CN115988900A - Display panel, preparation method thereof and display device - Google Patents
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- CN115988900A CN115988900A CN202211696974.9A CN202211696974A CN115988900A CN 115988900 A CN115988900 A CN 115988900A CN 202211696974 A CN202211696974 A CN 202211696974A CN 115988900 A CN115988900 A CN 115988900A
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- 238000002360 preparation method Methods 0.000 title abstract description 8
- 239000002346 layers by function Substances 0.000 claims abstract description 55
- 239000000758 substrate Substances 0.000 claims abstract description 28
- 238000004519 manufacturing process Methods 0.000 claims abstract description 13
- 238000000034 method Methods 0.000 claims description 16
- 230000002349 favourable effect Effects 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 35
- 239000010409 thin film Substances 0.000 description 10
- 239000011368 organic material Substances 0.000 description 9
- 238000007641 inkjet printing Methods 0.000 description 8
- 230000008569 process Effects 0.000 description 8
- 238000002347 injection Methods 0.000 description 7
- 239000007924 injection Substances 0.000 description 7
- 230000008020 evaporation Effects 0.000 description 6
- 238000001704 evaporation Methods 0.000 description 6
- 238000000151 deposition Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000007769 metal material Substances 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- 239000010408 film Substances 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000005525 hole transport Effects 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- -1 graphene Chemical compound 0.000 description 2
- 229910021389 graphene Inorganic materials 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000008204 material by function Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
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Abstract
The application discloses display panel and preparation method, display device thereof, display panel include the display area and with the non-display area of display area connection, display panel includes: a substrate extending from the display region to the non-display region; the anode is arranged on the substrate and is positioned in the display area and the non-display area; the organic functional layer is arranged on the anode and is positioned in the display area and the non-display area; a cathode disposed on the organic functional layer and extending from the display region to the non-display region; and at least one conductive column which penetrates through the organic functional layer, is used for connecting the anode and the cathode and is positioned in the non-display area. This application sets up at the negative pole overlap joint district and leads electrical pillar and make negative pole and positive pole electrically conductive connection to adopt same mask preparation organic functional layer and negative pole, be favorable to reduction in production cost.
Description
Technical Field
The application relates to the technical field of display, in particular to a display panel, a preparation method of the display panel and a display device.
Background
Organic Light Emitting Diodes (OLEDs) have attracted much attention and developed due to their flexibility, fast response time, wide color gamut, low power consumption, and the like. The OLED is composed of an anode, a cathode, and one or more layers of organic materials between the electrodes, and excitons are formed by recombination of holes and electrons injected from the anode and the cathode in an organic light emitting layer and are emitted by radiative transition of the excitons.
In recent years, there are many process options for large generation line OLEDs, and inkjet Printing (IJP) has attracted considerable attention from panel manufacturers because of its great potential to reduce OLED production costs. The ink-jet printing process may greatly reduce the manufacturing cost, so that the OLED has more cost competitiveness in products such as televisions, tablet computers and the like. For the IJP OLED panel, the fabrication thereof employs an inkjet printing process (IJP) and an evaporation process (EV)/Sputtering Process (SPT), due to limited ink development of an Electron Transport Material (ETM) and an Electron Injection Material (EIM). Currently, an IJP OLED panel deposits OLED functional layers such as a Hole Injection Layer (HIL), a Hole Transport Layer (HTL), and an emission layer (EML) by using an IJP process, and deposits OLED functional layers such as an Electron Transport Layer (ETL), an Electron Injection Layer (EIL), and a Cathode (Cathode, CAT) by using an EV/SPT process.
In addition, the white OLED is also provided, RGB organic materials are mixed into white light, RGB pixels are analyzed by means of the filtering technology of the LCD, and W pixels are added for increasing brightness. Even the OLED technology of depositing RGB organic light emitting materials using a metal mask is applied to large generation lines. For the OLED structure, the cathode and the anode need to be conducted in the lap joint area, so that metal masks with various openings need to be used, and the condition that other organic light-emitting/functional materials are deposited in the lap joint area to influence the conduction of the cathode and the anode is avoided.
Disclosure of Invention
The invention aims to provide a display panel, a preparation method thereof and a display device, and aims to solve the technical problem that multiple openings are needed for conducting a cathode and an anode.
