence the wiring, so that the wiring of other pins is treated as the virtual barrier; then, the shortest path length under the current line width, namely the shortest distance after bypassing the obstacle, needs to be determined; and finally, obtaining a winding result according to the determined arrangement mode.
For example, fig. 4 is a schematic diagram of sub-winding planning provided according to an embodiment of the present application, where, as shown in fig. 4, a white rectangular portion is a virtual obstacle, a "start" refers to a start pin, a "end" refers to a final target object, a width of a grid unit area refers to a distance between the grid unit area and the virtual obstacle during winding, a length of each square is recorded as a line distance, and a minimum path of two points, that is, a solid line portion, is quickly found in a square grid environment according to a path planning algorithm.
The path planning algorithm may be multiple, and optionally, in the winding method of the circuit board provided by the embodiment of the invention, a shortest path between the current pin and the target object bypassing the obstacle is determined by adopting a jump point searching algorithm.
It should be noted that, the jump point search algorithm, i.e. JPS (Jump Point Search), can find a path on the grid map, and is suitable for use as a path finding means of the 2D grid map and a calculation method of the two-pin connection path.
Specifically, after the size of the grid is properly adjusted, that is, the width of each pin trace is set, the algorithm can detect the obstacle to find the shortest path between two points during trace path planning.
Optionally, in the winding method of the circuit board provided by the embodiment of the present invention, determining a wire distance between a lead and an obstacle to be maintained during winding, and determining a shortest path between a current pin and a target object at the wire distance in a grid of the printed circuit board includes: setting virtual barriers according to the interval distance requirement between wires and the width of the wiring, and determining the width of the virtual barriers as the wire distance; a shortest path between the current pin and the target object at the line distance is determined in the grid of the printed circuit board that bypasses the obstacle, wherein the obstacle includes a physical obstacle as well as a virtual obstacle.
Specifically, the line distance in the design rule refers to a certain interval distance between lines, further, the line distance is set to be the width of a virtual barrier, the barrier can include a physical barrier, a virtual barrier and a reserved space with an interval distance from the rest of the lines, and since the pins cannot be overlapped with the paths of the lines when being routed, the width of the lines, that is, the certain interval distance between the lines, needs to be considered, in a square grid environment, the length of a square grid is recorded as a line distance unit, that is, the basic width of the lines, the width of each line can be set as long as the size of a grid through which the lines pass is properly adjusted, and the area occupied by the barrier can be set by using the skill, wherein the area where the barrier is located is the area through which the lines cannot pass. The layout trace cannot pass through certain specific areas so as to achieve the design rule that the line-to-line distance is kept.
In the method for winding a circuit board according to the embodiment of the present invention, optionally, the initial winding result includes a plurality of sub-winding results, each sub-winding result is a result of connecting one pin with other components through a lead, and determining whether the initial winding result meets the winding allowance requirement includes: for each sub-winding result, determining the sub-winding fraction according to the condition conforming to the layout design rule; calculating the sum of the winding scores of all the sub-windings to obtain the winding score of the initial winding result; judging whether the winding fraction of the initial winding result meets the winding allowance fraction condition or not; and under the condition that the winding fraction of the initial winding result meets the winding allowance fraction condition, determining that the initial winding result meets the winding allowance requirement.
Specifically, each sub-winding result is input to the inspection software to obtain a sub-winding score corresponding to each sub-winding result and a result analysis report, for example, the inspection software may be DRC (Design Rule Check), where the result analysis report includes which winding does not conform to the layout design rule. And determining the sub-winding scores of each sub-winding result according to the severity degree of the non-conforming rule in the report, and adding the scores to obtain a total score, namely the winding score.
And comparing the calculated total score with a winding allowance score, and judging whether the winding result meets the winding allowance requirement or not, wherein the winding allowance score corresponds to the winding result under the winding allowance requirement. And under the condition that the total score meets the winding allowance score, namely the winding result meets the winding allowance requirement, determining that the initial winding result meets the requirement.
Optionally, in the winding method of the circuit board provided by the embodiment of the present invention, for each sub-winding result, determining the sub-winding score according to the situation that the layout design rule is met includes: judging whether the sub-winding result accords with the layout design rule; under the condition that the sub-winding result accords with the layout design rule, determining the winding allowed fraction as the sub-winding fraction of the sub-winding result; under the condition that the sub-winding result does not accord with the layout design rule, determining the type and degree of the sub-winding result which does not accord with the layout design rule; determining each initial score according to the degree that the sub-winding result does not accord with the layout design rules of different types, determining each weight according to the type that the sub-winding result does not accord with the layout design rules of different types, and carrying out weighted summation on the initial scores according to the weights to obtain the sub-winding score of the sub-winding result.
