CN115988757A - Electroplating method of circuit board and circuit board - Google Patents
Electroplating method of circuit board and circuit board Download PDFInfo
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- CN115988757A CN115988757A CN202111205503.9A CN202111205503A CN115988757A CN 115988757 A CN115988757 A CN 115988757A CN 202111205503 A CN202111205503 A CN 202111205503A CN 115988757 A CN115988757 A CN 115988757A
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- circuit board
- electroplating
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- plating
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
Abstract
The application relates to the technical field of circuit boards, and particularly discloses an electroplating method of a circuit board and the circuit board, wherein the electroplating method of the circuit board comprises the following steps: performing primary treatment on a circuit board to be electroplated to form a blind hole on one side surface of the circuit board; carrying out primary electroplating on the circuit board after the primary treatment by using an electroplating solution and an additive; wherein the electroplating solution comprises electroplating chemical solution and an accelerator; carrying out primary electrolysis on the circuit board subjected to primary electroplating to remove the accelerator adsorbed on one side surface of the circuit board after electroplating and retain the accelerator adsorbed on the bottom and part of the side wall of the blind hole; and carrying out secondary electroplating on the circuit board subjected to the primary electrolysis treatment. Through the mode, the electroplating method of the circuit board can effectively improve the efficiency of electroplating hole filling, so that the hole filling time is shortened, and the blind holes of the circuit board can be effectively filled.
Description
Technical Field
The present disclosure relates to circuit board technologies, and in particular, to a circuit board and a method for electroplating the circuit board.
Background
Nowadays, as the Printed Circuit Board (PCB) continues to be developed in the industry, the requirements for the PCB manufacturing process and the quality thereof are gradually increased.
In the process of copper-filling holes in circuit boards, direct current or pulse current is generally used for electroplating. The waveform of the pulse current generally has the following characteristics: (1) The forward current density is close to the current density during direct current electroplating; (2) reverse current density > forward current density; (3) Time of reverse current < forward current time, and the ratio of reverse current to forward current duration is between 1:5-1, 100, most commonly 1. (4) The forward and reverse pulse times are very short, with reverse pulse times of < 20 μ s being common, most often 1-5 μ s.
However, in the actual production process, the thickness-diameter ratio (hole depth: aperture) of the blind holes of the circuit board is generally controlled to be less than 0.8, and especially the hole depth of the blind holes with hole filling requirements is generally rarely over 120 μm, so that the problems of low hole filling efficiency, overlong time and blind hole filling incapability are usually inevitable in the hole filling electroplating process of hole filling electroplating, especially the hole filling electroplating process of deep blind holes with hole depth of more than 120 μm.
Disclosure of Invention
The application provides an electroplating method of a circuit board and the circuit board, which are used for solving the problems of low hole filling efficiency, overlong time and incapability of filling blind holes in the electroplating method of the circuit board in the prior art.
In order to solve the technical problem, the application adopts a technical scheme that: the electroplating method of the circuit board is provided, wherein the electroplating method of the circuit board comprises the following steps: performing primary treatment on a circuit board to be electroplated to form a blind hole on one side surface of the circuit board; carrying out primary electroplating on the circuit board after the primary treatment by using an electroplating solution and an additive; wherein the additive comprises an accelerator; carrying out primary electrolysis on the circuit board subjected to the primary electroplating to remove the accelerator adsorbed on one side surface of the circuit board after the primary electroplating, and retaining the accelerator adsorbed on the bottom and part of the side wall of the blind hole; and carrying out secondary electroplating on the circuit board subjected to the primary electrolysis treatment.
Wherein, carry out electrolysis once to the circuit board after once electroplating to get rid of once and adsorb the accelerator on a circuit board side after electroplating, and remain after the step of the accelerator that adsorbs on blind hole bottom and part lateral wall, before the step of carrying out secondary plating to the circuit board after once electrolytic treatment: and repeatedly carrying out the step of carrying out primary electroplating on the circuit board after the primary treatment by using the electroplating solution and the additive and carrying out primary electrolysis on the circuit board after the primary electroplating to remove the accelerator adsorbed on one side surface of the circuit board after the electroplating and keep the accelerator adsorbed on the bottom and part of the side wall of the blind hole at least once.
The step of carrying out primary electroplating on the circuit board after primary treatment by using the electroplating solution and the additive comprises the following steps: and carrying out primary electroplating on the primarily treated circuit board by using the electroplating solution in the forced convection.
The step of carrying out primary electroplating on the circuit board after primary treatment by using the electroplating solution and the additive comprises the following steps: and carrying out primary electroplating treatment on the primarily treated circuit board for 5-60 minutes by using the electroplating solution.
