CN115985819A - Detection device for detecting and rotating real-time co-location of LED chip mass transfer self-compensation - Google Patents

Abstract

The invention discloses a detection device for LED chip mass transfer self-compensation transfer measurement real-time co-location, which consists of a chip transfer system, an optical detection system and an alignment system; the transfer system includes: the laser head comprises a platform base, an upright post support, an upright post, a fixed seat, a bottom plate, a connecting block and a laser head; the optical detection system includes: the device comprises a detection device fixing block, an annular camera carrying platform support assembly, a detection camera fixer and an annular camera carrying platform; the counterpoint system includes: the chip carrier plate and the target substrate are respectively provided with an alignment platform base, an alignment platform rail, an alignment platform sliding block, an alignment platform and a checkerboard. The vertical co-location of the laser head, the chip and the target crystal position is realized, the CCD industrial cameras with three included angles of 120 degrees are adopted to obtain a non-blind-area real-time transfer image, the influence of frame loss of a single camera on detection precision during high-speed work is eliminated through self-compensation, the system work is not influenced when any camera fails, and the chip transfer precision and efficiency are effectively improved.

Description

Detection device for detecting and rotating real-time co-location of LED chip mass transfer self-compensation

Technical Field

The invention relates to a LED light-emitting diode bulk transfer technology, in particular to a detection device for LED chip bulk transfer self-compensation transfer real-time co-location.

Background

The Light Emitting Diode (LED) is used as a fourth generation solid state light source after incandescent lamps, fluorescent lamps and high-intensity gas discharge electric light sources, and has the advantages of energy conservation, environmental protection, low starting voltage, flexible size design, no mercury, high efficiency, long service life and the like. With the development of semiconductor technology, LEDs are in the trend of miniaturization, thinning and matrixing, and the size of the LEDs is also reduced from millimeter level to micrometer level, and the micron light emitting diode (Mini/Micro LED) display technology is in use. Compared with the LCD and OLED technologies popular in the market at present, the Mini/Micro LED display has higher brightness, wider color gamut, higher resolution, higher stability and higher energy utilization rate, and can better meet the personalized requirements of high-end display, such as new applications of 5G ultra-high-definition display, AR glasses, medical display, vehicle-mounted display and the like.

The process flow of the Mini/Micro LED display panel production mainly comprises chip preparation, chip transfer and defect detection and repair. The process of transferring millions or even tens of millions of micron-scale chips from a source substrate to a target substrate in a high-density array is called mass transfer, and the corresponding transfer yield is not lower than 99.99% (the transfer error is less than +/-5 μm). In order to ensure the chip transfer quality and improve the screen display effect, the chip transfer quality and the defective point chips of the target substrate board need to be detected by a specific detection device. In the transferring process, if the chip transferring error is too large, the transferring quality is reduced and the number of bad points is increased by continuing transferring. Therefore, a huge transfer inspection apparatus is needed to inspect the chip transfer quality and bad chips on the target substrate board in real time.

According to the existing mainstream swing arm type mass transfer scheme, the position information of a chip and a target crystal position is detected in real time by fixing a camera above a chip carrier plate and a target substrate, the chip is picked up by a mechanical arm and transferred to the target crystal position, the transfer yield is well guaranteed in real time by measuring and transferring, but the scheme has a large transfer stroke, and the mechanical arm, the chip and the target crystal position are not co-located in the vertical direction by measuring and transferring, so that the transfer speed is greatly limited.

The first prior art is as follows:

according to the chip bulk transfer method and the chip bulk transfer device disclosed in chinese patent 202111536055.0, the crystal-piercing head, the chip and the target crystal position are measured and transferred in the vertical direction to be co-located, so that the chip transfer stroke is effectively reduced, the transfer speed is increased, but the camera cannot be installed right above the chip and the target crystal position, and the position coordinates of the transferred chip and the target crystal position cannot be detected in real time by the camera, so that the improvement of the transfer yield is limited. In conclusion, during mass transfer, the transfer measurement can effectively improve the transfer yield and transfer quality of the chip in real time, but the transfer measurement is not co-located easily, so that the transfer speed and transfer efficiency are limited to be improved; the measurement and transfer co-location can improve the chip transfer speed and transfer efficiency, but the measurement and transfer is not real-time, the chip transfer cannot be detected in real time, and the improvement of the chip transfer yield is limited;

the second prior art is:

the device for detecting the transfer real-time co-location of the LED chip mass transfer described in the accepted patent 202211548336.2 is characterized in that a laser head, a chip on a chip carrier board assembly and a target crystal position on a target substrate are co-located in the vertical direction, and the intersection point of two projection reverse extension lines of the laser head is detected by means of two orthogonally-mounted CCD industrial cameras, so that the transfer real-time co-location of the chip transfer is realized. However, the visual axes of the two cameras are intersected below the laser head obliquely, a visual field blind area still exists, and when the two cameras work at a high speed, the frame loss of any camera can cause inconsistent detection results, information debugging is difficult to perform, and the improvement of chip transfer efficiency is greatly limited.

In view of this, it is preferable that, the invention is particularly proposed.

Disclosure of Invention

The invention aims to provide a detection device for detecting the real-time co-location of the huge transfer self-compensation of an LED chip, which aims to solve the technical problems in the prior art.

The purpose of the invention is realized by the following technical scheme:

the invention relates to a detection device for LED chip mass transfer self-compensation measurement-transfer real-time co-location, which mainly comprises a chip transfer system, an optical detection system and an alignment system, wherein the transfer system mainly comprises: the laser welding device comprises a platform base, a left upright post support, a right upright post support, a left upright post, a right upright post, a left fixed seat, a right fixed seat, a bottom plate, a connecting block and a laser head; the optical detection system mainly comprises: the device comprises a detection device fixing block, an annular camera carrying platform support assembly, a left front detection camera, a right front detection camera, a rear detection camera, a left front detection camera fixer, a right front detection camera fixer, a rear detection camera fixer and an annular camera carrying platform; the alignment system mainly comprises: a chip carrier plate alignment platform base, a chip carrier plate alignment platform longitudinal rail, a chip carrier plate alignment platform longitudinal slider, a chip carrier plate alignment platform transverse rail, a chip carrier plate alignment platform transverse slider, a chip carrier plate alignment platform, chip carrier plate checkerboards, a target substrate alignment platform transverse base, a target substrate alignment platform front transverse rail, a target substrate alignment platform rear transverse rail, a target substrate alignment platform left front transverse slider, a target substrate alignment platform right front transverse slider, a target substrate alignment platform left rear transverse slider, a target substrate alignment platform right rear transverse slider, a target substrate alignment platform longitudinal base, a target substrate alignment platform longitudinal left guide rail, a target substrate alignment platform longitudinal right guide rail, a target substrate alignment platform longitudinal left slider, a target substrate alignment platform longitudinal right slider, a target substrate platform and a target substrate platform checkerboard; the platform base is positioned below the left upright post support, the right upright post support, the left upright post and the right upright post, the left upright post support and the right upright post support are respectively positioned at the upper left corner and the upper right corner of the platform base and are installed on the platform base through fastening screws, the left upright post and the right upright post are respectively positioned in hollow cylinders of the left upright post support and the right upright post support and are installed on the left upright post support and the right upright post support through threaded fit, the left fixing seat and the right fixing seat are respectively installed at the middle upper ends of the left upright post and the right upright post by using screws, the bottom plate is positioned on the rear surfaces of the left fixing seat and the right fixing seat and is installed on the left fixing seat and the right fixing seat through the fastening screws, the connecting block is positioned on the rear side surface of the laser head transverse bottom plate and is installed on the laser head transverse bottom plate through the fastening screws, the laser head is positioned behind the connecting block and is installed on the rear surface of the connecting block through the fastening screws, the detection device fixing block is positioned in front of the bottom plate and is installed on the front surface of the bottom plate through fastening screws, the annular camera platform support assembly is positioned below the detection device fixing block and is installed on the detection device fixing block through fastening screws, the left front detection camera, the right front detection camera and the rear detection camera are respectively positioned in a circular sleeve which is placed at the left front part, the right front part and the right rear part of the annular camera platform and are respectively fixed through a left front detection camera fixer, a right front detection camera fixer and a rear detection camera fixer, the axis of the annular camera platform is collinear with the axis of the laser head, the annular camera platform is positioned behind the camera platform support and is installed on the annular camera platform support assembly through fastening screws, the chip carrier plate alignment platform base is positioned above the platform base, and the chip carrier plate alignment platform base is positioned behind the left upright support and the right upright support, and is mounted above the platform base by fastening screws, a chip carrier plate contraposition platform longitudinal rail is mounted above the chip carrier plate contraposition platform base longitudinally by fastening screws, a chip carrier plate contraposition platform longitudinal slide block is connected to the chip carrier plate contraposition platform longitudinal rail by slide rails, a chip carrier plate contraposition platform transverse rail is mounted above the chip carrier plate contraposition platform longitudinal slide block transversely by fastening screws, a target substrate contraposition platform transverse base is located at the upper end of the platform base, a target substrate contraposition platform transverse base is located behind the left upright post support and the right upright post support, a target substrate contraposition platform transverse base is located at the left of the chip carrier plate contraposition platform base and is mounted on the platform base by fastening screws, a target substrate contraposition platform front transverse rail and a target substrate contraposition platform rear transverse rail are both mounted transversely above the target substrate contraposition platform transverse base by fastening screws, a target substrate contraposition platform front transverse rail is located behind the target substrate contraposition platform transverse rail, a target substrate contraposition platform front transverse rail and a target substrate rear transverse rail are both connected to a target substrate transverse target platform front slide block through a target base plate transverse slide rail, a target substrate contraposition platform front slide rail and a target substrate transverse slide rail are connected to a target substrate transverse slide block on the target substrate contraposition platform front platform transverse slide rail, and the target substrate alignment platform left rear transverse slider is positioned at the left of the target substrate alignment platform right rear transverse slider, the target substrate alignment platform longitudinal base is fixed above the target substrate alignment platform left front transverse slider, the target substrate alignment platform right front transverse slider, the target substrate alignment platform left rear transverse slider and the target substrate alignment platform right rear transverse slider through fastening screws, the target substrate alignment platform longitudinal left guide rail and the target substrate alignment platform longitudinal right guide rail are fixed above the target substrate alignment platform longitudinal base through fastening screws, the target substrate alignment platform longitudinal left guide rail is positioned at the left of the target substrate alignment platform longitudinal right guide rail, the target substrate alignment platform longitudinal left slider is connected to the target substrate alignment platform longitudinal left guide rail through a slide rail, the target substrate alignment platform longitudinal right slider is connected to the target substrate alignment platform longitudinal right guide rail through a slide rail, the target substrate platform is fixed above the target substrate alignment platform longitudinal left slider and the target substrate alignment platform longitudinal right slider through fastening screws, and the target substrate chessboard pattern is placed in the upper surface groove of the target substrate platform.

Compared with the prior art, the detection device for detecting the mass transfer self-compensation transfer real-time co-location of the LED chip, provided by the invention, adopts the three CCD industrial cameras with included angles of 120 degrees, so as to obtain a non-blind-area real-time transfer image, eliminates the influence of frame loss of a single camera on detection precision during high-speed work through self-compensation, does not influence system work when any one camera fails, and effectively improves the chip transfer precision and efficiency.

Drawings

FIG. 1a is a schematic diagram of a forward three-dimensional structure of a detection apparatus for detecting LED chip bulk transfer self-compensation and real-time co-location;

FIG. 1b is a schematic side view of a three-dimensional structure according to an embodiment of the present invention;

FIG. 2 is a schematic three-dimensional structure diagram of a chip transfer system according to an embodiment of the present invention;

FIG. 3 is a schematic three-dimensional structure of an optical inspection system according to an embodiment of the present invention;

FIG. 4 is a schematic three-dimensional structure diagram of an alignment system according to an embodiment of the present invention;

FIG. 5 is a schematic three-dimensional structure diagram of a loop camera stage according to an embodiment of the present invention;

FIG. 6 is a schematic three-dimensional structure diagram of a circular camera stage support assembly according to an embodiment of the present invention;

fig. 7 is a schematic three-dimensional structure diagram of a chip carrier alignment platform according to an embodiment of the invention.

Detailed Description

The technical scheme in the embodiment of the invention is clearly and completely described below by combining the attached drawings in the embodiment of the invention; it should be understood that the described embodiments are only some of the embodiments of the present invention, not all of the embodiments, and are not intended to limit the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present invention without making any creative effort, shall fall within the protection scope of the present invention.

The terms that may be used herein are first described as follows:

the term "and/or" means that either or both can be achieved, for example, X and/or Y means that both cases include "X" or "Y" as well as three cases including "X and Y".

The terms "comprising," "including," "containing," "having," or other similar terms of meaning should be construed as non-exclusive inclusions. For example: including a feature (e.g., material, component, ingredient, carrier, formulation, material, dimension, part, component, mechanism, device, process, procedure, method, reaction condition, processing condition, parameter, algorithm, signal, data, product, or article of manufacture), is to be construed as including not only the particular feature explicitly listed but also other features not explicitly listed as such which are known in the art.