Specifically, when the sub-winding result accords with the layout design rule, the sub-winding score, namely the sub-winding score, is determined as the winding allowance score; in the case where the result of the sub-winding does not meet the layout design rule, the degree of the non-compliance, that is, the degree of the error, needs to be determined.
Specifically, by detecting the order of the pin windings and the positions of the virtual obstacles, a level which does not conform to the layout design rule is obtained, wherein the level may include a strict level, a high level and a lower level, and the level is displayed as a "strict level" and indicates that the error is the worst, and if the level is a "strict level", rewiring is required.
Further, each initial score is determined according to the degree of non-conforming to the layout design rules of different types, and then weights are determined according to the types of non-conforming rules, and the sub-winding scores are obtained through weighted summation.
In the case that the initial winding result does not meet the winding allowance requirement, the winding fraction and the winding grade need to be used for determining, optionally, in the winding method of the circuit board provided by the embodiment of the invention, determining whether the winding fraction of the initial winding result meets the winding allowance fraction condition includes: judging whether the winding fraction of the initial winding result is larger than or equal to the winding allowance fraction, and determining that the initial winding result does not meet the winding allowance requirement under the condition that the winding fraction of the initial winding result is larger than or equal to the winding allowance fraction; or determining the winding grade according to the winding fraction of the initial winding result, judging whether the winding grade of the initial winding result is greater than or equal to the winding allowable grade, and determining that the initial winding result does not meet the winding allowable requirement under the condition that the winding grade is greater than the winding allowable grade.
The manner of determining whether the wire wrap enable requirements are met may be determined by score or rank. Specifically, the calculated winding fraction is compared with the winding fraction required to be obtained according to the winding allowance. If the calculated fraction is greater than or equal to the fraction corresponding to the winding allowance requirement, the winding is not met, and the winding needs to be adjusted, for example, the winding fraction obtained by the winding allowance requirement is 5, and if the calculated fraction of the winding result of the circuit board is 7, the winding of the circuit board is not met, and the winding needs to be adjusted.
On the other hand, by judging the winding result in terms of the level, a winding level is obtained, and then the level is compared with the level corresponding to the winding enabling request, and when the winding level is greater than the level of the winding enabling request, it is determined that the winding enabling request is not satisfied, for example, if the winding level corresponding to the winding enabling request is low and the winding level corresponding to the winding result is high, it is indicated that the winding result does not satisfy the winding enabling request, and adjustment is required from the aspect of the position of the intermediate point through which the wiring passes, and the like.
In the method for winding the circuit board provided by the embodiment of the invention, the target strategy model determines the winding adjustment action of the integrated circuit module according to the following modes: under the condition that the initial winding result does not meet the winding allowance requirement and the winding allowance degree is larger than the winding allowance degree, the target strategy model determines a winding adjustment action of the integrated circuit module according to a first adjustment strategy; and under the condition that the degree of the initial winding result which does not meet the winding allowance requirement is smaller than or equal to the winding allowance degree, the target strategy model determines the winding adjustment action of the integrated circuit module according to a second adjustment strategy, wherein the adjustment amplitude of the first adjustment strategy is larger than that of the second adjustment strategy.
Optionally, in the winding method of the circuit board provided by the embodiment of the present invention, the extent to which the initial winding result does not meet the winding allowance requirement is determined by a difference between the winding score of the initial winding result and the winding allowance score, or by a relationship between the winding grade of the initial winding result and the winding allowance grade.
Specifically, the winding-allowed winding fraction and the winding-allowed winding grade are determined by the winding-allowed requirement. For example, a winding allowable winding score of 5 minutes is obtained by winding allowable winding of a circuit board wiring, a winding allowable winding grade is lower, a winding result is obtained after preliminary winding is carried out on the circuit board, a winding score corresponding to the winding result is obtained by calculation and is 8 minutes, the winding grade is strict, a first adjustment strategy and a second adjustment strategy are obtained after the winding allowable winding score is input into a strategy model, and the error occurrence degree is larger and large-scale adjustment is needed; the winding fraction becomes 7 after adjustment according to the first adjustment strategy; further, further adjustment is performed according to the second adjustment strategy, and the obtained winding fraction becomes 6, so that the adjustment is effective.