The step of carrying out primary electrolysis on the circuit board subjected to primary electroplating comprises the following steps of: and carrying out primary electrolytic treatment on the circuit board subjected to primary electroplating for 5-120 seconds.
Wherein, the step of carrying out primary electroplating on the circuit board after primary treatment by using the electroplating solution and the additive comprises the following steps: adopting a first direct current power supply to carry out primary electroplating on the circuit board after primary treatment through an electroplating solution and an additive; the step of carrying out primary electrolysis on the circuit board subjected to primary electroplating comprises the following steps: performing primary electrolysis on the circuit board subjected to primary electroplating by using a second direct current power supply; the current density correspondingly output to the circuit board by the first direct current power supply is larger than the current density correspondingly output to the circuit board by the second direct current power supply.
The step of carrying out primary electrolysis on the circuit board subjected to primary electroplating comprises the following steps of: carrying out primary electrolytic treatment on the electroplated circuit board by using an electrolytic solution; wherein the electrolytic solution is different from the electroplating solution.
Wherein the electrolytic solution includes an acid ion.
Wherein, the electroplating solution adopted in each two times of electroplating is different.
In order to solve the above technical problem, the present application adopts another technical solution: there is provided a circuit board, wherein the circuit board is obtained by the plating method of the circuit board as described in any one of the above.
The beneficial effect of this application is: be different from prior art's condition, the electroplating method of circuit board in this application forms the blind hole on a side of circuit board, and carry out once electroplating the back through electroplating solution and additive to the circuit board after preliminary treatment, can once carry out the electrolysis through the circuit board to once electroplating the back, get rid of and adsorb the accelerator on a side of circuit board after electroplating, and remain the accelerator that adsorbs on blind hole bottom and partial lateral wall, thereby strengthened the absorbent effect of additive specificity, guarantee the blind hole that fills up the circuit board that can be rapid at the secondary electroplating to the circuit board after once electrolytic treatment, with the efficiency of effectively improving the electroplating filling hole, and shorten the time of filling hole.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts. Wherein:
FIG. 1a is a schematic flow chart of a first embodiment of a method for plating a circuit board according to the present invention;
FIGS. 1 b-1 f are schematic structural diagrams of an embodiment corresponding to S11-S14 in FIG. 1 a;
FIG. 1g is a side view of an electroplating cell and an electrolytic cell used in a specific application scenario of the circuit board electroplating method of the present application;
FIG. 1h is a top view of an embodiment of the plating cell and the electrolytic cell of FIG. 1 g;
FIG. 1i is a top view of another embodiment of the plating cell and the electrolytic cell of FIG. 1 g;
FIG. 1j is a top view of the plating cell and yet another embodiment of the electrolytic cell of FIG. 1 g;
FIG. 1k is a side view of an electroplating cell and an electrolytic cell used in another embodiment of the circuit board electroplating method of the present application;
FIG. 1l is a top view of an embodiment of the electroplating cell and the electrolytic cell of FIG. 1 k;
FIG. 1m is a top view of another embodiment of the plating cell and the electrolytic cell of FIG. 1 k;
FIG. 2 is a schematic flow chart of a second embodiment of the electroplating method for the circuit board of the present application.
Detailed Description
The inventor has found through long-term research that the process of electroplating copper in the circuit board to fill the hole generally comprises the following steps: pretreatment (oil removal, water washing, microetching and water washing) → acid dipping → electroplating → water washing → drying; in some cases, an additive pre-adsorption step is added before acid leaching.
On the other hand, since the copper electroplating in the circuit board may need to be performed several times, the electroplating process liquid may evolve into: pretreatment 1 (degreasing, water washing, microetching and water washing) → acid pickling → electroplating 1 → water washing → drying (optional) → pretreatment 2 (optional) → acid pickling → electroplating 2 → water washing → drying; wherein, the steps of electroplating 1 to electroplating 2 can be repeated for a plurality of times.
In both cases, it is understood that the electroplating process uses direct current. But there is also a case where the plating is performed using a pulse current; and the waveform of the pulse current has the following characteristics: (1) The forward current density is close to the current density during direct current electroplating; (2) reverse current density > forward current density; (3) Time of reverse current < forward current time, and the ratio of reverse current to forward current duration is between 1:5-1, 100, most commonly 1. (4) The forward and reverse pulse times are very short, with reverse pulse times of < 20 μ s being common, most often 1-5 μ s.