The term "consisting of 823070 \8230composition" means to exclude any technical characteristic elements not explicitly listed. If used in a claim, the term shall render the claim closed except for the inclusion of the technical features that are expressly listed except for the conventional impurities associated therewith. If the term occurs in only one clause of the claims, it is defined only as specifically listed in that clause, and elements recited in other clauses are not excluded from the overall claims.

Unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly, as for example: can be fixedly connected, can also be detachably connected or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms herein can be understood by those of ordinary skill in the art as appropriate.

The terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," and the like are used in an orientation or positional relationship that is indicated based on the orientation or positional relationship shown in the drawings for ease of description and simplicity of description only, and are not meant to imply or imply that the device or element so referred to must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner and therefore are not to be construed as limiting herein.

Details which are not described in detail in the embodiments of the invention belong to the prior art which is known to the person skilled in the art. Those not specifically mentioned in the examples of the present invention were carried out according to the conventional conditions in the art or conditions suggested by the manufacturer. The reagents or instruments used in the examples of the present invention are not specified by manufacturers, and are all conventional products available by commercial purchase.

The invention relates to a detection device for LED chip mass transfer self-compensation measurement-transfer real-time co-location, which mainly comprises a chip transfer system, an optical detection system and an alignment system, wherein the transfer system mainly comprises: the laser welding device comprises a platform base, a left upright post support, a right upright post support, a left upright post, a right upright post, a left fixed seat, a right fixed seat, a bottom plate, a connecting block and a laser head; the optical detection system mainly comprises: the device comprises a detection device fixing block, an annular camera carrying platform support assembly, a left front detection camera, a right front detection camera, a rear detection camera, a left front detection camera fixer, a right front detection camera fixer, a rear detection camera fixer and an annular camera carrying platform; the alignment system mainly comprises: a chip carrier plate alignment platform base, a chip carrier plate alignment platform longitudinal rail, a chip carrier plate alignment platform longitudinal slider, a chip carrier plate alignment platform transverse rail, a chip carrier plate alignment platform transverse slider, a chip carrier plate alignment platform, a chip carrier plate checkerboard, a target substrate alignment platform transverse base, a target substrate alignment platform front transverse rail, a target substrate alignment platform rear transverse rail, a target substrate alignment platform left front transverse slider, a target substrate alignment platform right front transverse slider, a target substrate alignment platform left rear transverse slider, a target substrate alignment platform right rear transverse slider, a target substrate alignment platform longitudinal base, a target substrate alignment platform longitudinal left guide rail, a target substrate alignment platform longitudinal right guide rail, a target substrate alignment platform longitudinal left slider, a target substrate alignment platform longitudinal right slider, a target substrate carrier and a target substrate carrier checkerboard; the platform base is positioned below the left upright post support, the right upright post support, the left upright post and the right upright post, the left upright post support and the right upright post support are respectively positioned at the upper left corner and the upper right corner of the platform base and are installed on the platform base through fastening screws, the left upright post and the right upright post are respectively positioned in hollow cylinders of the left upright post support and the right upright post support and are installed on the left upright post support and the right upright post support through threaded fit, the left fixing seat and the right fixing seat are respectively installed at the middle upper ends of the left upright post and the right upright post by using screws, the bottom plate is positioned on the rear surfaces of the left fixing seat and the right fixing seat and is installed on the left fixing seat and the right fixing seat through the fastening screws, the connecting block is positioned on the rear side surface of the laser head transverse bottom plate and is installed on the laser head transverse bottom plate through the fastening screws, the laser head is positioned behind the connecting block and is installed on the rear surface of the connecting block through the fastening screws, the detection device fixing block is positioned in front of the bottom plate and is installed on the front surface of the bottom plate through fastening screws, the annular camera platform support assembly is positioned below the detection device fixing block and is installed on the detection device fixing block through fastening screws, the left front detection camera, the right front detection camera and the rear detection camera are respectively positioned in a circular sleeve which is placed at the left front part, the right front part and the right rear part of the annular camera platform and are respectively fixed through a left front detection camera fixer, a right front detection camera fixer and a rear detection camera fixer, the axis of the annular camera platform is collinear with the axis of the laser head, the annular camera platform is positioned behind the camera platform support and is installed on the annular camera platform support assembly through fastening screws, the chip carrier plate alignment platform base is positioned above the platform base, and the chip carrier plate alignment platform base is positioned behind the left upright support and the right upright support, and is installed above the platform base by fastening screws, a longitudinal rail of a chip carrier plate aligning platform is installed above the base of the chip carrier plate aligning platform longitudinally by fastening screws, a longitudinal slide block of the chip carrier plate aligning platform is connected to the longitudinal rail of the chip carrier plate aligning platform by a slide rail, a transverse rail of the chip carrier plate aligning platform is installed above the longitudinal slide block of the chip carrier plate aligning platform transversely by fastening screws, a transverse slide block of the chip carrier plate aligning platform is connected to the transverse rail of the chip carrier plate aligning platform by a slide rail, the chip carrier plate aligning platform is installed above the transverse slide block of the chip carrier plate aligning platform by fastening screws, a checkerboard of the chip carrier plate is placed in a groove on the upper surface of the chip carrier plate aligning platform, a transverse base of a target substrate aligning platform is located at the upper end of the platform base, a transverse base of the target substrate aligning platform is located behind a left upright support and a right upright support, the target substrate alignment platform transverse base is positioned at the left side of the chip carrier alignment platform base and is installed on the platform base through a fastening screw, a target substrate alignment platform front transverse rail and a target substrate alignment platform rear transverse rail are both transversely installed above the target substrate alignment platform transverse base through the fastening screw, the target substrate alignment platform front transverse rail is positioned in front of the target substrate alignment platform rear transverse rail, a target substrate alignment platform left front transverse slider and a target substrate alignment platform right front transverse slider are both connected to the target substrate alignment platform front transverse rail through a sliding rail, the substrate alignment platform left front transverse slider is positioned at the left side of the target substrate alignment platform right front transverse slider, the target substrate alignment platform left rear transverse slider and the target substrate alignment platform right rear transverse slider are both connected to the target substrate alignment platform rear transverse rail through the sliding rail, and the target substrate alignment platform left rear transverse slider is positioned at the left of the target substrate alignment platform right rear transverse slider, the target substrate alignment platform longitudinal base is fixed above the target substrate alignment platform left front transverse slider, the target substrate alignment platform right front transverse slider, the target substrate alignment platform left rear transverse slider and the target substrate alignment platform right rear transverse slider through fastening screws, the target substrate alignment platform longitudinal left guide rail and the target substrate alignment platform longitudinal right guide rail are fixed above the target substrate alignment platform longitudinal base through fastening screws, the target substrate alignment platform longitudinal left guide rail is positioned at the left of the target substrate alignment platform longitudinal right guide rail, the target substrate alignment platform longitudinal left slider is connected to the target substrate alignment platform longitudinal left guide rail through a slide rail, the target substrate alignment platform longitudinal right slider is connected to the target substrate alignment platform longitudinal right guide rail through a slide rail, the target substrate platform is fixed above the target substrate alignment platform longitudinal left slider and the target substrate alignment platform longitudinal right slider through fastening screws, and the target substrate chessboard pattern is placed in the upper surface groove of the target substrate platform.