On the other hand, since the winding grade corresponding to the winding result of the circuit board is a strict grade, the winding grade becomes a high grade after being adjusted according to the first adjustment strategy; and further, the second adjustment strategy is used for adjustment to obtain a lower winding grade, so that the strategy can be effectively adjusted.
The operation degree of the winding adjustment is determined according to the degree that the winding allowance requirement is not satisfied, the adjustment amplitude of the first adjustment strategy is large, and the adjustment amplitude of the second adjustment strategy is small.
The winding adjustment action may include various types, and optionally, in the winding method of the circuit board provided in the embodiment of the present invention, the winding adjustment action includes at least one of the following types: the winding sequence of each pin is adjusted; the method comprises the steps of adjusting the size of a virtual barrier and the position of the virtual barrier, wherein the virtual barrier is used for determining the line distance of a winding action; and adjusting the position of the middle point where the lead wire of the winding operation passes.
Specifically, when the initial winding result is compared with the winding allowance requirement, the winding needs to be adjusted, and the adjustment mode includes adjustment of the winding sequence of the pins, adjustment of the size and the position of the set barrier and adjustment of the position of the passing point of the lead.
Optionally, in the winding method of the circuit board provided by the embodiment of the present invention, the sequence of each winding adjustment action in the first adjustment policy is as follows: the winding sequence of each pin is adjusted, the size of a virtual barrier arranged on the printed circuit board is adjusted, the position of the virtual barrier is adjusted, and the position of a middle point through which a lead wire of a winding action passes is adjusted.
Specifically, when the winding result is larger than the winding allowance requirement, the pin winding in the initial winding result is adjusted according to the first adjustment strategy in the target strategy model, and the adjusting part can be for adjusting the winding sequence, adjusting the size position of the virtual barrier and adjusting the interval position between the winding.
Optionally, in the winding method of the circuit board provided by the embodiment of the present invention, the sequence of each winding adjustment action in the second adjustment policy is as follows: the method comprises the steps of adjusting the position of a middle point where a lead wire of a winding operation passes, adjusting the winding sequence of each pin, and adjusting the size and the position of a virtual barrier arranged on a printed circuit board.
Specifically, when the winding result is smaller than the winding allowance requirement, the pin winding in the initial winding result is adjusted according to a second adjustment strategy in the target strategy model; or when the positions of the pins, the leads and the like are adjusted according to the first adjustment strategy and then are input into the model for continuous detection, and the winding result still does not meet the requirement of winding allowance, the winding result is required to be adjusted secondarily according to the second adjustment strategy.
Optionally, in the winding method of a circuit board provided by the embodiment of the present invention, the value of the loss function is a result of weighted summation of a sub-winding fraction of a sub-winding result of each pin of a current winding event and an attenuation factor, where each attenuation factor characterizes a degree of influence of one winding on a total winding condition of the integrated circuit module, and each sub-winding fraction is used for describing a degree that one sub-winding result accords with a layout design rule.
Specifically, since each winding is sequential and the correlation between the result of each winding and the execution of the winding is the greatest, in order to improve the accuracy of the output result, an attenuation factor is introduced, and the attenuation factor can be preset, when the product calculation is performed on the sub-winding fraction of each sub-winding result and the attenuation factor, the correlation between other windings and the current winding action becomes low, and the accuracy of the output result is improved.
Specifically, the loss function is set to L, l=Σan, where An is a total evaluation function of a plurality of pins, and refers to a result of weighted summation of a sub-winding fraction of a sub-winding result of each pin and An attenuation factor, r represents An evaluation function of each pin, d represents An attenuation factor, n represents the number of pins, and then the total evaluation function is: an=r1+r2 (d 1 )+ r3*(d 2 )+...+ rn*(d n-1 )= Σ N n=x rn*d^(n-x) 。
Optionally, in the winding method of the circuit board provided by the embodiment of the present invention, iteratively training the initial policy model by using a plurality of sets of winding data until a value of a loss function of the policy model obtained by training reaches a preset value includes: and determining whether the value of the loss function of the strategy model reaches a preset value or not through a gradient descent algorithm.
Specifically, the Gradient Descent inspection algorithm, i.e., GD algorithm (Gradient device), is an algorithm for obtaining optimization parameters. The objective is to obtain a set of parameters that minimizes the output of the loss function, i.e. to make the loss function in the policy model reach the preset parameters.