In order to achieve the above object, the present invention provides a display panel including a display area and a non-display area connected to the display area, the display panel including: a substrate extending from the display region to the non-display region
A zone; the anode is arranged on the substrate and is positioned in the display area and the non-display area; an organic function 5 layer disposed on the anode and located in the display region and the non-display region; a cathode disposed at the cathode
The organic functional layer extends from the display area to the non-display area; and at least one conductive column which penetrates through the organic functional layer, is used for connecting the anode and the cathode and is positioned in the non-display area.
Further, the conductive post includes: a first surface; a second surface on the first surface
The conductive columns are arranged at intervals in the height direction; and a connection surface connected between the first surface and the second surface 0.
Furthermore, an included angle is formed between the extending direction of the connecting surface and a central axis perpendicular to the plane where the second surface is located.
Further, the included angle is in a range of 44-55 degrees.
Further, an orthographic area of the first surface on the substrate is smaller than an orthographic area of the second surface on the substrate 5.
Furthermore, a cathode overlapping area is arranged in the non-display area, and at least two conductive columns are arranged in the cathode overlapping area at intervals.
Further, the sum of the heights of the organic functional layer and the cathode is less than or equal to the height of the conductive column.
0 to achieve the above object, the present invention further provides a method for manufacturing a display panel, the display panel
The preparation method comprises a display area and a non-display area connected with the display area, and comprises the following steps:
forming an anode on a substrate and extending from the display region to the non-display region;
forming at least one conductive column on the anode and in the non-display area;
forming an organic functional layer on the anode and extending from the display region to the non-display region; wherein, in the non-display area, the organic functional layer is arranged at an interval from the conductive column;
forming a cathode on the organic functional layer and extending from the display region to the non-display region;
wherein, in the non-display area, the cathode and the anode are connected through the conductive pillar.
Further, in the step of forming the organic functional layer and the step of forming the cathode, the organic functional layer and the cathode are formed using the same mask.
In order to achieve the above object, the present invention further provides a display device including the display panel according to any one of the above embodiments.
The display panel and the preparation method thereof and the display device provided by the invention have the technical effects that the conductive column is arranged in the cathode lap joint area to enable the cathode to be in conductive connection with the anode, and the organic functional layer and the cathode are prepared by adopting the same mask, so that the production cost is favorably reduced.
Furthermore, the top surface and the bottom surface of the conductive column are connected through an inclined connecting surface, so that the conductive column can be provided with an evaporation coating angle matched with the organic functional layer, therefore, in the evaporation coating process, an organic material can be deposited at the position between any two adjacent conductive columns as much as possible, excessive organic materials are prevented from being deposited on the top surface of the conductive column, and the conduction performance of the cathode and the anode is improved.
Furthermore, the sum of the heights of the organic functional layer and the cathode is smaller than the height of the conductive column, so that the contact area of the contact between the connecting surface of the conductive column and the cathode can be increased, and the conductivity of the cathode and the anode is effectively improved.
Drawings
The technical solutions and other advantages of the present application will become apparent from the following detailed description of specific embodiments of the present application when taken in conjunction with the accompanying drawings.
Fig. 1 is a plan view of a display panel provided in embodiment 1 of the present application.
Fig. 2 is a cross-sectional view of a display panel provided in embodiment 1 of the present application.
Fig. 3 is an enlarged view of the conductive pillar in fig. 2.
Fig. 4 is a top view of the conductive post of fig. 3 on the anode.
Fig. 5 is a flowchart of a method for manufacturing a display panel provided in embodiment 1 of the present application.
Fig. 6 is a cross-sectional view of a display panel provided in embodiment 2 of the present application.
The components of the drawings are identified as follows:
AA. A display area; NA, non-display area; 10. a cathode overlap region; 1. a substrate; 2. a pixel defining layer; 3. an anode; 4. an organic functional layer; 5. a cathode; 6. a conductive post; 61. a first surface; 62. a second surface; 63. and (5) connecting the surface.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the description of the present application, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are only for convenience in describing the present application and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be taken as limiting the present application. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first" and "second" may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
Example 1
As shown in fig. 1-2, an embodiment of the present application provides a display panel, which includes a display area AA and a non-display area NA connected to the display area AA, and the display panel includes a substrate 1, a pixel defining layer 2, an anode 3, an organic functional layer 4, a cathode 5, and a conductive pillar 6.