In the aspect of technical principle, the direct current electroplating blind hole is filled by utilizing the specific adsorption of an additive on the surface of a plated part, so that the current on the surface of the plated part is redistributed to realize larger current in the hole; the positive part of the pulse electroplating filling hole has the same principle as the direct current electroplating, and the reverse part can enhance the specific adsorption of the additives on the surface of the plated part, so that the current in the blind hole is larger when the current is redistributed; the fact that the current density in the blind hole is larger than the plate surface is the basic principle of filling the hole with the electroplated copper.
The step of 'additive pre-adsorption' is to specifically adsorb corresponding additives before electroplating so as to enhance the effect of specific adsorption of the additives during electroplating, thereby improving the current density in the blind hole, shortening the electroplating time and reducing the electroplating defects. This "additive pre-adsorption" can be achieved either by "soaking" or by "electroplating"; however, "immersion" or "plating" is not sufficient and often requires an "accelerated" treatment for best results.
However, all the above-mentioned electroplating methods have in common: that is, for a certain purpose, electroplating is completed at one time. For example, in the first mentioned process, which is most common, when blind vias need to be filled, it is necessary to ensure that the blind vias can be completely filled by one electroplating process by changing the current density, the electroplating time, optimizing the electroplating solution, and the like. The second process evolved from the first process comprises multiple times of electroplating; it is divided into three main categories; one is that the purpose of multiple plating is different, for example, flash plating is performed during the first plating in order to thicken the seed layer; in order to fill the hole, the electroplating solution and parameters of the second electroplating are greatly different, and the electroplating baths of the multiple electroplating are necessarily different. The second type is that the plating solution is the same for multiple times, but the subsequent plating is to make up for the defects in the previous plating, and the plating is generally suspended between each time to carry out quality detection; both of these first two types of plating baths are discontinuous. The third type is that the plating solution is the same for multiple times, but the through hole is filled by adopting pulse and direct current respectively; the purpose of the pulse section is different from that of the direct current section, wherein the pulse is used for sealing the middle of the through hole to obtain 2 blind holes, and the direct current is used for filling the rest 2 blind holes.
At present, in the actual production process, the thickness-diameter ratio (hole depth: aperture) of the blind holes of the circuit board is generally controlled to be less than 0.8; in the blind hole filling with the hole diameter controlled within 120 microns and the hole depths of 140 microns, 180 microns and 220 microns, the scheme of local additive pre-adsorption can accelerate the hole filling speed and reduce the hole filling defects, but the problems of overlong hole filling time and incomplete hole filling still exist.
In order to effectively improve the efficiency of electroplating hole filling, shorten the hole filling time and effectively fill the blind holes of the circuit board, the application provides an electroplating method of the circuit board and the circuit board. The present application will be described in further detail with reference to the following drawings and examples. It is to be noted that the following examples are only illustrative of the present application, and do not limit the scope of the present application. Likewise, the following examples are only some examples and not all examples of the present application, and all other examples obtained by a person of ordinary skill in the art without any inventive work are within the scope of the present application.
Reference in the specification to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the specification. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.
Referring to fig. 1a to fig. 1f, fig. 1a is a schematic flow chart of a first embodiment of a method for manufacturing a circuit board of the present application, and fig. 1b to fig. 1f are schematic structural diagrams of an embodiment corresponding to S11 to S14 in fig. 1 a. The embodiment comprises the following steps:
s11: the circuit board to be electroplated is subjected to preliminary treatment to form a blind hole on one side surface of the circuit board.
Specifically, as shown in fig. 1b, before the circuit board 102 to be electroplated is electroplated, it is usually inevitable to perform a preliminary treatment on the circuit board 102, for example, first, the circuit board 102 to be electroplated is subjected to any reasonable process flows such as splitting, inner layer patterning, browning, pressing, drilling, copper deposition, and the like, so as to form a blind hole 1021 on a side surface of the circuit board 102 disposed on the carrier 101, which is not further described herein.
S12: and carrying out primary electroplating on the circuit board after the primary treatment by using the electroplating solution and the additive.
Further, as shown in fig. 1c, after forming the blind hole 1021 on one side surface of the preliminarily processed circuit board 102, the circuit board 102 is further subjected to a plating process, for example, by immersing the preliminarily processed circuit board 102 in a plating bath containing a plating solution (not shown) and an additive 104, and supplying power by using a dc power source, so as to further plate a plating layer 103 on one side surface of the circuit board 102 and the bottom and side walls of the blind hole 1021.
The additive 104 specifically includes an accelerator 1041, and as shown in fig. 1d, the preliminarily processed circuit board 102 is subjected to a plating process, so that the accelerator 1041 is adsorbed on a side surface of the circuit board 102 and the plating layer 103 correspondingly formed on the bottom and the side wall of the blind via 1021. In other embodiments, the additive 104 may further include an inhibitor 1042 and/or a leveling agent 1043, which is not limited in this application.