The embodiment also provides a winding device for a circuit board, which is used for implementing the above embodiment and the preferred implementation, and is not described again. As used below, the term "unit" may be a combination of software and/or hardware that implements a predetermined function. While the means described in the following embodiments are preferably implemented in software, implementation in hardware, or a combination of software and hardware, is also possible and contemplated.
Fig. 5 is a schematic view of a winding device of a circuit board according to an embodiment of the present application, as shown in fig. 5, the device includes: acquisition unit 50, judgment unit 51, adjustment unit 52.
An obtaining unit 50, configured to obtain an initial winding result of the integrated circuit module in the printed circuit board, where the initial winding result is a result that each pin of the integrated circuit module is connected to other components through a lead;
the judging unit 51 is configured to judge whether an initial winding result meets a winding enabling requirement, and input a winding parameter of the integrated circuit module into a target policy model to obtain a winding adjustment action of each pin of the integrated circuit module when the initial winding result does not meet the winding enabling requirement, where the winding parameter of the integrated circuit module is used to describe the initial winding result, and the winding enabling requirement is a winding requirement that meets a preset circuit design;
and the adjusting unit 52 is used for adjusting the winding of each pin of the integrated circuit module according to the winding adjusting action to obtain a target winding result.
Optionally, in the winding device for a circuit board provided by the embodiment of the present invention, the device further includes: and the winding unit is used for winding each pin of the integrated circuit module according to a winding sequence rule before obtaining an initial winding result of the integrated circuit module in the printed circuit board to obtain the initial winding result, wherein the winding sequence rule at least comprises one of the following steps: the first winding rule is to perform winding according to the high-low sequence of the data transmission speed of the signal line; the second winding rule is to sequentially wind according to the distance between the pin and a target object, wherein the target object is an object to be wound of the pin; a third winding rule, wherein the third winding rule refers to the sequential winding according to the number of the layout design rules to be followed by the signal line; and a fourth winding rule, wherein the fourth winding rule refers to sequential winding from a pair winding requirement to no pair winding requirement according to the signal line.
Optionally, in the winding device for a circuit board provided by the embodiment of the present invention, in a case where each pin of the integrated circuit module uses a plurality of winding rules to perform winding, priorities of the first winding rule, the second winding rule, the third winding rule and the fourth winding rule decrease sequentially.
Optionally, in the winding device for a circuit board provided by the embodiment of the present invention, the initial winding result includes a plurality of sub-winding results, each sub-winding result is a result that a current pin is connected with other components except for the current pin through a lead, the device further includes a connection unit, the connection unit is used for determining each sub-winding result, and the connection unit includes: the first determining module is used for determining a target object to which the current pin needs to be connected; the second determining module is used for determining the wire distance to be kept between the lead and the obstacle during wire winding and determining the shortest path between the current pin and the target object under the wire distance in the grid of the printed circuit board; the obtaining module is used for arranging the leads between the current pins and the target object according to the shortest path to obtain the sub-winding result of the current pins.
Optionally, in the winding device for a circuit board provided in the embodiment of the present invention, the obtaining unit 50 includes: the setting module is used for setting virtual barriers according to the interval distance requirement between the wires and the width of the wiring, and determining the width of the virtual barriers as the wire distance; and a third determining module for determining a shortest path between the current pin and the target object at the line distance around the obstacle in the grid of the printed circuit board, wherein the obstacle comprises a physical obstacle and a virtual obstacle.
Optionally, in the winding device for a circuit board provided by the embodiment of the present invention, a shortest path between the current pin and the target object bypassing the obstacle is determined by using a trip point search algorithm.
Optionally, in the winding device for a circuit board provided in the embodiment of the present invention, the determining unit 51 includes: the fourth determining module is used for determining the sub-winding fraction according to the situation conforming to the layout design rule for each sub-winding result; the calculation module is used for calculating the sum of the winding scores of all the sub-windings to obtain the winding score of the initial winding result; the first judging module is used for judging whether the winding fraction of the initial winding result meets the winding allowance fraction condition or not; and the fifth determining module is used for determining that the initial winding result meets the winding allowance requirement under the condition that the winding score of the initial winding result meets the winding allowance score condition.
Optionally, in the winding device for a circuit board provided in the embodiment of the present invention, the determining unit 51 includes: the second judging module is used for judging whether the sub-winding result accords with the layout design rule; a sixth determining module, configured to determine a winding allowed fraction as a sub-winding fraction of the sub-winding result when the sub-winding result meets a layout design rule; a seventh determining module, configured to determine, when the sub-winding result does not conform to the layout design rule, a type and a degree of the sub-winding result not conform to the layout design rule; and the eighth determining module is used for determining each initial score according to the degree that the sub-winding result does not accord with the layout design rules of different types, determining each weight according to the type that the sub-winding result does not accord with the layout design rules of different types, and carrying out weighted summation on the initial scores according to the weights to obtain the sub-winding score of the sub-winding result.
