CN116007521A - Stress detection method and device - Google Patents
Stress detection method and device Download PDFInfo
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- CN116007521A CN116007521A CN202310025799.9A CN202310025799A CN116007521A CN 116007521 A CN116007521 A CN 116007521A CN 202310025799 A CN202310025799 A CN 202310025799A CN 116007521 A CN116007521 A CN 116007521A
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Abstract
The stress detection method and the device thereof, the stress detection method comprises the following steps: (1) A rigid plate is arranged at a position to be detected, one side of the rigid plate is provided with a marking target, and the distribution of the marking target changes along with the deformation of the plate; (2) capturing a change in distribution of the tagged objects; (3) And calculating to obtain the deformation and/or stress of the plate through a digital image correlation algorithm according to the distribution condition of the marked targets. The distribution condition of the marked targets is obtained by optical detection, deformation and/or stress conditions can be obtained according to the distribution condition, and the deformation detected in this way is truly generated deformation, so that the accuracy is high.
Description
Technical Field
The invention relates to the field of sensors, in particular to a deformation and mechanical sensing detection method and a device thereof.
Background
Conventional sensors for detecting deformation and stress conditions are mainly resistive, piezoelectric and capacitive, however, these sensors have large limitations in measuring deformation of an object, and are prone to deviation of the measured deformation from reality. Because these sensors all calculate deformation indirectly by measuring other physical parameters, rather than directly detecting deformation.
Disclosure of Invention
The present invention aims to solve at least one of the technical problems existing in the prior art. Therefore, the invention provides a stress detection method and a device thereof.
According to an embodiment of the first aspect of the present invention, a force detection method includes the following steps:
(1) A rigid plate is arranged at a position to be detected, one side of the rigid plate is provided with a marking target, and the distribution of the marking target changes along with the deformation of the rigid plate;
(2) Shooting the distribution change of the marked targets;
(3) And calculating to obtain the deformation and/or stress of the rigid plate through a digital image correlation algorithm according to the distribution condition of the marked targets.
In some embodiments, the rigid sheet material is selected from a metallic material.
In some embodiments, the plate is disposed at a stressed end of the device, and in particular, the stressed end of the device may be a terminal end of the mechanical arm.
A sensing device for performing the force detection method according to an embodiment of the second aspect of the present invention includes: the marking device comprises a metal plate and a marking layer, wherein the marking layer is positioned on one side of the metal plate and consists of a marking target; a spacer layer which is positioned on a side of the mark layer away from the metal plate and through which light can pass; the luminous piece can emit light to irradiate the marking layer; the miniature camera is positioned on one side of the spacing layer away from the marking layer, the miniature camera can shoot the distribution situation of the marking targets, the miniature camera is connected to a processor, and the processor calculates and obtains the deformation and/or stress of the metal plate according to the shot distribution situation of the marking targets.
The sensing device according to the embodiment of the second aspect of the invention has at least the following advantages: the distribution condition of the marked targets is obtained by optical detection, deformation and/or stress conditions can be obtained according to the distribution condition, and the deformation detected in this way is truly generated deformation, so that the accuracy is high.
In some embodiments, the marking target is a marking speckle, which constitutes the marking layer.
In some embodiments, the marking target is a marking particle, the marking particle comprising the marking layer.
In some embodiments, the lighting element is a light plate and the miniature camera is disposed protruding from the light plate.
In some embodiments, the lamp panel further comprises a base, and the lamp panel is fixed on the base.
In some embodiments, the base is provided with a first through hole at which the miniature camera is disposed.
In some embodiments, a second through hole is formed in the lamp panel corresponding to the first through hole.
In some embodiments, a connection plate is further included, and the miniature camera is connected to the connection plate.
In some embodiments, a connection wire is further included, the connection wire being connected with the connection plate.
In some embodiments, the connection line is disposed between the connection plate and the light panel.
In some embodiments, the miniature camera is provided with a plurality of miniature cameras. Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.
Drawings
FIG. 1 is a layered structure diagram of a sensing device according to an embodiment of the present invention
FIG. 2 is a layered structure diagram of a sensor device according to another embodiment of the present invention
FIG. 3 is a perspective view of a sensor device according to the present invention
FIG. 4 is a schematic view of the speckle distribution of the constituent marking layers
Wherein:
a metal plate 1, a marking layer 2, a spacer layer 3, a light emitting element 4, a miniature camera 5, a base 6, a first through hole 7, a connecting plate 8 and a connecting wire 9.
Detailed Description
Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the invention.
In the description of the present invention, it should be understood that references to orientation, such as the orientation or positional relationship indicated above, below, inside, outside, etc., are based on the orientation or positional relationship shown in the drawings, are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the apparatus or element in question must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as limiting the present invention.
In the description of the present invention, the first and second are used only for distinguishing technical features, and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
In the description of the present invention, unless explicitly defined otherwise, terms such as arrangement, mounting, connection, assembly, cooperation, etc. should be construed broadly and the specific meaning of the terms in the present invention can be reasonably determined by a person skilled in the art in combination with the specific contents of the technical solution.