The annular camera carrying platform comprises an annular camera carrying platform body, an LED adjustable annular lamp and an annular camera carrying platform fixing knob.

The annular camera microscope carrier support assembly comprises a detection device fixing block connecting rod, a detection device fixing block connecting rod fixing knob, an annular camera microscope carrier connecting rod, an annular camera microscope carrier fixing knob and a connecting block.

The chip carrier alignment platform comprises a chip carrier, a crystal film and a chip.

The left front detection camera, the right front detection camera and the rear detection camera can be used by matching three cameras with each other, higher positioning precision is provided, when any one camera fails, the remaining two cameras can be used for continuously working, and the included angle between the optical axes of the three cameras is 120 +/-10'.

The self-compensation rotation-measurement co-location detection method comprises the following steps:

s1: the left front detection camera, the right front detection camera and the rear detection camera sequentially scan the target substrate carrying platform checkerboard, the chip carrying platform checkerboard, the target substrate carrying platform and the chip carrying platform aligning platform, a coordinate system is established, and coordinate information of a chip and a target crystal position is identified and recorded;

s2: moving a longitudinal slide block of the chip carrier plate alignment platform and a transverse slide block of the chip carrier plate alignment platform, and driving a chip on the chip carrier plate platform to move to a position right below the laser head;

s3: moving a transverse sliding block of the target substrate alignment platform and a longitudinal sliding block of the target substrate alignment platform, and driving a target crystal position of a target substrate carrying platform to move to a position right below a laser head;

s4: starting a laser head, irradiating the chip on the chip carrier plate platform, and enabling the chip to fall off and be transferred to the target substrate platform;

s5: when the distance between the chip on the chip carrier plate alignment platform and the target crystal position on the target substrate carrying platform in the coordinate system is within the allowable range and the chip drop point is the target crystal position, repeating the steps S2-S5;

s5: when the distance between the chip on the chip support plate alignment platform and the target crystal position on the target substrate carrying platform before the laser head is started to transfer and the position right below the laser head is still larger than the acceptable error, the laser head moves again according to the current coordinate, if the distance is still larger than the acceptable error, the transfer is stopped, the system gives an alarm, and S2-S5 are repeated after the problem is solved until all chips are transferred;

s5: when the chip drop point deviates from the target crystal position, stopping transferring, giving an alarm by a system, and repeating S2-S5 after troubleshooting problems until all chips are transferred;

s6: and when any one of the front left detection camera and the front right detection camera fails, establishing a coordinate system by using the remaining two cameras, and continuing to transfer.

The principle of the scheme is as follows:

the working process of the detection device for the LED chip mass transfer self-compensation detection-transfer real-time co-location can be divided into three stages of coordinate system establishment, chip transfer detection self-compensation and chip drop point detection self-compensation. Establishing a coordinate system:

(1) scanning a target substrate platform checker and a chip carrier plate checker by using three optical detection system CCD industrial cameras with optical axes having an included angle of 120 degrees, respectively establishing three target substrate coordinate systems and three chip carrier plate coordinate systems based on adjacent camera parallaxes and images, and distributing initial weights of the coordinate systems; (2) driving a target substrate carrying platform to move to a camera view, scanning the target substrate, and identifying and recording the coordinates of a target crystal position in a target substrate coordinate system; (3) and driving the chip carrier plate platform to move to the camera under the visual field, scanning the chip carrier plate platform, and identifying and recording the coordinates of the chip in the chip carrier plate coordinate system. Chip transfer detection self-compensation: (1) when the distance between the coordinates of the target crystal position and the chip on the XOY plane and the coordinates of the laser head on the XOY plane is within an allowable range, the laser head is started to irradiate the chip on the chip carrier plate platform, so that the chip falls off; (2) when the distance between the coordinates of the target crystal position and the chip on the XOY plane and the coordinates of the laser head on the XOY plane is larger than the acceptable error, the laser head moves again according to the current coordinates, if the error is still larger than the acceptable error, the system alarms, the chip transfer is stopped, the weight of the coordinate system with abnormal data is reduced, and self-compensation is carried out until the error is reduced to be within an allowable range. Chip drop point detection self-compensation: (1) when the chip drop point is the target crystal position on the substrate platform, judging that the transfer quality meets the requirement, and circularly transferring the chips in sequence; (2) when the chip drop point deviates from the target crystal position on the substrate platform, the system alarms, stops chip transfer, repairs the dead chip, and continues to transfer after the working state is recovered. When one of the three cameras fails, the weight of the coordinate system established by the failed camera is set to be 0, and the coordinate systems established by the remaining two cameras are used for continuing working.

Compared with the prior art, the invention has the advantages that:

the invention utilizes three optical detection system CCD industrial cameras with optical axes having an included angle of 120 degrees, establishes a coordinate system from images scanned by different cameras through a parallax principle, completes real-time measurement and detection in the chip transfer process, and realizes transfer measurement and transfer real-time co-location. Compared with the existing swing arm type large-volume transfer scheme, the transfer measurement and co-location is realized, the transfer stroke is shortened, and the transfer speed is improved. Compared with the existing laser and acupuncture massive transfer scheme, the transfer method realizes real-time detection of transfer, and improves the transfer precision and transfer efficiency. Compared with the existing orthogonal double-camera measurement-rotation real-time co-location transfer detection device, the scheme has no visual field blind area, can carry out information debugging through self-compensation, eliminates the influence of single-camera frame loss on a detection result, can continuously work when one camera fails, and is particularly suitable for bulk transfer of Mini/Micro LED chips.

In summary, the detection device for LED chip bulk transfer with self-compensation measurement to real-time co-location in the embodiments of the present invention enables the laser head, the chip and the target crystal position to be vertically co-located, and performs real-time detection with three CCD industrial cameras with 120 ° included angles of optical axes, without a dead zone of visual field, eliminates the influence of frame loss of a single camera on the detection precision by mutual verification of the detection results of multiple devices, and does not affect the system operation when any one camera fails, which is beneficial to improving the chip transfer efficiency. The vertical co-location of the laser head, the chip and the target crystal position is realized, the CCD industrial cameras with three included angles of 120 degrees are adopted to obtain a non-blind-area real-time transfer image, the influence of frame loss of a single camera on detection precision during high-speed work is eliminated through self-compensation, the system work is not influenced when any camera fails, and the chip transfer precision and efficiency are effectively improved.