Optionally, in the winding device for a circuit board provided in the embodiment of the present invention, the determining unit 51 includes: the third judging module is used for judging whether the winding fraction of the initial winding result is more than or equal to the winding allowance fraction or not, and determining that the initial winding result does not meet the winding allowance requirement under the condition that the winding fraction of the initial winding result is more than or equal to the winding allowance fraction; and the fourth judging module is used for determining the winding grade according to the winding fraction of the initial winding result, judging whether the winding grade of the initial winding result is more than or equal to the winding allowable grade, and determining that the initial winding result does not meet the winding allowable requirement under the condition that the winding grade is more than the winding allowable grade.
Optionally, in the winding device for a circuit board provided by the embodiment of the present invention, the target policy model determines a winding adjustment action of the integrated circuit module according to the following manner: under the condition that the initial winding result does not meet the winding allowance requirement and the winding allowance degree is larger than the winding allowance degree, the target strategy model determines a winding adjustment action of the integrated circuit module according to a first adjustment strategy; and under the condition that the degree of the initial winding result which does not meet the winding allowance requirement is smaller than or equal to the winding allowance degree, the target strategy model determines the winding adjustment action of the integrated circuit module according to a second adjustment strategy, wherein the adjustment amplitude of the first adjustment strategy is larger than that of the second adjustment strategy.
Optionally, in the winding device for a circuit board provided by the embodiment of the present invention, the extent to which the initial winding result does not meet the winding allowance requirement is determined by a difference between the winding score of the initial winding result and the winding allowance score, or by a relationship between the winding grade of the initial winding result and the winding allowance grade.
Optionally, in the winding device for a circuit board provided by the embodiment of the present invention, the winding adjustment action includes at least one of the following types: the winding sequence of each pin is adjusted; the method comprises the steps of adjusting the size of a virtual barrier and the position of the virtual barrier, wherein the virtual barrier is used for determining the line distance of a winding action; and adjusting the position of the middle point where the lead wire of the winding operation passes.
Optionally, in the winding device for a circuit board provided by the embodiment of the present invention, the sequence of each winding adjustment action in the first adjustment strategy is as follows: the winding sequence of each pin is adjusted, the size of a virtual barrier arranged on the printed circuit board is adjusted, the position of the virtual barrier is adjusted, and the position of a middle point through which a lead wire of a winding action passes is adjusted.
Optionally, in the winding device for a circuit board provided by the embodiment of the present invention, the sequence of each winding adjustment action in the second adjustment strategy is as follows: the method comprises the steps of adjusting the position of a middle point where a lead wire of a winding operation passes, adjusting the winding sequence of each pin, and adjusting the size and the position of a virtual barrier arranged on a printed circuit board.
Optionally, in the winding device for a circuit board provided by the embodiment of the present invention, the target policy model is trained by: and iteratively training an initial strategy model by adopting a plurality of groups of winding data until the value of a loss function of the strategy model obtained by training reaches a preset value allowed by winding, wherein each group of winding data comprises winding parameters of a current winding event of the integrated circuit module, scores of winding results and winding adjustment actions.
Optionally, in the winding device for a circuit board provided by the embodiment of the present invention, the value of the loss function is a result of weighted summation of a sub-winding fraction of a sub-winding result of each pin of a current winding event and an attenuation factor, where each attenuation factor characterizes a degree of influence of one winding on a total winding condition of the integrated circuit module, and each sub-winding fraction is used for describing a degree that one sub-winding result accords with a layout design rule.
Optionally, in the winding device for a circuit board provided in the embodiment of the present invention, the adjusting unit 52 includes: and the eleventh determining module is used for determining whether the value of the loss function of the strategy model reaches a preset value allowed by winding through a gradient descent algorithm.
It should be noted that each of the above modules may be implemented by software or hardware, and for the latter, it may be implemented by, but not limited to: the modules are all located in the same processor; alternatively, the above modules may be located in different processors in any combination.
Embodiments of the present application also provide a computer readable storage medium having a computer program stored therein, wherein the computer program is arranged to perform the steps of any of the method embodiments described above when run.
