CN204649311U

CN204649311U - Measurement mechanism

Info

Publication number: CN204649311U
Application number: CN201390000881.6U
Authority: CN
Inventors: M·福克斯; M·纳斯迈耶; E·A·库尔特; N·霍根斯特恩; T·R·赫尔特; K·斯特兰德玛; P·布朗热; B·夏普
Original assignee: Flir Systems Inc
Current assignee: Teledyne Flir LLC
Priority date: 2012-09-14
Filing date: 2013-09-13
Publication date: 2015-09-16
Anticipated expiration: 2023-09-13
Also published as: WO2014043592A2; WO2014043592A3

Abstract

Disclose the measurement mechanism for obtaining various physics and/or electrical quantity in comprehensive mode.In one embodiment, measurement mechanism can comprise shell, logical device, infrared imaging module and display.In another embodiment, measurement mechanism can comprise shell, optical transmitting set, sensor, distance measuring circuit, electric meter circuit, display.User can carry easily and use described measurement mechanism, and to perform a series of range observation in comprehensive mode when without the need to using multiple different device, wire length is measured, electric parameter measurement and/or trouble shooting.In one example in which, electrician can use described measurement mechanism to perform electric wire installation and/or other tasks in diverse location (such as, electrical installation place).In another example, electrician can use described device to check the heat picture of the one or more scenes being positioned at this place to locate potential electric fault easily.

Description

Measurement mechanism

The cross reference of related application

The application advocates the U.S. Provisional Patent Application No.61/701 being entitled as " MEASUREMENT DEVICE FOR ELECTRICAL INSTALLATIONS AND RELATED METHODS " submitted on September 14th, 2012, the rights and interests of 292, it can be used as entirety to be incorporated herein by way of reference.

The application advocates the U.S. Provisional Patent Application No.61/748 being entitled as " COMPACT MULTI-SPECTRUM IMAGING WITH FUSION " submitted on Dec 31st, 2012, and the rights and interests of 018, it can be used as entirety to be incorporated herein by way of reference.

Technical field

One or more embodiment of the present utility model relates generally to surveying instrument, more specifically, such as, relates to the instrument providing physics and/or electric parameter measurement.

Background technology

The installation, maintenance of electrical equipment or maintenance work need electrician and other staff to perform a series of measurement and inspection in work place usually.Such as, electrician may need accurately to measure the various distance of electric wire installation site or span with determine the electric wire of needs length, check that wire spool is to check electric wire on spool whether long enough and checked the length of electric wire of cutting before electric wire is installed to installation site.In addition, after installing electric wire and/or other electric components, electrician may need to check and may represent the focus of various types of electric fault or the installation site of cold spot, and check the various electrical quantitys (such as, voltage, electric current, resistance, electric capacity or other parameters) having the particular wire of electric fault suspicion or parts subsequently.

But the single assembly (such as, multimeter) with limited capability is only carried to work place by electrician usually, this is because other instruments are unavailable and/or carry inconvenience and switch inconvenient between multiple instrument.In addition, the conventional apparatus for electrical installation is not provided for the thermal imaging function performing fault detect and other tasks usually.

Utility model content

Disclose the various technology of measurement mechanism for obtaining various physics and/or electrical quantity in an integrated fashion and method.Such as, according to various embodiment of the present disclosure, measurement mechanism can comprise shell, optical transmitting set, sensor, distance measuring circuit, Length Measuring Circuit, electric meter circuit, display, infrared imaging module and/or non-thermographic module.User can carry easily and use described measurement mechanism, with when performing a series of range observation when multiple different device in an integrated fashion without the need to using, wire length is measured, electric parameter measurement and/or trouble shooting.In one example in which, electrician can use described measurement mechanism perform electric wire install and/or diverse location other tasks (such as, at the execute-in-place in electrical installation place, for example, such as, described electrical installation place is electric checking or infield and/or other places).In another example, electrician can use described measurement mechanism to check the heat picture of the one or more scenes being positioned at this place to locate potential electric fault easily.

In one embodiment, measurement mechanism comprises: be suitable for by the hand-held shell of user; Be suitable for the logical device determining the physical parameter relevant to external articles; Be suitable for the infrared imaging module of the infrared image of capturing scenes; And the display fixing relative to described shell, described display be suitable for will the information superposition of the described physical parameter of instruction to conversion on user's visual picture of the infrared image of catching, thus show described information and user's visual picture is checked for described user.

In another embodiment, described measurement mechanism comprises: be configured to by the hand-held shell of user; Be configured to the optical transmitting set to the objective emission light beam in scene; Be configured to detect the light beam that reflects from described target and produce the sensor of detection signal in response to the light pulse detected; Be configured to the distance measuring circuit of the distance determining described target based on described detection signal; Be configured to be electrically connected to external articles and determine the electric meter circuit of the electrical quantity relevant to described external articles; And the display that the information being configured to present the described distance of instruction and/or described electrical quantity is checked for described user.

In another example, a kind of method, comprising: utilize and be configured to by the optical transmitting set of the hand-held measurement mechanism of user to objective emission light beam, wherein, by described user by target described in described beam alignment; The sensor of described device is utilized to detect the light beam of described target reflection; Detection signal is produced in response to the light beam detected; Determined the distance of described target based on described detection signal by the distance measuring circuit of described device; The information that the display of described device presents the distance being indicated to described target is checked for described user; The electrical quantity of the external articles being electrically connected to described electric meter circuit is determined by the electric meter circuit of described device; And present on the display and indicate the information of described electrical quantity to check for user.

Scope of the present utility model is defined by the claims, and this part is herein incorporated by way of reference.By detailed description to one or more embodiment below considering, the realization of more complete understanding to the utility model embodiment and wherein additional advantage will be provided to those skilled in the art.Below with reference to the accompanying drawing first will briefly described.

Accompanying drawing explanation

Fig. 1 shows the infrared imaging module being configured to realize in the host device according to disclosure embodiment.

Fig. 2 shows the infrared imaging module after according to the assembling of disclosure embodiment.

Fig. 3 show according to disclosure embodiment and be placed in the exploded view of the infrared imaging module on socket.

Fig. 4 shows the block diagram comprising the infrared sensor package of infrared array sensor according to disclosure embodiment.

Fig. 5 shows the process flow diagram of the various operations of the determination NUC item according to disclosure embodiment.

Difference between Fig. 6 shows according to the neighbor of disclosure embodiment.

Fig. 7 shows the flat field correction technology according to disclosure embodiment.

Fig. 8 shows according to the various image processing techniques of Fig. 5 of disclosure embodiment and other operations of being applied in image processing pipeline.

Fig. 9 shows the noise in time domain abatement process according to disclosure embodiment.

Figure 10 shows the concrete implementation detail of several steps of the image processing pipeline of the Fig. 6 according to disclosure embodiment.

Figure 11 shows the FPN according to the space correlation in the neighborhood pixels of disclosure embodiment.

Figure 12 shows the block diagram realized according to the another kind comprising the infrared sensor package of infrared array sensor and low dropout regulator of disclosure embodiment.

Figure 13 shows the circuit diagram of the part infrared sensor package of the Figure 12 according to disclosure embodiment.

Figure 14 A shows the front outer portion view of the measurement mechanism according to disclosure embodiment.

Figure 14 B shows the end face external view of the measurement mechanism according to disclosure embodiment.

Figure 15 shows the block diagram of the measurement mechanism of Figure 14 A according to disclosure embodiment.

Figure 16 shows the block diagram of the measurement mechanism according to another embodiment of the disclosure.

Figure 17 shows the front outer portion view of the measurement mechanism according to disclosure embodiment.

Figure 18 shows the front outer portion view of the measurement mechanism according to another embodiment of the disclosure.

Figure 19 shows the process flow diagram according to the combination heat picture of disclosure embodiment and the process of non-thermographic.

Figure 20 shows the process flow diagram utilizing and perform the process measured and check according to the measurement mechanism of disclosure embodiment.

Figure 21 shows the process flow diagram manufactured according to the process of the measurement mechanism of disclosure embodiment.

By reference to detailed description below, embodiment of the present utility model and advantage thereof can be understood better.Should be understood that, identical reference number is for representing the similar elements in a width or several accompanying drawings.

Embodiment

Fig. 1 show according to disclosure embodiment be configured to realize infrared imaging module 100 (such as, infrared camera or infreared imaging device) in host apparatus 102.In one or more embodiments, undersized infrared imaging module 100 can be realized according to Wafer level packaging or other encapsulation technologies.

In one embodiment, infrared imaging module 100 can be configured to realize in small-sized portable host apparatus 102, such as, mobile phone, tablet computing device, laptop devices, personal digital assistant, visible light camera, music player or any other suitable mobile device.With regard to this respect, infrared imaging module 100 may be used for providing infrared imaging function to host apparatus 102.Such as, infrared imaging module 100 can be configured to catch, process and/or manage infrared image and this infrared image be supplied to host apparatus 102 so that described host apparatus 102 can use this infrared image (such as, be further processed this infrared image, be stored into storer, display, used by the various application programs run on host apparatus 102, output to other devices or other application) in any desired way.

In various embodiments, infrared imaging module 100 can be configured to be operated in low voltage level and wide temperature range.Such as, in one embodiment, infrared one-tenth module 100 can use the power work that is about 2.4 volts, 2.5 volts, 2.8 volts or lower voltage and the work that (such as, can provide suitable dynamic range and performance in the ambient temperature range of about 80 DEG C) in the temperature range of about-20 DEG C to about 60 DEG C.In one embodiment, by making infrared imaging module 110 be operated in low voltage level, compared with the infreared imaging device of other types, the spontaneous heating of infrared imaging module 100 may be less.Therefore, infrared imaging module 100 can work when reducing the measure compensating this spontaneous heating.

As shown in Figure 1, host apparatus 102 can comprise socket 104, shutter 105, motion sensor 194, processor 195, storer 196, display 197 and/or miscellaneous part 198.Socket 104 can be configured to receiving infrared imaging module 100 as shown by an arrow 101.With regard to this respect, Fig. 2 shows the infrared imaging module 100 be assemblied in socket 104 according to disclosure embodiment.

Run sensor 194 to be realized by other suitable devices of one or more accelerometer, gyroscope or the motion that can be used for detection host apparatus 102.Processing module 160 or processor 195 can monitor motion sensor 194 and motion sensor 194 can provide information, to detect motion to processing module 160 or processor 195.In various embodiments, motion sensor 194 part of other devices that can be implemented as host apparatus 102 (as shown in Figure 1), infrared imaging module 100 or be attached to host apparatus 102 or be connected with host apparatus 102.

Processor 195 can be implemented as and can be used to perform suitable instruction (such as by host apparatus 102, the software instruction provided by storer 196) any suitable device (such as, programmable logic device (PLD), microcontroller, processor, special IC (ASIC) or other equipment).Display 197 can be used for infrared image and/or other images, data and the information of display capture and/or process.Miscellaneous part 198 can be used for realizing as various application may expect any function (such as, clock, temperature sensor, visible light camera or miscellaneous part) of host apparatus 102.In addition, machine readable media 193 can be configured to store and be loaded into storer 196 and the instruction of the non-transitory performed by processor 195.

In various embodiments, infrared imaging module 100 and socket 104 may be embodied as large-scale production so that high volume applications, and such as, it may be implemented in mobile phone or other devices (such as, requiring undersized device).In one embodiment, when infrared imaging module 100 being installed in socket 104, the overall dimensions that the combination of infrared imaging module 100 and socket 104 shows can be about 8.5mm × 8.5mm × 5.9mm.

Fig. 3 show according to disclosure embodiment and be placed in the exploded view of the infrared imaging module 100 on socket 104.Infrared imaging module 100 can comprise lens barrel 110, shell 120, infrared sensor package 128, circuit board 170, pedestal 150 and processing module 160.

Lens barrel 110 can surround optical element 180 (such as, lens) at least in part, and the hole 112 in scioptics lens barrel 110 is part this optical element visible in figure 3.Lens barrel 110 can comprise roughly cylindrical extension 114, and it can be used for lens barrel 110 is connected with the hole 122 in shell 120.

Such as, infrared sensor package 128 can be realized by the lid 130 (such as, lid) be arranged on substrate 140.Infrared sensor package 128 can comprise and realizes with array or other modes multiple infrared sensors 132 (such as, infrared eye) of covering on substrate 140 and by lid 130.Such as, in one embodiment, infrared sensor package 128 can be implemented as focal plane arrays (FPA) (FPA).This focal plane arrays (FPA) can be implemented as the assembly (such as, being sealed by lid 130 and substrate 140) of such as Vacuum Package.In one embodiment, infrared sensor package 128 can be implemented as wafer-class encapsulation (such as, infrared sensor package 128 can be from the one group of Vacuum Package segmentation be arranged on wafer out).In one embodiment, the power supply that infrared sensor package 128 can be implemented as use about 2.4 volts, 2.5 volts, 2.8 volts or similar voltage carrys out work.

Infrared sensor 132 can be configured to the infrared radiation of detection target scene (such as, infrared energy), such as, other thermal imaging wave bands may expected in medium-wave infrared wave band (MWIR), long wave infrared region (LWIR) and/or specific implementation are comprised.In one embodiment, infrared sensor package 128 can be provided according to wafer-class encapsulation technology.

Infrared sensor 132 can be implemented as such as with the micro-metering bolometer of the array pattern of any expectation arrangement or other types thermal imaging infrared sensor, to provide multiple pixel.In one embodiment, infrared sensor 132 can be implemented as vanadium oxide (VOx) detector that pel spacing is 17um.In various embodiments, the infrared array sensor 132 of about 32 × 32, the infrared array sensor 132 of about 64 × 64, the infrared array sensor 132 of about 80 × 64 or other array sizes can be used.

Substrate 140 can comprise various circuit, such as, in one embodiment, comprises the reading integrated circuit (ROIC) that size is less than about 5.5mm × 5.5mm.Substrate 140 can also comprise bond pad 142, and it can be used for, when such as assembling infrared imaging module 100 shown in Fig. 5 A, 5B and 5C, contacting with the acomplementary connector being positioned at shell 120 inside surface.In one embodiment, sensing circuit can be implemented as has low dropout regulator (LDO), to perform voltage-regulation, thus reduce the power supply noise being incorporated into infrared ray sensor assembly 128, and the Power Supply Rejection Ratio (PSRR) of improvement is provided thus.In addition, by being embodied as by ROIC, there is LDO (such as, in wafer-level packaging), less die area can be consumed and need discrete tube core (or chip) less.

Fig. 4 shows the block diagram of the infrared sensor package 128 comprising infrared array sensor 132 according to disclosure embodiment.In the illustrated embodiment, infrared sensor 132 is as a part for the cell array of ROIC 402.ROIC 402 comprises bias voltage and produces and timing control circuit 404, column amplifier 405, row multiplexer 406, row multiplexer 408 and output amplifier 410.The picture frame (such as, heat picture) that infrared sensor 132 can be caught by output amplifier 410 is supplied to processing module 160, processor 195 and/or performs other suitable parts of various treatment technology described herein.Although shown in Fig. 4 be 8 × 8 array, the array configurations of any expectation can be used in other embodiments.On February 22nd, 2000, the U.S. Patent No. 6,028,309 of bulletin further described ROIC and infrared sensor (such as, micro-metering bolometer circuit), it can be used as entirety to be incorporated into herein by way of reference.

Infrared sensor package 128 can be caught image (such as, picture frame) and be provided these images by its ROIC with various speed.Processing module 160 can be used for performing suitable process to the image of catching and can realize according to any suitable framework.In one embodiment, processing module 160 can be implemented as ASIC.With regard to this respect, this ASIC can be configured to high-performance and/or perform image procossing expeditiously.In another embodiment, general Central Processing Unit (CPU) can be utilized to realize processing module 160, this general Central Processing Unit can be configured to perform suitable software instruction with performs image procossing, coordination and perform the image procossing of each image processing block, the interface between Coordination Treatment module 160 and host apparatus 102 connects and/or other operate.In another embodiment, field programmable gate array (FPGA) can be utilized to realize processing module 160.In other embodiments, as this area is understandable, the process of other types and/or logical circuit can be utilized to realize processing module 160.

In these and other embodiments, when appropriate, miscellaneous part can also be utilized (such as, volatile memory, nonvolatile memory and/or one or more interface are (such as, infrared eye interface, internal integrated circuit (I2C) interface, mobile Industry Processor Interface (MIPI), combined testing action group (JTAG) interface (such as, IEEE 1149.1 standard test access port and boundary scan architecture) and/or other interfaces) realize processing module 160.

In certain embodiments, infrared imaging module 100 can also comprise one or more actuators 199 of the focus that can be used for the infrared image frame regulating infrared sensor package 128 to catch.Such as, actuator 199 can be used for relative to each other mobile optical element 180, infrared sensor 132 and/or miscellaneous part, to focus on and to defocus infrared image frame according to the choice of technology described herein.Actuator 199 can realize according to the device indicating movements of any type or mechanism, and can according to different application need be positioned at the inner or outside any position of infrared imaging module 100.

When infrared imaging module 100 being assembled, shell 120 can surround infrared ray sensor assembly 128, pedestal 150 and processing module 160 substantially.Shell 120 can so that the connection of all parts of infrared imaging module 100.Such as, in one embodiment, shell 120 can provide the electrical connector 126 connecting all parts, will be described further below.

When infrared imaging module 100 being assembled, electrical connector 126 (such as, the web member of conductive path, trace or other types) can be electrically connected with bond pad 142.In various embodiments, can electrical connector 126 be embedded in shell 120, be arranged on the inside surface of shell 120 and/or provided by shell 120.Electrical connector 126 can terminate in the outstanding web member 124 of the lower surface from shell 120 as shown in Figure 3.(such as, in various embodiments, shell 120 can be placed on circuit board 170) when infrared imaging module 100 being assembled, web member 124 can be connected with circuit board 170.Processing module 160 can be electrically connected with circuit board 170 by suitable electrical connector.Therefore, infrared sensor package 128 can be such as electrically connected with processing module 160 by conductive path, and described conductive path is provided by the electrical connector 126 of the connection assist on bond pad 142, shell 120 inside surface, shell 120, web member 124 and circuit board 170.Advantageously, this layout can realize when without the need to arranging bonding wire between infrared sensor package 128 and processing module 160.

In various embodiments, the electrical connector 126 in shell 120 can be manufactured by the material of any expectation (such as, copper or any other suitable conductive material).In one embodiment, electrical connector 126 can contribute to infrared imaging module 100 and dispels the heat.

Other can be used in other embodiments to connect.Such as, in one embodiment, sensor module 128 can be connected to sensor module 128 through bonding wire and be attached to processing module 160 by the ceramic wafer that ball grid array (BGA) is connected to processing module 160.In another embodiment, sensor module 128 directly can be installed on hard and soft plate and to be electrically connected with bonding wire, and bonding wire or BGA can be utilized processing element 160 to be installed and are connected to hard and soft plate.