It should be noted that the electroplating solution is specifically a solution capable of providing metal ions, such as a copper sulfate solution, so as to form an electroplating layer 103 by electroplating on a side surface of the circuit board 102 and the bottom and side walls of the blind via 1021.
The accelerator 1041 is specifically a small molecular compound containing sulfydryl and sulfonate or benzene ring, can be adsorbed on the surface of the copper plating layer and continuously transfers to the outermost surface of the plating layer along with the electroplating process, and has the function of reducing electrochemical polarization of electroplated copper.
S13: and carrying out primary electrolysis on the circuit board subjected to primary electroplating to remove the accelerator adsorbed on one side surface of the circuit board after the primary electroplating and retain the accelerator adsorbed on the bottom and part of the side wall of the blind hole.
Still further, as shown in fig. 1e, the circuit board 102 after the primary plating is subjected to primary electrolysis, for example, the circuit board 102 is immersed in an electrolytic bath containing an electrolyte solution and is electrolyzed to dissolve part of the plating layer 103 on one side surface of the circuit board 102, so that the accelerator 1041 adsorbed on one side surface of the circuit board 102 after the primary plating can be removed, and only the accelerator 1041 adsorbed near the bottom of the blind via 1021 remains to form a specific adsorption effect of the accelerator 1041.
It should be noted that the specific adsorption of the additive 104 means that different components of the additive 104 have different adsorption concentrations at different positions on the surface of the plated part during the electroplating process.
S14: and carrying out secondary electroplating on the circuit board subjected to the primary electrolysis treatment.
Still further, as shown in fig. 1f, the circuit board 102 after the primary electrolytic treatment is subjected to secondary plating to further form a plating fill layer 105 on the plating layer 103 to fill the entire blind via 1021 step by step.
It is understood that the electroplated fill layer 105 is the same as the electroplated layer 103, and is distinguished herein for convenience of description.
In an embodiment, the additive 104 used in the secondary electroplating may further include a suppressor 1042 and a leveling agent 1043, which are not described herein again.
It is noted that the inhibitor 1042 (also known as a wetting agent or carrier) is a substance that retards or slows the rate of a chemical reaction, in contrast to the accelerator 1041. It cannot stop the electrochemical reaction but increases the polarization of the electrochemical reaction, thereby suppressing the rate of copper electroplating. The leveling agent 1043 is a substance added into the plating solution to improve the flatness of the plating layer, and to enhance the differential adsorption effect of the additive 104, especially the accelerator 1041, so that the obtained plating layer is smoother than the substrate surface.
It can be understood that, in the above scheme, the additive 104 is adsorbed by "primary electroplating", and then the specific adsorption of the accelerator 1041 is realized by utilizing "primary electrolysis" in a short time, so that the specific adsorption effect of the additive 104 during "secondary electroplating" can be enhanced to quickly realize electroplating hole filling, thereby effectively improving the efficiency of electroplating hole filling and shortening the hole filling time.
In one embodiment, the "primary plating" is specifically used for flash plating or hole filling while adsorbing the accelerator 1041, and the "secondary plating" is used for hole filling. Therefore, the plating solutions used for the "primary plating" and the "secondary plating" are different, for example, the concentrations of the copper sulfate solutions included in the solutions are different, so as to be different from each other in correspondence to different plating scenarios.
Further, in an embodiment, after the step S13 and before the step S14, the method further includes: the above-described S12 and S13 are repeatedly performed in sequence at least once.
It can be understood that, in order to ensure faster filling of the blind holes 1021 formed on the circuit board 102, and in particular to ensure effective filling of the blind holes 1021 in the circuit board 102 with a high aspect ratio, after the above step S13 and before the step S14, the circuit board 102 may be subjected to at least one electroplating and electrolysis in turn, and the electroplated circuit board 102 may be subjected to one electrolysis treatment between each two adjacent electroplating treatments to gradually form the electroplating filling layer 105 on the electroplating layer 103 until the electroplating filling layer 105 fills the whole blind holes 1021 by the second electroplating.
From this, it is clear that, compared with the conventional plating method: the present application continuously utilizes "one electroplating" to adsorb the additive 104, and then utilizes "one electrolysis" for a short time to realize "partial pre-adsorption of the additive"; then, the 'primary electroplating' is carried out to quickly fill the hole and adsorb the additive 104, then the 'primary electrolysis' in a short time is utilized to realize the 'local pre-adsorption of the additive', and the steps are carried out alternately in sequence, namely, the steps are repeated according to the hole depth of the blind hole 1021, so that the quick growth of the in-hole electroplating filling layer 105 of the 'local pre-adsorption of the additive' method can be kept for a long time, and the problems of overlong hole filling time and incomplete blind hole 1021 filling existing in the 'local pre-adsorption of the additive' technology are solved.