Specifically, the substrate 1 extends from the display area AA to the non-display area NA. The substrate 1 includes a substrate, a buffer layer, a thin film transistor layer, a planarization layer, and other film layers in sequence from bottom to top, wherein the thin film transistor layer is provided with a plurality of thin film transistors, and the thin film transistors may include a driving thin film transistor, an induction transistor, and the like, which are not limited herein.
The pixel defining layer 2 is disposed on the substrate 1 and located in the display area AA, and the pixel defining layer 2 includes more than two pixel defining blocks disposed at intervals, and adjacent pixel defining blocks surround a light emitting area.
The anode 3 is disposed on the substrate 1 and located in the display area AA and the non-display area NA. In the display area AA, the anode 3 is correspondingly disposed on the substrate 1 of the light emitting area; in the non-display area NA, the anode 3 is entirely laid on the substrate 1.
The organic functional layer 4 is disposed on the anode 3 and is located in the display area AA and the non-display area NA. The organic functional layer 4 includes two or more spaced light emitting units, wherein the light emitting units may be red light emitting units, green light emitting units, blue light emitting units, etc. The organic functional layer 4 may include a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, an electron injection layer, and other film layers, which are not described herein again. Note that, in the display area AA, the organic functional layer 4 is mainly disposed on the anode 3 of the light emitting area, but since the organic functional layer 4 is deposited over the entire surface, the organic functional layer 4 is also formed on the upper surface of the pixel defining layer 2 in fig. 2. In the non-display area NA, the organic functional layer 4 is disposed at an interval from the conductive pillar 6.
The cathode electrode 5 is disposed on the organic functional layer 4 and extends from the display area AA to the non-display area NA.
At least one conductive pillar 6 penetrates through the organic functional layer 4, is used for connecting the anode 3 and the cathode 5, and is located in the non-display area NA. The material used for the conductive pillars 6 may be a metal material, such as copper, aluminum, molybdenum, or a conductive material such as graphene, and is not limited in particular.
In some embodiments, a cathode overlapping area 10 is disposed in the non-display area NA, and the at least two conductive pillars 6 are disposed at the cathode overlapping area 10 at intervals. Specifically, in the cathode overlapping area 10, a light emitting unit is disposed between two adjacent conductive columns 6, so that the conductive columns 6 are arranged in the cathode overlapping area 10 at intervals, and further, the conductive connection between the cathode 5 and the anode 3 is realized through the conductive columns 6.
As shown in fig. 3, in some embodiments, the conductive post 6 includes a first surface 61, a second surface 62, and a connection surface 63. The second surface 62 and the first surface 61 are disposed at an interval in the height direction of the conductive pillar 6, wherein the first surface 61 is a top surface of the conductive pillar 6, the second surface 62 is a bottom surface of the conductive pillar 6, and the second surface 62 contacts with the upper surface of the substrate 1. The connection surface 63 is connected between the first surface 61 and the second surface 62.
As shown in fig. 2 to fig. 3, in some embodiments, the extending direction of the connection surface 63 forms an included angle α with a central axis perpendicular to the plane of the second surface 62, so as to increase the contact area between the organic functional layer 4 and the connection surface 63 of the conductive pillar 6, and the contact area between the cathode 5 and the connection surface 63 of the conductive pillar 6.
In some embodiments, the included angle α ranges from 44 ° to 55 °, and an orthographic projection area of the first surface 61 on the substrate 1 is smaller than an orthographic projection area of the first surface 61 on the substrate 1, so that the connection surface 63 of the conductive pillar 6 is a slope, and the conductive pillar 6 can have an evaporation angle matching the organic functional layer 4, the evaporation angle being 44 ° to 55 °. In the evaporation process, the organic material can be deposited at a position between any two adjacent conductive pillars 6 as much as possible, and excessive organic material is prevented from being deposited on the first surfaces 61 of the conductive pillars 6, so that the conduction performance of the cathode 5 and the anode 3 is improved. In addition, the conductive pillar 6 has a structure that the contact area between the organic functional layer 4 and the connection surface 63 of the conductive pillar 6 can be increased, thereby improving the light emitting effect of the light emitting region.