Each realization of the infrared imaging module 100 set forth herein and host apparatus 102 provides in order to the object of illustrating, instead of restriction.With regard to this respect, any one in various technology described herein can be applicable to any IR camera system, infrared imaging device or performs other devices of infrared/thermal imaging.

The substrate 140 of infrared sensor package 128 can be installed in pedestal 150.In various embodiments, pedestal 150 (such as, base) by the copper production such as formed by metal injection moulding (MIM), and can be provided with black oxide or nickel plating coating.In various embodiments, pedestal 150 can manufacture according to the material (such as zinc, aluminium or magnesium) of the needs of given application by any expectation, and can by the suitable technique of any expectation (for example, such as, the aluminium casting needed for application-specific, MIM or zinc quick cast) formed.In various embodiments, pedestal 150 can be implemented as provides support structure, each circuit paths, heat dispersion and other functions when appropriate.In one embodiment, pedestal 150 can be the sandwich construction using stupalith to realize at least in part.

In various embodiments, circuit board 170 can hold shell 120, thus can all parts of physical support infrared imaging module 100.In various embodiments, circuit board 170 can be implemented as printed circuit board (PCB) (such as, the circuit board of FR4 circuit board or other types), the interconnection (such as, the interconnection of tape or other types) of rigidity or flexibility, flexible circuit board, flexible plastic substrates or other suitable structures.In various embodiments, pedestal 150 can be implemented as the various characteristic sum attributes of the circuit board 170 with description, and vice versa.

Socket 104 can comprise the cavity 106 being configured to hold infrared imaging module 100 (such as, wiring layout) as shown in Figure 2.Infrared imaging module 100 and/or socket 104 can comprise suitable card, arm, pin, securing member or can be used for other suitable engagement members of utilizing friction, tension force, bonding and/or any other suitable mode infrared imaging module 100 to be fixed to socket 104 or to be fixed in socket 104.Socket 104 can comprise when infrared image-forming module 100 is inserted into the cavity 106 of socket 104 can the engagement member 107 on surface 109 of splice closure 120.The engagement member of other types can be used in other embodiments.

Infrared imaging module 100 can be electrically connected with socket 104 by suitable electrical connector (such as, contact, pin, electric wire or any other suitable web member).Such as, socket 104 can comprise the electrical connector 108 that can contact to the corresponding electrical connector of infrared imaging module 100 (other electrical connectors on other electrical connectors, bond pad 142 or pedestal 150 such as, on the side of interconnect pad, contact or circuit board 170 or bottom surface or other web members).Electrical connector 108 can be manufactured by the material of any expectation (such as, copper or any other suitable conductive material).In one embodiment, electrical connector 108 can be made mechanically to be biased, to be close to the electrical connector of infrared imaging module 100 when infrared image-forming module 100 is inserted into the cavity 106 of socket 104.In one embodiment, infrared imaging module 100 can be fixed in socket 104 by electrical connector 108 at least in part.The electrical connector of other types can be used in other embodiments.

Socket 104 can be electrically connected with host apparatus 102 by the electrical connector of similar type.Such as, in one embodiment, host apparatus 102 can comprise the electrical connector (such as, soldered joint, snap-in web member or other web members) be connected with the electrical connector 108 through hole 190.In various embodiments, this electrical connector can be arranged on side and/or the bottom of socket 104.

Flip chip technology (fct) can be utilized to realize all parts of infrared imaging module 100, and described flip chip technology (fct) may be used for directly parts being installed to circuit board, and connects usually required extra gap without the need to wire bonding.As an example, flip-chip connection can be used for the overall dimensions of minimizing infrared imaging module 100 to use in the application of compact.Such as, in one embodiment, flip-chip can be used to connect processing module 160 is installed to circuit board 170.Such as, this flip-chip arrangement can be utilized to realize infrared imaging module 100.

In various embodiments, the U.S. Patent application No.12/844 that can submit to according on July 27th, 2010, the U.S. Provisional Patent Application No.61/469 that on March 30th, 124 and 2011 submits to, the 651 various technology proposed (such as, Wafer level packaging) realize infrared imaging module 100 and/or associated components, by way of reference they are merged into herein as main body.In addition, according to one or more embodiment, for example, the U.S. Patent No. 7 such as can issued according on Dec 30th, 2008, 470, 902, the U.S. Patent No. 6 that on February 22nd, 2000 issues, 028, 309, the U.S. Patent No. 6 that on November 2nd, 2004 issues, 812, 465, the U.S. Patent No. 7 that on April 25th, 2006 issues, 034, 301, the U.S. Patent No. 7 that on March 16th, 2010 issues, 679, 048, the United States Patent (USP) 7 that on Dec 30th, 2008 issues, 470, 904, the U.S. Patent application No.12/202 that on September 2nd, 2008 submits to, the U.S. Patent application No.12/202 that on September 2nd, 880 and 2008 submits to, 896, realize, calibration, test and/or use infrared imaging module 100 and/or associated components, by way of reference they are merged into herein as main body.

Refer again to Fig. 1, in various embodiments, host apparatus 102 can comprise shutter 105.With regard to this respect, when infrared imaging module is installed to socket 104, shutter 105 optionally can be placed in (such as, as shown by arrows 103) on socket 104.Such as, with regard to this respect, when not using shutter 105, it can be used for protection infrared imaging module 100.As understood by those skilled in the art, shutter 105 also can be used as the temperature reference of a part for the calibration process (such as, NUC process or other calibration processes) as infrared imaging module 100.

In various embodiments, shutter 105 can be manufactured by various material, such as, and polymkeric substance, glass, aluminium (such as, japanning or anodization) or other materials.In various embodiments, shutter 105 can comprise one or more coating (such as, uniform black matrix coating or reflection Gold plated Layer) with optionally filter electromagnetic radiation and/or the various optical properties regulating shutter 105.

In another embodiment, shutter 105 can be fixed on appropriate location and protect infrared imaging module 100 with round-the-clock.In this case, a part for shutter 105 or shutter 105 can be manufactured by the suitable material (for example, the infrared transmission material of polymkeric substance or such as silicon, germanium, zinc selenide or chalcogenide glass) substantially not filtering required Infrared wavelength.In another embodiment, as understood by those skilled in the art, shutter can be implemented as a part (miscellaneous part such as, being positioned at lens barrel or infrared imaging module 100 is inner or a part of as it) for infrared imaging module 100.

Interchangeable, in another embodiment, do not need to arrange shutter (such as, the outside or inside shutter of shutter 105 or other types), but the calibration performing NUC process or other types without fast gate technique can be used.In another embodiment, can in conjunction with performing NUC process based on fast gate technique or using the calibration without the other types of fast gate technique.

The U.S. Provisional Patent Application No.61/495 that can submit to according on June 10th, 2011,873, the U.S. Provisional Patent Application 61/495 submitted on June 10th, 2011, the U.S. Provisional Patent Application 61/495 that on June 10th, 879 and 2011 submits to, 878, realize infrared imaging module 100 and host apparatus 102.By way of reference they are merged into herein as main body.

In various embodiments, the parts of host apparatus 102 and/or infrared imaging module 100 can be implemented as local system or parts each other by distributed system that is wired and/or wireless communication.Therefore, the various operations can determined by local and/or the distal component execution disclosure according to the needs of specific implementation.

Fig. 5 show according to disclosure embodiment, the process flow diagram of the various operations of determining NUC item.In certain embodiments, the processing module 160 that can be operated by the picture frame of catching infrared sensor 132 or processor 195 (also usual both is called processor) perform the operation of Fig. 5.

At block 505, infrared inductor 132 starts the picture frame of capturing scenes.Usually, described scene will be the true environment that host apparatus 102 is currently located at.With regard to this respect, shutter 105 (if optionally arranging) can be opened to allow infrared imaging module to receive infrared radiation from scene.Infrared sensor 132 can catch picture frame continuously during all operations shown in Fig. 5.With regard to this respect, the picture frame of catching continuously can be used for the various operations as discussed further.In one embodiment, before using the picture frame of catching in the operation shown in Fig. 5, time-domain filtering can be carried out (such as to it, step according to the block 826 of the Fig. 8 further described herein) and utilize other (such as, factory's gain term 812 of Fig. 8 as further described herein, factory's shift term 816, the NUC item 817 previously determined, row FPN item 820 and row FPN items 824) to process.

At block 510, detect that NUC process starts event.In one embodiment, NUC process can be started in response to the physical motion of host apparatus 102.Such as, can by this motion can be detected by the motion sensor 194 of processor poll.In one example in which, user can in a particular manner (such as, by brandish back and forth wittingly host apparatus 102 make its do " erasing " or " slip " motion) mobile host device 102.With regard to this respect, user can according to predetermined speed and direction (speed), and such as, up and down, left and right or other modes, mobile host device 102 is to start NUC process.In this example, use such movement can allow user intuitively operating host device 102 with the noise in the picture frame of simulating " abatement " and catching.

In another example, if motion exceedes threshold value (such as, motion has exceeded the normal use expected), NUC process can be started by host apparatus 102.Be appreciated that the spatial displacement of any desired type of host apparatus 102 can be used for starting NUC process.

In another example, if pass by minimum time since the NUC process previously performed, then can start NUC process by host apparatus 102.In another example, if infrared imaging module 100 experienced by minimum temperature variation since the NUC process previously performed, then can start NUC process by host apparatus 102.In another example, can start continuously and repeat NUC process.

At block 515, after NUC process startup event being detected, determine whether perform NUC process practically.With regard to this respect, whether can meet based on one or more subsidiary condition, optionally start NUC process.Such as, in one embodiment, unless since the NUC process previously performed, pass by minimum time, otherwise NUC process can not have been performed.In another embodiment, unless since the NUC process previously performed, infrared imaging module 100 experienced by minimum temperature variation, otherwise can not perform NUC process.Other standards or condition can be used in other embodiments.If met suitable standard or condition, then process flow diagram has proceeded to block 520.Otherwise process flow diagram turns back to block 505.

In NUC process, fuzzy graph picture frame can be used for determining NUC item, and the picture frame that described NUC item can be applicable to catch is to correct FPN.As discussed, in one embodiment, fuzzy graph picture frame can be obtained by multiple picture frames (multiple picture frames of such as, catching when scene and/or thermal imaging system are in motion) of cumulative moving scene.In another embodiment, fuzzy graph picture frame can be obtained by making the optical element miscellaneous part of thermal imaging system defocus.

Therefore, at block 520, provide the selection of two kinds of methods.If use based drive method, then process flow diagram proceeds to block 525.If used based on the method defocused, then process flow diagram proceeds to block 530.

With reference now to based drive method, at block 525, motion detected.Such as, in one embodiment, the picture frame can caught based on infrared sensor 132 detects motion.With regard to this respect, suitable method for testing motion can be applied (such as to the picture frame of catching, method for registering images, frame are to the Difference Calculation of frame or other suitable methods) to determine whether there is motion (what such as, captured is static or moving image frame).Such as, in one embodiment, whether the pixel around the pixel can determining successive image frame or the change in region be more than user-defined amount (such as, number percent and/or threshold value).If the pixel of at least given number percent has changed at least user-defined amount, then positive detection can arrive motion, thus proceed to block 535.

In another embodiment, can determine motion on the basis of each pixel, wherein, the pixel showing and there occurs significant change that only adds up is to provide fuzzy graph picture frame.Such as, counter can be set for each pixel, and this counter for guarantee each pixel be accumulated equal number pixel value or for being averaged to pixel value based on the quantity of the actual cumulative pixel value of each pixel.The motion based on image that can perform other types detects, and such as, performs and draws the winter (Radon) to convert.

In another embodiment, the Data Detection motion that can provide based on motion sensor 194.In one embodiment, this motion detects to comprise and whether detects host apparatus 102 in space along relatively straight orbiting motion.Such as, if host apparatus 102 is just along relatively straight orbiting motion, then likely appearing at some object in the scene of imaging may by not obviously fuzzy (such as, may aim at or be arranged essentially parallel to the object of described straight orbiting motion in scene with straight track).Therefore, in this embodiment, the condition of the motion of motion sensor 194 detection is display or the host apparatus 102 not showing particular track.

In yet another embodiment, motion detection step and motion sensor 194 can be used.Therefore, use any one of these various embodiments, can to determine when at least part of scene and host apparatus 102 move relative to each other whether (such as, to be moved relative to host apparatus 102 relative to scene motion, at least partly scene by host apparatus 102 or said two devices causes) catches each picture frame.

Can be expected that, due to the infrared sensor 132 mutual with scene motion thermal time constant (such as, micro-metering bolometer thermal time constant), detect that the picture frame of motion can demonstrate the scene of catching some secondary fuzzy (such as, relevant to scene fuzzy thermographic image data).

At block 535, cumulative picture frame motion being detected.Such as, if the motion of one group of continuous print picture frame detected, then can add up this series of drawing picture frame.As another example, if the motion of some picture frame only detected, then can skip and there is no the picture frame of motion and it does not added up.Therefore, can, based on the motion detected, a continuous or discrete picture group picture frame be selected to add up.

At block 540, be averaged to provide fuzzy graph picture frame to cumulative picture frame.Because cumulative picture frame is during movement caught, so estimate that scene information actual between picture frame will be different, thus cause scene information in the fuzzy graph picture frame (block 545) produced by fuzzy further.

In contrast, during movement, FPN (such as, being caused by one or more parts of infrared imaging module 100), by having in limited time in the change of scene radiation at least at short notice and at least, remains unchanged.Therefore, picture frame close on the Time and place during movement captured will have identical or at least similar FPN.Therefore, although the scene information in successive image frame may change, FPN will keep substantially constant.By being averaged to the multiple picture frames captured between moving period, described multiple picture frame will fuzzy scene information, but can not fuzzy FPN.Therefore, the restriction that the FPN in the fuzzy graph picture frame that provides of block 545 will keep than scene information clearly.

In one embodiment, in block 535 and 540, cumulative sum carried out to 32 or more picture frames average.But the picture frame of any desired amt is all in other embodiments available, just along with the minimizing of the quantity of frame, correction accuracy can reduce usually.

With reference now to based on the method defocused, at block 530, carry out defocusing operations and defocus with the picture frame making infrared sensor 132 wittingly and catch.Such as, in one embodiment, one or more actuator 199 can be used for adjusting, the miscellaneous part of mobile or translation optical element 180, infrared sensor package 128 and/or infrared imaging module 100, to make fuzzy (such as, not focusing on) picture frame of infrared sensor 132 capturing scenes.Also can consider to use other not make infrared image frame defocus wittingly based on the technology of actuator, such as, as manually (such as, user starts) defocuses.

Although the scene in picture frame may occur fuzzy, by defocusing operations, FPN (such as, being caused by one or more parts of infrared imaging module 100) will remain unaffected.Therefore, the fuzzy graph picture frame (block 545) of scene will have FPN, and compared with scene information, described FPN will keep clearly in described blurred picture.

In superincumbent discussion, describe the method based on defocusing relative to single picture frame of catching.In another embodiment, can comprise based on the method defocused and when infrared image-forming module 100 is defocused, multiple picture frame being added up, and the picture frame defocused is averaged to eliminate the impact of noise in time domain and provides fuzzy graph picture frame at block 545.

Therefore, be understandable that, both by based drive method also by providing fuzzy picture frame based on the method defocused at block 545.Because motion, to defocus or said two devices all can make a lot of scene informations fuzzy, so effectively fuzzy graph picture frame can be thought the low-pass filtering version of the relevant scene information of original picture frame of catching.

At block 505, the FPN item of the row and column determining to upgrade is processed (such as to fuzzy graph picture frame, if do not determine the FPN item of row and column before, the FPN item of the row and column so upgraded can be block 550 first time the new row and column in iteration FPN item).As the disclosure use, according to the direction of the miscellaneous part of infrared sensor 132 and/or infrared imaging module 100, term row and column is used interchangeably.

In one embodiment, block 550 comprise determine fuzzy graph picture frame every a line (such as, every a line can have himself space FPN correction term) space FPN correction term, and determine fuzzy graph picture frame each row (such as, each row can have the space FPN correction term of himself) space FPN correction term.That this process can be used for reducing the intrinsic space of thermal imaging system and the row and column FPN of slowly change (1/f), it is such as caused by the 1/f noise feature of the amplifier in ROIC 402, and described 1/f noise feature can show as the vertical and horizontal bar in picture frame.

Advantageously, by the FPN utilizing fuzzy graph picture frame to determine space row and column, can reduce and the vertical and horizontal in the scene of actual imaging be thought by mistake be the risk (such as, real scene content is fuzzy, and FPN maintenance is not fuzzy) of row and column noise.

In one embodiment, by consider fuzzy graph picture frame neighbor between difference determine row and column FPN item.Such as, Fig. 6 to show according to the neighbor of disclosure embodiment between difference.Particularly, in figure 6, pixel 610 and 8 horizontal adjacent pixels near it are compared: d0-d3 is in side, and d4-d7 is at opposite side.Difference between neighbor can be averaged, to obtain the estimated value of the offset error of the pixel groups illustrated.All can add up to the offset error of each pixel in row or row, and the mean value obtained can be used for correcting whole row or row.

In order to prevent that real contextual data is interpreted as noise, can SC service ceiling threshold value and lower threshold (thPix and-thPix).The pixel value (in this example embodiment, being pixel d1 and d4) fallen into outside this threshold range is not used in acquisition offset error.In addition, these threshold values can limit the maximum that row and column FPN corrects.

The U.S. Patent application No.12/396 that on March 2nd, 2009 submits to, 340 describe the other technologies performing space row and column FPN and correct, and it can be used as entirety to be incorporated in herein by way of reference.

Refer again to Fig. 5, the row and column FPN item of the renewal determined in block 550 is carried out storing (block 552) and is applied to the fuzzy graph picture frame that (block 555) block 545 provides.After applying these, the FPN of some the space row and columns in fuzzy graph picture frame can be reduced.But, because these are applied to row and column usually, so additional FPN can keep, such as, the space-independent FPN relevant to the skew of pixel to pixel or other reasons.With single row and column may not be directly related, the neighborhood of space-independent FPN also can keep.Therefore, can be further processed to determine NUC item, will be described below.

At block 560, determine local contrast value in fuzzy graph picture frame (the gradient edge value such as, between neighbor or small group of pixels or absolute value).If the scene information in fuzzy graph picture frame comprises also not by obviously fuzzy contrast region (such as, the high-contrast edge in Raw scene data), so this feature can be identified by the contrast determining step of block 560.