Note that the "additive pre-dipping" or "additive partial pre-adsorption" means that the additive 104 is adsorbed on the surface of the plating material before the plating.
Further, in an embodiment, the step S12 further includes: the preliminarily processed circuit board 102 is subjected to primary plating by the plating solution in forced convection.
It will be appreciated that to ensure that the bottom of the blind holes 1021 of the circuit board 102 can be plated more quickly and efficiently, it is necessary to ensure that the circuit board 102 after the primary treatment, which is immersed in the plating solution, is in strong convection, for example, by circularly stirring the plating solution, so that the circuit board 102 is always in strong convection to perform a plating treatment.
Further, in an embodiment, the step S12 further includes: the primarily treated circuit board 102 is subjected to a primary plating treatment for a duration of 5 to 60 minutes by a plating solution.
Further, in an embodiment, the step S13 further includes: the circuit board 102 after the primary plating is subjected to primary electrolytic processing for a duration of 5 to 120 seconds.
Thus, compared with the conventional plating method: the method for realizing the pre-adsorption of the accelerator by introducing the 'electrolysis' process in a short time (5-120 s) between multiple times of electroplating has the advantages that the 'electrolysis' is used for replacing the action of the 'oxidant such as micro-etching', on the one hand, the effect of multiple times of 'pre-adsorption of the accelerator' in one-time electroplating process is realized by multiple times of 'electrolysis', and the using effect of the principle of 'local pre-adsorption of the accelerator' is enhanced. The method has obvious difference with pulse plating, namely, the method uses a direct current power supply, and the duration of the forward current (plating output current) and the reverse current (electrolysis output current) is different by orders of magnitude compared with the pulse plating.
Further, in an embodiment, the step S13 further includes: the circuit board 102 after plating is subjected to primary electrolytic processing by the electrolytic solution.
It will be understood that the electrolytic treatment of the plated circuit board 102 is carried out by immersing it in an electrolytic bath containing an electrolytic solution to electrolyze it.
Optionally, the electrolytic solution is different from the electroplating solution. In other embodiments, the electrolytic solution may be the same as the electroplating solution, which is not limited in this application.
Alternatively, the electrolytic solution may include acid ions, such as any reasonable acid ions, such as sulfate ions, chlorate ions, etc., or may further include other reasonable solutions, which is not limited in this application.
Optionally, when the circuit board 102 needs to be plated and electrolyzed for multiple times, the plating solutions used in each two times of plating processing are different, for example, the concentrations of the copper sulfate solutions included correspondingly are different, or the concentrations of other main components are different, so that the filling progress of the blind hole 1021 can be matched with the current plating scenario, and a better plating effect and plating efficiency can be achieved; and the electrolytic solution adopted by every two times of electrolytic treatment can be different so as to match the current electrolytic scene according to the filling progress of the blind hole 1021, thereby realizing better electrolytic effect and electrolytic efficiency. In other embodiments, the electroplating solution may be consistent and the electrolytic solution may be consistent, which is not limited in this application.
In one embodiment, as shown in fig. 1g and fig. 1h, fig. 1g is a side view of a plating tank and an electrolytic tank used in a specific application scenario of the circuit board plating method of the present application, and fig. 1h is a top view of a specific embodiment of the plating tank and the electrolytic tank in fig. 1 g. The electroplating method of the circuit board in this embodiment specifically uses a plurality of electroplating baths and electrolytic baths connected end to end, for example, the electroplating bath 1, the electroplating bath 2, the electroplating bath N +1 (N is a positive integer greater than 1), and the electrolytic bath 1, the electrolytic bath 2, the electroplating bath N, and the electrolytic bath N, so as to alternately perform electroplating and electrolytic processing on the circuit board 102 for a plurality of times in sequence, and specifically uses a VCP (Vertical continuous plating) line or a gantry line or a horizontal line for process processing.
It should be noted that the VCP line is a production line for acid and alkali resistant materials used for electroplating each liquid container. When the VCP line is used for plating copper on a PCB, a whole board (one-time) copper plating production line of a spraying copper plating process and a vertical continuous conveying device is adopted. The advantages of the vertical continuous electroplating are as follows: stable plating efficiency: all the workpieces are continuously moved from one side of the electroplating bath to the other side, and the moving speed of each workpiece is the same.