A sensing device for performing a force detection method, see fig. 1-3, comprises a metal plate 1, a marking layer 2, a spacer layer 3, a light emitting element 4 and a miniature camera 5. For ease of understanding, all the marking objects on one side of the metal plate 1 are considered as a whole, and are referred to as a marking layer 2, and the marking layer 2 contains only the marking objects and no other additional material. The spacer layer 3 is located on the side of the mark layer 2 remote from the metal plate 1 and light is able to penetrate the spacer layer 3. The light emitting member 4 can emit light to irradiate the marking layer 2. The miniature camera 5 is located on the side of the spacer layer 3 remote from the marking layer 2, the miniature camera 5 being capable of capturing the distribution of the marking objects within the marking layer 2, the miniature camera 5 being connected to a processor. When the metal plate 1 is stressed and deformed, the marking layer 2 is tightly attached to the metal plate 1, so that the distribution condition of the marking targets of the marking layer 2 can be changed, the light emitting piece 4 emits light to penetrate the spacing layer 3 to irradiate the marking layer 2, and the metal plate 1 can prevent the light from escaping and prevent the external light from entering to cause interference. The miniature camera 5 photographs the distribution change of the marking object of the marking layer 2 and transmits it to the processor, and the processor calculates the deformation and/or stress at the metal plate 1 according to the photographed distribution situation of the marking object. The deformation of the metal plate 1 inevitably drives the marking layer 2 to deform, the marking object on the marking layer 2 inevitably deforms when the marking layer 2 deforms, and the stress condition of the metal plate 1 can be obtained by shooting the position and distribution change of the marking object on the marking layer 2. In some embodiments, referring to fig. 1, the marking target is a marking speckle, which constitutes the marking layer 2. In some embodiments, the marking layer 2 may be integrally provided with the metal plate 1 or integrally formed, i.e. the marking target is directly provided on the metal plate 1. Fig. 4 is a schematic diagram of a speckle distribution, it being understood that the speckle may be distributed in any desired form, and is not limited to a particular form.
In some embodiments, referring to fig. 2, the marking targets are marking particles, which constitute the marking layer 2. Thus, the marking layer 2 has a certain thickness. The marking layer 2 is tightly connected to the metal plate and may be fixed by, for example, adhesion.
In some embodiments, referring to fig. 1-3, the spacer layer 3 is made of a rigid, non-deformable transparent material. In order for the miniature camera 5 to be able to take a picture of the marking layer 2, a certain focusing distance is required, so that the miniature camera 5 must be spaced apart from the marking layer 2 by a certain distance. In order to protect the miniature camera 5 from the impact of the marking layer 2 when deformed under force, a spacer layer 3 may be provided at this distance. Whereas the spacer layer 3 should be selected from a transparent material in order not to affect the photographing of the miniature camera 5. While the miniature camera 5 itself needs to remain fixed during shooting, otherwise the data it shoots will be inaccurate, so the spacer layer 3 needs to be made of a rigid, non-deformable material.
In some embodiments, referring to fig. 1-3, the lighting element 4 is a light plate and the miniature camera 5 is disposed protruding from the light plate. In some embodiments, the lighting element 4 is an LED light panel. The LED lamp panel can save electric energy, which is very critical for mobile equipment.
In some embodiments, referring to fig. 1-3, further comprising a base 6, the light panel is secured to the base 6. In some embodiments, the base 6 is provided with a first through hole 7, and the miniature camera 5 is disposed at the first through hole 7. In some embodiments, a second through hole is provided in the light panel corresponding to the first through hole 7, so that the miniature camera 5 protrudes from the light panel. It will be appreciated, of course, that the light panels may be arranged so as not to cover the first through holes 7, but this may require a greater number of light panels, which increases the cost.
In some embodiments, referring to fig. 1-3, a connection plate 8 is also included, and the miniature camera 5 is connected to the connection plate 8. The connection board 8 is used to transfer power and data with the miniature camera 5. In some embodiments, a connection line 9 is further included, the connection line 9 being connected with the connection plate 8. The connection line 9 is used for transmitting power and data for the connection board 8 and is further connected to a device comprising a CPU. In some embodiments, the connection lines 9 are elastic connection lines 9. In some embodiments, the connection plate 8 is provided below the base 6, and the connection line 9 is provided below the connection plate 8.
In some embodiments, referring to fig. 1-3, to further reduce size (i.e., thickness), a connection line 9 may be provided between the miniature camera and the connection plate 8. In some embodiments, when the lamp panel is provided with the second through hole, the connecting wire 9 is disposed between the connecting plate 8 and the lamp panel. In this way, outlets can be made in the sides of the base 6 to bring the connecting wires 9 out from the sides to reduce the size.