Such as, the local contrast value in blurred picture can be calculated, or the edge detecting step of type needed for any other can be applicable to identify as local contrast region a part, some pixel in blurred picture.Can think that the pixel marked by this way comprises the scene information of very high spatial frequency, the scene information of this very high spatial frequency can be interpreted as FPN (such as, this region may correspond in also not by the part of fully fuzzy scene).Therefore, these pixels can be got rid of outside the process being used for determining further NUC item.In one embodiment, this contrast check processing can be dependent on higher than the expectation contrast value relevant to FPN threshold value (such as, can think that the contrast value that demonstrates is scene information higher than the pixel of threshold value, and that think that those pixels lower than threshold value show is FPN).

In one embodiment, after row and column FPN item has been applied to fuzzy graph picture frame, can determine (such as, as shown in Figure 5) the contrast of fuzzy graph picture frame execution block 560.In another embodiment, can before block 550 execution block 560, to determine contrast (such as, defining impact with what prevent the contrast based on scene for these) before determining row and column FPN item.

After block 560, can be expected that, any high spatial frequency component remained in fuzzy graph picture frame is generally attributable to space-independent FPN.With regard to this respect, after block 560, other noises a lot of or the real information based on scene needed are removed or got rid of outside fuzzy graph picture frame, this is because: to fuzzy wittingly (such as, by from the motion of block 520 to 545 or defocus) of picture frame, the application (block 555) of row and column FPN item and the determination (block 560) of contrast.

Therefore, it is expected to, after block 560, any residual high spatial frequency component (such as, being shown as the contrast in fuzzy graph picture frame or distinct regions) is all attributable to space-independent FPN.Therefore, at block 565, high-pass filtering is carried out to fuzzy graph picture frame.In one embodiment, this can comprise fuzzy graph picture frame application Hi-pass filter to extract high spatial frequency component from fuzzy graph picture frame.In another embodiment, this can comprise fuzzy graph picture frame application of low-pass filters, and the difference extracted between the picture frame after low-pass filtering and the picture frame not having filtering is to obtain high spatial frequency component.According to various embodiment of the present disclosure, realize Hi-pass filter by the mean difference between calculating sensor signal (such as, pixel value) and its field.

At block 570, flat field correction process is carried out to the fuzzy graph picture frame after high-pass filtering, to determine the NUC item (such as, if previously do not perform NUC process, the NUC item so upgraded can be the new NUC item of first time in iteration of block 570) upgraded.

Such as, Fig. 7 shows the flat field correction technology 700 according to disclosure embodiment.In the figure 7, the NUC item by using the value of neighbor 712 to 726 of pixel 710 to determine each pixel 710 of fuzzy graph picture frame.For each pixel 710, several gradient can be determined based on the absolute difference between the value of various neighbor.Such as, the absolute difference between following pixel can be determined: between pixel 712 and 714 between (diagonal angle gradient from left to right), pixel 716 and 718 between (VG (vertical gradient) from top to bottom), pixel 720 and 722 between (diagonal angle gradient from right to left) and pixel 724 and 726 (horizontal gradient from left to right).

Can sue for peace to these absolute differences, to provide the summation gradient of pixel 710.Can determine the weighted value of pixel 710, described weighted value is inversely proportional to summation gradient.This step can be performed, until provide weighted value for each pixel 710 to whole pixels 710 of fuzzy graph picture frame.For the region (such as, by fuzzy region or the region with low contrast) with low gradient, weighted value will close to 1.On the contrary, for the region with high gradient, weighted value will be 0 or close to 0.The updated value of the NUC item estimated by Hi-pass filter is multiplied with weighted value.

In one embodiment, by a certain amount of time decay is applied to NUC item determining step, risk scene information being incorporated into NUC item can be reduced further.Such as, the time decay factor λ between 0 and 1 can be selected, the new NUC item (NUC stored like this _nEW) be old NUC item (NUC _oLD) and the NUC item (NUC of renewal that estimates _uPDATE) weighted mean value.In one embodiment, this can be expressed as: NUC _nEW=λ NUC _oLD+ (1-λ) (NUC _oLD+ NUC _uPDATE).

Determine NUC item although described according to gradient, local contrast value time suitable, also can be used to replace gradient.Also other technologies can be used, such as, standard deviation calculation.The flat field correction step that can perform other types, to determine NUC item, comprising: the U.S. Patent No. 6,028,309 that such as on February 22nd, 2000 issues; The U.S. Patent No. 6,812,465 issued on November 2nd, 2004; And the U.S. Patent application No.12/114 that on May 5th, 2008 submits to, the various steps described in 865.By way of reference above-mentioned document is incorporated in herein as a whole.

Refer again to Fig. 5, block 570 can comprise the additional treatments to NUC item.Such as, in one embodiment, in order to retain the mean value of scene signals, by the mean value that deducts NUC item from each NUC item by whole NUC item and normalize to 0.Same ground, at block 570, in order to avoid row and column noise effect NUC item, can deduct the mean value of every row and column from the NUC item of every row and column.Therefore, the row and column FPN wave filter being used in the row and column FPN item that block 550 is determined after can filtering out better and NUC item being applied to the image of catching (such as, in the step that block 580 carries out, to be further described this herein) further iteration in the row and column noise of (such as, as Fig. 8 be shown specifically).With regard to this respect, row and column FPN wave filter can use more data to calculate often row the and often deviation ratio that arranges is (such as usually, the FPN item of row and column), and with come on capture space compared with incoherent noise based on Hi-pass filter, can thus provide thus more reliably, for reducing the option of the FPN of space correlation.

At block 571-573, can perform additional high-pass filtering to the NUC item upgraded alternatively and further determine that process is with the FPN eliminating space correlation, the FPN of described space correlation has the spatial frequency lower than the previous spatial frequency eliminated by row and column FPN item.With regard to this respect, some changes of the miscellaneous part of infrared sensor 132 or infrared imaging module 100 can produce the FPN noise of space correlation, and the FPN noise of the space correlation produced can not be modeled as row or row noise easily.The FPN of this space correlation can comprise the transmitted fluorescence on such as different from adjacent infrared sensor 132 to radiometric response sensor package or infrared sensor 132 groups.In one embodiment, offset correction can be used to reduce the FPN of this space correlation.If the quantity of the FPN of this space correlation is a lot, then also noise can be detected in fuzzy graph picture frame.Because such noise can affect neighbor, the Hi-pass filter with very little kernel may not detect that FPN in neighbor (such as, whole values that Hi-pass filter uses can from affected pixel near pixel extract, thus can by same offset errors effect).Such as, if use the high-pass filtering of little kernel execution block 565 (such as, only considering the pixel of the next-door neighbour of the environs of the pixel falling into the FPN impact being subject to space correlation), then the FPN of the space correlation of extensively distribution may not be detected.

Such as, Figure 11 shows the FPN according to the space correlation in disclosure embodiment, neighbouring pixel.As adopt sample picture frame 1100 shown in, the pixel of the vicinity of pixel 11001110 can show the FPN of space correlation, the FPN of described space correlation is inaccurately relevant to single row and column, and be distributed in neighbouring multiple pixels (such as, in this example embodiment, neighbouring pixel is about the pixel of 4*4).The sample graph picture frame 1100 of sampling also comprises one group of pixel 1120 and one group of pixel 1130, and described pixel 1120 shows does not have substantially responding uniformly of use in filtering calculates, and described pixel 1130 is for estimating the low-pass value of neighbouring pixel 1110.In one embodiment, pixel 1130 can be can eliminate multiple pixels of 2, so that effective calculating of the hardware of efficiency or software by being divided into 2.

Refer again to Fig. 5, at block 571-573, can additional high-pass filtering be performed to the NUC item upgraded alternatively and further determine process, to eliminate the FPN of space correlation, such as, the FPN of the space correlation that pixel 1110 shows.At block 571, the NUC item of the renewal determined at block 570 is applied to fuzzy graph picture frame.Therefore, now, fuzzy graph picture frame will for the FPN (such as, by applying the row and column FPN upgraded at block 555) of preliminary corrections space correlation, and also for the space-independent FPN of preliminary corrections (such as, by applying the NUC item upgraded at block 571).

At block 572, apply another Hi-pass filter, the core of this Hi-pass filter is larger than the core of the Hi-pass filter used in block 565, and can determine the NUC item of renewal further at block 573.Such as, in order to detect the FPN of the space correlation existed in pixel 1110, the data of the enough large adjacent area from pixel can be comprised at the Hi-pass filter of block 572 application, thus can determine there is no affected pixel (such as, pixel 1120) and affected pixel (such as, pixel 1110) between difference.Such as, the low-pass filter (such as, the N × N kernel much larger than 3 × 3 pixels) with macronucleus can be used, and the result that obtains can be deducted to carry out suitable high-pass filtering.

In one embodiment, in order to improve counting yield, sparse kernel can be used, thus only use the neighbor of the lesser amt in N × N near zone.For Hi-pass filter operation (such as macronucleus) of any given use neighbor far away, there is the risk (may be fuzzy) scene information of reality being modeled as the FPN of space correlation.Therefore, in one embodiment, the time decay factor λ of the NUC item being used for the renewal determined at block 573 can be set to close to 1.

In various embodiments, can repeatable block 571-573 (such as, cascade), high-pass filtering is performed iteratively to utilize the core size increased progressively, thus the NUC item upgraded further is provided, the NUC item of described further renewal is used for the FPN of the space correlation correcting the adjacent area size needed further.In one embodiment, whether the FPN of space correlation can be eliminated veritably according to the NUC item of the renewal of the prior operation by block 571-573, make the decision whether performing this iteration.

After block 571-573 completes, make the decision (block 574) about whether, the NUC item of renewal being applied to the picture frame of catching.Such as, if the mean value of the absolute value of the NUC item of whole picture frame is less than minimum threshold value, or be greater than maximum threshold value, then can think that this NUC item is false or can not provides significant correction.Alternatively, threshold criteria can be applied to each pixel, to determine which pixel-by-pixel basis receives the NUC item of renewal.In one embodiment, threshold value may correspond to the difference between the NUC item and the NUC item previously calculated of new calculating.In another embodiment, threshold value can independent of the NUC item previously calculated.Other tests (such as, spatial coherence test) can be applied to determine whether apply this NUC item.

If think that NUC item is false or can not provides significant correction, then process flow diagram turns back to block 505.Otherwise, store the up-to-date NUC item (block 575) determined to substitute previous NUC item (such as, being determined by the iteration previously performed in Fig. 5), and the described up-to-date NUC item determined be applied to the picture frame that (block 580) catch.

Fig. 8 shows and operates with other according to the various image processing techniques being applied in the Fig. 5 in image processing pipeline 800 of disclosure embodiment.With regard to this respect, streamline 800 identifies the various operations of Fig. 5 when the processing scheme of the whole iterative images for correcting the picture frame that infrared imaging module 100 provides.In certain embodiments, streamline 800 can be provided by the processing module 160 operated the picture frame of being caught by infrared sensor 132 or processor 195 (also usual both is called processor).

The picture frame that infrared sensor 132 is caught can be supplied to frame averager 804, described frame averager 804 asks the integration of multiple picture frame to provide the picture frame 802 of the signal to noise ratio (S/N ratio) with improvement.By infrared sensor 132, ROIC 402 and be embodied as and support that the miscellaneous part that hi-vision catches the infrared sensor package 128 of speed provides frame averager 804 effectively.Such as, in one embodiment, infrared sensor package 128 can catch infrared image frame with the frame per second of 240Hz (such as, 240 width images per second).In this embodiment, such as by making infrared sensor package 128 be operated in relatively low voltage (such as, compatible mutually with the voltage of mobile phone), and by using relatively little infrared sensor 132 array (such as, in one embodiment, be the infrared array sensor of 64 × 64), realize frame per second high like this.

In one embodiment, with higher frame per second (such as, 240Hz or other frame per second), this infrared image frame from infrared array sensor 128 can be supplied to processing module 160.In another embodiment, infrared sensor package 128 can carry out integration in longer time period or multiple time period, thus with lower frame per second (such as, 30Hz, 9Hz or other frame per second) (after such as, being averaged) the infrared image frame after integration is supplied to processing module 160.Catching compared with hi-vision the U.S. Provisional Patent Application No.61/495 that the details of the implementation of speed can be referenced before this paper about can be used for providing, finding in 879.

Picture frame 802 continues through streamline 800, and in streamline 800, they are adjusted by various item, are temporally filtered, are used to determine various adjustment item and gain compensation.

At block 810 and 814, factory's gain term 812 and factory's shift term 816 are applied to picture frame 802, with the gain between the miscellaneous part compensating determined various infrared sensor 132 and/or infrared imaging module 100 during Computer-Assisted Design, Manufacture And Test respectively and offset deviation.

At block 580, NUC item 817 is applied to picture frame 802, to correct FPN as described above.In one embodiment, if also do not determine NUC item 817 (such as, before starting NUC process), then may can not execution block 580, or initial value can be used for the NUC item 817 (such as, the off-set value of each pixel will equal 0) that view data can not be caused to change.

At block 818 to 822, respectively row FPN item 820 and row FPN item 824 are applied to picture frame 802.Row FPN item 820 and row FPN item 824 can be determined as mentioned above according to block 550.In one embodiment, if also do not determine row FPN item 820 and row FPN item 824 (such as, before starting NUC process), then may can not execution block 818 and 822, or the row FPN item 820 that initial value can be used for causing view data to change and row FPN item 824 (such as, the off-set value of each pixel will equal 0).

At block 826, according to noise in time domain abatement (TNR) method, instantaneous filtering is performed to picture frame 802.Fig. 9 shows the TNR method according to disclosure embodiment.In fig .9, to the picture frame 802b process after the picture frame 802a be currently received and previous time-domain filtering to determine the picture frame 802e after new time-domain filtering.Picture frame 802a and 802b comprises local neighbor 803a and 803b respectively centered by pixel 805a and 805b.Neighbor 803a and 803b corresponds to the same position in picture frame 802a and 802b, and is the subset of the whole pixel of picture frame 802a and 802b.In the illustrated embodiment, neighbor 803a and 803b comprises the region of 5 × 5 pixels.The neighbor of other sizes can be used in other embodiments.

Determine the difference of pixel corresponding in neighbor 803a and 803b and it is averaging, thinking that the position corresponding to pixel 805a and 805b provides average variable values 805c.Average variable values 805c is used in block 807 and determines weighted value, to apply it to pixel 805a and the 805b of picture frame 802a and 802b.

In one embodiment, as shown in figure 809, the weighted value determined at block 807 can be inversely proportional to average variable values 805c, and during to make that difference is larger between neighbor 803a and 803b, weighted value is reduced to 0 rapidly.With regard to this respect, between neighbor 803a and 803b, bigger difference can represent that scene is interior (such as, due to motion) there occurs change, and in one embodiment, suitable weighting can be carried out, to avoid to run into frame fuzzy to introducing during the scene change of frame to pixel 802a and 802b.Other associations between weighted value and average variable values 805c can be used in other embodiments.

The weighted value determined at block 807 can be used for pixel 805a and 805b, to determine the value (block 811) of the respective pixel 805e of picture frame 802e.With regard to this respect, pixel 805e can have the weighted mean value (or other combinations) of pixel 805a and 805b, depends on the average variable values 805c and weighted value that determine at block 807.

Such as, the pixel 805e of the picture frame 802e after time-domain filtering may be the pixel 805a of picture frame 802a and 802b and the weighted sum of 805b.If the average difference between pixel 805a and 805b causes due to noise, so can be expected that, the mean change between neighbor 805a and 805b will close to 0 (such as, corresponding to the mean value of incoherent change).In this case, can be expected that, the difference between neighbor 805a and 805b and will close to 0.In this case, suitable weighting can be carried out to the pixel 805a of picture frame 802a, to contribute to the value producing pixel 805e.

But, if this difference and be not 0 (such as, in one embodiment, even only very little with zero phase error amount), so can by change interpretation for being by kinetic, instead of caused by noise.Therefore, the change of the mean value that can show based on neighbor 805a and 805b detects motion.In this case, heavier weight can be applied to the pixel 805a of picture frame 802a, and lighter weight is applied to the pixel 805b of picture frame 802b.

Other embodiments are also admissible.Such as, although what describe is determine average variable values 805c according to neighbor 805a and 805b, but in other embodiments, average variable values 805c can be determined according to the standard of any expectation (such as, according to the pixel groups be made up of a series of pixel of single pixel or other types).

In the above embodiments, picture frame 802a is described as the picture frame be currently received, and picture frame 802b is described as the picture frame previously after time-domain filtering.In another embodiment, picture frame 802a and 802b can be infrared imaging module 100 capture also not through the first and second picture frames of time-domain filtering.

Figure 10 shows the further implementation detail relevant with the TNR method performed by block 826.As shown in Figure 10, respectively picture frame 802a and 802b is read into line buffer 1010a and 1010b, and before picture frame 802b (such as, previous image frames) is read into line buffer 1010b, can be stored in frame buffer 1020.In one embodiment, one piece of random access memory (RAM) that can be provided by any suitable parts of infrared imaging module 100 and/or host apparatus 102 realizes line buffer 1010a-b and frame buffer 1020.

Refer again to Fig. 8, picture frame 802e can be sent to automatic gain compensation block 828, it is further processed picture frame 802e, to provide the final image frame 830 that can be used as required by host apparatus 102.

Fig. 8 further illustrates the various operations for determining as discussed performed by row and column FPN item and NUC item.In one embodiment, these operations can use picture frame 802e as shown in Figure 8.Because carried out time-domain filtering to picture frame 802e, so at least some noise in time domain can be eliminated, thus inadvertently can not affect the determination to row and column FPN item 824 and 820 and NUC item 817.In another embodiment, the picture frame 802 of non-temporal filtering can be used.

In fig. 8, the block 510,515 of Fig. 5 is together with 520 intensively represent.As discussed, can event be started in response to various NUC process and optionally start based on various standard or condition or perform NUC process.Also as discussed, according to based drive method (block 525,535 and 540) or NUC process can be performed based on the method defocused (block 530), to provide fuzzy picture frame (block 545).Fig. 8 further illustrates the various extra blocks 550,552,555,560,565,570,571,572,573 and 575 about Fig. 5 previously discussed.

As shown in Figure 8, row and column FPN item 824 and 820 and NUC item 817 can be determined and be applied in an iterative manner, thus use the picture frame 802 having applied first preceding paragraph to determine the item upgraded.Therefore, the institute of Fig. 8 can repeatedly upgrade in steps, and applies these to reduce the noise in the picture frame 830 that will be used by host apparatus 102 continuously.