In order to more clearly show the technical solutions and the technical effects provided by the present invention, the following detailed description is provided for the embodiments of the present invention with specific embodiments.

Example 1

As shown in fig. 1a and fig. 1b, a three-dimensional structure schematic diagram of a technical solution of the present invention, a detection apparatus for transfer measurement and real-time co-location for massive transfer of LED chips, mainly comprising a chip transfer system, a counterpoint system and a detection system, is characterized in that the chip transfer system mainly comprises: the laser welding device comprises a platform base 1, a left upright post support 2A, a right upright post support 2B, a left upright post 3A, a right upright post 3B, a left fixed seat 4A, a right fixed seat 4B, a bottom plate 5, a connecting block 6 and a laser head 7; the optical detection system mainly comprises: a detection device fixing block 8, an annular camera stage support frame assembly 9, a left front detection camera 10A, a right front detection camera 10B, a rear detection camera 10C, a left front detection camera holder 11A, a right front detection camera holder 11B, a rear detection camera holder 11C and an annular camera stage 12; the alignment system mainly comprises: a chip carrier alignment platform base 13, a chip carrier alignment platform longitudinal rail 14, a chip carrier alignment platform longitudinal slider 15, a chip carrier alignment platform transverse rail 16, a chip carrier alignment platform transverse slider 17, a chip carrier alignment platform 18, a chip carrier checkerboard 19, a target substrate alignment platform transverse base 20, a target substrate alignment platform front transverse rail 21A, a target substrate alignment platform rear transverse rail 21B, a target substrate alignment platform left front transverse slider 22A, a target substrate alignment platform right front transverse slider 22B, a target substrate alignment platform left rear transverse slider 22C, a target substrate alignment platform right rear transverse slider 22D, a target substrate alignment platform longitudinal base 23, a target substrate alignment platform longitudinal left guide rail 24A, a target substrate alignment platform longitudinal right guide rail 24B, a target substrate alignment platform longitudinal left slider 25A, a target substrate alignment platform longitudinal right slider 25B, a target substrate carrier 26 and a target substrate checkerboard 27; the platform base 1 is positioned below a left upright post support 2A, a right upright post support 2B, a left upright post 3A and a right upright post 3B, the left upright post support 2A and the right upright post support 2B are respectively positioned at the left upper corner and the right upper corner of the platform base 1 and are installed on the platform base 1 through fastening screws, the left upright post 3A and the right upright post 3B are respectively positioned in hollow cylinders of the left upright post support 2A and the right upright post support 2B and are installed on the left upright post support 2A and the right upright post support 2B through thread fit, a left fixing seat 4A and a right fixing seat 4B are respectively installed at the middle upper ends of the left upright post 3A and the right upright post 3B through screws, a bottom plate 5 is positioned on the rear surfaces of the left fixing seat 4A and the right fixing seat 4B and are installed on the left fixing seat 4A and the right fixing seat 4B through the fastening screws, a connecting block 6 is positioned on the rear side surface of a laser head transverse bottom plate 5 and is installed on the laser head transverse bottom plate 5 through the fastening screws, the laser head 7 is positioned behind the connecting block 6 and is arranged on the rear surface of the connecting block 6 through a fastening screw, the detection device fixing block 8 is positioned in front of the bottom plate 5 and is arranged on the front surface of the bottom plate 5 through a fastening screw, the annular camera platform support assembly 9 is positioned below the detection device fixing block 8 and is arranged on the detection device fixing block 8 through a fastening screw, the left front detection camera 10A, the right front detection camera 10B and the rear detection camera 10C are respectively positioned in circular sleeves which are arranged at the front left side, the front right side and the rear side of the annular camera platform 12 and are respectively fixed through a front left detection camera holder 11A, a front right detection camera holder 11B and a rear detection camera holder 11C, the axis of the annular camera platform 12 is collinear with the axis of the laser head 7, the annular camera platform 12 is positioned behind the camera platform support 9 and is arranged on the annular camera platform support assembly 9 through a fastening screw, a chip carrier alignment platform base 13 is positioned above the platform base 1, the chip carrier alignment platform base 13 is positioned behind a left upright post support 2A and a right upright post support 2B and is mounted above the platform base 1 by fastening screws, a chip carrier alignment platform longitudinal rail 14 is longitudinally mounted above the chip carrier alignment platform base 13 by fastening screws, a chip carrier alignment platform longitudinal slide 15 is connected to the chip carrier alignment platform longitudinal rail 14 by a slide rail, a chip carrier alignment platform transverse rail 16 is transversely mounted above the chip carrier alignment platform longitudinal slide 15 by fastening screws, a chip carrier alignment platform transverse slide 17 is connected to the chip carrier alignment platform transverse rail 16 by a slide rail, a chip carrier alignment platform 18 is mounted above the chip carrier alignment platform transverse slide 17 by fastening screws, a chip carrier checkerboard 19 is placed in an upper surface groove of the chip carrier alignment platform 18, a target substrate alignment platform transverse base 20 is positioned at the upper end of the platform base 1, a target substrate alignment platform transverse base 20 is positioned behind a left upright post support 2A and a right upright post support 2B, a target substrate alignment platform transverse slide rail 21 is mounted on a target substrate transverse alignment platform base 21, a target substrate alignment platform transverse slide rail 21 is mounted above a target platform base 21, a target substrate alignment platform transverse slide rail 21 is mounted on a target platform transverse alignment platform base 21, a target substrate alignment platform transverse alignment platform base 21 is mounted on a target platform transverse slide rail, a target substrate alignment platform base 21 and target substrate alignment platform base B transverse target substrate alignment platform base 21, and the front left lateral slider 22A of the substrate alignment platform is positioned at the left of the front right lateral slider 22B of the target substrate alignment platform, the rear left lateral slider 22C of the target substrate alignment platform and the rear right lateral slider 22D of the target substrate alignment platform are both connected to the rear lateral rail 21B of the target substrate alignment platform through slide rails, the rear left lateral slider 22C of the target substrate alignment platform is positioned at the left of the rear right lateral slider 22D of the target substrate alignment platform, the target substrate alignment platform longitudinal base 23 is fixed above the front left lateral slider 22A of the target substrate alignment platform, the front right lateral slider 22B of the target substrate alignment platform, the rear left lateral slider 22C of the target substrate alignment platform and the rear right lateral slider 22D of the target substrate alignment platform through fastening screws, the target substrate alignment platform longitudinal left guide rail 24A and the target substrate alignment platform longitudinal right guide rail 24B are fixed above the target substrate alignment platform longitudinal base 23 through fastening screws, the target substrate alignment platform longitudinal left guide rail 24A is positioned at the target substrate alignment platform longitudinal right guide rail 24B, the target substrate alignment platform longitudinal guide rail 25A is connected to the right guide rail 24A of the target substrate alignment platform longitudinal guide rail, the target substrate alignment platform left guide rail 24A is connected to the target substrate alignment platform longitudinal guide rail B through fastening screws, the target substrate alignment platform left guide rail B, the target substrate alignment platform longitudinal guide rail 25A is connected to the target substrate alignment platform right guide rail B, the target substrate alignment platform longitudinal guide rail B through fastening groove 26 on the target substrate alignment platform left side, the target substrate alignment platform longitudinal guide rail 24B, the target substrate alignment platform.