In some embodiments, referring to fig. 3, the miniature camera 5 is provided with a plurality of miniature cameras. In some embodiments, the miniature cameras 5 are provided in four. Thus, when the entire marker layer 2 needs to be photographed, if a single miniature camera 5 is used, the focusing distance is large, increasing the size (i.e., thickness) of the entire miniature camera 5. While the reduced size, the field of view of a single miniature camera 5 is insufficient to cover the entire marking layer 2, thus requiring the use of multiple miniature cameras. In some embodiments, four miniature cameras 5 are employed, the four miniature cameras 5 being arranged in a rectangular shape.
In some embodiments, the processor calculates the deformation and/or stress of the sheet material through a digital image correlation algorithm according to the distribution condition of the marked targets. Digital image correlation (Digital Image Correlation, DIC), a digital image tracking technique based on identifiable marking targets provided on a surface under test, can be used to detect deformation of the surface of an object due to stress. The processor tracks the distribution change condition of the marked target through the miniature camera, obtains the offset of the marked target according to a digital image correlation algorithm, and calculates to obtain the deformation and/or stress of the metal plate.
In some embodiments, a model previously trained by a convolutional neural network is stored in the processor for predicting the three-dimensional force distribution of the sensor surface. The convolutional neural network (Convolutional Neural Network, CNN) consists of an input layer, a plurality of convolutional layers, a pooling layer and an output layer, the input graphic data is transmitted forwards, the identification result is obtained after being processed by the convolutional layers and the pooling layer, the error obtained by comparing the identification result with the label data is transmitted backwards, the algorithm parameters are updated, and the processes are repeated until the error between the identification result and the label data is within the expected range. The convolutional neural network is mainly used for analyzing visual images, briefly setting distribution change data of a marked target as source data, taking three-dimensional stress as tag data, and obtaining a three-dimensional stress prediction model after training for many times. The processor tracks the distribution change condition of the marked target through the miniature camera, obtains the offset of the marked target according to a digital image correlation algorithm, and calculates the deformation and/or stress of the metal plate by combining with the prediction model.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge of one of ordinary skill in the art without departing from the spirit of the present invention.
Claims (10)
1. The stress detection method is characterized by comprising the following steps of:
(1) A rigid plate is arranged at a position to be detected, one side of the rigid plate is provided with a marking target, and the distribution of the marking target changes along with the deformation of the rigid plate;
(2) Shooting the distribution change of the marked targets;
(3) And calculating to obtain the deformation and/or stress of the rigid plate through a digital image correlation algorithm according to the distribution condition of the marked targets.
2. A method of testing a force according to claim 1, wherein the rigid sheet material is selected from a metal material.
3. A sensing device for performing the force detection method according to any one of claims 1-2, comprising:
the metal sheet is provided with a plurality of metal holes,
a marking layer which is positioned at one side of the metal plate and consists of a marking target;
a spacer layer which is positioned on a side of the mark layer away from the metal plate and through which light can pass;
the luminous piece can emit light to irradiate the marking layer;
the miniature camera is positioned on one side of the spacing layer away from the marking layer, the miniature camera can shoot the distribution situation of the marking targets, the miniature camera is connected to a processor, and the processor calculates and obtains the deformation and/or stress of the metal plate according to the shot distribution situation of the marking targets.
4. A sensing device according to claim 3, wherein the marking target is a marking speckle, the marking speckle comprising the marking layer.
5. A sensing device according to claim 3, wherein the label target is a label particle, the label particle constituting the label layer.
6. A sensing device according to claim 3, wherein,
the luminous piece is a lamp panel, and the miniature camera protrudes out of the lamp panel.
7. The sensing device of claim 6, further comprising a base, wherein the light panel is secured to the base.
8. The sensing device of claim 7, wherein the base is provided with a first through hole, and the miniature camera is disposed at the first through hole.
9. The sensing device of claim 8, wherein the lamp panel is provided with a second through hole corresponding to the first through hole.
10. The sensing device of claim 9, wherein the miniature camera is provided with a plurality of miniature cameras.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310025799.9A CN116007521A (en) | 2023-01-09 | 2023-01-09 | Stress detection method and device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310025799.9A CN116007521A (en) | 2023-01-09 | 2023-01-09 | Stress detection method and device |
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| CN116007521A true CN116007521A (en) | 2023-04-25 |
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| CN202310025799.9A Pending CN116007521A (en) | 2023-01-09 | 2023-01-09 | Stress detection method and device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117553700A (en) * | 2023-12-28 | 2024-02-13 | 成都电科星拓科技有限公司 | Method for detecting bending deformation and stress of sliding rod based on force-induced luminescent material |
-
2023
- 2023-01-09 CN CN202310025799.9A patent/CN116007521A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117553700A (en) * | 2023-12-28 | 2024-02-13 | 成都电科星拓科技有限公司 | Method for detecting bending deformation and stress of sliding rod based on force-induced luminescent material |
| CN117553700B (en) * | 2023-12-28 | 2024-04-02 | 成都电科星拓科技有限公司 | Method for detecting bending deformation and stress of sliding rod based on force-induced luminescent material |
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