Refer again to Figure 10, it illustrates the detailed implementation detail of various pieces relevant with streamline 800 in Fig. 5 and Fig. 8.Such as, block 525,535 and 540 is shown as the normal frame rate operation of the picture frame 802 received with streamline 800.In the embodiment shown in fig. 10, the decision made at block 525 is expressed as decision rhombus, it is for determining whether Given Graph picture frame 802 changes fully, thus can think that it is such picture frame: if picture frame is joined in other picture frames, this picture frame will strengthen fuzzy, therefore this picture frame is carried out adding up (in this embodiment, representing block 535 by arrow) and average (block 540).

Equally in Fig. 10, to be shown as with renewal rate operation, in this example embodiment, due to the average treatment performed at block 540 to the determination (block 550) of row FPN item 820, this renewal rate is 1/32 of sensor frame per second (such as, normal frame rate).Other renewal rates can be used in other embodiments.Although Figure 10 only identifies row FPN item 820, can in an identical manner, with the frame per second reduced to realize row FPN item 824.

Figure 10 also show the further implementation detail relevant with the NUC determining step of block 570.With regard to this respect, fuzzy graph picture frame can be read into line buffer 1030 (block RAM such as, provided by any suitable parts of infrared imaging module 100 and/or host apparatus 102 realizes).The flat field correction technology 700 of Fig. 7 can be performed on fuzzy graph picture frame.

In view of content of the present disclosure, should be understood that, method described herein can be used for eliminating various types of FPN (such as, comprising the FPN of very high-amplitude), such as, and the row and column FPN of space correlation and space-independent FPN.

Other embodiments are also admissible.Such as, in one embodiment, the renewal rate of row and column FPN item and/or NUC item can be inversely proportional to the fuzzy quantity of the estimation in fuzzy graph picture frame and/or is inversely proportional to the size of local contrast value (such as, determining at block 560).

In various embodiments, the technology of description is better than traditional noise compensation technology based on shutter.Such as, by using the process without shutter, do not need to arrange shutter (such as, as shutter 105), thus can reduced in size, weight, cost and mechanical complexity.If do not need the operation shutter of machinery, the power and maximum voltage that are supplied to infrared imaging module 100 or produced by infrared imaging module 100 also can be reduced.By being removed by the shutter as potential trouble spot, reliability will be improved.The potential image that process without shutter also eliminates caused by the temporary blockade of the scene by shutter imaging interrupts.

Similarly, noise is corrected by using the fuzzy graph picture frame of catching from real scene (not being the unified scene that shutter provides) wittingly, can carry out noise compensation to picture frame, the radiation level of the real scene that the radiation level of described picture frame and expectation are imaged is similar.This can improve precision according to the determined noise compensation item of the technology of various description and efficiency.

As discussed, in various embodiments, infrared imaging module 100 can be configured to work at low-voltage.Especially, the circuit that is configured to work at low-voltage can be utilized and/or according to allowing infrared imaging module 100 continuously and effective other parameters realized in various types of host apparatus 102 (such as, mobile device and other devices) realize infrared imaging module.

Such as, Figure 12 shows another block diagram realized comprising the infrared sensor package of infrared sensor 132 and low dropout regulator according to disclosure embodiment.As shown, Figure 12 also show all parts 1202,1204,1205,1206,1208 and 1210, and these parts can to realize with the same or analogous mode of the corresponding component of the Fig. 4 described before.Figure 12 also show the bias voltage correction circuit 1212 that can be used for regulating the one or more bias voltages (such as, with the change of compensation temperature, self-heating and/or other factors) being supplied to infrared sensor 132.

In certain embodiments, LDO 1220 can as a part for infrared sensor package 128 (such as, being positioned in the wafer-level packaging of same chip and/or ROIC).Such as, LDO 1220 can as a part of FPA with infrared ray sensor assembly 128.As discussed, this realization can reduce the power supply noise being incorporated into infrared sensor package 128, thus provides the PSRR of improvement.In addition, by being embodied as by ROIC, there is LDO, less die area can be consumed and need less discrete tube core (or chip).

LDO 1220 receives the output voltage that power supply 1230 is provided by power lead 1232.LDO 1220 provides output voltage by power lead 1222 to all parts of infrared sensor package 128.With regard to this respect, LDO 1220 can provide substantially the same burning voltage in response to the single input voltage received from power supply 1230 to all parts of infrared sensor package 128.

Such as, in certain embodiments, the scope of the input voltage that power supply 1230 can provide for about 2.8 volts to about 11 volts (such as, in one embodiment, be about 2.8 volts), and the scope of the output voltage that LDO 1220 can provide is about 1.5 volts to about 2.8 volts (such as, in one embodiment, being about 2.5 volts).With regard to this respect, LDO 1220 can be used for providing consistent regulated output voltage, and no matter power supply 1230 is embodied as the conventional voltage scope with about 9 volts to about 11 volts, or all low pressure of 2.8 volts according to appointment.Therefore, although provide various voltage range for input and output voltage, can be expected that, although input voltage changes, maintenance is fixed by the output voltage of LDO 1220.

Compared with realizing with the normal power supplies of FPA, part LDO 1220 being embodied as infrared sensor package 128 provides various advantage.Such as, conventional FPA depends on multiple power supply usually, each power supply can be supplied to FPA respectively and distribute to all parts of FPA respectively.By utilizing LDO 1220 to regulate single power supply 1230, suitable voltage can being supplied to respectively (such as, in order to reduce possible noise) all parts to infrared sensor package 128, this reduces complicacy.LDO 1220 is used also to allow infrared sensor package 128 to work in a uniform matter, even if the input voltage 1230 of power supply 1230 changes (such as, if battery or be used as power supply 1230 other types device charge or discharge and cause input voltage increase or reduce).

The all parts of infrared sensor package 128 shown in Figure 12 also can be implemented as and is operated in lower voltage than conventional equipment.Such as, as discussed, LDO 1220 can be embodied as provides low-voltage (such as, about 2.5 volts).In contrast, multiple high voltage is generally used for as the FPA of routine powers, such as: for being about 3.3 volts to about 5 volts of supplying digital circuits; For about 3.3 volts that power for mimic channel; And for being about 9 volts to about 11 volts of load supplying.In addition, in certain embodiments, use LDO 1220 can reduce or eliminate the needs to the independent negative reference voltage being supplied to infrared sensor package 128.

With reference to Figure 13, the other side of the low voltage operating of infrared sensor package 128 can be understood further.Figure 13 shows the circuit diagram of the part infrared sensor package 128 of the Figure 12 according to disclosure embodiment.Especially, Figure 13 shows the optional feature (such as, parts 1326,1330,1332,1334,1336,1338 and 1341) of the bias voltage correction circuit 1212 being connected to LDO 1220 and infrared sensor 132.Such as, according to embodiment of the present disclosure, bias voltage correction circuit 1212 can be used for compensating the change that bias voltage depends on temperature.With reference to the like that the U.S. Patent No. 7,679,048 issued on March 16th, 2010 identifies, the operation of these optional features can be understood further, it can be used as entirety to be incorporated into herein by way of reference.Also all parts that the U.S. Patent No. 6,812,465 can issued according on November 2nd, 2004 identifies realizes infrared sensor package 128, it can be used as entirety to be incorporated into herein by way of reference

In various embodiments, as shown in figure 13, part or all of bias voltage correction circuit 1212 (such as, for making all infrared sensors 132 concentrate in an array) can be realized on the basis of global array.In other embodiments, part or all of bias voltage correction circuit 1212 can be implemented as single-sensor bias voltage (such as, copying each infrared sensor 132 whole or in part).In certain embodiments, the miscellaneous part of bias voltage correction circuit 1212 and Figure 13 can be implemented as a part of ROIC 1202.

As shown in figure 13, LDO 1220 provides load voltage Vload along a power lead 1222 to bias voltage correction circuit 1212.As discussed, in certain embodiments, with can be used as conventional infreared imaging device load voltage the high voltage of about 9 volts to about 11 volts compared with, Vload can be about 2.5 volts.

Based on Vload, bias voltage correction circuit 1212 provides sensor bias voltage Vbolo at node 1360.By suitable on-off circuit 1370 (represented by the dotted line such as, in Figure 13), Vbolo can be distributed to one or more infrared sensor 132.In some example, the suitable parts that can identify according to the U.S. Patent No. 6,812,465 and 7,679,048 quoted before this paper realize on-off circuit.

Each infrared sensor 132 comprise by on-off circuit 1370 receive Vbolo node 1350 and can another node 1352, substrate and/or negative reference voltage of ground connection.In certain embodiments, the voltage on node 1360 can be substantially the same with the voltage Vbolo provided at node 1350.In other embodiments, can the voltage of knot modification 1360 to compensate the possible pressure drop relevant with on-off circuit 1370 and/or other factors.

Compared with being generally used for the voltage of conventional infrared sensor bias voltage, Vbolo can be implemented as lower voltage.In one embodiment, Vbolo can be in the scope of about 0.2 volt to about 0.7 volt.In another embodiment, Vbolo can be in the scope of about 0.4 volt to about 0.6 volt.In another embodiment, Vbolo can be about 0.5 volt.In contrast, conventional infrared sensor uses the bias voltage of about 1 volt usually.

Compared with the infreared imaging device of routine, the infrared sensor 132 according to the lower bias voltage of use of the present disclosure makes infrared sensor package 128 show significantly reduced power consumption.Especially, the power consumption of each infrared sensor 132 presses square reduction of bias voltage.Therefore, such as power consumption is significantly reduced, particularly when being applied to the many infrared sensors 132 in infrared array sensor from the reduction of 1.0 volts to 0.5 volt.The reduction of this power consumption can also cause the self-heating of infrared sensor package 128 to reduce.

The embodiment other according to the disclosure, provides the various technology of the impact for reducing the noise in the picture frame that provided by the infreared imaging device being operated in low-voltage.With regard to this respect, when being operated in low-voltage when infrared sensor package 128 as described, if do not corrected noise, self-heating and/or other phenomenon, it just shows more obvious in the picture frame provided by infrared sensor package 128.

Such as, with reference to Figure 13, when Vload is remained on low-voltage in mode described herein by LDO 1220, Vbolo also will remain on its corresponding low-voltage and can reduce the relative size of its output signal.Therefore, noise, self-heating and/or other phenomenons can produce larger impact to the less output signal read from infrared sensor 132, thus cause output signal to change (such as, mistake).If do not corrected, these changes can show as the noise in picture frame.In addition, although low voltage operating can reduce some phenomenon (such as, self-heating) total amount, but, less output signal can allow remainder error source (residual self-heating) during low voltage operating on output signal produce out-of-proportion impact.

In order to compensate this phenomenon, various array sizes, frame per second and/or frame averaging can be utilized to realize infrared sensor package 128, infrared imaging module 100 and/or host apparatus 102.Such as, as discussed, consider various different array sizes to be used for infrared sensor 132.In certain embodiments, infrared sensor 132 can be embodied as the infrared sensor 132 of array sizes scope from 32 × 32 to 160 × 120.Other exemplary array sizes comprise 80 × 64,80 × 60,64 × 64 and 64 × 32.The array sizes of any needs can be used.

Advantageously, when infrared sensor package 128 is embodied as this smaller array sizes, infrared sensor package 128 when without the need to making very large amendment to ROIC and interlock circuit, can provide picture frame with relatively high frame per second.Such as, in certain embodiments, the scope of frame per second can from about 120Hz to about 480Hz.

In certain embodiments, can make array size and frame per second relative to each other between convergent-divergent (such as, in the mode be inversely proportional to or contrary to the mode be directly proportional), there is lower frame per second larger array is embodied as and less array is embodied as there is higher frame per second.Such as, in one embodiment, the frame per second that the array of 160 × 120 has is about 120Hz.In another embodiment, the array of 80 × 60 has the corresponding higher frame per second being about 240Hz.It is also conceivable to other frame per second.

By size and the frame per second of convergent-divergent array between relative to each other, no matter actual FPA array sizes or frame per second be how many, and the row of FPA array and/or the specific reading of row regularly can be consistent.In one embodiment, the reading timing of every row or column can be about 63 microseconds.

As before to the discussion of Fig. 8, the picture frame that infrared ray sensor 132 is caught can be supplied to frame averager 804, frame averager 804 quadratures to provide to multiple picture frame has lower frame per second (such as, about 30Hz, about 60Hz or other frame per second) and the picture frame 802 (picture frame such as, after process) of signal to noise ratio (S/N ratio) that improves.Especially, be averaged by the picture frame of the high frame per second provided relatively little FPA array, can effectively on average fall and/or reduce significantly the picture noise produced in picture frame 802 due to low voltage operating.Therefore, infrared sensor package 128 can be operated in the relatively low voltage provided by LDO as above, and not by being processed the impact of the additional noise in the rear picture frame 802 produced with relevant spinoff by frame averager 804.

It is also conceivable to other embodiments.Such as, although show the infrared sensor 132 of single array, can be expected that, multiple this array can use to provide more high-resolution picture frame (such as, scene can pass through multiple such array image-forming) together.This array can be arranged in multiple infrared ray sensor assembly 128 and/or be arranged in identical infrared sensor package 128.Each this array can be operated in low-voltage as described, and can be provided with the ROIC circuit that is associated so that each array still can be operated in relatively high frame per second.The picture frame of the high frame per second provided by this array can by share or dedicated frame averager 804 average, to reduce and/or to eliminate the noise relevant to low voltage operating.Therefore, still high-resolution infrared image can be obtained when being operated in low-voltage.

In various embodiments, infrared sensor package 128 can be embodied as suitable size, pup J-Horner 104 (such as, for the socket of mobile device) can be coordinated to use to allow infrared imaging module 100.Such as, in certain embodiments, infrared sensor package 128 can be embodied as the chip size of range of size for about 4.0mm × 4.0mm to about 5.5mm × about 5.5mm (such as, in one embodiment, being about 4.0 × about 5.5mm).Infrared sensor package 128 can be embodied as this size or other suitable sizes, with allow with the socket 104 being embodied as various sizes with the use of, such as: 8.5mm × 8.5mm, 8.5mm × 5.9mm, 6.0mm × 6.0mm, 5.5mm × 5.5mm, 4.5mm × 4.5mm and/or other jack sizes, for example, such as, the U.S. Provisional Patent Application No.61/495 quoted herein, those sizes that the table 1 of 873 is determined.

One or more embodiment of the present disclosure is for the measurement mechanism that can be carried to work place by electrician or other users easily, this user uses this measurement mechanism to perform in comprehensive mode and measures and check, and without the need to requiring that user uses multiple different device.Such as, carry out the electrician of electrical installation work or other users can use the measurement mechanism of one or more embodiment accurately measure the various distance of electric wire installation site or span with determine the electric wire needed length, check that wire spool is to check electric wire on spool whether long enough and checked the length of electric wire of cutting before electric wire is installed to installation site.After installing electric wire and/or other electric components, user can also use the measurement mechanism inspection various electrical quantitys relevant to electric wire and/or other electric components to detect and/or to diagnose electric fault.In addition, electrician or other users can utilize measurement mechanism to check the heat picture of scene, such as to locate easily and/or to identify potential electric fault.

Forward in Figure 14 A-15, will describe according to the measurement mechanism 1400 (such as, measuring equipment, instrument or instrument) in various embodiment of the present disclosure now.Such as, various task is performed when measurement mechanism 1400 can be used by electrician and other people to work at the scene.Such task can comprise, such as, mounting electrical system, check electrical system and/or perform a series of electric measurement, installation and Detection task time other tasks.The measurement mechanism 1400 of one or more embodiment by the parameter of the form of providing convenience, various integrated and cooperation is measured and checking ability (such as, range observation, wire length measurement, electric parameter measurement and/or thermal imaging ability), can advantageously help electrician and other staff.

Figure 14 A-14B shows the various external views of the measurement mechanism 1400 according to embodiment of the present disclosure.More specifically, Figure 14 A and Figure 14 B respectively illustrates front view and the top-level view of measurement mechanism 1400.The all parts of measurement mechanism 1400 can be arranged on shell 1402 or inner (such as, be completely enclosed within shell, substantially close in the enclosure and/or in the enclosure partially enclosed).When carrying or using (such as, at the scene operation during), it is hand-held or be otherwise convenient to user and handle that shell 1402 can be suitable for user (such as, electrician).As shown, in one embodiment, shell 1402 size and dimension can be usually carried to traditional multimeter of work place similar with electrician.In another embodiment, shell 1402 can comprise the handle or other projections (such as, pistol grip) that allow user to hold shell 1402 easily.But, it should be pointed out that shell 1402 can be generally any size and/or the shape that are suitable for onsite application easily, and be not necessarily limited to allow the singlehanded shape used.

In one embodiment, measurement mechanism 1400 can comprise and is arranged on multiple electric terminals 1404 (such as, comprising the one or more electric terminals as 1404A-1404D mark) in shell 1402 or on it, optical transmitting set 1406, sensor 1408, infrared imaging module 1416, display 1418, customer controller 1422 and/or display 1424.The position of all parts shown in Figure 14 A-14B is only in order to the object for explaining, and can application-specific as required or in order to be suitable for measurement mechanism 1400, all parts identified can be arranged on any other position in shell 1402 or on it herein.Such as, in other embodiments, if the side of shell 1402 or bottom surface are convenient to use and/or the manufacture of measurement mechanism 1400 more, then all or part of multiple terminals 1404 can be arranged on this position.Be understandable that, when not deviating from the scope of the present disclosure and spirit, based on the needs of the application-specific of measurement mechanism 1400, one or more parts of measurement mechanism 1400 can merge each other and/or omit.

With reference now to Figure 15, it illustrates the block diagram of the measurement mechanism 1400 according to disclosure embodiment.Measurement mechanism 1400 can comprise distance measuring circuit 1510, Length Measuring Circuit 1512, electric meter circuit 1514, storer 1520 and/or optional feature 1526.The combination being configured to perform the simulation of various operation as herein described and/or any suitable of digital circuit can be utilized to realize distance measuring circuit 1510, Length Measuring Circuit 1512 and electric meter circuit 1514.

In one embodiment, various measurement can be performed by mimic channel to operate.In another embodiment, can be performed some by mimic channel and operate, and simulating signal is converted to digital signal (such as, utilizing analog to digital converter (DAC) or other Sampling techniques) to be further processed by digital circuit.In yet another embodiment, can by the digital signal converted back into analog signal (such as, utilizing digital to analog converter or DAC) that exports from digital circuit to further process.

In certain embodiments, the digital circuits section of distance measuring circuit 1510, Length Measuring Circuit 1512 or electric meter circuit 1514 can be implemented as and is configured to high-performance specially and/or performs the special IC (ASIC) measuring operation as herein described expeditiously.In other embodiments, can utilize and be configured to perform suitable software instruction to perform the general Central Processing Unit (CPU) of various operation as herein described, microcontroller, digital signal processing (DSP) equipment or other processor to realize digital circuits section.