Fig. 2 is a schematic three-dimensional structure diagram of a chip transfer system according to the technical solution of the present invention, and the chip transfer system mainly includes: the device comprises a platform base 1, a left upright post support 2A, a right upright post support 2B, a left upright post 3A, a right upright post 3B, a left fixed seat 4A, a right fixed seat 4B, a bottom plate 5, a connecting block 6 and a laser head 7; platform base 1 is located left stand support 2A, right stand support 2B, left stand 3A and right stand 3B's below, left side stand support 2A and right stand support 2B are located the upper left corner and the upper right corner of platform base 1 respectively, and install on platform base 1 through fastening screw, left side stand 3A and right stand 3B are located left stand support 2A and right stand support 2B's hollow cylinder respectively, and install on left stand support 2A and right stand support 2B through screw-thread fit, left side fixing base 4A and right fixing base 4B are respectively through the screw installation at left stand 3A and right stand 3B's well upper end, bottom plate 5 is located left fixing base 4A and right fixing base 4B rear surface, and install on left fixing base 4A and right fixing base 4B through fastening screw, connecting block 6 is located laser head transverse bottom plate 5's rear side surface, and install on laser head transverse bottom plate 5 through fastening screw, laser head 7 is located connecting block 6's rear surface, install the rear surface at connecting block 6 through the screw fastening.

Fig. 3 is a schematic three-dimensional structure diagram of an optical detection system according to the technical solution of the present invention, and the optical detection system mainly includes: the inspection device comprises an inspection device fixing block 8, an annular camera stage support frame assembly 9, a left front inspection camera 10A, a right front inspection camera 10B, a rear inspection camera 10C, a left front inspection camera holder 11A, a right front inspection camera holder 11B, a rear inspection camera holder 11C and an annular camera stage 12; detection device fixed block 8 is located the top of annular camera microscope carrier subassembly 9, annular camera microscope carrier subassembly 9 is located the below of detection device fixed block 8, install on detection device fixed block 8 through fastening screw, left front detection camera 10A, right front detection camera 10B and back detection camera 10C are located the left front of annular camera microscope carrier 12 respectively, in the circular sleeve that right front and put just back, and fix through left front detection camera fixer 11A, right front detection camera fixer 11B and back detection camera fixer 11C respectively, the axle center of annular camera microscope carrier 12 and the axle center collineation of laser head 7, annular camera microscope carrier 12 is located camera microscope carrier 9 rear, and install on annular camera microscope carrier subassembly 9 through fastening screw.

Fig. 4 is a schematic three-dimensional structure diagram of an alignment system according to the technical solution of the present invention, the alignment system mainly includes: a chip carrier alignment platform base 13, a chip carrier alignment platform longitudinal rail 14, a chip carrier alignment platform longitudinal slider 15, a chip carrier alignment platform transverse rail 16, a chip carrier alignment platform transverse slider 17, a chip carrier alignment platform 18, a chip carrier checkerboard 19, a target substrate alignment platform transverse base 20, a target substrate alignment platform front transverse rail 21A, a target substrate alignment platform rear transverse rail 21B, a target substrate alignment platform left front transverse slider 22A, a target substrate alignment platform right front transverse slider 22B, a target substrate alignment platform left rear transverse slider 22C, a target substrate alignment platform right rear transverse slider 22D, a target substrate alignment platform longitudinal base 23, a target substrate alignment platform longitudinal left guide rail 24A, a target substrate alignment platform longitudinal right guide rail 24B, a target substrate alignment platform longitudinal left slider 25A, a target substrate alignment platform longitudinal right slider 25B, a target substrate carrier 26 and a target substrate checkerboard 27; a chip-carrier alignment platform base 13 is located below the chip-carrier alignment platform longitudinal rail 14, the chip-carrier alignment platform longitudinal rail 14 is longitudinally mounted above the chip-carrier alignment platform base 13 by fastening screws, the chip-carrier alignment platform longitudinal slide 15 is connected to the chip-carrier alignment platform longitudinal rail 14 by slide rails, the chip-carrier alignment platform transverse rail 16 is transversely mounted above the chip-carrier alignment platform longitudinal slide 15 by fastening screws, the chip-carrier alignment platform transverse slide 17 is connected to the chip-carrier alignment platform transverse rail 16 by slide rails, the chip-carrier alignment platform 18 is mounted above the chip-carrier alignment platform transverse slide 17 by fastening screws, the chip-carrier checkerboard 19 is placed in an upper surface groove of the chip-carrier alignment platform 18, the target substrate alignment platform transverse base 20 is located at the left of the chip-carrier alignment platform base 13, the target substrate alignment platform front transverse rail 21A and the target substrate alignment platform rear transverse rail 21B are both transversely mounted above the target substrate alignment platform transverse base 20 by fastening screws, the target substrate alignment platform front transverse rail 21A is located at the target substrate alignment platform rear transverse rail 21B, the target substrate alignment platform front transverse slide 22A and the target substrate alignment platform rear transverse slide 22B is connected to the target substrate rear transverse slide 22 by target platform rear target substrate transverse slide 22C, the target substrate alignment platform rear transverse slide 22A and the target substrate rear target substrate transverse slide 22 is located at the target platform rear target substrate rear platform rear target substrate transverse slide rail 22C, the target substrate alignment platform longitudinal base 23 is fixed above a target substrate alignment platform left front transverse slider 22A, a target substrate alignment platform right front transverse slider 22B, a target substrate alignment platform left rear transverse slider 22C and a target substrate alignment platform right rear transverse slider 22D through fastening screws, a target substrate alignment platform longitudinal left guide rail 24A and a target substrate alignment platform longitudinal right guide rail 24B are fixed above the target substrate alignment platform longitudinal base 23 through fastening screws, the target substrate alignment platform longitudinal left guide rail 24A is located at the left of the target substrate alignment platform longitudinal right guide rail 24B, the target substrate alignment platform longitudinal left slider 25A is connected to the target substrate alignment platform longitudinal left guide rail 24A through a slide rail, the target substrate alignment platform longitudinal right slider 25B is connected to the target substrate alignment platform longitudinal right guide rail 24B through a slide rail, the target substrate platform 26 is fixed above the target substrate alignment platform longitudinal left slider 25A and the target substrate alignment platform longitudinal right slider 25B through fastening screws, and the target substrate platform 27 is placed in a chessboard upper surface groove of the target substrate platform 26.