The gantry line is an automatic operation line, which includes a single gantry, a double gantry, i.e. an automatic line, and is used to automatically operate the PCB after being mounted, i.e. a gantry type production line, i.e. a general plating line, i.e. a vertical line in which a crane spans two side guide rails and moves a hanger from a fixed slot at a fixed time point according to a program to complete production.
The horizontal electroplating method and the vertical electroplating method are the same in principle, and both the anode and the cathode are required. In contrast to the vertical line, the plating is placed vertically in the vertical line and held by a clamp, while the plating is moved horizontally on a roller in the horizontal line. The horizontal line is relatively more closed and has smaller volume.
It is understood that the plurality of plating tanks contain the same or different plating solutions, the plurality of plating tanks contain the same or different electrolytic solutions, and the electrolytic solutions and the plating solutions may be the same or different; the circuit board 102 is immersed in the electroplating bath 1, the electroplating bath 2, the plating bath N, and the electroplating bath N +1 from one side of the electroplating bath 1 in sequence, so as to alternately perform electroplating and electrolytic treatment on the circuit board 102.
Wherein, as shown in fig. 1h, the plurality of plating tanks and the plurality of electrolytic tanks are communicated with each other, the correspondingly contained plating solution and electrolytic solution are the same, and the corresponding sub-tanks are also communicated with each other for the cyclic alternation of the tank solutions.
In yet other embodiments, as shown in FIG. 1i, FIG. 1i is a top view of the plating tank and the electrolytic tank of FIG. 1g in another embodiment, differing from FIG. 1h in that the sub-tanks of the multiple plating tanks are in communication with each other, and the sub-tanks of the multiple electrolytic tanks are in communication with each other but not with the plating tank, to enable a cyclic alternation of plating solution and electrolytic solution, respectively, and to enable a targeted specific treatment of solid waste material that may be present in the waste solution after electrolysis.
And as shown in fig. 1i, fig. 1j is a top view of the electroplating tank and the electrolytic tank in fig. 1g in another embodiment, which is different from fig. 1h in that a plurality of electroplating tanks and a plurality of electrolytic tanks may also adopt mutually independent auxiliary tanks, respectively, and the application is not limited thereto.
In another embodiment, as shown in fig. 1k and fig. 1h, fig. 1k is a side view of a plating tank and an electrolytic tank used in another specific application scenario of the circuit board plating method of the present application, and fig. 1l is a top view of a specific embodiment of the plating tank and the electrolytic tank in fig. 1 k. The electroplating method of the circuit board in this embodiment specifically adopts the electroplating bath 11, the electroplating bath 12, the electroplating bath 1 (N + 1) (N is a positive integer greater than 1), and the electroplating bath 11, the electroplating bath 12, the electroplating bath 1N, and every two adjacent solution baths are spaced from each other and are not communicated, so as to alternately perform multiple times of electroplating and electrolytic processing on the circuit board 102 in sequence, and specifically adopts a VCP line or a gantry line to perform process processing.
Wherein, as shown in fig. 1l, when a plurality of plating solutions are identical to each other but different from a plurality of electrolytic solutions, the sub-tanks of a plurality of plating tanks are communicated with each other and the sub-tanks of a plurality of electrolytic tanks are communicated with each other but not with the plating tank, so that the circulation alternation of the plating solutions and the electrolytic solutions can be separately performed and the solid wastes possibly existing in the waste solutions after the electrolysis can be specifically treated.
In other embodiments, as shown in fig. 1m, fig. 1m is a top view of another embodiment of the plating tank and the electrolytic tank in fig. 1k, and when the plurality of plating solutions and the plurality of electrolytic solutions are different from each other, the plurality of plating tanks and the plurality of electrolytic tanks may also respectively adopt auxiliary tanks independent of each other, which is not limited in this application.
Further, in an embodiment, after the step S11 and before the step S12, the method further includes: and performing acid leaching treatment on the circuit board 102 after the primary treatment.
It should be noted that acid leaching refers to a mineral leaching process using an aqueous solution of an inorganic acid as a leaching agent to facilitate a subsequent electroplating process.
Further, in an embodiment, after the step S14, the method further includes: and sequentially carrying out water washing and drying treatment on the circuit board 102 subjected to secondary electroplating.
It can be understood that after the circuit board 102 after the secondary electroplating is washed and dried, the electroplated circuit board 102 product can be obtained.