In certain embodiments, distance measuring circuit 1510, Length Measuring Circuit 1512 and electric meter circuit 1514 can be implemented in one single chip, module, encapsulation or circuit board, and/or can share some general subunit.Such as, distance measuring circuit 1510, Length Measuring Circuit 1512 and electric meter circuit 1514 all can be arranged in one single chip, and share general subunit, such as ADC, DAC or I/O logical circuit.In another example, single general processor can be used for the digital circuits section realizing all three parts, and can be configured to optionally to perform three different software modules, each software module is configured to make processor perform the suitable process corresponding to and measure operation.In other embodiments, at least one in distance measuring circuit 1510, Length Measuring Circuit 1512 and electric meter circuit 1514 can realize in chip, module or in encapsulating separately with other circuit.

Distance measuring circuit 1510 (such as, by suitable board traces, bus, electric wire, cable, strip connector and/or other web members being suitable for transmission simulation and/or digital signal) can be coupled to optical transmitting set 1406 and sensor 1408 communicatedly.Distance measuring circuit 1510 can be configured to, by utilizing optical transmitting set 1406 transmitted beam and utilizing sensor 1408 to detect the light beam of target 1542 reflection, determine the distance of measurement mechanism 1400 to target 1542.Such as, Figure 15 show the light beam launched to target 1542 the path 1544 of process and the transmitting of reflect back toward sensor 1408 light beam the path 1544 of process.Light beam can be used as one or more pulse, continuously bundle, determines that other optical delivery of distance 1546 are transmitted through ovennodulation with the light beam of coded pulse and/or the light beam that is suitable for based target reflection.In certain embodiments, the distance computation techniques of traditional flight time or phase shift detection technology can be used to determine distance 1548.Therefore, distance measuring circuit 1510 can comprise any suitable combination of analogy and digital circuit and/or be configured to any suitable combination of the hardware and software realizing suitable distance computation techniques.Can periodically or in response to the input (such as, when user presses the button of customer controller 1422) of user transmitting beam.

In one embodiment, the laser instrument (such as, laser diode) being suitable for operating in response to the suitable control signal of distance measuring circuit 1510 can be utilized to realize optical transmitting set 1406.In this embodiment, can utilize corresponding to the laser sensitive photodetector of wave band of laser instrument to realize sensor 1408.In other embodiments, other optical light sources can be used for realizing optical transmitting set 1406, and use the photodetector being suitable for the type of used optical light source to realize sensor 1408.For example, these optical light sources can comprise: visible light source; Closely, in and/or far infrared light source; And/or other non-visible light sources.Therefore, the application-specific that can be suitable for measurement mechanism 1400 can be used and/or realize optical transmitting set 1406 according to the optical transmitting set of the needs of this application-specific.Non-optical transmitter and detecting device are also admissible, and are included in the scope of the present disclosure and spirit.Such as, the ultrasonic transmitter and the corresponding ultrasonic detector that are enough to the application carrying out short distance range observation can replace optical transmitting set and detecting device to come for range observation.

In one embodiment, optical transmitting set 1406 can be configured to when measurement mechanism 1400 is for (such as, being placed in distance measuring mode) during range observation, sends continuous light beam.This light beam can produce light pulse and/or light beam will arrive the visible instruction of (such as, specifying the laser spots of the point of impingement), thus contributes to user and to aim at the mark light pulse on object and/or light beam.In this embodiment, light beam can suitably be regulated or change to encode to other modulation of light pulse, Modulation and Amplitude Modulation, frequency modulation (PFM) or light beam.In another embodiment, independent optical transmitting set can be used for the visual instruction providing shock point.

Length Measuring Circuit 1512 can electric coupling (such as, use board traces, cable, electric wire and/or there are other the suitable electric pathways of enough rated power of application of device 1400 of the measurement for expecting) to one or more terminal 1404, and be configured to determine to be electrically connected to the described electric wire of Length Measuring Circuit 1512 or the approximate length of cable by one or more terminal 1404.Similar, electric meter circuit 1514 can be electrically coupled to one or more terminal 1404, and be configured to determine to be electrically connected to the external articles of described electric meter circuit 1514 (such as by one or more terminal 1404, electric/electronic devices, parts, circuit board, electric wire, cable, trace and/or other electrical/electronic goods) various electrical quantitys (such as, voltage, electric current, resistance, electric capacity or other parameters).

With regard to this respect, terminal 1404 in one or more embodiments can be suitable for being formed the electrical connection with external cable, cable or other goods.Such as, in one or more embodiments, terminal 1404 can comprise the suitable link (such as, jack, socket, plug, pin, clip, screw or other suitable electrical/electronic connectors) for being electrically connected to external cable, cable or other goods.In one embodiment, terminal 1404 can comprise the suitable link being configured to hold suitable test lead 1530 insertedly and/or releasedly.In certain embodiments, test lead 1530 can comprise the connector that connector that standard plug or one end are other types and/or the other end are the other types of clip (such as, spring clamp) or probe.The test lead 1530 of suitable design is also admissible.

In one embodiment, each terminal 1404 can be wired connection and be configured to the input terminal of particular type.Such as, terminal 1404A can be used for measuring voltage, and terminal 1404B can be used for measuring electric current, and terminal 1404D can be used for the length measuring electric wire, and terminal 1404C is used for providing grounding connection.In another example, terminal 1404A-1404D can be distinguished further based on voltage range, range of current, resistance range or other measurement ranges.In another embodiment, terminal 1404 can be switchable (such as, manually selecting to regulate suitable on-off circuit by automatic sensing-detecting and/or reception), optionally to receive dissimilar input.Therefore, Length Measuring Circuit 1512 and electric meter circuit 1514 can be electrically connected to external articles (such as, external articles 1532) or electric wire (electric wire 1534 such as, on wire spool axle) by one or more terminal 1404.Test lead (such as, test lead 1530) is if can be used for needing just to be electrically connected to external articles or electric wire.

Turn back to the explanation to Length Measuring Circuit 1512, in one embodiment, the length of domain reflectometer (TDR) technology determination electric wire (such as, electric wire 1534) can be utilized.More specifically, such as, Length Measuring Circuit 1512 can comprise and is configured to produce concurrent power transmission pulse (such as, having the change in voltage of short rise time) from the link 1534A of electric wire 1534, receives from the openend 1534B of electric wire 1534 pulse that is reflected back and determines suitable mimic channel, digital circuit and/or the software module of the length of electric wire 1354 based on total travel-time of pulse.That is, length can be determined according to the mistiming sent between pulse and the pulse receiving reflection.Because for the electric wire of given type, the velocity of propagation of electric signal is constant, thus can according to electric signal from link 1534A sends to the length turning back to openend 1534B institute elapsed time and determine electric wire 1534.

With regard to this respect, in one embodiment, Length Measuring Circuit 1512 can comprise and relate to various standardization wire gauge (such as, American wire gage (AWG) standard) and the look-up table (such as, in suitable data structure and/or hardware storage apparatus) of corresponding velocity of propagation in electric wire.In the present embodiment, the wire gauge of user's electric wire that (such as, utilizing customer controller 1422) can be inputted or select to measure.In another embodiment, Length Measuring Circuit 1512 can be configured to based on length computation, by measuring the total travel-time through the electric wire of known length, derives suitable velocity of propagation.Such as, user can cut a bit of electric wire of length-specific from wire spool and this section is wired to measurement mechanism 1400, automatically determines velocity of propagation to make Length Measuring Circuit 1512.When not knowing the specification of electric wire or when the specification of the electric wire criteria of right and wrong, this embodiment can allow user to measure the length of electric wire.In another embodiment, (such as, utilizing customer controller 1422 to input) can be provided for determining the suitable velocity of propagation of wire length by user, and without the need to look-up table.

In one embodiment, Length Measuring Circuit 1512 can comprise suitable mimic channel, digital circuit and/or the software module that are configured to determine the approximate length of electric wire based on the accumulation resistance of the electric wire of certain length.Because the resistance of electric wire is directly proportional to the length of electric wire, so approximate length can be calculated by the accumulation resistance measuring the electric wire of certain length accurately.With regard to this respect, in one embodiment, Length Measuring Circuit 1512 can comprise another look-up table relating to the various standardization wire gauges with unitary resistance value (milliohm every foot).In another embodiment, the resistance that Length Measuring Circuit 1512 can be configured to by measuring the electric wire of known length that user provides carrys out derived unit resistance value.In another embodiment, (such as, utilizing customer controller 1422 to input) can be provided for determining the suitable unitary resistance value of wire length by user, and without the need to look-up table.

Electric meter circuit 1514 can comprise suitable mimic channel, digital circuit and/or software module for measuring various electrical quantity (such as, voltage, electric current, resistance, electric capacity and/or other parameters of being associated with the external articles be connected thereto).Such as, electric meter circuit 1514 can be configured to be produced by external articles and send reference electrical signal (such as, reference voltage or reference current), and based on the electric signal monitored change (such as, voltage drop determination electrical quantity (such as, resistance).In various embodiments, electric meter circuit 1514 can be configured to the electrical quantity determining one or more selection in response to user in the selection of customer controller 1422.In certain embodiments, electric meter circuit 1514 can be configured to provide and automatically establish the scope of changing and/or automatic sensing-detecting to electrical quantity.

Display 1418 can be coupled to distance measuring circuit 1510, Length Measuring Circuit 1512 and electric meter circuit 1514 communicatedly.Display 1418 can be configured to the information presenting, indicate or transmit distance, length and/or electrical quantity that each circuit of instruction is determined.With regard to this respect, display 1418 can comprise the video-stream processor being configured the signal from each circuit to be converted to the suitable form being suitable for presenting.Any suitable combination of mimic channel, digital circuit and/or software module can be utilized to realize video-stream processor.Such as, in certain embodiments, general purpose microcontroller or general procedure core can be used as video-stream processor.In other embodiments, dedicated hardware logic or ASIC can be used for realizing video-stream processor.In certain embodiments, video-stream processor can not be embodied as a part for display 1418, but a part for other parts as distance measuring circuit 1510, Length Measuring Circuit 1512, electric meter circuit 1514 and/or measurement mechanism 1400.

In certain embodiments, video-stream processor can be implemented as a part for the processor 1519 of each circuit for realizing measurement mechanism 1400.Except realizing video-stream processor, processor 1519 also can, according to the needs of specific embodiment, be suitable for realizing the processor for other parts of distance measuring circuit 1510, Length Measuring Circuit 1512, electric meter circuit 1514 and/or measurement mechanism 1400.

In various embodiments, alphanumeric can be utilized to read panel (such as, sectional type LED panel, vacuum fluorescent display (VFD) panel, liquid crystal display (LCD) panel or other multistages, multicomponent or dot matrix panel) and/or electronic display screen (such as, the video display of cathode-ray tube (CRT) (CRT), liquid crystal display or other types and monitor) realize display 1418.In certain embodiments, display 1418 can be configured to be suitable for present the display numeral of the information that measurement mechanism 1400 produces, word and/or symbol.Such as, display 1418 can be configured to the distance of the form display measurement of numerical digit, length and/or electrical quantity, show suitable word or symbol with the type of indication information (such as, whether numeral represents distance, line length, voltage, electric current, resistance, electric capacity or other parameters) and be suitable for unit (such as, rice, inch, foot, volt, ampere, ohm, farad or other unit).In other embodiments, except numerical value presents or replace numerical value to present, display 1418 can be configured to represent that the figure of information that measurement mechanism 1400 produces presents.This figure presents and can comprise, such as, and presenting of bar chart, pie chart, dial (of a telephone), line chart, image, figure or other suitable respective measurement values.In another example, movement on index dial can be utilized to realize display 1418 with the indicator (such as, pointer) aiming at the various measured values that can present.Can be expected that, the combination that above-mentioned display realizes may be used for display 1418.

Storer 1520 can comprise one or more storage arrangement to store data and information, and the data of storage and information comprise the information of the electric parameter measurement that instruction range observation, linear measure longimetry and each circuit are determined.One or more memory storage can comprise various types of storer, comprise volatibility and Nonvolatile memory devices, such as, RAM (random access memory), flash memory, EEPROM (electricallyerasable ROM (EEROM)), ROM (ROM (read-only memory)), hard disk drive and other suitable memory storages.In certain embodiments, storer 1520 can be configured to store and can be accessed and the software instruction performed by the miscellaneous part of the video-stream processor of display 1418/1424, distance measuring circuit 1510, Length Measuring Circuit 1512, electric meter circuit 1514, processor 1519 and/or measurement mechanism 1400.In certain embodiments, this instruction also can be stored in computer-readable medium, such as, in compact disk, digital video disc, flash drive or other suitable media, maybe this instruction is sent to measurement mechanism 1400 to download this instruction from described computer-readable medium.

In one or more embodiments, measurement mechanism 1600 can comprise logical device 1601, and it is one or more that described logical device 1601 comprises in electric meter circuit 1514, processor 1519, storer 1520 and/or additional measurement component 1611.Such as, logical device 1601 can be used for according to any one in various technology described herein, determine the one or more physical parameters (such as, in response to the one or more signals that from sensor and/or other suitable parts receive) relevant to external articles.In certain embodiments, logical device 1601 can be embodied as processing module 160 and/or processor 195 as described herein.

In one embodiment, storer 1520 may be implemented as the individual components of the miscellaneous part being coupled to measurement mechanism 1400 communicatedly.In other embodiments, storer 1520 can be implemented as a part (such as, embed, be distributed in wherein or otherwise realize) for the miscellaneous part of distance measuring circuit 1510, Length Measuring Circuit 1512, electric meter circuit 1514, display 1418, processor 1519 and/or measurement mechanism 1400.

In certain embodiments, the miscellaneous part of distance measuring circuit 1510, Length Measuring Circuit 1512, electric meter circuit 1514, display 1418 and/or measurement mechanism 1400 can be configured to by indicate determined by each circuit range observation, linear measure longimetry and electric parameter measurement information be stored in storer 1520.The all parts of measurement mechanism 1400 can call and/or access the information of storage.Such as, in one embodiment, one or more measured values that the video-stream processor of display 1418 or processor 1519 can be configured to metering circuit to be determined to be stored in storer 1520 and the measured value stored before access, and such display 1418 can present current and measured value before so that user compares easily.In other embodiments, the miscellaneous part of distance measuring circuit 1510, Length Measuring Circuit 1512, electric meter circuit 1514 and/or measurement mechanism 1400 can be configured to perform and store and call.

Therefore, such as, when electrician is just at installing wire, measurement mechanism 1400 can advantageously allow the convenient distance measure by the installation site obtained before of electrician (such as, the span of installation site or height) to compare with the length of the electric wire for this position when pre-test.Electrician can check the measured value that two on display 1418 are different easily, such as, does not need the span additionally writing or remember position, just can verify the electric wire whether long enough for this position.In certain embodiments, the measured value (such as, wire length measured value) of the measured value (such as, distance measure) stored before one or more and current acquisition can be shown together.In other embodiments, user can before and carry out between current measured value switching or overturning (such as, the button utilizing customer controller 1422 to provide or button), to check them in an alternating fashion.

In certain embodiments, the miscellaneous part of distance measuring circuit 1510, Length Measuring Circuit 1512, electric meter circuit 1514, display 1418 and/or measurement mechanism 1400 can further manage the measured value of the measured value stored and current acquisition or process.In one embodiment, the video-stream processor of display 1418 or miscellaneous part can be configured to other the derivative values obtaining the total value of two or more measured values, the mean value of two or more measured values or two or more values.Therefore, such as, when electric wire installation site needs multiple distance measure (such as, when electric wire be provided with bending or turn round instead of straight line connects time), measurement mechanism 1400 advantageously can provide total span of installation site (such as to electrician, the summation of multiple distance measure), so as electrician need not write and multiple measured value that adds up to calculate needs how long electric wire.

In another embodiment, the video-stream processor of display 1418 or miscellaneous part can be configured to the measured value of the measured value stored before and current acquisition to compare.Compare based on this, warning, message or other notices can be produced alternatively.Therefore, such as, the wire length measured value of the distance measure of storage and current acquisition can advantageously compare by measurement mechanism 1400, and provide electric wire for whether sufficiently long instruction (such as, by buzzer, flashing lamp or other warning tones and/or light) this distance to electrician.Therefore, measurement mechanism 1400 can allow electrician without the need to must reading and comparing the measured value on display 1418, just can check that whether the electric wire stayed on spool is enough for installation site.When another is exemplary, measurement mechanism 1400 can be compared by the distance of the length pre-test with it by the electric wire when pre-test, indicates whether electric wire have been cut into correct length.As can be appreciated, this compare operation can be performed to total value or other derivative values.

Infrared imaging module 1416 can be Minitype infrared camera or the Minitype infrared imaging device being suitable for catching heat picture.Such as, Fig. 1 can be utilized or realize infrared imaging module 1416 according to the infrared imaging module of other embodiments of Fig. 1-13 description herein.Infrared imaging module 1416 can comprise such as according to the infrared imaging module that FPA or other suitable modes of various embodiment described herein realize.

Infrared imaging module 1416 can be configured to catch, process and/or manage the infrared image (such as, comprising heat picture) with the scene of the environmental correclation of user (such as, scene 1540).With regard to this respect, infrared imaging module 1416 can be connected, assembles, installs, inserts or is arranged on any suitable position in shell 1402 or on it, during with convenient user by the expectation part of sensing user environment general for measurement mechanism 1400, allow the expectation part of the environment of user to be placed in the visual field (FOV) 1541 of infrared imaging module 1416.In addition, as the discussion of the infrared imaging module 100 of above composition graphs 1, infrared imaging module 1416 and/or associated components can be configured to perform each NUC process as herein described.

The heat picture of the scene of catching can be rendered as the visible heat picture of user (such as, thermogram) so that user's viewing.In one embodiment, display 1418 (such as, utilizing electronic display to realize) can be configured to the visible heat picture of display user.In another embodiment, measurement mechanism 1400 can comprise another display, this display is fixed (such as, be connected to shell, be placed in shell, be placed on shell and/or otherwise and fix) relative to shell and is configured to the visible heat picture of display user.Electronic display (such as, LCD, LED, cathode-ray tube (CRT) (CRT) or be suitable for the known electronic console of the other types that image and/or video are shown) can be utilized to realize display 1424.Although illustrated two displays 1418 and 1424 in the example of Figure 14 and 15, can be expected that, according to the application desired by measurement mechanism 1400, this display 1418/1424 of any amount can be included in measurement mechanism 1400.

According to various embodiment, infrared imaging module 1416, processor 1519 and/or display 1418/1424 can be configured to perform suitable conversion operations and produce the visible heat picture of user with the heat picture of catching from the FPA in infrared imaging module.Such as, the temperature data be included in the pixel of heat picture can be converted to the image that suitable GTG or color range pixel can be checked with structuring user's.In certain embodiments, user's visual picture can comprise the temperature scale or legend that indicate the color of corresponding pixel and/or the approximate temperature of intensity alternatively.