Fig. 5 is a schematic three-dimensional structure diagram of an annular camera stage 12 according to the technical solution of the present invention, where the annular camera stage 12 mainly includes an annular camera stage body 1201, an LED adjustable annular lamp 1202, and an annular camera stage fixing knob 1203, the annular camera stage body 1201 is located above the LED adjustable annular lamp 1202, the LED adjustable annular lamp 1202 is located below the annular camera stage body 1201, the LED adjustable annular lamp 1202 is mounted on a lower surface of the annular camera stage body 1201 through a fastening screw, and the annular camera stage fixing knob 1203 is located in a threaded hole on an upper surface of the annular camera stage body 1201.

Fig. 6 is a schematic three-dimensional structure diagram of an annular camera stage support assembly 9 according to the technical solution of the present invention, where the annular camera stage support assembly 9 mainly includes: detection device fixed block connecting rod 901, fixed knob 902 of detection device fixed block connecting rod, annular camera microscope carrier connecting rod 903, fixed knob 904 of annular camera microscope carrier and connecting block 905, detection device fixed block connecting rod 901 is located the vertical through-hole of connecting block 905, it is fixed through fixed knob 902 of detection device fixed block connecting rod, fixed knob 902 of detection device fixed block connecting rod is located the threaded hole on connecting block 905 right side surface, annular camera microscope carrier connecting rod 903 is located the horizontal through-hole of connecting block 905, it is fixed through fixed knob 904 of annular camera microscope carrier, fixed knob 904 of annular camera microscope carrier is located the threaded hole on connecting block 905 left surface.

Fig. 7 is a schematic three-dimensional structure diagram of a chip carrier alignment platform 18 according to the technical solution of the present invention, where the chip carrier alignment platform 18 mainly includes: chip carrier plate 1801, a die 1802, and a chip 1803, where chip carrier plate 1801 is located above die 1802 and chip 1803, die 1802 is located in a large recess on the right side of die carrier plate 1801 and is adhered to die carrier plate 1801, and chip 1803 is located on the lower surface of die 1802 and is adhered to the lower surface of die 1802.

The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims. The information disclosed in this background section is only for enhancement of understanding of the general background of the invention and should not be taken as an acknowledgement or any form of suggestion that this information forms the prior art already known to a person skilled in the art.

Claims (6)

1. A self-compensation detection device for LED chip mass transfer and real-time co-location of measurement and transfer mainly comprises a chip transfer system, an optical detection system and an alignment system, and is characterized in that:

the transfer system mainly comprises: the device comprises a platform base (1), a left upright post support (2A), a right upright post support (2B), a left upright post (3A), a right upright post (3B), a left fixed seat (4A), a right fixed seat (4B), a bottom plate (5), a connecting block (6) and a laser head (7);

the optical detection system mainly comprises: the device comprises a detection device fixing block (8), an annular camera carrier bracket assembly (9), a left front detection camera (10A), a right front detection camera (10B), a rear detection camera (10C), a left front detection camera fixer (11A), a right front detection camera fixer (11B), a rear detection camera fixer (11C) and an annular camera carrier (12);

the alignment system mainly comprises: a chip carrier alignment platform base (13), a chip carrier alignment platform longitudinal rail (14), a chip carrier alignment platform longitudinal slider (15), a chip carrier alignment platform transverse rail (16), a chip carrier alignment platform transverse slider (17), a chip carrier alignment platform (18), a chip carrier chessboard (19), a target substrate alignment platform transverse base (20), a target substrate alignment platform front transverse rail (21A), a target substrate alignment platform rear transverse rail (21B), a target substrate alignment platform left front transverse slider (22A), a target substrate alignment platform right front transverse slider (22B), a target substrate alignment platform left rear transverse slider (22C), a target substrate alignment platform right rear transverse slider (22D), a target substrate alignment platform longitudinal base (23), a target substrate alignment platform longitudinal left guide rail (24A), a target substrate alignment platform longitudinal right guide rail (24B), a target substrate alignment platform longitudinal left slider (25A), a target substrate alignment platform longitudinal right slider (25B), a target substrate alignment platform longitudinal right slider (26) and a target substrate chessboard (27);