In one exemplary embodiment, the computer readable storage medium may include, but is not limited to: a usb disk, a Read-Only Memory (ROM), a random access Memory (Random Access Memory, RAM), a removable hard disk, a magnetic disk, or an optical disk, or other various media capable of storing a computer program.
An embodiment of the present application further provides an electronic device, fig. 6 is a block diagram of a hardware structure of the electronic device (or mobile device) according to the winding method of the circuit board of the embodiment of the present application, and as shown in fig. 6, the electronic device 60 includes a memory and a processor, where the memory stores a computer program, and the processor is configured to execute the computer program to perform the steps in any of the method embodiments described above.
In an exemplary embodiment, the electronic device may further include a transmission device connected to the processor, and an input/output device connected to the processor.
Specific examples in this embodiment may refer to the examples described in the foregoing embodiments and the exemplary implementation, and this embodiment is not described herein.
It will be appreciated by those skilled in the art that the modules or steps of the application described above may be implemented in a general purpose computing device, they may be concentrated on a single computing device, or distributed across a network of computing devices, they may be implemented in program code executable by computing devices, so that they may be stored in a storage device for execution by computing devices, and in some cases, the steps shown or described may be performed in a different order than that shown or described herein, or they may be separately fabricated into individual integrated circuit modules, or multiple modules or steps of them may be fabricated into a single integrated circuit module. Thus, the present application is not limited to any specific combination of hardware and software.
The foregoing description is only of the preferred embodiments of the present application and is not intended to limit the same, but rather, various modifications and variations may be made by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the principles of the present application should be included in the protection scope of the present application.
Claims (19)
1. A method of winding a circuit board, comprising:
obtaining an initial winding result of an integrated circuit module in a printed circuit board, wherein the initial winding result refers to a result that each pin of the integrated circuit module is connected with other components through leads;
judging whether the initial winding result meets a winding enabling requirement or not, and inputting winding parameters of the integrated circuit module into a target strategy model and outputting winding adjustment actions of all pins of the integrated circuit module under the condition that the initial winding result does not meet the winding enabling requirement, wherein the winding parameters of the integrated circuit module are used for describing the initial winding result, and the winding enabling requirement refers to a winding requirement conforming to a preset circuit design;
the winding of each pin of the integrated circuit module is adjusted according to the winding adjustment action, and a target winding result is obtained;
The target policy model determines a wire wrap adjustment action of the integrated circuit module as follows:
when the initial winding result does not meet the winding allowance requirement to a degree greater than the winding allowance degree, the target strategy model determines a winding adjustment action of the integrated circuit module according to a first adjustment strategy;
and when the initial winding result does not meet the winding allowance requirement, and the degree of the winding allowance requirement is smaller than or equal to the winding allowance degree, the target strategy model determines a winding adjustment action of the integrated circuit module according to a second adjustment strategy, wherein the adjustment amplitude of the first adjustment strategy is larger than that of the second adjustment strategy.
2. The method of claim 1, wherein prior to obtaining the initial winding result for the integrated circuit module in the printed circuit board, the method further comprises:
and winding each pin of the integrated circuit module according to a winding sequence rule to obtain the initial winding result, wherein the winding sequence rule at least comprises one of the following steps:
the first winding rule is to perform winding according to the high-low sequence of the data transmission speed of the signal line;
The second winding rule refers to winding according to the sequence of the distance between the pin and a target object, wherein the target object is an object to be wound of the pin;
a third winding rule, wherein the third winding rule refers to the sequential winding according to the number of the layout design rules to be followed by the signal lines;
and a fourth winding rule, wherein the fourth winding rule refers to sequential winding from a pair winding requirement to no pair winding requirement according to the signal line.
3. The method of claim 2, wherein the priorities of the first routing rule, the second routing rule, the third routing rule, and the fourth routing rule decrease in sequence in the case where each pin of the integrated circuit module is routed using a plurality of routing rules.
4. The method of claim 1, wherein the initial winding result comprises a plurality of sub-winding results, each sub-winding result being a result of connecting a current pin with other components than the current pin through a lead wire, each sub-winding result being obtained by:
determining a target object to be connected with the current pin;
Determining a wire distance to be maintained between a lead and an obstacle during wire winding, and determining a shortest path between the current pin and the target object at the wire distance in a grid of the printed circuit board;
and arranging the leads between the current pin and the target object according to the shortest path to obtain a sub-winding result of the current pin.