In the above scheme, the blind hole 1021 is formed on one side surface of the circuit board 102 by the electroplating method of the circuit board 102, and after the circuit board 102 after the primary treatment is subjected to primary electroplating through the electroplating solution and the additive 104, the accelerator 1041 adsorbed on one side surface of the circuit board 102 after the primary electroplating can be removed by carrying out primary electrolysis on the circuit board 102 after the primary electroplating, and the accelerator 1041 adsorbed on the bottom and the side wall of the blind hole 1021 is retained, so that the effect of specific adsorption of the additive 104 is enhanced, and the blind hole 1021 of the circuit board 102 can be rapidly filled by secondary electroplating on the circuit board 102 after the primary electrolysis treatment, so that the electroplating hole filling efficiency is effectively improved, and the hole filling time is shortened.
Referring to fig. 2, fig. 2 is a schematic flow chart of a second embodiment of the method for plating a circuit board according to the present invention. The electroplating method of the circuit board of the present embodiment is a schematic flow chart of a detailed embodiment of the electroplating method of the circuit board in fig. 1a, and the present embodiment includes the following steps:
s21: the circuit board to be electroplated is subjected to preliminary treatment to form a blind hole on one side of the circuit board.
S21 is the same as S11 in fig. 1a, and please refer to S11 and the related text description thereof, which are not repeated herein.
S22: and adopting a first direct current power supply to carry out primary electroplating on the circuit board after the primary treatment through an electroplating solution and an additive.
Specifically, a first direct current power supply is adopted to supply power to the electroplating bath containing electroplating solution and additives so as to carry out primary direct current electroplating on the circuit board after primary treatment, and further electroplating is carried out on one side surface of the circuit board, the bottom and the side wall of the blind hole to form an electroplated layer, and the accelerator is adsorbed on the electroplated layers correspondingly formed on one side surface of the circuit board, the bottom and the side wall of the blind hole.
Alternatively, the duration of the primary plating treatment is 5 to 60 minutes.
S23: and carrying out primary electrolysis on the circuit board subjected to primary electroplating by adopting a second direct current power supply so as to remove the accelerator adsorbed on one side surface of the circuit board after the primary electroplating and retain the accelerator adsorbed on the bottom and part of the side wall of the blind hole.
Further, adopt the second direct current power supply to supply power to the electrolysis trough that holds and be provided with electrolyte to the circuit board after once electroplating carries out once electrolysis, in order to dissolve the electroplating layer part on this circuit board one side, thereby can get rid of once and adsorb the accelerator on circuit board one side, and only remain the accelerator that adsorbs on blind hole bottom and partial lateral wall, and specifically be close to the one side of circuit board more, the accelerator that remains is less, and the more close to the blind hole bottom, the accelerator that remains is more complete, in order to form the specific adsorption effect of additive.
The current density correspondingly output to the circuit board by the first direct current power supply is larger than the current density correspondingly output to the circuit board by the second direct current power supply.
Alternatively, the duration of one electrolytic treatment is 5 to 120 seconds.
S24: and carrying out secondary electroplating on the circuit board subjected to the primary electrolysis treatment.
S24 is the same as S14 in fig. 1a, and please refer to S14 and the related text description thereof, which are not repeated herein.
Understandably, compared with the existing electroplating method: in the embodiment, continuous multiple electroplating is adopted, and electrolysis exists between the electroplating; also in contrast to pulse plating, the "forward current duration" (plating time) and "reverse current duration" (electrolysis time) of the present application are both longer, and do not require the use of a pulse power supply, but rather require the combination of multiple dc power supplies.
The beneficial effect of this application is: be different from the condition of prior art, the electroplating method of circuit board in this application forms the blind hole on the side of circuit board, and carry out once electroplating the back through electroplating solution and additive to the circuit board after preliminary treatment, can once carry out the electrolysis through the circuit board after once electroplating, get rid of and adsorb the accelerator on a circuit board side after electroplating, and remain the accelerator that adsorbs on blind hole bottom and partial lateral wall, thereby the absorbent effect of additive specificity has been strengthened, guarantee the secondary electroplating that can be rapid filling up the blind hole of circuit board to the circuit board after once electrolytic treatment, with the efficiency of electroplating the pore-filling effectively improves, in order to shorten the time of pore-filling.
The above embodiments are merely examples and are not intended to limit the scope of the present disclosure, and all modifications, equivalents, and flow charts using the contents of the specification and drawings of the present disclosure or those directly or indirectly applied to other related technical fields are intended to be included in the scope of the present disclosure.