The conductive column 6 may have a column structure, such as a circular truncated cylinder and a square column, and a cross-sectional view of the column structure may be a polygon such as a rectangle and a trapezoid, which is not limited herein. As shown in fig. 4, in some embodiments, in the cathode overlapping area 10, the orthogonal projection shape of the conductive pillar 6 on the anode 3 may be a polygon such as a rectangle, a trapezoid, etc., which is not limited herein. Wherein the density of conductive pillars 6 is selectable to match the dimensions of different conductive pillars 6. It should be noted that the arrangement of the conductive pillars 6 in the cathode overlapping area 10 may be regular or irregular, and may be specifically set according to actual conditions, which is not particularly limited herein.
In some embodiments, the sum of the heights of the organic functional layer 4 and the cathode 5 is equal to the height of the conductive pillar 6, and referring to fig. 2, that is, the first surface 61 of the conductive pillar 6 is flush with the upper surface of the cathode 5, so that the deposition material on the first surface 61 and the upper surface of the cathode 5 can be saved.
As shown in fig. 5, an embodiment of the present application further provides a method for manufacturing a display panel, where the display panel includes a display area AA and a non-display area NA connected to the display area AA, and the method includes the following steps:
s1, forming an anode 3 on a substrate 1 and located in a display area AA and a non-display area NA, referring to fig. 3.
A conductive material, which may be indium tin oxide, indium zinc oxide, or other metal material, etc., is deposited on the substrate 1 to form the anode 3, and is not particularly limited herein.
The substrate 1 includes a substrate, a buffer layer, a thin film transistor layer, a planarization layer, and other film layers in sequence from bottom to top, where the thin film transistor layer is provided with a plurality of thin film transistors, and the thin film transistors may include driving thin film transistors, sensing transistors, and the like, which is not limited herein.
S2, forming at least one conductive pillar 6 on the anode 3 and located in the non-display area NA, as shown in fig. 3.
The conductive pillar 6 is formed by depositing a metal material on the anode 3 of the non-display area NA, and the metal material may be copper, aluminum, molybdenum, or a conductive material such as graphene, which is not limited herein.
S3, forming an organic functional layer 4 on the anode 3 and positioned in the display area AA and the non-display area NA; in the non-display area NA, the organic functional layer 4 and the conductive pillar 6 are disposed at an interval, as shown in fig. 2.
The organic functional layer 4 includes two or more light emitting units spaced apart from each other, wherein the light emitting units may be red light emitting units, green light emitting units, blue light emitting units, or the like. The organic functional layer 4 may include a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, an electron injection layer, and other film layers, which are not described herein again.
S4, forming a cathode 5 on the organic functional layer 4 and extending from the display area AA to the non-display area NA; here, in the non-display area NA, the cathode 5 and the anode 3 are connected by the conductive post 6, see fig. 2.
A cathode 5 is formed by depositing a metal material on the organic functional layer 4 such that the cathode 5 and the anode 3 are connected by a conductive pillar 6 in a cathode landing area 10 of the non-display area NA.
In the step S3 of forming the organic functional layer 4 and the step S4 of forming the cathode 5, the same mask is used to form the organic functional layer 4 and the cathode 5, so that at least one mask can be saved, and the production cost can be reduced.
An embodiment of the present application further provides a display device, including the display panel described above. The display device can be a display device with a display panel, such as a mobile phone, a tablet computer, a notebook computer, a television and the like.
Example 2
The present embodiment provides a display panel, a method for manufacturing the same, and a display device, which includes most of the technical solutions of embodiment 1, and is different in that the sum of the heights of the organic functional layer and the cathode is less than the height of the conductive pillar.