5. The method of claim 4, wherein determining a wire spacing to be maintained between a wire and an obstruction when winding and determining a shortest path between the current pin and the target object at the wire spacing in a grid of the printed circuit board comprises:
setting virtual barriers according to the interval distance requirement between wires and the width of the wiring, and determining the width of the virtual barriers as the wire distance;
determining a shortest path between the current pin and the target object at the line distance that bypasses an obstacle in a grid of the printed circuit board, wherein the obstacle comprises a physical obstacle and a virtual obstacle.
6. The method of claim 5, wherein a shortest path between the current pin and the target object that bypasses an obstacle is determined using a trip point search algorithm.
7. The method of claim 1, wherein the initial winding result comprises a plurality of sub-winding results, each sub-winding result being a result of a pin being connected to other components through a lead, and determining whether the initial winding result meets a winding enable requirement comprises:
for each sub-winding result, determining the sub-winding fraction according to the condition conforming to the layout design rule;
calculating the sum of the winding scores of all the sub-windings to obtain the winding score of the initial winding result;
judging whether the winding fraction of the initial winding result meets a winding allowance fraction condition or not;
and under the condition that the winding fraction of the initial winding result meets the winding allowance fraction condition, determining that the initial winding result meets the winding allowance requirement.
8. The method of claim 7, wherein determining the sub-winding fraction for each sub-winding result based on compliance with the layout design rules, respectively, comprises:
judging whether the sub-winding result accords with the layout design rule;
determining the winding allowance fraction as a sub-winding fraction of the sub-winding result under the condition that the sub-winding result accords with the layout design rule;
Determining the type and degree of the sub-winding result which does not accord with the layout design rule under the condition that the sub-winding result does not accord with the layout design rule;
and determining each initial score according to the degree that the sub-winding result does not accord with the layout design rules of different types, determining each weight according to the type that the sub-winding result does not accord with the layout design rules of different types, and weighting and summing the initial scores according to the weights to obtain the sub-winding score of the sub-winding result.
9. The method of claim 7, wherein determining whether the winding fraction of the initial winding result satisfies a winding admission fraction condition comprises:
judging whether the winding fraction of the initial winding result is larger than or equal to the winding allowance fraction, and determining that the initial winding result does not meet the winding allowance requirement under the condition that the winding fraction of the initial winding result is larger than or equal to the winding allowance fraction; or alternatively
And determining a winding grade according to the winding fraction of the initial winding result, judging whether the winding grade of the initial winding result is greater than or equal to a winding allowable grade, and determining that the initial winding result does not meet the winding allowable requirement under the condition that the winding grade is greater than the winding allowable grade.
10. The method of claim 1, wherein the extent to which the initial winding result does not meet the winding enable requirement is determined by a difference between a winding fraction of the initial winding result and a winding enable fraction, or by a relationship of a winding level of the initial winding result and a winding enable winding level.
11. The method of claim 1, wherein the winding adjustment action comprises at least one of the following types:
the winding sequence of each pin is adjusted;
the method comprises the steps of adjusting the size of a virtual barrier and the position of the virtual barrier, wherein the virtual barrier is arranged on a printed circuit board and is used for determining the line distance of a winding action;
and adjusting the position of the middle point where the lead wire of the winding operation passes.
12. The method of claim 11, wherein the sequence of individual wire winding adjustment actions in the first adjustment strategy is as follows:
the winding sequence of each pin is adjusted, the size and the position of the virtual barrier arranged on the printed circuit board are adjusted, and the position of the middle point through which the lead wire of the winding action passes is adjusted.
13. The method of claim 11, wherein the sequence of individual wire winding adjustment actions in the second adjustment strategy is as follows:
The method comprises the steps of adjusting the position of a middle point where a lead wire of a winding action passes, adjusting the winding sequence of each pin, and adjusting the size and the position of a virtual barrier arranged on a printed circuit board.
14. The method of claim 1, wherein the target policy model is trained by:
and iteratively training an initial strategy model by adopting a plurality of groups of winding data until the value of a loss function of the strategy model obtained by training reaches a preset value allowed by winding, wherein each group of winding data comprises winding parameters of a current winding event of the integrated circuit module, scores of winding results and winding adjustment actions.
15. The method of claim 14, wherein the value of the loss function is a result of a weighted summation of a sub-winding fraction of a sub-winding result of each pin of the current winding event and attenuation factors, wherein each attenuation factor characterizes a degree of impact of one winding on a total winding condition of the integrated circuit module, and each sub-winding fraction is used to describe a degree to which one sub-winding result meets layout design rules.