By checking the visible heat picture of this user, user can perform various electric checking.Such as, the visible heat picture of user can show in electric utility 1550 the focus 1550A and/or cold spot 1550B that may represent fault (such as, loose contact, connector are corroded, connector do not have correct fixing, internal damage, laod unbalance and other various electric faults) rapidly.In another example, cold spot 1550B can represent the moisture causing electric fault.Therefore, such as, the infrared imaging module 1416 using measurement mechanism 1400 is passed through the electrician of electrical install position work, after measurement and installation (such as, using measurement mechanism 1400 as above) electric wire and parts, can check that installation site is to check any fault in installing fast.Should be understood that, to be caught by measurement mechanism 1400 and the heat picture presented also can be used for other purposes various, such as, check and detect other application of water and Leakage Gas and thermal imaging.

In certain embodiments, the visible heat picture of user can provide visual guidance, the beam alignment measurement mechanism launched to make optical transmitting set 1406.Such as, in one embodiment, infrared imaging module 1416 can be arranged and orientation relative to optical transmitting set 1406, and the light beam reflected to make target 1542 can be positioned at the visual field (FOV) 1541 of infrared imaging module 1416.In addition, in this embodiment, infrared imaging module 1416 can be configured to the IR of light beam generation radiosensitive.Alternatively, optical transmitting set 1406 can be configured to the light beam of the IR wavelength producing infrared imaging module 1416 sensitivity.In any one realizes, infrared imaging module 1416 can catch the heat picture of the image comprising folded light beam.Therefore, user is by checking user's visual picture easily, and the some beam alignment of optical transmitting set 1406 can expected or target are to carry out range observation.

In another embodiment, infrared photography module 1416, display 1418/1424 and/or processor 1519 can be configured on the visible heat picture of user, superpose graticule, cross-hair or be suitable for indicating other marks from the point of impingement of the light beam of optical transmitting set 1406.This graticule on the visible screen of user or cross-hair can provide additional or interchangeable visual guidance when aiming at the light beam being used for range observation.

Customer controller 1422 can comprise one or more knob, button, keyboard, slide block and/or be configured to user interactions and receive user input other user activated devices.Such as, Figure 14 A shows the customer controller 1422 having and utilize knob to realize at least partly.In certain embodiments, customer controller 1422 can be implemented as a part for display 1418 or display 1424, and described display 1418 or display 1424 are configured to be used as both user input apparatus and display device.Such as, customer controller 1422 can be implemented as the graphic user interface (GUI) be presented on display 1418 (such as, touch-screen).

In various embodiments, customer controller 1422 can receive the mode of operation of the measurement mechanism 1400 that user selects, such as, and the distance measuring mode, wire length measurement pattern or the electric meter pattern that are provided by each circuit as above.In various embodiments, customer controller 1422 can also receive the various types of users' inputs described by the above all parts in conjunction with measurement mechanism 1400, this input comprises: the electrical quantity that measure of selection (such as, other parameters that voltage, electric current, resistance, electric capacity or electric meter circuit 1514 are determined) type, the reference velocity of propagation of the wire gauge of selection number, electric wire, the unitary resistance value of electric wire, for the trigger of range observation, the control inputs of thermal imaging and/or other inputs according to the needs of the application-specific of measurement mechanism 1400.

Optional feature 1526 can comprise any other device needed for the various application of measurement mechanism 1400 or parts.In certain embodiments, optional feature 1526 can comprise with the motion sensor realized with the same or analogous mode of motion sensor 194 of Fig. 1.Infrared imaging module 1416 and/or other associated components can monitor this motion sensor, and this motion sensor provides information to perform various NUC technology as herein described to this infrared imaging module 1416 and/or other associated components.

In certain embodiments, optional feature 1526 can comprise positioning element, such as, is suitable for GPS (GPS) module producing geographical location information.The geographical location information obtained by GPS module can be used for the position of metrical information for obtaining and/or the such as relevant electric checking of heat picture annotation or infield.

In certain embodiments, optional feature 1526 can comprise the one or more sensors that can be used for detecting one or more physical parameter relevant to electric checking or infield.Such as, in one embodiment, optional feature 1526 can comprise humidity sensor (such as, Digital Hygrometer), it can measure humidity or moisture, and the humidity of measurement is converted to the suitable signal that can be processed further by other suitable parts of processor 1519 and/or measurement mechanism 1400.Similar, other devices of motion sensor, GPS module and measurement mechanism described herein 1400 can produce the suitable sensor signal representing the physical parameter sensed.According to some embodiment of the present disclosure, the logical device 1601 of measurement mechanism can sensor-lodging further processing it.

In certain embodiments, optional feature 1526 can comprise pilot lamp (such as, LED indicator, colored electric lamp bulb or for realizing other conventional lighting sources of indicator), hummer, clock, have sonorific interlock circuit loudspeaker or can be used for producing and can listen and/or other suitable devices of visible notice.This can be listened and/or sight indicator can be used for the result that notifies that user measures or tests, such as, for the electric wire whether long enough of the installation site about display 1418 and storer 1520 as described above.

In certain embodiments, optional feature 1526 can comprise the Visible Light Camera utilizing charge-coupled image sensor (CCD) sensor, complementary metal oxide semiconductor (CMOS) (CMOS) sensor, electron multiplication CCD (EMCCD), Scientific Grade CMOS (SCMOS) sensor and/or other the suitable imageing sensors for the visible images of capturing scenes to realize.Sensor-based type, visible light camera except catching visible ray or substitute catch visible ray, also can be suitable for the electromagnetic radiation of catching other wavelength.Such as, in certain embodiments, visible light camera can be suitable for from electric utility or check that the image of near infrared (NIR) and/or short-wave infrared (SWIR) radiation is caught in place (such as, scene 1540).NIR and SWIR is commonly referred to non-Thermal Infra-Red.In contrast, as above in conjunction with infrared sensor 132 discuss, some realization of infrared imaging module 1416 is suitable for the image (that is, thermal infrared images) of catching MWIR and/or LWIR.Therefore, for some embodiment, as further described herein, visible light camera is caught visible ray, NIR and/or SWIR radiation image can be used for compensating MWIR and/or the LWIR image that infrared imaging module 1416 is caught.

In one embodiment, together with visible light camera can be co-located in infrared imaging module 1416, to form double camera module.In one example in which, according to the U.S. Provisional Patent Application No.61/748 quoted before this paper, the 018 various technology described, infrared imaging module 1416 and visible light camera can be implemented as the dual sensor module 1416 of shared substrate.This dual sensor module realizes comprising the universal circuit for visual light imaging and infrared imaging and/or general restraint device, thus be embodied as standalone module with infrared imaging module 1416 and visible light camera and compare, potentially reducing the overall dimensions of measurement mechanism 1400.In addition, dual sensor module realizes the parallax that the infrared imaging of minimizing more recently module 1416 that the image that can be suitable for by making infrared imaging module 1416 and visible ray take a picture to catch leans on and visible ray are taken a picture between the image of catching.

In another embodiment, visible light camera can be connected separately with infrared imaging module 1416, assemble, install, insert or otherwise arrange in place.In certain embodiments, the suitable technology will further described according to Figure 19 or other places can be utilized herein, the heat picture that the visible images of visible light camera being caught and infrared imaging module 1416 are caught carries out merging, superpose or combining, to produce the visible heat picture of user with higher sharpness, clear degree and/or contrast.

In certain embodiments, above-mentioned measurement mechanism 1400 can be carried to work place by electrician or other users easily, and this user can utilize described measurement mechanism 1400 to perform various measurement and inspection in comprehensive mode, and without the need to requiring that user uses multiple different device or writes down middle measured value.In addition, measurement mechanism 1400 is caught and the heat picture presented can advantageously help user to check the work place that electric fault or other faults occur fast, and accurately and easily alignment to perform range observation.

Figure 16 shows the block diagram of another embodiment of measurement mechanism 1600.As shown, measurement mechanism 1600 can comprise all parts of the above-mentioned measurement mechanism 1400 represented by identical label.Measurement mechanism 1600 can also comprise shell 1602, contactless electric transducer 1604, additional measurement component 1611, wireless communication module 1613, non-thermographic module 1626, humidity sensor 1627 and/or additional sensor 1629.

Contactless electric transducer 1604 can be suitable for without the need to just sensing the electric current relevant with conductor, voltage and/or other electrical quantitys to conductor physical electrical contact.Such as, can utilize comprise Luo-coil (Rogowski coil), iron (or ferrite) core current transformer or can the inductance type transducer of other suitable transducers of induced AC current to realize contactless electric transducer 1604.In certain embodiments, contactless electric transducer 1604 can comprise the hall effect sensor allowing to exchange and sense and both direct current sensing.In certain embodiments, contactless electric transducer 1604 can comprise the coil or transducer that are configured to by the voltage of capacitive coupling technique sensing associated conductor known in the art.Therefore, that contactless electric transducer 1604 can be other or alternative is provided with electric terminal 1404, just can sense electrical quantity without the need to electric terminal 1404 and test lead 1530.For the embodiment with contactless electric transducer 1604, it is suitable measured value that processor 1519 and/or electric meter circuit 1514 can be adapted to pass through contactless electric transducer 1604 by the Parameter Switch of sensing.

In certain embodiments, contactless electric transducer 1604 can be provided with the clamp that can be opened or closed by the user of measurement mechanism 1600, so as conductor can at least in part by clamp ring around to measure.In certain embodiments, contactless electric transducer 1604 can be provided with flexible ring, and described flexible ring has at least one demountable end to allow described ring around the conductor that will measure.Can also be expected that, contactless electric transducer 1604 can have other forms and/or structure of being suitable for sensing the various electrical quantitys relevant to conductor non-contactly.

In certain embodiments, comprise the clamp of contactless electric transducer 1604, flexible ring or other structures can dismantle from shell 1602 or be separated with shell 1602.The contactless electric transducer 1604 of this embodiment can be placed on the place with the hand-held user comprising the shell 1602 of the miscellaneous part of measurement mechanism 1600 with certain distance, thus allow when user obtains electric measurement value from the parts with potential danger, user keeps safe and avoids distance.In this embodiment, comprise the clamp of contactless electric transducer 1604, flexible ring or other structures the electrical quantity of sensing or measurement can also be suitable for wirelessly to be sent to the miscellaneous part (such as, processor 1519) of measurement mechanism 1600 to be further processed and/or to be shown to user.

Can be expected that, the miscellaneous part of measurement mechanism 1600 also can be configured to allow to carry out remote measurement in a similar fashion.Such as, if humidity sensor 162 and support in circuit any one can be arranged in its oneself shell that is detachable with shell 1602 or that be separated, then described humidity sensor 162 and support that circuit is configured to the moisture wirelessly sending sensing or measure.In another example, all or part of electric meter circuit 1514 and electric terminal 1404 can be arranged in its oneself shell that is detachable with shell 1602 or that be separated, and are configured to wirelessly send the electrical quantity relevant to the parts being electrically connected to terminal 1404 by test lead 1530.

With regard to this respect, measurement mechanism 1600 in some embodiment can comprise and is suitable for processing, manage or contribute to this wireless communication module 1613 that is detachable or radio communication (such as, by wireless link 1670) between the sensor that is separated and the miscellaneous part of measurement mechanism 1600.Such as, wireless communication module can comprise and realizes IEEE 802.11 wireless network standards, bluetooth ^tMstandard, ZigBee ^tMthe parts of standard or other suitable short distance radio communication standards.Wireless communication module 1613 can also be furnished with special wireless communication protocol based on radio frequency (RF), microwave frequency (MWF), infrared frequency (IRF) and/or other suitable Radio Transmission Technologys and interface.Wireless communication module 1613 can comprise the antenna 1676 be coupled with it in order to the object of radio communication.

In certain embodiments, wireless communication module 1613 can be suitable for process, manages or contribute to the radio communication (such as, by wireless link 1670) between measurement mechanism 1600 and far end device 1674.Far end device 1674 can represent such as workstation computer, server computer, flat computer, laptop computer, smart phone, another measurement mechanism 1600 or have any other suitable device of radio communication and data-handling capacity.In this embodiment, one or more parts of measurement mechanism 1600 (such as, processor 1519 and/or electric meter circuit 1514) metrical information, heat picture, non-thermographic and/or other data that are produced by measurement mechanism 1600 by wireless communication module 1631 can be suitable for (such as, the annotation of time and position, user or other explain) be wirelessly sent to far end device 1674, far end device 1674 can process further this metrical information, image and/or other data and/or store.

Additional measurement component 1611 can represent the optical transmitting set 1406 of Figure 14 as described above and 15, sensor 1408, distance measuring circuit 1510 and/or Length Measuring Circuit 1512.In various embodiments, can alternatively one or more additional measurement component 1611 be arranged in measurement mechanism 1600.

In the same or analogous mode of the optional feature 1526 with measurement mechanism 1400 described above, non-thermographic module 1626 can be embodied as the visible light camera of measurement mechanism 1400.Therefore, non-thermographic module 1626 can be suitable for catching visible ray, NIR and/or SWIR image, and the suitable technology will further described according to Figure 19 or other places can be utilized herein, the heat picture that the visible ray of catching, NIR and/or SWIR image can be caught with infrared imaging module 1416 is merged, superposes or combines, to produce the visible heat picture of the user with higher resolution, sharpness and/or contrast.

In certain embodiments, humidity sensor 1627 can be set, and in the same or analogous mode of the optional feature 1526 with measurement mechanism 1400 described above, humidity sensor 1627 can be embodied as the humidity sensor of measurement mechanism 1400.The humidity utilizing humidity sensor 1627 to obtain or moisture measured value can be used for the existence of water or moisture in each position verified electric utility or check place.As the discussion of the above cold spot 1550B to Figure 15, the user of measurement mechanism 1600 can check electric utility or check that place is to locate cold spot, and subsequently according to the existence of water or moisture in the cold spot of the moisture measured value checking location obtained by humidity sensor 1627.Same as discussed above, the data of wireless transmission sensing can be suitable for allow remote measurement moisture according to the humidity sensor 1627 of some embodiment.

Alternatively the additional sensor 1629 of the sensor representing one or more other types can be arranged in measurement mechanism 1600.For example, additional sensor 1629 can comprise: be suitable for the sonic transducer sensing sound (such as, the sound of electric arc) and/or location sound.In other instances, additional sensor 1629 can involving vibrations sensor and/or temperature sensor.As the discussion of the above miscellaneous part to Figure 15, according to some embodiment of the present disclosure, the logical device 1601 of measurement mechanism can receive and the sensor signal of process humidity sensor 1627 and additional sensor 1429 generation further.

As the description to Figure 15, display 1424 can be suitable for display user visible heat picture, and the visible heat picture of described user is the heat picture of being caught by image image-forming module 1416 and/or the image produced by being carried out combining by the non-thermographic that heat picture and non-thermographic module 1626 are caught.In certain embodiments, display 1424 can also be suitable for showing the numeral, word and/or the symbol that are applicable to presenting the information that measurement mechanism 1600 produces.

Such as, processor 1519 and/or display 1424 can be suitable for produce and with the distance of the form display measurement of numerical digit, length and/or electrical quantity, show suitable word or symbol with the type of indication information (such as, whether numeral indicates distance, line length, voltage, electric current, resistance, electric capacity or other parameters) and suitable unit (such as, rice, inch, foot, volt, ampere, ohm, farad or other unit).As other examples, except numeral presents or replace numeral to present, processor 1519 and/or display 1424 can be configured to produce and present for the figure of the information of display, and this information is produced by measurement mechanism 1600.This figure presents and can comprise, such as, and other suitable presenting of bar chart, pie chart, index dial, line chart, image, figure or respective measurement values.In this embodiment, processor 1519 and/or display 1424 can be suitable for also other expressions of the word of generation, numeral, symbol, figure and/or metrical information being added to when showing the visible heat picture of user on display 1424 the visible heat picture of user.

Forward Figure 17 to, it illustrates the front view of the measurement mechanism 1600A realized according to the embodiment of the measurement mechanism 1600 of Figure 16.Measurement mechanism 1600A can comprise display 1424, and it can show other expressions and/or the visible heat picture of superposition user as discussed above of word, numeral, symbol, figure and/or metrical information.In the example shown in Figure 17, what display 1424 showed is the metrical information 1625 be added on the visible heat picture 1627 of user.In yet another aspect, measurement mechanism 1600A can comprise infrared imaging module 1416 and non-thermographic module 1626.Therefore, as further described herein, all parts of measurement mechanism 1600A can be configured to produce the visible heat picture of user of enhancing to show by combination heat picture and non-thermographic.

Figure 18 shows the front view of the measurement mechanism 1600B realized according to the measurement mechanism 1600 of another embodiment of Figure 16.As shown, measurement mechanism 1600B can comprise the clamp 1604A realizing contactless electric transducer 1604.As above to the description of contactless electric transducer 1604, the user of measurement mechanism 1600B can open clamp 1604A make its at least in part around electric component (such as, wire) to measure electrical quantity.Measurement mechanism 1600B can comprise control lever 1660, and described control lever 1660 is suitable for being opened clamp 1604A when user pushes.Other embodiments also can consider electric actuator, pneumatic actuator, hydraulic actuator and other suitable devices for opening clamp 1604.

With reference now to Figure 19, it illustrates the process flow diagram according to the combination of embodiment of the present disclosure or the step 1900 of fusion heat picture and non-thermal (such as, visible ray) image.Combination image can comprise radiometric data and/or correspond to from electric checking or infield (such as, scene 1540) other thermal characteristicss of radiation, but as compared to usually usually being provided separately with non-thermographic by heat picture, combination image can have very many object detail.Therefore, such as, the combination image produced in these embodiments can advantageously provide enough radiometric datas, details and contrast, can more easily identify and/or understand each electric component (such as, electric wire, isolating switch or checking or other electric components of infield) and relative incipient fault.

Although herein in conjunction with Figure 19 describe step for merge or combination heat picture and visible images discuss, but, should be understood that, this step can be applied to combination heat picture and any suitable non-thermographic (such as, visible images, near-infrared image, short-wave infrared image, EMCCD image, ICCD image, or other non-thermographic of being caught by non-thermographic module 1626).Step 1900 can be performed by all parts of measurement mechanism 1400 or 1600, such as, be performed by processor 1519, display 1424, infrared imaging module 1416 and/or non-thermographic module 1626.

At block 1902, visible images and infrared image (such as, heat picture) can be received.Such as, by the visible images of non-thermographic module 1626 capturing scenes 1540, and the visible images of catching can be received by processor 1519.Such as, by the heat picture of infrared imaging module 1416 capturing scenes 1540, and the heat picture of catching can be received by processor 1519.Processor 1519 can such as use heat picture and non-thermographic to perform each operation of step 1900.