As shown in fig. 6, the sum of the heights of the organic functional layer 4 and the cathode 5 is less than the height of the conductive pillar 6, so that the coverage of the organic material of the organic functional layer 4 on the conductive pillar 6 can be reduced, and the cathode 5 is conducted with the anode 3 by covering the conductive pillar 6. Specifically, in the step of forming the organic functional layer 4, when depositing the organic material on the anode 3, the organic material may be sputtered onto the top surface (the first surface 61) of the conductive pillar 6, and if the cathode 5 is subsequently formed on the organic functional layer 4 and contacts with the top surface of the conductive pillar, this may result in poor conduction effect between the cathode 5 and the anode 3, and therefore, in the cathode overlapping region 10, by setting the sum of the heights of the functional layer 4 and the cathode 5 to be less than the height of the conductive pillar 6, the contact area between the inclined surface (the connection surface 63) of the conductive pillar 6 and the cathode 5 may be increased, thereby effectively improving the conduction performance between the cathode 5 and the anode 3. Therefore, compared to embodiment 1, the conductivity between the cathode 5 and the anode 3 is better than the conductivity between the cathode 5 and the anode 3.
In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
The display panel, the manufacturing method thereof, and the display device provided in the embodiments of the present application are described in detail above, and specific examples are applied in the description to explain the principle and the implementation of the present application, and the description of the embodiments above is only used to help understanding the technical solution and the core idea of the present application; those of ordinary skill in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications or substitutions do not depart from the spirit and scope of the present disclosure as defined by the appended claims.
Claims (10)
1. A display panel including a display area and a non-display area connected to the display area, the display panel comprising:
a substrate extending from the display region to the non-display region;
the anode is arranged on the substrate and is positioned in the display area and the non-display area;
the organic functional layer is arranged on the anode and is positioned in the display area and the non-display area;
a cathode disposed on the organic functional layer and extending from the display region to the non-display region; and
and the at least one conductive column penetrates through the organic functional layer, is used for connecting the anode and the cathode, and is positioned in the non-display area.
2. The display panel according to claim 1, wherein the conductive pillar comprises:
a first surface;
a second surface spaced apart from the first surface in a height direction of the conductive post; and
a connection face connected between the first surface and the second surface.
3. The display panel according to claim 2,
the extending direction of the connecting surface forms an included angle with a central axis which is perpendicular to the plane where the second surface is located.
4. The display panel according to claim 3,
the included angle ranges from 44 degrees to 55 degrees.
5. The display panel according to claim 2,
an orthographic area of the first surface on the substrate is smaller than an orthographic area of the second surface on the substrate.
6. The display panel according to claim 1,
the non-display area is internally provided with a cathode overlapping area, and the at least two conductive columns are arranged in the cathode overlapping area at intervals.
7. The display panel according to any one of claims 1 to 6,
the sum of the heights of the organic functional layer and the cathode is less than or equal to the height of the conductive column.
8. A method for manufacturing a display panel, the display panel including a display area and a non-display area connected to the display area, the method comprising the steps of:
forming an anode on a substrate and located in the display area and the non-display area;
forming at least one conductive column on the anode and in the non-display area;
forming an organic functional layer on the anode and in the display region and the non-display region; wherein, in the non-display area, the organic functional layer and the conductive column are arranged at intervals;
forming a cathode on the organic functional layer and extending from the display region to the non-display region; wherein, in the non-display area, the cathode and the anode are connected through the conductive pillar.
9. The method for manufacturing a display panel according to claim 8,
in the step of forming the organic functional layer and the step of forming the cathode,
and forming the organic functional layer and the cathode by using the same mask.
10. A display device characterized by comprising the display panel according to any one of claims 1 to 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211696974.9A CN115988900A (en) | 2022-12-28 | 2022-12-28 | Display panel, preparation method thereof and display device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202211696974.9A CN115988900A (en) | 2022-12-28 | 2022-12-28 | Display panel, preparation method thereof and display device |
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| CN115988900A true CN115988900A (en) | 2023-04-18 |
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| CN114628481A (en) * | 2022-03-25 | 2022-06-14 | 京东方科技集团股份有限公司 | Display panel and display device |
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2022
- 2022-12-28 CN CN202211696974.9A patent/CN115988900A/en active Pending
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| US20140346453A1 (en) * | 2013-05-22 | 2014-11-27 | Samsung Display Co., Ltd. | Organic light emitting display device and manufacturing method thereof |
| US20190280059A1 (en) * | 2018-03-07 | 2019-09-12 | Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Oled display panel and manufacturing method thereof |
| CN109244269A (en) * | 2018-09-19 | 2019-01-18 | 京东方科技集团股份有限公司 | Display panel and its manufacturing method, display device |
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