16. The method of claim 14, wherein iteratively training the initial strategy model using the plurality of sets of winding data until a value of a loss function of the trained strategy model reaches a predetermined value for winding allowance comprises: and determining whether the value of the loss function of the strategy model reaches a preset value allowed by the winding or not through a gradient descent algorithm.
17. A circuit board winding apparatus, comprising:
the device comprises an acquisition unit, a control unit and a control unit, wherein the acquisition unit is used for acquiring an initial winding result of an integrated circuit module in a printed circuit board, wherein the initial winding result is a result that each pin of the integrated circuit module is connected with other components through leads;
the judging unit is used for judging whether the initial winding result meets the winding enabling requirement or not, and inputting winding parameters of the integrated circuit module into a target strategy model under the condition that the initial winding result does not meet the winding enabling requirement, and processing to obtain winding adjustment actions of all pins of the integrated circuit module, wherein the winding parameters of the integrated circuit module are used for describing the initial winding result;
the adjusting unit is used for adjusting the winding of each pin of the integrated circuit module according to the winding adjusting action to obtain a target winding result;
the target policy model determines a wire wrap adjustment action of the integrated circuit module as follows:
when the initial winding result does not meet the winding allowance requirement to a degree greater than the winding allowance degree, the target strategy model determines a winding adjustment action of the integrated circuit module according to a first adjustment strategy;
And when the initial winding result does not meet the winding allowance requirement, and the degree of the winding allowance requirement is smaller than or equal to the winding allowance degree, the target strategy model determines a winding adjustment action of the integrated circuit module according to a second adjustment strategy, wherein the adjustment amplitude of the first adjustment strategy is larger than that of the second adjustment strategy.
18. A computer-readable storage medium, in which a computer program is stored, wherein the computer program, when being executed by a processor, implements the steps of the method of winding a circuit board as claimed in any one of claims 1 to 16.
19. An electronic device comprising a memory, a processor and a computer program stored on the memory and executable on the processor, characterized in that the processor implements the steps of the method of winding a circuit board as claimed in any one of claims 1 to 16 when the computer program is executed by the processor.
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CN202310285922.0A CN116011388B (en) | 2023-03-22 | 2023-03-22 | Circuit board winding method and device, storage medium and electronic equipment |
PCT/CN2023/134813 WO2024193088A1 (en) | 2023-03-22 | 2023-11-28 | Circuit board winding method and apparatus, nonvolatile readable storage medium and electronic device |
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TWI854877B (en) | 2023-11-01 | 2024-09-01 | 英業達股份有限公司 | Path planning method |
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CN116011388B (en) * | 2023-03-22 | 2023-06-16 | 苏州浪潮智能科技有限公司 | Circuit board winding method and device, storage medium and electronic equipment |
CN116911246B (en) * | 2023-09-14 | 2023-12-08 | 芯行纪科技有限公司 | Wiring planning method for chip design and related equipment |
CN117829084B (en) * | 2024-03-04 | 2024-05-14 | 杭州广立微电子股份有限公司 | Three-dimensional grid winding method |
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US7620922B1 (en) * | 2006-11-06 | 2009-11-17 | Cadence Design Systems, Inc. | Method and system for optimized circuit autorouting |
US7698666B2 (en) * | 2006-12-29 | 2010-04-13 | Cadence Design Systems, Inc. | Method and system for model-based design and layout of an integrated circuit |
CN111859847A (en) * | 2020-06-29 | 2020-10-30 | 苏州浪潮智能科技有限公司 | Method and device for detecting routing of printed circuit board and computer readable storage medium |
CN114186527A (en) * | 2021-12-15 | 2022-03-15 | 清华大学 | Method and device for realizing automatic wiring of integrated circuit independent of grid point |
CN114925651A (en) * | 2022-04-29 | 2022-08-19 | 华为技术有限公司 | Circuit routing determination method and related equipment |
CN114781318B (en) * | 2022-06-16 | 2022-09-13 | 飞腾信息技术有限公司 | Module pin wiring method and device of chip, electronic equipment and storage medium |
CN115270705B (en) * | 2022-09-23 | 2023-01-20 | 深圳鸿芯微纳技术有限公司 | Design rule violation prediction method, device, equipment and storage medium |
CN116011388B (en) * | 2023-03-22 | 2023-06-16 | 苏州浪潮智能科技有限公司 | Circuit board winding method and device, storage medium and electronic equipment |
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TWI854877B (en) | 2023-11-01 | 2024-09-01 | 英業達股份有限公司 | Path planning method |
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