At block 1904, obtain the high spatial frequency content of one or more visible images and heat picture from the one or more visible images received at block 1902 and heat picture.Such as, the high spatial frequency content obtained according to each embodiment can comprise the edge/profile details and/or high-contrast pixel that extract from one or more visible images and heat picture.

In one embodiment, can obtain high spatial frequency content by performing high-pass filtering (such as, spatial filtering) operation to image, wherein, the result of Hi-pass filter operation is high spatial frequency content.In alternative embodiments, can by performing low-pass filtering (such as to image, spatial filtering) and result after deducting low-pass filtering subsequently from original image to obtain the content (that is, high spatial frequency content) of reservation, thus obtain high spatial frequency content.In another embodiment, can obtain high spatial frequency content from the image selected by Difference Imaging, such as, from the second figure image subtraction image being subject to the first image disturbances, and the result deducted is exactly high spatial frequency content.Such as, the optical element of infrared imaging module 1416 and/or the optical element of non-thermographic module 1626 can be configured to vibration, to defocus and/or motion artifacts is incorporated into by one or two a series of images of catching in infrared imaging module 1416 and non-thermographic module 1626.Subtracted image (adjacent image such as, in a series of images) can be passed through and obtain high spatial frequency content.

In certain embodiments, only high spatial frequency content can be obtained from visible images or heat picture.In other embodiments, only high spatial frequency content can be obtained from single visible images or heat picture.In other embodiments, can from seeing that one or more components (such as, the luminance component of visible images, or such as, the radial component of heat picture) of light image and/or heat picture obtain high spatial frequency content.The high spatial frequency content obtained can be stored (such as, being stored into storer 1520) temporarily and/or can further process according to block 1908.

At block 1906, can to one or more heat picture denoising.Such as, processor 1519 can be configured to use various image processing operations, carries out denoising, level and smooth or fuzzy to one or more heat pictures of scene 1540.In one embodiment, remove the high spatial frequency noise in heat picture, make when the heat picture after process is combined with the high spatial frequency content obtained according to block 1904, significantly reduce the risk that the object described in the combination image of scene 1540 introduces dual edge (such as, edge noise).

In one embodiment, the noise removing heat picture can comprise image execution low-pass filtering (such as, space and/or time-domain filtering) operation, and wherein, the result after low-pass filtering operation is denoising or the heat picture after processing.In a further embodiment, the noise removing one or more heat picture can comprise and carries out down-sampling to heat picture, and then up-sampling image, makes it turn back to original resolution.

In another embodiment, the heat picture after process can be obtained by the heat picture of fuzzy scene 1540 on one's own initiative.Such as, the optical element of infrared imaging module 1416 multiple heat pictures that can be configured to infrared imaging module 1416 is caught defocusing slightly.As described further below, denoising fully or fuzzy can be carried out to the heat picture of the deliberate fuzziness obtained, to reduce or the combination image eliminated to scene 1540 introduces ancipital risk.In other embodiments, as the substituting or supplementing of heat picture utilizing optical element initiatively fuzzy scene 1540, fuzzy or smoothed image process can be performed by processor 1519 to the heat picture received and operate.Can (such as, being stored into storer 1520) be stored temporarily by obtaining the heat picture after processing and/or can further process according to block 1908.

At block 1908, high spatial frequency content can mix with one or more heat picture.Such as, processor 1519 can be configured to one or more heat pictures of the high spatial frequency content obtained at block 1904 and scene 1540 (heat picture after the process such as, provided at block 1906) to mix.

In one embodiment, by heat picture that high spatial frequency content is added to, high spatial frequency content can be mixed with heat picture, wherein, high spatial frequency content replace or cover heating image in corresponding to those parts that there is high spatial frequency content.Such as, high spatial frequency content can be included in the edge of the object described in the image of scene 1540, but the inside of this object may not exist high spatial frequency content.In this embodiment, the view data of mixing can comprise high spatial frequency content simply, as described by block 1910, this high spatial frequency content can be encoded to continuously one or more components of combination image.

Such as, the radial component of heat picture can be the chromatic component of heat picture, and can obtain high spatial frequency content from the brightness of visible images and/or chromatic component.In this embodiment, combination image can comprise the radial component of the chromatic component being encoded as combination image (such as, the chromatic component of heat picture) and be encoded directly the high spatial frequency content that (such as, still not having heat picture composition as combined image data) is the luminance component of combination image.By doing like this, the radiometric calibration of the radial component of heat picture can be retained.In similar embodiment, blended image data can comprise the high spatial frequency content of the luminance component adding heat picture to, and the blended data obtained is encoded as the luminance component of the vision-mix obtained.

In other embodiments, high spatial frequency content can be obtained from one or more certain components of or a series of visible images and/or heat picture, and high spatial frequency content can be encoded to corresponding one or more component of combination image.Such as, high spatial frequency content can be obtained from the luminance component of visible images, and this high spatial frequency content (being all luminance picture data in this embodiment) can be encoded to the luminance component of combination image.

In another embodiment, hybrid parameter can be utilized high spatial frequency content to be mixed with heat picture with the equation that counts.Such as, in one embodiment, high spatial frequency content can be obtained from the luminance component of visible images.In this embodiment, according to hybrid parameter and mixing equation, high spatial frequency content and corresponding luminance component can be mixed to produce blended image data.Such as, blended image data can be encoded to the luminance component of vision-mix, and the chromatic component of heat picture can be encoded to the chromatic component of combination image.Can be in the embodiment of their chromatic component at the radial component of infrared image, combination image can retain the radiometric calibration of heat picture.In other embodiments, partial radiation component can be mixed with high spatial frequency content and be encoded to combination image subsequently.

More generally, high spatial frequency content can be obtained from one or more components of visible images and/or heat picture.In this embodiment, high spatial frequency content can mix to produce blended image data (such as with the one or more components in heat picture, use hybrid parameter and mixing equation), and the combination image obtained can comprise the blended image data of the corresponding one or more component being encoded as combination image.In certain embodiments, one or more components of blended data need not correspond to final one or more components (such as, color space/format conversion can perform as a part for cataloged procedure) of combination image.

Hybrid parameter value can be selected by user, or automatically can be determined according to context or other data (such as, according to the image enhaucament level that measurement mechanism 1400/1600 is expected) by processor 1519.In certain embodiments, when showing (such as, by display 1424) combination image, can adjust or refining hybrid parameter.In certain embodiments, hybrid parameter can be selected only to comprise thermal characteristics to make blended image data, or alternatively, only comprise visible light characteristic.Hybrid parameter can be restricted to certain limit, such as not produce the blended data outside the border of the dynamic range of particular color space/form or display.

Except above-mentioned process, or alternative above-mentioned process, as the U.S. Patent application No.13/437 quoted before this paper, disclosed in 645, according to the process of high contrast mode can comprise one or more treatment step, treatment step order, arithmetic combination and/or adjustment hybrid parameter.Such as, equation below can be used for Y, Cr and Cb component determining combination image, and wherein, Y-component is from the visible images after high-pass filtering, and Cr and Cb component is from heat picture.

hp_y_vis＝highpass(y_vis)

(y_ir,cr_ir,cb_ir)＝colored(lowpass(ir_signal_linear))

In superincumbent equation, highpass (y_vis) can be the high spatial frequency content obtained by carrying out high-pass filtering to the luminance component of visible images.

Colored (lowpass (ir_signal_linear)) can be luminance component and the chromatic component of the heat picture obtained after carrying out low-pass filtering to heat picture.In certain embodiments, heat picture can comprise the luminance component of 0.5 times being chosen as high-high brightness (such as, the high-high brightness of display and/or treatment step).In relevant embodiment, the radial component of heat picture can be the chromatic component of heat picture.In certain embodiments, the y_ir component of heat picture can be abandoned, and the component of combination image can be (hp_y_vis, CIR, CBIR), which use above-mentioned symbol.

In another embodiment, equation below can be used for Y, Cr and Cb component determining combination image, and wherein, Y-component is from the visible images after high-pass filtering, and Cr and Cb component is from heat picture.

comb_y＝y_ir+alpha×hp_y_vis

comb_cr＝cr_ir

comb_cb＝cb_ir

The user that is changed to of alpha provides and determines that combination image needs the chance of how many contrasts.When alpha close to zero time, only will show heat picture, but when alpha is quite high, the very sharp-pointed profile/edge in combination image can be seen.In theory, alpha can be infinitely-great numeral, but in fact, may need the size limiting alpha, can be chosen as applicable current application.

Once high spatial frequency content mixes with one or more heat picture, process can proceed to block 1610, wherein, blended data can be encoded to the component of combination image to form combination image.

At block 1910, blended data can be encoded to one or more components of combination image.Such as, processor 1519 can be configured to the blended data obtaining according to block 1910 or produce to be encoded to combination image, and this increases, refining or enhance the information that visible ray or himself visible heat picture transmit.In certain embodiments, the component that blended image data coding becomes combination image can be comprised additional image processing operations, for example, such as, dynamic range adjustment, normalization, gain and offset operation, noise reduction and color space conversion.

In addition, processor 1519 can be configured to other coded image datas is combination image.Such as, if blended image data to be encoded to the luminance component of combination image, then the chromatic component of visible images or heat picture can be encoded to the chromatic component of combination image.Such as, source images can be inputted by user and select source, or automatically can determine based on context or other data.More generally, in certain embodiments, the component of the combination image not utilizing blended data to encode can utilize the corresponding component of visible images or heat picture to encode.By doing like this, the radiometric calibration of heat picture and/or the color space calibration of visible images can be retained in the combination image obtained.

In certain embodiments, at least some part of processor 1519 described herein or some function can be implemented as a part for infrared imaging module 1416, such as, and the processing module 160 that above composition graphs 3 describes.In certain embodiments, at least some part of processor 1519 or some function can be parts for display 1418 and/or display 1424 or utilize the processing element of display 1418 and/or display 1424 to realize.

With reference now to Figure 20, it illustrates the process flow diagram utilizing and perform the method 2000 measured and check according to the measurement mechanism of embodiment of the present disclosure.Such as, method 2000 can part be performed by the measurement mechanism 1400 of various embodiment, and part is performed by the user of the measurement mechanism 1400 using various embodiment.Although below according to the measurement in electric wire installation task, installation and inspection operation, describe some part of method 2000, it should be pointed out that can resequence, omit and/or the various operations of merging method 2000 to perform other tasks.

At block 2002, place suitably and alignment measuring device 1400 to measure the distance relevant to installation site.Such as, measurement mechanism 1400 can be placed in one end of (such as, when user is hand-held) installation site and make optical transmitting set 1406 aim at the other end of installation site, can measure the distance between two ends by user.In one embodiment, by performing the above-described operation about infrared imaging module 1416, can catch and producing the heat picture comprising visual guidance information.In this embodiment, user can check the visible heat picture of user, and the visible heat picture of described user can comprise the image of cross-hair/cruciform and/or folded light beam, with the other end making the light beam of optical transmitting set 1406 accurately aim at installation site.

At block 2004, the mode of operation of measurement mechanism 1400 is chosen as distance measuring mode.Such as, user can input or otherwise provide the selection of distance measuring mode on the customer controller 1422 of measurement mechanism 1400.The suitable components of measurement mechanism 1400 can determine distance as described by block 2006-2008 below.According to the needs of the application-specific of method 2000 or requirement, before the operation of execution block 2002, the selection of distance measuring mode can be performed.

At block 2006, light beam can be sent to the other end of installation site and reflect.Such as, if at the correct aligning of block 2002, then distance measuring circuit can utilize optical transmitting set 1406 light beam to be sent to the other end of installation site.As mentioned above, can in a variety of manners, pattern and/or wavelength send light beam.If do not have suitable surface or target to make light beam can reflect at the other end of installation site, then by user, suitable destination object (such as, any object of abundant folded light beam) can be placed in the other end of installation site.

At block 2008, the distance between two ends, installation site can be determined based on the light beam reflected.Such as, as above to the description of optical transmitting set 1406, sensor 1408 and distance measuring circuit 1510, the detection signal that distance measuring circuit 1510 can produce based on sensor 1408, is calculated by the distance performing the flight time or distance is determined in phase shift detection operation.At block 2010, can show subsequently and/or store the distance determined.Such as, the distance determined can be presented on display 1418 or display 1424 and check for user.In certain embodiments, as the description above in conjunction with display 1418 and storer 1520, the distance determined can be stored in storer 1520 to carry out showing and/or further processing.In certain embodiments, such as, when installation position be equipped with bending or turn round time, can repeatable block 2002,2006,2008 and 2010, to obtain total span of installation site.As mentioned above, all parts of measurement mechanism 1400 can calculate multiple measured value and to provide total span.

At block 2012, can by through cutting and be installed to installation site be wired to measurement mechanism 1400 to determine the length of this electric wire.Such as, the one or both ends of electric wire 1534 can be connected to a suitable terminal 1404 so that electric wire 1534 is electrically connected to Length Measuring Circuit 1512 by user.As discussed, some realization of Length Measuring Circuit 1512 can be operated by two ends 1534A and 1534B being electrically connected to electric wire 1534, and other realizations can be operated by one end 1534A being only connected to electric wire 1534.As required, electric wire 1534 can utilize or be connected to a suitable terminal 1404 without the need to test lead 1530.

At block 2014, the mode of operation of measurement mechanism 1400 is chosen as length measurement mode.Such as, user can input or otherwise provide the selection of length measurement mode on the customer controller 1422 of measurement mechanism 1400.In certain embodiments, such as, the wire gauge number of the electric wire that will be able to be cut by customer controller 1422 input or velocity of propagation.Alternatively, as described in conjunction with Length Measuring Circuit 1512, the wire segment of known length can be connected to measurement mechanism to obtain suitable velocity of propagation, calculate wire length based on the velocity of propagation obtained.

At block 2016, the length of electric wire can be determined.Such as, in one embodiment, as above to the description of Length Measuring Circuit 1512, the length of TDR technology determination electric wire can be utilized.That is, at block 2016, electric pulse can be sent by wire 1534 via link 1534A and also can detect subsequently at the electric pulse that the end 1534B not having to connect reflects, to determine the length of electric wire.In another embodiment, can as above to the description of Length Measuring Circuit 1512, by very accurately measuring the length being determined electric wire by the accumulation resistance of electric wire 1534.

At block 2010, can show, store and/or compare the length of the electric wire that will cut determined subsequently.Such as, the length determined can be presented on display 1418 or display 1424 and check for user.Such as, as above in conjunction with described by display 1418 and storer 1520, the length determined can be stored in storer 1520 to carry out showing and/or further processing.In one embodiment, the length that user can compare the electric wire determined and the span of installation site determined, will cut to verify and be arranged on the electric wire whether long enough of this position.In another embodiment, as above to the storer 1520 of measurement mechanism 1400 and the description of display 1418, all parts of measurement mechanism 1400 can perform relatively and produce the whether sufficiently long instruction of electric wire.

At block 2020, if for the electric wire long enough of this position, then electric wire can be cut into the length of expectation by user.If not, then user can to other electric wire repeatable blocks 2012,2016 and 2018.Once find for the sufficiently long electric wire in this position and electric wire be cut into the length of expectation, then can by being wired to measurement mechanism at block 2022 by what cut, the length of the electric wire cut is determined at block 2024, and show, store and/or compare the length of the electric wire of cutting at block 2026, verify the length of the electric wire of cutting.Except block 2022-2026 is the electric wire execution to cutting, can with block 2012,2016 and 2018 similar mode execution block 2022-2026, and the comparison performed by user or measurement mechanism 1400 can be used for checking is cut into correct length (such as by electric wire, be positioned at the certain limit relative to correct length), instead of simple check the electric wire whether long enough being used for installation site.

At block 2028, the electric wire of cutting and/or other electric components can be installed to installation site.Such as, after verifying at block 2028 electric wire is cut into correct length, the electric wire of cutting and other electric components (such as, if switch, fuse, isolating switch, divider and/or the miscellaneous part that needs) can install by user together.

After the electric wire installing one or more cutting and/or miscellaneous part, at block 2030, the infrared camera (such as, infrared imaging module 1416) of measurement mechanism 1400 can be opened and make it point to installation site to scan any unusual condition.Such as, if in order to other objects (such as, at block 2002, alignment) and not yet open infrared imaging module 1416, then user can be opened by customer controller 1422 or otherwise activates infrared imaging module 1416 and make measurement mechanism 1400 point to installation site, so that installation site is positioned at the scene 1540 that infrared imaging module 1416 is caught at least partly.If need, user can point to, locate and/or orientation survey device 1400 to catch any other scene relevant to user environment.

At block 2032, the installation site relevant to user environment or the heat picture of other scenes can be caught, be converted into the visible heat picture of user, and present the visible heat picture of described user and watch for user.The technology for infrared imaging module 1416 described above can be utilized, perform catching and produce and showing the visible heat picture of user of heat picture.Such as, after the heat picture of catching image capture module 1416 is changed, visible for user heat picture can be presented on the display 1418 of measurement mechanism 1400 or display 1424 and check for user.If measurement mechanism comprise visible light camera, the visible images of installation site or other scenes can be caught, and suitable operation can be performed to heat picture and visible images, there is higher resolution to produce and/or know the combination of degree or the visible heat picture of user of fusion.Suitable operation for generation of the visible heat picture of user merged can comprise, such as, U.S. Patent application No.13/105 that on May 11st, 2011 submits to, that be entitled as " Infrared Resolution and Contrast Enhancement with Fusion ", resolution disclosed in 765 and contrast strengthen mixing operation, it can be used as entirety to be merged into herein by way of reference.

At block 2034, heat picture can be checked.Such as, user can check the visible heat picture of user of installation site on the display 1418 of measurement mechanism 1400 or display 1424 or other scenes, to search the fault of focus 1550A, cold spot 1550B or any other instruction.Because loose contact, connector are corroded, connector does not have correct fixing, internal damage, laod unbalance and other various electric faults usually to reveal higher or lower temperature, so by checking that the visible heat picture of user can detect the electric wire and/or parts that may break down rapidly than the electric wire of normal work and/or components list.At block 2036, this suspicious electric wire, parts and/or other external articles can be connected to measurement mechanism to check the various electrical quantitys (such as, voltage, electric current, resistance, electric capacity and/or other parameter) relevant to electric wire, parts and/or other external articles.Such as, external articles 1532 can be connected to a suitable terminal 1404 so that external articles 1532 is electrically connected to electric meter circuit 1514 by user.Can optionally use test lead 1530 as required.