Claims (10)
1. A method for electroplating a circuit board, the method comprising:
performing primary treatment on a circuit board to be electroplated to form a blind hole on one side surface of the circuit board;
carrying out primary electroplating on the circuit board after primary treatment through an electroplating solution and an additive; wherein the additive comprises an accelerator;
carrying out primary electrolysis on the circuit board subjected to primary electroplating to remove the accelerator adsorbed on one side surface of the circuit board after the primary electroplating and retain the accelerator adsorbed on the bottom and partial side wall of the blind hole;
and carrying out secondary electroplating on the circuit board subjected to the primary electrolytic treatment.
2. The method of claim 1, wherein after the step of performing the first electrolysis on the circuit board after the first electroplating to remove the accelerator adsorbed on one side surface of the circuit board after the first electroplating and retain the accelerator adsorbed on the bottom and a portion of the sidewall of the blind via, and before the step of performing the second electroplating on the circuit board after the first electrolysis, the method further comprises:
repeatedly executing the step of carrying out primary electroplating on the circuit board after the primary treatment through the electroplating solution and the additive and the step of carrying out primary electrolysis on the circuit board after the primary electroplating to get rid of and adsorb behind the primary electroplating on one side of the circuit board the accelerator, and keep adsorbing on the bottom of the blind hole and part of the side wall of the blind hole the step of the accelerator is at least once.
3. The plating method of circuit board according to claim 1, wherein said step of performing primary plating of said circuit board after preliminary treatment by means of a plating solution and an additive comprises:
and carrying out primary electroplating on the circuit board after the primary treatment by using the electroplating solution in the forced convection.
4. The plating method of circuit board according to claim 1, wherein said step of performing primary plating of said circuit board after preliminary treatment by means of a plating solution and an additive comprises:
and carrying out primary electroplating treatment on the primarily treated circuit board for 5-60 minutes by using the electroplating solution.
5. The method of plating a circuit board according to claim 1 or 4, wherein the step of subjecting the circuit board after the primary plating to primary electrolysis comprises:
and carrying out primary electrolytic treatment on the circuit board subjected to primary electroplating for 5-120 seconds.
6. The method for plating a circuit board according to claim 1, wherein the step of performing primary plating of the preliminarily processed circuit board with a plating solution and an additive comprises:
carrying out primary electroplating on the primarily treated circuit board by adopting a first direct current power supply through the electroplating solution and the additive;
the step of carrying out primary electrolysis on the circuit board subjected to primary electroplating comprises the following steps:
carrying out primary electrolysis on the circuit board subjected to primary electroplating by adopting a second direct current power supply;
the current density correspondingly output to the circuit board by the first direct current power supply is larger than the current density correspondingly output to the circuit board by the second direct current power supply.
7. The method for plating a circuit board according to claim 1, wherein said step of subjecting said circuit board after primary plating to primary electrolysis comprises:
carrying out primary electrolytic treatment on the electroplated circuit board through an electrolytic solution; wherein the electrolytic solution is different from the electroplating solution.
8. The plating method for a circuit board according to claim 7,
the electrolytic solution includes an acid ion.
9. The plating method of a circuit board according to claim 1 or 2,
the plating solution used for each plating run was different.
10. A circuit board obtained by the plating method of the circuit board according to any one of claims 1 to 9.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111205503.9A CN115988757A (en) | 2021-10-15 | 2021-10-15 | Electroplating method of circuit board and circuit board |
| PCT/CN2021/142198 WO2023060773A1 (en) | 2021-10-15 | 2021-12-28 | Electroplating method for circuit board, and circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111205503.9A CN115988757A (en) | 2021-10-15 | 2021-10-15 | Electroplating method of circuit board and circuit board |
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| CN115988757A true CN115988757A (en) | 2023-04-18 |
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| CN202111205503.9A Pending CN115988757A (en) | 2021-10-15 | 2021-10-15 | Electroplating method of circuit board and circuit board |
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| WO (1) | WO2023060773A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1291775A (en) * | 2000-11-09 | 2001-04-18 | 上海维安热电材料股份有限公司 | Technology for making thermosensitive resistor for SMT |
| US7405163B1 (en) * | 2003-12-17 | 2008-07-29 | Novellus Systems, Inc. | Selectively accelerated plating of metal features |
| JP2004342750A (en) * | 2003-05-14 | 2004-12-02 | Toshiba Corp | Method of manufacturing electronic device |
| JP4857317B2 (en) * | 2008-02-26 | 2012-01-18 | 新光電気工業株式会社 | Through-hole filling method |
| TWI487815B (en) * | 2010-01-27 | 2015-06-11 | Ebara Corp | Plating method and plating apparatus |
| CN101775601B (en) * | 2010-02-09 | 2012-05-09 | 合肥工业大学 | Chemical deplating solution and deplating method suitable for removing tin-nickel coating on surface of brass |
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