the platform base (1) is positioned below the left upright post support (2A), the right upright post support (2B), the left upright post (3A) and the right upright post (3B), the left upright post support (2A) and the right upright post support (2B) are respectively positioned at the upper left corner and the upper right corner of the platform base (1) and are installed on the platform base (1) through fastening screws, the left upright post (3A) and the right upright post (3B) are respectively positioned in hollow cylinders of the left upright post support (2A) and the right upright post support (2B) and are installed on the left upright post support (2A) and the right upright post support (2B) through threaded fit, the left fixing seat (4A) and the right fixing seat (4B) are respectively installed at the upper middle ends of the left upright post (3A) and the right upright post (3B) through screws, the bottom plate (5) is positioned on the rear surfaces of the left fixing seat (4A) and the right fixing seat (4B) and is arranged on the left fixing seat (4A) and the right fixing seat (4B) through fastening screws, the connecting block (6) is positioned on the rear side surface of the laser head transverse bottom plate (5) and is arranged on the laser head transverse bottom plate (5) through fastening screws, the laser head (7) is positioned behind the connecting block (6) and is arranged on the rear surface of the connecting block (6) through fastening screws, the detection device fixing block (8) is positioned in front of the bottom plate (5) and is arranged on the front surface of the bottom plate (5) through fastening screws, an annular camera platform support frame assembly (9) is positioned below a detection device fixing block (8) and is installed on the detection device fixing block (8) through a fastening screw, a left front detection camera (10A), a right front detection camera (10B) and a rear detection camera (10C) are respectively positioned in a left front circular sleeve and a right front circular sleeve of an annular camera platform (12) and are respectively fixed through a left front detection camera fixer (11A), a right front detection camera fixer (11B) and a rear detection camera fixer (11C), the axis of the annular camera platform (12) and the axis of a laser head (7) are collinear, the annular camera (12) is positioned behind the camera platform support frame (9) and is installed on the annular camera platform support frame assembly (9) through a fastening screw, a chip aligning platform base (13) is positioned above the platform base (1), the chip supporting plate aligning platform base (13) is positioned behind a left upright support (2A) and a right upright support frame (2B) and is installed above the platform base (1) through a fastening screw, the chip aligning platform base (13) is installed above a chip aligning platform through a longitudinal chip aligning platform slide block (14) and is installed on a chip aligning platform through a longitudinal slide block (14), a chip carrier plate contraposition platform transverse sliding block (17) is connected to a chip carrier plate contraposition platform transverse rail (16) through a sliding rail, a chip carrier plate contraposition platform (18) is installed above the chip carrier plate contraposition platform transverse sliding block (17) through a fastening screw, chip carrier plate checkerboards (19) are placed in an upper surface groove of the chip carrier plate contraposition platform (18), a target substrate contraposition platform transverse base (20) is located at the upper end of a platform base (1), a target substrate contraposition platform transverse base (20) is located behind a left column support (2A) and a right column support (2B), a target substrate contraposition platform transverse base (20) is located at the left side of a chip carrier plate contraposition platform base (13) and is installed on the platform base (1) through a fastening screw, a target substrate contraposition platform front transverse rail (21A) and a target substrate left contraposition platform rear transverse rail (21B) are both transversely installed above the target substrate contraposition platform transverse base (20) through a fastening screw, a target substrate contraposition platform front transverse rail (21A) is located behind a target substrate contraposition platform rear transverse rail (21B), a target substrate contraposition platform front transverse rail (22A) and a target substrate front transverse base (22A) are both located on a target substrate contraposition platform front slide rail of a target substrate, a target substrate contraposition platform and a target substrate front transverse sliding block (22A) are both connected to a target substrate front transverse sliding block (22A) of a target substrate contraposition platform, a target substrate front transverse sliding block of a target substrate contraposition platform and a target substrate transverse sliding block (22A) are connected to a target substrate front target substrate contraposition platform and a target substrate transverse sliding block of a target substrate platform, and a target substrate transverse sliding block of a target substrate contraposition platform, a target substrate front target substrate contraposition platform, a target substrate transverse sliding block of a target substrate are both target substrate contraposition platform, a left rear transverse sliding block (22C) of a target substrate alignment platform and a right rear transverse sliding block (22D) of the target substrate alignment platform are connected to a rear transverse rail (21B) of the target substrate alignment platform through sliding rails, the left rear transverse sliding block (22C) of the target substrate alignment platform is positioned at the left of the right rear transverse sliding block (22D) of the target substrate alignment platform, a longitudinal base (23) of the target substrate alignment platform is fixed above the left front transverse sliding block (22A) of the target substrate alignment platform, the right front transverse sliding block (22B) of the target substrate alignment platform, the left rear transverse sliding block (22C) of the target substrate alignment platform and the right rear transverse sliding block (22D) of the target substrate alignment platform through fastening screws, a longitudinal left guide rail (24A) of the target substrate alignment platform and a longitudinal right guide rail (24B) of the target substrate alignment platform are fixed above the longitudinal base (23) of the target substrate alignment platform through fastening screws, the left longitudinal guide rail (24A) of the target substrate alignment platform is positioned at the right longitudinal guide rail (24B) of the target substrate alignment platform, the left longitudinal guide rail (25A) of the target substrate alignment platform is connected to a left longitudinal guide rail (25A) of the target substrate alignment platform, the left longitudinal guide rail (25A) of the target substrate alignment platform and the right longitudinal guide rail (25B) of the target substrate alignment platform are connected to a target substrate alignment platform through fastening platform, the target substrate stage checkerboard (27) is placed in a groove on the upper surface of the target substrate stage (26).

2. The apparatus of claim 1, wherein the apparatus comprises: the annular camera stage (12) comprises an annular camera stage body (1201), an LED adjustable annular lamp (1202) and an annular camera stage fixing knob (1203).

3. The apparatus of claim 1, wherein the apparatus comprises: the annular camera stage support assembly (9) comprises a detection device fixed block connecting rod (901), a detection device fixed block connecting rod fixing knob (902), an annular camera stage connecting rod (903), an annular camera stage fixing knob (904) and a connecting block (905).

4. The apparatus of claim 1, wherein the apparatus comprises: the chip carrier alignment platform (18) comprises a chip carrier (1801), a crystal film (1802) and a chip (1803).

5. The apparatus of claim 1, wherein the apparatus comprises: the left front detection camera (10A), the right front detection camera (10B) and the rear detection camera (10C) can be used by mutually matching three cameras, higher positioning precision is provided, when any one camera fails, the remaining two cameras can be used for continuously working, and the included angle between the optical axes of the three cameras is 120 +/-10'.

6. The device for detecting the real-time co-location of LED chips in mass transfer according to any one of claims 1 to 5, wherein: the method for realizing the self-compensation rotation-measurement co-location detection of the device comprises the following steps:

s1: the left front detection camera (10A), the right front detection camera (10B) and the rear detection camera (10C) sequentially scan a target substrate carrying table checkerboard (27), a chip carrying plate checkerboard (19), a target substrate carrying table (26) and a chip carrying plate alignment platform (18), a coordinate system is established, and coordinate information of a chip (1803) and a target crystal position is identified and recorded;

s2: a longitudinal slide block (15) of a chip carrier plate alignment platform and a transverse slide block (17) of the chip carrier plate alignment platform are moved to drive a chip (1803) on a chip carrier plate platform (18) to move to the position right below a laser head (7);

s3: moving a target substrate alignment platform transverse sliding block (22) and a target substrate alignment platform longitudinal sliding block (25) to drive a target crystal position of a target substrate carrying platform (26) to move to a position right below a laser head (7);

s4: starting a laser head (7), irradiating the chip (1803) on the chip carrier plate platform (18), and enabling the chip (1803) to fall off and be transferred onto a target substrate (26) platform;

s5: when the distance between the chip (1803) on the chip carrier alignment platform (18) and the target crystal position on the target substrate carrying platform (26) in the coordinate system is within an allowable range and the falling point of the chip (1803) is the target crystal position, repeating the steps S2-S5;

s5: when the distance between a chip (1803) on the chip carrier alignment platform (18) and a target crystal position on the target substrate carrying platform (26) before the laser head is started to transfer and the position right below the laser head is still larger than an acceptable error, the laser head moves again according to the current coordinate, if the distance is still larger than the acceptable error, the transfer is stopped, the system gives an alarm, and S2-S5 are repeated after the problem is solved until all chips (1803) are transferred;

s5: when the chip (1803) is in a point deviation target crystal position, stopping transferring, giving an alarm by a system, and repeating S2-S5 after troubleshooting until all chips (1803) are transferred;

s6: when any one of the front left detection camera (10A) and the front right detection camera (10B) and the rear detection camera (10C) fails, the remaining two cameras are used for establishing a coordinate system and continuing to transfer.

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