At block 2038, the mode of operation of measurement mechanism 1400 is chosen as electric meter pattern.Such as, user can input or otherwise provide the selection of electric meter pattern on the customer controller 1422 of measurement mechanism 1400.In certain embodiments, user such as selects in voltage, electric current, resistance, electric capacity or other electrical quantitys that will measure further by customer controller 1422.Before connecting electric wire, parts and/or other external articles at block 2036, the selection of electric meter pattern can be performed.At block 2040, conventional art can be utilized to determine the electrical quantity relevant to suspicious electric wire, parts and/or other external articles.At block 2014, by performing the operation of the display 1418 of measurement mechanism 1400 described above, the electrical quantity determined such as can be presented on display 1418 and check for user.User can check any fault that the electrical quantity presented may exist with checking or further diagnosis suspicious electric wire, parts and/or other external articles.If need or expect to measure more than one electrical quantity, then user such as can select another electrical quantity on customer controller 1422, and can repeatable block 2040-2042.

With reference now to Figure 21, it illustrates the process flow diagram manufactured according to the method 2100 of the measurement mechanism of disclosure embodiment.Such as, measurement mechanism 1400/1600 or other similar devices can be constructed by execution part or all method 2100.In various embodiments, according to the needs of the application-specific of method 2100, can resequence, combine, revise and/or omission method 2100 each operation, to manufacture measurement mechanism 1400/1600 or other similar devices of various embodiment.Although describe the ad-hoc location of all parts of measurement mechanism 1400/1600, layout and orientation, in other embodiments can according to various realization need they are adjusted.

At block 2102, the shell 1402/1602 of measurement mechanism 1400/1600 can be set.The shape and size of shell 1402/1602 can be set to hand-held, or when carry or onsite application time be convenient to user (such as, electrician) operation.Such as, in one embodiment, shell 1402/1602 can be undersized and its shape is the shape of shell 1602A or 1602B shown in Figure 17 and 18.In certain embodiments, can handle or other projections (such as, pistol grip) be arranged on shell 1402/1602, with allow user comfortable hold shell 1402/1602.Shell 1402/1602 can by any suitable material manufacture to use at the scene time protection internal part.In one embodiment, shell 1402/1602 can by the combination manufacture of durable polymer and metal.Shell 1402/1602 can be manufactured by the combination in any of molding, assembling, casting and other suitable constructing technologies.

At block 2104, electric terminal 1404 can be set.Such as, as above to the description of Figure 14 A-15, can electric terminal 1404 be arranged on any one or more outside surfaces of shell 1402/1602, any position allowing to be advantageously connected to electric wire and/or external articles can be arranged on.In one embodiment, can will be used for realizing jack, socket, plug, pin, clip, screw or other suitable structure installment, the assembling of electric terminal 1404 or otherwise be placed in the hole of the correct position being formed in shell 1402/1602.This structure can be manufactured by conductive material, and when being contained in coupling arrangement with convenient electric terminal 1404, it can be formed with external cable, cable or goods and be electrically connected.In one embodiment, these structures can hold the test lead (such as, test lead 1530) comprising standard or special connector insertedly and/or releasedly.In certain embodiments, at block 2104, contactless electric transducer 1604 can be furnished with clamp 1604A or flexible ring, or according to embodiment, removably can arrange other structures covering contactless electric transducer 1604.

At block 2106, optical transmitting set 1406 can be set.In various embodiments, optical transmitting set 1406 can be installed, assemble, be connected to shell 1402 or otherwise fixing relative to shell 1402, and the light beam launched to make optical transmitting set 1406 can not be covered by housing 1402 or block.Optical transmitting set 1406 can be directed relative to housing 1402, to make to hold shell 1402 by user and to make its direction pointing to expectation carry out alignment.Such as, in one embodiment, as shown in Figure 14 A-14B, at least part of optical transmitting set 1406 exposes and is placed in the top of shell 1402, with make user can by the top side of shell 1402 towards expect direction, thus alignment light transmitter 1406 launch light beam.

At block 2108, the location settings sensor 1408 detecting folded light beam can be suitable for.In various embodiments, sensor 148 can be installed, assemble, be connected to shell 1402 or be otherwise fixed to the position that light beam that the external object (such as, object 1542) on shell 1402 reflects can arrive.Such as, in one embodiment, as shown in Figure 14B, at least part of sensor 1408 exposes and is placed in and the same position of optical transmitting set 1406 in the top side of shell 1402.As will be appreciated, because folded light beam is defocused in all directions usually, so sensor 1408 does not need to aim at completely with optical transmitting set 1406.Like this, sensor 1408 can be placed in any suitable position that folded light beam can arrive.

At block 2110, distance measuring circuit 1510 can be set.In various embodiments; distance measuring circuit 1510 can be arranged on circuit boards or other encapsulation in; it is substantially closed in shell 1402, is substantially placed in the inside of shell 1402 or otherwise fixes, so that shell 1402 can provide at least some for the protection of external environment condition to distance measuring circuit 1510 relative to shell 1402.Therefore, such as, can will realize the mimic channel of distance measuring circuit 1510, digital circuit and/or memory storage (such as, storer 1520) appropriate combination arrange on circuit boards or in other suitable encapsulation, its substantially by above-mentioned suitable combined closing in the enclosure, combinations thereof is placed in substantially shell inside or otherwise fix relative to shell.

At block 2112, distance measuring circuit 1510 can be coupled to optical transmitting set 1406 and sensor 1408 communicatedly.In various embodiments, suitable board traces, bus, electric wire, cable, strip connector and/or other web members can be set, it is for the formation of the signal path being suitable for transportation simulator and/or digital signal (such as, comprising other suitable carriers of electrical transmission, optical transport or signal) between distance measuring circuit 1510 and optical transmitting set 1406 and between distance measuring circuit 1510 and sensor 1408.

At block 2114, electric meter circuit 1514 is set.In various embodiments; electric meter circuit 1514 can be arranged on circuit boards or other encapsulation in; the inside that it is cruelly enclosed in shell 1402/1602 substantially, be substantially placed in shell 1402/1602 or otherwise fix relative to shell 1402/1602, so as shell 1402/1602 can to electric meter circuit 1514 provide at least some for the protection of external environment condition.In certain embodiments, based on embodiment, electric meter circuit 1514 and distance measuring circuit 1510 can be arranged in identical circuit board or other encapsulation, and some parts can be shared with distance measuring circuit 1510.As above to the description of Figure 14 A-15, the appropriate combination of mimic channel, digital circuit and/or memory storage (such as, storer 1520) can be utilized to realize electric meter circuit 1514.

At block 2116, electric meter circuit 1514 can be electrically connected to one or more electric terminal 1404 and/or non-contact type electric transducer 1604.In various embodiments, board traces, cable, electric wire and/or other suitable web members can be set between electric meter circuit 1514 and a suitable electric terminal 1404, so that the application of the expectation according to measurement mechanism 1400, form the electric pathway with enough rated power.In certain embodiments, electrical connection can be not switchable, to make it possible to as each electric terminal 1404 distributes the input (such as, for the terminal of voltage measurement, the terminal for current measurement, the terminal for ground connection or the terminal for the input of other types) of particular type.In other embodiments, electrical connection can be routed to automatic or manual on-off circuit, described on-off circuit can as a part for a part for electric meter circuit 1514, customer controller 1422 or as individual components.In this embodiment, electric terminal 1404 can be switchable (such as, manually selecting to adjust on-off circuit by automatic sensing-detecting and/or reception), optionally to receive dissimilar input.In other embodiments, some electric terminals 1404 can be switchable, and other are not switchable.In various embodiments, can print, embossing, engraving mark or word or near being otherwise set on shell 1402 outside each electric terminal 1404 accordingly, what connect to indicate each electric terminal 1404 is the input of which kind of type.In certain embodiments, when do not have dismountable contactless electric transducer 1604 is set time, wireless communication module 1613 can be set.

At block 2118, Length Measuring Circuit 1512 can be set.In various embodiments; Length Measuring Circuit 1512 can be arranged on circuit boards or other encapsulation in; it is substantially closed in shell 1402, is substantially placed in the inside of shell 1402 or otherwise fixes relative to shell 1402, so as shell 1402 can to Length Measuring Circuit 1512 provide at least some for the protection of external environment condition.In certain embodiments, Length Measuring Circuit 1512 and distance measuring circuit 1510 and/or electric meter circuit 1514 can be arranged on identical circuit board or in other encapsulation.In certain embodiments, Length Measuring Circuit 1512 can also share some parts with distance measuring circuit 1510 and/or electric meter circuit 1514.As above to the description of Figure 14 A-15, the appropriate combination of mimic channel, digital circuit and/or memory storage (such as, storer 1520) can be utilized to realize Length Measuring Circuit 1512.

At block 2120, Length Measuring Circuit 1512 can be electrically connected to one or more electric terminal 1404.In various embodiments, board traces, cable, electric wire and/or other suitable web members can be set between Length Measuring Circuit 1512 and a suitable electric terminal 1404, so that the application of the expectation according to measurement mechanism 1400, form the electric pathway with enough rated power.In various embodiments, electrical connector can be not switchable or switchable electrical connector that is wired, route or that formed in the similar mode described with block 2116.

At block 2122, display 1418 can be set.In various embodiments, display 1418 can be installed, assemble, be connected to shell 1402/1602 or be otherwise fixed on shell 1402/1602, and at least can have the reading panel of the outside surface being exposed to shell 1402 (such as, VFD panel, LED panel or other multistages or dot matrix panel) or electronic display screen (such as, LCD display) part.Such as, in one embodiment, as shown in Figure 14 A, 17 or 18, display 1418 can be placed in shell 1402/1602 or otherwise fix relative to shell 1402/1602, checks for user so that reading panel is placed in the front surface being exposed to shell 1402/1602.As above to the description of Figure 14 A-15, reading panel or electrical screen, video-stream processor and/or memory storage (such as, storer 1520) can be utilized to realize display 1418.

At block 2124, display 1418 can be coupled to the miscellaneous part of distance measuring circuit 1510, electric meter circuit 1514, Length Measuring Circuit 1512 and/or measurement mechanism 1400/1600 communicatedly.In various embodiments, can suitable board traces, bus, electric wire, cable, strip connector and/or other web members be set between display 1418 and all parts of measurement mechanism 1400/1600, to form the signal path being suitable for transportation simulator and/or digital signal, described simulation and/or digital signal can be the coded messages of each measured value that each circuit of instruction is determined.In certain embodiments, when display 1424 is configured to display measurement information and the visible heat picture of user, block 2122 and 2124 can be omitted.

At block 2126, customer controller 1422 can be set.In various embodiments, customer controller 1422 can be arranged, be arranged on shell 1402/1602 or otherwise and fix relative to shell 1402/1602, activate outside surface that input media can be exposed to shell 1402/1602 to make knob, button, keyboard, slide block and/or other users to receive and user mutual or receive user's input.Such as, as shown in Figure 14 A, 17 or 18, the front surface of shell 1402/1602 can be exposed to the knob of the customer controller 1422 of suitable word or mark or other user input apparatus.In various embodiments, customer controller 1422 can be coupled to communicatedly, and (such as, utilize suitable board traces, bus, electric wire, cable, strip connector and/or be suitable for transmitting simulation and/or other web members of digital signal) comprises all parts of distance measuring circuit 1510, electric meter circuit 1514 and/or Length Measuring Circuit 1512.In certain embodiments, when customer controller 1422 can be implemented as the GUI be presented on display 1418 or display 1424, block 2126 can be omitted.

At block 2128, can installation infrared image-forming module 1416.In various embodiments, infrared imaging module 1416 can be installed, assembles or is connected to shell 1402/1602 be suitable for suitable provide infrared imaging module 1416 so that the expedite position checking scene (such as, scene 1540).In certain embodiments, infrared imaging module 1416 can be made directed relative to optical transmitting set 1406, the point of impingement of the light beam from optical transmitting set can be placed in the FOV1541 of infrared imaging module 1416.Such as, in one embodiment, as shown in Figure 14 A-14B, the top side being arranged on shell 1402 that the lens of at least focal plane of infrared imaging module 1416 or other hole can be exposed is near the position of optical transmitting set 1406.In one embodiment, can be held by socket (such as, the socket 104 of above-mentioned Fig. 1-2) and be fixed infrared imaging module 1416.In one embodiment, suitable pin, card, plug or other securing members can be set to connect the infrared imaging module 1416 being embodied as plug-in unit (such as, add-on module) releasedly.In certain embodiments, in the mode similar with infrared imaging module 1416, non-thermographic module 1626 can be installed.In certain embodiments, infrared imaging module 1416 can be arranged on together with non-thermographic module 1626 in dual sensor module and to be installed together.

At block 2130, display screen (such as, display 1424) can be set.In various embodiments, display screen 1424 can be installed, assemble, be connected to shell 1402/1602, or fix relative to shell 1402/1602, and at least can have electronic display screen (such as, the LCD display) part of the outside surface being exposed to shell 1402/1602.Such as, in one embodiment, as shown in Figure 14 A, 17 or 18, display 1424 can be placed on shell or otherwise and fix relative to shell, so that the front surface that electronic display part is exposed to shell 1402/1602 is checked for user.In certain embodiments, on duty when a display 1418 is set, block 2130 can be omitted.

At block 2132, display screen (such as, display 1424) can be coupled to the miscellaneous part of infrared imaging module 1416 and/or measurement mechanism 1400/1600 communicatedly.In various embodiments, can suitable board traces, bus, electric wire, cable, strip connector and/or other web members be set between display screen and infrared imaging module, to form the signal path being suitable for transportation simulator and/or digital signal, the former data that described simulation and/or digital signal can catch infrared imaging module 1416 and/or produce or the visible heat picture of user are encoded.Can be configured at display 1418 present in the embodiment of the visible heat picture of user, display 1418 can be coupled to infrared imaging module 1416 communicatedly.

In a suitable case, realize by the combination of hardware, software or hardware and software the various embodiments that the disclosure provides.Equally in a suitable case, when not departing from spirit of the present disclosure, proposed various hardware component and/or software part can be merged into and comprising software, hardware and/or the composite component of the two.In a suitable case, when not departing from spirit of the present disclosure, proposed various hardware component and/or software part can be separated into and comprise software, hardware and/or the subassembly of the two.In addition, in a suitable case, can be expected that, software part can be embodied as software part, and vice versa.

According to software of the present disclosure, such as, non-transitory instruction, program code and/or data can be stored in one or more non-transitory machine readable media.Can also be expected that, can use one or more general or special purpose computer and/or computer system, network and/or other modes realize herein mentioned by software.In a suitable case, the order of various step described herein can change, merges into composite steps and/or be separated into sub-step, to provide function described herein.

Embodiment described above only illustratively, instead of limits the utility model.It is to be further understood that, according to principle of the present utility model, many amendments and change are possible.Therefore, scope of the present utility model is only limited by claims below.

Claims

1. a measurement mechanism, is characterized in that, comprising:

Shell, it is suitable for by user hand-held;

Logical device, it is suitable for determining the physical parameter relevant to external articles;

Infrared imaging module, it is suitable for the infrared image of capturing scenes; And

Display, it is fixed relative to described shell, and be suitable for will the information superposition of the described physical parameter of instruction to conversion on user's visual picture of the infrared image of catching, thus show described information and user's visual picture is checked for user.

2. measurement mechanism according to claim 1, is characterized in that,

Described physical parameter comprises electrical quantity; And

Described logical device comprises and is suitable for being electrically connected to described external articles to determine the electric meter circuit of described electrical quantity.

3. measurement mechanism according to claim 1, is characterized in that, comprise the sensor being suitable for the sensor signal producing the described physical parameter of instruction further, wherein, described logical device is suitable for determining described physical parameter in response to described sensor signal.

4. measurement mechanism according to claim 3, is characterized in that,

Described physical parameter comprises electrical quantity;

Described sensor comprises the contactless electric transducer being suitable for just sensing the electrical quantity relevant to described external articles without the need to carrying out electrical contact; And

Described logical device is suitable for determining described electrical quantity in response to the sensor signal from described contactless electric transducer.

5. measurement mechanism according to claim 4, is characterized in that, described contactless electric transducer comprises clamp, this clamp be suitable at least in part around described external articles to sense described electrical quantity.

6. measurement mechanism according to claim 4, it is characterized in that, described contactless electric transducer is dismountable from described shell, and be suitable for described sensor signal to be wirelessly sent to described logical device, described measurement mechanism comprises wireless communication module further, and it is suitable for the radio communication between auxiliary described contactless electric transducer and described logical device.

7. measurement mechanism according to claim 3, is characterized in that,

Described physical parameter comprises humidity level;

Described sensor comprises the humidity sensor of induction humidity; And

Described logical device is suitable for determining described humidity level in response to the sensor signal from described humidity sensor.

8. measurement mechanism according to claim 1, is characterized in that, comprises the non-thermographic module being suitable for the non-thermographic of catching described scene further, wherein:

The described infrared image that described infrared imaging module is caught is heat picture; And

Described logical device is suitable for combining described heat picture and non-thermographic to produce the visible heat picture of user.

9. measurement mechanism according to claim 8, is characterized in that, described logical device is suitable for:

High spatial frequency content is obtained from described non-thermographic; And

Described heat picture and non-thermographic is combined, to improve contrast and the edge details of described user's visual picture by described high spatial frequency content is added to described heat picture.

10. a measurement mechanism, is characterized in that, comprising:

Shell, it is configured to by user hand-held;

Optical transmitting set, it is configured to the objective emission light beam in scene;

Sensor, it is configured to detect the light beam that reflects from described target and produces detection signal in response to the light pulse detected;

Distance measuring circuit, it is configured to the distance determining described target based on described detection signal;

Electric meter circuit, it is configured to be electrically connected to external articles and determines the electrical quantity relevant to described external articles; And

Display, its information being configured to present the described distance of instruction and/or described electrical quantity is checked for described user.

11. measurement mechanisms according to claim 10, it is characterized in that, comprise Length Measuring Circuit further, it is configured to be electrically connected to electric wire and determines the length of described electric wire, wherein, described display is further configured to present and indicates the information of the length of described electric wire to check for described user.

12. measurement mechanisms according to claim 10, is characterized in that, comprise the infrared imaging module being configured to the infrared image of catching described scene further, and wherein, described display is further configured to:

Present described infrared image to check for described user; And

To the information superposition of described distance and/or electrical quantity be indicated on described infrared image.

13. measurement mechanisms according to claim 12, is characterized in that, described infrared image comprises the image of described light beam.

14. measurement mechanisms according to claim 12, is characterized in that, comprise the non-thermographic module being configured to the non-thermographic of catching described scene further, wherein:

Described infrared image is heat picture; And

Described display is further configured to the described heat picture of combination and described non-thermographic to produce the combination image checked of the described user of confession.

15. measurement mechanisms according to claim 14, is characterized in that, described display is further configured to:

Described heat picture and non-thermographic is combined, to improve contrast and the edge details of combination image by described high spatial frequency content is added to described heat picture.